Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36604) > Сторінка 556 з 611
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| NXH2004UK/A2Z | NXP USA Inc. |
Description: NXH2004UK/A2Z Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||
|
S912ZVC19F1WLFR | NXP USA Inc. |
Description: S12Z, 48LQFP, 192K FLASH Number of I/O: 28 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b SAR Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
|
S912ZVC19F1WLF | NXP USA Inc. |
Description: S12Z, 48LQFP, 192K FLASH Number of I/O: 28 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b SAR Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
|
S912ZVCA19F1WLF | NXP USA Inc. |
Description: S12Z, 48LQFP, 192K FLASH Number of I/O: 28 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x12b SAR; D/A 1x8b Core Processor: S12Z EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 12K x 8 Program Memory Size: 192KB (192K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
| KIT-UCANS32K1SCT | NXP USA Inc. |
Description: EVAL BOARD FOR TJA1153AEmbedded: Yes, MCU, 32-Bit Utilized IC / Part: TJA1153A Contents: Board(s), Cable(s) Type: Interface Function: CAN Transceiver Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
74AUP2G3407GMH | NXP USA Inc. |
Description: IC BUFF 0.8V/3.6V 6-XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA; 4mA, 4mA Supplier Device Package: 6-XSON (1.45x1) |
на замовлення 90000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
S9S12G64ACLHR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||
|
|
S9S12G48AMLHR | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFPDigiKey Programmable: Not Verified Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 1.5K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 48KB (48K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||
|
|
S9S12G64ACLH | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 54 Supplier Device Package: 64-LQFP (10x10) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||
|
|
S9S12G48AMLH | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: 12V1 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||
| NCF29AGVHNF/0500ZY | NXP USA Inc. |
Description: NCF29AGVHNF/0500ZY Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||
| NCF29AGXHN4/0500ZY | NXP USA Inc. |
Description: NCF29AGXHN4/0500ZY Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||
| S9S12GN16J0MLFR | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFP Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||
|
S9S12GN16J0MLF | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
| S9S12G64J1VLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | |||||||||||||||
| S9S12G64J1MLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | |||||||||||||||
|
BFU768F,115 | NXP USA Inc. |
Description: RF TRANS NPN 2.8V 70MA 4DFPPackaging: Tape & Reel (TR) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.1dB Power - Max: 220mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz Supplier Device Package: 4-DFP |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | ||||||||||||||
|
BFU768F,115 | NXP USA Inc. |
Description: RF TRANS NPN 2.8V 70MA 4DFPPackaging: Cut Tape (CT) Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: 150°C (TJ) Gain: 13.1dB Power - Max: 220mW Current - Collector (Ic) (Max): 70mA Voltage - Collector Emitter Breakdown (Max): 2.8V DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz Supplier Device Package: 4-DFP |
на замовлення 268 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
BFU520XRR | NXP USA Inc. |
Description: RF TRANS NPN 12V 10.5GHZ SOT143RQualification: AEC-Q101 Grade: Automotive Supplier Device Package: SOT-143R Noise Figure (dB Typ @ f): 0.65dB @ 900MHz Frequency - Transition: 10.5GHz DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Voltage - Collector Emitter Breakdown (Max): 12V Current - Collector (Ic) (Max): 30mA Power - Max: 450mW Gain: 20dB Operating Temperature: -40°C ~ 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: SOT-143R Packaging: Tape & Reel (TR) |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
BFU520XRR | NXP USA Inc. |
Description: RF TRANS NPN 12V 10.5GHZ SOT143RPackaging: Cut Tape (CT) Package / Case: SOT-143R Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 20dB Power - Max: 450mW Current - Collector (Ic) (Max): 30mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V Frequency - Transition: 10.5GHz Noise Figure (dB Typ @ f): 0.65dB @ 900MHz Supplier Device Package: SOT-143R Grade: Automotive Qualification: AEC-Q101 |
на замовлення 5924 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
SA56004AD,112 | NXP USA Inc. |
Description: SENSOR DIGITAL -40C-125C 8SOSensing Temperature - Remote: -40°C ~ 125°C Sensing Temperature - Local: -40°C ~ 125°C Accuracy - Highest (Lowest): ±2°C (±3°C) Test Condition: 60°C ~ 100°C (-40°C ~ 125°C) Supplier Device Package: 8-SO Resolution: 10 b Sensor Type: Digital, Local/Remote Voltage - Supply: 3V ~ 5.5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Output Type: I2C/SMBus Package / Case: 8-SOIC (0.154", 3.90mm Width) Features: Output Switch, Programmable Limit Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PDTC144VM,315 | NXP USA Inc. |
Description: TRANS PREBIAS NPN 250MW SOT883Packaging: Bulk |
на замовлення 80000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| MCIMX6X1CVO08AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGAPackaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | |||||||||||||||
|
MCIMX6X3CVO08AB | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGAAdditional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Display & Interface Controllers: Keypad, LCD Graphics Acceleration: Yes RAM Controllers: LPDDR2, LVDDR3, DDR3 Co-Processors/DSP: Multimedia; NEON™ MPE Number of Cores/Bus Width: 2 Core, 32-Bit USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 400-MAPBGA (17x17) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Operating Temperature: -40°C ~ 105°C (TA) Speed: 200MHz, 800MHz Mounting Type: Surface Mount Package / Case: 400-LFBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||||
| MMA2204KEGR2 | NXP USA Inc. |
Description: ACCEL 112.5G ANALOG 16SOICQualification: AEC-Q100 Grade: Automotive Sensitivity (mV/g): 20 Supplier Device Package: 16-SOIC Bandwidth: 400Hz Voltage - Supply: 4.75V ~ 5.25V Operating Temperature: -40°C ~ 125°C Acceleration Range: ±112.5g Axis: X Type: Analog Mounting Type: Surface Mount Output Type: Analog Voltage Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
NVT4557UKAZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 9-WLCSPPackaging: Tape & Reel (TR) Package / Case: 9-XFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 10MHz Supplier Device Package: 9-WLCSP (0.92x0.92) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Number of Circuits: 1 |
товару немає в наявності |
Мінімальне замовлення: 20000 шт В кошику од. на суму грн. | ||||||||||||||
|
NVT4557UKAZ | NXP USA Inc. |
Description: IC XLTR VL BIDIR 9-WLCSPPackaging: Cut Tape (CT) Package / Case: 9-XFBGA, WLCSP Output Type: Non-Inverted Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Data Rate: 10MHz Supplier Device Package: 9-WLCSP (0.92x0.92) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 1 Voltage - VCCA: 1.08 V ~ 1.95 V Voltage - VCCB: 1.65 V ~ 3.6 V Number of Circuits: 1 |
на замовлення 6370 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
S908QB4E0CDTE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 16TSSOP Packaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM Supplier Device Package: 16-TSSOP Number of I/O: 14 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | ||||||||||||||
| SAF4000EL/102Z52AK | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 630 шт В кошику од. на суму грн. | |||||||||||||||
| SAF4001EL/101Z305Y | NXP USA Inc. |
Description: SAF4001EL Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
| SAF4001EL/101Z305K | NXP USA Inc. |
Description: SAF4001EL Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 630 шт В кошику од. на суму грн. | |||||||||||||||
| MPF5302AMMA0ES | NXP USA Inc. |
Description: IC REG BUCK ADJ 15A 24HWQFNVoltage - Output (Min/Fixed): 0.5V Voltage - Input (Min): 2.7V Voltage - Output (Max): 1.2V Synchronous Rectifier: No Supplier Device Package: 24-HWQFN (4.5x3.5) Topology: Buck Voltage - Input (Max): 5.5V Frequency - Switching: 2MHz ~ 3MHz Output Configuration: Positive Operating Temperature: -40°C ~ 125°C (TA) Current - Output: 15A Function: Step-Down Number of Outputs: 1 Mounting Type: Surface Mount, Wettable Flank Output Type: Adjustable Package / Case: 24-PowerWFQFN Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | |||||||||||||||
|
MC35FS6513NAE | NXP USA Inc. |
Description: FS6500Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| J3R150P1U15/0ZA2AV | NXP USA Inc. |
Description: J3R150P1U15 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 24109 шт В кошику од. на суму грн. | |||||||||||||||
| J3R150P1U15/0ZA2BV | NXP USA Inc. |
Description: J3R150P1U15 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 24109 шт В кошику од. на суму грн. | |||||||||||||||
| SCBGARBW1AO | NXP USA Inc. |
Description: SOCKET SUPPORTING VERTICAL AUTOM Packaging: Bulk Module/Board Type: Socket Module - BGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
N74F51D,602 | NXP USA Inc. |
Description: IC GATE AND/OR/INVERT 2IN 14SOICNumber of Circuits: 2 Supplier Device Package: 14-SO Schmitt Trigger Input: No Number of Inputs: 10 Input (3, 3, 2, 2) Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: AND/OR/INVERT Gate Mounting Type: Surface Mount Output Type: Differential Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
на замовлення 3420 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
MFS2400AVMA0ESR2 | NXP USA Inc. |
Description: MFS2400AVMA0ESR2Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||||
|
MFS2400AVMA1ESR2 | NXP USA Inc. |
Description: Safety Mini CAN FD SBCPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||||
|
MFS2400AVMA0ES | NXP USA Inc. |
Description: MFS2400AVMA0ESPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||
|
MFS2400AVBA0ESR2 | NXP USA Inc. |
Description: MFS2400AVBA0ESR2Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||||
|
MFS2400AVBA0ES | NXP USA Inc. |
Description: MFS2400AVBA0ESPackaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 115°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Supplier Device Package: 32-HVQFN (5x5) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||
|
MC44BS374T1EFR2 | NXP USA Inc. |
Description: IC NTSC/PAL MODULATOR 16-SOICPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: NTSC/PAL Modulator Applications: Audio/Video, VCR's, Set-Top Boxes Supplier Device Package: 16-SOIC DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||
| MC20XS4200DFKR2 | NXP USA Inc. |
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MOFault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO Supplier Device Package: 23-PQFN (12x12) Ratio - Input:Output: 1:1 Current - Output (Max): 4.4A Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Voltage - Load: 8V ~ 36V Input Type: Non-Inverting Rds On (Typ): 20mOhm (Max) Output Configuration: High Side Operating Temperature: -40°C ~ 125°C (TA) Switch Type: General Purpose Interface: SPI Number of Outputs: 2 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 23-PowerQFN Features: Internal PWM, Slew Rate Controlled, Watchdog Timer Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1200 шт В кошику од. на суму грн. | |||||||||||||||
|
MKE02Z32VLD2 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
на замовлення 788 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| MCXA146VPJ | NXP USA Inc. |
Description: IC MCUPackaging: Tray Package / Case: 112-BGA Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: D/A 1x12b Core Size: 32-Bit Connectivity: FlexIO, I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 112-VFBGA (7x7) Number of I/O: 82 |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
|
MCF51AG128CLK | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 80LQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 24x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 69 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | ||||||||||||||
|
SC16C852LIBS,151 | NXP USA Inc. |
Description: IC UART DUAL W/FIFO 32-HVQFNPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 1.8V FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
Мінімальне замовлення: 490 шт В кошику од. на суму грн. | ||||||||||||||
|
MIMX8UD3DVP08SC | NXP USA Inc. |
Description: I.MX8ULP, DUAL 800MHZPackaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Supplier Device Package: 485-LFBGA (15x15) |
на замовлення 610 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
MCXA154VPJ | NXP USA Inc. |
Description: IC MCUPackaging: Tray Package / Case: 112-VFBGA Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: D/A 1x12b Core Size: 32-Bit Connectivity: FlexIO, I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 112-VFBGA (7x7) Number of I/O: 82 |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| MCXA155VPJ | NXP USA Inc. |
Description: IC MCUPackaging: Tray Package / Case: 112-BGA Mounting Type: Surface Mount Speed: 96MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: D/A 1x12b Core Size: 32-Bit Connectivity: FlexIO, I2C, SPI, UART/USART, USB Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 112-VFBGA (7x7) Number of I/O: 82 |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
|
MFS2633AMDAHAD | NXP USA Inc. |
Description: MFS2633AMDAHADPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) |
на замовлення 249 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| MBMI7014TA1AER2 | NXP USA Inc. |
Description: MBMI7014TA1AER2Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | |||||||||||||||
| MBMI7014TA1AE | NXP USA Inc. |
Description: MBMI7014TA1AEPackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | |||||||||||||||
| SAF4000EL/103Q200Y | NXP USA Inc. |
Description: SAF4000EL/103Q200Y Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
| SAF4000EL/103Q200K | NXP USA Inc. |
Description: SAF4000EL/103Q200K Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 630 шт В кошику од. на суму грн. | |||||||||||||||
| LFDBGVCALS50R | NXP USA Inc. |
Description: 156 PIN VERTICAL RING TO ROTATED Packaging: Bulk Module/Board Type: Adapter Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
FRWY-LS1012A-PB | NXP USA Inc. |
Description: LAYERSCAPE LS1012A FREEWAY BRDPackaging: Box Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: LS1012A Platform: Layerscape LS1012A Freeway |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
LD6806CX4/33P,315 | NXP USA Inc. |
Description: IC REG LINEAR 3.3V 200MA 4WLCSPCurrent - Supply (Max): 250 µA Protection Features: Over Current, Over Temperature Voltage Dropout (Max): 0.1V @ 200mA PSRR: 55dB (1kHz) Control Features: Enable Voltage - Output (Min/Fixed): 3.3V Supplier Device Package: 4-WLCSP (0.76x0.76) Number of Regulators: 1 Voltage - Input (Max): 5.5V Current - Quiescent (Iq): 100 µA Output Configuration: Positive Operating Temperature: -40°C ~ 85°C Current - Output: 200mA Mounting Type: Surface Mount Output Type: Fixed Package / Case: 4-XFBGA, WLCSP Packaging: Bulk |
на замовлення 9000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
MPX2053DP | NXP USA Inc. |
Description: SENSOR 7.25PSID 0.19" .04VPackaging: Tray Features: Temperature Compensated Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 7.25PSI (50kPa) Pressure Type: Differential Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Port Size: Male - 0.19" (4.93mm) Tube, Dual Applications: Board Mount Port Style: Barbed Maximum Pressure: 29.01PSI (200kPa) |
товару немає в наявності |
В кошику од. на суму грн. |
| S912ZVC19F1WLFR |
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| S912ZVC19F1WLF |
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| S912ZVCA19F1WLF |
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| KIT-UCANS32K1SCT |
![]() |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TJA1153A
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: TJA1153A
Contents: Board(s), Cable(s)
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
Description: EVAL BOARD FOR TJA1153A
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: TJA1153A
Contents: Board(s), Cable(s)
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| 74AUP2G3407GMH |
![]() |
Виробник: NXP USA Inc.
Description: IC BUFF 0.8V/3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
Description: IC BUFF 0.8V/3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
на замовлення 90000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 678+ | 29.89 грн |
| S9S12G64ACLHR |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| S9S12G48AMLHR |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| S9S12G64ACLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| S9S12G48AMLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| NCF29AGVHNF/0500ZY |
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| NCF29AGXHN4/0500ZY |
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| S9S12GN16J0MLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| S9S12GN16J0MLF |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| S9S12G64J1VLC |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| S9S12G64J1MLC |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| BFU768F,115 |
![]() |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| BFU768F,115 |
![]() |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 2.8V 70MA 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13.1dB
Power - Max: 220mW
Current - Collector (Ic) (Max): 70mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 155 @ 10mA, 2V
Noise Figure (dB Typ @ f): 1.1dB @ 2.4GHz
Supplier Device Package: 4-DFP
на замовлення 268 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 6+ | 57.34 грн |
| 10+ | 34.25 грн |
| 100+ | 22.07 грн |
| BFU520XRR |
![]() |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Frequency - Transition: 10.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 30mA
Power - Max: 450mW
Gain: 20dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Qualification: AEC-Q101
Grade: Automotive
Supplier Device Package: SOT-143R
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Frequency - Transition: 10.5GHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Voltage - Collector Emitter Breakdown (Max): 12V
Current - Collector (Ic) (Max): 30mA
Power - Max: 450mW
Gain: 20dB
Operating Temperature: -40°C ~ 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: SOT-143R
Packaging: Tape & Reel (TR)
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3000+ | 8.05 грн |
| BFU520XRR |
![]() |
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
Description: RF TRANS NPN 12V 10.5GHZ SOT143R
Packaging: Cut Tape (CT)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 20dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 30mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 8V
Frequency - Transition: 10.5GHz
Noise Figure (dB Typ @ f): 0.65dB @ 900MHz
Supplier Device Package: SOT-143R
Grade: Automotive
Qualification: AEC-Q101
на замовлення 5924 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 16+ | 19.37 грн |
| 24+ | 12.91 грн |
| 27+ | 11.46 грн |
| 100+ | 9.24 грн |
| 250+ | 8.52 грн |
| 500+ | 8.08 грн |
| 1000+ | 7.59 грн |
| SA56004AD,112 |
![]() |
Виробник: NXP USA Inc.
Description: SENSOR DIGITAL -40C-125C 8SO
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
Description: SENSOR DIGITAL -40C-125C 8SO
Sensing Temperature - Remote: -40°C ~ 125°C
Sensing Temperature - Local: -40°C ~ 125°C
Accuracy - Highest (Lowest): ±2°C (±3°C)
Test Condition: 60°C ~ 100°C (-40°C ~ 125°C)
Supplier Device Package: 8-SO
Resolution: 10 b
Sensor Type: Digital, Local/Remote
Voltage - Supply: 3V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Output Type: I2C/SMBus
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Features: Output Switch, Programmable Limit
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| PDTC144VM,315 |
![]() |
на замовлення 80000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 11871+ | 2.23 грн |
| MCIMX6X1CVO08AC |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| MCIMX6X3CVO08AB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| MMA2204KEGR2 |
![]() |
Виробник: NXP USA Inc.
Description: ACCEL 112.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: ACCEL 112.5G ANALOG 16SOIC
Qualification: AEC-Q100
Grade: Automotive
Sensitivity (mV/g): 20
Supplier Device Package: 16-SOIC
Bandwidth: 400Hz
Voltage - Supply: 4.75V ~ 5.25V
Operating Temperature: -40°C ~ 125°C
Acceleration Range: ±112.5g
Axis: X
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| NVT4557UKAZ |
![]() |
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
товару немає в наявності
Мінімальне замовлення: 20000 шт
В кошику
од. на суму грн.
| NVT4557UKAZ |
![]() |
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
Description: IC XLTR VL BIDIR 9-WLCSP
Packaging: Cut Tape (CT)
Package / Case: 9-XFBGA, WLCSP
Output Type: Non-Inverted
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Data Rate: 10MHz
Supplier Device Package: 9-WLCSP (0.92x0.92)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 1
Voltage - VCCA: 1.08 V ~ 1.95 V
Voltage - VCCB: 1.65 V ~ 3.6 V
Number of Circuits: 1
на замовлення 6370 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 61.99 грн |
| 10+ | 42.61 грн |
| 25+ | 38.38 грн |
| 100+ | 31.67 грн |
| 250+ | 29.59 грн |
| 500+ | 28.34 грн |
| 1000+ | 26.98 грн |
| S908QB4E0CDTE |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| SAF4001EL/101Z305Y |
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MPF5302AMMA0ES |
![]() |
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 15A 24HWQFN
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 15A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tray
Description: IC REG BUCK ADJ 15A 24HWQFN
Voltage - Output (Min/Fixed): 0.5V
Voltage - Input (Min): 2.7V
Voltage - Output (Max): 1.2V
Synchronous Rectifier: No
Supplier Device Package: 24-HWQFN (4.5x3.5)
Topology: Buck
Voltage - Input (Max): 5.5V
Frequency - Switching: 2MHz ~ 3MHz
Output Configuration: Positive
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output: 15A
Function: Step-Down
Number of Outputs: 1
Mounting Type: Surface Mount, Wettable Flank
Output Type: Adjustable
Package / Case: 24-PowerWFQFN
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| MC35FS6513NAE |
![]() |
Виробник: NXP USA Inc.
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: FS6500
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 749.34 грн |
| 10+ | 565.33 грн |
| 25+ | 526.20 грн |
| 100+ | 453.45 грн |
| 250+ | 434.21 грн |
| J3R150P1U15/0ZA2AV |
товару немає в наявності
Мінімальне замовлення: 24109 шт
В кошику
од. на суму грн.
| J3R150P1U15/0ZA2BV |
товару немає в наявності
Мінімальне замовлення: 24109 шт
В кошику
од. на суму грн.
| SCBGARBW1AO |
Виробник: NXP USA Inc.
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
Description: SOCKET SUPPORTING VERTICAL AUTOM
Packaging: Bulk
Module/Board Type: Socket Module - BGA
товару немає в наявності
В кошику
од. на суму грн.
| N74F51D,602 |
![]() |
Виробник: NXP USA Inc.
Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Number of Circuits: 2
Supplier Device Package: 14-SO
Schmitt Trigger Input: No
Number of Inputs: 10 Input (3, 3, 2, 2)
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: AND/OR/INVERT Gate
Mounting Type: Surface Mount
Output Type: Differential
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC GATE AND/OR/INVERT 2IN 14SOIC
Number of Circuits: 2
Supplier Device Package: 14-SO
Schmitt Trigger Input: No
Number of Inputs: 10 Input (3, 3, 2, 2)
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: AND/OR/INVERT Gate
Mounting Type: Surface Mount
Output Type: Differential
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
на замовлення 3420 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1902+ | 11.80 грн |
| MFS2400AVMA0ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVMA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| MFS2400AVMA1ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: Safety Mini CAN FD SBC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| MFS2400AVMA0ES |
![]() |
Виробник: NXP USA Inc.
Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVMA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| MFS2400AVBA0ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVBA0ESR2
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| MFS2400AVBA0ES |
![]() |
Виробник: NXP USA Inc.
Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
Description: MFS2400AVBA0ES
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| MC44BS374T1EFR2 |
![]() |
Виробник: NXP USA Inc.
Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
Description: IC NTSC/PAL MODULATOR 16-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Supplier Device Package: 16-SOIC
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| MC20XS4200DFKR2 |
![]() |
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1200 шт
В кошику
од. на суму грн.
| MKE02Z32VLD2 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 788 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 258.04 грн |
| 10+ | 187.30 грн |
| 25+ | 171.99 грн |
| 160+ | 141.57 грн |
| 320+ | 136.43 грн |
| 640+ | 132.21 грн |
| MCXA146VPJ |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 471.14 грн |
| 10+ | 348.85 грн |
| 25+ | 322.75 грн |
| 100+ | 275.98 грн |
| 260+ | 262.68 грн |
| MCF51AG128CLK |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 69
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| SC16C852LIBS,151 |
![]() |
Виробник: NXP USA Inc.
Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART DUAL W/FIFO 32-HVQFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 1.8V
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
товару немає в наявності
Мінімальне замовлення: 490 шт
В кошику
од. на суму грн.
| MIMX8UD3DVP08SC |
![]() |
Виробник: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 610 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1957.42 грн |
| 10+ | 1520.77 грн |
| 25+ | 1429.73 грн |
| 100+ | 1247.86 грн |
| 250+ | 1203.10 грн |
| MCXA154VPJ |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
Description: IC MCU
Packaging: Tray
Package / Case: 112-VFBGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 271.22 грн |
| 10+ | 196.92 грн |
| 25+ | 180.97 грн |
| 100+ | 153.36 грн |
| 260+ | 145.22 грн |
| MCXA155VPJ |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
Description: IC MCU
Packaging: Tray
Package / Case: 112-BGA
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: D/A 1x12b
Core Size: 32-Bit
Connectivity: FlexIO, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 112-VFBGA (7x7)
Number of I/O: 82
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 362.66 грн |
| 10+ | 240.50 грн |
| 25+ | 224.16 грн |
| 100+ | 187.90 грн |
| 260+ | 182.27 грн |
| MFS2633AMDAHAD |
![]() |
Виробник: NXP USA Inc.
Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Description: MFS2633AMDAHAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
на замовлення 249 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 593.58 грн |
| 10+ | 444.37 грн |
| 25+ | 412.56 грн |
| 100+ | 354.35 грн |
| SAF4000EL/103Q200Y |
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| LFDBGVCALS50R |
Виробник: NXP USA Inc.
Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
Description: 156 PIN VERTICAL RING TO ROTATED
Packaging: Bulk
Module/Board Type: Adapter Board
товару немає в наявності
В кошику
од. на суму грн.
| FRWY-LS1012A-PB |
![]() |
Виробник: NXP USA Inc.
Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
Description: LAYERSCAPE LS1012A FREEWAY BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: LS1012A
Platform: Layerscape LS1012A Freeway
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 27410.03 грн |
| LD6806CX4/33P,315 |
![]() |
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
Description: IC REG LINEAR 3.3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3.3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3328+ | 6.64 грн |
| MPX2053DP |
![]() |
Виробник: NXP USA Inc.
Description: SENSOR 7.25PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
Description: SENSOR 7.25PSID 0.19" .04V
Packaging: Tray
Features: Temperature Compensated
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 7.25PSI (50kPa)
Pressure Type: Differential
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube, Dual
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 29.01PSI (200kPa)
товару немає в наявності
В кошику
од. на суму грн.
























