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MWCT1213AVLH MWCT1213AVLH NXP USA Inc. WCT1213DS.pdf Description: 15W, MULTI-COIL AUTO, MULTI-DEVI
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Controller, Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32Z280AACK0VJFR NXP USA Inc. Description: STANDARD 594MAP S32Z280 W/OUT DF
Packaging: Tape & Reel (TR)
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S32Z280AACK0VJFT NXP USA Inc. Description: STANDARD 594MAP S32Z280 W/OUT DF
Packaging: Tray
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74HC125D,653 74HC125D,653 NXP USA Inc. 74HC_HCT125.pdf Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
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74AHC125D,112 74AHC125D,112 NXP USA Inc. 74AHC_AHCT125.pdf Description: IC BUFF DVR TRI-ST QD 14SOIC
Packaging: Tube
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74HC125D,652 74HC125D,652 NXP USA Inc. 74HC_HCT125.pdf Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
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74HC125DB,118 74HC125DB,118 NXP USA Inc. 74HC_HCT125.pdf Description: IC BUFFER NON-INVERT 6V 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SSOP
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74HC4094D,652 74HC4094D,652 NXP USA Inc. 74HC_HCT4094.pdf Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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74HC4094PW,118 74HC4094PW,118 NXP USA Inc. 74HC_HCT4094.pdf Description: IC SR TRI-STATE 8BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
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BT137-600,127 NXP USA Inc. bt137-600.pdf Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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BT137-600G,127 NXP USA Inc. bt137-600g.pdf Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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BT137-600E,127 NXP USA Inc. bt137-600e.pdf Description: TRIAC SENS GATE 600V 8A TO220AB
Packaging: Tube
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BT137-600D,127 NXP USA Inc. bt137-600d.pdf Description: TRIAC SENS GATE 600V 8A TO220AB
Packaging: Tube
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MCXA152VLF MCXA152VLF NXP USA Inc. MCXAP100M96FS6.pdf Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 52
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MC33PF8201A0TSR2 NXP USA Inc. PF8101_PF8201.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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MC33PF8201A0TS NXP USA Inc. PF8101_PF8201.pdf Description: MC33PF8201A0TS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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PDTC143ZT,215 PDTC143ZT,215 NXP USA Inc. PDTA143Z_Series_Rev2009.pdf Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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PDTC143ZT,235 PDTC143ZT,235 NXP USA Inc. PDTA143Z_Series_Rev2009.pdf Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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PCA9564D,112 PCA9564D,112 NXP USA Inc. PCA9564.pdf Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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PCA9564D,118 PCA9564D,118 NXP USA Inc. PCA9564.pdf Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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74ABT640N,602 74ABT640N,602 NXP USA Inc. 74ABT640D.pdf Description: IC TXRX INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-DIP
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N74F240N,602 N74F240N,602 NXP USA Inc. 74F240.pdf Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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74HC241D,652 74HC241D,652 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241D,653 74HC241D,653 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241DB,112 74HC241DB,112 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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74HCT241PW,118 74HCT241PW,118 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFF NON-INVERT 5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
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74HCT241D,652 74HCT241D,652 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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74HCT241DB,112 74HCT241DB,112 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
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BTA412Y-600C,127 NXP USA Inc. bta412y-600c.pdf Description: TRIAC 600V 12A TO220AB-3
Packaging: Tube
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PCA9501D,118 PCA9501D,118 NXP USA Inc. PCA9501.pdf Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PEMI6QFN/HT,132 PEMI6QFN/HT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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CLRD710,599 CLRD710,599 NXP USA Inc. MFEV710_SDS.pdf Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
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MPC555LFAZP40 MPC555LFAZP40 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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SPC5747CFK0ACKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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BCP53,115 NXP USA Inc. BCP53_SER.pdf Description: TRANSISTOR PNP 80V 1A SOT-223
Packaging: Tape & Reel (TR)
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MAC97A8,412 NXP USA Inc. mac97a8.pdf description Description: TRIAC SENS GATE 600V 0.6A TO92-3
Packaging: Bulk
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SAF4000EL/101Q53BK NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tray
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MC68HC16Z1MAG16 MC68HC16Z1MAG16 NXP USA Inc. MC68HC16ZUM.pdf Description: IC MCU 16BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 16
DigiKey Programmable: Not Verified
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BT152-600R,127 NXP USA Inc. bt152-600r.pdf Description: THYRISTOR 20A 650V TO220AB
Packaging: Tube
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Z0107NA,412 NXP USA Inc. z0107na.pdf Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
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MC25XS6300BEKR2 MC25XS6300BEKR2 NXP USA Inc. MC12XS6D2.pdf Description: IC SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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N74F02N,602 N74F02N,602 NXP USA Inc. DS_568_74F02.pdf Description: IC GATE NOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Number of Circuits: 4
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BC846BS,115 NXP USA Inc. Description: TRANS 2NPN 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BC857BS,115 NXP USA Inc. Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BCM856BS,115 NXP USA Inc. Description: TRANS 2PNP 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BCM857BS,115 NXP USA Inc. BCM857BS.pdf Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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MFS8612BMDA0ESR2 MFS8612BMDA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC68331CEH16 MC68331CEH16 NXP USA Inc. MC68331UM.pdf Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 18
DigiKey Programmable: Not Verified
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74HC377D,652 74HC377D,652 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,118 74HC377PW,118 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377D,653 74HC377D,653 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,112 74HC377PW,112 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74AHC377PW,118 74AHC377PW,118 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC OCT D FF POS-EDG TRIG 20TSSOP
Packaging: Tape & Reel (TR)
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74AHC377D,118 74AHC377D,118 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tape & Reel (TR)
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74AHC377PW,112 74AHC377PW,112 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC OCTAL D F-F POS-EDG 20-TSSOP
Packaging: Tube
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74AHC377D,112 74AHC377D,112 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tube
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74HC377DB,118 74HC377DB,118 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377DB,112 74HC377DB,112 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC4066BQ,115 74LVC4066BQ,115 NXP USA Inc. 74LVC4066.pdf Description: IC SWITCH QUAD SPST 14DHVQFN
Packaging: Tape & Reel (TR)
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74LVC4066D,118 74LVC4066D,118 NXP USA Inc. 74LVC4066.pdf Description: IC SWITCH QUAD SPST 14SOIC
Packaging: Tape & Reel (TR)
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MWCT1213AVLH WCT1213DS.pdf
MWCT1213AVLH
Виробник: NXP USA Inc.
Description: 15W, MULTI-COIL AUTO, MULTI-DEVI
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Applications: Controller, Wireless Power Transmitter
Current - Supply: 300µA
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32Z280AACK0VJFR
Виробник: NXP USA Inc.
Description: STANDARD 594MAP S32Z280 W/OUT DF
Packaging: Tape & Reel (TR)
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S32Z280AACK0VJFT
Виробник: NXP USA Inc.
Description: STANDARD 594MAP S32Z280 W/OUT DF
Packaging: Tray
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74HC125D,653 74HC_HCT125.pdf
74HC125D,653
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
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74AHC125D,112 74AHC_AHCT125.pdf
74AHC125D,112
Виробник: NXP USA Inc.
Description: IC BUFF DVR TRI-ST QD 14SOIC
Packaging: Tube
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74HC125D,652 74HC_HCT125.pdf
74HC125D,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SO
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74HC125DB,118 74HC_HCT125.pdf
74HC125DB,118
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 14-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-SSOP
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74HC4094D,652 74HC_HCT4094.pdf
74HC4094D,652
Виробник: NXP USA Inc.
Description: IC SHFT REG TRI-STATE 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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74HC4094PW,118 74HC_HCT4094.pdf
74HC4094PW,118
Виробник: NXP USA Inc.
Description: IC SR TRI-STATE 8BIT 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-TSSOP
Number of Bits per Element: 8
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BT137-600,127 bt137-600.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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BT137-600G,127 bt137-600g.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 8A TO220AB
Packaging: Tube
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BT137-600E,127 bt137-600e.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 8A TO220AB
Packaging: Tube
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BT137-600D,127 bt137-600d.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 8A TO220AB
Packaging: Tube
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MCXA152VLF MCXAP100M96FS6.pdf
MCXA152VLF
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 52
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MC33PF8201A0TSR2 PF8101_PF8201.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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MC33PF8201A0TS PF8101_PF8201.pdf
Виробник: NXP USA Inc.
Description: MC33PF8201A0TS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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PDTC143ZT,215 PDTA143Z_Series_Rev2009.pdf
PDTC143ZT,215
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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PDTC143ZT,235 PDTA143Z_Series_Rev2009.pdf
PDTC143ZT,235
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 250MW TO236AB
Packaging: Tape & Reel (TR)
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PCA9564D,112 PCA9564.pdf
PCA9564D,112
Виробник: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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PCA9564D,118 PCA9564.pdf
PCA9564D,118
Виробник: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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74ABT640N,602 74ABT640D.pdf
74ABT640N,602
Виробник: NXP USA Inc.
Description: IC TXRX INVERT 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 1
Logic Type: Transceiver, Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 20-DIP
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N74F240N,602 74F240.pdf
N74F240N,602
Виробник: NXP USA Inc.
Description: IC BUFFER INVERTING 5.5V 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 2
Logic Type: Buffer, Inverting
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 15mA, 64mA
Supplier Device Package: 20-DIP
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74HC241D,652 74HC_HCT241.pdf
74HC241D,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241D,653 74HC_HCT241.pdf
74HC241D,653
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241DB,112 74HC_HCT241.pdf
74HC241DB,112
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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74HCT241PW,118 74HC_HCT241.pdf
74HCT241PW,118
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
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74HCT241D,652 74HC_HCT241.pdf
74HCT241D,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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74HCT241DB,112 74HC_HCT241.pdf
74HCT241DB,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
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BTA412Y-600C,127 bta412y-600c.pdf
Виробник: NXP USA Inc.
Description: TRIAC 600V 12A TO220AB-3
Packaging: Tube
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PCA9501D,118 PCA9501.pdf
PCA9501D,118
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Features: EEPROM, POR
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PEMI6QFN/HT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/HT,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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CLRD710,599 MFEV710_SDS.pdf
CLRD710,599
Виробник: NXP USA Inc.
Description: CARD READER MIFARE
Packaging: Box
Frequency: 13.56MHz
Interface: Ethernet, RS 232, RS 422, RS 485, USB
Type: Read/Write
Standards: ISO 14443
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MPC555LFAZP40 MPC555PB.pdf
MPC555LFAZP40
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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SPC5747CFK0ACKU6 MPC5748G.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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BCP53,115 BCP53_SER.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR PNP 80V 1A SOT-223
Packaging: Tape & Reel (TR)
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MAC97A8,412 description mac97a8.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 0.6A TO92-3
Packaging: Bulk
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SAF4000EL/101Q53BK
Виробник: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tray
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MC68HC16Z1MAG16 MC68HC16ZUM.pdf
MC68HC16Z1MAG16
Виробник: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 16
DigiKey Programmable: Not Verified
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BT152-600R,127 bt152-600r.pdf
Виробник: NXP USA Inc.
Description: THYRISTOR 20A 650V TO220AB
Packaging: Tube
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Z0107NA,412 z0107na.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
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MC25XS6300BEKR2 MC12XS6D2.pdf
MC25XS6300BEKR2
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Features: Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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N74F02N,602 DS_568_74F02.pdf
N74F02N,602
Виробник: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Number of Circuits: 4
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BC846BS,115
Виробник: NXP USA Inc.
Description: TRANS 2NPN 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BC857BS,115
Виробник: NXP USA Inc.
Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BCM856BS,115
Виробник: NXP USA Inc.
Description: TRANS 2PNP 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BCM857BS,115 BCM857BS.pdf
Виробник: NXP USA Inc.
Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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MFS8612BMDA0ESR2 FS8600_SDS.pdf
MFS8612BMDA0ESR2
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC68331CEH16 MC68331UM.pdf
MC68331CEH16
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 18
DigiKey Programmable: Not Verified
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74HC377D,652 74HC_HCT377.pdf
74HC377D,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,118 74HC_HCT377.pdf
74HC377PW,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377D,653 74HC_HCT377.pdf
74HC377D,653
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,112 74HC_HCT377.pdf
74HC377PW,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74AHC377PW,118 74AHC_AHCT377.pdf
74AHC377PW,118
Виробник: NXP USA Inc.
Description: IC OCT D FF POS-EDG TRIG 20TSSOP
Packaging: Tape & Reel (TR)
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74AHC377D,118 74AHC_AHCT377.pdf
74AHC377D,118
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tape & Reel (TR)
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74AHC377PW,112 74AHC_AHCT377.pdf
74AHC377PW,112
Виробник: NXP USA Inc.
Description: IC OCTAL D F-F POS-EDG 20-TSSOP
Packaging: Tube
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74AHC377D,112 74AHC_AHCT377.pdf
74AHC377D,112
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tube
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74HC377DB,118 74HC_HCT377.pdf
74HC377DB,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377DB,112 74HC_HCT377.pdf
74HC377DB,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC4066BQ,115 74LVC4066.pdf
74LVC4066BQ,115
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD SPST 14DHVQFN
Packaging: Tape & Reel (TR)
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74LVC4066D,118 74LVC4066.pdf
74LVC4066D,118
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD SPST 14SOIC
Packaging: Tape & Reel (TR)
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