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MC9RS08KB8CWJ MC9RS08KB8CWJ NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
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S912XEP768BVAL NXP USA Inc. Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
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S9KEAZN64BMLCR NXP USA Inc. Description: IC MCU
Packaging: Tape & Reel (TR)
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S9KEAZN64BMLC NXP USA Inc. Description: IC MCU
Packaging: Tray
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MPF5030BMMA4ES MPF5030BMMA4ES NXP USA Inc. PF5030_SDS.pdf Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 395 шт:
термін постачання 21-31 дні (днів)
1+450.50 грн
10+396.31 грн
25+388.71 грн
40+362.14 грн
80+324.95 грн
230+323.73 грн
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MCIMX6G1AVM05AB MCIMX6G1AVM05AB NXP USA Inc. IMX6ULTRALITEFS.pdf Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MPC8360EZUAJDGA MPC8360EZUAJDGA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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MIMXRT685SFVKBR MIMXRT685SFVKBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
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MIMXRT685SFVKBR MIMXRT685SFVKBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Cut Tape (CT)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
на замовлення 524 шт:
термін постачання 21-31 дні (днів)
1+1465.17 грн
10+1126.63 грн
25+1055.58 грн
100+917.35 грн
250+882.42 грн
500+861.37 грн
В кошику  од. на суму  грн.
MIMXRT685SFFOBR MIMXRT685SFFOBR NXP USA Inc. RT600.pdf Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 147
на замовлення 1360 шт:
термін постачання 21-31 дні (днів)
1+1785.29 грн
10+1381.53 грн
25+1297.23 грн
100+1130.44 грн
250+1088.99 грн
500+1064.01 грн
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PTN36043BBXY NXP USA Inc. PTN36043B.pdf Description: PTN36043BBXY
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
на замовлення 6836 шт:
термін постачання 21-31 дні (днів)
3+161.31 грн
10+115.09 грн
25+105.05 грн
100+88.18 грн
250+83.22 грн
500+83.16 грн
Мінімальне замовлення: 3
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LPC865M201JHI48/0K LPC865M201JHI48/0K NXP USA Inc. LPC86x.pdf Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, I3C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
2+207.28 грн
10+179.80 грн
25+169.63 грн
80+135.62 грн
230+127.34 грн
440+111.43 грн
1300+90.81 грн
Мінімальне замовлення: 2
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PTN36242LBS,518 PTN36242LBS,518 NXP USA Inc. PTN36242L.pdf Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
на замовлення 7900 шт:
термін постачання 21-31 дні (днів)
184+125.34 грн
Мінімальне замовлення: 184
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SPC5604PF1VLL6 SPC5604PF1VLL6 NXP USA Inc. Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
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SPC5644AF0MMG2R SPC5644AF0MMG2R NXP USA Inc. MPC5644A.pdf Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
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LFVBSK77CZWA NXP USA Inc. Description: QORIVVA MPC5777C 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
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C9KEAZN16AMLC C9KEAZN16AMLC NXP USA Inc. Description: C9KEAZN16AMLC
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
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BFU520XRVL BFU520XRVL NXP USA Inc. BFU520XR.pdf Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 1dB @ 1.8GHz
Supplier Device Package: SOT-143R
на замовлення 3868 шт:
термін постачання 21-31 дні (днів)
2111+10.29 грн
Мінімальне замовлення: 2111
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MC7447AVU1167NB MC7447AVU1167NB NXP USA Inc. MPC7447AEC.pdf Description: IC MPU MPC74XX 1.167GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.167GHZ
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC33FS8530A0KSR2 MC33FS8530A0KSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8530A0KS MC33FS8530A0KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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LS1023ASE7QQB LS1023ASE7QQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MC33FS8435G0ES MC33FS8435G0ES NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT1189JVM8B NXP USA Inc. Description: IC MCU
Packaging: Tray
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MWCT1015SFVLLPR NXP USA Inc. MWCT101xSF.pdf Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
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MWCT1015SFVLLP NXP USA Inc. MWCT101xSF.pdf Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
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M86207G12 NXP USA Inc. Description: IC TELECOM INTERFACE 625BGA
Packaging: Tray
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MC68HC908QY2CDTE MC68HC908QY2CDTE NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC9S08SH4CWJR MC9S08SH4CWJR NXP USA Inc. MC9S08SH8.pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 113557 шт:
термін постачання 21-31 дні (днів)
135+173.25 грн
Мінімальне замовлення: 135
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P2010NXE2KHC P2010NXE2KHC NXP USA Inc. QP20XXFS.pdf Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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S9S08AW8AE0MLC S9S08AW8AE0MLC NXP USA Inc. Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
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SPC5746CK1AVKU6 SPC5746CK1AVKU6 NXP USA Inc. Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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ACTT4X-800C,127 ACTT4X-800C,127 NXP USA Inc. PHGLS24768-1.pdf?t.download=true&u=5oefqw Description: TRIAC 800V 4A TO220F
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 35 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A, 39A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 800 V
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
1004+23.07 грн
Мінімальне замовлення: 1004
В кошику  од. на суму  грн.
MFS2321BMMA0EP NXP USA Inc. 568_FS23.pdf Description: MFS2321BMMA0EP
Packaging: Tray
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S9S12G128AMLF S9S12G128AMLF NXP USA Inc. MC9S12G_Family_Manual_and_Datasheet.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1240 шт:
термін постачання 21-31 дні (днів)
1+600.11 грн
10+446.53 грн
25+413.63 грн
80+358.90 грн
250+338.15 грн
500+328.42 грн
1000+315.15 грн
В кошику  од. на суму  грн.
P87C51MC2BA/02,529 P87C51MC2BA/02,529 NXP USA Inc. Description: IC MCU 8BIT 96KB OTP 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 3K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 147846 шт:
термін постачання 21-31 дні (днів)
33+708.97 грн
Мінімальне замовлення: 33
В кошику  од. на суму  грн.
P87C51MC2BA/02,529 P87C51MC2BA/02,529 NXP USA Inc. Description: IC MCU 8BIT 96KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 3K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC56F81748LMLH NXP USA Inc. MC56F81XXXL.pdf Description: IC
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MPC8313ZQADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MRFE6VP5600HSR5 MRFE6VP5600HSR5 NXP USA Inc. MRFE6VP5600H.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MPC8247VRTMFA MPC8247VRTMFA NXP USA Inc. MPC8272EC.pdf Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MC9S08SU16VFK MC9S08SU16VFK NXP USA Inc. MC9S08SU16DS.pdf Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 2688 шт:
термін постачання 21-31 дні (днів)
110+218.34 грн
Мінімальне замовлення: 110
В кошику  од. на суму  грн.
MC9S08SU16VFK MC9S08SU16VFK NXP USA Inc. MC9S08SU16DS.pdf Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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MFS8416AMBP0ES MFS8416AMBP0ES NXP USA Inc. FS84QFN48EP.pdf Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 60V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
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LPC5514JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+288.09 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
LPC5514JBD100Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+403.70 грн
10+355.02 грн
25+348.21 грн
50+324.43 грн
100+291.12 грн
250+290.03 грн
500+267.36 грн
В кошику  од. на суму  грн.
LPC5514JBD100K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
1+403.70 грн
10+355.02 грн
25+348.21 грн
40+324.43 грн
80+291.12 грн
230+290.02 грн
450+267.36 грн
В кошику  од. на суму  грн.
LPC5516JBD100K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
1+472.23 грн
10+414.66 грн
25+406.74 грн
40+378.95 грн
80+340.04 грн
230+338.76 грн
450+312.29 грн
В кошику  од. на суму  грн.
LPC5534JBD100MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
на замовлення 980 шт:
термін постачання 21-31 дні (днів)
1+632.71 грн
10+561.06 грн
25+549.33 грн
50+513.76 грн
100+460.99 грн
250+447.05 грн
500+418.15 грн
В кошику  од. на суму  грн.
LPC5536JBD100MP LPC5536JBD100MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
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LPC5536JBD100MP LPC5536JBD100MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
на замовлення 411 шт:
термін постачання 21-31 дні (днів)
1+715.45 грн
10+538.21 грн
25+500.33 грн
100+427.55 грн
250+408.18 грн
В кошику  од. на суму  грн.
LPC5536JBD100K LPC5536JBD100K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 400 шт:
термін постачання 21-31 дні (днів)
1+947.81 грн
10+717.45 грн
80+593.98 грн
В кошику  од. на суму  грн.
MCHC908JW16FC MCHC908JW16FC NXP USA Inc. MC68HC908JB8.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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MCHC908JW32FC MCHC908JW32FC NXP USA Inc. MC68HC908JW32.pdf Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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MCHC908JW32FAE MCHC908JW32FAE NXP USA Inc. MC68HC908JW32.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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MCHC908QT4VDWER MCHC908QT4VDWER NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MHT1004NR3 MHT1004NR3 NXP USA Inc. Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 280W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
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S912ZVC96AMKH S912ZVC96AMKH NXP USA Inc. Description: S912ZVC96AMKH
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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BUK7515-100A,127 NXP USA Inc. BUK7515-100A.pdf Description: MOSFET N-CH 100V 75A TO220AB
Packaging: Tube
на замовлення 4668 шт:
термін постачання 21-31 дні (днів)
392+61.28 грн
Мінімальне замовлення: 392
В кошику  од. на суму  грн.
MCF5206ECAB40 MCF5206ECAB40 NXP USA Inc. MCF5206EFS.pdf Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Additional Interfaces: EBI/EMI, I2C, UART/USART
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MC9RS08KB8CWJ MC9RS08KB12.pdf
MC9RS08KB8CWJ
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 254 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 18
DigiKey Programmable: Not Verified
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S912XEP768BVAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 768KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 1.98V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
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S9KEAZN64BMLCR
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
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S9KEAZN64BMLC
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
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MPF5030BMMA4ES PF5030_SDS.pdf
MPF5030BMMA4ES
Виробник: NXP USA Inc.
Description: PMIC 3 BUCKS 2 LDO A1 DIE
Packaging: Tray
Package / Case: 40-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V ~ 5.25V
Applications: System Basis Chip
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 395 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+450.50 грн
10+396.31 грн
25+388.71 грн
40+362.14 грн
80+324.95 грн
230+323.73 грн
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MCIMX6G1AVM05AB IMX6ULTRALITEFS.pdf
MCIMX6G1AVM05AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 289MAPBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 289-MAPBGA (14x14)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MPC8360EZUAJDGA MPC8360E%2C8358E.pdf
MPC8360EZUAJDGA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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MIMXRT685SFVKBR RT600.pdf
MIMXRT685SFVKBR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
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MIMXRT685SFVKBR RT600.pdf
MIMXRT685SFVKBR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 176VFBGA
Packaging: Cut Tape (CT)
Package / Case: 176-VFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 176-VFBGA (9x9)
Number of I/O: 96
на замовлення 524 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1465.17 грн
10+1126.63 грн
25+1055.58 грн
100+917.35 грн
250+882.42 грн
500+861.37 грн
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MIMXRT685SFFOBR RT600.pdf
MIMXRT685SFFOBR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 249FOWLP
Packaging: Cut Tape (CT)
Package / Case: 249-WFBGA
Mounting Type: Surface Mount
Speed: 300MHz
RAM Size: 4.5M x 8
Operating Temperature: -20°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 249-FOWLP (7x7)
Number of I/O: 147
на замовлення 1360 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1785.29 грн
10+1381.53 грн
25+1297.23 грн
100+1130.44 грн
250+1088.99 грн
500+1064.01 грн
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PTN36043BBXY PTN36043B.pdf
Виробник: NXP USA Inc.
Description: PTN36043BBXY
Packaging: Cut Tape (CT)
Package / Case: 18-XFQFN Exposed Pad
Delay Time: 500ps (Max)
Number of Channels: 2
Mounting Type: Surface Mount
Output: Differential
Type: Buffer, ReDriver
Input: Differential
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Applications: USB Type C
Current - Supply: 113mA
Supplier Device Package: 18-X2QFN (2.4x2)
Signal Conditioning: Input Equalization, Output De-Emphasis
на замовлення 6836 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+161.31 грн
10+115.09 грн
25+105.05 грн
100+88.18 грн
250+83.22 грн
500+83.16 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
LPC865M201JHI48/0K LPC86x.pdf
LPC865M201JHI48/0K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, I3C, SMBus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 42
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+207.28 грн
10+179.80 грн
25+169.63 грн
80+135.62 грн
230+127.34 грн
440+111.43 грн
1300+90.81 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PTN36242LBS,518 PTN36242L.pdf
PTN36242LBS,518
Виробник: NXP USA Inc.
Description: IC REDRIVER USB 3.0 2CH 32HVQFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Delay Time: 0.4ns
Number of Channels: 2
Mounting Type: Surface Mount
Type: Buffer, ReDriver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Applications: USB 3.0
Current - Supply: 225mA
Supplier Device Package: 32-HVQFN (3x6)
Signal Conditioning: Input Equalization, Output De-Emphasis
на замовлення 7900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
184+125.34 грн
Мінімальне замовлення: 184
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SPC5604PF1VLL6
SPC5604PF1VLL6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 68
DigiKey Programmable: Not Verified
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SPC5644AF0MMG2R MPC5644A.pdf
SPC5644AF0MMG2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 208MAPBGA
Packaging: Cut Tape (CT)
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 40x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 120
DigiKey Programmable: Not Verified
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LFVBSK77CZWA
Виробник: NXP USA Inc.
Description: QORIVVA MPC5777C 416 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5777C
Accessory Type: Base Board
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C9KEAZN16AMLC
C9KEAZN16AMLC
Виробник: NXP USA Inc.
Description: C9KEAZN16AMLC
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
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BFU520XRVL BFU520XR.pdf
BFU520XRVL
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 17.5dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 1dB @ 1.8GHz
Supplier Device Package: SOT-143R
на замовлення 3868 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2111+10.29 грн
Мінімальне замовлення: 2111
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MC7447AVU1167NB MPC7447AEC.pdf
MC7447AVU1167NB
Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.167GHZ 360BGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.167GHZ
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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MC33FS8530A0KSR2 FS84_FS85C_DS.pdf
MC33FS8530A0KSR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8530A0KS FS84_FS85C_DS.pdf
MC33FS8530A0KS
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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LS1023ASE7QQB LS1043AFS.pdf
LS1023ASE7QQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MC33FS8435G0ES FS84_FS85C_DS.pdf
MC33FS8435G0ES
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT1189JVM8B
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
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MWCT1015SFVLLPR MWCT101xSF.pdf
Виробник: NXP USA Inc.
Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
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MWCT1015SFVLLP MWCT101xSF.pdf
Виробник: NXP USA Inc.
Description: WCT1015,NO CSEC/CAN-FD
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Wireless Power Transmitter
Supplier Device Package: 100-LQFP (14x14)
Grade: Automotive
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M86207G12
Виробник: NXP USA Inc.
Description: IC TELECOM INTERFACE 625BGA
Packaging: Tray
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MC68HC908QY2CDTE MC68HC908QY4.pdf
MC68HC908QY2CDTE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
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MC9S08SH4CWJR MC9S08SH8.pdf
MC9S08SH4CWJR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-SOIC
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 113557 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
135+173.25 грн
Мінімальне замовлення: 135
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P2010NXE2KHC QP20XXFS.pdf
P2010NXE2KHC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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S9S08AW8AE0MLC
S9S08AW8AE0MLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
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SPC5746CK1AVKU6
SPC5746CK1AVKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD/HVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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ACTT4X-800C,127 PHGLS24768-1.pdf?t.download=true&u=5oefqw
ACTT4X-800C,127
Виробник: NXP USA Inc.
Description: TRIAC 800V 4A TO220F
Packaging: Bulk
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Triac Type: Standard
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 35 mA
Current - Gate Trigger (Igt) (Max): 35 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35A, 39A
Voltage - Gate Trigger (Vgt) (Max): 1 V
Supplier Device Package: TO-220F
Current - On State (It (RMS)) (Max): 4 A
Voltage - Off State: 800 V
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1004+23.07 грн
Мінімальне замовлення: 1004
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MFS2321BMMA0EP 568_FS23.pdf
Виробник: NXP USA Inc.
Description: MFS2321BMMA0EP
Packaging: Tray
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S9S12G128AMLF MC9S12G_Family_Manual_and_Datasheet.pdf
S9S12G128AMLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1240 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+600.11 грн
10+446.53 грн
25+413.63 грн
80+358.90 грн
250+338.15 грн
500+328.42 грн
1000+315.15 грн
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P87C51MC2BA/02,529
P87C51MC2BA/02,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB OTP 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 3K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 34
DigiKey Programmable: Not Verified
на замовлення 147846 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
33+708.97 грн
Мінімальне замовлення: 33
В кошику  од. на суму  грн.
P87C51MC2BA/02,529
P87C51MC2BA/02,529
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 3K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC56F81748LMLH MC56F81XXXL.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
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MPC8313ZQADDC MPC8313E_Hrdw_Spec.pdf
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MRFE6VP5600HSR5 MRFE6VP5600H.pdf
MRFE6VP5600HSR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230-4S
Mounting Type: Chassis Mount
Frequency: 230MHz
Configuration: Dual
Power - Output: 600W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230-4S
Voltage - Rated: 130 V
Voltage - Test: 50 V
Current - Test: 100 mA
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MPC8247VRTMFA MPC8272EC.pdf
MPC8247VRTMFA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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MC9S08SU16VFK MC9S08SU16DS.pdf
MC9S08SU16VFK
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Bulk
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
на замовлення 2688 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
110+218.34 грн
Мінімальне замовлення: 110
В кошику  од. на суму  грн.
MC9S08SU16VFK MC9S08SU16DS.pdf
MC9S08SU16VFK
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 18V
Connectivity: I2C, SCI
Peripherals: PWM, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 17
DigiKey Programmable: Not Verified
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MFS8416AMBP0ES FS84QFN48EP.pdf
MFS8416AMBP0ES
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 60V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
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LPC5514JBD100Y LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+288.09 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
LPC5514JBD100Y LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+403.70 грн
10+355.02 грн
25+348.21 грн
50+324.43 грн
100+291.12 грн
250+290.03 грн
500+267.36 грн
В кошику  од. на суму  грн.
LPC5514JBD100K LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+403.70 грн
10+355.02 грн
25+348.21 грн
40+324.43 грн
80+291.12 грн
230+290.02 грн
450+267.36 грн
В кошику  од. на суму  грн.
LPC5516JBD100K LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+472.23 грн
10+414.66 грн
25+406.74 грн
40+378.95 грн
80+340.04 грн
230+338.76 грн
450+312.29 грн
В кошику  од. на суму  грн.
LPC5534JBD100MP LPC553x.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
на замовлення 980 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+632.71 грн
10+561.06 грн
25+549.33 грн
50+513.76 грн
100+460.99 грн
250+447.05 грн
500+418.15 грн
В кошику  од. на суму  грн.
LPC5536JBD100MP LPC553x.pdf
LPC5536JBD100MP
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
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LPC5536JBD100MP LPC553x.pdf
LPC5536JBD100MP
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
на замовлення 411 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+715.45 грн
10+538.21 грн
25+500.33 грн
100+427.55 грн
250+408.18 грн
В кошику  од. на суму  грн.
LPC5536JBD100K LPC553x.pdf
LPC5536JBD100K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 23x16b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+947.81 грн
10+717.45 грн
80+593.98 грн
В кошику  од. на суму  грн.
MCHC908JW16FC MC68HC908JB8.pdf
MCHC908JW16FC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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MCHC908JW32FC MC68HC908JW32.pdf
MCHC908JW32FC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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MCHC908JW32FAE MC68HC908JW32.pdf
MCHC908JW32FAE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: SPI, USB
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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MCHC908QT4VDWER MC68HC908QY4.pdf
MCHC908QT4VDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MHT1004NR3
MHT1004NR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 32V OM780-2
Packaging: Tape & Reel (TR)
Package / Case: OM-780-2
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 2.45GHz
Power - Output: 280W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: OM-780-2
Voltage - Rated: 65 V
Voltage - Test: 32 V
Current - Test: 100 mA
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S912ZVC96AMKH
S912ZVC96AMKH
Виробник: NXP USA Inc.
Description: S912ZVC96AMKH
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 16x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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BUK7515-100A,127 BUK7515-100A.pdf
Виробник: NXP USA Inc.
Description: MOSFET N-CH 100V 75A TO220AB
Packaging: Tube
на замовлення 4668 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
392+61.28 грн
Мінімальне замовлення: 392
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MCF5206ECAB40 MCF5206EFS.pdf
MCF5206ECAB40
Виробник: NXP USA Inc.
Description: IC MPU MCF520X 40MHZ 160QFP
Packaging: Tray
Package / Case: 160-BQFP
Mounting Type: Surface Mount
Speed: 40MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: Coldfire V2
Voltage - I/O: 3.3V
Supplier Device Package: 160-QFP (28x28)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Additional Interfaces: EBI/EMI, I2C, UART/USART
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