Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35863) > Сторінка 551 з 598
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| NAFE13188B40BSMP | NXP USA Inc. |
Description: ICPackaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| NAFE13188B40BSMP | NXP USA Inc. |
Description: ICPackaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PEMI2QFN/CK,115 | NXP USA Inc. |
Description: FILTER RC(PI) 20 OHM/13.5PF SMDPackaging: Bulk Package / Case: 6-XFDFN Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 10dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Number of Channels: 2 |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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| AFSC5G35E37T2 | NXP USA Inc. |
Description: 10X6 MODULE Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 26-HLQFN (10x6) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| RD9Z1-638BJBEVM | NXP USA Inc. |
Description: RD9Z1-638BJBEVMPackaging: Bulk Function: Battery Monitor Type: Power Management Utilized IC / Part: MM9Z1_638 Supplied Contents: Board(s), Accessories Primary Attributes: 5V ~ 12V Supply Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| T1023NSE7KQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 525FCPBGAPackaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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LS1088AXN7PTA | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FBGAPackaging: Bulk Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
на замовлення 1273 шт: термін постачання 21-31 дні (днів) |
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MPC8377EVRALGA | NXP USA Inc. |
Description: IC MPU MPC83XX 667MHZ PBGA689Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
товару немає в наявності |
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| MRFE6S9135HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI880SPackaging: Tape & Reel (TR) Package / Case: NI-880S Mounting Type: Surface Mount Frequency: 940MHz Power - Output: 39W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-880S Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1 A |
товару немає в наявності |
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MCIMX6X3EVO10AB | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
товару немає в наявності |
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MGD3160AM318EK | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 32SOICPackaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 40V Input Type: Non-Inverting Supplier Device Package: 32-SOIC Channel Type: Single Driven Configuration: High-Side Number of Drivers: 1 Gate Type: IGBT, SiC MOSFET Current - Peak Output (Source, Sink): 15A, 15A Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
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S912ZVHL32F1CLQ | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| SAF4000EL/101Z233K | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| FB32K148UJT0VMHT | NXP USA Inc. |
Description: S32K148 100 MAPBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MKE17Z512VLH9 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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MKE17Z512VLL9 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 105°C (TA) Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 |
на замовлення 398 шт: термін постачання 21-31 дні (днів) |
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MCF52258VN80 | NXP USA Inc. |
Description: IC MCU 32B 512KB FLASH 144MAPBGAPackaging: Tray Package / Case: 144-LBGA Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V2 Data Converters: A/D 8x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 144-MAPBGA (13x13) Number of I/O: 96 DigiKey Programmable: Not Verified |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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PCA9958HNY | NXP USA Inc. |
Description: PCA9958HNYPackaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Outputs: 24 Frequency: 31.25kHz Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Applications: General Purpose Current - Output / Channel: 63mA Internal Switch(s): No Topology: Constant Current Supplier Device Package: 40-HVQFN (6x6) Dimming: PWM, SPI Voltage - Supply (Min): 2.7V Voltage - Supply (Max): 5.5V |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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74LVT126DB,118 | NXP USA Inc. |
Description: IC BUFF TRI-ST QD N-INV 14SSOPPackaging: Bulk |
на замовлення 18000 шт: термін постачання 21-31 дні (днів) |
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74LVT16373ADGG,518 | NXP USA Inc. |
Description: BUS DRIVERPackaging: Bulk Package / Case: 48-TFSOP (0.240", 6.10mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.7V ~ 3.6V Independent Circuits: 2 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 2.1ns Supplier Device Package: 48-TSSOP |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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S9S12XS64J1VAE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| MF3DH2301DUD/00Z | NXP USA Inc. |
Description: MF3DH2301DUDPackaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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BY459X-1500,127 | NXP USA Inc. |
Description: DIODE STANDARD 1500V 12A TO220FPPackaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 350 ns Technology: Standard Current - Average Rectified (Io): 12A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 1500 V Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A Current - Reverse Leakage @ Vr: 250 µA @ 1300 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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BY459X-1500S,127 | NXP USA Inc. |
Description: DIODE STANDARD 1500V 10A TO220FPPackaging: Tube Package / Case: TO-220-2 Full Pack Mounting Type: Through Hole Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 220 ns Technology: Standard Current - Average Rectified (Io): 10A Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max) Voltage - DC Reverse (Vr) (Max): 1500 V Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A Current - Reverse Leakage @ Vr: 250 µA @ 1300 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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FS32K148UGT0VLQR | NXP USA Inc. |
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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SVF312R3K2CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 266MHZ 176HLQFPPackaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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SVF321R3K2CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 176HLQFPPackaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: No Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MVF50NS151CMK40 | NXP USA Inc. |
Description: IC MPU VYBRID 400MHZ 364LFBGAPackaging: Tray Package / Case: 364-LFBGA Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 364-LFBGA (17x17) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MVF30NN151CKU26 | NXP USA Inc. |
Description: IC MPU VYBRID 266MHZ 176HLQFPPackaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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SVF332R3K1CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 176HLQFPPackaging: Bulk Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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SVF332R3K1CKU2 | NXP USA Inc. |
Description: IC MPU VYBRID 133MHZ 176HLQFPPackaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 266MHz, 133MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM® Cortex®-A5 + Cortex®-M4 Voltage - I/O: 3.3V Supplier Device Package: 176-HLQFP (24x24) Ethernet: 10/100Mbps (2) USB: USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DRAM Graphics Acceleration: Yes Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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BGS8U5X | NXP USA Inc. |
Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSONPackaging: Tape & Reel (TR) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 3.4GHz ~ 3.8GHz RF Type: Cellular, LTE Voltage - Supply: 1.5V ~ 3.1V Gain: 15.5dB Current - Supply: 4.5mA Noise Figure: 1dB P1dB: 11dBm Supplier Device Package: 6-XSON (1.1x0.7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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74LVT273DB,118 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20SSOPPackaging: Tape & Reel (TR) Package / Case: 20-SSOP (0.209", 5.30mm Width) Output Type: Non-Inverted Mounting Type: Surface Mount Number of Elements: 1 Function: Master Reset Type: D-Type Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Current - Quiescent (Iq): 190 µA Current - Output High, Low: 32mA, 64mA Trigger Type: Positive Edge Clock Frequency: 150 MHz Input Capacitance: 4 pF Supplier Device Package: 20-SSOP Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MC33PF8100EQES | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QMPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
на замовлення 278 шт: термін постачання 21-31 дні (днів) |
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BUK7E2R7-30B,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 75A I2PAKPackaging: Tube Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V Power Dissipation (Max): 300W (Tc) Vgs(th) (Max) @ Id: 4V @ 1mA Supplier Device Package: I2PAK Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| BUK663R5-55C,118 | NXP USA Inc. |
Description: MOSFET N-CH 55V 120A D2PAKPackaging: Bulk |
на замовлення 1589 шт: термін постачання 21-31 дні (днів) |
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MKL24Z32VLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 50 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MCF51AC256BCLKE | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 69 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| OM6733J | NXP USA Inc. |
Description: DUMMY MODULE Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| OM6736/NXD61P-FJAJ | NXP USA Inc. |
Description: 6-PIN DIF MODULE NXD6.1 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MC34825EPR2 | NXP USA Inc. |
Description: MICRO-USB INTERFACE IC, UNIVERSAPackaging: Bulk DigiKey Programmable: Not Verified |
на замовлення 4600 шт: термін постачання 21-31 дні (днів) |
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S9S12G240F0MLL | NXP USA Inc. |
Description: IC MCU 16BIT 240KB FLASH 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 240KB (240K x 8) RAM Size: 11K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: 12V1 Data Converters: A/D 16x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PNEV5190MB | NXP USA Inc. |
Description: EVAL BOARD FOR PN5190Packaging: Bulk Type: Near Field Communication (NFC) Contents: Board(s) Utilized IC / Part: PN5190 Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MCIMX6Z0DVM09ABR | NXP USA Inc. |
Description: I.MX6ULZ, 289MAPBGAPackaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 900MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Supplier Device Package: 289-MAPBGA (14x14) USB: USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: Keypad Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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SA56004ETK,118 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8HVSONFeatures: Output Switch, Programmable Limit Packaging: Bulk Package / Case: 8-VDFN Exposed Pad Output Type: I2C/SMBus Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 3V ~ 5.5V Sensor Type: Digital, Local/Remote Resolution: 10 b Supplier Device Package: 8-HVSON (3x3) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Accuracy - Highest (Lowest): ±2°C (±3°C) Sensing Temperature - Local: -40°C ~ 125°C Sensing Temperature - Remote: -40°C ~ 125°C |
на замовлення 1710 шт: термін постачання 21-31 дні (днів) |
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| A3V07H600-2STG | NXP USA Inc. |
Description: RF REFERENCE CIRCUIT 600W 758-80 Packaging: Bulk Supplied Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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PDTA143XM,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 250MW SOT883Packaging: Bulk |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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MK10DX64VMC7 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLSH 121MAPBGAPackaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 39x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 74 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| PCA8546BTT/AY | NXP USA Inc. |
Description: 4 X 44 AUTOMOTIVE LCD DRIVER Packaging: Tape & Reel (TR) Package / Case: 56-TFSOP (0.240", 6.10mm Width) Display Type: LCD Mounting Type: Surface Mount Interface: SPI Configuration: 176 Segment Operating Temperature: -40°C ~ 95°C (TA) Voltage - Supply: 1.8V ~ 5.5V Digits or Characters: 11 Characters, 22 Characters, 176 Elements Supplier Device Package: 56-TSSOP Grade: Automotive Current - Supply: 30 µA Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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MIMX8QM6AVUFFABR | NXP USA Inc. |
Description: I.MX 8QUADMAXPackaging: Tape & Reel (TR) Package / Case: 1313-BFBGA Mounting Type: Surface Mount Speed: 1.6GHz, 1.2GHz, 264MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 1313-BGA (29x29) Ethernet: 1Gbps (2) USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1) Number of Cores/Bus Width: 8 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS Additional Interfaces: CANbus, I2C, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
| BUK9507-30B,127 | NXP USA Inc. |
Description: MOSFET N-CH 30V 75A TO220AB Packaging: Tube |
на замовлення 11973 шт: термін постачання 21-31 дні (днів) |
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| MFS2320BMMA0EPR2 | NXP USA Inc. |
Description: ICPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
| MFS2320BMMA0EP | NXP USA Inc. |
Description: ICPackaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
|
74AHCT08D,112 | NXP USA Inc. |
Description: IC GATE AND 4CH 2-INP 14-SOPackaging: Bulk |
на замовлення 23129 шт: термін постачання 21-31 дні (днів) |
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MC33VR5500V1ES | NXP USA Inc. |
Description: VR5500Packaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: Switching Regulator Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) |
на замовлення 240 шт: термін постачання 21-31 дні (днів) |
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MPC855TVR50D4 | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITECPackaging: Bulk Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 11039 шт: термін постачання 21-31 дні (днів) |
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| MPC855TCVR50D4-NXP | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITEC Packaging: Bulk |
на замовлення 1758 шт: термін постачання 21-31 дні (днів) |
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MPC875VR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGAPackaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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MPC860TVR66D4 | NXP USA Inc. |
Description: POWERQUICC 32 BIT POWER ARCHITECPackaging: Bulk |
на замовлення 91 шт: термін постачання 21-31 дні (днів) |
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MPC860DPVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. |
| NAFE13188B40BSMP |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
товару немає в наявності
В кошику
од. на суму грн.
| NAFE13188B40BSMP |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
товару немає в наявності
В кошику
од. на суму грн.
| PEMI2QFN/CK,115 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3806+ | 6.18 грн |
| AFSC5G35E37T2 |
Виробник: NXP USA Inc.
Description: 10X6 MODULE
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Description: 10X6 MODULE
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
товару немає в наявності
В кошику
од. на суму грн.
| RD9Z1-638BJBEVM |
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Виробник: NXP USA Inc.
Description: RD9Z1-638BJBEVM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: MM9Z1_638
Supplied Contents: Board(s), Accessories
Primary Attributes: 5V ~ 12V Supply
Embedded: No
Description: RD9Z1-638BJBEVM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: MM9Z1_638
Supplied Contents: Board(s), Accessories
Primary Attributes: 5V ~ 12V Supply
Embedded: No
товару немає в наявності
В кошику
од. на суму грн.
| T1023NSE7KQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| LS1088AXN7PTA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
на замовлення 1273 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 14069.85 грн |
| MPC8377EVRALGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
товару немає в наявності
В кошику
од. на суму грн.
| MRFE6S9135HSR3 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 39W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 39W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1 A
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX6X3EVO10AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MGD3160AM318EK |
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Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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| S912ZVHL32F1CLQ |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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| MKE17Z512VLH9 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Description: IC MCU 32BIT 512KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 467.02 грн |
| 10+ | 334.98 грн |
| 25+ | 310.92 грн |
| 100+ | 274.65 грн |
| MKE17Z512VLL9 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
на замовлення 398 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 386.70 грн |
| 10+ | 301.41 грн |
| 25+ | 291.33 грн |
| 100+ | 265.73 грн |
| MCF52258VN80 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1380.36 грн |
| 10+ | 1064.67 грн |
| 25+ | 998.64 грн |
| 100+ | 930.13 грн |
| PCA9958HNY |
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Виробник: NXP USA Inc.
Description: PCA9958HNY
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 24
Frequency: 31.25kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Current - Output / Channel: 63mA
Internal Switch(s): No
Topology: Constant Current
Supplier Device Package: 40-HVQFN (6x6)
Dimming: PWM, SPI
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
Description: PCA9958HNY
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 24
Frequency: 31.25kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Current - Output / Channel: 63mA
Internal Switch(s): No
Topology: Constant Current
Supplier Device Package: 40-HVQFN (6x6)
Dimming: PWM, SPI
Voltage - Supply (Min): 2.7V
Voltage - Supply (Max): 5.5V
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4000+ | 103.89 грн |
| 74LVT126DB,118 |
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на замовлення 18000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1448+ | 16.21 грн |
| 74LVT16373ADGG,518 |
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Виробник: NXP USA Inc.
Description: BUS DRIVER
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-TSSOP
Description: BUS DRIVER
Packaging: Bulk
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 3.6V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2.1ns
Supplier Device Package: 48-TSSOP
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 807+ | 28.57 грн |
| S9S12XS64J1VAE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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| MF3DH2301DUD/00Z |
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Виробник: NXP USA Inc.
Description: MF3DH2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
Description: MF3DH2301DUD
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: Wafer
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| BY459X-1500,127 |
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Виробник: NXP USA Inc.
Description: DIODE STANDARD 1500V 12A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Description: DIODE STANDARD 1500V 12A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 350 ns
Technology: Standard
Current - Average Rectified (Io): 12A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
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| BY459X-1500S,127 |
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Виробник: NXP USA Inc.
Description: DIODE STANDARD 1500V 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 220 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
Description: DIODE STANDARD 1500V 10A TO220FP
Packaging: Tube
Package / Case: TO-220-2 Full Pack
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 220 ns
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 1500 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 6.5 A
Current - Reverse Leakage @ Vr: 250 µA @ 1300 V
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| FS32K148UGT0VLQR |
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Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
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| SVF312R3K2CKU2 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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| SVF321R3K2CKU2 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: No
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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| MVF50NS151CMK40 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 400MHZ 364LFBGA
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 364-LFBGA (17x17)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
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| MVF30NN151CKU26 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 266MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Additional Interfaces: CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2593.46 грн |
| 10+ | 2030.78 грн |
| SVF332R3K1CKU2 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Bulk
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2398.29 грн |
| SVF332R3K1CKU2 |
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Виробник: NXP USA Inc.
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
Description: IC MPU VYBRID 133MHZ 176HLQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz, 133MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM® Cortex®-A5 + Cortex®-M4
Voltage - I/O: 3.3V
Supplier Device Package: 176-HLQFP (24x24)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DRAM
Graphics Acceleration: Yes
Display & Interface Controllers: DCU, GPU, LCD, VideoADC, VIU
Security Features: ARM TZ, Hashing, RNG, RTC, RTIC, Secure JTAG, SNVS, TZ ASC, TZ WDOG
Additional Interfaces: CAN, I2C, IrDA, LIN, MediaLB, SCI, SDHC, SPI, UART/USART
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| BGS8U5X |
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Виробник: NXP USA Inc.
Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.5mA
Noise Figure: 1dB
P1dB: 11dBm
Supplier Device Package: 6-XSON (1.1x0.7)
Description: IC AMP CELL 3.4GHZ-3.8GHZ 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
RF Type: Cellular, LTE
Voltage - Supply: 1.5V ~ 3.1V
Gain: 15.5dB
Current - Supply: 4.5mA
Noise Figure: 1dB
P1dB: 11dBm
Supplier Device Package: 6-XSON (1.1x0.7)
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| 74LVT273DB,118 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Number of Bits per Element: 8
Description: IC FF D-TYPE SNGL 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Current - Quiescent (Iq): 190 µA
Current - Output High, Low: 32mA, 64mA
Trigger Type: Positive Edge
Clock Frequency: 150 MHz
Input Capacitance: 4 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 5.5ns @ 3.3V, 50pF
Number of Bits per Element: 8
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| MC33PF8100EQES |
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Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
на замовлення 278 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 724.55 грн |
| 10+ | 544.69 грн |
| 25+ | 506.40 грн |
| 100+ | 435.77 грн |
| 260+ | 416.24 грн |
| BUK7E2R7-30B,127 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
Description: MOSFET N-CH 30V 75A I2PAK
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Rds On (Max) @ Id, Vgs: 2.7mOhm @ 25A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: I2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 91 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6212 pF @ 25 V
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| BUK663R5-55C,118 |
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на замовлення 1589 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 417+ | 55.59 грн |
| MKL24Z32VLH4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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| MCF51AC256BCLKE |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
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| MC34825EPR2 |
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Виробник: NXP USA Inc.
Description: MICRO-USB INTERFACE IC, UNIVERSA
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICRO-USB INTERFACE IC, UNIVERSA
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 4600 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 124+ | 172.36 грн |
| S9S12G240F0MLL |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 240KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 240KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 240KB (240K x 8)
RAM Size: 11K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
DigiKey Programmable: Not Verified
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| PNEV5190MB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
Description: EVAL BOARD FOR PN5190
Packaging: Bulk
Type: Near Field Communication (NFC)
Contents: Board(s)
Utilized IC / Part: PN5190
Supplied Contents: Board(s)
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| MCIMX6Z0DVM09ABR |
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Виробник: NXP USA Inc.
Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
Description: I.MX6ULZ, 289MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Supplier Device Package: 289-MAPBGA (14x14)
USB: USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: Keypad
Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
Additional Interfaces: eCSPI, ESAI, I2C, MMC/SD/SDIO, SAI, SPI, UART, USB
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| SA56004ETK,118 |
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Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
Description: SENSOR DIGITAL -40C-125C 8HVSON
Features: Output Switch, Programmable Limit
Packaging: Bulk
Package / Case: 8-VDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 5.5V
Sensor Type: Digital, Local/Remote
Resolution: 10 b
Supplier Device Package: 8-HVSON (3x3)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -40°C ~ 125°C
Sensing Temperature - Remote: -40°C ~ 125°C
на замовлення 1710 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 520+ | 44.30 грн |
| A3V07H600-2STG |
Виробник: NXP USA Inc.
Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
Description: RF REFERENCE CIRCUIT 600W 758-80
Packaging: Bulk
Supplied Contents: Board(s)
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| PDTA143XM,315 |
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на замовлення 20000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 9713+ | 2.29 грн |
| MK10DX64VMC7 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLSH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 39x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
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| PCA8546BTT/AY |
Виробник: NXP USA Inc.
Description: 4 X 44 AUTOMOTIVE LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
Description: 4 X 44 AUTOMOTIVE LCD DRIVER
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Display Type: LCD
Mounting Type: Surface Mount
Interface: SPI
Configuration: 176 Segment
Operating Temperature: -40°C ~ 95°C (TA)
Voltage - Supply: 1.8V ~ 5.5V
Digits or Characters: 11 Characters, 22 Characters, 176 Elements
Supplier Device Package: 56-TSSOP
Grade: Automotive
Current - Supply: 30 µA
Qualification: AEC-Q100
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| MIMX8QM6AVUFFABR |
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Виробник: NXP USA Inc.
Description: I.MX 8QUADMAX
Packaging: Tape & Reel (TR)
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
Description: I.MX 8QUADMAX
Packaging: Tape & Reel (TR)
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz, 1.2GHz, 264MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A72, ARM® Cortex®-M4F, ARM® Cortex®-A53
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1313-BGA (29x29)
Ethernet: 1Gbps (2)
USB: USB 2.0 + HSIC (1), USB 2.0 + PHY (1), USB 3.0 + PHY (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: DP, eDP, HDMI, LVDS, MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG, SNVS
Additional Interfaces: CANbus, I2C, SPI, UART
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В кошику
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| BUK9507-30B,127 |
на замовлення 11973 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 761+ | 29.71 грн |
| 74AHCT08D,112 |
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на замовлення 23129 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2674+ | 8.33 грн |
| MC33VR5500V1ES |
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Виробник: NXP USA Inc.
Description: VR5500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Switching Regulator
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Description: VR5500
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Switching Regulator
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
на замовлення 240 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 570.53 грн |
| 10+ | 424.29 грн |
| 25+ | 393.08 грн |
| 100+ | 336.68 грн |
| MPC855TVR50D4 |
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Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 11039 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 9904.89 грн |
| MPC855TCVR50D4-NXP |
на замовлення 1758 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 9904.89 грн |
| MPC875VR66 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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В кошику
од. на суму грн.
| MPC860TVR66D4 |
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на замовлення 91 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 14859.81 грн |
| MPC860DPVR66D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.






























