Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35737) > Сторінка 592 з 596
Фото | Назва | Виробник | Інформація |
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A5G35H110N-3400 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 3.3GHz ~ 3.7GHz Power - Output: 15.1W Gain: 15.3dB Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 70 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PMST2369,135 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 250mV @ 1mA, 10mA Current - Collector Cutoff (Max): 400nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V Frequency - Transition: 500MHz Supplier Device Package: SOT-323 Grade: Automotive Current - Collector (Ic) (Max): 200 mA Voltage - Collector Emitter Breakdown (Max): 15 V Power - Max: 200 mW Qualification: AEC-Q101 |
на замовлення 150000 шт: термін постачання 21-31 дні (днів) |
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PDTA123EM,315 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 129976 шт: термін постачання 21-31 дні (днів) |
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S9S08LG16J0VLF | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 18KB (18K x 8) RAM Size: 1.9K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 9x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 39 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HC175PW-Q100J | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 8 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 89 MHz Input Capacitance: 3.5 pF Supplier Device Package: 16-TSSOP Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF Number of Bits per Element: 4 |
на замовлення 4899 шт: термін постачання 21-31 дні (днів) |
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FH32K148UJT0VLQT | NXP USA Inc. |
Description: S32K148 144 LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S32M276LHABMKHST | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7F Data Converters: A/D 6x12b SAR; D/A 2x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 480 шт: термін постачання 21-31 дні (днів) |
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S32M276CHABMKHST | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7F Data Converters: A/D 6x12b SAR; D/A 2x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 429 шт: термін постачання 21-31 дні (днів) |
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S912ZVC96AMKHR | NXP USA Inc. |
Description: S912ZVC96AMKHR Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 16x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C912ZVMC64L0MKH | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Number of I/O: 24 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C912ZVML12L0MKH | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Number of I/O: 24 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BFG505/X,215 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: TO-253-4, TO-253AA Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 175°C (TJ) Power - Max: 150mW Current - Collector (Ic) (Max): 18mA Voltage - Collector Emitter Breakdown (Max): 15V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz Supplier Device Package: SOT-143B |
на замовлення 4610 шт: термін постачання 21-31 дні (днів) |
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MC908QT2ACDWE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
на замовлення 1378 шт: термін постачання 21-31 дні (днів) |
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BAP51-02,315 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-79, SOD-523 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD-523 Current - Max: 50 mA Power Dissipation (Max): 715 mW |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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BAP51-02,315 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD-523 Current - Max: 50 mA Power Dissipation (Max): 715 mW |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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TJA1042TK/3/2Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 4920 шт: термін постачання 21-31 дні (днів) |
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SAF4000EL/103Q23CY | NXP USA Inc. |
Description: SAF4000EL/103Q23CY Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/103Q23CK | NXP USA Inc. |
Description: SAF4000EL/103Q23CK Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/103Q235Y | NXP USA Inc. |
Description: SAF4000EL/103Q235Y Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/103Q235K | NXP USA Inc. |
Description: SAF4000EL/103Q235K Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC33FS8430G4KSR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMX8QP6AVUFFAB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1313-BFBGA Mounting Type: Surface Mount Speed: 1.6GHz, 1.26GHz, 266MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1313-BGA (29x29) Ethernet: 1Gbps (2) USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Number of Cores/Bus Width: 7 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Additional Interfaces: CANbus, I2C, SPI, UART |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PMN70XPE,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2A, 4.5V Power Dissipation (Max): 500mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1.25V @ 250µA Supplier Device Package: 6-TSOP Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 7.8 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 602 pF @ 10 V |
на замовлення 41368 шт: термін постачання 21-31 дні (днів) |
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74HC74DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Output Type: Complementary Mounting Type: Surface Mount Number of Elements: 2 Function: Set(Preset) and Reset Type: D-Type Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Current - Quiescent (Iq): 40 µA Current - Output High, Low: 5.2mA, 5.2mA Trigger Type: Positive Edge Clock Frequency: 82 MHz Input Capacitance: 3.5 pF Supplier Device Package: 14-SSOP Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF Number of Bits per Element: 1 |
на замовлення 9761 шт: термін постачання 21-31 дні (днів) |
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MC33FS8430G4KS | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HCT138DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
на замовлення 51489 шт: термін постачання 21-31 дні (днів) |
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AFV121KHR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 960MHz ~ 1.22GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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AFV121KHR5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 960MHz ~ 1.22GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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PCF8576DT/2,518 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: 40 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Grade: Automotive Current - Supply: 3.5 µA Qualification: AEC-Q100 |
на замовлення 1995 шт: термін постачання 21-31 дні (днів) |
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C912ZVMC12L0WKHR | NXP USA Inc. |
Description: 16-BIT MICROCONTROLLERS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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C912ZVMC12L0WKH | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Number of I/O: 24 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HC157PW,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP |
на замовлення 2160 шт: термін постачання 21-31 дні (днів) |
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BZX84-A2V4,235 | NXP USA Inc. |
![]() Tolerance: ±1% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.4 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 µA @ 1 V Qualification: AEC-Q101 |
на замовлення 32500 шт: термін постачання 21-31 дні (днів) |
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BZX84-A22,215 | NXP USA Inc. |
![]() Tolerance: ±1% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 22 V Impedance (Max) (Zzt): 55 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 nA @ 700 mV Qualification: AEC-Q101 |
на замовлення 3161 шт: термін постачання 21-31 дні (днів) |
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S912ZVLA12F0MFM | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12 Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b, 6x12b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
NXQ1TXL5DB1411UL | NXP USA Inc. |
Description: EVAL BOARD FOR NXQ1TXL5 Packaging: Bulk Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: NXQ1TXL5 Primary Attributes: Transmitter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MCIMX6Q5EZK08AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
T1013NSN7PQA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74ABT543AD,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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74ABT543AD,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO |
на замовлення 1131 шт: термін постачання 21-31 дні (днів) |
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MPF5302AMMA0ESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-PowerWFQFN Output Type: Adjustable Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 1 Function: Step-Down Current - Output: 15A Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 2MHz ~ 3MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 24-HWQFN (4.5x3.5) Synchronous Rectifier: No Voltage - Output (Max): 1.2V Voltage - Input (Min): 2.7V Voltage - Output (Min/Fixed): 0.5V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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TDF8546TH/N2ZJ | NXP USA Inc. |
![]() Features: Depop, Short-Circuit and Thermal Protection Packaging: Tape & Reel (TR) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 36-HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TDF8546TH/N2ZJ | NXP USA Inc. |
![]() Features: Depop, Short-Circuit and Thermal Protection Packaging: Cut Tape (CT) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 36-HSOP |
на замовлення 498 шт: термін постачання 21-31 дні (днів) |
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PTVS22VP1UTP,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOD-128 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 185°C (TA) Current - Peak Pulse (10/1000µs): 16.9A Voltage - Reverse Standoff (Typ): 22V Supplier Device Package: SOD-128/CFP5 Unidirectional Channels: 1 Voltage - Breakdown (Min): 24.4V Voltage - Clamping (Max) @ Ipp: 35.5V Power - Peak Pulse: 600W Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
на замовлення 8279 шт: термін постачання 21-31 дні (днів) |
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MIMX9332XVVXMABR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SJA1110BEL/1Y | NXP USA Inc. |
Description: SJA1110BEL/1Y Packaging: Tape & Reel (TR) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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SJA1110BEL/1Y | NXP USA Inc. |
Description: SJA1110BEL/1Y Packaging: Cut Tape (CT) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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RD-HVBMSCTBUN | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Monitor Type: Power Management Contents: Board(s) Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
RD-HVBMSCT800BUN | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Monitor Type: Power Management Contents: Board(s), Cable(s), Power Supply, Accessories Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S32M276SFFRD | NXP USA Inc. |
![]() Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: S32M276 Primary Attributes: Motors (BLDC, PMSM) Secondary Attributes: CAN/UART Interface(s) Embedded: Yes, MCU, 8-Bit |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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74HC540N,652 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 6V Number of Bits per Element: 8 Current - Output High, Low: 7.8mA, 7.8mA Supplier Device Package: 20-DIP |
на замовлення 115 шт: термін постачання 21-31 дні (днів) |
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BTS6403UJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: 5G, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 42dB Current - Supply: 100mA Noise Figure: 4.1dB P1dB: 2.9dBm Test Frequency: 3.5GHz Supplier Device Package: 16-HVQFN (3x3) |
на замовлення 5950 шт: термін постачання 21-31 дні (днів) |
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GTL2006PW,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 28-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 28-TSSOP Channel Type: Unidirectional Output Signal: LVTTL Translator Type: Mixed Signal Channels per Circuit: 13 Input Signal: GTL Number of Circuits: 1 |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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SC16C550BIBS,128 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 3Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SC16C550BIBS,128 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 3Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKL14Z32VLK4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TDA18273HN/C1,518 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Tuner Voltage - Supply: 3.3V ~ 3.6V Applications: Professional Video Standards: DVB-T2, DVB-C2 Supplier Device Package: 40-HVQFN (6x6) Control Interface: I2C |
на замовлення 218999 шт: термін постачання 21-31 дні (днів) |
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S9S08SG4E2MSC | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MK60DN512ZVMC10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 86 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
MIMXRT1172AVM8B | NXP USA Inc. |
Description: IC Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
A5G35H110N-3400 |
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Виробник: NXP USA Inc.
Description: RF MOSFET 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
Power - Output: 15.1W
Gain: 15.3dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
Description: RF MOSFET 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 3.3GHz ~ 3.7GHz
Power - Output: 15.1W
Gain: 15.3dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 70 mA
товару немає в наявності
В кошику
од. на суму грн.
PMST2369,135 |
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Виробник: NXP USA Inc.
Description: TRANS NPN 15V 0.2A SOT-323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 400nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Frequency - Transition: 500MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 200 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 200 mW
Qualification: AEC-Q101
Description: TRANS NPN 15V 0.2A SOT-323
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 250mV @ 1mA, 10mA
Current - Collector Cutoff (Max): 400nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 10mA, 1V
Frequency - Transition: 500MHz
Supplier Device Package: SOT-323
Grade: Automotive
Current - Collector (Ic) (Max): 200 mA
Voltage - Collector Emitter Breakdown (Max): 15 V
Power - Max: 200 mW
Qualification: AEC-Q101
на замовлення 150000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
13172+ | 1.52 грн |
PDTA123EM,315 |
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на замовлення 129976 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
11871+ | 2.28 грн |
S9S08LG16J0VLF |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 18KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 18KB (18K x 8)
RAM Size: 1.9K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 9x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
74HC175PW-Q100J |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
на замовлення 4899 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1794+ | 12.48 грн |
S32M276LHABMKHST |
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Виробник: NXP USA Inc.
Description: S32M276LHABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32M276LHABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 480 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1313.09 грн |
10+ | 980.60 грн |
25+ | 897.04 грн |
160+ | 731.78 грн |
S32M276CHABMKHST |
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Виробник: NXP USA Inc.
Description: S32M276CHABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: S32M276CHABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 429 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1313.09 грн |
10+ | 980.60 грн |
25+ | 897.04 грн |
160+ | 755.98 грн |
S912ZVC96AMKHR |
Виробник: NXP USA Inc.
Description: S912ZVC96AMKHR
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S912ZVC96AMKHR
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
C912ZVMC64L0MKH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
C912ZVML12L0MKH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
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BFG505/X,215 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
Description: RF TRANS NPN 15V 9GHZ SOT-143B
Packaging: Bulk
Package / Case: TO-253-4, TO-253AA
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 150mW
Current - Collector (Ic) (Max): 18mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 6V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.2dB ~ 1.9dB @ 900MHz ~ 2GHz
Supplier Device Package: SOT-143B
на замовлення 4610 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1665+ | 13.66 грн |
MC908QT2ACDWE |
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Виробник: NXP USA Inc.
Description: MC68HC908QT - MICROCONTROLLER, 8
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: MC68HC908QT - MICROCONTROLLER, 8
Packaging: Bulk
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
на замовлення 1378 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
126+ | 180.58 грн |
BAP51-02,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8000+ | 7.13 грн |
BAP51-02,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
18+ | 18.30 грн |
26+ | 12.11 грн |
29+ | 10.73 грн |
100+ | 8.61 грн |
250+ | 7.91 грн |
500+ | 7.50 грн |
1000+ | 7.03 грн |
2500+ | 6.68 грн |
TJA1042TK/3/2Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 4920 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 85.15 грн |
10+ | 69.66 грн |
25+ | 66.49 грн |
100+ | 56.62 грн |
250+ | 52.09 грн |
500+ | 51.27 грн |
1000+ | 49.56 грн |
2500+ | 43.38 грн |
MC33FS8430G4KSR2 |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MIMX8QP6AVUFFAB |
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Виробник: NXP USA Inc.
Description: MPU I.MX8 QUAD PLUS
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.26GHz, 266MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 7 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Description: MPU I.MX8 QUAD PLUS
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.26GHz, 266MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 7 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8433.99 грн |
PMN70XPE,115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PMN70XPE - SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2A, 4.5V
Power Dissipation (Max): 500mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 602 pF @ 10 V
Description: NOW NEXPERIA PMN70XPE - SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2A, 4.5V
Power Dissipation (Max): 500mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 602 pF @ 10 V
на замовлення 41368 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4745+ | 4.55 грн |
74HC74DB,112 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE DOUBLE 1BIT 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 82 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF
Number of Bits per Element: 1
Description: IC FF D-TYPE DOUBLE 1BIT 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 40 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 82 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SSOP
Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF
Number of Bits per Element: 1
на замовлення 9761 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1393+ | 16.15 грн |
MC33FS8430G4KS |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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од. на суму грн.
74HCT138DB,112 |
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Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 3-8 LINE 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC DECODER/DEMUX 3-8 LINE 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
на замовлення 51489 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1399+ | 15.41 грн |
AFV121KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
50+ | 49707.50 грн |
AFV121KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 64 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 59590.23 грн |
10+ | 54072.46 грн |
PCF8576DT/2,518 |
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Виробник: NXP USA Inc.
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
на замовлення 1995 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 167.12 грн |
10+ | 119.62 грн |
25+ | 109.22 грн |
100+ | 91.80 грн |
250+ | 86.69 грн |
500+ | 83.61 грн |
1000+ | 79.74 грн |
C912ZVMC12L0WKH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
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од. на суму грн.
74HC157PW,118 |
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Виробник: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Description: IC QUAD 2-IN MUX 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
на замовлення 2160 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2160+ | 9.86 грн |
BZX84-A2V4,235 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 2.4V 250MW SOT23
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 2.4V 250MW SOT23
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q101
на замовлення 32500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2681+ | 8.35 грн |
BZX84-A22,215 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 22V 250MW SOT23
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Qualification: AEC-Q101
Description: DIODE ZENER 22V 250MW SOT23
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 55 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 700 mV
Qualification: AEC-Q101
на замовлення 3161 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3161+ | 8.35 грн |
S912ZVLA12F0MFM |
Виробник: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
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NXQ1TXL5DB1411UL |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR NXQ1TXL5
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NXQ1TXL5
Primary Attributes: Transmitter
Description: EVAL BOARD FOR NXQ1TXL5
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NXQ1TXL5
Primary Attributes: Transmitter
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MCIMX6Q5EZK08AD |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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T1013NSN7PQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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74ABT543AD,118 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
860+ | 26.56 грн |
74ABT543AD,112 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
на замовлення 1131 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1131+ | 26.56 грн |
MPF5302AMMA0ESR2 |
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Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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TDF8546TH/N2ZJ |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
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TDF8546TH/N2ZJ |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
на замовлення 498 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2244.98 грн |
10+ | 1748.32 грн |
25+ | 1645.05 грн |
100+ | 1437.36 грн |
250+ | 1386.63 грн |
PTVS22VP1UTP,115 |
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Виробник: NXP USA Inc.
Description: TVS DIODE 22VWM 35.5VC SOD1285
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Current - Peak Pulse (10/1000µs): 16.9A
Voltage - Reverse Standoff (Typ): 22V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 24.4V
Voltage - Clamping (Max) @ Ipp: 35.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE 22VWM 35.5VC SOD1285
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Current - Peak Pulse (10/1000µs): 16.9A
Voltage - Reverse Standoff (Typ): 22V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 24.4V
Voltage - Clamping (Max) @ Ipp: 35.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
на замовлення 8279 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2509+ | 9.10 грн |
MIMX9332XVVXMABR |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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SJA1110BEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110BEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110BEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1000+ | 1001.90 грн |
SJA1110BEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110BEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110BEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1570.13 грн |
10+ | 1207.67 грн |
25+ | 1131.69 грн |
100+ | 983.76 грн |
250+ | 946.43 грн |
500+ | 923.94 грн |
RD-HVBMSCTBUN |
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Виробник: NXP USA Inc.
Description: RD-HVBMSCTBUN
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Embedded: No
Description: RD-HVBMSCTBUN
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Embedded: No
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RD-HVBMSCT800BUN |
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Виробник: NXP USA Inc.
Description: 800 V BATTERY MANAGEMENT SYSTEM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: No
Description: 800 V BATTERY MANAGEMENT SYSTEM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: No
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S32M276SFFRD |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR S32M276
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M276
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: CAN/UART Interface(s)
Embedded: Yes, MCU, 8-Bit
Description: EVAL BOARD FOR S32M276
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M276
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: CAN/UART Interface(s)
Embedded: Yes, MCU, 8-Bit
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3821.48 грн |
74HC540N,652 |
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Виробник: NXP USA Inc.
Description: IC BUFFER INVERT 6V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-DIP
Description: IC BUFFER INVERT 6V 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-DIP
на замовлення 115 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
115+ | 40.97 грн |
BTS6403UJ |
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Виробник: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
на замовлення 5950 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 253.07 грн |
10+ | 210.90 грн |
25+ | 199.31 грн |
100+ | 172.09 грн |
250+ | 163.13 грн |
500+ | 156.80 грн |
1000+ | 148.36 грн |
GTL2006PW,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 13
Input Signal: GTL
Number of Circuits: 1
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 13
Input Signal: GTL
Number of Circuits: 1
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
270+ | 84.22 грн |
SC16C550BIBS,128 |
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Виробник: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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SC16C550BIBS,128 |
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Виробник: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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MKL14Z32VLK4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified
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TDA18273HN/C1,518 |
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Виробник: NXP USA Inc.
Description: IC VIDEO SILICON TUNER 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
Description: IC VIDEO SILICON TUNER 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 3.3V ~ 3.6V
Applications: Professional Video
Standards: DVB-T2, DVB-C2
Supplier Device Package: 40-HVQFN (6x6)
Control Interface: I2C
на замовлення 218999 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
249+ | 88.82 грн |
S9S08SG4E2MSC |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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MK60DN512ZVMC10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 86
DigiKey Programmable: Not Verified
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