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PDTC123TE,115 PDTC123TE,115 NXP USA Inc. PDTC123T_SER.pdf Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
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FB32K148HFT0VLQT NXP USA Inc. Description: S32K148 144 LQFP
Packaging: Tray
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MPVZ5004G6T1 MPVZ5004G6T1 NXP USA Inc. MPVZ5004G.pdf Description: SENSOR 0.57PSIG 4.9V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±6.25%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 2.32PSI (16kPa)
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MPVZ4006G6T1 MPVZ4006G6T1 NXP USA Inc. MPVZ4006G.pdf Description: SENSOR 0.87PSIG 4.6V
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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MPVZ4006G6U MPVZ4006G6U NXP USA Inc. MPVZ4006G.pdf description Description: SENSOR 0.87PSIG 4.6V 8SOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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MPVZ4006G7U MPVZ4006G7U NXP USA Inc. MPVZ4006G.pdf Description: SENSOR 0.87PSIG 4.6V 8DIP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-DIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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ASL5115SHNZ ASL5115SHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
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ASL5115SHNZ ASL5115SHNZ NXP USA Inc. PB_ASL5xxxyHz.pdf Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
на замовлення 404 шт:
термін постачання 21-31 дні (днів)
1+745.25 грн
10+559.68 грн
25+520.12 грн
100+447.31 грн
250+427.86 грн
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BC857T,115 BC857T,115 NXP USA Inc. BC856T_857T_Rev_Feb2017.pdf Description: TRANS PNP 45V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 150 mW
Qualification: AEC-Q101
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S912ZVL64AVFMR NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-LQFP (7x7)
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S912ZVL64AVFM NXP USA Inc. Description: S12Z CPU, 64K FLASH
Packaging: Tray
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A5G35S008NT6 NXP USA Inc. A5G35S008N.pdf Description: RF MOSFET
Packaging: Tape & Reel (TR)
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MSC8151TAG1000B MSC8151TAG1000B NXP USA Inc. MSC8151.pdf Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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LPC2930FBD208,551 LPC2930FBD208,551 NXP USA Inc. LPC2930.pdf Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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MF1S7001XDUD2/V1A NXP USA Inc. MF1S70YYX_V1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MF1S7031XDUD2/V1A NXP USA Inc. MF1S70YYX_V1.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MC33FS6520NAER2 MC33FS6520NAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MPF5024CMMA0ESR2 NXP USA Inc. PF5024.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MCIMX93-QSB MCIMX93-QSB NXP USA Inc. Description: I.MX 93 QSB DEV BOARD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M33
Utilized IC / Part: i.MX 93
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
1+23047.18 грн
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MC33771CTA2AER2 MC33771CTA2AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTA2AE MC33771CTA2AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP2AER2 MC33771CTP2AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP2AE MC33771CTP2AE NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTA1AER2 MC33771CTA1AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP1AER2 MC33771CTP1AER2 NXP USA Inc. MC33771C.pdf Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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BATT-14EXTENDER NXP USA Inc. BATT-14EXTENDER.pdf Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
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BATT-14CEMULATOR BATT-14CEMULATOR NXP USA Inc. BATT-14CEMULATOR.pdf Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
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RD33771CNTREVM NXP USA Inc. get-started-with-the-rd33771cntrevm:GS-RD33771CNTREVM Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
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S912ZVLA96AVFMR NXP USA Inc. Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
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MC33FS6525CAE MC33FS6525CAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+449.63 грн
10+384.26 грн
25+366.45 грн
40+335.62 грн
80+323.80 грн
250+313.11 грн
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MC33FS6525NAE MC33FS6525NAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525NAER2 MC33FS6525NAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525KAER2 MC33FS6525KAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525CAER2 MC33FS6525CAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525LAER2 MC33FS6525LAER2 NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525KAE MC33FS6525KAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MKE15Z256VLH7R MKE15Z256VLH7R NXP USA Inc. KE1xZP100M72SF0.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
1+465.37 грн
10+344.47 грн
25+318.60 грн
100+272.33 грн
250+259.62 грн
500+251.95 грн
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S912XEG128BCAAR S912XEG128BCAAR NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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74CBTLV16211DGG,11 74CBTLV16211DGG,11 NXP USA Inc. 74CBTLV16211.pdf Description: IC BUS SWITCH 24BIT LV 56-TSSOP
Packaging: Bulk
на замовлення 19943 шт:
термін постачання 21-31 дні (днів)
386+60.03 грн
Мінімальне замовлення: 386
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74AUP1G17GX,125 74AUP1G17GX,125 NXP USA Inc. PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
на замовлення 125986 шт:
термін постачання 21-31 дні (днів)
4784+4.62 грн
Мінімальне замовлення: 4784
В кошику  од. на суму  грн.
74AUP1G17GN,132 74AUP1G17GN,132 NXP USA Inc. PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
на замовлення 145000 шт:
термін постачання 21-31 дні (днів)
1920+12.31 грн
Мінімальне замовлення: 1920
В кошику  од. на суму  грн.
S9S08DZ128F2MLLR S9S08DZ128F2MLLR NXP USA Inc. MC9S08DZ128.pdf Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
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SPC5603BAMLL4 SPC5603BAMLL4 NXP USA Inc. Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
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LPC11E14FBD64/401, LPC11E14FBD64/401, NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 174 шт:
термін постачання 21-31 дні (днів)
2+307.21 грн
10+199.11 грн
25+192.30 грн
160+151.65 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
FS32K148HFT0MLQT FS32K148HFT0MLQT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
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A5G26H605W19NR3 NXP USA Inc. A5G26H605W19N.pdf Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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A7002CGHN1/T1AG502 A7002CGHN1/T1AG502 NXP USA Inc. 568_A700x.pdf Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 3.2K x 8
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
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PCA9552D,118 PCA9552D,118 NXP USA Inc. PCA9552.pdf Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+129.17 грн
Мінімальне замовлення: 1000
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PCA9552D,118 PCA9552D,118 NXP USA Inc. PCA9552.pdf Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 2070 шт:
термін постачання 21-31 дні (днів)
2+235.17 грн
10+169.92 грн
25+155.68 грн
100+131.42 грн
250+124.42 грн
500+120.20 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PCA9532D,118 PCA9532D,118 NXP USA Inc. PCA9532.pdf Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
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PCA9532D,118 PCA9532D,118 NXP USA Inc. PCA9532.pdf Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 424 шт:
термін постачання 21-31 дні (днів)
2+236.82 грн
10+171.20 грн
25+156.89 грн
100+132.44 грн
250+125.38 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LD6836CX4/33H,315 LD6836CX4/33H,315 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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TDA8035HN/C1/S1EL TDA8035HN/C1/S1EL NXP USA Inc. TDA8035.pdf Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
на замовлення 2449 шт:
термін постачання 21-31 дні (днів)
491+46.95 грн
Мінімальне замовлення: 491
В кошику  од. на суму  грн.
MPC565CZP56 MPC565CZP56 NXP USA Inc. MPC565PB.pdf Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MGD3160AM515EKR2 MGD3160AM515EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
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MGD3160AM515EKR2 MGD3160AM515EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
на замовлення 552 шт:
термін постачання 21-31 дні (днів)
1+681.49 грн
10+510.96 грн
25+474.73 грн
100+408.15 грн
250+390.34 грн
500+379.61 грн
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NAFE13388B40BSMP NAFE13388B40BSMP NXP USA Inc. NAFE13388.pdf Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
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NAFE13388B40BSMP NAFE13388B40BSMP NXP USA Inc. NAFE13388.pdf Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
1+1738.91 грн
10+1340.32 грн
25+1256.80 грн
100+1093.33 грн
250+1052.28 грн
500+1027.54 грн
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SAF775DHN/N208WCMP NXP USA Inc. Description: SAF775DHN/N208WCMP
Packaging: Tape & Reel (TR)
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SAF775DHN/N208W/CK NXP USA Inc. Description: SAF775DHN/N208W/CK
Packaging: Tray
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PDTC123TE,115 PDTC123T_SER.pdf
PDTC123TE,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS NPN 50V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: SC-75
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 150 mW
Resistor - Base (R1): 2.2 kOhms
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FB32K148HFT0VLQT
Виробник: NXP USA Inc.
Description: S32K148 144 LQFP
Packaging: Tray
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MPVZ5004G6T1 MPVZ5004G.pdf
MPVZ5004G6T1
Виробник: NXP USA Inc.
Description: SENSOR 0.57PSIG 4.9V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 1 V ~ 4.9 V
Operating Pressure: 0.57PSI (3.92kPa)
Pressure Type: Vented Gauge
Accuracy: ±6.25%
Operating Temperature: 0°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 2.32PSI (16kPa)
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MPVZ4006G6T1 MPVZ4006G.pdf
MPVZ4006G6T1
Виробник: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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MPVZ4006G6U description MPVZ4006G.pdf
MPVZ4006G6U
Виробник: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V 8SOP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-SMD Module
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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MPVZ4006G7U MPVZ4006G.pdf
MPVZ4006G7U
Виробник: NXP USA Inc.
Description: SENSOR 0.87PSIG 4.6V 8DIP
Packaging: Tube
Features: Temperature Compensated
Package / Case: 8-DIP Module
Output Type: Analog Voltage
Mounting Type: Through Hole
Output: 0.3 V ~ 4.6 V
Operating Pressure: 0.87PSI (6kPa)
Pressure Type: Vented Gauge
Operating Temperature: 10°C ~ 60°C
Termination Style: PC Pin
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: No Port
Maximum Pressure: 10.88PSI (75kPa)
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ASL5115SHNZ PB_ASL5xxxyHz.pdf
ASL5115SHNZ
Виробник: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
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ASL5115SHNZ PB_ASL5xxxyHz.pdf
ASL5115SHNZ
Виробник: NXP USA Inc.
Description: IC LED DRV CTRL PWM 1.5A 36HVQFN
Packaging: Cut Tape (CT)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 12
Frequency: 200MHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 125°C (TA)
Current - Output / Channel: 1.5A
Internal Switch(s): Yes
Topology: Switched Capacitor (Charge Pump)
Supplier Device Package: 36-HVQFN (6x6)
Dimming: PWM
Voltage - Supply (Min): 4.5V
Voltage - Supply (Max): 5.5V
Grade: Automotive
на замовлення 404 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+745.25 грн
10+559.68 грн
25+520.12 грн
100+447.31 грн
250+427.86 грн
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BC857T,115 BC856T_857T_Rev_Feb2017.pdf
BC857T,115
Виробник: NXP USA Inc.
Description: TRANS PNP 45V 0.1A SC75
Packaging: Tape & Reel (TR)
Package / Case: SC-75, SOT-416
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 125 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: SC-75
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 150 mW
Qualification: AEC-Q101
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S912ZVL64AVFMR
Виробник: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Supplier Device Package: 48-LQFP (7x7)
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S912ZVL64AVFM
Виробник: NXP USA Inc.
Description: S12Z CPU, 64K FLASH
Packaging: Tray
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A5G35S008NT6 A5G35S008N.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET
Packaging: Tape & Reel (TR)
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MSC8151TAG1000B MSC8151.pdf
MSC8151TAG1000B
Виробник: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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LPC2930FBD208,551 LPC2930.pdf
LPC2930FBD208,551
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 125MHz
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM968E-S
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Number of I/O: 152
DigiKey Programmable: Not Verified
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MF1S7001XDUD2/V1A MF1S70YYX_V1.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MF1S7031XDUD2/V1A MF1S70YYX_V1.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: UART
Type: RFID Transponder
Operating Temperature: -25°C ~ 70°C
Standards: ISO 14443, MIFARE
Supplier Device Package: Die
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MC33FS6520NAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6520NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
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MPF5024CMMA0ESR2 PF5024.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8 Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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MCIMX93-QSB
MCIMX93-QSB
Виробник: NXP USA Inc.
Description: I.MX 93 QSB DEV BOARD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55, Cortex®-M33
Utilized IC / Part: i.MX 93
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+23047.18 грн
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MC33771CTA2AER2 MC33771C.pdf
MC33771CTA2AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTA2AE MC33771C.pdf
MC33771CTA2AE
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP2AER2 MC33771C.pdf
MC33771CTP2AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP2AE MC33771C.pdf
MC33771CTP2AE
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTA1AER2 MC33771C.pdf
MC33771CTA1AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, ADVANCE
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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MC33771CTP1AER2 MC33771C.pdf
MC33771CTP1AER2
Виробник: NXP USA Inc.
Description: BATTERY CELL CONTROLLER, PREMIUM
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Battery Cell Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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BATT-14EXTENDER BATT-14EXTENDER.pdf
Виробник: NXP USA Inc.
Description: BATT-14EXTENDER
Packaging: Bulk
For Use With/Related Products: MC33771B, MC33771C
Accessory Type: Extender
Utilized IC / Part: MC33771B, MC33771C
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BATT-14CEMULATOR BATT-14CEMULATOR.pdf
BATT-14CEMULATOR
Виробник: NXP USA Inc.
Description: BATT-14CEMULATOR
Packaging: Bulk
For Use With/Related Products: MC33771C
Accessory Type: Battery Pack Emulator
Utilized IC / Part: MC33771C
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RD33771CNTREVM get-started-with-the-rd33771cntrevm:GS-RD33771CNTREVM
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33771C
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s), Cable(s), Power Supply
Utilized IC / Part: MC33771C
Primary Attributes: Li-Ion (14 Cells)
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU
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S912ZVLA96AVFMR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT
Packaging: Tape & Reel (TR)
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MC33FS6525CAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+449.63 грн
10+384.26 грн
25+366.45 грн
40+335.62 грн
80+323.80 грн
250+313.11 грн
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MC33FS6525NAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525NAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525KAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525KAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525CAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525LAER2 FS6500-FS4500SDS-ASILB.pdf
MC33FS6525LAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS6525KAE FS6500-FS4500SDS-ASILB.pdf
MC33FS6525KAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MKE15Z256VLH7R KE1xZP100M72SF0.pdf
MKE15Z256VLH7R
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 27x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+465.37 грн
10+344.47 грн
25+318.60 грн
100+272.33 грн
250+259.62 грн
500+251.95 грн
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S912XEG128BCAAR MC9S12XEP100RMV1.pdf
S912XEG128BCAAR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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74CBTLV16211DGG,11 74CBTLV16211.pdf
74CBTLV16211DGG,11
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 24BIT LV 56-TSSOP
Packaging: Bulk
на замовлення 19943 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
386+60.03 грн
Мінімальне замовлення: 386
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74AUP1G17GX,125 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GX,125
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
на замовлення 125986 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4784+4.62 грн
Мінімальне замовлення: 4784
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74AUP1G17GN,132 PHGL-S-A0000283103-1.pdf?t.download=true&u=5oefqw
74AUP1G17GN,132
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Input Type: Schmitt Trigger
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON (0.9x1)
на замовлення 145000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1920+12.31 грн
Мінімальне замовлення: 1920
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S9S08DZ128F2MLLR MC9S08DZ128.pdf
S9S08DZ128F2MLLR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 128KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 87
DigiKey Programmable: Not Verified
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SPC5603BAMLL4
SPC5603BAMLL4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 28K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
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LPC11E14FBD64/401, LPC11E6X.pdf
LPC11E14FBD64/401,
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 174 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+307.21 грн
10+199.11 грн
25+192.30 грн
160+151.65 грн
Мінімальне замовлення: 2
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FS32K148HFT0MLQT S32K1xx.pdf
FS32K148HFT0MLQT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 128
DigiKey Programmable: Not Verified
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A5G26H605W19NR3 A5G26H605W19N.pdf
Виробник: NXP USA Inc.
Description: A5G26H605W19NR3
Packaging: Bulk
Package / Case: OM-780-4S4S
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 85W
Gain: 14.2dB
Technology: GaN
Supplier Device Package: OM-780-4S4S
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 300 mA
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A7002CGHN1/T1AG502 568_A700x.pdf
A7002CGHN1/T1AG502
Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION MICROCONTR
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 3.2K x 8
Operating Temperature: -40°C ~ 90°C
Voltage - Supply: 1.62V ~ 5.5V
Controller Series: A700x
Program Memory Type: EEPROM (76.4kB)
Applications: Authentication
Core Processor: MX51
Supplier Device Package: 32-HVQFN (5x5)
DigiKey Programmable: Not Verified
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PCA9552D,118 PCA9552.pdf
PCA9552D,118
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+129.17 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
PCA9552D,118 PCA9552.pdf
PCA9552D,118
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 2070 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+235.17 грн
10+169.92 грн
25+155.68 грн
100+131.42 грн
250+124.42 грн
500+120.20 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
PCA9532D,118 PCA9532.pdf
PCA9532D,118
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
товару немає в наявності
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PCA9532D,118 PCA9532.pdf
PCA9532D,118
Виробник: NXP USA Inc.
Description: IC LED DRIVER PS I2C 25MA 24SO
Packaging: Cut Tape (CT)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Number of Outputs: 16
Type: Power Switch
Operating Temperature: -40°C ~ 85°C (TA)
Applications: Backlight
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 24-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 424 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+236.82 грн
10+171.20 грн
25+156.89 грн
100+132.44 грн
250+125.38 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LD6836CX4/33H,315 LD6836.pdf
LD6836CX4/33H,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3.3V 300MA 4WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3.3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
товару немає в наявності
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TDA8035HN/C1/S1EL TDA8035.pdf
TDA8035HN/C1/S1EL
Виробник: NXP USA Inc.
Description: HIGH INTEGRATED AND LOW POWER SM
Packaging: Bulk
на замовлення 2449 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
491+46.95 грн
Мінімальне замовлення: 491
В кошику  од. на суму  грн.
MPC565CZP56 MPC565PB.pdf
MPC565CZP56
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 56
DigiKey Programmable: Not Verified
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MGD3160AM515EKR2 GD3160.pdf
MGD3160AM515EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
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MGD3160AM515EKR2 GD3160.pdf
MGD3160AM515EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 15A
Technology: Capacitive Coupling
Current - Output High, Low: 15A, 15A
Voltage - Isolation: 8000Vrms
Approval Agency: CSA, UL, VDE
Supplier Device Package: 32-SOIC
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 4.75V ~ 40V
Qualification: AEC-Q100
на замовлення 552 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+681.49 грн
10+510.96 грн
25+474.73 грн
100+408.15 грн
250+390.34 грн
500+379.61 грн
В кошику  од. на суму  грн.
NAFE13388B40BSMP NAFE13388.pdf
NAFE13388B40BSMP
Виробник: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
товару немає в наявності
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NAFE13388B40BSMP NAFE13388.pdf
NAFE13388B40BSMP
Виробник: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Packaging: Cut Tape (CT)
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Number of Bits: 24
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Supplier Device Package: 64-HVQFN (9x9)
Number of Channels: 8
Power (Watts): 150 mW
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1738.91 грн
10+1340.32 грн
25+1256.80 грн
100+1093.33 грн
250+1052.28 грн
500+1027.54 грн
В кошику  од. на суму  грн.
SAF775DHN/N208WCMP
Виробник: NXP USA Inc.
Description: SAF775DHN/N208WCMP
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
SAF775DHN/N208W/CK
Виробник: NXP USA Inc.
Description: SAF775DHN/N208W/CK
Packaging: Tray
товару немає в наявності
В кошику  од. на суму  грн.
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