Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35480) > Сторінка 561 з 592
Фото | Назва | Виробник | Інформація |
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MRFE6P3300HR3 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: NI-860C3 Mounting Type: Chassis Mount Frequency: 857MHz ~ 863MHz Power - Output: 270W Gain: 20.4dB Technology: LDMOS Supplier Device Package: NI-860C3 Voltage - Rated: 66 V Voltage - Test: 32 V Current - Test: 1.6 A |
на замовлення 82 шт: термін постачання 21-31 дні (днів) |
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PZU24B3A,115 | NXP USA Inc. |
![]() Packaging: Bulk Tolerance: ±2% Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C Voltage - Zener (Nom) (Vz): 24 V Impedance (Max) (Zzt): 30 Ohms Supplier Device Package: SOD-323 Power - Max: 320 mW Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA Current - Reverse Leakage @ Vr: 50 nA @ 19 V |
на замовлення 49600 шт: термін постачання 21-31 дні (днів) |
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NT2L1011G0DUDZ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: Die Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 70°C (TA) Standards: ISO 14443, NFC Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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FS32K148HFT0VLQR | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 128 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
PCA9420AUKZ | NXP USA Inc. |
Description: PCA9420AUK Packaging: Cut Tape (CT) Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Current - Supply: 4.5µA Supplier Device Package: 25-WLCSP (2.09x2.09) |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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FXPS71407ST1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa) Pressure Type: Absolute Accuracy: ±7% Operating Temperature: -40°C ~ 125°C Applications: Board Mount Supplier Device Package: 16-HQFN (4x4) Port Style: No Port |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
S9S08DV32F2MLHR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q204Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2040 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q500Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5002 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q200K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2002 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q224K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2240 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q500K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5002 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q204K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2040 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q233Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2331 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q23AY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2332 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q233K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2331 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
SAF4000EL/101Q23AK | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q2332 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FXLS93421AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FXPS71407T1 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Applications: Board Mount Supplier Device Package: 16-HQFN (4x4) Port Style: No Port |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCIMX233CJM4C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 454MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V Supplier Device Package: 169-MAPBGA (11x11) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Data; DCP RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touchscreen Security Features: Cryptography, Hardware ID Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33FS6510NAE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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QN9030THN/001Y | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -97dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 320kB Flash, 88kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C (TJ) Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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MC68HC908JL8CSPE | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-SDIP (0.400", 10.16mm) Mounting Type: Through Hole Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 13x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI Peripherals: LED, LVD, POR, PWM Supplier Device Package: 32-SDIP Number of I/O: 26 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
NX30P6093AUKAZ | NXP USA Inc. |
![]() Features: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Output Type: P-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: I2C Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Rds On (Typ): 16mOhm Input Type: Non-Inverting Voltage - Load: 2.8V ~ 20V Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V Current - Output (Max): 5.6A Ratio - Input:Output: 1:1 Supplier Device Package: 20-WLCSP (2.16x1.7) Fault Protection: Over Temperature, Over Voltage, UVLO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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FS32K144MAT0CMHT | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b SAR; D/A1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 89 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MRFX1K80H-230MHZ | NXP USA Inc. |
![]() Packaging: Bulk For Use With/Related Products: MRFX1K80H Frequency: 230MHz Type: Transistor Supplied Contents: Board(s) Contents: Board(s) Utilized IC / Part: MRFX1K80H |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCF51JM128VLKR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 66 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MCF51JM128VLKR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 80-LQFP (14x14) Number of I/O: 66 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MK10DX32VLH5 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 19x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 44 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
TJA1103BHN/0J | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) Package / Case: 36-VFQFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Number of Drivers/Receivers: 1/1 Data Rate: 100Mbps Protocol: IEEE 802.3 Supplier Device Package: 36-HVQFN (6x6) Duplex: Full |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D23C0DA8/00J | NXP USA Inc. |
Description: MF3D23C0DA8 Packaging: Tape & Reel (TR) Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3D23C0DA4/00J | NXP USA Inc. |
Description: MF3D23C0DA4 Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH4300DA8/00J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: MOA8, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader/Transponder Operating Temperature: -25°C ~ 85°C (TA) Standards: Mifare, NFC Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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CBT3245ADS,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 20-SSOP (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 8 x 1:1 Type: Bus Switch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4V ~ 5.5V Independent Circuits: 1 Voltage Supply Source: Single Supply Supplier Device Package: 20-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX6D6AVT08AC | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 852MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P3T1755DP/Q900Z | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Voltage - Supply: 1.4V ~ 3.6V Applications: Controllers, Notebook PC Supplier Device Package: 8-TSSOP |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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P3T1755DP/Q900Z | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Voltage - Supply: 1.4V ~ 3.6V Applications: Controllers, Notebook PC Supplier Device Package: 8-TSSOP |
на замовлення 3388 шт: термін постачання 21-31 дні (днів) |
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WCT-15WAUTOS2 | NXP USA Inc. |
Description: WCT-15WAUTOS2 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MF3DH8300DA4/00J | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: MOA4, Smart Card Module Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Reader Operating Temperature: -25°C ~ 85°C Standards: ISO 14443A Supplier Device Package: PLLMC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC9S08AC16CFJER | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 22 DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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MC9S08AC16CFJER | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 22 DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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TEA18361LT/2J | NXP USA Inc. |
Description: GREENCHIP SMPS CONTROL IC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Frequency - Switching: 25kHz ~ 132.5kHz Internal Switch(s): Yes Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V Supplier Device Package: 14-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V Control Features: Frequency Control, Soft Start |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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TEA18361T/2J | NXP USA Inc. |
Description: GREENCHIP SMPS CONTROL IC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Frequency - Switching: 25kHz ~ 132.5kHz Internal Switch(s): No Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V Supplier Device Package: 14-SO Fault Protection: Over Power, Over Temperature, Over Voltage Voltage - Start Up: 14.9 V Control Features: Frequency Control, Soft Start Power (Watts): 75 W |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MK40DX256VMC7 | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 34x16b; D/A 1x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 74 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
NAFE13188B40BSK | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
NAFE13188B40BSE | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
NAFE13188B40BSMP | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
NAFE13188B40BSMP | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 64-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Number of Bits: 24 Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Supplier Device Package: 64-HVQFN (9x9) Number of Channels: 8 Power (Watts): 150 mW |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PEMI2QFN/CK,115 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-XFDFN Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 20Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 10dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 20 ESD Protection: Yes Number of Channels: 2 |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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BUK653R4-40C,127 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 3.6mOhm @ 25A, 10V Power Dissipation (Max): 204W (Tc) Vgs(th) (Max) @ Id: 2.8V @ 1mA Supplier Device Package: TO-220AB Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±16V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 125 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 8020 pF @ 25 V |
на замовлення 1309 шт: термін постачання 21-31 дні (днів) |
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AFSC5G35E37T2 | NXP USA Inc. |
Description: 10X6 MODULE Packaging: Tape & Reel (TR) Package / Case: 26-LQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 26-HLQFN (10x6) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
RD9Z1-638BJBEVM | NXP USA Inc. |
![]() Packaging: Bulk Function: Battery Monitor Type: Power Management Utilized IC / Part: MM9Z1_638 Supplied Contents: Board(s), Accessories Primary Attributes: 5V ~ 12V Supply Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
T1023NSE7KQA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 525-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 525-FCPBGA (19x19) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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LS1088AXN7PTA | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: -40°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 8 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
на замовлення 863 шт: термін постачання 21-31 дні (днів) |
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MPC8377EVRALGA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
MRFE6S9135HSR3 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: NI-880S Mounting Type: Surface Mount Frequency: 940MHz Power - Output: 39W Gain: 21dB Technology: LDMOS Supplier Device Package: NI-880S Voltage - Rated: 66 V Voltage - Test: 28 V Current - Test: 1 A |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCIMX6X3EVO10AB | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 400-LFBGA Mounting Type: Surface Mount Speed: 227MHz, 1GHz Operating Temperature: -20°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V Supplier Device Package: 400-MAPBGA (17x17) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MGD3160AM318EK | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 4.5V ~ 40V Input Type: Non-Inverting Supplier Device Package: 32-SOIC Channel Type: Single Driven Configuration: High-Side Number of Drivers: 1 Gate Type: IGBT, SiC MOSFET Current - Peak Output (Source, Sink): 15A, 15A Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912ZVHL32F1CLQ | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 32KB (32K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12Z Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 100 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
SAF4000EL/101Z233K | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. |
MRFE6P3300HR3 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Bulk
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
Description: RF MOSFET LDMOS 32V NI860C3
Packaging: Bulk
Package / Case: NI-860C3
Mounting Type: Chassis Mount
Frequency: 857MHz ~ 863MHz
Power - Output: 270W
Gain: 20.4dB
Technology: LDMOS
Supplier Device Package: NI-860C3
Voltage - Rated: 66 V
Voltage - Test: 32 V
Current - Test: 1.6 A
на замовлення 82 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 30635.05 грн |
PZU24B3A,115 |
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Виробник: NXP USA Inc.
Description: SINGLE ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
Description: SINGLE ZENER DIODE
Packaging: Bulk
Tolerance: ±2%
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C
Voltage - Zener (Nom) (Vz): 24 V
Impedance (Max) (Zzt): 30 Ohms
Supplier Device Package: SOD-323
Power - Max: 320 mW
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 100 mA
Current - Reverse Leakage @ Vr: 50 nA @ 19 V
на замовлення 49600 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
12488+ | 1.50 грн |
NT2L1011G0DUDZ |
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Виробник: NXP USA Inc.
Description: NTAG210, NFC FORUM TYPE 2 TAG CO
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
Description: NTAG210, NFC FORUM TYPE 2 TAG CO
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: ISO 14443, NFC
Supplier Device Package: Wafer
товару немає в наявності
В кошику
од. на суму грн.
FS32K148HFT0VLQR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
PCA9420AUKZ |
Виробник: NXP USA Inc.
Description: PCA9420AUK
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Description: PCA9420AUK
Packaging: Cut Tape (CT)
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 198.82 грн |
10+ | 169.52 грн |
25+ | 161.69 грн |
50+ | 146.39 грн |
100+ | 141.22 грн |
250+ | 134.66 грн |
500+ | 127.76 грн |
1000+ | 123.24 грн |
FXPS71407ST1 |
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Виробник: NXP USA Inc.
Description: SENSOR 20.31PSIA 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Accuracy: ±7%
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Description: SENSOR 20.31PSIA 16HQFN
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Accuracy: ±7%
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
товару немає в наявності
В кошику
од. на суму грн.
FXPS71407T1 |
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Виробник: NXP USA Inc.
Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
Description: AUTOMOTIVE SAFETY PRESSURE SENSO
Packaging: Tape & Reel (TR)
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Pressure: 5.8PSI ~ 20.31PSI (40kPa ~ 140kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Applications: Board Mount
Supplier Device Package: 16-HQFN (4x4)
Port Style: No Port
товару немає в наявності
В кошику
од. на суму грн.
MCIMX233CJM4C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Description: IC MPU I.MX23 454MHZ 169MAPBGA
Packaging: Tray
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 454MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 169-MAPBGA (11x11)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Data; DCP
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touchscreen
Security Features: Cryptography, Hardware ID
Additional Interfaces: I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
товару немає в наявності
В кошику
од. на суму грн.
MC33FS6510NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 471.70 грн |
10+ | 351.37 грн |
25+ | 325.65 грн |
80+ | 285.82 грн |
QN9030THN/001Y |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -97dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB Flash, 88kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 380.74 грн |
10+ | 327.73 грн |
25+ | 294.93 грн |
100+ | 252.17 грн |
250+ | 227.57 грн |
500+ | 204.20 грн |
1000+ | 169.39 грн |
MC68HC908JL8CSPE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32SDIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 13x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
NX30P6093AUKAZ |
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Виробник: NXP USA Inc.
Description: HIGH-VOLTAGE I2C CONTROLLED OVER
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 16mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 5.6A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
Description: HIGH-VOLTAGE I2C CONTROLLED OVER
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Output Type: P-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: I2C
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Rds On (Typ): 16mOhm
Input Type: Non-Inverting
Voltage - Load: 2.8V ~ 20V
Voltage - Supply (Vcc/Vdd): 3V ~ 4.5V
Current - Output (Max): 5.6A
Ratio - Input:Output: 1:1
Supplier Device Package: 20-WLCSP (2.16x1.7)
Fault Protection: Over Temperature, Over Voltage, UVLO
товару немає в наявності
В кошику
од. на суму грн.
FS32K144MAT0CMHT |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32B 512KB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
DigiKey Programmable: Not Verified
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MRFX1K80H-230MHZ |
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Виробник: NXP USA Inc.
Description: MRFX1K80H REF BRD 230MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
Description: MRFX1K80H REF BRD 230MHZ 1800W
Packaging: Bulk
For Use With/Related Products: MRFX1K80H
Frequency: 230MHz
Type: Transistor
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MRFX1K80H
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MCF51JM128VLKR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1000+ | 732.10 грн |
MCF51JM128VLKR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1155.92 грн |
10+ | 889.55 грн |
100+ | 751.31 грн |
500+ | 700.75 грн |
MK10DX32VLH5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 19x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 44
DigiKey Programmable: Not Verified
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TJA1103BHN/0J |
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 100Mbps
Protocol: IEEE 802.3
Supplier Device Package: 36-HVQFN (6x6)
Duplex: Full
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MF3D23C0DA8/00J |
Виробник: NXP USA Inc.
Description: MF3D23C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D23C0DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3D23C0DA4/00J |
Виробник: NXP USA Inc.
Description: MF3D23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3D23C0DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MF3DH4300DA8/00J |
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Виробник: NXP USA Inc.
Description: MF3DH4300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
Description: MF3DH4300DA8
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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CBT3245ADS,112 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 8 x 1:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4V ~ 5.5V
Independent Circuits: 1
Voltage Supply Source: Single Supply
Supplier Device Package: 20-SSOP
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MCIMX6D6AVT08AC |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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P3T1755DP/Q900Z |
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Виробник: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2500+ | 30.15 грн |
P3T1755DP/Q900Z |
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Виробник: NXP USA Inc.
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
Description: I3C, I2C-BUS INTERFACE, 0.5 C A
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Voltage - Supply: 1.4V ~ 3.6V
Applications: Controllers, Notebook PC
Supplier Device Package: 8-TSSOP
на замовлення 3388 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5+ | 64.40 грн |
10+ | 44.26 грн |
25+ | 39.84 грн |
100+ | 32.89 грн |
250+ | 30.74 грн |
500+ | 29.44 грн |
1000+ | 27.91 грн |
MF3DH8300DA4/00J |
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Виробник: NXP USA Inc.
Description: MF3DH8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
Description: MF3DH8300DA4
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C
Standards: ISO 14443A
Supplier Device Package: PLLMC
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MC9S08AC16CFJER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2000+ | 297.48 грн |
MC9S08AC16CFJER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 515.17 грн |
10+ | 383.08 грн |
25+ | 354.77 грн |
100+ | 303.73 грн |
250+ | 289.81 грн |
500+ | 281.42 грн |
1000+ | 270.02 грн |
TEA18361LT/2J |
Виробник: NXP USA Inc.
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): Yes
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
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TEA18361T/2J |
Виробник: NXP USA Inc.
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Power (Watts): 75 W
Description: GREENCHIP SMPS CONTROL IC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Frequency - Switching: 25kHz ~ 132.5kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 9.9V ~ 30V
Supplier Device Package: 14-SO
Fault Protection: Over Power, Over Temperature, Over Voltage
Voltage - Start Up: 14.9 V
Control Features: Frequency Control, Soft Start
Power (Watts): 75 W
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MK40DX256VMC7 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 34x16b; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 74
DigiKey Programmable: Not Verified
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NAFE13188B40BSK |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
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NAFE13188B40BSE |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
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NAFE13188B40BSMP |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
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NAFE13188B40BSMP |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
Description: IC
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
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PEMI2QFN/CK,115 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
Description: FILTER RC(PI) 20 OHM/13.5PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 10dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3806+ | 6.00 грн |
BUK653R4-40C,127 |
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Виробник: NXP USA Inc.
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 25A, 10V
Power Dissipation (Max): 204W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 125 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8020 pF @ 25 V
Description: MOSFET N-CH 40V 100A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 25A, 10V
Power Dissipation (Max): 204W (Tc)
Vgs(th) (Max) @ Id: 2.8V @ 1mA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 125 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8020 pF @ 25 V
на замовлення 1309 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
398+ | 56.30 грн |
AFSC5G35E37T2 |
Виробник: NXP USA Inc.
Description: 10X6 MODULE
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
Description: 10X6 MODULE
Packaging: Tape & Reel (TR)
Package / Case: 26-LQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 26-HLQFN (10x6)
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RD9Z1-638BJBEVM |
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Виробник: NXP USA Inc.
Description: RD9Z1-638BJBEVM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: MM9Z1_638
Supplied Contents: Board(s), Accessories
Primary Attributes: 5V ~ 12V Supply
Embedded: No
Description: RD9Z1-638BJBEVM
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: MM9Z1_638
Supplied Contents: Board(s), Accessories
Primary Attributes: 5V ~ 12V Supply
Embedded: No
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T1023NSE7KQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
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LS1088AXN7PTA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Bulk
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
на замовлення 863 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 11539.06 грн |
MPC8377EVRALGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MRFE6S9135HSR3 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 39W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1 A
Description: RF MOSFET LDMOS 28V NI880S
Packaging: Tape & Reel (TR)
Package / Case: NI-880S
Mounting Type: Surface Mount
Frequency: 940MHz
Power - Output: 39W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-880S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1 A
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MCIMX6X3EVO10AB |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
Description: IC MPU I.MX6SX 1GHZ 400MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 227MHz, 1GHz
Operating Temperature: -20°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Supplier Device Package: 400-MAPBGA (17x17)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
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MGD3160AM318EK |
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Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Description: IC GATE DRVR HIGH-SIDE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: IGBT, SiC MOSFET
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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S912ZVHL32F1CLQ |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 32KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 100
DigiKey Programmable: Not Verified
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