Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36388) > Сторінка 587 з 607
| Фото | Назва | Виробник | Інформація |
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BB182LX,315 | NXP USA Inc. |
Description: DIODE VARACTOR 32V SINGLE SOD2Capacitance Ratio: 22.0 Voltage - Peak Reverse (Max): 32 V Supplier Device Package: SOD2 Capacitance Ratio Condition: C1/C28 Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single Mounting Type: Surface Mount Package / Case: SOD-882 Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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LPC5506JHI48Y | NXP USA Inc. |
Description: ICNumber of I/O: 30 Supplier Device Package: 48-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 7x16b SAR Core Processor: ARM® Cortex®-M33F Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 256KB (256K x 8) Speed: 96MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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LPC5506JHI48K | NXP USA Inc. |
Description: ICConnectivity: CANBus, Flexcomm, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 7x16b SAR Core Processor: ARM® Cortex®-M33F Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 256KB (256K x 8) Speed: 96MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray Number of I/O: 30 Supplier Device Package: 48-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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LPC5506JHI48E | NXP USA Inc. |
Description: ICNumber of I/O: 30 Supplier Device Package: 48-HVQFN (7x7) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 7x16b SAR Core Processor: ARM® Cortex®-M33F Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 256KB (256K x 8) Speed: 96MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| FRDMFS4503CAEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS4500Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s), Cable(s), Accessories Utilized IC / Part: FS4500 Embedded: Yes, MCU, 32-Bit |
товару немає в наявності |
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MC56F8023VLC | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 32LQFPNumber of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 16-Bit Data Converters: A/D 6x12b; D/A 2x12b Core Processor: 56800E Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 2K x 16 Program Memory Size: 32KB (16K x 16) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 1258 шт: термін постачання 21-31 дні (днів) |
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74ABT245D,623 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-SOSupplier Device Package: 20-SO Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 8 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74ABT245D,602 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-SOMounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube Supplier Device Package: 20-SO Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 8 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74ABT245PW,112 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 5.5V 20-TSSOPSupplier Device Package: 20-TSSOP Current - Output High, Low: 32mA, 64mA Number of Bits per Element: 8 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74AHCT00PW,118 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-TSSOPPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74AHCT00D,112 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-SOPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74AHCT00BQ,115 | NXP USA Inc. |
Description: IC GATE NAND 4CH 2-INP 14-DHVQFNPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PMEG6010CEH,115 | NXP USA Inc. |
Description: SCHOTTKY RECT 60V 1A SOD123FPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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A30LDJUK/2003J7Z | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 16-WLCSPPackaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 16-WLCSP (1.84x1.87) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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A30LDJUK/2003J7Z | NXP USA Inc. |
Description: IC SECURE AUTHENTICATOR 16-WLCSPPackaging: Cut Tape (CT) Package / Case: 16-UFBGA, WLCSP Mounting Type: Surface Mount Type: Secure Authenticator Supplier Device Package: 16-WLCSP (1.84x1.87) |
на замовлення 9250 шт: термін постачання 21-31 дні (днів) |
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| BZV85-C10,113 | NXP USA Inc. |
Description: DIODE ZENER 10V 1.3W DO41Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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BZX884-C24,315 | NXP USA Inc. |
Description: DIODE ZENER 24V 250MW SOD882Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| BYV29-600,127 | NXP USA Inc. |
Description: DIODE 600 TO-220AC SOD59Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| BYV29X-500,127 | NXP USA Inc. |
Description: DIODE UFAST 500V 9A TO220FPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| BYQ28X-200,127 | NXP USA Inc. |
Description: DIODE ARRAY 200V 10A TO220-3Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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PBLS2002S,115 | NXP USA Inc. |
Description: TRANS PREBIAS 1NPN 1PNP 8-SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 1.5W Current - Collector (Ic) (Max): 100mA, 3A Voltage - Collector Emitter Breakdown (Max): 50V, 20V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V Frequency - Transition: 100MHz Resistor - Base (R1): 4.7kOhms Resistor - Emitter Base (R2): 4.7kOhms Supplier Device Package: 8-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| 74HC4067DB,118 | NXP USA Inc. |
Description: IC MUX/DEMUX 1X16 24SSOPPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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74HC4067D,652 | NXP USA Inc. |
Description: IC MUX/DEMUX 1X16 24SOICPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74HC4067D,653 | NXP USA Inc. |
Description: IC MUX/DEMUX 1X16 24SOICPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74HC4067DB,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 1X16 24SSOPPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74HC4067PW,118 | NXP USA Inc. |
Description: IC MUX/DEMUX 1X16 24TSSOPPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74HC4067PW,112 | NXP USA Inc. |
Description: IC MUX/DEMUX 1X16 24TSSOPPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| Z0103MA,116 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A TO92-3Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| Z0103NA,412 | NXP USA Inc. |
Description: TRIAC SENS GATE 800V 1A TO92-3Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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Z0103NN,135 | NXP USA Inc. |
Description: TRIAC 800V 1A SOT-223Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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HEF4051BT,653 | NXP USA Inc. |
Description: IC MUX/DEMUX 8X1 16SOICPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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HEF4051BT,652 | NXP USA Inc. |
Description: IC MUX/DEMUX 8X1 16SOICPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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N74F244N,602 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 5.5V 20-DIPPackaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: 0°C ~ 70°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 4 Current - Output High, Low: 15mA, 64mA Supplier Device Package: 20-DIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MKL15Z32VLK4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 80FQFPSupplier Device Package: 80-FQFP (12x12) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, TSI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x16b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Bulk DigiKey Programmable: Not Verified Number of I/O: 70 |
на замовлення 180 шт: термін постачання 21-31 дні (днів) |
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MC33596FCAER2 | NXP USA Inc. |
Description: RF RX FSK/OOK 304/315/426 32QFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Sensitivity: -104dBm Mounting Type: Surface Mount Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz Modulation or Protocol: FSK, OOK Data Interface: PCB, Surface Mount Operating Temperature: -20°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V Applications: General Data Transfer Current - Receiving: 10.3mA Data Rate (Max): 22.4kBaud Antenna Connector: PCB, Surface Mount Supplier Device Package: 32-QFN-EP (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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MSC8152SAG1000B | NXP USA Inc. |
Description: IC DSP 2X 1GHZ SC3850 783FCBGASupplier Device Package: 783-FCPBGA (29x29) Clock Rate: 1GHz Voltage - Core: 1.00V Voltage - I/O: 2.50V On-Chip RAM: 576kB Non-Volatile Memory: ROM (96KB) Operating Temperature: 0°C ~ 105°C (TJ) Type: SC3850 Dual Core Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PBSS5140U,115 | NXP USA Inc. |
Description: TRANS PNP 40V 1A SOT323Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| PMEG4010EH,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A SOD123FPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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PMEG4010CEJ,115 | NXP USA Inc. |
Description: SCHOTTKY RECT 40V 1A SOD323FPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| PMEG4010EJ,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A SOD323FPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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PMEG4010CEH,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A SOD123FPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| PMEG4010ET,215 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A TO236ABPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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PMEG4010ER,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A SOD123WPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PMEG4010CPA,115 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 1A 3HUSONPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PEMI4QFN/HP,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHMS ESD SMDNumber of Channels: 4 ESD Protection: Yes Resistance - Channel (Ohms): 45 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 17dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 45Ohms, C = 18.5pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Package / Case: 8-XFDFN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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2N7002BKM,315 | NXP USA Inc. |
Description: MOSFET N-CH 60V 450MA SOT883Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| MRF150 | NXP USA Inc. |
Description: MOSFET N-CHAN 150W 221-11/2Current - Test: 250 mA Voltage - Test: 50 V Voltage - Rated: 125 V Supplier Device Package: 211-11, Style 2 Technology: MOSFET (Metal Oxide) Gain: 17dB Power - Output: 150W Configuration: N-Channel Frequency: 30MHz Current Rating (Amps): 16A Package / Case: 211-11, Style 2 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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74HC30N,652 | NXP USA Inc. |
Description: IC GATE NAND 1CH 8-INP 14DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 8 Supplier Device Package: 14-DIP Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF Number of Circuits: 1 Current - Quiescent (Max): 2 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PBSS5350X,115 | NXP USA Inc. |
Description: TRANS PNP 50V 3A SOT89Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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PBSS5350SS,115 | NXP USA Inc. |
Description: TRANS 2PNP 50V 2.7A 8SOPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| BLC6G10LS-160 | NXP USA Inc. |
Description: TRANS LDMOS W-CDMA SOT896 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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74HCT245D,652 | NXP USA Inc. |
Description: IC TXRX 4.5V/5.5V 20-SOPackaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Transceiver, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 8 Current - Output High, Low: 6mA, 6mA Supplier Device Package: 20-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74HCT27DB,112 | NXP USA Inc. |
Description: IC GATE NOR 3CH 3-INP 14-SSOPLogic Type: NOR Gate Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Packaging: Tube Current - Quiescent (Max): 2 µA Number of Circuits: 3 Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF Input Logic Level - Low: 0.8V Input Logic Level - High: 2V Supplier Device Package: 14-SSOP Number of Inputs: 3 Current - Output High, Low: 4mA, 4mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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74HC04D,652 | NXP USA Inc. |
Description: IC INVERTER HEX 6CH 1-INP 14SOICPackaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Current - Output High, Low: 5.2mA, 5.2mA Number of Inputs: 1 Supplier Device Package: 14-SO Input Logic Level - High: 1.5V ~ 4.2V Input Logic Level - Low: 0.5V ~ 1.8V Max Propagation Delay @ V, Max CL: 14ns @ 6V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
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HEF4001BT,652 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14-SOPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| BTA316-600C,127 | NXP USA Inc. |
Description: TRIAC 600V 16A TO-220ABPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
| BTA316-600D,127 | NXP USA Inc. |
Description: TRIAC 600V 16A TO220ABPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||||
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BTA316-600BT,127 | NXP USA Inc. |
Description: TRIAC 600V 16A TO-220ABPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||||
| BT134W-600D,115 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 1A SC73Packaging: Tape & Reel (TR) |
товару немає в наявності |
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| BCW61C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 32V 100MA SOT23Packaging: Tape & Reel (TR) |
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| BB182LX,315 |
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Виробник: NXP USA Inc.
Description: DIODE VARACTOR 32V SINGLE SOD2
Capacitance Ratio: 22.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Cut Tape (CT)
Description: DIODE VARACTOR 32V SINGLE SOD2
Capacitance Ratio: 22.0
Voltage - Peak Reverse (Max): 32 V
Supplier Device Package: SOD2
Capacitance Ratio Condition: C1/C28
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Cut Tape (CT)
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| LPC5506JHI48Y |
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Виробник: NXP USA Inc.
Description: IC
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| LPC5506JHI48K |
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Виробник: NXP USA Inc.
Description: IC
Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Description: IC
Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
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| LPC5506JHI48E |
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Виробник: NXP USA Inc.
Description: IC
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC
Number of I/O: 30
Supplier Device Package: 48-HVQFN (7x7)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Connectivity: CANBus, Flexcomm, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 7x16b SAR
Core Processor: ARM® Cortex®-M33F
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 96MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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| FRDMFS4503CAEVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS4500
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS4500
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS4500
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: FS4500
Embedded: Yes, MCU, 32-Bit
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| MC56F8023VLC |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 16-Bit
Data Converters: A/D 6x12b; D/A 2x12b
Core Processor: 56800E
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 2K x 16
Program Memory Size: 32KB (16K x 16)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 1258 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 35+ | 593.80 грн |
| 74ABT245D,623 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-SO
Supplier Device Package: 20-SO
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC TXRX NON-INVERT 5.5V 20-SO
Supplier Device Package: 20-SO
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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| 74ABT245D,602 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-SO
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Description: IC TXRX NON-INVERT 5.5V 20-SO
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
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| 74ABT245PW,112 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 5.5V 20-TSSOP
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC TXRX NON-INVERT 5.5V 20-TSSOP
Supplier Device Package: 20-TSSOP
Current - Output High, Low: 32mA, 64mA
Number of Bits per Element: 8
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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| A30LDJUK/2003J7Z |
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Виробник: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 16-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 16-WLCSP (1.84x1.87)
Description: IC SECURE AUTHENTICATOR 16-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 16-WLCSP (1.84x1.87)
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| A30LDJUK/2003J7Z |
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Виробник: NXP USA Inc.
Description: IC SECURE AUTHENTICATOR 16-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 16-WLCSP (1.84x1.87)
Description: IC SECURE AUTHENTICATOR 16-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Type: Secure Authenticator
Supplier Device Package: 16-WLCSP (1.84x1.87)
на замовлення 9250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 143.20 грн |
| 10+ | 101.63 грн |
| 25+ | 92.61 грн |
| 100+ | 77.64 грн |
| 250+ | 73.22 грн |
| 500+ | 70.55 грн |
| 1000+ | 67.24 грн |
| 2500+ | 64.96 грн |
| 5000+ | 63.59 грн |
| PBLS2002S,115 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 4.7kOhms
Supplier Device Package: 8-SO
Description: TRANS PREBIAS 1NPN 1PNP 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 1.5W
Current - Collector (Ic) (Max): 100mA, 3A
Voltage - Collector Emitter Breakdown (Max): 50V, 20V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 355mV @ 300mA, 3A
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 10mA, 5V / 150 @ 2A, 2V
Frequency - Transition: 100MHz
Resistor - Base (R1): 4.7kOhms
Resistor - Emitter Base (R2): 4.7kOhms
Supplier Device Package: 8-SO
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| N74F244N,602 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
Description: IC BUFFER NON-INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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| MKL15Z32VLK4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 70
Description: IC MCU 32BIT 32KB FLASH 80FQFP
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, TSI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Bulk
DigiKey Programmable: Not Verified
Number of I/O: 70
на замовлення 180 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 52+ | 398.38 грн |
| MC33596FCAER2 |
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Виробник: NXP USA Inc.
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
Description: RF RX FSK/OOK 304/315/426 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -104dBm
Mounting Type: Surface Mount
Frequency: 304MHz, 315MHz, 426MHz, 434MHz, 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V, 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 10.3mA
Data Rate (Max): 22.4kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN-EP (5x5)
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| MSC8152SAG1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 2X 1GHZ SC3850 783FCBGA
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 2.50V
On-Chip RAM: 576kB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: 0°C ~ 105°C (TJ)
Type: SC3850 Dual Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Description: IC DSP 2X 1GHZ SC3850 783FCBGA
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 2.50V
On-Chip RAM: 576kB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: 0°C ~ 105°C (TJ)
Type: SC3850 Dual Core
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
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| PEMI4QFN/HP,132 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Tape & Reel (TR)
Description: FILTER RC(PI) 45 OHMS ESD SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 45
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 17dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 45Ohms, C = 18.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Tape & Reel (TR)
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| MRF150 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CHAN 150W 221-11/2
Current - Test: 250 mA
Voltage - Test: 50 V
Voltage - Rated: 125 V
Supplier Device Package: 211-11, Style 2
Technology: MOSFET (Metal Oxide)
Gain: 17dB
Power - Output: 150W
Configuration: N-Channel
Frequency: 30MHz
Current Rating (Amps): 16A
Package / Case: 211-11, Style 2
Packaging: Bulk
Description: MOSFET N-CHAN 150W 221-11/2
Current - Test: 250 mA
Voltage - Test: 50 V
Voltage - Rated: 125 V
Supplier Device Package: 211-11, Style 2
Technology: MOSFET (Metal Oxide)
Gain: 17dB
Power - Output: 150W
Configuration: N-Channel
Frequency: 30MHz
Current Rating (Amps): 16A
Package / Case: 211-11, Style 2
Packaging: Bulk
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| 74HC30N,652 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 1CH 8-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 8
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 1CH 8-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 8
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 22ns @ 6V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
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| 74HCT245D,652 |
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Виробник: NXP USA Inc.
Description: IC TXRX 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
Description: IC TXRX 4.5V/5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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| 74HCT27DB,112 |
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Виробник: NXP USA Inc.
Description: IC GATE NOR 3CH 3-INP 14-SSOP
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Current - Quiescent (Max): 2 µA
Number of Circuits: 3
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Description: IC GATE NOR 3CH 3-INP 14-SSOP
Logic Type: NOR Gate
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Current - Quiescent (Max): 2 µA
Number of Circuits: 3
Max Propagation Delay @ V, Max CL: 21ns @ 4.5V, 50pF
Input Logic Level - Low: 0.8V
Input Logic Level - High: 2V
Supplier Device Package: 14-SSOP
Number of Inputs: 3
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
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| 74HC04D,652 |
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Виробник: NXP USA Inc.
Description: IC INVERTER HEX 6CH 1-INP 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 14ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC INVERTER HEX 6CH 1-INP 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 14ns @ 6V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
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