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MCF52110CAF80 MCF52110CAF80 NXP USA Inc. PHGL-S-A0002794573-1.pdf?t.download=true&u=5oefqw Description: RISC MICROCONTROLLER, 32-BIT, FL
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
на замовлення 473 шт:
термін постачання 21-31 дні (днів)
31+706.35 грн
Мінімальне замовлення: 31
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S9S12G48J1VLC NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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FD32K146HAT0VLHT NXP USA Inc. Description: S32K146 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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SAF776D/20S0000K NXP USA Inc. Description: SAF776D/20S0000
Packaging: Tray
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MC705C8ACFBE MC705C8ACFBE NXP USA Inc. Description: IC MCU 8BIT 8KB OTP 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 304 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
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74LVC1GU04GF,132 74LVC1GU04GF,132 NXP USA Inc. PHGLS27066-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
на замовлення 189970 шт:
термін постачання 21-31 дні (днів)
3129+7.57 грн
Мінімальне замовлення: 3129
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MC7448VU1400ND MC7448VU1400ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7457RX867NC MC7457RX867NC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 867MHZ 483FCCBGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 867MHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCCBGA
Packaging: Tray
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
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MC7457VG1000LC MC7457VG1000LC NXP USA Inc. MPC7457.pdf Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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KMC7448THX1400ND KMC7448THX1400ND NXP USA Inc. MPC7448ECS02AD.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VU867ND MC7448VU867ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VU1700LD MC7448VU1700LD NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.7GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
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MC7448VU1600LD MC7448VU1600LD NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
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MC7448VU1000LD MC7448VU1000LD NXP USA Inc. MPC7448EC.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
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MC7448VS1400ND MC7448VS1400ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.4GHZ 360FCCLGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCLGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-CLGA, FCCLGA
Packaging: Tray
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MC7448HX1000ND MC7448HX1000ND NXP USA Inc. MPC7448ECS01AD.pdf Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MIMXRT1181JVP2B NXP USA Inc. Description: IC MCU
Packaging: Tray
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MIMXRT1182JVP2B NXP USA Inc. Description: IC MCU
Packaging: Tray
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MFS2633AMBA0ADR2 NXP USA Inc. PB_FS26.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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P1011NXE2DFB P1011NXE2DFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU 533MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1011NXN2DFB P1011NXN2DFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
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KITPF5300FRDMEVM NXP USA Inc. UM11890.pdf Description: EVAL BOARD FOR MPF5302AMBA0ES
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Contents: Board(s)
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+13172.86 грн
В кошику  од. на суму  грн.
MF3D4301DUD/00Z NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3D4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
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MF3DH4301DUD/00Z NXP USA Inc. MF3D_H_X3_SDS.pdf Description: MF3DH4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
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MKE04Z8VFK4R MKE04Z8VFK4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
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MKE04Z8VFK4R MKE04Z8VFK4R NXP USA Inc. MKE04P24M48SF0.pdf Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 4759 шт:
термін постачання 21-31 дні (днів)
3+141.62 грн
10+100.72 грн
25+91.76 грн
100+76.89 грн
250+72.48 грн
500+69.83 грн
1000+67.54 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC33FS6503NAE MC33FS6503NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+836.26 грн
10+565.61 грн
25+503.80 грн
80+416.87 грн
230+379.13 грн
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BATT-TPLCABLE50 NXP USA Inc. Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
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BATT-TPLCABLE20 NXP USA Inc. Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
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MC33FS6515CAE MC33FS6515CAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 210 шт:
термін постачання 21-31 дні (днів)
1+568.85 грн
10+424.05 грн
25+393.12 грн
100+337.02 грн
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MC56F81768MLH MC56F81768MLH NXP USA Inc. MC56F81XXX.pdf Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MPC8241LZQ200D MPC8241LZQ200D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 200MHZ 357BGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
1+3527.00 грн
10+2783.15 грн
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MPC8248ZQMIBA MPC8248ZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8247CZQMIBA MPC8247CZQMIBA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 266MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+4021.48 грн
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MC9S08DZ16AMLF MC9S08DZ16AMLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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BUK9506-40B,127 NXP USA Inc. Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
на замовлення 5318 шт:
термін постачання 21-31 дні (днів)
579+36.95 грн
Мінімальне замовлення: 579
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FS32K148UIT0VLQR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
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8MPNAVQ-8GB-XG 8MPNAVQ-8GB-XG NXP USA Inc. 8MPNAVQQSG.pdf Description: DEV KIT
Core Processor: ARM® Cortex®-A53
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: i.MX 8M Plus
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MC9328MXLVP20R2 MC9328MXLVP20R2 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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K32W061Y K32W061Y NXP USA Inc. K32W061.pdf Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
1+751.60 грн
10+559.89 грн
25+511.39 грн
100+424.46 грн
250+395.28 грн
500+376.50 грн
1000+354.27 грн
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PCF2120TK/1,118 PCF2120TK/1,118 NXP USA Inc. PCF2120.pdf Description: IC OSC XTAL 32KHZ 10-HVSON
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 32kHz
Type: Oscillator, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Supplier Device Package: 10-HVSON (3x3)
Current - Supply: 1.39 µA
на замовлення 10953 шт:
термін постачання 21-31 дні (днів)
289+75.90 грн
Мінімальне замовлення: 289
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MC9S08SH8MTJR MC9S08SH8MTJR NXP USA Inc. MC9S08SH32.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
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LD6806F/25P,115 LD6806F/25P,115 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 2.5V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
2219+10.54 грн
Мінімальне замовлення: 2219
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MC35FS6518CAE MC35FS6518CAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+819.64 грн
10+618.55 грн
25+575.91 грн
100+496.47 грн
250+475.48 грн
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SCVBBK77CWA NXP USA Inc. Description: NXP LEAD FREE MPC5777C 416 PIN 1
Packaging: Bulk
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P1015NSN5FFB P1015NSN5FFB NXP USA Inc. QP1024FS.pdf Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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P1015NXN5FFB P1015NXN5FFB NXP USA Inc. QP1024FS.pdf Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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P1016NXN5FFB P1016NXN5FFB NXP USA Inc. Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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S32K396EHT1MKUST S32K396EHT1MKUST NXP USA Inc. S32K39%2C%20S32K37.pdf Description: S32K396 Arm Cortex-M7
Packaging: Tray
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+3513.55 грн
10+2607.47 грн
25+2409.28 грн
200+2060.63 грн
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S32K3X8EVB-Q289 S32K3X8EVB-Q289 NXP USA Inc. S32K3xx.pdf Description: EVAL BOARD S32K3X8
Packaging: Box
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S32K310NHT0VLFSR S32K310NHT0VLFSR NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0VLFSR
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K310NHT0VLFST S32K310NHT0VLFST NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K311NHT0VPASR S32K311NHT0VPASR NXP USA Inc. S32K3xx.pdf Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K311NHT0MPAIR S32K311NHT0MPAIR NXP USA Inc. S32K3xx.pdf Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K312NHT0MPAIR S32K312NHT0MPAIR NXP USA Inc. S32K3xx.pdf Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K312NHT0MPASR S32K312NHT0MPASR NXP USA Inc. S32K3xx.pdf Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K394EHT1MJBSR S32K394EHT1MJBSR NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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S32K394NHT1MJBST S32K394NHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394NHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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S32K394EHT1MJBST S32K394EHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K394EHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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S32K396NHT1MJBST S32K396NHT1MJBST NXP USA Inc. S32K39-S32K37-DS.pdf Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
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MCF52110CAF80 PHGL-S-A0002794573-1.pdf?t.download=true&u=5oefqw
MCF52110CAF80
Виробник: NXP USA Inc.
Description: RISC MICROCONTROLLER, 32-BIT, FL
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
на замовлення 473 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
31+706.35 грн
Мінімальне замовлення: 31
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S9S12G48J1VLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: S12
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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FD32K146HAT0VLHT
Виробник: NXP USA Inc.
Description: S32K146 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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SAF776D/20S0000K
Виробник: NXP USA Inc.
Description: SAF776D/20S0000
Packaging: Tray
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MC705C8ACFBE
MC705C8ACFBE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Supplier Device Package: 44-QFP (10x10)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC05
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 304 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
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74LVC1GU04GF,132 PHGLS27066-1.pdf?t.download=true&u=5oefqw
74LVC1GU04GF,132
Виробник: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1x1)
Input Logic Level - High: 1.32V ~ 4.4V
Input Logic Level - Low: 0.33V ~ 1.1V
Max Propagation Delay @ V, Max CL: 4ns @ 5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 4 µA
на замовлення 189970 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3129+7.57 грн
Мінімальне замовлення: 3129
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MC7448VU1400ND MPC7448ECS01AD.pdf
MC7448VU1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7457RX867NC MPC7457.pdf
MC7457RX867NC
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 483FCCBGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 867MHz
Mounting Type: Surface Mount
Package / Case: 483-BCBGA, FCCBGA
Packaging: Tray
Supplier Device Package: 483-FCCBGA (29x29)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
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MC7457VG1000LC MPC7457.pdf
MC7457VG1000LC
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 483FCCBGA
Packaging: Tray
Package / Case: 483-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 483-FCCBGA (29x29)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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KMC7448THX1400ND MPC7448ECS02AD.pdf
KMC7448THX1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VU867ND MPC7448ECS01AD.pdf
MC7448VU867ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 867MHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-CBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 867MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC7448VU1700LD MPC7448EC.pdf
MC7448VU1700LD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.7GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.7GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
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MC7448VU1600LD MPC7448EC.pdf
MC7448VU1600LD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.6GHZ 360FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
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MC7448VU1000LD MPC7448EC.pdf
MC7448VU1000LD
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 360-CBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCBGA (25x25)
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MC7448VS1400ND MPC7448ECS01AD.pdf
MC7448VS1400ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.4GHZ 360FCCLGA
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-FCCLGA (25x25)
Voltage - I/O: 1.5V, 1.8V, 2.5V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 360-CLGA, FCCLGA
Packaging: Tray
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MC7448HX1000ND MPC7448ECS01AD.pdf
MC7448HX1000ND
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.0GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MIMXRT1181JVP2B
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
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MIMXRT1182JVP2B
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
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MFS2633AMBA0ADR2 PB_FS26.pdf
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 29µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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P1011NXE2DFB QorIQ_P1.pdf
P1011NXE2DFB
Виробник: NXP USA Inc.
Description: IC MPU 533MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1011NXN2DFB QorIQ_P1.pdf
P1011NXN2DFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
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KITPF5300FRDMEVM UM11890.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MPF5302AMBA0ES
Packaging: Box
Voltage - Input: 2.7V ~ 5.5V
Current - Output: 15A
Contents: Board(s)
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: MPF5302AMBA0ES
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+13172.86 грн
В кошику  од. на суму  грн.
MF3D4301DUD/00Z MF3D_H_X3_SDS.pdf
Виробник: NXP USA Inc.
Description: MF3D4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
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MF3DH4301DUD/00Z MF3D_H_X3_SDS.pdf
Виробник: NXP USA Inc.
Description: MF3DH4301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
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MKE04Z8VFK4R MKE04P24M48SF0.pdf
MKE04Z8VFK4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
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MKE04Z8VFK4R MKE04P24M48SF0.pdf
MKE04Z8VFK4R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 4759 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+141.62 грн
10+100.72 грн
25+91.76 грн
100+76.89 грн
250+72.48 грн
500+69.83 грн
1000+67.54 грн
Мінімальне замовлення: 3
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MC33FS6503NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6503NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+836.26 грн
10+565.61 грн
25+503.80 грн
80+416.87 грн
230+379.13 грн
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BATT-TPLCABLE50
Виробник: NXP USA Inc.
Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
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BATT-TPLCABLE20
Виробник: NXP USA Inc.
Description: ELECTRICAL TRANSPORT PROTOCOL LI
Packaging: Bulk
Accessory Type: Cable
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MC33FS6515CAE FS6500-FS4500-ASILD.pdf
MC33FS6515CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 210 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+568.85 грн
10+424.05 грн
25+393.12 грн
100+337.02 грн
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MC56F81768MLH MC56F81XXX.pdf
MC56F81768MLH
Виробник: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 128KB
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MPC8241LZQ200D MPC8241.pdf
MPC8241LZQ200D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 357BGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3527.00 грн
10+2783.15 грн
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MPC8248ZQMIBA MPC8272EC.pdf
MPC8248ZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MPC8247CZQMIBA MPC8272EC.pdf
MPC8247CZQMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4021.48 грн
В кошику  од. на суму  грн.
MC9S08DZ16AMLF MC9S08DZ60.pdf
MC9S08DZ16AMLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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BUK9506-40B,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 75A TO220AB
Packaging: Tube
на замовлення 5318 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
579+36.95 грн
Мінімальне замовлення: 579
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FS32K148UIT0VLQR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
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8MPNAVQ-8GB-XG 8MPNAVQQSG.pdf
8MPNAVQ-8GB-XG
Виробник: NXP USA Inc.
Description: DEV KIT
Core Processor: ARM® Cortex®-A53
Contents: Board(s)
Type: MPU
Mounting Type: Fixed
Packaging: Bulk
Utilized IC / Part: i.MX 8M Plus
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MC9328MXLVP20R2 MC9328MXL.pdf
MC9328MXLVP20R2
Виробник: NXP USA Inc.
Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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K32W061Y K32W061.pdf
K32W061Y
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+751.60 грн
10+559.89 грн
25+511.39 грн
100+424.46 грн
250+395.28 грн
500+376.50 грн
1000+354.27 грн
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PCF2120TK/1,118 PCF2120.pdf
PCF2120TK/1,118
Виробник: NXP USA Inc.
Description: IC OSC XTAL 32KHZ 10-HVSON
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 32kHz
Type: Oscillator, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Supplier Device Package: 10-HVSON (3x3)
Current - Supply: 1.39 µA
на замовлення 10953 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
289+75.90 грн
Мінімальне замовлення: 289
В кошику  од. на суму  грн.
MC9S08SH8MTJR MC9S08SH32.pdf
MC9S08SH8MTJR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
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LD6806F/25P,115 LD6806_Series.pdf
LD6806F/25P,115
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 6XSON
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.13V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 2.5V
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2219+10.54 грн
Мінімальне замовлення: 2219
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MC35FS6518CAE FS6500-FS4500-ASILD.pdf
MC35FS6518CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+819.64 грн
10+618.55 грн
25+575.91 грн
100+496.47 грн
250+475.48 грн
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SCVBBK77CWA
Виробник: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C 416 PIN 1
Packaging: Bulk
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P1015NSN5FFB QP1024FS.pdf
P1015NSN5FFB
Виробник: NXP USA Inc.
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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P1015NXN5FFB QP1024FS.pdf
P1015NXN5FFB
Виробник: NXP USA Inc.
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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P1016NXN5FFB
P1016NXN5FFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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S32K396EHT1MKUST S32K39%2C%20S32K37.pdf
S32K396EHT1MKUST
Виробник: NXP USA Inc.
Description: S32K396 Arm Cortex-M7
Packaging: Tray
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3513.55 грн
10+2607.47 грн
25+2409.28 грн
200+2060.63 грн
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S32K3X8EVB-Q289 S32K3xx.pdf
S32K3X8EVB-Q289
Виробник: NXP USA Inc.
Description: EVAL BOARD S32K3X8
Packaging: Box
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S32K310NHT0VLFSR S32K3xx.pdf
S32K310NHT0VLFSR
Виробник: NXP USA Inc.
Description: S32K310NHT0VLFSR
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K310NHT0VLFST S32K3xx.pdf
S32K310NHT0VLFST
Виробник: NXP USA Inc.
Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K311NHT0VPASR S32K3xx.pdf
S32K311NHT0VPASR
Виробник: NXP USA Inc.
Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K311NHT0MPAIR S32K3xx.pdf
S32K311NHT0MPAIR
Виробник: NXP USA Inc.
Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K312NHT0MPAIR S32K3xx.pdf
S32K312NHT0MPAIR
Виробник: NXP USA Inc.
Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K312NHT0MPASR S32K3xx.pdf
S32K312NHT0MPASR
Виробник: NXP USA Inc.
Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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S32K394EHT1MJBSR S32K39-S32K37-DS.pdf
S32K394EHT1MJBSR
Виробник: NXP USA Inc.
Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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S32K394NHT1MJBST S32K39-S32K37-DS.pdf
S32K394NHT1MJBST
Виробник: NXP USA Inc.
Description: S32K394NHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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S32K394EHT1MJBST S32K39-S32K37-DS.pdf
S32K394EHT1MJBST
Виробник: NXP USA Inc.
Description: S32K394EHT1MJBST
Qualification: AEC-Q100
Number of I/O: 209
Grade: Automotive
Supplier Device Package: 289-LFBGA (14x14)
Peripherals: DMA, I2S, WDT
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Quad-Core
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Processor: ARM® Cortex®-M7
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 800K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 320MHz
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Packaging: Tray
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S32K396NHT1MJBST S32K39-S32K37-DS.pdf
S32K396NHT1MJBST
Виробник: NXP USA Inc.
Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
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