Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36847) > Сторінка 547 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| A5G35S008NT6 | NXP USA Inc. |
Description: RF MOSFETPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | |||||||||||||
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MSC8151TAG1000B | NXP USA Inc. |
Description: IC DSP 1X 1GHZ SC3850 783FCBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Type: SC3850 Single Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (96KB) On-Chip RAM: 576kB Voltage - I/O: 2.50V Voltage - Core: 1.00V Clock Rate: 1GHz Supplier Device Package: 783-FCPBGA (29x29) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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LPC2930FBD208,551 | NXP USA Inc. |
Description: IC MCU 16/32BIT ROMLESS 208LQFPPackaging: Tray Package / Case: 208-LQFP Mounting Type: Surface Mount Speed: 125MHz RAM Size: 56K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM968E-S Data Converters: A/D 24x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 208-LQFP (28x28) Number of I/O: 152 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||
| MF1S7001XDUD2/V1A | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIESupplier Device Package: Die Standards: ISO 14443, MIFARE Operating Temperature: -25°C ~ 70°C Type: RFID Transponder Interface: UART Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: Die Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 141145 шт В кошику од. на суму грн. | |||||||||||||
| MF1S7031XDUD2/V1A | NXP USA Inc. |
Description: IC RFID TRANSP 13.56MHZ DIESupplier Device Package: Die Standards: ISO 14443, MIFARE Operating Temperature: -25°C ~ 70°C Type: RFID Transponder Interface: UART Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: Die Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 141145 шт В кошику од. на суму грн. | |||||||||||||
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MC33FS6520NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
| MPF5024CMMA0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4Packaging: Tape & Reel (TR) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8 Processor Based Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| MCIMX93-QSB | NXP USA Inc. |
Description: I.MX 93 QSB DEV BOARD Packaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A55, Cortex®-M33 Utilized IC / Part: i.MX 93 |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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MC33771CTA2AER2 | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, ADVANCEQualification: AEC-Q100 Grade: Automotive Fault Protection: Over/Under Voltage Supplier Device Package: 64-LQFP (10x10) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 105°C (TA) Interface: SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 7 ~ 14 Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||
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MC33771CTA2AE | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, ADVANCEQualification: AEC-Q100 Grade: Automotive Fault Protection: Over/Under Voltage Supplier Device Package: 64-LQFP (10x10) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 105°C (TA) Interface: SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 7 ~ 14 Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||
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MC33771CTP2AER2 | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, PREMIUMQualification: AEC-Q100 Grade: Automotive Fault Protection: Over/Under Voltage Supplier Device Package: 64-LQFP (10x10) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 105°C (TA) Interface: SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 7 ~ 14 Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||
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MC33771CTP2AE | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, PREMIUMQualification: AEC-Q100 Grade: Automotive Fault Protection: Over/Under Voltage Supplier Device Package: 64-LQFP (10x10) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 105°C (TA) Interface: SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 7 ~ 14 Package / Case: 64-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33771CTA1AER2 | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, ADVANCEQualification: AEC-Q100 Grade: Automotive Fault Protection: Over/Under Voltage Supplier Device Package: 64-LQFP (10x10) Battery Chemistry: Lithium Ion Operating Temperature: -40°C ~ 105°C (TA) Interface: SPI Function: Battery Cell Controller Mounting Type: Surface Mount Number of Cells: 7 ~ 14 Package / Case: 64-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||
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MC33771CTP1AER2 | NXP USA Inc. |
Description: BATTERY CELL CONTROLLER, PREMIUMPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Number of Cells: 7 ~ 14 Mounting Type: Surface Mount Function: Battery Cell Controller Interface: SPI Operating Temperature: -40°C ~ 105°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over/Under Voltage Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||
| BATT-14EXTENDER | NXP USA Inc. |
Description: BATT-14EXTENDERPackaging: Bulk For Use With/Related Products: MC33771B, MC33771C Accessory Type: Extender Utilized IC / Part: MC33771B, MC33771C |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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BATT-14CEMULATOR | NXP USA Inc. |
Description: BATT-14CEMULATORPackaging: Bulk For Use With/Related Products: MC33771C Accessory Type: Battery Pack Emulator Utilized IC / Part: MC33771C |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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RD33771CNTREVM | NXP USA Inc. |
Description: EVAL BOARD FOR MC33771CPackaging: Bulk Function: Battery Cell Controller Type: Power Management Contents: Board(s), Cable(s), Power Supply Utilized IC / Part: MC33771C Primary Attributes: Li-Ion (14 Cells) Secondary Attributes: On-Board LEDs Embedded: Yes, MCU |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| S912ZVLA96AVFMR | NXP USA Inc. |
Description: IC MCU 16BITPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | |||||||||||||
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MC33FS6525CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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MC33FS6525NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC33FS6525NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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MC33FS6525KAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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MC33FS6525CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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MC33FS6525LAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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MC33FS6525KAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||
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MKE15Z256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPNumber of I/O: 58 Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LVD, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 27x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 32K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Cut Tape (CT) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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S912XEG128BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFPPackaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 750 шт В кошику од. на суму грн. | ||||||||||||
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74CBTLV16211DGG,11 | NXP USA Inc. |
Description: IC BUS SWITCH 24BIT LV 56-TSSOPPackaging: Bulk |
на замовлення 19943 шт: термін постачання 21-31 дні (днів) |
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S9S08DZ128F2MLLR | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 87 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||
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SPC5603BAMLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||
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LPC11E14FBD64/401, | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 457 шт: термін постачання 21-31 дні (днів) |
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FS32K148HFT0MLQT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| A5G26H605W19NR3 | NXP USA Inc. |
Description: A5G26H605W19NR3Packaging: Bulk Package / Case: OM-780-4S4S Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz Power - Output: 85W Gain: 14.2dB Technology: GaN Supplier Device Package: OM-780-4S4S Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 300 mA |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | |||||||||||||
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A7002CGHN1/T1AG502 | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTRDigiKey Programmable: Not Verified Supplier Device Package: 32-HVQFN (5x5) Core Processor: MX51 Applications: Authentication Program Memory Type: EEPROM (76.4kB) Controller Series: A700x Voltage - Supply: 1.62V ~ 5.5V Operating Temperature: -40°C ~ 90°C RAM Size: 3.2K x 8 Interface: I2C Mounting Type: Surface Mount Package / Case: 32-VFQFN Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCA9552D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS 25MA 24SOPackaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCA9552D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS 25MA 24SOPackaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
на замовлення 403 шт: термін постачання 21-31 дні (днів) |
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PCA9532D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS I2C 25MA 24SOPackaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||
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PCA9532D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS I2C 25MA 24SOPackaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
на замовлення 661 шт: термін постачання 21-31 дні (днів) |
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LD6836CX4/33H,315 | NXP USA Inc. |
Description: IC REG LINEAR 3.3V 300MA 4WLCSPCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.16V @ 300mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 3.3V Supplier Device Package: 4-WLCSP (0.76x0.76) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 300mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-XFBGA, WLCSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MPC565CZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGARAM Size: 36K x 8 Program Memory Size: 1MB (1M x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 56 Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Data Converters: A/D 40x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MGD3160AM515EKR2 | NXP USA Inc. |
Description: EV INVERTER CONTROL; IGBT & SICPackaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Current - Peak Output: 15A Technology: Capacitive Coupling Current - Output High, Low: 15A, 15A Voltage - Isolation: 8000Vrms Approval Agency: CSA, UL, VDE Supplier Device Package: 32-SOIC Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 4.75V ~ 40V Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||
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MGD3160AM515EKR2 | NXP USA Inc. |
Description: EV INVERTER CONTROL; IGBT & SICPackaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Current - Peak Output: 15A Technology: Capacitive Coupling Current - Output High, Low: 15A, 15A Voltage - Isolation: 8000Vrms Approval Agency: CSA, UL, VDE Supplier Device Package: 32-SOIC Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 4.75V ~ 40V Qualification: AEC-Q100 |
на замовлення 386 шт: термін постачання 21-31 дні (днів) |
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NAFE13388B40BSMP | NXP USA Inc. |
Description: IC AFE 24BIT 64-HVQFNPackaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||
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NAFE13388B40BSMP | NXP USA Inc. |
Description: IC AFE 24BIT 64-HVQFNPackaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
на замовлення 642 шт: термін постачання 21-31 дні (днів) |
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| SAF775DHN/N208WCMP | NXP USA Inc. |
Description: SAF775DHN/N208WCMP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| SAF775DHN/N208W/CK | NXP USA Inc. |
Description: SAF775DHN/N208W/CK Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||
| SAF7754HV/N208WY | NXP USA Inc. |
Description: CAR DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||
| SAF7754HV/N208WK | NXP USA Inc. |
Description: CAR DSP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | |||||||||||||
| SAF7755HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| SAF775DHV/N208W/FY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||
| SAF7755HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||
| SAF775DHV/N208W/BK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | |||||||||||||
| SAF7755HV/N208WY | NXP USA Inc. |
Description: MULTI-TUNER CAR RADIO & AUDIO ON Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | |||||||||||||
| SAF775CHN/N208WBMP | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| SAF775DHV/N208W/FK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | |||||||||||||
| SAF775CHN/N208WAMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| SAF775CHN/N208W/SK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||
| KMI85HP | NXP USA Inc. |
Description: KMI85 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| KMI85/WHP | NXP USA Inc. |
Description: KMI85 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| KMI85/PHP | NXP USA Inc. |
Description: KMI85 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. |
| MSC8151TAG1000B |
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Виробник: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
товару немає в наявності
В кошику
од. на суму грн.
| LPC2930FBD208,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 36 шт
В кошику
од. на суму грн.
| MF1S7001XDUD2/V1A |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Supplier Device Package: Die
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Description: IC RFID TRANSP 13.56MHZ DIE
Supplier Device Package: Die
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 141145 шт
В кошику
од. на суму грн.
| MF1S7031XDUD2/V1A |
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Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Supplier Device Package: Die
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Description: IC RFID TRANSP 13.56MHZ DIE
Supplier Device Package: Die
Standards: ISO 14443, MIFARE
Operating Temperature: -25°C ~ 70°C
Type: RFID Transponder
Interface: UART
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 141145 шт
В кошику
од. на суму грн.
| MC33FS6520NAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MPF5024CMMA0ESR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MCIMX93-QSB |
Виробник: NXP USA Inc.
Description: I.MX 93 QSB DEV BOARD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M33
Utilized IC / Part: i.MX 93
Description: I.MX 93 QSB DEV BOARD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M33
Utilized IC / Part: i.MX 93
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 25663.74 грн |
| MC33771CTA2AER2 |
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Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: BATTERY CELL CONTROLLER, ADVANCE
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MC33771CTA2AE |
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Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: BATTERY CELL CONTROLLER, ADVANCE
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| MC33771CTP2AER2 |
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Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: BATTERY CELL CONTROLLER, PREMIUM
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MC33771CTP2AE |
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Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Description: BATTERY CELL CONTROLLER, PREMIUM
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC33771CTA1AER2 |
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Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: BATTERY CELL CONTROLLER, ADVANCE
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Over/Under Voltage
Supplier Device Package: 64-LQFP (10x10)
Battery Chemistry: Lithium Ion
Operating Temperature: -40°C ~ 105°C (TA)
Interface: SPI
Function: Battery Cell Controller
Mounting Type: Surface Mount
Number of Cells: 7 ~ 14
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MC33771CTP1AER2 |
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Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| BATT-14EXTENDER |
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Виробник: NXP USA Inc.
Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
товару немає в наявності
В кошику
од. на суму грн.
| BATT-14CEMULATOR |
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Виробник: NXP USA Inc.
Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
товару немає в наявності
В кошику
од. на суму грн.
| RD33771CNTREVM |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6525CAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 429.60 грн |
| 10+ | 367.14 грн |
| 25+ | 350.12 грн |
| 40+ | 320.67 грн |
| 80+ | 309.37 грн |
| 250+ | 299.16 грн |
| MC33FS6525NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6525NAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
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| MC33FS6525KAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC33FS6525CAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
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| MC33FS6525LAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC33FS6525KAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| MKE15Z256VLH7R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 32K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Cut Tape (CT)
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 444.63 грн |
| 10+ | 329.12 грн |
| 25+ | 304.41 грн |
| 100+ | 260.20 грн |
| 250+ | 248.05 грн |
| 500+ | 240.73 грн |
| S912XEG128BCAAR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 750 шт
В кошику
од. на суму грн.
| 74CBTLV16211DGG,11 |
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на замовлення 19943 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 386+ | 57.36 грн |
| S9S08DZ128F2MLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| SPC5603BAMLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| LPC11E14FBD64/401, |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 457 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 383.71 грн |
| 10+ | 282.12 грн |
| 50+ | 247.24 грн |
| 100+ | 221.86 грн |
| 160+ | 216.02 грн |
| FS32K148HFT0MLQT |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
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| A5G26H605W19NR3 |
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Виробник: NXP USA Inc.
Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| A7002CGHN1/T1AG502 |
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Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Supplier Device Package: 32-HVQFN (5x5)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (76.4kB)
Controller Series: A700x
Voltage - Supply: 1.62V ~ 5.5V
Operating Temperature: -40°C ~ 90°C
RAM Size: 3.2K x 8
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
Description: SECURE AUTHENTICATION MICROCONTR
DigiKey Programmable: Not Verified
Supplier Device Package: 32-HVQFN (5x5)
Core Processor: MX51
Applications: Authentication
Program Memory Type: EEPROM (76.4kB)
Controller Series: A700x
Voltage - Supply: 1.62V ~ 5.5V
Operating Temperature: -40°C ~ 90°C
RAM Size: 3.2K x 8
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
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| PCA9552D,118 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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| PCA9552D,118 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 403 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 220.73 грн |
| 10+ | 159.08 грн |
| 25+ | 145.73 грн |
| 100+ | 123.01 грн |
| 250+ | 116.46 грн |
| PCA9532D,118 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
товару немає в наявності
Мінімальне замовлення: 1000 шт
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од. на суму грн.
| PCA9532D,118 |
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Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 661 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 227.63 грн |
| 10+ | 164.21 грн |
| 25+ | 150.45 грн |
| 100+ | 127.00 грн |
| 250+ | 120.23 грн |
| 500+ | 116.16 грн |
| LD6836CX4/33H,315 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.16V @ 300mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 300mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
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| MPC565CZP56 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
RAM Size: 36K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 40x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC MCU 32BIT 1MB FLASH 388PBGA
RAM Size: 36K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 40x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
товару немає в наявності
В кошику
од. на суму грн.
| MGD3160AM515EKR2 |
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Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MGD3160AM515EKR2 |
![]() |
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
на замовлення 386 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 685.15 грн |
| 10+ | 513.80 грн |
| 25+ | 477.38 грн |
| 100+ | 410.43 грн |
| 250+ | 403.71 грн |
| NAFE13388B40BSMP |
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Виробник: NXP USA Inc.
Description: IC AFE 24BIT 64-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC AFE 24BIT 64-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| NAFE13388B40BSMP |
![]() |
Виробник: NXP USA Inc.
Description: IC AFE 24BIT 64-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC AFE 24BIT 64-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
на замовлення 642 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1535.65 грн |
| 10+ | 1183.17 грн |
| 25+ | 1109.48 грн |
| 100+ | 980.87 грн |
| SAF775DHN/N208WCMP |
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| SAF775CHN/N208WBMP |
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| SAF775CHN/N208WAMP |
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.


















