Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35986) > Сторінка 591 з 600
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| BLF571,112 | NXP USA Inc. |
Description: FET RF 110V 225MHZ SOT467C Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MC68HC11E1CFNE2 | NXP USA Inc. |
 Description: IC MCU 8BIT ROMLESS 52PLCCPackaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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KKL03Z32CAF4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 7x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 20-WLCSP (2x1.61) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| BSH114,215 | NXP USA Inc. |
Description: MOSFET N-CH 100V 500MA SOT23 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PDTD123YT,215 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW TO236AB Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PDTD123ET,215 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW TO236AB Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PDTD123TT,215 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW TO236AB Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PDTD113ZT,215 | NXP USA Inc. |
Description: TRANS NPN W/RES 50V SOT-23 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BAT85,113 | NXP USA Inc. |
Description: DIODE SCHOTTKY 30V 0.2A DO34 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BAT854W,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 0.2A SOT323 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PDZ4.7B,115 | NXP USA Inc. |
Description: DIODE ZENER 4.7V 400MW SOD323 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MRF7P20040HR3 | NXP USA Inc. |
Description: MOSFET RF N-CH 40W NI780H-4 Packaging: Tape & Reel (TR) Package / Case: NI-780-4 Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 2.03GHz Configuration: Dual Power - Output: 10W Gain: 18.2dB Technology: LDMOS Supplier Device Package: NI-780-4 Voltage - Rated: 65 V Voltage - Test: 32 V Current - Test: 150 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MRF7S15100HSR5 | NXP USA Inc. |
Description: MOSFET RF N-CH 28V 23W NI780S Packaging: Tape & Reel (TR) Package / Case: NI-780S Current Rating (Amps): 10µA Mounting Type: Chassis Mount Frequency: 1.51GHz Power - Output: 23W Gain: 19.5dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 600 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| MRF7S38010HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 2W Gain: 15dB Technology: LDMOS Supplier Device Package: NI-400S-2S Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 160 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| MRF7S38040HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 30V NI400 Packaging: Tape & Reel (TR) Package / Case: NI-400S-2S Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.6GHz Power - Output: 8W Gain: 14dB Technology: LDMOS Supplier Device Package: NI-400S-2S Voltage - Rated: 65 V Voltage - Test: 30 V Current - Test: 450 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MRF7S16150HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 1.66GHz Power - Output: 32W Gain: 19.7dB Technology: LDMOS Supplier Device Package: NI-780S Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 1.5 A |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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TL431IDBZR,215 | NXP USA Inc. |
Description: IC VREF SHUNT PREC ADJ SOT-23-3 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| BT132-600D,412 | NXP USA Inc. |
Description: TRIAC 600V 1A TO92-3 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| BT132-600D,116 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A TO92-3 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HEF4069UBTT,118 | NXP USA Inc. |
Description: IC HEX INVERTER 14-TSSOP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PEMI6QFN/HM,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: 12-XFDFN Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 16pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 15dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 6 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC00D,652 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC00DB,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SSOP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 40 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC02D,653 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14-SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NOR Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 2 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF Number of Circuits: 4 Current - Quiescent (Max): 2 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPX5700GS | NXP USA Inc. |
Description: PRESSURE SENSOR GAUGE AXL 6SIP Packaging: Tray Package / Case: 6-SIP Module Mounting Type: Through Hole Termination Style: PCB |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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HEF4066BT,652 | NXP USA Inc. |
Description: IC SWITCH QUAD 1X1 14SOIC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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NTS0304EUKZ | NXP USA Inc. |
Description: IC TRANSLTR TRX 4BIT 12-WLCSP Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 12-WLCSP (1.42x1.97) |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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NTS0304EUKZ | NXP USA Inc. |
Description: IC TRANSLTR TRX 4BIT 12-WLCSP Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Bits: 4 Logic Type: Translating Transceiver Operating Temperature: -40°C ~ 125°C (TA) Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V Supplier Device Package: 12-WLCSP (1.42x1.97) |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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74LVC245ABQ,115 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20DHVQFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74LVC245ADB,118 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Supplier Device Package: 20-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74LVC245AD,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20SOIC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74LVC245ADB,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Supplier Device Package: 20-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HCT540D,653 | NXP USA Inc. |
Description: IC BUFFER INVERTING 5.5V 20-SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HCT540D,652 | NXP USA Inc. |
Description: IC BUFFER INVERTING 5.5V 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HCT540DB,112 | NXP USA Inc. |
Description: IC BUFFER INVERTING 5.5V 20-SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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P5021NXE7TMC | NXP USA Inc. |
Description: IC MPU QORIQ P5 1.8GHZ 1295BGA Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e5500 Voltage - I/O: 1.0V, 1.1V Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (10), 10Gbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPXS3010VMM150 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z7d Data Converters: A/D 22x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| BYC10-600,127 | NXP USA Inc. |
Description: DIODE FAST REC 500V 10A TO220AC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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PMEG4010BEA,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A SOD323 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC573D,652 | NXP USA Inc. |
Description: IC D-TYPE TRANSP 1:8 20-SO Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Delay Time - Propagation: 14ns Supplier Device Package: 20-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC573D,653 | NXP USA Inc. |
Description: IC D-TYPE TRANSP 1:8 20-SO Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Delay Time - Propagation: 14ns Supplier Device Package: 20-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC573DB,118 | NXP USA Inc. |
Description: IC D-TYPE TRANSP 1:8 20-SSOP Packaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Delay Time - Propagation: 14ns Supplier Device Package: 20-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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74HC573DB,112 | NXP USA Inc. |
Description: IC D-TYPE TRANSP 1:8 20-SSOP Packaging: Tube Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 1:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 7.8mA, 7.8mA Delay Time - Propagation: 14ns Supplier Device Package: 20-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| BCM847BV,115 | NXP USA Inc. |
Description: TRANS 2NPN 45V 0.1A SOT666 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MAC97A6,412 | NXP USA Inc. |
Description: TRIAC SENS GATE 400V 0.6A TO92-3 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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BZV55-B8V2,115 | NXP USA Inc. |
Description: DIODE ZENER 8.2V 500MW LLDS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PMLL4148L,115 | NXP USA Inc. |
Description: DIODE SWITCHING 75V 0.2A LLDS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PMLL4148L,135 | NXP USA Inc. |
Description: DIODE SWITCHING 75V 0.2A LLDS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC17XSG500BEK | NXP USA Inc. |
Description: IC SWITCH HIGH-SIDE PENTA 32SOIC Packaging: Tube Features: Internal PWM Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 6 Interface: SPI Switch Type: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: High Side Rds On (Typ): 17mOhm Voltage - Load: 7V ~ 30V Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Current - Output (Max): 5.5A Ratio - Input:Output: 1:1 Supplier Device Package: 32-SOIC-EP Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCA9544AD,112 | NXP USA Inc. |
Description: DIGITAL MOS STAND LOGIC CIRCUIT Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: I2C, SMBus Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V Applications: Translating Switch Supplier Device Package: 20-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC8275ZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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HEF4052BT,653 | NXP USA Inc. |
Description: IC MUX/DEMUX DUAL 4X1 16SOIC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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HEF4052BT,652 | NXP USA Inc. |
Description: IC MUX/DEMUX DUAL 4X1 16SOIC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PEMB3,115 | NXP USA Inc. |
Description: TRANS 2PNP PREBIAS 0.3W SOT666 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| FG32K142HRT0VLHT | NXP USA Inc. |
Description: S32K142 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| FC32K142HRT0VLHT | NXP USA Inc. |
Description: S32K142 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| FC32K142HFT0MLHT | NXP USA Inc. |
Description: S32K142 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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S32K324EHT1VPBSR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 4MB (4M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7F Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| FC32K144HFT0MLFR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| FG32K142HRT0VLHR | NXP USA Inc. |
Description: S32K142 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. |
| MC68HC11E1CFNE2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| KKL03Z32CAF4R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 7x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 20-WLCSP (2x1.61)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| MRF7P20040HR3 |
|
Виробник: NXP USA Inc.
Description: MOSFET RF N-CH 40W NI780H-4
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 10W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 150 mA
Description: MOSFET RF N-CH 40W NI780H-4
Packaging: Tape & Reel (TR)
Package / Case: NI-780-4
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.03GHz
Configuration: Dual
Power - Output: 10W
Gain: 18.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 150 mA
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| MRF7S15100HSR5 |
|
Виробник: NXP USA Inc.
Description: MOSFET RF N-CH 28V 23W NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.51GHz
Power - Output: 23W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 600 mA
Description: MOSFET RF N-CH 28V 23W NI780S
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 1.51GHz
Power - Output: 23W
Gain: 19.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 600 mA
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| MRF7S38010HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA
Description: RF MOSFET LDMOS 30V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 2W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 160 mA
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| MRF7S38040HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 30V NI400
Packaging: Tape & Reel (TR)
Package / Case: NI-400S-2S
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.6GHz
Power - Output: 8W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-400S-2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 450 mA
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| MRF7S16150HSR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 1.66GHz
Power - Output: 32W
Gain: 19.7dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.5 A
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| PEMI6QFN/HM,132 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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| 74HC00D,652 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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| 74HC00DB,112 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
Description: IC GATE NAND 4CH 2-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 7ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 40 µA
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| 74HC02D,653 |
|
Виробник: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Description: IC GATE NOR 4CH 2-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NOR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
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| MPX5700GS |
|
Виробник: NXP USA Inc.
Description: PRESSURE SENSOR GAUGE AXL 6SIP
Packaging: Tray
Package / Case: 6-SIP Module
Mounting Type: Through Hole
Termination Style: PCB
Description: PRESSURE SENSOR GAUGE AXL 6SIP
Packaging: Tray
Package / Case: 6-SIP Module
Mounting Type: Through Hole
Termination Style: PCB
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| NTS0304EUKZ |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR TRX 4BIT 12-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)
Description: IC TRANSLTR TRX 4BIT 12-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4000+ | 39.38 грн |
| NTS0304EUKZ |
|
Виробник: NXP USA Inc.
Description: IC TRANSLTR TRX 4BIT 12-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)
Description: IC TRANSLTR TRX 4BIT 12-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Bits: 4
Logic Type: Translating Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Supply Voltage: 0.95V ~ 3.6V, 1.65V ~ 5.5V
Supplier Device Package: 12-WLCSP (1.42x1.97)
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 82.75 грн |
| 10+ | 57.87 грн |
| 25+ | 52.28 грн |
| 100+ | 43.34 грн |
| 250+ | 40.62 грн |
| 500+ | 39.29 грн |
| 74LVC245ADB,118 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
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| 74LVC245ADB,112 |
|
Виробник: NXP USA Inc.
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
Description: IC TRANSCVR TRI-ST 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP
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| 74HCT540D,653 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Description: IC BUFFER INVERTING 5.5V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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| 74HCT540D,652 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Description: IC BUFFER INVERTING 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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| 74HCT540DB,112 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
Description: IC BUFFER INVERTING 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
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| P5021NXE7TMC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P5 1.8GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Voltage - I/O: 1.0V, 1.1V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (10), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ P5 1.8GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Voltage - I/O: 1.0V, 1.1V
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (10), 10Gbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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| MPXS3010VMM150 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7d
Data Converters: A/D 22x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
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| 74HC573D,652 |
|
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
Description: IC D-TYPE TRANSP 1:8 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
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| 74HC573D,653 |
|
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
Description: IC D-TYPE TRANSP 1:8 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SO
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| 74HC573DB,118 |
|
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
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| 74HC573DB,112 |
|
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
Description: IC D-TYPE TRANSP 1:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 7.8mA, 7.8mA
Delay Time - Propagation: 14ns
Supplier Device Package: 20-SSOP
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| MC17XSG500BEK |
|
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH-SIDE PENTA 32SOIC
Packaging: Tube
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 30V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Description: IC SWITCH HIGH-SIDE PENTA 32SOIC
Packaging: Tube
Features: Internal PWM
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 17mOhm
Voltage - Load: 7V ~ 30V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 5.5A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
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| PCA9544AD,112 |
|
Виробник: NXP USA Inc.
Description: DIGITAL MOS STAND LOGIC CIRCUIT
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Switch
Supplier Device Package: 20-SO
Description: DIGITAL MOS STAND LOGIC CIRCUIT
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I2C, SMBus
Voltage - Supply: 2.3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Translating Switch
Supplier Device Package: 20-SO
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| MPC8275ZQMIBA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| S32K324EHT1VPBSR |
|
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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