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SAF7754HV/N208WK NXP USA Inc. Description: CAR DSP
Packaging: Tray
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SAF7755HN/N208WMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
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SAF775DHV/N208W/FY NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
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SAF7755HN/N208WK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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SAF775DHV/N208W/BK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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SAF7755HV/N208WY NXP USA Inc. Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tape & Reel (TR)
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SAF775CHN/N208WBMP NXP USA Inc. Description: CAR DISP
Packaging: Tape & Reel (TR)
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SAF775DHV/N208W/FK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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SAF775CHN/N208WAMP NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
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SAF775CHN/N208W/SK NXP USA Inc. Description: CAR DISP
Packaging: Tray
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KMI85HP NXP USA Inc. Description: KMI85
Packaging: Tape & Reel (TR)
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KMI85/WHP NXP USA Inc. Description: KMI85
Packaging: Tape & Reel (TR)
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KMI85/PHP NXP USA Inc. Description: KMI85
Packaging: Tape & Reel (TR)
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KMA321/AZ NXP USA Inc. KMA321_A.pdf Description: PROGRAMMABLE ANGLE SENSOR
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
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KMA310/AZ NXP USA Inc. KMA310_A.pdf Description: KMA310
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 3-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 3-SIP Module
Packaging: Tape & Reel (TR)
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KMA320/AZ NXP USA Inc. KMA320_A.pdf Description: PROGRAMMABLE ANGLE SENSOR
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
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MCIMX6X2EVN10AB MCIMX6X2EVN10AB NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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MCIMX6X2CVN08AC NXP USA Inc. IMX6SXIEC.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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74ALVC02D,112 74ALVC02D,112 NXP USA Inc. 74ALVC02.pdf Description: IC GATE NOR 4CH 2-INP 14-SO
Packaging: Tube
на замовлення 3079 шт:
термін постачання 21-31 дні (днів)
3079+8.30 грн
Мінімальне замовлення: 3079
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MPC8323VRADDCA MPC8323VRADDCA NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8313CVRADDC MPC8313CVRADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8323EVRADDCA MPC8323EVRADDCA NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323CVRADDCA MPC8323CVRADDCA NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323ECVRADDCA MPC8323ECVRADDCA NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323EVRADDC MPC8323EVRADDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323EZQADDC MPC8323EZQADDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323ECVRADDC MPC8323ECVRADDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8321EVRADDC MPC8321EVRADDC NXP USA Inc. MPC8323EEC.pdf Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8306SCVMADDCA MPC8306SCVMADDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
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MPC8306SVMADDCA MPC8306SVMADDCA NXP USA Inc. MPC8306SEC.pdf Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
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MC33FS6500CAE MC33FS6500CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+477.07 грн
10+356.09 грн
25+330.16 грн
80+290.85 грн
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MC9328MXLDVP15 MC9328MXLDVP15 NXP USA Inc. MC9328MXL.pdf Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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MC68EC020AA16 MC68EC020AA16 NXP USA Inc. MC68020%2C%20MC68EC020%20Users%20Manual.pdf Description: IC MPU M680X0 16MHZ 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 100-QFP (14x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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LFVBBK77CWB NXP USA Inc. Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
For Use With/Related Products: MPCxxxx
Accessory Type: Calibration Unit
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S912ZVL64F0CLFR S912ZVL64F0CLFR NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVL64F0CLF S912ZVL64F0CLF NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MPC8241LVR266D MPC8241LVR266D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 266MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
на замовлення 309 шт:
термін постачання 21-31 дні (днів)
6+3320.38 грн
Мінімальне замовлення: 6
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MCW68LK332A NXP USA Inc. Description: IC MCU 32BIT
DigiKey Programmable: Not Verified
Packaging: Tray
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MC9S08QG8MFQE MC9S08QG8MFQE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 8KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
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FS32K144UIT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K144, M4F, 512 KB FLASH
Packaging: Tray
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MVR5510AMBANES MVR5510AMBANES NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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FC32K146HFT0MLLT NXP USA Inc. Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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FB32K146HRT0MLLT NXP USA Inc. PdfFile_890942.pdf Description: S32K146, M4F, FLASH 1M, RAM 128K
Packaging: Tray
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LS1023ASN8MQB LS1023ASN8MQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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LD6806CX4/30P,315 LD6806CX4/30P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
3328+6.62 грн
Мінімальне замовлення: 3328
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FRDM-MCXW71 FRDM-MCXW71 NXP USA Inc. getting-started-with-frdm-mcxw71:GS-FRDM-MCXW71 Description: FREEDOM MCXW71 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXW71
Platform: Freedom
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
1+2218.42 грн
В кошику  од. на суму  грн.
LS1043ASE7MNLA LS1043ASE7MNLA NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MPF53BDAMMA1ES MPF53BDAMMA1ES NXP USA Inc. PF5300.pdf Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Input (Min): 2.7V
на замовлення 613 шт:
термін постачання 21-31 дні (днів)
1+386.88 грн
10+284.25 грн
25+262.17 грн
100+223.29 грн
490+206.07 грн
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S9S08RN60W1VLF S9S08RN60W1VLF NXP USA Inc. S9S08RN60DS.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC9S08JE128CLH MC9S08JE128CLH NXP USA Inc. Description: IC MCU 8BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 6x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MCXA155VMP NXP USA Inc. MCXAP100M96FS6.pdf Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
на замовлення 511 шт:
термін постачання 21-31 дні (днів)
1+348.11 грн
10+255.15 грн
25+235.23 грн
100+200.13 грн
250+190.31 грн
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PEMI6QFN/CE,132 PEMI6QFN/CE,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHMS ESD SMD
Number of Channels: 6
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 8.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Package / Case: 12-XFDFN
Packaging: Bulk
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
1902+11.68 грн
Мінімальне замовлення: 1902
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MPC8358VVADDEA MPC8358VVADDEA NXP USA Inc. MPC8360E%2C8358E.pdf Description: IC MPU MPC83XX 266MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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LFK77CINTPWD NXP USA Inc. Description: NXP MPC5777C 416-PIN 1.0 MM BGA
Packaging: Bulk
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MC908GZ32MFUE MC908GZ32MFUE NXP USA Inc. MC68HC908GZ60.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MCF52258CAG66R MCF52258CAG66R NXP USA Inc. MCF52259.pdf Description: MCF522XX 32-BIT MCU, COLDFIRE V2
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
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MPF5300AMMA0ESR2 NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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MPF5300AMMA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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MC8641DVJ1500KE MC8641DVJ1500KE NXP USA Inc. MCP8641%28D%29.pdf Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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HVP-KV11Z75M HVP-KV11Z75M NXP USA Inc. Description: KV1X HIGH-VOLTAGE DEV PLATFORM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: High-Voltage Dev Platform
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SAF7754HV/N208WK
Виробник: NXP USA Inc.
Description: CAR DSP
Packaging: Tray
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SAF7755HN/N208WMP
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
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SAF775DHV/N208W/FY
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
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SAF7755HN/N208WK
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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SAF775DHV/N208W/BK
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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SAF7755HV/N208WY
Виробник: NXP USA Inc.
Description: MULTI-TUNER CAR RADIO & AUDIO ON
Packaging: Tape & Reel (TR)
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SAF775CHN/N208WBMP
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Tape & Reel (TR)
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SAF775DHV/N208W/FK
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
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SAF775CHN/N208WAMP
Виробник: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tape & Reel (TR)
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SAF775CHN/N208W/SK
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
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KMI85HP
Виробник: NXP USA Inc.
Description: KMI85
Packaging: Tape & Reel (TR)
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KMI85/WHP
Виробник: NXP USA Inc.
Description: KMI85
Packaging: Tape & Reel (TR)
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KMI85/PHP
Виробник: NXP USA Inc.
Description: KMI85
Packaging: Tape & Reel (TR)
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KMA321/AZ KMA321_A.pdf
Виробник: NXP USA Inc.
Description: PROGRAMMABLE ANGLE SENSOR
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
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KMA310/AZ KMA310_A.pdf
Виробник: NXP USA Inc.
Description: KMA310
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 3-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 3-SIP Module
Packaging: Tape & Reel (TR)
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KMA320/AZ KMA320_A.pdf
Виробник: NXP USA Inc.
Description: PROGRAMMABLE ANGLE SENSOR
Qualification: AEC-Q100
Grade: Automotive
Output Signal: Clockwise Increase
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Supplier Device Package: 4-SIL
For Measuring: Angle
Technology: Magnetoresistive
Actuator Type: External Magnet, Not Included
Linearity: ±1.2°
Voltage - Supply: 4.5V ~ 5.5V
Termination Style: PC Pin
Operating Temperature: -40°C ~ 180°C
Output: Analog Voltage
Mounting Type: Through Hole
Package / Case: 4-SIP Module
Packaging: Tape & Reel (TR)
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MCIMX6X2EVN10AB IMX6SXIEC.pdf
MCIMX6X2EVN10AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -20°C ~ 105°C (TJ)
Speed: 227MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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MCIMX6X2CVN08AC IMX6SXIEC.pdf
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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74ALVC02D,112 74ALVC02.pdf
74ALVC02D,112
Виробник: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14-SO
Packaging: Tube
на замовлення 3079 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3079+8.30 грн
Мінімальне замовлення: 3079
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MPC8323VRADDCA MPC8323EEC.pdf
MPC8323VRADDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8313CVRADDC MPC8313E_Hrdw_Spec.pdf
MPC8313CVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8323EVRADDCA MPC8323EEC.pdf
MPC8323EVRADDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323CVRADDCA MPC8323EEC.pdf
MPC8323CVRADDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323ECVRADDCA MPC8323EEC.pdf
MPC8323ECVRADDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323EVRADDC MPC8323EEC.pdf
MPC8323EVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323EZQADDC MPC8323EEC.pdf
MPC8323EZQADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8323ECVRADDC MPC8323EEC.pdf
MPC8323ECVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8321EVRADDC MPC8323EEC.pdf
MPC8321EVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
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MPC8306SCVMADDCA MPC8306SEC.pdf
MPC8306SCVMADDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
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MPC8306SVMADDCA MPC8306SEC.pdf
MPC8306SVMADDCA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
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MC33FS6500CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6500CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+477.07 грн
10+356.09 грн
25+330.16 грн
80+290.85 грн
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MC9328MXLDVP15 MC9328MXL.pdf
MC9328MXLDVP15
Виробник: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
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MC68EC020AA16 MC68020%2C%20MC68EC020%20Users%20Manual.pdf
MC68EC020AA16
Виробник: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 100-QFP (14x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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LFVBBK77CWB
Виробник: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
For Use With/Related Products: MPCxxxx
Accessory Type: Calibration Unit
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S912ZVL64F0CLFR S9S12ZVL_FamilyRefManual_DS.pdf
S912ZVL64F0CLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVL64F0CLF S9S12ZVL_FamilyRefManual_DS.pdf
S912ZVL64F0CLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MPC8241LVR266D MPC8241.pdf
MPC8241LVR266D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
на замовлення 309 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+3320.38 грн
Мінімальне замовлення: 6
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MCW68LK332A
Виробник: NXP USA Inc.
Description: IC MCU 32BIT
DigiKey Programmable: Not Verified
Packaging: Tray
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MC9S08QG8MFQE MC9S08AC60.pdf
MC9S08QG8MFQE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 8DFN
Packaging: Tray
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-DFN-EP (4x4)
Number of I/O: 4
DigiKey Programmable: Not Verified
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FS32K144UIT0VLFT S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K144, M4F, 512 KB FLASH
Packaging: Tray
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MVR5510AMBANES VR5510.pdf
MVR5510AMBANES
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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FC32K146HFT0MLLT
Виробник: NXP USA Inc.
Description: S32K144 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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FB32K146HRT0MLLT PdfFile_890942.pdf
Виробник: NXP USA Inc.
Description: S32K146, M4F, FLASH 1M, RAM 128K
Packaging: Tray
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LS1023ASN8MQB LS1043AFS.pdf
LS1023ASN8MQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 780FCPBGA
SATA: SATA 6Gbps (1)
Security Features: Secure Boot, TrustZone®
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 3.0 (2) + PHY
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
Supplier Device Package: 780-FCPBGA (23x23)
Core Processor: ARM® Cortex®-A53
Operating Temperature: 0°C ~ 105°C
Speed: 1.2GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA, FCBGA
Packaging: Tray
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LD6806CX4/30P,315 LD6806_Series.pdf
LD6806CX4/30P,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 4WLCSP
Current - Supply (Max): 250 µA
Protection Features: Over Current, Over Temperature
Voltage Dropout (Max): 0.1V @ 200mA
PSRR: 55dB (1kHz)
Control Features: Enable
Voltage - Output (Min/Fixed): 3V
Supplier Device Package: 4-WLCSP (0.76x0.76)
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Current - Quiescent (Iq): 100 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 85°C
Current - Output: 200mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 4-XFBGA, WLCSP
Packaging: Bulk
на замовлення 9000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3328+6.62 грн
Мінімальне замовлення: 3328
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FRDM-MCXW71 getting-started-with-frdm-mcxw71:GS-FRDM-MCXW71
FRDM-MCXW71
Виробник: NXP USA Inc.
Description: FREEDOM MCXW71 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXW71
Platform: Freedom
на замовлення 76 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2218.42 грн
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LS1043ASE7MNLA LS1043AFS.pdf
LS1043ASE7MNLA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.2GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MPF53BDAMMA1ES PF5300.pdf
MPF53BDAMMA1ES
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Input (Min): 2.7V
на замовлення 613 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+386.88 грн
10+284.25 грн
25+262.17 грн
100+223.29 грн
490+206.07 грн
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S9S08RN60W1VLF S9S08RN60DS.pdf
S9S08RN60W1VLF
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b
Core Processor: S08
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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MC9S08JE128CLH
MC9S08JE128CLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 6x12b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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MCXA155VMP MCXAP100M96FS6.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Packaging: Tray
Speed: 96MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, I3C, SPI, UART/USART, USB
Peripherals: POR, PWM, WDT
на замовлення 511 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+348.11 грн
10+255.15 грн
25+235.23 грн
100+200.13 грн
250+190.31 грн
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PEMI6QFN/CE,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/CE,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHMS ESD SMD
Number of Channels: 6
ESD Protection: Yes
Resistance - Channel (Ohms): 20
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 7dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 20Ohms, C = 8.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Package / Case: 12-XFDFN
Packaging: Bulk
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1902+11.68 грн
Мінімальне замовлення: 1902
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MPC8358VVADDEA MPC8360E%2C8358E.pdf
MPC8358VVADDEA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 740TBGA
Packaging: Tray
Package / Case: 740-LBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 740-TBGA (37.5x37.5)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
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LFK77CINTPWD
Виробник: NXP USA Inc.
Description: NXP MPC5777C 416-PIN 1.0 MM BGA
Packaging: Bulk
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MC908GZ32MFUE MC68HC908GZ60.pdf
MC908GZ32MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MCF52258CAG66R MCF52259.pdf
MCF52258CAG66R
Виробник: NXP USA Inc.
Description: MCF522XX 32-BIT MCU, COLDFIRE V2
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
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MPF5300AMMA0ESR2 PF5300_SDS.pdf
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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MPF5300AMMA0ES PF5300_SDS.pdf
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 12A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 12A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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MC8641DVJ1500KE MCP8641%28D%29.pdf
MC8641DVJ1500KE
Виробник: NXP USA Inc.
Description: IC MPU MPC86XX 1.5GHZ 1023FCCBGA
Packaging: Tray
Package / Case: 1023-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e600
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 1023-FCCBGA (33x33)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, RapidIO
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HVP-KV11Z75M
HVP-KV11Z75M
Виробник: NXP USA Inc.
Description: KV1X HIGH-VOLTAGE DEV PLATFORM
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: KV1x
Platform: High-Voltage Dev Platform
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