Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36249) > Сторінка 589 з 605
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
|---|---|---|---|---|---|
| BT152X-600R,127 | NXP USA Inc. |
 Description: THYRISTOR 650V 20A SOT186APackaging: Bulk |
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| BT152-500RT,127 | NXP USA Inc. |
Description: THYRISTOR 12A 500V TO220AB Packaging: Tube |
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| BT152B-600R,118 | NXP USA Inc. |
Description: THYRISTOR 650V 20A D2PAK Packaging: Tape & Reel (TR) |
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74LVC1G3157GW,125 | NXP USA Inc. |
Description: IC MUX/DEMUX 2X1 6TSSOP Packaging: Tape & Reel (TR) |
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74LVC1G3157GF,132 | NXP USA Inc. |
Description: IC MUX/DEMUX 2X1 6XSON Packaging: Tape & Reel (TR) |
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74LVC1G3157GN,132 | NXP USA Inc. |
Description: IC MUX/DEMUX 2X1 6XSON Packaging: Tape & Reel (TR) |
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BAS101S,215 | NXP USA Inc. |
Description: DIODE SW HI-VOLT DUAL SOT-23 Packaging: Tape & Reel (TR) |
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74HC164D,652 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 14-SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Serial to Parallel Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 14-SO Number of Bits per Element: 8 |
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74HCT10D,653 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14-SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
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74HCT10D,652 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14-SO Packaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-SO Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
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74HCT10DB,112 | NXP USA Inc. |
Description: IC GATE NAND 3CH 3-INP 14-SSOP Packaging: Tube Package / Case: 14-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Logic Type: NAND Gate Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 4mA, 4mA Number of Inputs: 3 Supplier Device Package: 14-SSOP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF Number of Circuits: 3 Current - Quiescent (Max): 2 µA |
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MC68HC711D3CFN2 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 26 DigiKey Programmable: Not Verified |
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74HC4052N,652 | NXP USA Inc. |
Description: IC SWITCH SP4T X 2 150OHM 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 150Ohm -3db Bandwidth: 180MHz Supplier Device Package: 16-DIP Voltage - Supply, Single (V+): 2V ~ 10V Voltage - Supply, Dual (V±): ±1.5V ~ 5V Crosstalk: -60dB @ 1MHz Switch Circuit: SP4T Multiplexer/Demultiplexer Circuit: 4:1 Channel-to-Channel Matching (ΔRon): 6Ohm Switch Time (Ton, Toff) (Max): 58ns, 48ns Channel Capacitance (CS(off), CD(off)): 3.5pF Current - Leakage (IS(off)) (Max): 2µA Number of Circuits: 2 |
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| MIMXRT1182XVP2B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
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TJA1051ATK/3/0Z | NXP USA Inc. |
Description: IC TRANSCEIVER 1/1 8HVSON Packaging: Tape & Reel (TR) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 120 mV Grade: Automotive Qualification: AEC-Q100 |
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BZX84-C47,215 | NXP USA Inc. |
Description: DIODE ZENER 47V 250MW TO236AB Packaging: Tape & Reel (TR) |
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74HC40103D,653 | NXP USA Inc. |
Description: IC 8BIT SYNC BINARY DOWN 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 32 MHz Number of Bits per Element: 8 |
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74HC40103D,652 | NXP USA Inc. |
Description: IC 8BIT SYNC BINARY DOWN 16-SOIC Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 32 MHz Number of Bits per Element: 8 |
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74HC40103PW,118 | NXP USA Inc. |
Description: IC 8BIT SYNC BINARY DOWN 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-TSSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 32 MHz Number of Bits per Element: 8 |
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74HC40103PW,112 | NXP USA Inc. |
Description: IC 8BIT SYNC BINARY DOWN 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Down Trigger Type: Positive Edge Timing: Synchronous Supplier Device Package: 16-TSSOP Voltage - Supply: 2 V ~ 6 V Count Rate: 32 MHz Number of Bits per Element: 8 |
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74HC40105D,653 | NXP USA Inc. |
Description: IC FIFO REGISTER 4X16 16SOIC Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
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74HC40105PW,112 | NXP USA Inc. |
Description: IC FIFO REGISTER 4X16 16TSSOP Packaging: Tube DigiKey Programmable: Not Verified |
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74HC40105DB,112 | NXP USA Inc. |
Description: IC FIFO REGISTER 4X16 16SSOP Packaging: Tube DigiKey Programmable: Not Verified |
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74HC40105D,652 | NXP USA Inc. |
Description: IC FIFO REGISTER 4X16 16SOIC Packaging: Tube DigiKey Programmable: Not Verified |
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74AHC595D,118 | NXP USA Inc. |
Description: IC 8BIT SRL SHFT REGISTER 16SOIC Packaging: Tape & Reel (TR) |
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74AHC595D,112 | NXP USA Inc. |
Description: IC 8BIT SRL SHFT REGISTER 16SOIC Packaging: Tube |
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74AHC595PW,118 | NXP USA Inc. |
Description: IC 8BIT SRL SHFT REGISTR 16TSSOP Packaging: Tape & Reel (TR) |
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74AHC595PW,112 | NXP USA Inc. |
Description: IC 8BIT SRL SHFT REGISTR 16TSSOP Packaging: Tube |
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| BCX56-10,135 | NXP USA Inc. |
Description: TRANSISTOR NPN 80V 1A SOT89 Packaging: Tape & Reel (TR) |
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| BCX56-16,115 | NXP USA Inc. |
Description: TRANS NPN MED 1A 80V SOT89 Packaging: Tape & Reel (TR) |
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| BTA312-800B,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220AB Packaging: Tube |
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MC908QY1ACDTE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
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MC908JL8MDWE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 13x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 28-SOIC Number of I/O: 23 DigiKey Programmable: Not Verified |
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MC908QT2ACFQE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8DFN Packaging: Tray Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-DFN-EP (4x4) Number of I/O: 5 DigiKey Programmable: Not Verified |
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MC908QT4ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-PDIP Number of I/O: 5 DigiKey Programmable: Not Verified |
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MC908QY4ACDTE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
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MC908QY4ACDTER | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
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MC908EY16ACFJER | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
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MC908EY16ACFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
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MC908JL3ECFAE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 4KB (4K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 12x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V Peripherals: LED, LVD, POR, PWM Supplier Device Package: 48-LQFP (7x7) Number of I/O: 23 DigiKey Programmable: Not Verified |
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MC908QY1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 16-PDIP Number of I/O: 13 DigiKey Programmable: Not Verified |
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| BTA212-600E,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 12A TO220AB Packaging: Tube |
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| BTA212-600D,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 12A TO220AB Packaging: Tube |
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| BTA212-600B,127 | NXP USA Inc. |
Description: TRIAC 600V 12A TO220AB Packaging: Tube |
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| BTA212X-600E,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 12A TO220-3 Packaging: Bulk |
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| BTA212X-600D,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 12A TO220-3 Packaging: Bulk |
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| BTA212X-600F,127 | NXP USA Inc. |
Description: TRIAC 600V 12A TO220F Packaging: Bulk |
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| BTA212X-600B,127 | NXP USA Inc. |
Description: TRIAC 600V 12A SOT186A Packaging: Bulk |
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| BTA212B-600D,118 | NXP USA Inc. |
Description: TRIAC 600V 12A D2PAK Packaging: Tape & Reel (TR) |
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| BTA212B-600E,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 12A D2PAK Packaging: Tape & Reel (TR) |
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| BTA212B-600B,118 | NXP USA Inc. |
Description: TRIAC 600V 12A D2PAK Packaging: Tape & Reel (TR) |
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| BTA212X-800E,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO-220F Packaging: Bulk |
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| BTA212X-800B,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220-3 Packaging: Bulk |
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| BAS40-06,215 | NXP USA Inc. |
Description: DIODE SCHOTTKY 40V 120MA TO236AB Packaging: Tape & Reel (TR) |
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| BT145-800R,127 | NXP USA Inc. |
Description: THYRISTOR 25A 800V TO220AB Packaging: Tube |
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PEMI4QFN/HK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 45 OHMS ESD SMD Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 45Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 13dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 45 ESD Protection: Yes Number of Channels: 4 |
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| BCP56-16,135 | NXP USA Inc. |
Description: TRANSISTOR NPN 80V 1A SOT223 Packaging: Tape & Reel (TR) |
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| BCX52-10,115 | NXP USA Inc. |
Description: TRANSISTOR PNP 60V 1A SOT89 Packaging: Tape & Reel (TR) |
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| BCP52,135 | NXP USA Inc. |
Description: TRANSISTOR PNP 60V 1A SOT223 Packaging: Tape & Reel (TR) |
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| BCP55,115 | NXP USA Inc. |
Description: TRANSISTOR NPN 60V 1A SOT223 Packaging: Tape & Reel (TR) |
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| 74HC164D,652 |
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Виробник: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 14-SO
Number of Bits per Element: 8
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| 74HCT10D,653 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 3CH 3-INP 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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| 74HCT10D,652 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 3CH 3-INP 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-SO
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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| 74HCT10DB,112 |
|
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
Description: IC GATE NAND 3CH 3-INP 14-SSOP
Packaging: Tube
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 3
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 24ns @ 4.5V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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| MC68HC711D3CFN2 |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 26
DigiKey Programmable: Not Verified
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| 74HC4052N,652 |
|
Виробник: NXP USA Inc.
Description: IC SWITCH SP4T X 2 150OHM 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 150Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-DIP
Voltage - Supply, Single (V+): 2V ~ 10V
Voltage - Supply, Dual (V±): ±1.5V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 6Ohm
Switch Time (Ton, Toff) (Max): 58ns, 48ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 2
Description: IC SWITCH SP4T X 2 150OHM 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 150Ohm
-3db Bandwidth: 180MHz
Supplier Device Package: 16-DIP
Voltage - Supply, Single (V+): 2V ~ 10V
Voltage - Supply, Dual (V±): ±1.5V ~ 5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SP4T
Multiplexer/Demultiplexer Circuit: 4:1
Channel-to-Channel Matching (ΔRon): 6Ohm
Switch Time (Ton, Toff) (Max): 58ns, 48ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 2
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| TJA1051ATK/3/0Z |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
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| 74HC40103D,653 |
|
Виробник: NXP USA Inc.
Description: IC 8BIT SYNC BINARY DOWN 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Description: IC 8BIT SYNC BINARY DOWN 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
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| 74HC40103D,652 |
|
Виробник: NXP USA Inc.
Description: IC 8BIT SYNC BINARY DOWN 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Description: IC 8BIT SYNC BINARY DOWN 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
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| 74HC40103PW,118 |
|
Виробник: NXP USA Inc.
Description: IC 8BIT SYNC BINARY DOWN 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Description: IC 8BIT SYNC BINARY DOWN 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
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| 74HC40103PW,112 |
|
Виробник: NXP USA Inc.
Description: IC 8BIT SYNC BINARY DOWN 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
Description: IC 8BIT SYNC BINARY DOWN 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Down
Trigger Type: Positive Edge
Timing: Synchronous
Supplier Device Package: 16-TSSOP
Voltage - Supply: 2 V ~ 6 V
Count Rate: 32 MHz
Number of Bits per Element: 8
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| 74HC40105D,653 |
|
Виробник: NXP USA Inc.
Description: IC FIFO REGISTER 4X16 16SOIC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC FIFO REGISTER 4X16 16SOIC
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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| 74HC40105PW,112 |
|
Виробник: NXP USA Inc.
Description: IC FIFO REGISTER 4X16 16TSSOP
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC FIFO REGISTER 4X16 16TSSOP
Packaging: Tube
DigiKey Programmable: Not Verified
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| 74HC40105DB,112 |
|
Виробник: NXP USA Inc.
Description: IC FIFO REGISTER 4X16 16SSOP
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC FIFO REGISTER 4X16 16SSOP
Packaging: Tube
DigiKey Programmable: Not Verified
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| 74HC40105D,652 |
|
Виробник: NXP USA Inc.
Description: IC FIFO REGISTER 4X16 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
Description: IC FIFO REGISTER 4X16 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified
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| MC908QY1ACDTE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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| MC908JL8MDWE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 23
DigiKey Programmable: Not Verified
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| MC908QT2ACFQE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 5
DigiKey Programmable: Not Verified
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| MC908QT4ACPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-PDIP
Number of I/O: 5
DigiKey Programmable: Not Verified
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| MC908QY4ACDTE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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| MC908QY4ACDTER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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| MC908EY16ACFJER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC908EY16ACFJE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC908JL3ECFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 23
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 23
DigiKey Programmable: Not Verified
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| MC908QY1ACPE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-PDIP
Number of I/O: 13
DigiKey Programmable: Not Verified
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| PEMI4QFN/HK,132 |
|
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 13dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 4
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