Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35738) > Сторінка 546 з 596

Обрати Сторінку:   [  << Попередня Сторінка ]  1 59 118 177 236 295 354 413 472 531 541 542 543 544 545 546 547 548 549 550 551 590 596  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
S9S08AW60E5MFUE S9S08AW60E5MFUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
FS32K148UIT0VLQT NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
товару немає в наявності
В кошику  од. на суму  грн.
A5G07H800W19NR3 NXP USA Inc. A5G07H800W19N.pdf Description: A5G07H800W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 717MHz ~ 850MHz
Power - Output: 112W
Gain: 18.3dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
товару немає в наявності
В кошику  од. на суму  грн.
A5G08H800W19NR3 NXP USA Inc. A5G08H800W19N.pdf Description: A5G08H800W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 865MHz ~ 960MHz
Power - Output: 112W
Gain: 18.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96J0CLHR NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96J0CLH S9S12G96J0CLH NXP USA Inc. Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товару немає в наявності
В кошику  од. на суму  грн.
NCF29A8MHN3/0200IY NXP USA Inc. Description: NCF29A8MHN3
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
товару немає в наявності
В кошику  од. на суму  грн.
PEMI2STD/LP,115 PEMI2STD/LP,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
товару немає в наявності
В кошику  од. на суму  грн.
SPC5744PK1AMLQ9 SPC5744PK1AMLQ9 NXP USA Inc. Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
TEF7092AHN/V205Y NXP USA Inc. Description: TEF7092AHN
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
TEF3100HN/V205Y NXP USA Inc. Description: IC 64HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 64-HVQFN (9x9)
товару немає в наявності
В кошику  од. на суму  грн.
ZK-HC08LX-A NXP USA Inc. Description: MC68HC908LJ/LK EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908LJ/LK
товару немає в наявності
В кошику  од. на суму  грн.
MMPF0200F0ANES MMPF0200F0ANES NXP USA Inc. MMPF0200.pdf Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MPF5302AMDA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
1+528.73 грн
10+459.46 грн
25+438.08 грн
80+356.98 грн
230+340.94 грн
В кошику  од. на суму  грн.
MC33FS4506NAER2 NXP USA Inc. Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC33FS4506NAE NXP USA Inc. Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KIT-A1006-SHIELD NXP USA Inc. A1006_Demo-Dev_Kit.pdf Description: KIT-A1006-SHIELD
Packaging: Bulk
For Use With/Related Products: A1006
Accessory Type: Shield
товару немає в наявності
В кошику  од. на суму  грн.
FS32K148HFT0VLLR NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
товару немає в наявності
В кошику  од. на суму  грн.
FS32K144HAT0MLFR NXP USA Inc. S32K1xx.pdf Description: S32K144 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
товару немає в наявності
В кошику  од. на суму  грн.
1PS75SB45,115 1PS75SB45,115 NXP USA Inc. PHGL-S-A0000721047-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
на замовлення 29467 шт:
термін постачання 21-31 дні (днів)
6662+3.78 грн
Мінімальне замовлення: 6662
В кошику  од. на суму  грн.
1PS75SB45,135 1PS75SB45,135 NXP USA Inc. BAS40_1PSxxSB4x_Series_Rev9.pdf Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
6662+3.78 грн
Мінімальне замовлення: 6662
В кошику  од. на суму  грн.
S9S12GN32J0VFTR S9S12GN32J0VFTR NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
товару немає в наявності
В кошику  од. на суму  грн.
S9S12GN32J0VFT S9S12GN32J0VFT NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
товару немає в наявності
В кошику  од. на суму  грн.
S912ZVMAL1F0MLF S912ZVMAL1F0MLF NXP USA Inc. Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC33FS8420G0KS MC33FS8420G0KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC9S08AC96CFGE MC9S08AC96CFGE NXP USA Inc. MC9S08AC128.pdf Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
SPC5602BF2MLL4 SPC5602BF2MLL4 NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
FS32K148HFT0MMHT FS32K148HFT0MMHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156
товару немає в наявності
В кошику  од. на суму  грн.
PXLS70733AES NXP USA Inc. Description: SENSOR ACCELEROMETER UTA P2.0
Packaging: Tube
товару немає в наявності
В кошику  од. на суму  грн.
BAP70-05,215 BAP70-05,215 NXP USA Inc. BAP70-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
3000+17.13 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
BAP70-05,215 BAP70-05,215 NXP USA Inc. BAP70-05.pdf Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
на замовлення 5689 шт:
термін постачання 21-31 дні (днів)
9+38.90 грн
12+26.30 грн
25+23.49 грн
100+19.19 грн
250+17.82 грн
500+17.00 грн
1000+16.23 грн
Мінімальне замовлення: 9
В кошику  од. на суму  грн.
S9S12GN16BMLCR S9S12GN16BMLCR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12GN16BMLC S9S12GN16BMLC NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
AW690HNK/A2WMP NXP USA Inc. Description: AW690HNK/A2WMP
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
AW690HNK/A2WK NXP USA Inc. Description: IC
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
S9S12GN32J1MTJ NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
товару немає в наявності
В кошику  од. на суму  грн.
NCF29AEXHN4/0100ZY NXP USA Inc. Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
товару немає в наявності
В кошику  од. на суму  грн.
MFS5600AMMA7ESR2 NXP USA Inc. FS5600.pdf Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MPF5023CMBA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC34PF3001A5EPR2 MC34PF3001A5EPR2 NXP USA Inc. PF3001.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
товару немає в наявності
В кошику  од. на суму  грн.
MC35FS6505NAER2 NXP USA Inc. 35FS4500-35FS6500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MFS2602AMDA0ADR2 NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
товару немає в наявності
В кошику  од. на суму  грн.
MPF7100BVBA2ESR2 MPF7100BVBA2ESR2 NXP USA Inc. PF7100.pdf Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S912ZVCA19F1WLFR NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
товару немає в наявності
В кошику  од. на суму  грн.
MC33FS8435G0ESR2 MC33FS8435G0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MKV46F128VLL16R NXP USA Inc. KV4XP100M168.pdf Description: KINETIS KV46: 168MHZ M4F REAL-TI
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
MWCT2014SHVPAR NXP USA Inc. Description: MAXQFP100,512KB
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
S912XET256W1MAAR S912XET256W1MAAR NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
AW690HNK/A2AMP NXP USA Inc. Description: IC
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
SCBGARBU1AO NXP USA Inc. Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
товару немає в наявності
В кошику  од. на суму  грн.
8MPNAVQ-8GB-G 8MPNAVQ-8GB-G NXP USA Inc. 8MPNAVQQSG.pdf Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
1+35136.07 грн
10+29455.29 грн
В кошику  од. на суму  грн.
WCT-15WTXAUTO NXP USA Inc. WCT15WTXAUTOFS.pdf Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Contents: Board(s)
товару немає в наявності
В кошику  од. на суму  грн.
MKE02Z32VLC2R MKE02Z32VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+126.13 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
MKE02Z32VLC2R MKE02Z32VLC2R NXP USA Inc. MKE02P64M20SF0.pdf Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2+257.22 грн
10+186.46 грн
25+171.03 грн
100+144.62 грн
250+137.04 грн
500+132.47 грн
1000+126.60 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
NCK2910AHN/10204Y NXP USA Inc. Description: NCK2910AHN
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
KITPF5030FRDMEVM NXP USA Inc. UM11853.pdf Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+19263.79 грн
В кошику  од. на суму  грн.
MPC8358VRAGDGA MPC8358VRAGDGA NXP USA Inc. MPC8358EEC.pdf Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товару немає в наявності
В кошику  од. на суму  грн.
LFK46MINTPT4A NXP USA Inc. Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
товару немає в наявності
В кошику  од. на суму  грн.
TEA1998TS/1Z TEA1998TS/1Z NXP USA Inc. TEA1998TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
TEA1993TS/1Z TEA1993TS/1Z NXP USA Inc. TEA1993TS.pdf Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S08AW60E5MFUE MC9S08AW60.pdf
S9S08AW60E5MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
FS32K148UIT0VLQT S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
товару немає в наявності
В кошику  од. на суму  грн.
A5G07H800W19NR3 A5G07H800W19N.pdf
Виробник: NXP USA Inc.
Description: A5G07H800W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 717MHz ~ 850MHz
Power - Output: 112W
Gain: 18.3dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
товару немає в наявності
В кошику  од. на суму  грн.
A5G08H800W19NR3 A5G08H800W19N.pdf
Виробник: NXP USA Inc.
Description: A5G08H800W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 865MHz ~ 960MHz
Power - Output: 112W
Gain: 18.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96J0CLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товару немає в наявності
В кошику  од. на суму  грн.
S9S12G96J0CLH
S9S12G96J0CLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 3K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
товару немає в наявності
В кошику  од. на суму  грн.
NCF29A8MHN3/0200IY
Виробник: NXP USA Inc.
Description: NCF29A8MHN3
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
товару немає в наявності
В кошику  од. на суму  грн.
PEMI2STD/LP,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LP,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/18.5PF SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 18.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
товару немає в наявності
В кошику  од. на суму  грн.
SPC5744PK1AMLQ9
SPC5744PK1AMLQ9
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
TEF7092AHN/V205Y
Виробник: NXP USA Inc.
Description: TEF7092AHN
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
TEF3100HN/V205Y
Виробник: NXP USA Inc.
Description: IC 64HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 64-HVQFN (9x9)
товару немає в наявності
В кошику  од. на суму  грн.
ZK-HC08LX-A
Виробник: NXP USA Inc.
Description: MC68HC908LJ/LK EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908LJ/LK
товару немає в наявності
В кошику  од. на суму  грн.
MMPF0200F0ANES MMPF0200.pdf
MMPF0200F0ANES
Виробник: NXP USA Inc.
Description: IC REG CONV I.MX6 11OUT 56QFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 11
Voltage - Input: 2.8V ~ 4.5V
Operating Temperature: -40°C ~ 105°C (TA)
Applications: Converter, i.MX6
Supplier Device Package: 56-QFN-EP (8x8)
товару немає в наявності
В кошику  од. на суму  грн.
MPF5302AMDA0ES PF5300_SDS.pdf
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 15A
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
на замовлення 450 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+528.73 грн
10+459.46 грн
25+438.08 грн
80+356.98 грн
230+340.94 грн
В кошику  од. на суму  грн.
MC33FS4506NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC33FS4506NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
KIT-A1006-SHIELD A1006_Demo-Dev_Kit.pdf
Виробник: NXP USA Inc.
Description: KIT-A1006-SHIELD
Packaging: Bulk
For Use With/Related Products: A1006
Accessory Type: Shield
товару немає в наявності
В кошику  од. на суму  грн.
FS32K148HFT0VLLR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
товару немає в наявності
В кошику  од. на суму  грн.
FS32K144HAT0MLFR S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K144 ARM CORTEX-M4F, 80 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 43
товару немає в наявності
В кошику  од. на суму  грн.
1PS75SB45,115 PHGL-S-A0000721047-1.pdf?t.download=true&u=5oefqw
1PS75SB45,115
Виробник: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
на замовлення 29467 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6662+3.78 грн
Мінімальне замовлення: 6662
В кошику  од. на суму  грн.
1PS75SB45,135 BAS40_1PSxxSB4x_Series_Rev9.pdf
1PS75SB45,135
Виробник: NXP USA Inc.
Description: DIODE ARR SCHOTT 40V 120MA SC75
Packaging: Bulk
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Technology: Schottky
Diode Configuration: 1 Pair Common Cathode
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Supplier Device Package: SC-75
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 40 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Current - Reverse Leakage @ Vr: 10 µA @ 40 V
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6662+3.78 грн
Мінімальне замовлення: 6662
В кошику  од. на суму  грн.
S9S12GN32J0VFTR
S9S12GN32J0VFTR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
товару немає в наявності
В кошику  од. на суму  грн.
S9S12GN32J0VFT
S9S12GN32J0VFT
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
товару немає в наявності
В кошику  од. на суму  грн.
S912ZVMAL1F0MLF
S912ZVMAL1F0MLF
Виробник: NXP USA Inc.
Description: VMA16, 16K FLASH, 1K RAM, 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 7x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Connectivity: LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 31
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC33FS8420G0KS FS84_FS85C_DS.pdf
MC33FS8420G0KS
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC9S08AC96CFGE MC9S08AC128.pdf
MC9S08AC96CFGE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 38
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
SPC5602BF2MLL4
SPC5602BF2MLL4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
FS32K148HFT0MMHT S32K1xx.pdf
FS32K148HFT0MMHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 156
товару немає в наявності
В кошику  од. на суму  грн.
PXLS70733AES
Виробник: NXP USA Inc.
Description: SENSOR ACCELEROMETER UTA P2.0
Packaging: Tube
товару немає в наявності
В кошику  од. на суму  грн.
BAP70-05,215 BAP70-05.pdf
BAP70-05,215
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3000+17.13 грн
Мінімальне замовлення: 3000
В кошику  од. на суму  грн.
BAP70-05,215 BAP70-05.pdf
BAP70-05,215
Виробник: NXP USA Inc.
Description: RF DIODE PIN 50V 250MW SOT-23
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Diode Type: PIN - 1 Pair Common Cathode
Operating Temperature: -65°C ~ 150°C (TJ)
Capacitance @ Vr, F: 0.3pF @ 20V, 1MHz
Resistance @ If, F: 1.9Ohm @ 100mA, 100MHz
Voltage - Peak Reverse (Max): 50V
Supplier Device Package: SOT-23 (TO-236AB)
Current - Max: 100 mA
Power Dissipation (Max): 250 mW
на замовлення 5689 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+38.90 грн
12+26.30 грн
25+23.49 грн
100+19.19 грн
250+17.82 грн
500+17.00 грн
1000+16.23 грн
Мінімальне замовлення: 9
В кошику  од. на суму  грн.
S9S12GN16BMLCR S12G%20Family%20Fact%20Sheet.pdf
S9S12GN16BMLCR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
S9S12GN16BMLC
S9S12GN16BMLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 12V1
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
AW690HNK/A2WMP
Виробник: NXP USA Inc.
Description: AW690HNK/A2WMP
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
AW690HNK/A2WK
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
S9S12GN32J1MTJ
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 14
товару немає в наявності
В кошику  од. на суму  грн.
NCF29AEXHN4/0100ZY
Виробник: NXP USA Inc.
Description: NCF29AEXHN4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HVQFN (6x6)
товару немає в наявності
В кошику  од. на суму  грн.
MFS5600AMMA7ESR2 FS5600.pdf
Виробник: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MPF5023CMBA0ESR2 PF5023.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MC34PF3001A5EPR2 PF3001.pdf
MC34PF3001A5EPR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: Processor
Supplier Device Package: 48-HVQFN (7x7)
товару немає в наявності
В кошику  од. на суму  грн.
MC35FS6505NAER2 35FS4500-35FS6500SDS-ASILB.pdf
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MFS2602AMDA0ADR2 PB_FS26.pdf
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
товару немає в наявності
В кошику  од. на суму  грн.
MPF7100BVBA2ESR2 PF7100.pdf
MPF7100BVBA2ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8XL WI
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: i.MX Processors
Current - Supply: 10µA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
S912ZVCA19F1WLFR
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 192KB (192K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 28
товару немає в наявності
В кошику  од. на суму  грн.
MC33FS8435G0ESR2 FS84_FS85C_DS.pdf
MC33FS8435G0ESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
MKV46F128VLL16R KV4XP100M168.pdf
Виробник: NXP USA Inc.
Description: KINETIS KV46: 168MHZ M4F REAL-TI
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
MWCT2014SHVPAR
Виробник: NXP USA Inc.
Description: MAXQFP100,512KB
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
S912XET256W1MAAR
S912XET256W1MAAR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
AW690HNK/A2AMP
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
SCBGARBU1AO
Виробник: NXP USA Inc.
Description: BGA RECEIVER/ADAPTER, 324 PIN, 1
Packaging: Bulk
Module/Board Type: Socket Module - BGA
товару немає в наявності
В кошику  од. на суму  грн.
8MPNAVQ-8GB-G 8MPNAVQQSG.pdf
8MPNAVQ-8GB-G
Виробник: NXP USA Inc.
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+35136.07 грн
10+29455.29 грн
В кошику  од. на суму  грн.
WCT-15WTXAUTO WCT15WTXAUTOFS.pdf
Виробник: NXP USA Inc.
Description: WCT-15WTXAUTO
Packaging: Bulk
Function: Wireless Power Supply/Charging
Type: Power Management
Supplied Contents: Board(s)
Primary Attributes: Transmitter
Contents: Board(s)
товару немає в наявності
В кошику  од. на суму  грн.
MKE02Z32VLC2R MKE02P64M20SF0.pdf
MKE02Z32VLC2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+126.13 грн
Мінімальне замовлення: 2000
В кошику  од. на суму  грн.
MKE02Z32VLC2R MKE02P64M20SF0.pdf
MKE02Z32VLC2R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+257.22 грн
10+186.46 грн
25+171.03 грн
100+144.62 грн
250+137.04 грн
500+132.47 грн
1000+126.60 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
NCK2910AHN/10204Y
Виробник: NXP USA Inc.
Description: NCK2910AHN
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
KITPF5030FRDMEVM UM11853.pdf
Виробник: NXP USA Inc.
Description: KITPF5030FRDMEVM
Packaging: Bulk
Function: Power Supply
Type: Power Management
Utilized IC / Part: PF5030
Supplied Contents: Board(s), Cable(s), Accessories
Embedded: Yes, MCU
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+19263.79 грн
В кошику  од. на суму  грн.
MPC8358VRAGDGA MPC8358EEC.pdf
MPC8358VRAGDGA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товару немає в наявності
В кошику  од. на суму  грн.
LFK46MINTPT4A
Виробник: NXP USA Inc.
Description: QORIVVA MPC5746M ON A 292 PIN 0.
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
товару немає в наявності
В кошику  од. на суму  грн.
TEA1998TS/1Z TEA1998TS.pdf
TEA1998TS/1Z
Виробник: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 60V
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 250 µA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
TEA1993TS/1Z TEA1993TS.pdf
TEA1993TS/1Z
Виробник: NXP USA Inc.
Description: IC SYNC RECT CONTROLLER 6TSOP
Packaging: Tape & Reel (TR)
Package / Case: SC-74, SOT-457
Mounting Type: Surface Mount
Applications: Secondary-Side Controller, Synchronous Rectifier
Supplier Device Package: SC-74
Current - Supply: 200 µA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
Обрати Сторінку:   [  << Попередня Сторінка ]  1 59 118 177 236 295 354 413 472 531 541 542 543 544 545 546 547 548 549 550 551 590 596  [ Наступна Сторінка >> ]