Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35987) > Сторінка 561 з 600
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MC33FS6525KAE | NXP USA Inc. |
 Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
MKE15Z256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 32K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 27x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
S912XEG128BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
74CBTLV16211DGG,11 | NXP USA Inc. |
Description: IC BUS SWITCH 24BIT LV 56-TSSOP Packaging: Bulk |
на замовлення 19943 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
74AUP1G17GX,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 5X2SON Packaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 5-X2SON (0.80x0.80) |
на замовлення 125986 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
74AUP1G17GN,132 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Input Type: Schmitt Trigger Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON (0.9x1) |
на замовлення 145000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
S9S08DZ128F2MLLR | NXP USA Inc. |
Description: IC MCU 8BIT 128KB FLASH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 87 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
SPC5603BAMLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 384KB (384K x 8) RAM Size: 28K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
LPC11E14FBD64/401, | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
на замовлення 174 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
FS32K148HFT0MLQT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| A5G26H605W19NR3 | NXP USA Inc. |
Description: A5G26H605W19NR3 Packaging: Bulk Package / Case: OM-780-4S4S Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz Power - Output: 85W Gain: 14.2dB Technology: GaN Supplier Device Package: OM-780-4S4S Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 300 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
 |
A7002CGHN1/T1AG502 | NXP USA Inc. |
Description: SECURE AUTHENTICATION MICROCONTR Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C RAM Size: 3.2K x 8 Operating Temperature: -40°C ~ 90°C Voltage - Supply: 1.62V ~ 5.5V Controller Series: A700x Program Memory Type: EEPROM (76.4kB) Applications: Authentication Core Processor: MX51 Supplier Device Package: 32-HVQFN (5x5) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
PCA9552D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS 25MA 24SO Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
|
|
PCA9552D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS 25MA 24SO Packaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
на замовлення 2070 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
PCA9532D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS I2C 25MA 24SO Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
PCA9532D,118 | NXP USA Inc. |
Description: IC LED DRIVER PS I2C 25MA 24SO Packaging: Cut Tape (CT) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Number of Outputs: 16 Type: Power Switch Operating Temperature: -40°C ~ 85°C (TA) Applications: Backlight Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 24-SO Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
на замовлення 424 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
LD6836CX4/33H,315 | NXP USA Inc. |
Description: IC REG LINEAR 3.3V 300MA 4WLCSP Packaging: Tape & Reel (TR) Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 3.3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.16V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
TDA8035HN/C1/S1EL | NXP USA Inc. |
Description: HIGH INTEGRATED AND LOW POWER SM Packaging: Bulk |
на замовлення 2449 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
MPC565CZP56 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 40x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 56 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
MGD3160AM515EKR2 | NXP USA Inc. |
Description: EV INVERTER CONTROL; IGBT & SIC Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Current - Peak Output: 15A Technology: Capacitive Coupling Current - Output High, Low: 15A, 15A Voltage - Isolation: 8000Vrms Approval Agency: CSA, UL, VDE Supplier Device Package: 32-SOIC Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 4.75V ~ 40V Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MGD3160AM515EKR2 | NXP USA Inc. |
Description: EV INVERTER CONTROL; IGBT & SIC Packaging: Cut Tape (CT) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C Current - Peak Output: 15A Technology: Capacitive Coupling Current - Output High, Low: 15A, 15A Voltage - Isolation: 8000Vrms Approval Agency: CSA, UL, VDE Supplier Device Package: 32-SOIC Grade: Automotive Number of Channels: 1 Voltage - Output Supply: 4.75V ~ 40V Qualification: AEC-Q100 |
на замовлення 552 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
NAFE13388B40BSMP | NXP USA Inc. |
Description: UNIVERSAL 25 V 8-INPUT LOW POWER Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
NAFE13388B40BSMP | NXP USA Inc. |
Description: UNIVERSAL 25 V 8-INPUT LOW POWER Packaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
на замовлення 990 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
| SAF775DHN/N208WCMP | NXP USA Inc. |
Description: SAF775DHN/N208WCMP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775DHN/N208W/CK | NXP USA Inc. |
Description: SAF775DHN/N208W/CK Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF7754HV/N208WY | NXP USA Inc. |
Description: CAR DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF7754HV/N208WK | NXP USA Inc. |
Description: CAR DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF7755HN/N208WMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775DHV/N208W/FY | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF7755HN/N208WK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775DHV/N208W/BK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF7755HV/N208WY | NXP USA Inc. |
Description: MULTI-TUNER CAR RADIO & AUDIO ON Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775CHN/N208WBMP | NXP USA Inc. |
Description: CAR DISP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775DHV/N208W/FK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775CHN/N208WAMP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF775CHN/N208W/SK | NXP USA Inc. |
Description: CAR DISP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| KMI85HP | NXP USA Inc. |
Description: KMI85 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| KMI85/WHP | NXP USA Inc. |
Description: KMI85 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| KMI85/PHP | NXP USA Inc. |
Description: KMI85 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| KMA321/AZ | NXP USA Inc. |
Description: PROGRAMMABLE ANGLE SENSOR Packaging: Tape & Reel (TR) Package / Case: 4-SIP Module Mounting Type: Through Hole Output: Analog Voltage Operating Temperature: -40°C ~ 180°C Termination Style: PC Pin Voltage - Supply: 4.5V ~ 5.5V Linearity: ±1.2° Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 4-SIL Rotation Angle - Electrical, Mechanical: 0° ~ 180° Output Signal: Clockwise Increase Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| KMA310/AZ | NXP USA Inc. |
Description: KMA310 Packaging: Tape & Reel (TR) Package / Case: 3-SIP Module Mounting Type: Through Hole Output: Analog Voltage Operating Temperature: -40°C ~ 180°C Termination Style: PC Pin Voltage - Supply: 4.5V ~ 5.5V Linearity: ±1.2° Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 3-SIL Rotation Angle - Electrical, Mechanical: 0° ~ 180° Output Signal: Clockwise Increase Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| KMA320/AZ | NXP USA Inc. |
Description: PROGRAMMABLE ANGLE SENSOR Packaging: Tape & Reel (TR) Package / Case: 4-SIP Module Mounting Type: Through Hole Output: Analog Voltage Operating Temperature: -40°C ~ 180°C Termination Style: PC Pin Voltage - Supply: 4.5V ~ 5.5V Linearity: ±1.2° Actuator Type: External Magnet, Not Included Technology: Magnetoresistive For Measuring: Angle Supplier Device Package: 4-SIL Rotation Angle - Electrical, Mechanical: 0° ~ 180° Output Signal: Clockwise Increase Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
 |
MCIMX6X2EVN10AB | NXP USA Inc. |
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| MCIMX6X2CVN08AC | NXP USA Inc. |
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 200MHz, 800MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
 |
74ALVC02D,112 | NXP USA Inc. |
Description: IC GATE NOR 4CH 2-INP 14-SO Packaging: Tube |
на замовлення 3079 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
MPC8323VRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
MPC8313CVRADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 267MHZ 516TEPBGA Packaging: Tray Package / Case: 516-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 267MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-TEPBGA (27x27) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8323EVRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8323CVRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8323ECVRADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8323EVRADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8323EZQADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8323ECVRADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8321EVRADDC | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c2 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
MPC8306SCVMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MPC8306SVMADDCA | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 369BGA Packaging: Tray Package / Case: 369-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 3.3V Supplier Device Package: 369-PBGA (19x19) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, SPI, TDM |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
|
MC33FS6500CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||
 |
MC9328MXLDVP15 | NXP USA Inc. |
Description: IC MPU I.MXL 150MHZ 225MAPBGA Packaging: Tray Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 150MHz Operating Temperature: -30°C ~ 70°C (TA) Core Processor: ARM920T Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 225-MAPBGA (13x13) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
 |
MC68EC020AA16 | NXP USA Inc. |
Description: IC MPU M680X0 16MHZ 100QFP Packaging: Tray Package / Case: 100-BQFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: 68020 Voltage - I/O: 5.0V Supplier Device Package: 100-QFP (14x20) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| LFVBBK77CWB | NXP USA Inc. |
Description: NXP LEAD FREE MPC5777C CSE 2.08 Packaging: Bulk For Use With/Related Products: MPCxxxx Accessory Type: Calibration Unit |
товару немає в наявності |
В кошику од. на суму грн. |
| MC33FS6525KAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MKE15Z256VLH7R |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 469.72 грн |
| 10+ | 347.70 грн |
| 25+ | 321.59 грн |
| 100+ | 274.88 грн |
| 250+ | 262.05 грн |
| 500+ | 254.31 грн |
| S912XEG128BCAAR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| 74CBTLV16211DGG,11 |
|
на замовлення 19943 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 386+ | 60.60 грн |
| 74AUP1G17GX,125 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
на замовлення 125986 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4784+ | 4.66 грн |
| 74AUP1G17GN,132 |
|
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
на замовлення 145000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1920+ | 12.43 грн |
| S9S08DZ128F2MLLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| SPC5603BAMLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC11E14FBD64/401, |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 174 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 310.09 грн |
| 10+ | 200.97 грн |
| 25+ | 194.10 грн |
| 160+ | 153.07 грн |
| FS32K148HFT0MLQT |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| A5G26H605W19NR3 |
|
Виробник: NXP USA Inc.
Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
товару немає в наявності
В кошику
од. на суму грн.
| A7002CGHN1/T1AG502 |
|
Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 3.2K x 8
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 3.2K x 8
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| PCA9552D,118 |
|
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 130.38 грн |
| PCA9552D,118 |
|
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 2070 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 237.37 грн |
| 10+ | 171.51 грн |
| 25+ | 157.14 грн |
| 100+ | 132.65 грн |
| 250+ | 125.59 грн |
| 500+ | 121.33 грн |
| PCA9532D,118 |
|
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
товару немає в наявності
В кошику
од. на суму грн.
| PCA9532D,118 |
|
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 424 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 239.04 грн |
| 10+ | 172.80 грн |
| 25+ | 158.36 грн |
| 100+ | 133.68 грн |
| 250+ | 126.56 грн |
| LD6836CX4/33H,315 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
товару немає в наявності
В кошику
од. на суму грн.
| TDA8035HN/C1/S1EL |
|
на замовлення 2449 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 491+ | 47.39 грн |
| MPC565CZP56 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MGD3160AM515EKR2 |
|
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MGD3160AM515EKR2 |
|
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
на замовлення 552 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 687.87 грн |
| 10+ | 515.75 грн |
| 25+ | 479.18 грн |
| 100+ | 411.97 грн |
| 250+ | 394.00 грн |
| 500+ | 383.17 грн |
| NAFE13388B40BSMP |
|
Виробник: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
товару немає в наявності
В кошику
од. на суму грн.
| NAFE13388B40BSMP |
|
Виробник: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
на замовлення 990 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1755.20 грн |
| 10+ | 1352.88 грн |
| 25+ | 1268.58 грн |
| 100+ | 1103.57 грн |
| 250+ | 1062.14 грн |
| 500+ | 1037.16 грн |
| KMA321/AZ |
|
Виробник: NXP USA Inc.
Description: PROGRAMMABLE ANGLE SENSOR
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE ANGLE SENSOR
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| KMA310/AZ |
|
Виробник: NXP USA Inc.
Description: KMA310
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Description: KMA310
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 3-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| KMA320/AZ |
|
Виробник: NXP USA Inc.
Description: PROGRAMMABLE ANGLE SENSOR
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
Description: PROGRAMMABLE ANGLE SENSOR
Packaging: Tape & Reel (TR)
Package / Case: 4-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage
Operating Temperature: -40°C ~ 180°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Linearity: ±1.2°
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle
Supplier Device Package: 4-SIL
Rotation Angle - Electrical, Mechanical: 0° ~ 180°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX6X2EVN10AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX6X2CVN08AC |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz, 800MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
товару немає в наявності
В кошику
од. на суму грн.
| 74ALVC02D,112 |
|
на замовлення 3079 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3079+ | 8.77 грн |
| MPC8323VRADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8313CVRADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
товару немає в наявності
В кошику
од. на суму грн.
| MPC8323EVRADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8323CVRADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8323ECVRADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8323EVRADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8323EZQADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8323ECVRADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8321EVRADDC |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
Description: IC MPU MPC83XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c2
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, I2C, PCI, SPI, TDM, UART
товару немає в наявності
В кошику
од. на суму грн.
| MPC8306SCVMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
товару немає в наявності
В кошику
од. на суму грн.
| MPC8306SVMADDCA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
Description: IC MPU MPC83XX 266MHZ 369BGA
Packaging: Tray
Package / Case: 369-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 3.3V
Supplier Device Package: 369-PBGA (19x19)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, SPI, TDM
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6500CAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 503.99 грн |
| 10+ | 376.19 грн |
| 25+ | 348.79 грн |
| 80+ | 307.27 грн |
| MC9328MXLDVP15 |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MXL 150MHZ 225MAPBGA
Packaging: Tray
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Operating Temperature: -30°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
товару немає в наявності
В кошику
од. на суму грн.
| MC68EC020AA16 |
|
Виробник: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 100-QFP (14x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 16MHZ 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 100-QFP (14x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBK77CWB |
Виробник: NXP USA Inc.
Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
For Use With/Related Products: MPCxxxx
Accessory Type: Calibration Unit
Description: NXP LEAD FREE MPC5777C CSE 2.08
Packaging: Bulk
For Use With/Related Products: MPCxxxx
Accessory Type: Calibration Unit
товару немає в наявності
В кошику
од. на суму грн.