Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36388) > Сторінка 550 з 607
| Фото | Назва | Виробник | Інформація |
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| 88W8782-B0-NAPC/DZ | NXP USA Inc. |
Description: IC RF 68HVQFN Packaging: Tape & Reel (TR) Package / Case: 68-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 68-HVQFN (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| P3T2030DUKAZ | NXP USA Inc. |
Description: P3T2030DUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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| P3T2030DUKAZ | NXP USA Inc. |
Description: P3T2030DUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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P3T2030EUKAZ | NXP USA Inc. |
Description: P3T2030EUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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P3T2030EUKAZ | NXP USA Inc. |
Description: P3T2030EUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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P3T2030BUKAZ | NXP USA Inc. |
Description: P3T2030BUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3500 шт: термін постачання 21-31 дні (днів) |
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P3T2030FUKAZ | NXP USA Inc. |
Description: P3T2030FUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P3T2030FUKAZ | NXP USA Inc. |
Description: P3T2030FUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3497 шт: термін постачання 21-31 дні (днів) |
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P3T1035AUKAZ | NXP USA Inc. |
Description: P3T1035AUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Tape & Reel (TR) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5% Sensing Temperature - Local: -40°C ~ 125°C |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P3T1035AUKAZ | NXP USA Inc. |
Description: P3T1035AUKAZFeatures: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit Packaging: Cut Tape (CT) Package / Case: 4-UFBGA, WLCSP Output Type: I2C, I3C Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.4V ~ 1.98V Sensor Type: Digital Resolution: 12 b Supplier Device Package: 4-WLCSP (0.83x0.78) Test Condition: 0°C ~ 85°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±0.5% Sensing Temperature - Local: -40°C ~ 125°C |
на замовлення 3328 шт: термін постачання 21-31 дні (днів) |
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MC68360ZQ25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGAAdditional Interfaces: SCC, SMC, SPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: CPU32+ Operating Temperature: 0°C ~ 70°C (TA) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| P1017NSE5CFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 500MHZ 457TEPBGAPackaging: Tray Package / Case: 457-FBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 457-TEPBGA-1 (19x19) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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SPC5606SF2CLU6 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 176LQFPDigiKey Programmable: Not Verified Number of I/O: 136 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, LCD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 48K x 8 Program Memory Size: 1MB (1M x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| NT2H1511G0DUDZ | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIEPackaging: Bulk Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -25°C ~ 75°C Standards: ISO 14443 Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NT2H1511G0DUDV | NXP USA Inc. |
Description: NFC FORUM TYPE 2 TAG COMPLIANT IPackaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: Mifare, NFC Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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ON5088,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 55GHZ 4DFPSupplier Device Package: 4-DFP Noise Figure (dB Typ @ f): 1.1dB @ 12GHz Frequency - Transition: 55GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V Voltage - Collector Emitter Breakdown (Max): 10V Current - Collector (Ic) (Max): 40mA Power - Max: 136mW Gain: 13dB Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SOT-343F Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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ON5088,115 | NXP USA Inc. |
Description: RF TRANS NPN 10V 55GHZ 4DFPSupplier Device Package: 4-DFP Noise Figure (dB Typ @ f): 1.1dB @ 12GHz Frequency - Transition: 55GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V Voltage - Collector Emitter Breakdown (Max): 10V Current - Collector (Ic) (Max): 40mA Power - Max: 136mW Gain: 13dB Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SOT-343F Packaging: Cut Tape (CT) |
на замовлення 1704 шт: термін постачання 21-31 дні (днів) |
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LPC11U14FET48/201, | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 48TFBGAPackaging: Tray Package / Case: 48-TFBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-TFBGA (4.5x4.5) Number of I/O: 40 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| FS32R294HFK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGAPackaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| FS32R294HFK0MJDR | NXP USA Inc. |
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGAPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PR5331C3HN/C350,55 | NXP USA Inc. |
Description: IC RFID READER 13.56MHZ 40HVQFNSupplier Device Package: 40-HVQFN (6x6) Standards: FeliCa, ISO 14443, MIFARE, NFC Voltage - Supply: 2.5V ~ 3.6V Operating Temperature: -30°C ~ 85°C Type: RFID Reader Interface: I2C, UART Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCF51EM128CLL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPPackaging: Bulk Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
на замовлення 2324 шт: термін постачання 21-31 дні (днів) |
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MCF51EM128CLL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 63 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| FX32K118LAT0MLHT | NXP USA Inc. |
Description: S32K118 ARM CORTEX-M0+, 48 MHZ,Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MVR5510AVMANEP | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| FC32K116LAT0MLFT | NXP USA Inc. |
Description: S32K116 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCXC144VFT | NXP USA Inc. |
Description: 48MHz, Cortex-M0+Packaging: Tray Package / Case: 48-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-QFN (7x7) Number of I/O: 40 |
на замовлення 1150 шт: термін постачання 21-31 дні (днів) |
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| SAF775CHN/N208W/DK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MPC8245LZU350D | NXP USA Inc. |
Description: IC MPU MPC82XX 350MHZ 352TBGANumber of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: 0°C ~ 105°C (TA) Speed: 350MHz Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Tray Additional Interfaces: I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S9S08SL16F1VTL | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOP DigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 28-TSSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 16x10b Core Processor: S08 EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08AC8MFDE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48QFNDigiKey Programmable: Not Verified Number of I/O: 38 Supplier Device Package: 48-QFN-EP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: S08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 768 x 8 Program Memory Size: 8KB (8K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33FS8510A0KS | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN5Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tray Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Applications: System Basis Chip Voltage - Supply: 60V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| S912ZVL96AVFM | NXP USA Inc. |
Description: S12Z CPU, 96K FLASH Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 32MHz Program Memory Size: 96KB (96K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12Z Data Converters: A/D 6x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-QFN-EP (5x5) Number of I/O: 19 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MFS2630AMBA0AD | NXP USA Inc. |
Description: AUTO SBCPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 40V Current - Supply: 30µA Supplier Device Package: 48-LQFP-EP (7x7) Grade: Automotive |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S32K310NHT0MLFSR | NXP USA Inc. |
Description: IC MCUPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S32K310NHT0MLFST | NXP USA Inc. |
Description: S32K310NHT0MLFSTVoltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 112K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray Qualification: AEC-Q100 Number of I/O: 42 Grade: Automotive Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, I2S, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K310NHT0MPAST | NXP USA Inc. |
Description: S32K310NHT0MPASTQualification: AEC-Q100 Number of I/O: 84 Grade: Automotive Supplier Device Package: 100-MaxQFP (10x10) Peripherals: DMA, I2S, WDT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 112K x 8 Program Memory Size: 512KB (512K x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 100-QFP Packaging: Tray Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MMA5224KW | NXP USA Inc. |
Description: ACCELEROMETER 240G PCM/SPI 16QFNQualification: AEC-Q100 Grade: Automotive Sensitivity (LSB/g): 2 Supplier Device Package: 16-QFN (6x6) Voltage - Supply: 4.2V ~ 17V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±240g Axis: X Type: Digital Mounting Type: Surface Mount Output Type: PCM, SPI Package / Case: 16-QFN Exposed Pad Features: Selectable Low Pass Filter Packaging: Tube |
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В кошику од. на суму грн. | |||||||||||||||||
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MC9S08QE96CFT | NXP USA Inc. |
Description: IC MCU 8BIT 96KB FLASH 48QFNPackaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 96KB (96K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 48-QFN-EP (7x7) Number of I/O: 38 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K314NHT1MPBSR | NXP USA Inc. |
Description: S32K314NHT1MPBSRQualification: AEC-Q100 Number of I/O: 142 Grade: Automotive Supplier Device Package: 172-QFP (16x16) Peripherals: DMA, I2S, WDT Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b SAR Core Processor: ARM® Cortex®-M7 EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 172-QFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K314NHT1VPBSR | NXP USA Inc. |
Description: S32K314 ARM CORTEX-M7, 160 MHZ,Qualification: AEC-Q100 Number of I/O: 218 Grade: Automotive Supplier Device Package: 172-QFP (16x16) Peripherals: DMA, I2S, Serial Audio, WDT Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C RAM Size: 512K x 8 Program Memory Size: 4MB (4M x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 172-QFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCZ33903C5EK | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICPackaging: Tube Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Mounting Type: Surface Mount Applications: System Basis Chip Supplier Device Package: 32-SOIC-EP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MBMI7018TA1AER2 | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MBMI7018SA1AER2 | NXP USA Inc. |
Description: BMS1BCC18 100VPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NXLS95333AESR2 | NXP USA Inc. |
Description: XY DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NXLS95733AESR2 | NXP USA Inc. |
Description: YZ DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NXLS96433AESR2 | NXP USA Inc. |
Description: PSI5 XZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NXLS95433AESR2 | NXP USA Inc. |
Description: XZ DUAL-AXIS HIGH-G INERTIAL SE Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NXLS96733AESR2 | NXP USA Inc. |
Description: PSI5 YZ DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| NXLS96333AESR2 | NXP USA Inc. |
Description: PSI5 XY DUAL-AXIS HIGH-G INERTI Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
|
MMA1200KEG | NXP USA Inc. |
Description: ACCELEROMETER 281G ANALOG 16SOICPackaging: Bulk Package / Case: 16-SOIC (0.295", 7.50mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Type: Analog Axis: Z Acceleration Range: ±281g Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-SOIC Sensitivity (mV/g): 8 |
на замовлення 7683 шт: термін постачання 21-31 дні (днів) |
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MMA1250EGR2 | NXP USA Inc. |
Description: ACCELEROMETER 5G ANALOG 16SOICMounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 400 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±5g Axis: Z Type: Analog |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MMA1270KEG | NXP USA Inc. |
Description: ACCELEROMETER 2.5G ANALOG 16SOICGrade: Automotive Sensitivity (mV/g): 750 Supplier Device Package: 16-SOIC Bandwidth: 50Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 105°C Acceleration Range: ±2.5g Axis: Z Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tube Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| TEA1999DB1504UL | NXP USA Inc. |
Description: TEA1999 DEMOBOARD 1504Packaging: Box Function: Battery Charger Type: Power Management Contents: Board(s) Utilized IC / Part: TEA1999 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
MPC860SRCZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAAdditional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (4) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 95°C (TA) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MFS2613AMDHKAD | NXP USA Inc. |
Description: System Basis Chip ASIL-D LQFP-48Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) Voltage - Supply: 3.2V ~ 36V |
на замовлення 75 шт: термін постачання 21-31 дні (днів) |
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MFS8416AMBP5ESR2 | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN4Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MFS8416AMBP5ES | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN4Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC33FS6523NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOSupplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G3DVK05AB | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 272MAPBGAPackaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
В кошику од. на суму грн. |
| 88W8782-B0-NAPC/DZ |
Виробник: NXP USA Inc.
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| P3T2030DUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3500+ | 26.28 грн |
| P3T2030DUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030DUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 98.90 грн |
| 10+ | 60.11 грн |
| 25+ | 50.68 грн |
| 100+ | 37.59 грн |
| 250+ | 32.71 грн |
| 500+ | 29.72 грн |
| 1000+ | 26.79 грн |
| P3T2030EUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3500+ | 25.64 грн |
| P3T2030EUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030EUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 56.17 грн |
| 10+ | 38.63 грн |
| 25+ | 34.71 грн |
| 100+ | 28.53 грн |
| 250+ | 26.61 грн |
| 500+ | 25.44 грн |
| 1000+ | 24.09 грн |
| P3T2030BUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030BUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 55.38 грн |
| 10+ | 38.47 грн |
| 25+ | 34.53 грн |
| 100+ | 28.38 грн |
| 250+ | 26.47 грн |
| 500+ | 25.31 грн |
| 1000+ | 23.96 грн |
| P3T2030FUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
товару немає в наявності
В кошику
од. на суму грн.
| P3T2030FUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T2030FUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3497 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6+ | 56.17 грн |
| 10+ | 38.63 грн |
| 25+ | 34.71 грн |
| 100+ | 28.53 грн |
| 250+ | 26.61 грн |
| 500+ | 25.44 грн |
| 1000+ | 24.09 грн |
| P3T1035AUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
товару немає в наявності
В кошику
од. на суму грн.
| P3T1035AUKAZ |
![]() |
Виробник: NXP USA Inc.
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
Description: P3T1035AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3328 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 63.29 грн |
| 6+ | 53.18 грн |
| 10+ | 50.44 грн |
| 25+ | 44.33 грн |
| 50+ | 42.27 грн |
| 100+ | 40.37 грн |
| 500+ | 35.97 грн |
| 1000+ | 34.58 грн |
| MC68360ZQ25VL |
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Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU M683XX 25MHZ 357BGA
Additional Interfaces: SCC, SMC, SPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: CPU32+
Operating Temperature: 0°C ~ 70°C (TA)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| P1017NSE5CFB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| SPC5606SF2CLU6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 136
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 48K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
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| NT2H1511G0DUDZ |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
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| NT2H1511G0DUDV |
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Виробник: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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| ON5088,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Tape & Reel (TR)
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| ON5088,115 |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Cut Tape (CT)
Description: RF TRANS NPN 10V 55GHZ 4DFP
Supplier Device Package: 4-DFP
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Frequency - Transition: 55GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Voltage - Collector Emitter Breakdown (Max): 10V
Current - Collector (Ic) (Max): 40mA
Power - Max: 136mW
Gain: 13dB
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-343F
Packaging: Cut Tape (CT)
на замовлення 1704 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11+ | 30.06 грн |
| 15+ | 21.56 грн |
| 25+ | 19.23 грн |
| 100+ | 15.34 грн |
| 250+ | 13.86 грн |
| 500+ | 12.91 грн |
| 1000+ | 11.86 грн |
| LPC11U14FET48/201, |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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| PR5331C3HN/C350,55 |
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Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -30°C ~ 85°C
Type: RFID Reader
Interface: I2C, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: IC RFID READER 13.56MHZ 40HVQFN
Supplier Device Package: 40-HVQFN (6x6)
Standards: FeliCa, ISO 14443, MIFARE, NFC
Voltage - Supply: 2.5V ~ 3.6V
Operating Temperature: -30°C ~ 85°C
Type: RFID Reader
Interface: I2C, UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
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| MCF51EM128CLL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
на замовлення 2324 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 653.15 грн |
| MCF51EM128CLL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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| MVR5510AVMANEP |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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| MCXC144VFT |
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Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
на замовлення 1150 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 237.35 грн |
| 10+ | 175.99 грн |
| 25+ | 163.71 грн |
| 100+ | 134.67 грн |
| 250+ | 129.09 грн |
| 500+ | 116.41 грн |
| MPC8245LZU350D |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 350MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Description: IC MPU MPC82XX 350MHZ 352TBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 350MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
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| S9S08SL16F1VTL |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 28-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
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| MC9S08AC8MFDE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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| MC33FS8510A0KS |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
Description: SAFETY POWER MANAGEMENT IC, QFN5
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Applications: System Basis Chip
Voltage - Supply: 60V
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| S912ZVL96AVFM |
Виробник: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
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| MFS2630AMBA0AD |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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| S32K310NHT0MLFST |
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Виробник: NXP USA Inc.
Description: S32K310NHT0MLFST
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Description: S32K310NHT0MLFST
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Qualification: AEC-Q100
Number of I/O: 42
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
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| S32K310NHT0MPAST |
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Виробник: NXP USA Inc.
Description: S32K310NHT0MPAST
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Description: S32K310NHT0MPAST
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-MaxQFP (10x10)
Peripherals: DMA, I2S, WDT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-QFP
Packaging: Tray
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
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| MMA5224KW |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tube
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (LSB/g): 2
Supplier Device Package: 16-QFN (6x6)
Voltage - Supply: 4.2V ~ 17V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±240g
Axis: X
Type: Digital
Mounting Type: Surface Mount
Output Type: PCM, SPI
Package / Case: 16-QFN Exposed Pad
Features: Selectable Low Pass Filter
Packaging: Tube
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| MC9S08QE96CFT |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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| S32K314NHT1MPBSR |
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Виробник: NXP USA Inc.
Description: S32K314NHT1MPBSR
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Bulk
Description: S32K314NHT1MPBSR
Qualification: AEC-Q100
Number of I/O: 142
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Bulk
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| S32K314NHT1VPBSR |
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Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Qualification: AEC-Q100
Number of I/O: 218
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, Serial Audio, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Qualification: AEC-Q100
Number of I/O: 218
Grade: Automotive
Supplier Device Package: 172-QFP (16x16)
Peripherals: DMA, I2S, Serial Audio, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C
RAM Size: 512K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 172-QFP
Packaging: Tape & Reel (TR)
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| MCZ33903C5EK |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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| MMA1200KEG |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
Description: ACCELEROMETER 281G ANALOG 16SOIC
Packaging: Bulk
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: Z
Acceleration Range: ±281g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-SOIC
Sensitivity (mV/g): 8
на замовлення 7683 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 39+ | 510.62 грн |
| MMA1250EGR2 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 5G ANALOG 16SOIC
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
Description: ACCELEROMETER 5G ANALOG 16SOIC
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 400
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±5g
Axis: Z
Type: Analog
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| MMA1270KEG |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Qualification: AEC-Q100
Description: ACCELEROMETER 2.5G ANALOG 16SOIC
Grade: Automotive
Sensitivity (mV/g): 750
Supplier Device Package: 16-SOIC
Bandwidth: 50Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±2.5g
Axis: Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Qualification: AEC-Q100
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| TEA1999DB1504UL |
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Виробник: NXP USA Inc.
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
Description: TEA1999 DEMOBOARD 1504
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TEA1999
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| MPC860SRCZQ50D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (4)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
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| MFS2613AMDHKAD |
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Виробник: NXP USA Inc.
Description: System Basis Chip ASIL-D LQFP-48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 36V
Description: System Basis Chip ASIL-D LQFP-48
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Voltage - Supply: 3.2V ~ 36V
на замовлення 75 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 592.58 грн |
| 10+ | 442.95 грн |
| 25+ | 411.13 грн |
| MFS8416AMBP5ESR2 |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MFS8416AMBP5ES |
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Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MC33FS6523NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
на замовлення 250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 608.40 грн |
| 10+ | 456.81 грн |
| 25+ | 424.63 грн |
| 80+ | 378.72 грн |
| MCIMX6G3DVK05AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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