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BSZ340N08NS3GATMA1 BSZ340N08NS3GATMA1 Infineon Technologies Infineon-BSZ340N08NS3G-DS-v02_03-en.pdf?fileId=db3a30431ff9881501206626660b6c72 Description: MOSFET N-CH 80V 6A/23A 8TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6A (Ta), 23A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 12A, 10V
Power Dissipation (Max): 2.1W (Ta), 32W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 12µA
Supplier Device Package: PG-TSDSON-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 9.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 40 V
на замовлення 38558 шт:
термін постачання 21-31 дні (днів)
5+67.64 грн
10+48.97 грн
100+33.38 грн
500+25.23 грн
1000+22.89 грн
2000+20.92 грн
Мінімальне замовлення: 5
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KP125 Infineon Technologies KP125_V1+0_DS_Rev2+14.pdf Description: IC PRESSURE SENSOR BAROM DSOF-8
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KP125 Infineon Technologies KP125_V1+0_DS_Rev2+14.pdf Description: IC PRESSURE SENSOR BAROM DSOF-8
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IR2151SPBF IR2151SPBF Infineon Technologies ir2151.pdf description Description: IC GATE DRVR HALF-BRIDGE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: RC Input Circuit
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 80ns, 40ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 125mA, 250mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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CY7C1041DV33-10BVJXIT CY7C1041DV33-10BVJXIT Infineon Technologies Description: IC SRAM 4MBIT PARALLEL 48VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Part Status: Obsolete
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 256K x 16
DigiKey Programmable: Not Verified
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CY7C1165V18-400BZXC CY7C1165V18-400BZXC Infineon Technologies CY7C11(61,63,65,76)V18_8.pdf Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1170V18-400BZXC CY7C1170V18-400BZXC Infineon Technologies CY7C116x,117xV18_8.pdf Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1423AV18-267BZXCT CY7C1423AV18-267BZXCT Infineon Technologies Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 267 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 2M x 18
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BGA612E6327HTSA1 BGA612E6327HTSA1 Infineon Technologies BGA612.pdf?folderId=db3a30431441fb5d0114b654e6581730&fileId=db3a304314dca3890115418eaa5b1639 Description: IC AMP MMIC 80MA 2.8V SOT343
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IPA90R1K2C3XKSA1 IPA90R1K2C3XKSA1 Infineon Technologies IPA90R1K2C3_1.0.pdf?folderId=db3a3043163797a6011637d4bae7003b&fileId=db3a3043183a955501183c3c4d240098 Description: MOSFET N-CH 900V 5.1A TO220-FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.1A (Tc)
Rds On (Max) @ Id, Vgs: 1.2Ohm @ 2.8A, 10V
Power Dissipation (Max): 31W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 310µA
Supplier Device Package: PG-TO220-FP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 710 pF @ 100 V
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IPB019N08N3GATMA1 IPB019N08N3GATMA1 Infineon Technologies IPB019N08N3_Rev2.1.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431add1d95011ae87fdf90569f Description: MOSFET N-CH 80V 180A TO263-7
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 100A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 270µA
Supplier Device Package: PG-TO263-7
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 206 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14200 pF @ 40 V
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
1000+197.46 грн
Мінімальне замовлення: 1000
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XC8662FRA5VBEAXUMA1 XC8662FRA5VBEAXUMA1 Infineon Technologies Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t Description: IC MCU 8BIT 8KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 140°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Part Status: Discontinued at Digi-Key
Number of I/O: 27
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SAA-XC866-4FRA 5V BE SAA-XC866-4FRA 5V BE Infineon Technologies Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t Description: IC MCU 8BIT 16KB FLASH 38TSSOP
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SAF-XC888CLM-6FFA 5V AC SAF-XC888CLM-6FFA 5V AC Infineon Technologies Infineon-XC88XCLM-DS-v01_02-en.pdf?fileId=db3a304412b407950112b40c4a9e0afb Description: IC MCU 8BIT 24KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 1.75K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TQFP-64
Number of I/O: 48
DigiKey Programmable: Not Verified
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SAF-XE164F-48F66L AC SAF-XE164F-48F66L AC Infineon Technologies XE164_V2.1_Aug2008.pdf Description: IC MCU 16BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Number of I/O: 75
DigiKey Programmable: Not Verified
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XE164F72F66LACFXQMA1 XE164F72F66LACFXQMA1 Infineon Technologies Infineon-XE164X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd57301161007ff671b4d&ack=t Description: IC MCU 16BIT 576KB FLASH 100LQFP
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XE167F72F66LACFXQMA1 XE167F72F66LACFXQMA1 Infineon Technologies Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc Description: IC MCU 16BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XC226456F66LACKXUMA1 XC226456F66LACKXUMA1 Infineon Technologies XC226x_ds_v2.1_2008_08.pdf Description: IC MCU 16/32B 448KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 8x8/10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Part Status: Discontinued at Digi-Key
Number of I/O: 75
DigiKey Programmable: Not Verified
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XC226756F66LACKXUMA1 XC226756F66LACKXUMA1 Infineon Technologies XC226x_ds_v2.1_2008_08.pdf Description: IC MCU 16/32B 448KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x8/10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Part Status: Discontinued at Digi-Key
Number of I/O: 75
DigiKey Programmable: Not Verified
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XC226796F66LACKXUMA1 XC226796F66LACKXUMA1 Infineon Technologies XC226x_ds_v2.1_2008_08.pdf Description: IC MCU 16/32B 768KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x8/10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Number of I/O: 75
DigiKey Programmable: Not Verified
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SAK-XC2287-56F66L34 AC SAK-XC2287-56F66L34 AC Infineon Technologies Infineon-XC228X-DS-v02_01-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b40937b40162&ack=t Description: IC MCU 16/32B 448KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Part Status: Obsolete
Number of I/O: 118
DigiKey Programmable: Not Verified
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KX228796F66L82ACXT KX228796F66L82ACXT Infineon Technologies Infineon-XC228X-DS-v02_01-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b40937b40162&ack=t Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XC2766X96F66LACKXUMA1 XC2766X96F66LACKXUMA1 Infineon Technologies Infineon-XC276X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115944bf6c00727&fileId=db3a3043156fd5730115aceda53c0aa0&ack=t Description: IC MCU 16/32B 768KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 51K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Number of I/O: 75
DigiKey Programmable: Not Verified
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XC2786X96F66LACKXUMA1 XC2786X96F66LACKXUMA1 Infineon Technologies Infineon-XC2786X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115944bf6c00727&fileId=db3a3043156fd5730115acf1e7cf0aa6&ack=t Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 51K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 116
DigiKey Programmable: Not Verified
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XE167G48F66LACFXQMA1 XE167G48F66LACFXQMA1 Infineon Technologies Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167G72F66LACFXQMA1 XE167G72F66LACFXQMA1 Infineon Technologies Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc Description: IC MCU 16BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167H48F66LACFXQMA1 XE167H48F66LACFXQMA1 Infineon Technologies Infineon-XE167X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd5730116100ef1b41b52&ack=t Description: IC MCU 16BIT 384KB FLASH 144LQFP
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SAF-XE167H-72F66L AC SAF-XE167H-72F66L AC Infineon Technologies Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc Description: IC MCU 16BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167H96F66LACFXUMA1 XE167H96F66LACFXUMA1 Infineon Technologies Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167K48F66LACFXQMA1 XE167K48F66LACFXQMA1 Infineon Technologies Infineon-XE167X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd5730116100ef1b41b52&ack=t Description: IC MCU 16BIT 384KB FLASH 144LQFP
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XE167K72F66LACFXQMA1 XE167K72F66LACFXQMA1 Infineon Technologies Infineon-XE167X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd5730116100ef1b41b52&ack=t Description: IC MCU 16BIT 576KB FLASH 144LQFP
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XE167K96F66LACFXQMA1 XE167K96F66LACFXQMA1 Infineon Technologies Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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TC1762128F80HLACKXUMA1 TC1762128F80HLACKXUMA1 Infineon Technologies Infineon-TC1762-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313698d9701136c5edd7c006d&ack=t Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 52K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: TriCore™
Data Converters: A/D 2x10b, 32x8b/10b/12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Connectivity: ASC, CANbus, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
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SAK-TC1766-192F80HL BD SAK-TC1766-192F80HL BD Infineon Technologies Infineon-TC1766-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313553140011368a9b40e0224&ack=t Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
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SAK-TC1796-256F150E BD SAK-TC1796-256F150E BD Infineon Technologies Infineon-SAK-TC1796-256F150E+BE-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a34e1f28045d Description: IC MCU 32BIT 2MB FLASH 416BGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: TriCore™
Data Converters: A/D 44x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-BGA-416-4
Part Status: Obsolete
Number of I/O: 123
DigiKey Programmable: Not Verified
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SAA-XC866-4FRA 5V BE SAA-XC866-4FRA 5V BE Infineon Technologies Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t Description: IC MCU 8BIT 16KB FLASH 38TSSOP
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SAK-TC1766-192F80HL BD SAK-TC1766-192F80HL BD Infineon Technologies Infineon-TC1766-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313553140011368a9b40e0224&ack=t Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
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SAA-XC866-4FRA 5V BE SAA-XC866-4FRA 5V BE Infineon Technologies Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t Description: IC MCU 8BIT 16KB FLASH 38TSSOP
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SAK-TC1766-192F80HL BD SAK-TC1766-192F80HL BD Infineon Technologies Infineon-TC1766-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313553140011368a9b40e0224&ack=t Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
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BSZ067N06LS3GATMA1 BSZ067N06LS3GATMA1 Infineon Technologies BSZ067N06LS3_rev2.2.pdf?folderId=db3a30431ddc9372011ebafa04517f8b&fileId=db3a30431ddc9372011ebb0f41537ff6 Description: MOSFET N-CH 60V 14A/79A 8TSDSON
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Ta), 79A (Tc)
Rds On (Max) @ Id, Vgs: 6.7mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 69W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 35µA
Supplier Device Package: PG-TSDSON-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5100 pF @ 30 V
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
5000+36.54 грн
Мінімальне замовлення: 5000
В кошику  од. на суму  грн.
BSZ067N06LS3GATMA1 BSZ067N06LS3GATMA1 Infineon Technologies BSZ067N06LS3_rev2.2.pdf?folderId=db3a30431ddc9372011ebafa04517f8b&fileId=db3a30431ddc9372011ebb0f41537ff6 Description: MOSFET N-CH 60V 14A/79A 8TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Ta), 79A (Tc)
Rds On (Max) @ Id, Vgs: 6.7mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 69W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 35µA
Supplier Device Package: PG-TSDSON-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5100 pF @ 30 V
на замовлення 9628 шт:
термін постачання 21-31 дні (днів)
3+118.58 грн
10+76.40 грн
100+55.08 грн
500+41.98 грн
1000+37.84 грн
2000+35.48 грн
Мінімальне замовлення: 3
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IRMCK371TR IRMCK371TR Infineon Technologies IRMCK371.pdf Description: IC MTRDRV 1.62-1.98/3-3.6V 48QFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I2C, RS-232, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Applications: Appliance
Technology: IGBT
Supplier Device Package: 48-QFP (7x7)
Motor Type - AC, DC: AC, Synchronous
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IRMCF341TR IRMCF341TR Infineon Technologies irmcf341.pdf?fileId=5546d462533600a4015356726d8c2742 Description: IC MOTOR DRIVER 64MQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I2C, RS-232, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Applications: Appliance
Technology: IGBT
Supplier Device Package: 64-MQFP (10x10)
Motor Type - AC, DC: AC, Synchronous
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IRMCF343TR IRMCF343TR Infineon Technologies irmcf343.pdf?fileId=5546d462533600a40153567274282745 Description: IC MOTOR DRIVER 64MQFP
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IR3800MTRPBF IR3800MTRPBF Infineon Technologies IR3800MPBF.pdf Description: IC REG BUCK ADJ 12A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
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IR3800AMTRPBF IR3800AMTRPBF Infineon Technologies IR3800AMPbF.pdf Description: IC REG BUCK ADJ 14A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 14A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 300kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
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IR3500AMTRPBF IR3500AMTRPBF Infineon Technologies IR3500A.pdf Description: IC CTRL XPHASE3 VR11.0 32-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
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IRAM109-015SD IRAM109-015SD Infineon Technologies IRAM109-015SD.pdf Description: IC HYBRID H-BRIDGE 1A 500V SIP-S
Packaging: Tube
Package / Case: 19-PowerSIP Module, 13 Leads, Formed Leads
Mounting Type: Through Hole
Type: MOSFET
Configuration: Half Bridge
Current: 2 A
Voltage: 500 V
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IRAM136-1060B IRAM136-1060B Infineon Technologies IRAM136-1060B.pdf Description: IC HYBRID PWR 10A 600V ADV SIP05
Packaging: Tube
Package / Case: 29-PowerSSIP Module, 21 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMS10UP60B-2 IRAMS10UP60B-2 Infineon Technologies IRAMS10UP60B.pdf description Description: IC PWR MOD PLUG-N-DRIVE 600V 10A
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMS10UP60B-3 IRAMS10UP60B-3 Infineon Technologies IRAMS10UP60B.pdf Description: IC PWR MOD PLUG-N-DRIVE 600V 10A
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMS10UP60B-4 Infineon Technologies IRAMS10UP60B.pdf Description: IC PWR MOD PLUG-N-DRIVE 600V 10A
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMX16UP60A-2 IRAMX16UP60A-2 Infineon Technologies IRAMX16UP60A.pdf description Description: IC PWR HYBRID 600V 16A SIP2
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 16 A
Voltage: 600 V
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IRAMX16UP60B IRAMX16UP60B Infineon Technologies IRAMX16UP60B.pdf description Description: IC PWR HYBRID 600V 16A 23PWRSIP
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 16 A
Voltage: 600 V
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IRAMX16UP60B-2 IRAMX16UP60B-2 Infineon Technologies IRAMX16UP60B.pdf description Description: IC PWR HYBRID 600V 16A SIP2
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 16 A
Voltage: 600 V
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IRAMX20UP60A IRAMX20UP60A Infineon Technologies IRAMX20UP60A.pdf description Description: IC PWR HYBRID 600V 20A SIP2
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 20 A
Voltage: 600 V
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IRAMX20UP60A-2 IRAMX20UP60A-2 Infineon Technologies IRAMX20UP60A.pdf Description: IC PWR HYBRID 600V 20A 23PWRSIP
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 20 A
Voltage: 600 V
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IRAUDAMP7D IRAUDAMP7D Infineon Technologies IRAUDAMP7D.pdf Description: EVAL BOARD FOR IRS2092
Packaging: Tube
Output Type: 2-Channel (Stereo)
Amplifier Type: Class D
Voltage - Supply: ±45V ~ 60V
Max Output Power x Channels @ Load: 500W x 2 @ 8Ohm
Board Type: Fully Populated
Utilized IC / Part: IRS2092
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
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IR3502AMTRPBF IR3502AMTRPBF Infineon Technologies ir3502a.pdf Description: IC XPHASE CTRL VR11.0/1 32-MLPQ
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IR3801MTRPBF IR3801MTRPBF Infineon Technologies IR3801MPBF.pdf Description: IC REG BUCK ADJUSTABLE 7A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 7A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
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BSZ340N08NS3GATMA1 Infineon-BSZ340N08NS3G-DS-v02_03-en.pdf?fileId=db3a30431ff9881501206626660b6c72
BSZ340N08NS3GATMA1
Виробник: Infineon Technologies
Description: MOSFET N-CH 80V 6A/23A 8TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6A (Ta), 23A (Tc)
Rds On (Max) @ Id, Vgs: 34mOhm @ 12A, 10V
Power Dissipation (Max): 2.1W (Ta), 32W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 12µA
Supplier Device Package: PG-TSDSON-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 9.1 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 630 pF @ 40 V
на замовлення 38558 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+67.64 грн
10+48.97 грн
100+33.38 грн
500+25.23 грн
1000+22.89 грн
2000+20.92 грн
Мінімальне замовлення: 5
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KP125 KP125_V1+0_DS_Rev2+14.pdf
Виробник: Infineon Technologies
Description: IC PRESSURE SENSOR BAROM DSOF-8
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KP125 KP125_V1+0_DS_Rev2+14.pdf
Виробник: Infineon Technologies
Description: IC PRESSURE SENSOR BAROM DSOF-8
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IR2151SPBF description ir2151.pdf
IR2151SPBF
Виробник: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: RC Input Circuit
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 80ns, 40ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 125mA, 250mA
Part Status: Obsolete
DigiKey Programmable: Not Verified
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CY7C1041DV33-10BVJXIT
CY7C1041DV33-10BVJXIT
Виробник: Infineon Technologies
Description: IC SRAM 4MBIT PARALLEL 48VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Part Status: Obsolete
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 256K x 16
DigiKey Programmable: Not Verified
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CY7C1165V18-400BZXC CY7C11(61,63,65,76)V18_8.pdf
CY7C1165V18-400BZXC
Виробник: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1170V18-400BZXC CY7C116x,117xV18_8.pdf
CY7C1170V18-400BZXC
Виробник: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1423AV18-267BZXCT
CY7C1423AV18-267BZXCT
Виробник: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 267 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 2M x 18
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BGA612E6327HTSA1 BGA612.pdf?folderId=db3a30431441fb5d0114b654e6581730&fileId=db3a304314dca3890115418eaa5b1639
BGA612E6327HTSA1
Виробник: Infineon Technologies
Description: IC AMP MMIC 80MA 2.8V SOT343
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IPA90R1K2C3XKSA1 IPA90R1K2C3_1.0.pdf?folderId=db3a3043163797a6011637d4bae7003b&fileId=db3a3043183a955501183c3c4d240098
IPA90R1K2C3XKSA1
Виробник: Infineon Technologies
Description: MOSFET N-CH 900V 5.1A TO220-FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.1A (Tc)
Rds On (Max) @ Id, Vgs: 1.2Ohm @ 2.8A, 10V
Power Dissipation (Max): 31W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 310µA
Supplier Device Package: PG-TO220-FP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 710 pF @ 100 V
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IPB019N08N3GATMA1 IPB019N08N3_Rev2.1.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431add1d95011ae87fdf90569f
IPB019N08N3GATMA1
Виробник: Infineon Technologies
Description: MOSFET N-CH 80V 180A TO263-7
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
Rds On (Max) @ Id, Vgs: 1.9mOhm @ 100A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 270µA
Supplier Device Package: PG-TO263-7
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 206 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 14200 pF @ 40 V
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+197.46 грн
Мінімальне замовлення: 1000
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XC8662FRA5VBEAXUMA1 Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t
XC8662FRA5VBEAXUMA1
Виробник: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 140°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Part Status: Discontinued at Digi-Key
Number of I/O: 27
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SAA-XC866-4FRA 5V BE Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t
SAA-XC866-4FRA 5V BE
Виробник: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
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SAF-XC888CLM-6FFA 5V AC Infineon-XC88XCLM-DS-v01_02-en.pdf?fileId=db3a304412b407950112b40c4a9e0afb
SAF-XC888CLM-6FFA 5V AC
Виробник: Infineon Technologies
Description: IC MCU 8BIT 24KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 1.75K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TQFP-64
Number of I/O: 48
DigiKey Programmable: Not Verified
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SAF-XE164F-48F66L AC XE164_V2.1_Aug2008.pdf
SAF-XE164F-48F66L AC
Виробник: Infineon Technologies
Description: IC MCU 16BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Number of I/O: 75
DigiKey Programmable: Not Verified
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XE164F72F66LACFXQMA1 Infineon-XE164X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd57301161007ff671b4d&ack=t
XE164F72F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 576KB FLASH 100LQFP
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XE167F72F66LACFXQMA1 Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc
XE167F72F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XC226456F66LACKXUMA1 XC226x_ds_v2.1_2008_08.pdf
XC226456F66LACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 16/32B 448KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 8x8/10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Part Status: Discontinued at Digi-Key
Number of I/O: 75
DigiKey Programmable: Not Verified
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XC226756F66LACKXUMA1 XC226x_ds_v2.1_2008_08.pdf
XC226756F66LACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 16/32B 448KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x8/10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Part Status: Discontinued at Digi-Key
Number of I/O: 75
DigiKey Programmable: Not Verified
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XC226796F66LACKXUMA1 XC226x_ds_v2.1_2008_08.pdf
XC226796F66LACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 16/32B 768KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x8/10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Number of I/O: 75
DigiKey Programmable: Not Verified
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SAK-XC2287-56F66L34 AC Infineon-XC228X-DS-v02_01-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b40937b40162&ack=t
SAK-XC2287-56F66L34 AC
Виробник: Infineon Technologies
Description: IC MCU 16/32B 448KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Part Status: Obsolete
Number of I/O: 118
DigiKey Programmable: Not Verified
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KX228796F66L82ACXT Infineon-XC228X-DS-v02_01-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b40937b40162&ack=t
KX228796F66L82ACXT
Виробник: Infineon Technologies
Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XC2766X96F66LACKXUMA1 Infineon-XC276X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115944bf6c00727&fileId=db3a3043156fd5730115aceda53c0aa0&ack=t
XC2766X96F66LACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 16/32B 768KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 51K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-3
Number of I/O: 75
DigiKey Programmable: Not Verified
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XC2786X96F66LACKXUMA1 Infineon-XC2786X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115944bf6c00727&fileId=db3a3043156fd5730115acf1e7cf0aa6&ack=t
XC2786X96F66LACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 16/32B 768KB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 51K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 116
DigiKey Programmable: Not Verified
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XE167G48F66LACFXQMA1 Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc
XE167G48F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 34K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167G72F66LACFXQMA1 Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc
XE167G72F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167H48F66LACFXQMA1 Infineon-XE167X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd5730116100ef1b41b52&ack=t
XE167H48F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 384KB FLASH 144LQFP
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SAF-XE167H-72F66L AC Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc
SAF-XE167H-72F66L AC
Виробник: Infineon Technologies
Description: IC MCU 16BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167H96F66LACFXUMA1 Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc
XE167H96F66LACFXUMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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XE167K48F66LACFXQMA1 Infineon-XE167X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd5730116100ef1b41b52&ack=t
XE167K48F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 384KB FLASH 144LQFP
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XE167K72F66LACFXQMA1 Infineon-XE167X-DS-v02_01-en.pdf?folderId=db3a3043156fd5730115b3a665650d23&fileId=db3a3043156fd5730116100ef1b41b52&ack=t
XE167K72F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 576KB FLASH 144LQFP
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XE167K96F66LACFXQMA1 Infineon-XE167x-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8d2fe47b018dc1cf5bc857fc
XE167K96F66LACFXQMA1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 768KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 82K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-4
Number of I/O: 118
DigiKey Programmable: Not Verified
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TC1762128F80HLACKXUMA1 Infineon-TC1762-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313698d9701136c5edd7c006d&ack=t
TC1762128F80HLACKXUMA1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 52K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: TriCore™
Data Converters: A/D 2x10b, 32x8b/10b/12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Connectivity: ASC, CANbus, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Obsolete
Number of I/O: 81
DigiKey Programmable: Not Verified
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SAK-TC1766-192F80HL BD Infineon-TC1766-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313553140011368a9b40e0224&ack=t
SAK-TC1766-192F80HL BD
Виробник: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
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SAK-TC1796-256F150E BD Infineon-SAK-TC1796-256F150E+BE-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a34e1f28045d
SAK-TC1796-256F150E BD
Виробник: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 416BGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: TriCore™
Data Converters: A/D 44x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-BGA-416-4
Part Status: Obsolete
Number of I/O: 123
DigiKey Programmable: Not Verified
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SAA-XC866-4FRA 5V BE Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t
SAA-XC866-4FRA 5V BE
Виробник: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
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SAK-TC1766-192F80HL BD Infineon-TC1766-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313553140011368a9b40e0224&ack=t
SAK-TC1766-192F80HL BD
Виробник: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
товару немає в наявності
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SAA-XC866-4FRA 5V BE Infineon-SAA_XC866-DS-v01_05-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a30431689f442011690d942dc0119&ack=t
SAA-XC866-4FRA 5V BE
Виробник: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
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SAK-TC1766-192F80HL BD Infineon-TC1766-DS-v01_00-en.pdf?folderId=db3a304412b407950112b409ae7c0343&fileId=db3a304313553140011368a9b40e0224&ack=t
SAK-TC1766-192F80HL BD
Виробник: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
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BSZ067N06LS3GATMA1 BSZ067N06LS3_rev2.2.pdf?folderId=db3a30431ddc9372011ebafa04517f8b&fileId=db3a30431ddc9372011ebb0f41537ff6
BSZ067N06LS3GATMA1
Виробник: Infineon Technologies
Description: MOSFET N-CH 60V 14A/79A 8TSDSON
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Ta), 79A (Tc)
Rds On (Max) @ Id, Vgs: 6.7mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 69W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 35µA
Supplier Device Package: PG-TSDSON-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5100 pF @ 30 V
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5000+36.54 грн
Мінімальне замовлення: 5000
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BSZ067N06LS3GATMA1 BSZ067N06LS3_rev2.2.pdf?folderId=db3a30431ddc9372011ebafa04517f8b&fileId=db3a30431ddc9372011ebb0f41537ff6
BSZ067N06LS3GATMA1
Виробник: Infineon Technologies
Description: MOSFET N-CH 60V 14A/79A 8TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Ta), 79A (Tc)
Rds On (Max) @ Id, Vgs: 6.7mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 69W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 35µA
Supplier Device Package: PG-TSDSON-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5100 pF @ 30 V
на замовлення 9628 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+118.58 грн
10+76.40 грн
100+55.08 грн
500+41.98 грн
1000+37.84 грн
2000+35.48 грн
Мінімальне замовлення: 3
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IRMCK371TR IRMCK371.pdf
IRMCK371TR
Виробник: Infineon Technologies
Description: IC MTRDRV 1.62-1.98/3-3.6V 48QFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I2C, RS-232, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Applications: Appliance
Technology: IGBT
Supplier Device Package: 48-QFP (7x7)
Motor Type - AC, DC: AC, Synchronous
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IRMCF341TR irmcf341.pdf?fileId=5546d462533600a4015356726d8c2742
IRMCF341TR
Виробник: Infineon Technologies
Description: IC MOTOR DRIVER 64MQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: I2C, RS-232, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Applications: Appliance
Technology: IGBT
Supplier Device Package: 64-MQFP (10x10)
Motor Type - AC, DC: AC, Synchronous
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IRMCF343TR irmcf343.pdf?fileId=5546d462533600a40153567274282745
IRMCF343TR
Виробник: Infineon Technologies
Description: IC MOTOR DRIVER 64MQFP
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IR3800MTRPBF IR3800MPBF.pdf
IR3800MTRPBF
Виробник: Infineon Technologies
Description: IC REG BUCK ADJ 12A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
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IR3800AMTRPBF IR3800AMPbF.pdf
IR3800AMTRPBF
Виробник: Infineon Technologies
Description: IC REG BUCK ADJ 14A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 14A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 300kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
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IR3500AMTRPBF IR3500A.pdf
IR3500AMTRPBF
Виробник: Infineon Technologies
Description: IC CTRL XPHASE3 VR11.0 32-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
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IRAM109-015SD IRAM109-015SD.pdf
IRAM109-015SD
Виробник: Infineon Technologies
Description: IC HYBRID H-BRIDGE 1A 500V SIP-S
Packaging: Tube
Package / Case: 19-PowerSIP Module, 13 Leads, Formed Leads
Mounting Type: Through Hole
Type: MOSFET
Configuration: Half Bridge
Current: 2 A
Voltage: 500 V
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IRAM136-1060B IRAM136-1060B.pdf
IRAM136-1060B
Виробник: Infineon Technologies
Description: IC HYBRID PWR 10A 600V ADV SIP05
Packaging: Tube
Package / Case: 29-PowerSSIP Module, 21 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMS10UP60B-2 description IRAMS10UP60B.pdf
IRAMS10UP60B-2
Виробник: Infineon Technologies
Description: IC PWR MOD PLUG-N-DRIVE 600V 10A
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMS10UP60B-3 IRAMS10UP60B.pdf
IRAMS10UP60B-3
Виробник: Infineon Technologies
Description: IC PWR MOD PLUG-N-DRIVE 600V 10A
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMS10UP60B-4 IRAMS10UP60B.pdf
Виробник: Infineon Technologies
Description: IC PWR MOD PLUG-N-DRIVE 600V 10A
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
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IRAMX16UP60A-2 description IRAMX16UP60A.pdf
IRAMX16UP60A-2
Виробник: Infineon Technologies
Description: IC PWR HYBRID 600V 16A SIP2
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 16 A
Voltage: 600 V
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IRAMX16UP60B description IRAMX16UP60B.pdf
IRAMX16UP60B
Виробник: Infineon Technologies
Description: IC PWR HYBRID 600V 16A 23PWRSIP
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 16 A
Voltage: 600 V
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IRAMX16UP60B-2 description IRAMX16UP60B.pdf
IRAMX16UP60B-2
Виробник: Infineon Technologies
Description: IC PWR HYBRID 600V 16A SIP2
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 16 A
Voltage: 600 V
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IRAMX20UP60A description IRAMX20UP60A.pdf
IRAMX20UP60A
Виробник: Infineon Technologies
Description: IC PWR HYBRID 600V 20A SIP2
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 20 A
Voltage: 600 V
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IRAMX20UP60A-2 IRAMX20UP60A.pdf
IRAMX20UP60A-2
Виробник: Infineon Technologies
Description: IC PWR HYBRID 600V 20A 23PWRSIP
Packaging: Tube
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 20 A
Voltage: 600 V
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IRAUDAMP7D IRAUDAMP7D.pdf
IRAUDAMP7D
Виробник: Infineon Technologies
Description: EVAL BOARD FOR IRS2092
Packaging: Tube
Output Type: 2-Channel (Stereo)
Amplifier Type: Class D
Voltage - Supply: ±45V ~ 60V
Max Output Power x Channels @ Load: 500W x 2 @ 8Ohm
Board Type: Fully Populated
Utilized IC / Part: IRS2092
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
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IR3502AMTRPBF ir3502a.pdf
IR3502AMTRPBF
Виробник: Infineon Technologies
Description: IC XPHASE CTRL VR11.0/1 32-MLPQ
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IR3801MTRPBF IR3801MPBF.pdf
IR3801MTRPBF
Виробник: Infineon Technologies
Description: IC REG BUCK ADJUSTABLE 7A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 15-PowerVQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 7A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz
Voltage - Input (Max): 21V
Topology: Buck
Supplier Device Package: PQFN (5x6)
Synchronous Rectifier: Yes
Voltage - Output (Max): 12V
Voltage - Input (Min): 2.5V
Voltage - Output (Min/Fixed): 0.6V
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