Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36847) > Сторінка 556 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
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| S912ZVC64ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 28 Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | |||||||||||||||
| FH32K144HAT0MLFT | NXP USA Inc. |
Description: S32K144, 512K FLASH, 64K RAM Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | |||||||||||||||
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LPC11U37HFBD64/4QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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P3A9606JK-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR P3A9606Embedded: No Primary Attributes: 2-Channel (Dual) Utilized IC / Part: P3A9606 Contents: Board(s) Type: Interface Function: Level Shifter Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74AUP1G07GX,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 5X2SONPackaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 5-X2SON (0.80x0.80) |
на замовлення 9500 шт: термін постачання 21-31 дні (днів) |
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MC9S08LC36LH | NXP USA Inc. |
Description: IC MCU 8BIT 36KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 36KB (36K x 8) RAM Size: 2.5K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08LC36LH | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 36KB (36K x 8) RAM Size: 2.5K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 700 шт: термін постачання 21-31 дні (днів) |
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| ON5200,118 | NXP USA Inc. |
Description: RF MOSFET D2PAK Packaging: Tape & Reel (TR) Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Supplier Device Package: D2PAK |
товару немає в наявності |
Мінімальне замовлення: 4800 шт В кошику од. на суму грн. | |||||||||||||||
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S912XEP100J5CAG | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 119 Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | ||||||||||||||
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MC35FS6507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCOQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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MC35FS6507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCOQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||||
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MC33AR6000BGT | NXP USA Inc. |
Description: IC REG ALTERNATOR 1OUT TO220-5Grade: Automotive Supplier Device Package: TO-220-5 Applications: Alternator, 3-Phase Operating Temperature: -40°C ~ 125°C (TA) Voltage - Input: 5V ~ 16.5V Number of Outputs: 1 Mounting Type: Through Hole Voltage - Output: 10.6V ~ 16V Package / Case: TO-220-5 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MK20DX256VLK10R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFPPackaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
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MK20DX256VLK10R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFPPackaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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| A3T21H456W23SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOSPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 150 шт В кошику од. на суму грн. | |||||||||||||||
| RDA777T2 | NXP USA Inc. |
Description: RDA777T2 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MF1PH4230DA4/00J | NXP USA Inc. |
Description: MIFAREA PLUS EV2Operating Temperature: -25°C ~ 85°C (TA) Type: RFID Reader Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: MOA4, Smart Card Module Packaging: Tape & Reel (TR) Supplier Device Package: PLLMC Standards: Mifare, NFC |
товару немає в наявності |
Мінімальне замовлення: 17500 шт В кошику од. на суму грн. | |||||||||||||||
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SPC5643AF0MVZ2 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 324PBGADigiKey Programmable: Not Verified Number of I/O: 151 Supplier Device Package: 324-PBGA (23x23) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 40x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 3MB (3M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 324-BBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||||
| S32G233ASBK0VUCT | NXP USA Inc. |
Description: S32G233A ARM CORTEX-M7 AND -A53,Package / Case: 525-FBGA, FCBGA Packaging: Tray Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No RAM Controllers: DDR3L, LPDDR4 Co-Processors/DSP: Multimedia; NEON Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit USB: USB 2.0 OTG (1) Ethernet: GbE (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz, 1GHz Mounting Type: Surface Mount Qualification: AEC-Q100 Grade: Automotive |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | |||||||||||||||
| SLS1046ASN8T1A | NXP USA Inc. |
Description: SLS1046A ST 1.8GHZ DDR 2100 MT/ Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||
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TDA8034T/C1,112 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 16SOSupplier Device Package: 16-SO Voltage - Supply: 3V, 5V Interface: Analog Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tube |
на замовлення 653 шт: термін постачання 21-31 дні (днів) |
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MC9S12GC64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFPCore Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 60 Supplier Device Package: 80-QFP (14x14) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | ||||||||||||||
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MC35FS6518CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOApplications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
| S32G234MSBK1VUCR | NXP USA Inc. |
Description: S32G234M ARM CORTEX-M7, HSE W/PRQualification: AEC-Q100 Grade: Automotive Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No Co-Processors/DSP: Multimedia; NEON Number of Cores/Bus Width: 3 Core, 32/64-Bit Ethernet: 1/2.5Gbps (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| NCK2982RHN/10101Y | NXP USA Inc. |
Description: NCK2982RHN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MIMX8UD7CVP08SC | NXP USA Inc. |
Description: I.MX8ULP, DUAL 800MHZSupplier Device Package: 485-LFBGA (15x15) Mounting Type: Surface Mount Package / Case: 485-LFBGA Packaging: Tray |
на замовлення 170 шт: термін постачання 21-31 дні (днів) |
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MPF5020CMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 487 шт: термін постачання 21-31 дні (днів) |
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MPF5024CMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 40-HVQFN (6x6) Applications: High Performance i.MX 8 Processor Based Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
на замовлення 480 шт: термін постачання 21-31 дні (днів) |
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MPF7100BVMA3ES | NXP USA Inc. |
Description: PF7100 PMIC I.MX8DXP/DXQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HVQFN (7x7) Current - Supply: 10µA Applications: i.MX Processors Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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MIMX8US5DVP08SC | NXP USA Inc. |
Description: I.MX8ULP, SOLO 800MHZPackaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Supplier Device Package: 485-LFBGA (15x15) |
на замовлення 530 шт: термін постачання 21-31 дні (днів) |
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MSC8157TAG1000A | NXP USA Inc. |
Description: IC DSP 6X 1GHZ SC3850 783FCBGAInterface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray Supplier Device Package: 783-FCPBGA (29x29) Clock Rate: 1GHz Voltage - Core: 1.00V Voltage - I/O: 1.0V, 1.5V, 2.5V On-Chip RAM: 6.375MB Non-Volatile Memory: ROM (96KB) Operating Temperature: -40°C ~ 105°C (TJ) Type: SC3850 Six Core |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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CBT3306D,118 | NXP USA Inc. |
Description: IC BUS SWITCH 1 X 1:1 8SOSupplier Device Package: 8-SO Voltage Supply Source: Single Supply Independent Circuits: 2 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Bus Switch Circuit: 1 x 1:1 Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
на замовлення 14665 шт: термін постачання 21-31 дні (днів) |
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PEMH7,115 | NXP USA Inc. |
Description: TRANS 2NPN PREBIAS 0.3W SOT666Packaging: Bulk |
на замовлення 132000 шт: термін постачання 21-31 дні (днів) |
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| MRF6VP11KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Voltage - Test: 50 V Voltage - Rated: 110 V Supplier Device Package: NI-1230 Technology: LDMOS (Dual) Gain: 26dB Power - Output: 1000W Configuration: 2 N-Channel Frequency: 1.8MHz ~ 150MHz Mounting Type: Chassis Mount Package / Case: NI-1230 Packaging: Bulk Current - Test: 6 A |
на замовлення 805 шт: термін постачання 21-31 дні (днів) |
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MC35FS4500NAE | NXP USA Inc. |
Description: FS4500Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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SPC5742PK1MLQ5R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPDigiKey Programmable: Not Verified Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 64x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||
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SPC5742PK1MLQ5 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPDigiKey Programmable: Not Verified Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 64x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||||
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SPC5744BK1AMMH2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 100MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 100-MAPBGA (11x11) Peripherals: DMA, I2S, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 36x10b, 16x12b Core Processor: e200z4 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 880 шт В кошику од. на суму грн. | ||||||||||||||
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MC33937APEK | NXP USA Inc. |
Description: IC MOTOR DRIVER 6V-58V 54SOICGrade: Automotive Motor Type - AC, DC: Brushless DC (BLDC) Supplier Device Package: 54-SOIC-EP Technology: NMOS Voltage - Supply: 6V ~ 58V Output Configuration: Pre-Driver - Half Bridge (3) Operating Temperature: -40°C ~ 135°C (TA) Interface: SPI Function: Controller - Commutation, Direction Management Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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PCA9958HNY | NXP USA Inc. |
Description: PCA9958HNYType: Linear Frequency: 31.25kHz Number of Outputs: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Cut Tape (CT) Voltage - Supply (Max): 5.5V Voltage - Supply (Min): 2.7V Dimming: PWM, SPI Supplier Device Package: 40-HVQFN (6x6) Topology: Constant Current Internal Switch(s): No Current - Output / Channel: 63mA Applications: General Purpose Operating Temperature: -40°C ~ 85°C (TA) |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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MCXC243VFT | NXP USA Inc. |
Description: 48MHz, Cortex-M0+, USBNumber of I/O: 36 Supplier Device Package: 48-QFN (7x7) Peripherals: DMA, PWM, WDT Connectivity: I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-UFQFN Exposed Pad Packaging: Tray |
на замовлення 1263 шт: термін постачання 21-31 дні (днів) |
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MPC8315ECVRAGDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGAAdditional Interfaces: DUART, I2C, PCI, SPI, TDM SATA: SATA 3Gbps (2) Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 3.3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||
| S9S12VRP64F0MLFR | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12 CORE, 64K Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||
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MC908AP16ACFBE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08Packaging: Bulk DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| TDA19988AET/C1,151 | NXP USA Inc. |
Description: IC VIDEO HDMI TRANS 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Function: Transmitter Applications: Consumer Video Standards: HDMI 1.4a, ITU656 Supplier Device Package: 64-TFBGA (4.5x4.5) Control Interface: I2S |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| TDA19988BET/C1,151 | NXP USA Inc. |
Description: IC VIDEO HDMI TRANS 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Function: Transmitter Applications: Consumer Video Standards: HDMI 1.4a, ITU656 Supplier Device Package: 64-TFBGA (4.5x4.5) Control Interface: I2S |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MC56F84550VLF | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFPConnectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x12b; D/A 1x12b Core Processor: 56800EX EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
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MC56F84550VLFR | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFPCore Size: 32-Bit Single-Core Data Converters: A/D 10x12b; D/A 1x12b Core Processor: 56800EX EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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UJA1079ATW/3/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 75µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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UJA1079ATW/5/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 75µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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UJA1079ATW/3W/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 75µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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A7101CHTK2/T0BC2VJ | NXP USA Inc. |
Description: SECURE AUTHENTICATIONOperating Temperature: -25°C ~ 90°C (TA) Interface: I2C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Packaging: Bulk DigiKey Programmable: Not Verified Supplier Device Package: 8-HVSON (4x4) Core Processor: MX51 Applications: Authentication Voltage - Supply: 2.5V ~ 3.6V |
на замовлення 1897 шт: термін постачання 21-31 дні (днів) |
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MKW31Z256VHT4 | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 64VFLGADigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, UART RF Family/Standard: Bluetooth Modulation: FSK, GFSK, MSK, O-QPSK Supplier Device Package: 64-VFLGA (7x7) Current - Transmitting: 6mA Data Rate (Max): 1Mbps Current - Receiving: 6.2mA Protocol: Bluetooth v4.2 Power - Output: 3.5dBm Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -95dBm Package / Case: 64-VFLGA Packaging: Tray Type: TxRx + MCU Memory Size: 256kB Flash, 64kB RAM Voltage - Supply: 1.71V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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MPC8347VRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGAAdditional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||
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MRF8P20100HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Technology: LDMOS Gain: 16dB Power - Output: 20W Configuration: Dual Frequency: 2.03GHz Mounting Type: Surface Mount Package / Case: NI-780S-4L Packaging: Tape & Reel (TR) Current - Test: 400 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780S-4L |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5605BF1MLU6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 176LQFPDigiKey Programmable: Not Verified Number of I/O: 149 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 29x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 768KB (768K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||
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FRDM-MCXC444 | NXP USA Inc. |
Description: FREEDOM MCXC444 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: MCXC444 Platform: Freedom |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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| K32W032S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK WLCSP Packaging: Cut Tape (CT) Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 191-WLCSP (5.97x5.85) Number of I/O: 104 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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74AUP2G132GD,125 | NXP USA Inc. |
Description: IC GATE NAND 2CH 2-INP 8-XSONMax Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF Input Logic Level - Low: 0.1V ~ 0.88V Input Logic Level - High: 0.6V ~ 2.29V Supplier Device Package: 8-XSON (2x3) Number of Inputs: 2 Current - Output High, Low: 4mA, 4mA Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 8-XFDFN Features: Schmitt Trigger Packaging: Bulk Current - Quiescent (Max): 500 nA Number of Circuits: 2 |
на замовлення 447102 шт: термін постачання 21-31 дні (днів) |
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74AUP2G126GD,125 | NXP USA Inc. |
Description: IC BUFFER/LINEDVR DUAL XSON8USupplier Device Package: 8-XSON (2x3) Current - Output High, Low: 4mA, 4mA Number of Bits per Element: 1 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 84319 шт: термін постачання 21-31 дні (днів) |
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| S912ZVC64ACLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| LPC11U37HFBD64/4QL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P3A9606JK-EVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 74AUP1G07GX,125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
на замовлення 9500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4661+ | 4.54 грн |
| MC9S08LC36LH |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08LC36LH |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 700 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 49+ | 471.84 грн |
| ON5200,118 |
Виробник: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
товару немає в наявності
Мінімальне замовлення: 4800 шт
В кошику
од. на суму грн.
| S912XEP100J5CAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 300 шт
В кошику
од. на суму грн.
| MC35FS6507NAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC35FS6507NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| MC33AR6000BGT |
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Виробник: NXP USA Inc.
Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| MK20DX256VLK10R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MK20DX256VLK10R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 848.13 грн |
| 10+ | 641.11 грн |
| 25+ | 597.21 грн |
| 100+ | 515.19 грн |
| 250+ | 506.68 грн |
| MF1PH4230DA4/00J |
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Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
товару немає в наявності
Мінімальне замовлення: 17500 шт
В кошику
од. на суму грн.
| SPC5643AF0MVZ2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| S32G233ASBK0VUCT |
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Виробник: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| TDA8034T/C1,112 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
на замовлення 653 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 83.86 грн |
| 10+ | 58.59 грн |
| 50+ | 49.55 грн |
| 100+ | 43.87 грн |
| 250+ | 41.09 грн |
| 500+ | 39.42 грн |
| MC9S12GC64MFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| MC35FS6518CAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| S32G234MSBK1VUCR |
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Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| MIMX8UD7CVP08SC |
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Виробник: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
на замовлення 170 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1788.03 грн |
| 10+ | 1386.28 грн |
| 25+ | 1302.29 грн |
| 100+ | 1135.60 грн |
| MPF5020CMBA0ES |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 487 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 506.34 грн |
| 10+ | 376.05 грн |
| 25+ | 348.23 грн |
| 100+ | 298.07 грн |
| MPF5024CMBA0ES |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
на замовлення 480 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 500.81 грн |
| 10+ | 372.47 грн |
| 25+ | 344.97 грн |
| 100+ | 295.37 грн |
| MPF7100BVMA3ES |
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Виробник: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 540.36 грн |
| 10+ | 402.87 грн |
| 25+ | 373.43 грн |
| 100+ | 320.13 грн |
| 260+ | 305.14 грн |
| MIMX8US5DVP08SC |
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Виробник: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 530 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1306.21 грн |
| 10+ | 1001.01 грн |
| 25+ | 936.91 грн |
| 100+ | 813.09 грн |
| 250+ | 781.56 грн |
| MSC8157TAG1000A |
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Виробник: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
товару немає в наявності
В кошику
од. на суму грн.
| CBT3306D,118 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
на замовлення 14665 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1268+ | 18.18 грн |
| PEMH7,115 |
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на замовлення 132000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6772+ | 3.03 грн |
| MRF6VP11KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
на замовлення 805 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 22621.72 грн |
| MC35FS4500NAE |
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Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 603.66 грн |
| 10+ | 451.17 грн |
| 25+ | 418.57 грн |
| 100+ | 359.19 грн |
| 250+ | 343.15 грн |
| SPC5742PK1MLQ5R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| SPC5742PK1MLQ5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| SPC5744BK1AMMH2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 880 шт
В кошику
од. на суму грн.
| MC33937APEK |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 458.08 грн |
| PCA9958HNY |
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Виробник: NXP USA Inc.
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 208.08 грн |
| 10+ | 149.40 грн |
| 25+ | 136.65 грн |
| 100+ | 115.12 грн |
| 250+ | 108.86 грн |
| 500+ | 105.09 грн |
| 1000+ | 100.31 грн |
| MCXC243VFT |
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Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
на замовлення 1263 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 203.33 грн |
| 10+ | 145.97 грн |
| 50+ | 126.18 грн |
| 100+ | 112.66 грн |
| 500+ | 102.90 грн |
| MPC8315ECVRAGDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 36 шт
В кошику
од. на суму грн.
| MC908AP16ACFBE557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
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В кошику
од. на суму грн.
| TDA19988AET/C1,151 |
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Виробник: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
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| TDA19988BET/C1,151 |
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Виробник: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
товару немає в наявності
В кошику
од. на суму грн.
| MC56F84550VLF |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| MC56F84550VLFR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
товару немає в наявності
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| UJA1079ATW/3/2Z |
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
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од. на суму грн.
| UJA1079ATW/5/2Z |
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| UJA1079ATW/3W/2Z |
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
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од. на суму грн.
| A7101CHTK2/T0BC2VJ |
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Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
на замовлення 1897 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 183+ | 124.21 грн |
| MKW31Z256VHT4 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 585.46 грн |
| 10+ | 488.81 грн |
| 25+ | 462.81 грн |
| 100+ | 400.79 грн |
| 260+ | 379.88 грн |
| 520+ | 365.74 грн |
| MPC8347VRADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 36 шт
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| MRF8P20100HSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
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| SPC5605BF1MLU6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 500 шт
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| FRDM-MCXC444 |
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Виробник: NXP USA Inc.
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1452.57 грн |
| K32W032S1M2CAVAR |
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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| 74AUP2G132GD,125 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
на замовлення 447102 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2049+ | 11.36 грн |
| 74AUP2G126GD,125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 84319 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2049+ | 10.95 грн |































