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TDA8020HL/C2,118 TDA8020HL/C2,118 NXP USA Inc. TDA8020HL.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
на замовлення 5649 шт:
термін постачання 21-31 дні (днів)
121+190.05 грн
Мінімальне замовлення: 121
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LFLAIBK77MWA NXP USA Inc. Description: MPC5777M 416 PIN 1.0 MM PGA LOGI
Packaging: Bulk
For Use With/Related Products: MPC5777M
Module/Board Type: Socket Module - PGA
Utilized IC / Part: MPC5777M
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SCBGARBQ1AO NXP USA Inc. Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
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LFVBBK77CZA NXP USA Inc. Description: QORIVVA MPC5777C 516 PIN 1.0MM V
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
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LFDAHT NXP USA Inc. Description: 100 PIN 0.5MM QFP ZIF SOCKET ADA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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FXLS90630AESR2 NXP USA Inc. FXLS9xxx0.pdf Description: Y SINGLE-AXIS HIGH-G INERTIAL S
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
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MFS8412AMBP7ESR2 MFS8412AMBP7ESR2 NXP USA Inc. FS84QFN48EP.pdf Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC56F8323VFBER NXP USA Inc. MC56F8323.pdf Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 27
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LFDAMT NXP USA Inc. Description: 160 PIN 0.65MM QFP ZIF SOCKET AD
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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MPC860PZQ50D4 MPC860PZQ50D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC860SRZQ66D4 MPC860SRZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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NT2H2421G0DUFZ NXP USA Inc. NT2H2421G0.pdf Description: NT2H2421G0DUF
Packaging: Tray
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NT2H2421G0DUDZ NXP USA Inc. NT2H2421G0.pdf Description: NT2H2421G0DUD
Packaging: Tray
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NT2H2421S0DUDZ NXP USA Inc. NT2H2421G0.pdf Description: NT2H2421S0DUD
Packaging: Tray
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MMA9553LR1 MMA9553LR1 NXP USA Inc. MMA955xL.pdf Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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MPC860TZQ66D4 MPC860TZQ66D4 NXP USA Inc. MPC860EC.pdf Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 509 шт:
термін постачання 21-31 дні (днів)
2+13382.19 грн
Мінімальне замовлення: 2
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mpc8360evvagdga mpc8360evvagdga NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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74LVC3G17GM,125 74LVC3G17GM,125 NXP USA Inc. PHGLS27084-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA 74LVC3G17GM - BUFFE
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XQFN (1.6x1.6)
на замовлення 87946 шт:
термін постачання 21-31 дні (днів)
2701+8.37 грн
Мінімальне замовлення: 2701
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S912XEQ512AMAL S912XEQ512AMAL NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MC33FS8430G2KSR2 MC33FS8430G2KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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SPC5604BACLQ6R NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
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MPC8536EBVJAULA MPC8536EBVJAULA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MKL26Z128VMC4 MKL26Z128VMC4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
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PN7221EV/C100K NXP USA Inc. PN7220.pdf Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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T1024NXN7KQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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LX2160SE72029B LX2160SE72029B NXP USA Inc. Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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MCF52221CAF66 MCF52221CAF66 NXP USA Inc. Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
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LS1043AXN8PQB LS1043AXN8PQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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T2080NXN8PTB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MPC8245LZU300D MPC8245LZU300D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 300MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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74AUP1G04GM,132 74AUP1G04GM,132 NXP USA Inc. PHGLS24869-1.pdf?t.download=true&u=5oefqw Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 118473 шт:
термін постачання 21-31 дні (днів)
3974+6.09 грн
Мінімальне замовлення: 3974
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74AUP1G04GX/S500125 74AUP1G04GX/S500125 NXP USA Inc. 74AUP1G04.pdf Description: IC INVERTER 1CH 1-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 5-X2SON (0.80x0.80)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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BYC58X-600,127 BYC58X-600,127 NXP USA Inc. BYC58X-600.pdf Description: DIODE 600V 8A TO-220F SOD113
Packaging: Bulk
на замовлення 640 шт:
термін постачання 21-31 дні (днів)
371+63.56 грн
Мінімальне замовлення: 371
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MF3D43C0DA8/00J NXP USA Inc. Description: MF3D43C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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NT2H1511G0DUFZ NXP USA Inc. Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
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FXLS93422AESR2 NXP USA Inc. FXLS9xxxx.pdf Description: PSI5 XZ DUAL-AXIS MEDIUM-G INER
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
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MRF9030LR1 MRF9030LR1 NXP USA Inc. MRF9030LR1.pdf Description: RF MOSFET LDMOS 26V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 945MHz
Power - Output: 30W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 250 mA
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MK21FX512VLQ12 MK21FX512VLQ12 NXP USA Inc. K21P121M120SF5V2.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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TJA1044DTK/0J TJA1044DTK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044DTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044BTK/0J TJA1044BTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ETK/0J TJA1044ETK/0J NXP USA Inc. TJA1044.pdf Description: TJA1044ETK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044CTK/0J TJA1044CTK/0J NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ET/0Z TJA1044ET/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044ET/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+25.93 грн
Мінімальне замовлення: 2500
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TJA1044CT/0Z TJA1044CT/0Z NXP USA Inc. TJA1044.pdf Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044DT/0Z TJA1044DT/0Z NXP USA Inc. TJA1044.pdf Description: TJA1044DT/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+23.96 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
MKM35Z256VLL7R MKM35Z256VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
на замовлення 989 шт:
термін постачання 21-31 дні (днів)
1+772.21 грн
10+659.88 грн
25+629.26 грн
50+569.64 грн
100+549.50 грн
250+523.91 грн
500+497.04 грн
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MKM35Z512VLL7R MKM35Z512VLL7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+845.56 грн
10+722.58 грн
25+689.04 грн
50+623.77 грн
100+601.69 грн
250+573.68 грн
500+544.25 грн
В кошику  од. на суму  грн.
MKM35Z256VLQ7R MKM35Z256VLQ7R NXP USA Inc. KM35P144M75SF0.pdf Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
1+721.11 грн
10+616.31 грн
25+587.71 грн
50+532.02 грн
100+513.20 грн
250+489.31 грн
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MKV10Z16VLF7 MKV10Z16VLF7 NXP USA Inc. Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MKV10Z64VLH7 MKV10Z64VLH7 NXP USA Inc. KV11P64M75.pdf Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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LD6806TD/12P,125 LD6806TD/12P,125 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 41166 шт:
термін постачання 21-31 дні (днів)
2959+7.89 грн
Мінімальне замовлення: 2959
В кошику  од. на суму  грн.
GTL2034PWZ GTL2034PWZ NXP USA Inc. GTL2034.pdf Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
на замовлення 1750 шт:
термін постачання 21-31 дні (днів)
3+142.57 грн
10+100.87 грн
25+91.77 грн
100+76.73 грн
250+72.26 грн
500+69.56 грн
1000+66.24 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
74AUP2G126GT,115 74AUP2G126GT,115 NXP USA Inc. 74AUP2G126.pdf Description: IC BUFF DVR 3-ST DL L PWR 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
на замовлення 173330 шт:
термін постачання 21-31 дні (днів)
4139+5.33 грн
Мінімальне замовлення: 4139
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74AUP2G125GT,115 74AUP2G125GT,115 NXP USA Inc. 74AUP2G125.pdf Description: IC BUFF DVR 3-ST DL L PWR 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
на замовлення 62447 шт:
термін постачання 21-31 дні (днів)
4139+5.31 грн
Мінімальне замовлення: 4139
В кошику  од. на суму  грн.
MC33FS6510LAE MC33FS6510LAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+546.40 грн
10+408.31 грн
25+378.96 грн
80+335.18 грн
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MRF8S9120NR3 MRF8S9120NR3 NXP USA Inc. MRF8S9120N.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
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MRF8S9120NR3 MRF8S9120NR3 NXP USA Inc. MRF8S9120N.pdf Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
1+6149.64 грн
В кошику  од. на суму  грн.
MCF52233CVM60 MCF52233CVM60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
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MCF52234CVM60 MCF52234CVM60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 80
DigiKey Programmable: Not Verified
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MCF52235CVM60 MCF52235CVM60 NXP USA Inc. MCF52235.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
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TDA8020HL/C2,118 TDA8020HL.pdf
TDA8020HL/C2,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: I2C
Voltage - Supply: 2.7V ~ 3.6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
на замовлення 5649 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
121+190.05 грн
Мінімальне замовлення: 121
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LFLAIBK77MWA
Виробник: NXP USA Inc.
Description: MPC5777M 416 PIN 1.0 MM PGA LOGI
Packaging: Bulk
For Use With/Related Products: MPC5777M
Module/Board Type: Socket Module - PGA
Utilized IC / Part: MPC5777M
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SCBGARBQ1AO
Виробник: NXP USA Inc.
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
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LFVBBK77CZA
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 516 PIN 1.0MM V
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
Utilized IC / Part: MPC5777C
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LFDAHT
Виробник: NXP USA Inc.
Description: 100 PIN 0.5MM QFP ZIF SOCKET ADA
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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FXLS90630AESR2 FXLS9xxx0.pdf
Виробник: NXP USA Inc.
Description: Y SINGLE-AXIS HIGH-G INERTIAL S
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
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MFS8412AMBP7ESR2 FS84QFN48EP.pdf
MFS8412AMBP7ESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC56F8323VFBER MC56F8323.pdf
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 27
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LFDAMT
Виробник: NXP USA Inc.
Description: 160 PIN 0.65MM QFP ZIF SOCKET AD
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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MPC860PZQ50D4 MPC860EC.pdf
MPC860PZQ50D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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MPC860SRZQ66D4 MPC860EC.pdf
MPC860SRZQ66D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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NT2H2421G0DUFZ NT2H2421G0.pdf
Виробник: NXP USA Inc.
Description: NT2H2421G0DUF
Packaging: Tray
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NT2H2421G0DUDZ NT2H2421G0.pdf
Виробник: NXP USA Inc.
Description: NT2H2421G0DUD
Packaging: Tray
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NT2H2421S0DUDZ NT2H2421G0.pdf
Виробник: NXP USA Inc.
Description: NT2H2421S0DUD
Packaging: Tray
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MMA9553LR1 MMA955xL.pdf
MMA9553LR1
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
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MPC860TZQ66D4 MPC860EC.pdf
MPC860TZQ66D4
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Bulk
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 509 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+13382.19 грн
Мінімальне замовлення: 2
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mpc8360evvagdga MPC8360E%2C8358E.pdf
mpc8360evvagdga
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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74LVC3G17GM,125 PHGLS27084-1.pdf?t.download=true&u=5oefqw
74LVC3G17GM,125
Виробник: NXP USA Inc.
Description: NOW NEXPERIA 74LVC3G17GM - BUFFE
Packaging: Bulk
Package / Case: 8-XFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 5.5V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 32mA
Supplier Device Package: 8-XQFN (1.6x1.6)
на замовлення 87946 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2701+8.37 грн
Мінімальне замовлення: 2701
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S912XEQ512AMAL MC9S12XEPB.pdf
S912XEQ512AMAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MC33FS8430G2KSR2 FS84_FS85C_DS.pdf
MC33FS8430G2KSR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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SPC5604BACLQ6R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
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MPC8536EBVJAULA MPC8536E.pdf
MPC8536EBVJAULA
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783BGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MKL26Z128VMC4 KL26P121M48SF4.pdf
MKL26Z128VMC4
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D - 16bit; D/A - 12bit
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 84
DigiKey Programmable: Not Verified
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PN7221EV/C100K PN7220.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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T1024NXN7KQA T1024FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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LX2160SE72029B
LX2160SE72029B
Виробник: NXP USA Inc.
Description: IC MPU QORLQ LX2 2GHZ 1517FCPBGA
Packaging: Tray
Package / Case: 1517-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A72
Voltage - I/O: 1.2V, 1.8V, 3.3V
Supplier Device Package: 1517-FCPBGA (40x40)
Ethernet: 100Gbps (2)
USB: USB 3.0 (2) + PHY (2)
Number of Cores/Bus Width: 16 Core, 64-Bit
RAM Controllers: DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 3.0 (4)
Additional Interfaces: CANbus, I2C, MMC/SD, SPI, UART
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MCF52221CAF66
MCF52221CAF66
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 56
DigiKey Programmable: Not Verified
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LS1043AXN8PQB LS1043AFS.pdf
LS1043AXN8PQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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T2080NXN8PTB T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MPC8245LZU300D MPC8245.pdf
MPC8245LZU300D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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74AUP1G04GM,132 PHGLS24869-1.pdf?t.download=true&u=5oefqw
74AUP1G04GM,132
Виробник: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 6-XSON (1.45x1)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
на замовлення 118473 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3974+6.09 грн
Мінімальне замовлення: 3974
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74AUP1G04GX/S500125 74AUP1G04.pdf
74AUP1G04GX/S500125
Виробник: NXP USA Inc.
Description: IC INVERTER 1CH 1-INP 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 0.8V ~ 3.6V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 1
Supplier Device Package: 5-X2SON (0.80x0.80)
Input Logic Level - High: 1.6V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.9V
Max Propagation Delay @ V, Max CL: 5.4ns @ 3.3V, 30pF
Number of Circuits: 1
Current - Quiescent (Max): 500 nA
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BYC58X-600,127 BYC58X-600.pdf
BYC58X-600,127
Виробник: NXP USA Inc.
Description: DIODE 600V 8A TO-220F SOD113
Packaging: Bulk
на замовлення 640 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
371+63.56 грн
Мінімальне замовлення: 371
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MF3D43C0DA8/00J
Виробник: NXP USA Inc.
Description: MF3D43C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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NT2H1511G0DUFZ
Виробник: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
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FXLS93422AESR2 FXLS9xxxx.pdf
Виробник: NXP USA Inc.
Description: PSI5 XZ DUAL-AXIS MEDIUM-G INER
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
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MRF9030LR1 MRF9030LR1.pdf
MRF9030LR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 26V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360
Mounting Type: Chassis Mount
Frequency: 945MHz
Power - Output: 30W
Gain: 19dB
Technology: LDMOS
Supplier Device Package: NI-360
Voltage - Rated: 68 V
Voltage - Test: 26 V
Current - Test: 250 mA
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MK21FX512VLQ12 K21P121M120SF5V2.pdf
MK21FX512VLQ12
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 42x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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TJA1044DTK/0J TJA1044.pdf
TJA1044DTK/0J
Виробник: NXP USA Inc.
Description: TJA1044DTK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044BTK/0J TJA1044.pdf
TJA1044BTK/0J
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ETK/0J TJA1044.pdf
TJA1044ETK/0J
Виробник: NXP USA Inc.
Description: TJA1044ETK/0J
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044CTK/0J TJA1044.pdf
TJA1044CTK/0J
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Tape & Reel (TR)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1044ET/0Z TJA1044.pdf
TJA1044ET/0Z
Виробник: NXP USA Inc.
Description: TJA1044ET/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+25.93 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1044CT/0Z TJA1044.pdf
TJA1044CT/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
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TJA1044DT/0Z TJA1044.pdf
TJA1044DT/0Z
Виробник: NXP USA Inc.
Description: TJA1044DT/0Z
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+23.96 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
MKM35Z256VLL7R KM35P144M75SF0.pdf
MKM35Z256VLL7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
на замовлення 989 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+772.21 грн
10+659.88 грн
25+629.26 грн
50+569.64 грн
100+549.50 грн
250+523.91 грн
500+497.04 грн
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MKM35Z512VLL7R KM35P144M75SF0.pdf
MKM35Z512VLL7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 72
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+845.56 грн
10+722.58 грн
25+689.04 грн
50+623.77 грн
100+601.69 грн
250+573.68 грн
500+544.25 грн
В кошику  од. на суму  грн.
MKM35Z256VLQ7R KM35P144M75SF0.pdf
MKM35Z256VLQ7R
Виробник: NXP USA Inc.
Description: KM35: 75MHZ CORTEX-M0+ METROLOGY
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LCD, RNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 99
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+721.11 грн
10+616.31 грн
25+587.71 грн
50+532.02 грн
100+513.20 грн
250+489.31 грн
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MKV10Z16VLF7
MKV10Z16VLF7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
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MKV10Z64VLH7 KV11P64M75.pdf
MKV10Z64VLH7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 75MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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LD6806TD/12P,125 LD6806_Series.pdf
LD6806TD/12P,125
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.2V 200MA 5TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 1.2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 41166 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2959+7.89 грн
Мінімальне замовлення: 2959
В кошику  од. на суму  грн.
GTL2034PWZ GTL2034.pdf
GTL2034PWZ
Виробник: NXP USA Inc.
Description: IC BUS BUFFER 3.6V 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Bus Buffer
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: -, 40mA
Supplier Device Package: 14-TSSOP
на замовлення 1750 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+142.57 грн
10+100.87 грн
25+91.77 грн
100+76.73 грн
250+72.26 грн
500+69.56 грн
1000+66.24 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
74AUP2G126GT,115 74AUP2G126.pdf
74AUP2G126GT,115
Виробник: NXP USA Inc.
Description: IC BUFF DVR 3-ST DL L PWR 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
на замовлення 173330 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4139+5.33 грн
Мінімальне замовлення: 4139
В кошику  од. на суму  грн.
74AUP2G125GT,115 74AUP2G125.pdf
74AUP2G125GT,115
Виробник: NXP USA Inc.
Description: IC BUFF DVR 3-ST DL L PWR 8XSON
Packaging: Bulk
Package / Case: 8-XFDFN
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
на замовлення 62447 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4139+5.31 грн
Мінімальне замовлення: 4139
В кошику  од. на суму  грн.
MC33FS6510LAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6510LAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+546.40 грн
10+408.31 грн
25+378.96 грн
80+335.18 грн
В кошику  од. на суму  грн.
MRF8S9120NR3 MRF8S9120N.pdf
MRF8S9120NR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
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MRF8S9120NR3 MRF8S9120N.pdf
MRF8S9120NR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V OM780-2
Packaging: Cut Tape (CT)
Package / Case: OM-780-2
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 33W
Gain: 19.8dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 70 V
Voltage - Test: 28 V
Current - Test: 800 mA
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6149.64 грн
В кошику  од. на суму  грн.
MCF52233CVM60 MCF52235.pdf
MCF52233CVM60
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
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MCF52234CVM60 MCF52235.pdf
MCF52234CVM60
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 80
DigiKey Programmable: Not Verified
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MCF52235CVM60 MCF52235.pdf
MCF52235CVM60
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LBGA
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (12x12)
Number of I/O: 73
DigiKey Programmable: Not Verified
товару немає в наявності
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