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MCIMX355AVM4BR2 MCIMX355AVM4BR2 NXP USA Inc. MCIMX35SR2AEC.pdf Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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MC8640DTHX1250HE MC8640DTHX1250HE NXP USA Inc. Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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S32M243CCABWKHSR S32M243CCABWKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M243CCABWKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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P1025NXE5DFB P1025NXE5DFB NXP USA Inc. QP1025FS.pdf Description: IC MPU 533MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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NTB0102JKZ NTB0102JKZ NXP USA Inc. NTB0102.pdf Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
на замовлення 5950 шт:
термін постачання 21-31 дні (днів)
8+44.26 грн
12+30.25 грн
25+27.11 грн
100+22.19 грн
250+20.63 грн
500+19.69 грн
1000+18.61 грн
2500+17.81 грн
Мінімальне замовлення: 8
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NTS0102JKZ NTS0102JKZ NXP USA Inc. NTS0102.pdf Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 7604 шт:
термін постачання 21-31 дні (днів)
8+47.73 грн
11+32.68 грн
25+29.28 грн
100+23.97 грн
250+22.29 грн
500+21.27 грн
1000+20.10 грн
2500+19.24 грн
Мінімальне замовлення: 8
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FRDM-MCXA156 NXP USA Inc. UM12121.pdf Description: FRDM-MCXA156
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXA156
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S32M242CCABMKHST S32M242CCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M242CCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6527NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8430G1KS MC33FS8430G1KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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S32G274ASBK1VUCT NXP USA Inc. S32G2.pdf Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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LPC55S16JEV98K NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
1+513.77 грн
10+451.62 грн
25+443.00 грн
40+412.73 грн
80+370.33 грн
230+368.95 грн
440+340.12 грн
1300+325.77 грн
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FS32K148HAT0VLLT FS32K148HAT0VLLT NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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S912ZVLA64F0VFM S912ZVLA64F0VFM NXP USA Inc. Description: S912ZVLA64F0VFM
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
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S912ZVLA64F0VFMR S912ZVLA64F0VFMR NXP USA Inc. Description: S912ZVLA64F0VFMR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
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MW7IC2220NR1 MW7IC2220NR1 NXP USA Inc. MW7IC2220.pdf Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31dB
Current - Supply: 300mA
P1dB: 43dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
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MC908JK3ECDWE MC908JK3ECDWE NXP USA Inc. MC68HC908JL3E.pdf Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
на замовлення 672 шт:
термін постачання 21-31 дні (днів)
1+458.23 грн
10+338.13 грн
38+302.77 грн
114+264.78 грн
266+253.43 грн
532+245.96 грн
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MM908E626AVPEK MM908E626AVPEK NXP USA Inc. 908E626.pdf Description: IC STEPPER MOTOR DRVR 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 115°C
Voltage - Supply: 8V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 13
DigiKey Programmable: Not Verified
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MPC8260AZUPJDB MPC8260AZUPJDB NXP USA Inc. MPC8260A.pdf Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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P3T1035BUKAZ P3T1035BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035BUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T1035BUKAZ P3T1035BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035BUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3384 шт:
термін постачання 21-31 дні (днів)
6+58.17 грн
10+55.07 грн
25+48.41 грн
50+46.15 грн
100+44.08 грн
500+39.27 грн
1000+37.76 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
S9S12ZVLS3AVFMR NXP USA Inc. Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
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KITFS2400FRDMEVM NXP USA Inc. getting-started-with-the-kitfs2400frdmevm-evaluation-board:GS-KITFS2400FRDMEVM Description: EVAL BOARD FOR FS2400
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
Contents: Board(s), Cable(s), Accessories
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+37973.96 грн
В кошику  од. на суму  грн.
SPC5604CACLL6 SPC5604CACLL6 NXP USA Inc. MPC5604BC.pdf Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
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MC33FS6507NAER2 MC33FS6507NAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6507NAE MC33FS6507NAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6506NAE MC33FS6506NAE NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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C912ZVML31L0MKFR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
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XC56309VF100A XC56309VF100A NXP USA Inc. DSP56309UM.pdf Description: IC DSP 24BIT FIXED-POINT 196-BGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
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LFJ44INTPU1A NXP USA Inc. Description: QORIVVA MPC5644A ON A 324 PIN BG
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
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LFJ44INTPQA NXP USA Inc. Description: QORIVVA MPC5644A ON A 208 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5644A
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LFVCAL32SYNC2 NXP USA Inc. Description: 32-BIT 2 MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5644A
Accessory Type: Daughter Board
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SPC5644CF0VLU8R SPC5644CF0VLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0CLU8 SPC5644CF0CLU8 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0CLU8R SPC5644CF0CLU8R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0VLT1 SPC5644CF0VLT1 NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644CF0VLT1R SPC5644CF0VLT1R NXP USA Inc. Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644CF0MMJ1 SPC5644CF0MMJ1 NXP USA Inc. Description: IC MCU 32B 1.5MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
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P82B96DP,118 P82B96DP,118 NXP USA Inc. P82B96.pdf Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
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A5G19H605W19NR3 NXP USA Inc. A5G19H605W19N.pdf Description: A5G19H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 1.93GHz ~ 1.995GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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A5G21H605W19NR3 NXP USA Inc. A5G21H605W19N.pdf Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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FD32K144HRT0VLFT NXP USA Inc. Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
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PMV16UN,215 PMV16UN,215 NXP USA Inc. PMV16UN.pdf Description: MOSFET N-CH 20V 5.8A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.8A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 5.8A, 4.5V
Power Dissipation (Max): 510mW (Ta)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 10 V
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LFK77CIDBZ2W1A NXP USA Inc. Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
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LFK77CIDBZ2W1E NXP USA Inc. Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
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LFK77CIDBZ2W1D NXP USA Inc. Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
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PN7220EV/C101K NXP USA Inc. PN7220.pdf Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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74LV373DB,112 74LV373DB,112 NXP USA Inc. 74LV373.pdf Description: IC D-TYPE TRANSP 8:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-SSOP
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MPF5023CMBA0ES MPF5023CMBA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+489.47 грн
10+362.53 грн
25+335.36 грн
100+286.63 грн
490+265.37 грн
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MPF5023CMMA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CVNA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CVNA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CMMA0ES NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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PDTC115TE,115 PDTC115TE,115 NXP USA Inc. PDTC115T_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 100 kOhms
на замовлення 164500 шт:
термін постачання 21-31 дні (днів)
8876+2.49 грн
Мінімальне замовлення: 8876
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MC33FS4500NAE MC33FS4500NAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+437.40 грн
10+324.84 грн
25+300.79 грн
100+262.98 грн
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MC9S08GW64CLH MC9S08GW64CLH NXP USA Inc. MC9S08GW64.pdf Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
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PESD2NFC-SFYL PESD2NFC-SFYL NXP USA Inc. PESD5V0F1BL.pdf Description: TVS DIODE 24VWM DSN0603-2
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Power Line Protection: No
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
3523+7.44 грн
Мінімальне замовлення: 3523
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IW416HN/A1IMP IW416HN/A1IMP NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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IW416HN/A1IK IW416HN/A1IK NXP USA Inc. IW416.pdf Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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BB187,335 BB187,335 NXP USA Inc. BB187_Rev5.pdf Description: DIODE VHF VAR CAP 32V SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.92pF @ 25V, 1MHz
Capacitance Ratio Condition: C2/C25
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 11.0
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MCIMX355AVM4BR2 MCIMX35SR2AEC.pdf
MCIMX355AVM4BR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 400MHZ 400LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
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MC8640DTHX1250HE
MC8640DTHX1250HE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.25GHZ 1023BGA
Packaging: Tray
Package / Case: 1023-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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S32M243CCABWKHSR S32M2xx_DS.pdf
S32M243CCABWKHSR
Виробник: NXP USA Inc.
Description: S32M243CCABWKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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P1025NXE5DFB QP1025FS.pdf
P1025NXE5DFB
Виробник: NXP USA Inc.
Description: IC MPU 533MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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NTB0102JKZ NTB0102.pdf
NTB0102JKZ
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Tri-State
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 100Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.2 V ~ 3.6 V
Voltage - VCCB: 1.65 V ~ 5.5 V
Number of Circuits: 1
на замовлення 5950 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+44.26 грн
12+30.25 грн
25+27.11 грн
100+22.19 грн
250+20.63 грн
500+19.69 грн
1000+18.61 грн
2500+17.81 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
NTS0102JKZ NTS0102.pdf
NTS0102JKZ
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-X2SON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 7604 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8+47.73 грн
11+32.68 грн
25+29.28 грн
100+23.97 грн
250+22.29 грн
500+21.27 грн
1000+20.10 грн
2500+19.24 грн
Мінімальне замовлення: 8
В кошику  од. на суму  грн.
FRDM-MCXA156 UM12121.pdf
Виробник: NXP USA Inc.
Description: FRDM-MCXA156
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXA156
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S32M242CCABMKHST S32M2xx_DS.pdf
S32M242CCABMKHST
Виробник: NXP USA Inc.
Description: S32M242CCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6527NAE FS6500-FS4500SDS-ASILB.pdf
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8430G1KS FS84_FS85C_DS.pdf
MC33FS8430G1KS
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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S32G274ASBK1VUCT S32G2.pdf
Виробник: NXP USA Inc.
Description: S32G274A ARM CORTEX-M7 AND -A53,
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
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LPC55S16JEV98K LPC55S1x_LPC551x_DS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+513.77 грн
10+451.62 грн
25+443.00 грн
40+412.73 грн
80+370.33 грн
230+368.95 грн
440+340.12 грн
1300+325.77 грн
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FS32K148HAT0VLLT S32K1xx.pdf
FS32K148HAT0VLLT
Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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S912ZVLA64F0VFM
S912ZVLA64F0VFM
Виробник: NXP USA Inc.
Description: S912ZVLA64F0VFM
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
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S912ZVLA64F0VFMR
S912ZVLA64F0VFMR
Виробник: NXP USA Inc.
Description: S912ZVLA64F0VFMR
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 6x10b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Grade: Automotive
Number of I/O: 19
Qualification: AEC-Q100
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MW7IC2220NR1 MW7IC2220.pdf
MW7IC2220NR1
Виробник: NXP USA Inc.
Description: IC AMP W-CDMA 2.11-2.17GHZ TO270
Packaging: Tape & Reel (TR)
Package / Case: TO-270-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.17GHz
RF Type: W-CDMA
Voltage - Supply: 28V
Gain: 31dB
Current - Supply: 300mA
P1dB: 43dBm
Test Frequency: 2.14GHz
Supplier Device Package: TO-270 WBL-16
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MC908JK3ECDWE MC68HC908JL3E.pdf
MC908JK3ECDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 12x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 20-SOIC
Number of I/O: 15
DigiKey Programmable: Not Verified
на замовлення 672 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+458.23 грн
10+338.13 грн
38+302.77 грн
114+264.78 грн
266+253.43 грн
532+245.96 грн
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MM908E626AVPEK 908E626.pdf
MM908E626AVPEK
Виробник: NXP USA Inc.
Description: IC STEPPER MOTOR DRVR 54SOIC
Packaging: Tube
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 115°C
Voltage - Supply: 8V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC-EP
Grade: Automotive
Number of I/O: 13
DigiKey Programmable: Not Verified
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MPC8260AZUPJDB MPC8260A.pdf
MPC8260AZUPJDB
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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P3T1035BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035BUKAZ
Виробник: NXP USA Inc.
Description: P3T1035BUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T1035BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035BUKAZ
Виробник: NXP USA Inc.
Description: P3T1035BUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3384 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+58.17 грн
10+55.07 грн
25+48.41 грн
50+46.15 грн
100+44.08 грн
500+39.27 грн
1000+37.76 грн
Мінімальне замовлення: 6
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S9S12ZVLS3AVFMR
Виробник: NXP USA Inc.
Description: S12Z CPU, 32K FLASH
Packaging: Tape & Reel (TR)
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KITFS2400FRDMEVM getting-started-with-the-kitfs2400frdmevm-evaluation-board:GS-KITFS2400FRDMEVM
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2400
Packaging: Tray
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: FS2400
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: 40V Supply
Secondary Attributes: On-Board LEDs, Test Points
Embedded: Yes, MCU
Contents: Board(s), Cable(s), Accessories
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+37973.96 грн
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SPC5604CACLL6 MPC5604BC.pdf
SPC5604CACLL6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 28x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
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MC33FS6507NAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6507NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6507NAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6507NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6506NAE F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6506NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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C912ZVML31L0MKFR
Виробник: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
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XC56309VF100A DSP56309UM.pdf
XC56309VF100A
Виробник: NXP USA Inc.
Description: IC DSP 24BIT FIXED-POINT 196-BGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
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LFJ44INTPU1A
Виробник: NXP USA Inc.
Description: QORIVVA MPC5644A ON A 324 PIN BG
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
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LFJ44INTPQA
Виробник: NXP USA Inc.
Description: QORIVVA MPC5644A ON A 208 PIN 1.
Packaging: Bulk
For Use With/Related Products: MPC5644A
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5644A
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LFVCAL32SYNC2
Виробник: NXP USA Inc.
Description: 32-BIT 2 MB VERTICAL CALIBRATION
Packaging: Bulk
For Use With/Related Products: MPC5644A
Accessory Type: Daughter Board
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SPC5644CF0VLU8R
SPC5644CF0VLU8R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0CLU8
SPC5644CF0CLU8
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0CLU8R
SPC5644CF0CLU8R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 27x10b, 5x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 147
DigiKey Programmable: Not Verified
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SPC5644CF0VLT1
SPC5644CF0VLT1
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644CF0VLT1R
SPC5644CF0VLT1R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 208TQFP
Packaging: Tape & Reel (TR)
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-TQFP (28x28)
Number of I/O: 177
DigiKey Programmable: Not Verified
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SPC5644CF0MMJ1
SPC5644CF0MMJ1
Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4d, e200z0h
Data Converters: A/D 33x10b, 10x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 199
DigiKey Programmable: Not Verified
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P82B96DP,118 P82B96.pdf
P82B96DP,118
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 15V
Applications: I2C
Current - Supply: 900µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
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A5G19H605W19NR3 A5G19H605W19N.pdf
Виробник: NXP USA Inc.
Description: A5G19H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 1.93GHz ~ 1.995GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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A5G21H605W19NR3 A5G21H605W19N.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.11GHz ~ 2.2GHz
Power - Output: 85W
Gain: 15.1dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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FD32K144HRT0VLFT
Виробник: NXP USA Inc.
Description: S32K144, 512K FLASH, 64K RAM
Packaging: Tray
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PMV16UN,215 PMV16UN.pdf
PMV16UN,215
Виробник: NXP USA Inc.
Description: MOSFET N-CH 20V 5.8A TO236AB
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.8A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 5.8A, 4.5V
Power Dissipation (Max): 510mW (Ta)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: SOT-23 (TO-236AB)
Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 11 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 670 pF @ 10 V
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LFK77CIDBZ2W1A
Виробник: NXP USA Inc.
Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
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LFK77CIDBZ2W1E
Виробник: NXP USA Inc.
Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
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LFK77CIDBZ2W1D
Виробник: NXP USA Inc.
Description: MPC5777C INTEGRATED DEBUG BOARD
Packaging: Bulk
For Use With/Related Products: MPC5777C
Type: Debugger
Contents: Board(s)
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PN7220EV/C101K PN7220.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443A, ISO 14443B, ISO 15693, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
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74LV373DB,112 74LV373.pdf
74LV373DB,112
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 8:8 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-SSOP
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MPF5023CMBA0ES PF5023.pdf
MPF5023CMBA0ES
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+489.47 грн
10+362.53 грн
25+335.36 грн
100+286.63 грн
490+265.37 грн
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MPF5023CMMA0ESR2 PF5023.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CVNA0ESR2 PF5023.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CVNA0ES PF5023.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023CMMA0ES PF5023.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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PDTC115TE,115 PDTC115T_SER.pdf
PDTC115TE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 100 kOhms
на замовлення 164500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
8876+2.49 грн
Мінімальне замовлення: 8876
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MC33FS4500NAE 35FS4500-35FS6500-ASILD.pdf
MC33FS4500NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+437.40 грн
10+324.84 грн
25+300.79 грн
100+262.98 грн
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MC9S08GW64CLH MC9S08GW64.pdf
MC9S08GW64CLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x16b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LCD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 57
DigiKey Programmable: Not Verified
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PESD2NFC-SFYL PESD5V0F1BL.pdf
PESD2NFC-SFYL
Виробник: NXP USA Inc.
Description: TVS DIODE 24VWM DSN0603-2
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Power Line Protection: No
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3523+7.44 грн
Мінімальне замовлення: 3523
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IW416HN/A1IMP IW416.pdf
IW416HN/A1IMP
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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IW416HN/A1IK IW416.pdf
IW416HN/A1IK
Виробник: NXP USA Inc.
Description: IC RF TXRX 802.15.4 68HVQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.05V, 1.8V, 2.2V
Power - Output: 21dBm
Protocol: 802.11a/b/g/n, Bluetooth v5.1, Class 2, GPS, GSM, LTE, WCDMA
Current - Receiving: 5µA ~ 60mA
Data Rate (Max): 150Mbps
Current - Transmitting: 240µA ~ 325mA
Supplier Device Package: 68-HVQFN (8x8)
Modulation: 4-DQPSK, 8-DPSK, 16-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: 802.15.4, Bluetooth, Cellular, WiFi
Serial Interfaces: GPIO, I2S, JTAG, PCM, SDIO, UART
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BB187,335 BB187_Rev5.pdf
BB187,335
Виробник: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD523
Packaging: Tape & Reel (TR)
Package / Case: SC-79, SOD-523
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.92pF @ 25V, 1MHz
Capacitance Ratio Condition: C2/C25
Supplier Device Package: SOD-523
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 11.0
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