Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35481) > Сторінка 587 з 592
Фото | Назва | Виробник | Інформація |
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S912ZVC96AMKHR | NXP USA Inc. |
Description: S912ZVC96AMKHR Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 16x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C912ZVMC64L0MKH | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Number of I/O: 24 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C912ZVML12L0MKH | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Number of I/O: 24 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BAP51-02,315 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-79, SOD-523 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD-523 Current - Max: 50 mA Power Dissipation (Max): 715 mW |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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BAP51-02,315 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SC-79, SOD-523 Diode Type: PIN - Single Operating Temperature: -65°C ~ 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz Voltage - Peak Reverse (Max): 60V Supplier Device Package: SOD-523 Current - Max: 50 mA Power Dissipation (Max): 715 mW |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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TJA1042TK/3/2Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 4860 шт: термін постачання 21-31 дні (днів) |
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SAF4000EL/103Q23CY | NXP USA Inc. |
Description: SAF4000EL/103Q23CY Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/103Q23CK | NXP USA Inc. |
Description: SAF4000EL/103Q23CK Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/103Q235Y | NXP USA Inc. |
Description: SAF4000EL/103Q235Y Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/103Q235K | NXP USA Inc. |
Description: SAF4000EL/103Q235K Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC33FS8430G4KSR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMX8QP6AVUFFAB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1313-BFBGA Mounting Type: Surface Mount Speed: 1.6GHz, 1.26GHz, 266MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1313-BGA (29x29) Ethernet: 1Gbps (2) USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Number of Cores/Bus Width: 7 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Additional Interfaces: CANbus, I2C, SPI, UART |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PMN70XPE,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SC-74, SOT-457 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: P-Channel Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta) Rds On (Max) @ Id, Vgs: 85mOhm @ 2A, 4.5V Power Dissipation (Max): 500mW (Ta), 6.25W (Tc) Vgs(th) (Max) @ Id: 1.25V @ 250µA Supplier Device Package: 6-TSOP Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V Vgs (Max): ±12V Drain to Source Voltage (Vdss): 20 V Gate Charge (Qg) (Max) @ Vgs: 7.8 nC @ 4.5 V Input Capacitance (Ciss) (Max) @ Vds: 602 pF @ 10 V |
на замовлення 41368 шт: термін постачання 21-31 дні (днів) |
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MC33FS8430G4KS | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HCT138DB,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 4mA, 4mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SSOP |
на замовлення 51489 шт: термін постачання 21-31 дні (днів) |
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AFV121KHR5 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 960MHz ~ 1.22GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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AFV121KHR5 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: SOT-979A Mounting Type: Chassis Mount Frequency: 960MHz ~ 1.22GHz Configuration: Dual Power - Output: 1000W Gain: 19.6dB Technology: LDMOS Supplier Device Package: NI-1230-4H Voltage - Rated: 112 V Voltage - Test: 50 V Current - Test: 100 mA |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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PCF8576DT/2,518 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: I2C Configuration: 40 Segment Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 10 Characters, 20 Characters, 160 Elements Supplier Device Package: 56-TSSOP Grade: Automotive Current - Supply: 3.5 µA Qualification: AEC-Q100 |
на замовлення 1995 шт: термін постачання 21-31 дні (днів) |
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C912ZVMC12L0WKHR | NXP USA Inc. |
Description: 16-BIT MICROCONTROLLERS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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C912ZVMC12L0WKH | NXP USA Inc. |
Description: IC Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 9x12b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-HLQFP (10x10) Grade: Automotive Number of I/O: 24 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74HC157PW,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 4 x 2:1 Type: Multiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP |
на замовлення 2160 шт: термін постачання 21-31 дні (днів) |
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BZX84-A2V4,235 | NXP USA Inc. |
![]() Tolerance: ±1% Packaging: Bulk Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Operating Temperature: -65°C ~ 150°C Voltage - Zener (Nom) (Vz): 2.4 V Impedance (Max) (Zzt): 100 Ohms Supplier Device Package: SOT-23 Grade: Automotive Power - Max: 250 mW Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA Current - Reverse Leakage @ Vr: 50 µA @ 1 V Qualification: AEC-Q101 |
на замовлення 32500 шт: термін постачання 21-31 дні (днів) |
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S912ZVLA12F0MFM | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12 Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b, 6x12b; D/A 1x8b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
NXQ1TXL5DB1411UL | NXP USA Inc. |
Description: EVAL BOARD FOR NXQ1TXL5 Packaging: Bulk Function: Wireless Power Supply/Charging Type: Power Management Contents: Board(s) Utilized IC / Part: NXQ1TXL5 Primary Attributes: Transmitter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MCIMX6Q5EZK08AD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 569-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 569-MAPBGA (12x12) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
T1013NSN7PQA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74ABT543AD,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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74ABT543AD,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 24-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 24-SO |
на замовлення 1131 шт: термін постачання 21-31 дні (днів) |
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MPF5302AMMA0ESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 24-PowerWFQFN Output Type: Adjustable Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 1 Function: Step-Down Current - Output: 15A Operating Temperature: -40°C ~ 125°C (TA) Output Configuration: Positive Frequency - Switching: 2MHz ~ 3MHz Voltage - Input (Max): 5.5V Topology: Buck Supplier Device Package: 24-HWQFN (4.5x3.5) Synchronous Rectifier: No Voltage - Output (Max): 1.2V Voltage - Input (Min): 2.7V Voltage - Output (Min/Fixed): 0.5V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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TDF8546TH/N2ZJ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Features: Depop, Short-Circuit and Thermal Protection Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 36-HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TDF8546TH/N2ZJ | NXP USA Inc. |
![]() Features: Depop, Short-Circuit and Thermal Protection Packaging: Cut Tape (CT) Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad Output Type: 4-Channel (Quad) Mounting Type: Surface Mount Type: Class AB Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm Supplier Device Package: 36-HSOP |
на замовлення 498 шт: термін постачання 21-31 дні (днів) |
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PTVS22VP1UTP,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: SOD-128 Mounting Type: Surface Mount Type: Zener Operating Temperature: -55°C ~ 185°C (TA) Current - Peak Pulse (10/1000µs): 16.9A Voltage - Reverse Standoff (Typ): 22V Supplier Device Package: SOD-128/CFP5 Unidirectional Channels: 1 Voltage - Breakdown (Min): 24.4V Voltage - Clamping (Max) @ Ipp: 35.5V Power - Peak Pulse: 600W Power Line Protection: No Grade: Automotive Qualification: AEC-Q101 |
на замовлення 8279 шт: термін постачання 21-31 дні (днів) |
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MIMX9332XVVXMABR | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SJA1110BEL/1Y | NXP USA Inc. |
Description: SJA1110BEL/1Y Packaging: Tape & Reel (TR) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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SJA1110BEL/1Y | NXP USA Inc. |
Description: SJA1110BEL/1Y Packaging: Cut Tape (CT) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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RD-HVBMSCTBUN | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Monitor Type: Power Management Contents: Board(s) Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
RD-HVBMSCT800BUN | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Monitor Type: Power Management Contents: Board(s), Cable(s), Power Supply, Accessories Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S32M276SFFRD | NXP USA Inc. |
![]() Packaging: Bulk Function: Motor Controller/Driver Type: Power Management Contents: Board(s) Utilized IC / Part: S32M276 Primary Attributes: Motors (BLDC, PMSM) Secondary Attributes: CAN/UART Interface(s) Embedded: Yes, MCU, 8-Bit |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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BTS6403UJ | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-VFQFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.3GHz ~ 4.2GHz RF Type: 5G, TDD Voltage - Supply: 4.75V ~ 5.25V Gain: 42dB Current - Supply: 100mA Noise Figure: 4.1dB P1dB: 2.9dBm Test Frequency: 3.5GHz Supplier Device Package: 16-HVQFN (3x3) |
на замовлення 5950 шт: термін постачання 21-31 дні (днів) |
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GTL2006PW,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 28-TSSOP (0.173", 4.40mm Width) Output Type: Open Drain Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 28-TSSOP Channel Type: Unidirectional Output Signal: LVTTL Translator Type: Mixed Signal Channels per Circuit: 13 Input Signal: GTL Number of Circuits: 1 |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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SC16C550BIBS,128 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 3Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SC16C550BIBS,128 | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Number of Channels: 1, UART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 3Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKL14Z32VLK4 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 70 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S08SG4E2MSC | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MK60DN512ZVMC10 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 512KB (512K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 38x16b; D/A 2x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 86 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
MIMXRT1172AVM8B | NXP USA Inc. |
Description: IC Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MCIMX7U3DVK07SD | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 361-VFBGA Mounting Type: Surface Mount Speed: 720MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 361-VFBGA (10x10) USB: USB 2.0 (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: LPDDR2, LPDDR3 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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TJA1051TK/3/2Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 120 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 5160 шт: термін постачання 21-31 дні (днів) |
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BAS40/ZLVL | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA SOT23 Packaging: Tape & Reel (TR) Package / Case: TO-236-3, SC-59, SOT-23-3 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Technology: Schottky Capacitance @ Vr, F: 5pF @ 0V, 1MHz Current - Average Rectified (Io): 120mA Supplier Device Package: SOT-23 (TO-236AB) Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 40 V Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA Current - Reverse Leakage @ Vr: 10 µA @ 40 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P5020NSE7VNB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
IW416UK/A1IZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 76-UFBGA, WLCSP Sensitivity: -99dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.05V, 1.8V, 2.2V Power - Output: 21dBm Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA Current - Receiving: 5µA ~ 72mA Data Rate (Max): 150Mbps Current - Transmitting: 240µA ~ 325mA Supplier Device Package: 76-WLCSP (3.95x3.565) Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC34GD3000EP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Function: Controller - Commutation, Direction Management Interface: SPI Operating Temperature: -20°C ~ 105°C (TA) Output Configuration: Half Bridge (3) Voltage - Supply: 6V ~ 58V Applications: General Purpose Technology: Power MOSFET Voltage - Load: 6V ~ 58V Supplier Device Package: 56-QFN (8x8) Motor Type - AC, DC: Brushless DC (BLDC) |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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74LVC163PW,112 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 4322 шт: термін постачання 21-31 дні (днів) |
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74LVC594AD,112 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 6385 шт: термін постачання 21-31 дні (днів) |
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MCXC242VFM | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 32-QFN (5x5) Number of I/O: 24 |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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MSC8254SAG1000B | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Quad Core Operating Temperature: 0°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
на замовлення 77 шт: термін постачання 21-31 дні (днів) |
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MSC8254SAG1000B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Quad Core Operating Temperature: 0°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
BYQ30E-200,127 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 12872 шт: термін постачання 21-31 дні (днів) |
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TDA3664AT/N1,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Fixed Mounting Type: Surface Mount Current - Output: 100mA Operating Temperature: -40°C ~ 125°C Output Configuration: Positive Current - Quiescent (Iq): 30 µA Voltage - Input (Max): 45V Number of Regulators: 1 Supplier Device Package: 8-SO Voltage - Output (Min/Fixed): 5V PSRR: 60dB (120Hz) Voltage Dropout (Max): 0.3V @ 50mA Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage Current - Supply (Max): 2.5 mA |
на замовлення 9754 шт: термін постачання 21-31 дні (днів) |
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MC33FS6520NAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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S912ZVC96AMKHR |
Виробник: NXP USA Inc.
Description: S912ZVC96AMKHR
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S912ZVC96AMKHR
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
C912ZVMC64L0MKH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
C912ZVML12L0MKH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
BAP51-02,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
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8000+ | 7.03 грн |
BAP51-02,315 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
Description: RF DIODE PIN 60V 715MW SOD-523
Packaging: Cut Tape (CT)
Package / Case: SC-79, SOD-523
Diode Type: PIN - Single
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 5V, 1MHz
Voltage - Peak Reverse (Max): 60V
Supplier Device Package: SOD-523
Current - Max: 50 mA
Power Dissipation (Max): 715 mW
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
18+ | 18.05 грн |
26+ | 11.94 грн |
29+ | 10.58 грн |
100+ | 8.49 грн |
250+ | 7.81 грн |
500+ | 7.39 грн |
1000+ | 6.94 грн |
2500+ | 6.59 грн |
TJA1042TK/3/2Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 4860 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 80.07 грн |
10+ | 65.54 грн |
25+ | 62.50 грн |
100+ | 53.23 грн |
250+ | 48.97 грн |
500+ | 48.20 грн |
1000+ | 46.59 грн |
2500+ | 40.79 грн |
MC33FS8430G4KSR2 |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
MIMX8QP6AVUFFAB |
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Виробник: NXP USA Inc.
Description: MPU I.MX8 QUAD PLUS
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.26GHz, 266MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 7 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Description: MPU I.MX8 QUAD PLUS
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.26GHz, 266MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M0+, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 7 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
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1+ | 7929.79 грн |
PMN70XPE,115 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA PMN70XPE - SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2A, 4.5V
Power Dissipation (Max): 500mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 602 pF @ 10 V
Description: NOW NEXPERIA PMN70XPE - SC-74
Packaging: Bulk
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 3.2A (Ta)
Rds On (Max) @ Id, Vgs: 85mOhm @ 2A, 4.5V
Power Dissipation (Max): 500mW (Ta), 6.25W (Tc)
Vgs(th) (Max) @ Id: 1.25V @ 250µA
Supplier Device Package: 6-TSOP
Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 7.8 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 602 pF @ 10 V
на замовлення 41368 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4745+ | 4.49 грн |
MC33FS8430G4KS |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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74HCT138DB,112 |
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Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 3-8 LINE 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
Description: IC DECODER/DEMUX 3-8 LINE 16SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 4mA, 4mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP
на замовлення 51489 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1399+ | 15.20 грн |
AFV121KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
50+ | 49030.56 грн |
AFV121KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: SOT-979A
Mounting Type: Chassis Mount
Frequency: 960MHz ~ 1.22GHz
Configuration: Dual
Power - Output: 1000W
Gain: 19.6dB
Technology: LDMOS
Supplier Device Package: NI-1230-4H
Voltage - Rated: 112 V
Voltage - Test: 50 V
Current - Test: 100 mA
на замовлення 64 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 58778.70 грн |
10+ | 53336.08 грн |
PCF8576DT/2,518 |
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Виробник: NXP USA Inc.
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
Description: LCD DRIVER
Packaging: Cut Tape (CT)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: I2C
Configuration: 40 Segment
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 3.5 µA
Qualification: AEC-Q100
на замовлення 1995 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 164.84 грн |
10+ | 118.00 грн |
25+ | 107.73 грн |
100+ | 90.55 грн |
250+ | 85.51 грн |
500+ | 82.47 грн |
1000+ | 78.65 грн |
C912ZVMC12L0WKH |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
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74HC157PW,118 |
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Виробник: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Description: IC QUAD 2-IN MUX 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 4 x 2:1
Type: Multiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
на замовлення 2160 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2160+ | 9.73 грн |
BZX84-A2V4,235 |
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Виробник: NXP USA Inc.
Description: DIODE ZENER 2.4V 250MW SOT23
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q101
Description: DIODE ZENER 2.4V 250MW SOT23
Tolerance: ±1%
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 2.4 V
Impedance (Max) (Zzt): 100 Ohms
Supplier Device Package: SOT-23
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 µA @ 1 V
Qualification: AEC-Q101
на замовлення 32500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2681+ | 8.23 грн |
S912ZVLA12F0MFM |
Виробник: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Description: MAGNIV 16-BIT MCU, S12Z CORE, 12
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b, 6x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
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NXQ1TXL5DB1411UL |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR NXQ1TXL5
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NXQ1TXL5
Primary Attributes: Transmitter
Description: EVAL BOARD FOR NXQ1TXL5
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Contents: Board(s)
Utilized IC / Part: NXQ1TXL5
Primary Attributes: Transmitter
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MCIMX6Q5EZK08AD |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 800MHZ 569MAPBGA
Packaging: Tray
Package / Case: 569-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 569-MAPBGA (12x12)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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T1013NSN7PQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1.4GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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74ABT543AD,118 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Bulk
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
860+ | 26.19 грн |
74ABT543AD,112 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
Description: IC TXRX NON-INVERT 5.5V 24SO
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 24-SO
на замовлення 1131 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1131+ | 26.19 грн |
MPF5302AMMA0ESR2 |
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Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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TDF8546TH/N2ZJ |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Packaging: Tape & Reel (TR)
Features: Depop, Short-Circuit and Thermal Protection
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
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TDF8546TH/N2ZJ |
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Виробник: NXP USA Inc.
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
Description: IC AMP CLASS AB QUAD 25W 36HSOP
Features: Depop, Short-Circuit and Thermal Protection
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class AB
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 25W x 4 @ 4Ohm
Supplier Device Package: 36-HSOP
на замовлення 498 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2214.41 грн |
10+ | 1724.51 грн |
25+ | 1622.64 грн |
100+ | 1417.79 грн |
250+ | 1367.74 грн |
PTVS22VP1UTP,115 |
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Виробник: NXP USA Inc.
Description: TVS DIODE 22VWM 35.5VC SOD1285
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Current - Peak Pulse (10/1000µs): 16.9A
Voltage - Reverse Standoff (Typ): 22V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 24.4V
Voltage - Clamping (Max) @ Ipp: 35.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
Description: TVS DIODE 22VWM 35.5VC SOD1285
Packaging: Bulk
Package / Case: SOD-128
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -55°C ~ 185°C (TA)
Current - Peak Pulse (10/1000µs): 16.9A
Voltage - Reverse Standoff (Typ): 22V
Supplier Device Package: SOD-128/CFP5
Unidirectional Channels: 1
Voltage - Breakdown (Min): 24.4V
Voltage - Clamping (Max) @ Ipp: 35.5V
Power - Peak Pulse: 600W
Power Line Protection: No
Grade: Automotive
Qualification: AEC-Q101
на замовлення 8279 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2509+ | 8.98 грн |
MIMX9332XVVXMABR |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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SJA1110BEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110BEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110BEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1000+ | 988.26 грн |
SJA1110BEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110BEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110BEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1548.75 грн |
10+ | 1191.22 грн |
25+ | 1116.28 грн |
100+ | 970.36 грн |
250+ | 933.54 грн |
500+ | 911.36 грн |
RD-HVBMSCTBUN |
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Виробник: NXP USA Inc.
Description: RD-HVBMSCTBUN
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Embedded: No
Description: RD-HVBMSCTBUN
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s)
Embedded: No
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RD-HVBMSCT800BUN |
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Виробник: NXP USA Inc.
Description: 800 V BATTERY MANAGEMENT SYSTEM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: No
Description: 800 V BATTERY MANAGEMENT SYSTEM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s), Cable(s), Power Supply, Accessories
Embedded: No
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S32M276SFFRD |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR S32M276
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M276
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: CAN/UART Interface(s)
Embedded: Yes, MCU, 8-Bit
Description: EVAL BOARD FOR S32M276
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M276
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: CAN/UART Interface(s)
Embedded: Yes, MCU, 8-Bit
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3592.82 грн |
BTS6403UJ |
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Виробник: NXP USA Inc.
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
Description: 5G MASSIVE MIMO PRE-DRIVER
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: 5G, TDD
Voltage - Supply: 4.75V ~ 5.25V
Gain: 42dB
Current - Supply: 100mA
Noise Figure: 4.1dB
P1dB: 2.9dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
на замовлення 5950 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 237.85 грн |
10+ | 198.27 грн |
25+ | 187.37 грн |
100+ | 161.80 грн |
250+ | 153.37 грн |
500+ | 147.42 грн |
1000+ | 139.49 грн |
GTL2006PW,118 |
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Виробник: NXP USA Inc.
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 13
Input Signal: GTL
Number of Circuits: 1
Description: IC TRANSLATOR UNIDIR 28TSSOP
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 28-TSSOP
Channel Type: Unidirectional
Output Signal: LVTTL
Translator Type: Mixed Signal
Channels per Circuit: 13
Input Signal: GTL
Number of Circuits: 1
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
270+ | 83.07 грн |
SC16C550BIBS,128 |
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Виробник: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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SC16C550BIBS,128 |
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Виробник: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART SINGLE W/FIFO 32-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 1, UART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 3Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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MKL14Z32VLK4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 70
DigiKey Programmable: Not Verified
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S9S08SG4E2MSC |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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MK60DN512ZVMC10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 38x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 86
DigiKey Programmable: Not Verified
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MCIMX7U3DVK07SD |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX7ULP 720MHZ 361VFBGA
Packaging: Tray
Package / Case: 361-VFBGA
Mounting Type: Surface Mount
Speed: 720MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 361-VFBGA (10x10)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART
Description: IC MPU I.MX7ULP 720MHZ 361VFBGA
Packaging: Tray
Package / Case: 361-VFBGA
Mounting Type: Surface Mount
Speed: 720MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 361-VFBGA (10x10)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: LPDDR2, LPDDR3
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Security Features: Crypto/TRNG, eFuses/OTP, Secure Fuse, uHAB/HAB-Secure Boot
Additional Interfaces: FlexIO, GPIO, I2C, I2S, SPI, UART
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TJA1051TK/3/2Z |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 5160 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5+ | 69.08 грн |
10+ | 57.07 грн |
25+ | 53.37 грн |
100+ | 44.32 грн |
250+ | 41.56 грн |
500+ | 39.98 грн |
1000+ | 37.65 грн |
2500+ | 36.47 грн |
BAS40/ZLVL |
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 120mA
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
Description: DIODE SCHOTTKY 40V 120MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 120mA
Supplier Device Package: SOT-23 (TO-236AB)
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
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P5020NSE7VNB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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IW416UK/A1IZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
Description: IC RF TXRX 802.15.4 76WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 76-UFBGA, WLCSP
Sensitivity: -99dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 72mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 76-WLCSP (3.95x3.565)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, 64-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2C, I2S, PCM, SDIO, UART
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MC34GD3000EP |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: SPI
Operating Temperature: -20°C ~ 105°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 6V ~ 58V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 58V
Supplier Device Package: 56-QFN (8x8)
Motor Type - AC, DC: Brushless DC (BLDC)
Description: IC MOTOR DRIVER 6V-58V 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: SPI
Operating Temperature: -20°C ~ 105°C (TA)
Output Configuration: Half Bridge (3)
Voltage - Supply: 6V ~ 58V
Applications: General Purpose
Technology: Power MOSFET
Voltage - Load: 6V ~ 58V
Supplier Device Package: 56-QFN (8x8)
Motor Type - AC, DC: Brushless DC (BLDC)
на замовлення 260 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 371.29 грн |
10+ | 272.58 грн |
25+ | 251.23 грн |
100+ | 213.79 грн |
260+ | 202.91 грн |
74LVC163PW,112 |
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на замовлення 4322 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
833+ | 26.94 грн |
74LVC594AD,112 |
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на замовлення 6385 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1177+ | 18.71 грн |
MCXC242VFM |
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Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
Description: 48MHz, Cortex-M0+, USB
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 24
на замовлення 490 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 207.23 грн |
10+ | 159.49 грн |
25+ | 149.88 грн |
100+ | 124.40 грн |
490+ | 103.40 грн |
MSC8254SAG1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 4X 1GHZ SC3850 783FCBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Quad Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 4X 1GHZ SC3850 783FCBGA
Packaging: Bulk
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Quad Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
на замовлення 77 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 12673.37 грн |
MSC8254SAG1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 4X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Quad Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 4X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Quad Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
товару немає в наявності
В кошику
од. на суму грн.
BYQ30E-200,127 |
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на замовлення 12872 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
702+ | 32.18 грн |
TDA3664AT/N1,118 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 5V 100MA 8-SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-SO
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
Description: IC REG LINEAR 5V 100MA 8-SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 100mA
Operating Temperature: -40°C ~ 125°C
Output Configuration: Positive
Current - Quiescent (Iq): 30 µA
Voltage - Input (Max): 45V
Number of Regulators: 1
Supplier Device Package: 8-SO
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (120Hz)
Voltage Dropout (Max): 0.3V @ 50mA
Protection Features: Over Temperature, Reverse Polarity, Short Circuit, Transient Voltage
Current - Supply (Max): 2.5 mA
на замовлення 9754 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
398+ | 56.88 грн |
MC33FS6520NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 475.69 грн |
10+ | 355.05 грн |
25+ | 329.21 грн |
80+ | 289.66 грн |