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74HCT109PW,112 74HCT109PW,112 NXP USA Inc. 74HC_HCT109.pdf Description: IC FF JK TYPE DBL 1-BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 55 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74HCT107D,652 74HCT107D,652 NXP USA Inc. 74HC_HCT107.pdf Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 66 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 36ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74HCT393D,653 74HCT393D,653 NXP USA Inc. 74HC_HCT393.pdf Description: IC DUAL 4BIT BINARY RIPPL 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393D,652 74HCT393D,652 NXP USA Inc. 74HC_HCT393.pdf Description: IC COUNTER DUAL 4BIT BIN 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393BQ,115 74HCT393BQ,115 NXP USA Inc. 74HC_HCT393.pdf Description: IC DUAL 4BIT RIPP COUNT 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DHVQFN (2.5x3)
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393DB,118 74HCT393DB,118 NXP USA Inc. 74HC_HCT393.pdf Description: IC DUAL 4BIT BINARY RIPPL 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393DB,112 74HCT393DB,112 NXP USA Inc. 74HC_HCT393.pdf Description: IC DUAL 4BIT RIPPLE COUNT 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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BZX384-C3V3,115 BZX384-C3V3,115 NXP USA Inc. BZX384_SER.pdf Description: DIODE ZENER 3.3V 300MW SOD323
Packaging: Tape & Reel (TR)
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BCP54-16,115 NXP USA Inc. BCP54_SER.pdf Description: TRANSISTOR NPN 45V 1A SOT223
Packaging: Tape & Reel (TR)
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BCP54,115 NXP USA Inc. BCP54_SER.pdf Description: TRANSISTOR NPN 45V 1A SOT223
Packaging: Tape & Reel (TR)
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74HC540D,652 74HC540D,652 NXP USA Inc. 74HC_HCT540.pdf Description: IC BUFF 2V/6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC540DB,118 74HC540DB,118 NXP USA Inc. 74HC_HCT540.pdf Description: IC BUFF 2V/6V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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HEF4521BT,653 HEF4521BT,653 NXP USA Inc. HEF4521B.pdf Description: IC FREQ DIVIDER 24STG 16SOIC
Packaging: Tape & Reel (TR)
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HEF4521BT,652 HEF4521BT,652 NXP USA Inc. HEF4521B.pdf Description: IC FREQ DIVIDER 24STG 16-SOIC
Packaging: Tube
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SPC5745BBK1AVKU6 SPC5745BBK1AVKU6 NXP USA Inc. MPC5746C-Datasheet.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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LS2084ASE7V1B LS2084ASE7V1B NXP USA Inc. Download?colCode=LS2084A&amp;location=null Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA (2)
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MC33907LAER2 MC33907LAER2 NXP USA Inc. MC33907-MC33908D2.pdf Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Applications: Automotive, Power Supply
Supplier Device Package: 48-HLQFP (7x7)
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74LVC2G74GD,125 74LVC2G74GD,125 NXP USA Inc. 74LVC2G74.pdf Description: IC D-TYPE POS TRG SNGL 8XSON
Packaging: Tape & Reel (TR)
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BAS516,135 BAS516,135 NXP USA Inc. BAS16_SER.pdf Description: DIODE SWITCH 100V 0.25A SOD523
Packaging: Tape & Reel (TR)
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BAS516,115 BAS516,115 NXP USA Inc. BAS16_SER.pdf Description: DIODE SWITCH 100V 0.25A SOD523
Packaging: Tape & Reel (TR)
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BATT-18EMULATOR NXP USA Inc. BATT-18EMULATOR.pdf Description: 18-CELL BATTERY PACK EMULATOR TO
Packaging: Bulk
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33774
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+40971.95 грн
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P4081NSN7KKC P4081NSN7KKC NXP USA Inc. QP4080FS.pdf Description: IC MPU QORIQ P4 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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MIMX8MN2CVTIZAAR MIMX8MN2CVTIZAAR NXP USA Inc. IMX8MNIEC.pdf Description: I.MX 8M NANO FCPBGA486M
Packaging: Tape & Reel (TR)
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 750MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
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MIMX8MN2CVTIZAAR MIMX8MN2CVTIZAAR NXP USA Inc. IMX8MNIEC.pdf Description: I.MX 8M NANO FCPBGA486M
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 750MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
на замовлення 999 шт:
термін постачання 21-31 дні (днів)
1+2064.14 грн
10+1606.54 грн
25+1511.32 грн
100+1356.27 грн
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BTA201-600B,112 NXP USA Inc. BTA201-600B%2C112.pdf Description: TRIAC 600V 1A TO92-3
Packaging: Bulk
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BTA201-800ER,126 NXP USA Inc. bta201-800er.pdf Description: TRIAC 800V 1A TO-92
Packaging: Tape & Box (TB)
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BTA201-800ER,112 NXP USA Inc. BTA201-800ER_112.pdf Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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BTA201-800B,112 NXP USA Inc. bta201-800e.pdf Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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BTA201-800E,112 NXP USA Inc. bta201-800e.pdf Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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74HC173D,653 74HC173D,653 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173D,652 74HC173D,652 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173PW,118 74HC173PW,118 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173DB,112 74HC173DB,112 NXP USA Inc. 74HC_HCT173.pdf Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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BTA412Y-600C,127 NXP USA Inc. BTA412Y-600C.pdf Description: TRIAC 600V 12A TO220AB-3
Packaging: Tube
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74LVC1G19GV,125 74LVC1G19GV,125 NXP USA Inc. 74LVC1G19.pdf Description: IC DECODER/DEMUX 1-OF-2 6TSOP
Packaging: Tape & Reel (TR)
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BF820,215 NXP USA Inc. BF820.pdf Description: TRANS NPN 300V 50MA SOT23
Packaging: Tape & Reel (TR)
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MCXA145VMP NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
на замовлення 614 шт:
термін постачання 21-31 дні (днів)
1+350.49 грн
10+256.59 грн
25+236.36 грн
100+200.97 грн
250+191.04 грн
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BRKFXPS7XXX-PCB NXP USA Inc. BRKFXPS7XXX-PCB.pdf Description: BRKFXPS7XXX-PCB
Packaging: Bulk
Contents: Board(s)
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NTS0103GU10,115 NTS0103GU10,115 NXP USA Inc. NTS0103.pdf Description: IC XLTR VL BIDIR 10-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
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NTS0103GU10,115 NTS0103GU10,115 NXP USA Inc. NTS0103.pdf Description: IC XLTR VL BIDIR 10-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 1796 шт:
термін постачання 21-31 дні (днів)
6+61.71 грн
10+42.28 грн
25+38.06 грн
100+31.36 грн
250+29.28 грн
500+28.02 грн
1000+26.55 грн
Мінімальне замовлення: 6
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BZT52H-C15,115 NXP USA Inc. BZT52H_SER.pdf Description: DIODE ZENER 15V 375MW SOD123F
Packaging: Tape & Reel (TR)
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S9S08SG32E1CTLR S9S08SG32E1CTLR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MCIMX6D5EZK08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6Q5EZK08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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SI2304DS,215 SI2304DS,215 NXP USA Inc. SI2304DS_Aug17%2C2001.pdf Description: MOSFET N-CH 30V 1.7A SOT23
Packaging: Tape & Reel (TR)
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74LVC3G17DP,125 74LVC3G17DP,125 NXP USA Inc. 74LVC3G17.pdf Description: IC BUFF NON-INVERT 5.5V 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
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T4160NSN7QTB T4160NSN7QTB NXP USA Inc. T4240T4160FS.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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T4240NSE7QTB T4240NSE7QTB NXP USA Inc. T4240.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
на замовлення 3240 шт:
термін постачання 21-31 дні (днів)
1+93975.11 грн
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T4240NSE7QTB T4240NSE7QTB NXP USA Inc. T4240.pdf Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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1N4739A,113 1N4739A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 9.1V 1W DO41
Packaging: Tape & Reel (TR)
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74HC4017BQ,115 74HC4017BQ,115 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HCT4017BQ,115 74HCT4017BQ,115 NXP USA Inc. 74HC_HCT4017.pdf Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 67 MHz
Number of Bits per Element: 10
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1N4741A,113 1N4741A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 11V 1W DO41
Packaging: Tape & Reel (TR)
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74HCT4053D,112 74HCT4053D,112 NXP USA Inc. NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX TRIPLE 2X1 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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74HCT4053DB,112 74HCT4053DB,112 NXP USA Inc. NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw Description: IC MUX/DEMUX TRIPLE 2X1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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PCA9451A-EVK PCA9451A-EVK NXP USA Inc. UM11883.pdf Description: EVAL KIT FOR PCA9451
Packaging: Bulk
Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+10380.06 грн
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RD33774PDSTEVB NXP USA Inc. getting-started-with-the-rd33774pdstevb-evaluation-board:GS-RD33774PDSTEVB Description: RD33774PDSTEVB
Packaging: Box
Contents: Board(s)
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MPC860SRZQ80D4 MPC860SRZQ80D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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PDTA113ZT,215 PDTA113ZT,215 NXP USA Inc. PDTA113Z_SER.pdf Description: TRANS PREBIAS PNP 250MW TO236AB
Packaging: Tape & Reel (TR)
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PUMD13,135 PUMD13,135 NXP USA Inc. PEMD13_PUMD13.pdf Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
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74HCT109PW,112 74HC_HCT109.pdf
74HCT109PW,112
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DBL 1-BIT 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 55 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74HCT107D,652 74HC_HCT107.pdf
74HCT107D,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Complementary
Mounting Type: Surface Mount
Number of Elements: 2
Function: Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Positive Edge
Clock Frequency: 66 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 14-SO
Max Propagation Delay @ V, Max CL: 36ns @ 4.5V, 50pF
Number of Bits per Element: 1
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74HCT393D,653 74HC_HCT393.pdf
74HCT393D,653
Виробник: NXP USA Inc.
Description: IC DUAL 4BIT BINARY RIPPL 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393D,652 74HC_HCT393.pdf
74HCT393D,652
Виробник: NXP USA Inc.
Description: IC COUNTER DUAL 4BIT BIN 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393BQ,115 74HC_HCT393.pdf
74HCT393BQ,115
Виробник: NXP USA Inc.
Description: IC DUAL 4BIT RIPP COUNT 14DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-DHVQFN (2.5x3)
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393DB,118 74HC_HCT393.pdf
74HCT393DB,118
Виробник: NXP USA Inc.
Description: IC DUAL 4BIT BINARY RIPPL 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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74HCT393DB,112 74HC_HCT393.pdf
74HCT393DB,112
Виробник: NXP USA Inc.
Description: IC DUAL 4BIT RIPPLE COUNT 14SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SSOP
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 107 MHz
Number of Bits per Element: 4
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BZX384-C3V3,115 BZX384_SER.pdf
BZX384-C3V3,115
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.3V 300MW SOD323
Packaging: Tape & Reel (TR)
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BCP54-16,115 BCP54_SER.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR NPN 45V 1A SOT223
Packaging: Tape & Reel (TR)
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BCP54,115 BCP54_SER.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR NPN 45V 1A SOT223
Packaging: Tape & Reel (TR)
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74HC540D,652 74HC_HCT540.pdf
74HC540D,652
Виробник: NXP USA Inc.
Description: IC BUFF 2V/6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC540DB,118 74HC_HCT540.pdf
74HC540DB,118
Виробник: NXP USA Inc.
Description: IC BUFF 2V/6V 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 8
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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HEF4521BT,653 HEF4521B.pdf
HEF4521BT,653
Виробник: NXP USA Inc.
Description: IC FREQ DIVIDER 24STG 16SOIC
Packaging: Tape & Reel (TR)
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HEF4521BT,652 HEF4521B.pdf
HEF4521BT,652
Виробник: NXP USA Inc.
Description: IC FREQ DIVIDER 24STG 16-SOIC
Packaging: Tube
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SPC5745BBK1AVKU6 MPC5746C-Datasheet.pdf
SPC5745BBK1AVKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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LS2084ASE7V1B Download?colCode=LS2084A&amp;location=null
LS2084ASE7V1B
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 2.0GHZ 1292FCPBGA
Packaging: Tray
Package / Case: 1292-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8) or 1GbE (16) & 2.5GbE (1)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA (2)
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MC33907LAER2 MC33907-MC33908D2.pdf
MC33907LAER2
Виробник: NXP USA Inc.
Description: IC REG AUTO APPL 6OUT 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Applications: Automotive, Power Supply
Supplier Device Package: 48-HLQFP (7x7)
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74LVC2G74GD,125 74LVC2G74.pdf
74LVC2G74GD,125
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 8XSON
Packaging: Tape & Reel (TR)
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BAS516,135 BAS16_SER.pdf
BAS516,135
Виробник: NXP USA Inc.
Description: DIODE SWITCH 100V 0.25A SOD523
Packaging: Tape & Reel (TR)
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BAS516,115 BAS16_SER.pdf
BAS516,115
Виробник: NXP USA Inc.
Description: DIODE SWITCH 100V 0.25A SOD523
Packaging: Tape & Reel (TR)
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BATT-18EMULATOR BATT-18EMULATOR.pdf
Виробник: NXP USA Inc.
Description: 18-CELL BATTERY PACK EMULATOR TO
Packaging: Bulk
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33774
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+40971.95 грн
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P4081NSN7KKC QP4080FS.pdf
P4081NSN7KKC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P4 1.2GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (8), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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MIMX8MN2CVTIZAAR IMX8MNIEC.pdf
MIMX8MN2CVTIZAAR
Виробник: NXP USA Inc.
Description: I.MX 8M NANO FCPBGA486M
Packaging: Tape & Reel (TR)
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 750MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
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MIMX8MN2CVTIZAAR IMX8MNIEC.pdf
MIMX8MN2CVTIZAAR
Виробник: NXP USA Inc.
Description: I.MX 8M NANO FCPBGA486M
Packaging: Cut Tape (CT)
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz, 750MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI, LCD
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: AC'97, I2C, I2S, MMC/SD, PCIe, PDM, SAI, SDHC, SPDIF, SPI, TDM, UART
на замовлення 999 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2064.14 грн
10+1606.54 грн
25+1511.32 грн
100+1356.27 грн
В кошику  од. на суму  грн.
BTA201-600B,112 BTA201-600B%2C112.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 1A TO92-3
Packaging: Bulk
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BTA201-800ER,126 bta201-800er.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 1A TO-92
Packaging: Tape & Box (TB)
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BTA201-800ER,112 BTA201-800ER_112.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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BTA201-800B,112 bta201-800e.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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BTA201-800E,112 bta201-800e.pdf
Виробник: NXP USA Inc.
Description: TRIAC 800V 1A TO-92
Packaging: Bulk
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74HC173D,653 74HC_HCT173.pdf
74HC173D,653
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173D,652 74HC_HCT173.pdf
74HC173D,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4-BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SO
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173PW,118 74HC_HCT173.pdf
74HC173PW,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 4-BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-TSSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC173DB,112 74HC_HCT173.pdf
74HC173DB,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4BIT 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State, Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 7.8mA, 7.8mA
Trigger Type: Positive Edge
Clock Frequency: 95 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-SSOP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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BTA412Y-600C,127 BTA412Y-600C.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 12A TO220AB-3
Packaging: Tube
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74LVC1G19GV,125 74LVC1G19.pdf
74LVC1G19GV,125
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1-OF-2 6TSOP
Packaging: Tape & Reel (TR)
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BF820,215 BF820.pdf
Виробник: NXP USA Inc.
Description: TRANS NPN 300V 50MA SOT23
Packaging: Tape & Reel (TR)
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MCXA145VMP MCXAP100M96FS6.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 48MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
на замовлення 614 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+350.49 грн
10+256.59 грн
25+236.36 грн
100+200.97 грн
250+191.04 грн
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BRKFXPS7XXX-PCB BRKFXPS7XXX-PCB.pdf
Виробник: NXP USA Inc.
Description: BRKFXPS7XXX-PCB
Packaging: Bulk
Contents: Board(s)
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 10-XQFN
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
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NTS0103GU10,115 NTS0103.pdf
NTS0103GU10,115
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 10-XQFN
Packaging: Cut Tape (CT)
Features: Auto-Direction Sensing
Package / Case: 10-XFQFN
Output Type: Open Drain, Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 10-XQFN (1.4x1.8)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 3
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 1796 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.71 грн
10+42.28 грн
25+38.06 грн
100+31.36 грн
250+29.28 грн
500+28.02 грн
1000+26.55 грн
Мінімальне замовлення: 6
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BZT52H-C15,115 BZT52H_SER.pdf
Виробник: NXP USA Inc.
Description: DIODE ZENER 15V 375MW SOD123F
Packaging: Tape & Reel (TR)
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S9S08SG32E1CTLR MC9S08SG32.pdf
S9S08SG32E1CTLR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MCIMX6D5EZK08AD IMX6DQAEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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MCIMX6Q5EZK08AD IMX6DQAEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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SI2304DS,215 SI2304DS_Aug17%2C2001.pdf
SI2304DS,215
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 1.7A SOT23
Packaging: Tape & Reel (TR)
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74LVC3G17DP,125 74LVC3G17.pdf
74LVC3G17DP,125
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 8-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-TSSOP
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T4160NSN7QTB T4240T4160FS.pdf
T4160NSN7QTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (13), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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T4240NSE7QTB T4240.pdf
T4240NSE7QTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Bulk
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
на замовлення 3240 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+93975.11 грн
В кошику  од. на суму  грн.
T4240NSE7QTB T4240.pdf
T4240NSE7QTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T4 1.8GHZ 1932BGA
Packaging: Tray
Package / Case: 1932-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 1932-FCPBGA (45x45)
Ethernet: 1Gbps (16), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 12 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, RapidIO, SPI, UART
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1N4739A,113 1N4728A_SER.pdf
1N4739A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 9.1V 1W DO41
Packaging: Tape & Reel (TR)
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74HC4017BQ,115 74HC_HCT4017.pdf
74HC4017BQ,115
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 2 V ~ 6 V
Count Rate: 83 MHz
Number of Bits per Element: 10
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74HCT4017BQ,115 74HC_HCT4017.pdf
74HCT4017BQ,115
Виробник: NXP USA Inc.
Description: IC DECADE COUNTER 10BIT 16DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Counter, Decade
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C (TA)
Direction: Up
Trigger Type: Positive, Negative
Timing: Synchronous
Supplier Device Package: 16-DHVQFN (2.5x3.5)
Voltage - Supply: 4.5 V ~ 5.5 V
Count Rate: 67 MHz
Number of Bits per Element: 10
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1N4741A,113 1N4728A_SER.pdf
1N4741A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 11V 1W DO41
Packaging: Tape & Reel (TR)
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74HCT4053D,112 NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw
74HCT4053D,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SO
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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74HCT4053DB,112 NEXP-S-A0003512977-1.pdf?t.download=true&u=5oefqw
74HCT4053DB,112
Виробник: NXP USA Inc.
Description: IC MUX/DEMUX TRIPLE 2X1 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 120Ohm
-3db Bandwidth: 170MHz
Supplier Device Package: 16-SSOP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Voltage - Supply, Dual (V±): ±1V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPDT
Switch Time (Ton, Toff) (Max): 34ns, 31ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 100nA
Number of Circuits: 3
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PCA9451A-EVK UM11883.pdf
PCA9451A-EVK
Виробник: NXP USA Inc.
Description: EVAL KIT FOR PCA9451
Packaging: Bulk
Contents: Board(s)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+10380.06 грн
В кошику  од. на суму  грн.
RD33774PDSTEVB getting-started-with-the-rd33774pdstevb-evaluation-board:GS-RD33774PDSTEVB
Виробник: NXP USA Inc.
Description: RD33774PDSTEVB
Packaging: Box
Contents: Board(s)
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MPC860SRZQ80D4 MPC860EC.pdf
MPC860SRZQ80D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
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PDTA113ZT,215 PDTA113Z_SER.pdf
PDTA113ZT,215
Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 250MW TO236AB
Packaging: Tape & Reel (TR)
товару немає в наявності
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PUMD13,135 PEMD13_PUMD13.pdf
PUMD13,135
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN/PNP 6TSSOP
Packaging: Tape & Reel (TR)
товару немає в наявності
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