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MPC860PVR66D4-NXP MPC860PVR66D4-NXP NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 2556 шт:
термін постачання 21-31 дні (днів)
2+18756.56 грн
Мінімальне замовлення: 2
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MPC855TCVR66D4 MPC855TCVR66D4 NXP USA Inc. FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 1748 шт:
термін постачання 21-31 дні (днів)
3+11533.24 грн
Мінімальне замовлення: 3
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MPC853TVR66A MPC853TVR66A NXP USA Inc. MPC853TEC.pdf Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, TDM, UART
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MPC855TCVR66D4 MPC855TCVR66D4 NXP USA Inc. MPC855TTS.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC855TVR66D4 MPC855TVR66D4 NXP USA Inc. MPC855TTS.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC857TCVR66B MPC857TCVR66B NXP USA Inc. MPC862EC%2C857%28T%2CDSL%29.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 115°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MC33972APEKR2 NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SSOP-EP
Grade: Automotive
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MC33972APEWR2 NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SOIC
Grade: Automotive
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MC33972APEW NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SOIC
Grade: Automotive
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MC33972APEK NXP USA Inc. MC33972.pdf Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SSOP-EP
Grade: Automotive
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MC07XSG517DEKR2 MC07XSG517DEKR2 NXP USA Inc. MC32XSG.pdf Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Status Flag
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 30V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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MC07XSG517DEK NXP USA Inc. Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Packaging: Tube
Features: Internal PWM, Slew Rate Controlled, Status Flag
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 30V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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TJA1057ATK/3/0Z TJA1057ATK/3/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057ATK/0Z TJA1057ATK/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057AT/3/0Z TJA1057AT/3/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057AT/0Z TJA1057AT/0Z NXP USA Inc. TJA1057.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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SPC5744PFK1AMMM8 SPC5744PFK1AMMM8 NXP USA Inc. MPC5744P.pdf Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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MFS8622BMBA0ESR2 NXP USA Inc. Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
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MFS8622BMDA0ESR2 NXP USA Inc. Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
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MFS8622BMBA0ES MFS8622BMBA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MFS8622BMDA0ES MFS8622BMDA0ES NXP USA Inc. Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
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PCF85063AT-ARD NXP USA Inc. UM11581.pdf Description: PCF85063AT-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063A
Platform: Arduino
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SPC5517SAMLU66 SPC5517SAMLU66 NXP USA Inc. MPC5510PB.pdf Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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K32W148-EVK K32W148-EVK NXP USA Inc. AN13049.pdf Description: K32W148-EVK
Packaging: Bulk
Supplied Contents: Board(s)
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
1+18079.20 грн
10+15443.75 грн
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MC7448VU1267ND MC7448VU1267ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC13783JVK5 MC13783JVK5 NXP USA Inc. MC13783.pdf Description: IC PWR MGT AUD CIRCUIT 247MAPBGA
Packaging: Tray
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
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SLN-VIZNLC-IOT NXP USA Inc. SLN-VIZNLC-IOT-HDG.pdf Description: NXP EDGEREADY MCU-BASED SOLUTION
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: RT106F
Platform: EdgeReady
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74LVCH573BX/S711115 NXP USA Inc. PHGLS25920-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
на замовлення 49750 шт:
термін постачання 21-31 дні (днів)
1332+18.26 грн
Мінімальне замовлення: 1332
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MIMXRT1062CVL5BR MIMXRT1062CVL5BR NXP USA Inc. IMXRT1060IEC.pdf Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
1500+556.12 грн
Мінімальне замовлення: 1500
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SLRC61003HNY NXP USA Inc. SLRC610.pdf Description: CL READER IC'S
Packaging: Tape & Reel (TR)
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SLRC61003HNY NXP USA Inc. SLRC610.pdf Description: CL READER IC'S
Packaging: Cut Tape (CT)
на замовлення 6489 шт:
термін постачання 21-31 дні (днів)
1+466.91 грн
10+389.28 грн
25+368.35 грн
100+318.72 грн
250+302.56 грн
500+291.15 грн
1000+275.80 грн
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P60D144PU12/9A201V NXP USA Inc. Description: IC SMART CARD CTLR UNCASED
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC33FS6512CAER2 MC33FS6512CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6512LAER2 MC33FS6512LAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS6512NAER2 MC35FS6512NAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6512CAER2 MC35FS6512CAER2 NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6512CAE MC33FS6512CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6512LAE MC33FS6512LAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS6512CAE MC35FS6512CAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS6512NAE MC35FS6512NAE NXP USA Inc. 35FS4500-35FS6500SDS.pdf Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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TJA1124AHG/1Z TJA1124AHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1124AHG/1Z TJA1124AHG/1Z NXP USA Inc. TJA1124.pdf Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1493 шт:
термін постачання 21-31 дні (днів)
2+209.15 грн
10+143.66 грн
25+137.19 грн
100+122.73 грн
250+117.36 грн
500+113.33 грн
1000+108.84 грн
Мінімальне замовлення: 2
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74LVC16240ADGG/C4118 NXP USA Inc. 74LVC16240A.pdf Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
на замовлення 6093 шт:
термін постачання 21-31 дні (днів)
452+57.28 грн
Мінімальне замовлення: 452
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MPF5020CMMACESR2 MPF5020CMMACESR2 NXP USA Inc. PF5020.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
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MC34VR500VCESR2 MC34VR500VCESR2 NXP USA Inc. MC34VR500.pdf Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MX93AUD-HAT MX93AUD-HAT NXP USA Inc. MX93AUD-HAT-UM.pdf Description: ACCESSORY BOARD:AUDIO HAT
Packaging: Box
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+11396.70 грн
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MKL36Z256VMC4 MKL36Z256VMC4 NXP USA Inc. KL36P121M48SF4.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
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T2080NSN8MQB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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P3041NSE7NNC P3041NSE7NNC NXP USA Inc. P3041PB.pdf Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
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SCC2692AC1A44,518 SCC2692AC1A44,518 NXP USA Inc. SCC2692.pdf Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
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SCC2692AC1A44,512 SCC2692AC1A44,512 NXP USA Inc. SCC2692.pdf Description: UART IC 2, DUART CHANNEL 44-PLCC
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
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MPC8349EVVAJDB MPC8349EVVAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
1+13131.55 грн
24+10475.71 грн
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BFT25,215 BFT25,215 NXP USA Inc. BFT25A.pdf Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
на замовлення 4782 шт:
термін постачання 21-31 дні (днів)
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MC33MR3003AXVKR2 NXP USA Inc. Description: RF TXRX MOD ISM>1GHZSMD
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
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74AHCT08PW/C1118 NXP USA Inc. PHGLS15178-1.pdf?t.download=true&u=5oefqw Description: AND GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
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MPX2010D MPX2010D NXP USA Inc. MPX2010.pdf Description: SENSOR 1.45PSID .025V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
на замовлення 1033 шт:
термін постачання 21-31 дні (днів)
1+1090.90 грн
5+956.56 грн
10+921.71 грн
25+826.04 грн
50+799.34 грн
125+772.81 грн
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MC68040FE25V MC68040FE25V NXP USA Inc. MC68040UM.pdf Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68EC040FE40A MC68EC040FE40A NXP USA Inc. MC68040UM.pdf Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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PESD5V0C1UZF315 NXP USA Inc. PESD5V0C1USF.pdf Description: PESD5V0C1UZF - ULTRA LOW CAPACIT
Packaging: Bulk
на замовлення 171000 шт:
термін постачання 21-31 дні (днів)
8876+2.60 грн
Мінімальне замовлення: 8876
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S9S08SL8F1MTLR S9S08SL8F1MTLR NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MPC860PVR66D4-NXP FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC860PVR66D4-NXP
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 2556 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+18756.56 грн
Мінімальне замовлення: 2
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MPC855TCVR66D4 FSCL-S-A0001125202-1.pdf?t.download=true&u=5oefqw
MPC855TCVR66D4
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 1748 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+11533.24 грн
Мінімальне замовлення: 3
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MPC853TVR66A MPC853TEC.pdf
MPC853TVR66A
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, TDM, UART
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MPC855TCVR66D4 MPC855TTS.pdf
MPC855TCVR66D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC855TVR66D4 MPC855TTS.pdf
MPC855TVR66D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC857TCVR66B MPC862EC%2C857%28T%2CDSL%29.pdf
MPC857TCVR66B
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 115°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MC33972APEKR2 MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SSOP-EP
Grade: Automotive
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MC33972APEWR2 MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SOIC
Grade: Automotive
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MC33972APEW MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SOIC
Grade: Automotive
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MC33972APEK MC33972.pdf
Виробник: NXP USA Inc.
Description: SWITCH DETECTION INTERFACE, 22-S
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
Voltage - Supply: 3.1V ~ 5.25V
Applications: Multiple Switch Detection
Supplier Device Package: 32-SSOP-EP
Grade: Automotive
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MC07XSG517DEKR2 MC32XSG.pdf
MC07XSG517DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Packaging: Tape & Reel (TR)
Features: Internal PWM, Slew Rate Controlled, Status Flag
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 30V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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MC07XSG517DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 32V, TRIPLE 7M
Packaging: Tube
Features: Internal PWM, Slew Rate Controlled, Status Flag
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 7mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 30V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Ratio - Input:Output: 2:3
Supplier Device Package: 54-HSOP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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TJA1057ATK/3/0Z TJA1057.pdf
TJA1057ATK/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057ATK/0Z TJA1057.pdf
TJA1057ATK/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057AT/3/0Z TJA1057.pdf
TJA1057AT/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1057AT/0Z TJA1057.pdf
TJA1057AT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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SPC5744PFK1AMMM8 MPC5744P.pdf
SPC5744PFK1AMMM8
Виробник: NXP USA Inc.
Description: IC MCU 32B 2.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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MFS8622BMBA0ESR2
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
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MFS8622BMDA0ESR2
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
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MFS8622BMBA0ES
MFS8622BMBA0ES
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MFS8622BMDA0ES
MFS8622BMDA0ES
Виробник: NXP USA Inc.
Description: IC FS86 SYSTEM BASIS CHIP ASIL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: Camera
Supplier Device Package: 48-QFN (7x7)
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PCF85063AT-ARD UM11581.pdf
Виробник: NXP USA Inc.
Description: PCF85063AT-ARD
Packaging: Bulk
Function: Real Time Clock (RTC)
Type: Clock Timing
Contents: Board(s)
Utilized IC / Part: PCF85063A
Platform: Arduino
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SPC5517SAMLU66 MPC5510PB.pdf
SPC5517SAMLU66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z1
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.25V
Connectivity: CANbus, EBI/EMI, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 137
DigiKey Programmable: Not Verified
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K32W148-EVK AN13049.pdf
K32W148-EVK
Виробник: NXP USA Inc.
Description: K32W148-EVK
Packaging: Bulk
Supplied Contents: Board(s)
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+18079.20 грн
10+15443.75 грн
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MC7448VU1267ND MPC7448ECS01AD.pdf
MC7448VU1267ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.267GHZ 360BGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.267GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC13783JVK5 MC13783.pdf
MC13783JVK5
Виробник: NXP USA Inc.
Description: IC PWR MGT AUD CIRCUIT 247MAPBGA
Packaging: Tray
Package / Case: 247-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Handheld/Mobile Devices
Supplier Device Package: 247-MAPBGA (10x10)
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SLN-VIZNLC-IOT SLN-VIZNLC-IOT-HDG.pdf
Виробник: NXP USA Inc.
Description: NXP EDGEREADY MCU-BASED SOLUTION
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-M7
Utilized IC / Part: RT106F
Platform: EdgeReady
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74LVCH573BX/S711115 PHGLS25920-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
на замовлення 49750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1332+18.26 грн
Мінімальне замовлення: 1332
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MIMXRT1062CVL5BR IMXRT1060IEC.pdf
MIMXRT1062CVL5BR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1500+556.12 грн
Мінімальне замовлення: 1500
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SLRC61003HNY SLRC610.pdf
Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Tape & Reel (TR)
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SLRC61003HNY SLRC610.pdf
Виробник: NXP USA Inc.
Description: CL READER IC'S
Packaging: Cut Tape (CT)
на замовлення 6489 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+466.91 грн
10+389.28 грн
25+368.35 грн
100+318.72 грн
250+302.56 грн
500+291.15 грн
1000+275.80 грн
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P60D144PU12/9A201V
Виробник: NXP USA Inc.
Description: IC SMART CARD CTLR UNCASED
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC33FS6512CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6512CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6512LAER2 FS6500-FS4500-ASILD.pdf
MC33FS6512LAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS6512NAER2 35FS4500-35FS6500SDS.pdf
MC35FS6512NAER2
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6512CAER2 35FS4500-35FS6500SDS.pdf
MC35FS6512CAER2
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6512CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6512CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC33FS6512LAE FS6500-FS4500-ASILD.pdf
MC33FS6512LAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS6512CAE 35FS4500-35FS6500SDS.pdf
MC35FS6512CAE
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MC35FS6512NAE 35FS4500-35FS6500SDS.pdf
MC35FS6512NAE
Виробник: NXP USA Inc.
Description: FS6500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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TJA1124AHG/1Z TJA1124.pdf
TJA1124AHG/1Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1124AHG/1Z TJA1124.pdf
TJA1124AHG/1Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 4/4 24DHVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 5V ~ 28V
Number of Drivers/Receivers: 4/4
Data Rate: 20kBaud
Protocol: LIN
Supplier Device Package: 24-DHVQFN (5.5x3.5)
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 1493 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+209.15 грн
10+143.66 грн
25+137.19 грн
100+122.73 грн
250+117.36 грн
500+113.33 грн
1000+108.84 грн
Мінімальне замовлення: 2
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74LVC16240ADGG/C4118 74LVC16240A.pdf
Виробник: NXP USA Inc.
Description: BUS DRIVER, LVC/LCX/Z SERIES
Packaging: Bulk
на замовлення 6093 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
452+57.28 грн
Мінімальне замовлення: 452
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MPF5020CMMACESR2 PF5020.pdf
MPF5020CMMACESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
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MC34VR500VCESR2 MC34VR500.pdf
MC34VR500VCESR2
Виробник: NXP USA Inc.
Description: REGULATOR, BUCK, QUAD WITH UP TO
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Processor
Current - Supply: 297µA
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MX93AUD-HAT MX93AUD-HAT-UM.pdf
MX93AUD-HAT
Виробник: NXP USA Inc.
Description: ACCESSORY BOARD:AUDIO HAT
Packaging: Box
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+11396.70 грн
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MKL36Z256VMC4 KL36P121M48SF4.pdf
MKL36Z256VMC4
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
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T2080NSN8MQB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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P3041NSE7NNC P3041PB.pdf
P3041NSE7NNC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 1295FCPBGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
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SCC2692AC1A44,518 SCC2692.pdf
SCC2692AC1A44,518
Виробник: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tape & Reel (TR)
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
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SCC2692AC1A44,512 SCC2692.pdf
SCC2692AC1A44,512
Виробник: NXP USA Inc.
Description: UART IC 2, DUART CHANNEL 44-PLCC
Features: Configurable GPIO, Internal Oscillator, Timer/Counter
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 5V
Data Rate (Max): 1Mbps
Supplier Device Package: 44-PLCC
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
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MPC8349EVVAJDB MPC8349EAEC.pdf
MPC8349EVVAJDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13131.55 грн
24+10475.71 грн
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BFT25,215 BFT25A.pdf
BFT25,215
Виробник: NXP USA Inc.
Description: RF TRANS NPN 5V 2.3GHZ TO236AB
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 30mW
Current - Collector (Ic) (Max): 6.5mA
Voltage - Collector Emitter Breakdown (Max): 5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 1mA, 1V
Frequency - Transition: 2.3GHz
Noise Figure (dB Typ @ f): 5.5dB @ 500MHz
Supplier Device Package: SOT-23 (TO-236AB)
на замовлення 4782 шт:
термін постачання 21-31 дні (днів)
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MC33MR3003AXVKR2
Виробник: NXP USA Inc.
Description: RF TXRX MOD ISM>1GHZSMD
Packaging: Bulk
Package / Case: 214-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 76GHz ~ 81GHz
Operating Temperature: 125°C
Antenna Type: Antenna Not Included
Modulation: BPSK
RF Family/Standard: General ISM > 1GHz
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74AHCT08PW/C1118 PHGLS15178-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: AND GATE, AHCT/VHCT/VT SERIES
Packaging: Bulk
товару немає в наявності
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MPX2010D MPX2010.pdf
MPX2010D
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSID .025V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 25 mV (10V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Differential
Accuracy: ±1%
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
на замовлення 1033 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1090.90 грн
5+956.56 грн
10+921.71 грн
25+826.04 грн
50+799.34 грн
125+772.81 грн
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MC68040FE25V MC68040UM.pdf
MC68040FE25V
Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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MC68EC040FE40A MC68040UM.pdf
MC68EC040FE40A
Виробник: NXP USA Inc.
Description: IC MPU M680X0 40MHZ 184CQFP
Packaging: Tray
Package / Case: 184-BCQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68040
Voltage - I/O: 5.0V
Supplier Device Package: 184-CQFP (31.3x31.3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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PESD5V0C1UZF315 PESD5V0C1USF.pdf
Виробник: NXP USA Inc.
Description: PESD5V0C1UZF - ULTRA LOW CAPACIT
Packaging: Bulk
на замовлення 171000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8876+2.60 грн
Мінімальне замовлення: 8876
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S9S08SL8F1MTLR
S9S08SL8F1MTLR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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