Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36849) > Сторінка 491 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
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| OMA1006TL-SKT | NXP USA Inc. |
 Description: EVAL BOARD FOR A1006TLPackaging: Bulk Function: Anti Tamper and Security Type: Interface Contents: Board(s) Utilized IC / Part: A1006TL Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PN7120A0EV/C10801E | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 49VFBGA Supplier Device Package: 49-VFBGA (4x4.3) Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC Voltage - Supply: 1.65V ~ 3.6V Operating Temperature: -30°C ~ 85°C (TA) Type: RFID Reader Interface: I2C Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 49-VFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCF51QE32CLH | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 20x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 780 шт: термін постачання 21-31 дні (днів) |
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SC68376BGMAB20R | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 160QFP Packaging: Tape & Reel (TR) Package / Case: 160-BQFP Mounting Type: Surface Mount Speed: 20MHz RAM Size: 7.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 160-QFP (28x28) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||||||
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FXTH8715116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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FXTH8715116T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
на замовлення 1882 шт: термін постачання 21-31 дні (днів) |
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FXTH870511DT1528 | NXP USA Inc. |
Description: TPMS 7X7 450KPA X&Z AXIS Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| FXTH8718026T1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Operating Temperature: -40°C ~ 125°C Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
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FXTH87EG02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
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FXTH87EG02DT1 | NXP USA Inc. |
Description: SENSOR TIRE PRESSURE RF OUTPUT Packaging: Cut Tape (CT) Output Type: RF Sensor Type: Tire Pressure Monitoring (TPMS) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| FXTH87EH226T1 | NXP USA Inc. |
Description: TPMS E 7X7 900KPA X&Z AXIS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| FXTH87EK116T1 | NXP USA Inc. |
Description: SENSOR MULT PRESSURE Packaging: Tape & Reel (TR) Output Type: RF Sensor Type: Pressure |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
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SPC5674KAVMM2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tape & Reel (TR) Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5674KAVMM2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 152 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5674KAVMS2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tray Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5674KAVMS2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA Packaging: Tape & Reel (TR) Package / Case: 473-LFBGA Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z7d Data Converters: A/D 34x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 473-MAPBGA (19x19) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 750 шт В кошику од. на суму грн. | ||||||||||||||||
| SPC5674FAMVV3R | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||||||
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SPC5674FAMVR3 | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5674FAMVR3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 416PBGA Packaging: Tape & Reel (TR) Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 416-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||||
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SPC5674FAMVY3R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 516FPBGA Packaging: Tape & Reel (TR) Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||||
| SPC5674FAMVV3 | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 264MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z7 Data Converters: A/D 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM Supplier Device Package: 516-PBGA (27x27) Number of I/O: 32 |
товару немає в наявності |
Мінімальне замовлення: 40 шт В кошику од. на суму грн. | |||||||||||||||||
| LFJ74INTPZA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 516 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFJ74INTPWA | NXP USA Inc. |
Description: QORIVVA MPC5674F ON A 416 PIN 1. Packaging: Bulk For Use With/Related Products: MPC5674F Module/Board Type: Socket Adapter Utilized IC / Part: MPC5674F |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBBOJ74W1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 422 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBBJ74WA | NXP USA Inc. |
Description: QORIVVA MPC5674A 416 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board Utilized IC / Part: MPC5674A |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFJ74DBGZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM CA Packaging: Bulk For Use With/Related Products: MPC5674 Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBBOJ74Z1A | NXP USA Inc. |
Description: QORIVVA MPC5674F 522 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674F Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBBJ74ZA | NXP USA Inc. |
Description: QORIVVA MPC5674A 516 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5674A Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVCAL32SYNC4 | NXP USA Inc. |
Description: 32 BIT 4MB VERTICAL CALIBRATION Packaging: Bulk For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVCAL32SYNC8 | NXP USA Inc. |
Description: 32 BIT 8MB VERTICAL CALIBRATION Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C Accessory Type: Daughter Board For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBSJ74ZZ1A | NXP USA Inc. |
Description: QORIVVA MPC5674 522 PIN 1.0MM VE Utilized IC / Part: MPC5674 Accessory Type: Base Board For Use With/Related Products: MPC5674 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBSJ74ZW1A | NXP USA Inc. |
Description: QORIVVA MPC5674 422 PIN 1.0MM VE Utilized IC / Part: MPC5674 Accessory Type: Base Board For Use With/Related Products: MPC5674 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBSJ74ZWA | NXP USA Inc. |
Description: QORIVVA MPC5674 416 PIN 1.0MM VE Utilized IC / Part: MPC5674 Accessory Type: Base Board For Use With/Related Products: MPC5674 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBSJ74ZZA | NXP USA Inc. |
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C Accessory Type: Base Board For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SPC5674KAVJM2R | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA DigiKey Programmable: Not Verified Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 384K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SPC5674KAVJM2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA Core Size: 32-Bit Dual-Core Data Converters: A/D 22x12b Core Processor: e200z7d EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 384K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 257-LFBGA Packaging: Tray DigiKey Programmable: Not Verified Supplier Device Package: 257-LFBGA (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PCA8575DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24SSOP DigiKey Programmable: Not Verified Current - Output Source/Sink: 100µA, 25mA Supplier Device Package: 24-SSOP Interrupt Output: Yes Clock Frequency: 400 kHz Voltage - Supply: 2.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 16 Interface: I2C Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 24-SSOP (0.209", 5.30mm Width) Features: POR Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||
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PCA8575DB,118 | NXP USA Inc. |
Description: IC XPNDR 400KHZ I2C 24SSOP DigiKey Programmable: Not Verified Current - Output Source/Sink: 100µA, 25mA Supplier Device Package: 24-SSOP Interrupt Output: Yes Clock Frequency: 400 kHz Voltage - Supply: 2.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C Number of I/O: 16 Interface: I2C Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 24-SSOP (0.209", 5.30mm Width) Features: POR Packaging: Cut Tape (CT) |
на замовлення 307 шт: термін постачання 21-31 дні (днів) |
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MCF52232CAF50 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: Ethernet, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 56 DigiKey Programmable: Not Verified |
на замовлення 680 шт: термін постачання 21-31 дні (днів) |
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PMV450ENEA215 | NXP USA Inc. |
Description: NOW NEXPERIA SMALL SIGNAL FIELD- Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8555EPXAPF | NXP USA Inc. |
Description: IC MPU MPC85XX 833MHZ 783FCPBGA Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, SDRAM Co-Processors/DSP: Communications; CPM, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 783-FCPBGA (29x29) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 833MHz Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||||
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S912ZVHL32F1VLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||||||||||||||||
| MCIMX6Y2DVM09AA557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MCIMX6DP5EYM1AA557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MCIMX6S1AVM08AC557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MCIMX6U7CVM08AC557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCIMX6V2CVM08AB557 | NXP USA Inc. |
Description: CORTEX A9 RISC MICROPROCESSOR 32 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PDZ6.8B/ZL115 | NXP USA Inc. |
Description: DIODE ZENER Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1462BTK/S1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TJA1462ATK/S1Z | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 8Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 100 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC34PF1510A5EP | NXP USA Inc. |
Description: PF1510 Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||||
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BB172115 | NXP USA Inc. |
Description: VARIABLE CAPACITANCE DIODE Packaging: Bulk Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 15 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MMA5212KWR2 | NXP USA Inc. |
Description: ACCELEROMETER 120G PCM/SPI 16QFN Features: Selectable Low Pass Filter Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Output Type: PCM, SPI Mounting Type: Surface Mount Type: Digital Axis: X Acceleration Range: ±120g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.2V ~ 17V Supplier Device Package: 16-QFN (6x6) Sensitivity (LSB/g): 4 Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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RD772BJBCANFDEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33772C Packaging: Bulk Function: Battery Cell Controller Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Primary Attributes: 9V ~ 13.5V Supply Secondary Attributes: On-Board LEDs Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| RD772BJBTPLEVB | NXP USA Inc. |
Description: EVAL BOARD FOR MC33772C Packaging: Bulk Function: Battery Cell Controller Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: MC33772C Supplied Contents: Board(s), Cable(s) Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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RD772BJBTPL8EVB | NXP USA Inc. |
Description: 00 V BATTERY JUNCTION BOX USING Packaging: Bulk Function: Battery Monitor Type: Power Management Contents: Board(s) Supplied Contents: Board(s) Secondary Attributes: On-Board LEDs Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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QN9090-001-T10 | NXP USA Inc. |
Description: QN9090 BLE SOC DEV KIT Packaging: Bulk For Use With/Related Products: QN9090 Frequency: 2.4GHz Type: Transceiver; Bluetooth® 5 Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P3T1755DPZ | NXP USA Inc. |
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP Features: Shutdown Mode, One-Shot Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: 2-Wire Serial, I2C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5°C (±1°C) Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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P3T1755DPZ | NXP USA Inc. |
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP Features: Shutdown Mode, One-Shot Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: 2-Wire Serial, I2C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5°C (±1°C) Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 2641 шт: термін постачання 21-31 дні (днів) |
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P3T1750DPZ | NXP USA Inc. |
Description: IC TEMP SENSOR I3C/I2C-BUS Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 3.6V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 8-TSSOP Test Condition: -20°C ~ 85°C Accuracy - Highest (Lowest): ±1°C Sensing Temperature - Local: -40°C ~ 125°C |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. |
| OMA1006TL-SKT |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR A1006TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
Description: EVAL BOARD FOR A1006TL
Packaging: Bulk
Function: Anti Tamper and Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: A1006TL
Supplied Contents: Board(s)
товару немає в наявності
В кошику
од. на суму грн.
| PN7120A0EV/C10801E |
|
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 49VFBGA
Supplier Device Package: 49-VFBGA (4x4.3)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 49-VFBGA
Packaging: Tray
Description: IC RFID READER 13.56MHZ 49VFBGA
Supplier Device Package: 49-VFBGA (4x4.3)
Standards: FeliCa, ISO 14443, ISO 15693, ISO 18000, MIFARE, NFC
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -30°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 49-VFBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MCF51QE32CLH |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 780 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 704.93 грн |
| 10+ | 529.34 грн |
| 25+ | 492.10 грн |
| 100+ | 423.37 грн |
| 250+ | 405.06 грн |
| SC68376BGMAB20R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 160QFP
Packaging: Tape & Reel (TR)
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 7.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 160-QFP (28x28)
Number of I/O: 18
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| FXTH8715116T1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| FXTH8715116T1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
на замовлення 1882 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 867.11 грн |
| 10+ | 668.23 грн |
| 25+ | 618.08 грн |
| 100+ | 501.66 грн |
| 500+ | 470.31 грн |
| 1000+ | 438.96 грн |
| FXTH870511DT1528 |
Виробник: NXP USA Inc.
Description: TPMS 7X7 450KPA X&Z AXIS
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: TPMS 7X7 450KPA X&Z AXIS
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| FXTH8718026T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Operating Temperature: -40°C ~ 125°C
Sensor Type: Tire Pressure Monitoring (TPMS)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| FXTH87EG02DT1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| FXTH87EG02DT1 |
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
Description: SENSOR TIRE PRESSURE RF OUTPUT
Packaging: Cut Tape (CT)
Output Type: RF
Sensor Type: Tire Pressure Monitoring (TPMS)
товару немає в наявності
В кошику
од. на суму грн.
| FXTH87EK116T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR MULT PRESSURE
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Pressure
Description: SENSOR MULT PRESSURE
Packaging: Tape & Reel (TR)
Output Type: RF
Sensor Type: Pressure
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| SPC5674KAVMM2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| SPC5674KAVMM2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 152 шт
В кошику
од. на суму грн.
| SPC5674KAVMS2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tray
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| SPC5674KAVMS2R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
Description: IC MCU 32B 1.5MB FLASH 473MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z7d
Data Converters: A/D 34x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 473-MAPBGA (19x19)
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 750 шт
В кошику
од. на суму грн.
| SPC5674FAMVV3R |
|
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| SPC5674FAMVR3 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| SPC5674FAMVR3R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 416PBGA
Packaging: Tape & Reel (TR)
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 416-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| SPC5674FAMVY3R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 516FPBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| SPC5674FAMVV3 |
|
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 5.25V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM
Supplier Device Package: 516-PBGA (27x27)
Number of I/O: 32
товару немає в наявності
Мінімальне замовлення: 40 шт
В кошику
од. на суму грн.
| LFJ74INTPZA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674F ON A 516 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
товару немає в наявності
В кошику
од. на суму грн.
| LFJ74INTPWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5674F
Description: QORIVVA MPC5674F ON A 416 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5674F
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5674F
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBOJ74W1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 422 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBJ74WA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Utilized IC / Part: MPC5674A
Description: QORIVVA MPC5674A 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Utilized IC / Part: MPC5674A
товару немає в наявності
В кошику
од. на суму грн.
| LFJ74DBGZWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
Description: QORIVVA MPC5674 416 PIN 1.0MM CA
Packaging: Bulk
For Use With/Related Products: MPC5674
Module/Board Type: Socket Adapter
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBOJ74Z1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
Description: QORIVVA MPC5674F 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674F
Accessory Type: Base Board
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBJ74ZA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
Description: QORIVVA MPC5674A 516 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5674A
Accessory Type: Base Board
товару немає в наявності
В кошику
од. на суму грн.
| LFVCAL32SYNC4 |
Виробник: NXP USA Inc.
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Description: 32 BIT 4MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
товару немає в наявності
В кошику
од. на суму грн.
| LFVCAL32SYNC8 |
Виробник: NXP USA Inc.
Description: 32 BIT 8MB VERTICAL CALIBRATION
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
Description: 32 BIT 8MB VERTICAL CALIBRATION
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Daughter Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFVBSJ74ZZ1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Description: QORIVVA MPC5674 522 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFVBSJ74ZW1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Description: QORIVVA MPC5674 422 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFVBSJ74ZWA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
Description: QORIVVA MPC5674 416 PIN 1.0MM VE
Utilized IC / Part: MPC5674
Accessory Type: Base Board
For Use With/Related Products: MPC5674
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFVBSJ74ZZA |
Виробник: NXP USA Inc.
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
Description: QORIVVA 522 PIN 1.0MM PRE-VERTIC
Utilized IC / Part: MPC5674F, MPC5676R, MPC5777C
Accessory Type: Base Board
For Use With/Related Products: MPC5674F, MPC5676R, MPC5777C
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SPC5674KAVJM2R |
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| SPC5674KAVJM2 |
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
Description: IC MCU 32B 1.5MB FLASH 257MAPBGA
Core Size: 32-Bit Dual-Core
Data Converters: A/D 22x12b
Core Processor: e200z7d
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 257-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Supplier Device Package: 257-LFBGA (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI, UART
Voltage - Supply (Vcc/Vdd): 1.14V ~ 1.32V
товару немає в наявності
В кошику
од. на суму грн.
| PCA8575DB,118 |
|
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Tape & Reel (TR)
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| PCA8575DB,118 |
|
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Cut Tape (CT)
Description: IC XPNDR 400KHZ I2C 24SSOP
DigiKey Programmable: Not Verified
Current - Output Source/Sink: 100µA, 25mA
Supplier Device Package: 24-SSOP
Interrupt Output: Yes
Clock Frequency: 400 kHz
Voltage - Supply: 2.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Number of I/O: 16
Interface: I2C
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Features: POR
Packaging: Cut Tape (CT)
на замовлення 307 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 166.14 грн |
| 10+ | 118.55 грн |
| 25+ | 108.18 грн |
| 100+ | 90.84 грн |
| 250+ | 85.75 грн |
| MCF52232CAF50 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
на замовлення 680 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1665.40 грн |
| 10+ | 1287.09 грн |
| 25+ | 1207.91 грн |
| 100+ | 1051.96 грн |
| 450+ | 992.87 грн |
| PMV450ENEA215 |
|
Виробник: NXP USA Inc.
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: NOW NEXPERIA SMALL SIGNAL FIELD-
Packaging: Bulk
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MPC8555EPXAPF |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Co-Processors/DSP: Communications; CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 783-FCPBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 833MHz
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 36 шт
В кошику
од. на суму грн.
| S912ZVHL32F1VLQ |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 300 шт
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| TJA1462BTK/S1Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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| TJA1462ATK/S1Z |
|
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 100 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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| MC34PF1510A5EP |
|
Виробник: NXP USA Inc.
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: PF1510
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
товару немає в наявності
Мінімальне замовлення: 490 шт
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од. на суму грн.
| BB172115 |
|
Виробник: NXP USA Inc.
Description: VARIABLE CAPACITANCE DIODE
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
Description: VARIABLE CAPACITANCE DIODE
Packaging: Bulk
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.754pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 15
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| MMA5212KWR2 |
|
Виробник: NXP USA Inc.
Description: ACCELEROMETER 120G PCM/SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Grade: Automotive
Qualification: AEC-Q100
Description: ACCELEROMETER 120G PCM/SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±120g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 4
Grade: Automotive
Qualification: AEC-Q100
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| RD772BJBCANFDEVB |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 9V ~ 13.5V Supply
Secondary Attributes: On-Board LEDs
Embedded: No
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 9V ~ 13.5V Supply
Secondary Attributes: On-Board LEDs
Embedded: No
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| RD772BJBTPLEVB |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
Description: EVAL BOARD FOR MC33772C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: MC33772C
Supplied Contents: Board(s), Cable(s)
Embedded: No
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| RD772BJBTPL8EVB |
|
Виробник: NXP USA Inc.
Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs
Embedded: No
Description: 00 V BATTERY JUNCTION BOX USING
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Secondary Attributes: On-Board LEDs
Embedded: No
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| QN9090-001-T10 |
|
Виробник: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5
Supplied Contents: Board(s)
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| P3T1755DPZ |
|
Виробник: NXP USA Inc.
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Features: Shutdown Mode, One-Shot
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Features: Shutdown Mode, One-Shot
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 28.25 грн |
| P3T1755DPZ |
|
Виробник: NXP USA Inc.
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Features: Shutdown Mode, One-Shot
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
Description: SENSOR DGTL -40C ~ 125C 8-TSSOP
Features: Shutdown Mode, One-Shot
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: 2-Wire Serial, I2C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5°C (±1°C)
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 2641 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 7+ | 49.05 грн |
| 8+ | 41.14 грн |
| 10+ | 39.01 грн |
| 25+ | 34.15 грн |
| 50+ | 32.52 грн |
| 100+ | 31.02 грн |
| 500+ | 27.54 грн |
| 1000+ | 26.43 грн |
| P3T1750DPZ |
|
Виробник: NXP USA Inc.
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
Description: IC TEMP SENSOR I3C/I2C-BUS
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 3.6V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 8-TSSOP
Test Condition: -20°C ~ 85°C
Accuracy - Highest (Lowest): ±1°C
Sensing Temperature - Local: -40°C ~ 125°C
товару немає в наявності
Мінімальне замовлення: 2500 шт
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од. на суму грн.