Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35986) > Сторінка 557 з 600
| Фото | Назва | Виробник | Інформація |
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8MPNAVQ-8GB-XG | NXP USA Inc. |
 Description: DEV KITPackaging: Bulk Mounting Type: Fixed Type: MPU Contents: Board(s) Core Processor: ARM® Cortex®-A53 Utilized IC / Part: i.MX 8M Plus |
товару немає в наявності |
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MC9328MXLVP20R2 | NXP USA Inc. |
Description: IC MPU I.MXL 200MHZ 225MAPBGA Packaging: Tape & Reel (TR) Package / Case: 225-LFBGA Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: ARM920T Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 225-MAPBGA (13x13) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART |
товару немає в наявності |
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K32W061Y | NXP USA Inc. |
Description: IC RF TXRX+MCU 802.15.4 40HVQFN Packaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Sensitivity: -101.3dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 640kB Flash, 152kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 11.2dBm Protocol: Bluetooth v5.0 Current - Receiving: 4.3mA Data Rate (Max): 2Mbps Current - Transmitting: 7.4mA ~ 20.3mA Supplier Device Package: 40-HVQFN (6x6) GPIO: 22 RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: I2C, SPI, PWM, UART DigiKey Programmable: Not Verified |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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PCF2120TK/1,118 | NXP USA Inc. |
Description: IC OSC XTAL 32KHZ 10-HVSON Packaging: Bulk Package / Case: 10-VFDFN Exposed Pad Mounting Type: Surface Mount Frequency: 32kHz Type: Oscillator, Crystal Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.5V ~ 5.5V Supplier Device Package: 10-HVSON (3x3) Current - Supply: 1.39 µA |
на замовлення 10953 шт: термін постачання 21-31 дні (днів) |
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MC9S08SH8MTJR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 20TSSOP Packaging: Tape & Reel (TR) Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 17 DigiKey Programmable: Not Verified |
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LD6806F/25P,115 | NXP USA Inc. |
Description: IC REG LINEAR 2.5V 200MA 6XSON Packaging: Bulk Package / Case: 6-XFDFN Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Output (Min/Fixed): 2.5V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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MC35FS6518CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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| SCVBBK77CWA | NXP USA Inc. |
Description: NXP LEAD FREE MPC5777C 416 PIN 1 Packaging: Bulk |
товару немає в наявності |
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OM40002UL | NXP USA Inc. |
Description: LPC8N04 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: LPC8N04 |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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P1015NSN5FFB | NXP USA Inc. |
Description: IC MPU 667MHZ 561TEPBGA Packaging: Tray Package / Case: 561-FBGA Mounting Type: Surface Mount Supplier Device Package: 561-TEPBGA I (23x23) |
товару немає в наявності |
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P1015NXN5FFB | NXP USA Inc. |
Description: IC MPU 667MHZ 561TEPBGA Packaging: Tray Package / Case: 561-FBGA Mounting Type: Surface Mount Supplier Device Package: 561-TEPBGA I (23x23) |
товару немає в наявності |
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P1016NXN5FFB | NXP USA Inc. |
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA Packaging: Tray Package / Case: 561-FBGA Mounting Type: Surface Mount Speed: 667MHz Operating Temperature: -40°C ~ 125°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 561-TEPBGA I (23x23) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
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S32K396EHT1MKUST | NXP USA Inc. |
Description: S32K396 Arm Cortex-M7 Packaging: Tray |
на замовлення 200 шт: термін постачання 21-31 дні (днів) |
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S32K3X8EVB-Q289 | NXP USA Inc. |
Description: EVAL BOARD S32K3X8 Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K310NHT0VLFSR | NXP USA Inc. |
Description: S32K310NHT0VLFSR Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
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S32K310NHT0VLFST | NXP USA Inc. |
Description: S32K310NHT0VLFST Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 112K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
товару немає в наявності |
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S32K311NHT0VPASR | NXP USA Inc. |
Description: S32K311NHT0VPASR Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
товару немає в наявності |
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S32K311NHT0MPAIR | NXP USA Inc. |
Description: S32K311NHT0MPAIR Packaging: Bulk Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
товару немає в наявності |
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S32K312NHT0MPAIR | NXP USA Inc. |
Description: S32K312NHT0MPAIR Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K312NHT0MPASR | NXP USA Inc. |
Description: S32K312NHT0MPASR Packaging: Tape & Reel (TR) Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 2MB (2M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K394EHT1MJBSR | NXP USA Inc. |
Description: S32K394EHT1MJBSR Packaging: Tape & Reel (TR) Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K394NHT1MJBST | NXP USA Inc. |
Description: S32K394NHT1MJBST Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K394EHT1MJBST | NXP USA Inc. |
Description: S32K394EHT1MJBST Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 4MB (4M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Number of I/O: 209 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K396NHT1MJBST | NXP USA Inc. |
Description: S32K396NHT1MJBST Packaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 289-LFBGA (14x14) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| S32K396NHT1MKUSR | NXP USA Inc. |
Description: S32K396NHT1MKUSR Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 176-LQFP (24x24) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S32K396EHT1MKUSR | NXP USA Inc. |
Description: S32K396EHT1MKUSR Packaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 176-LQFP (24x24) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S32K396NHT1MKUST | NXP USA Inc. |
Description: S32K396NHT1MKUST Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 320MHz Program Memory Size: 6MB (6M x 8) RAM Size: 800K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 69x12b SAR, Sigma-Delta Core Size: 32-Bit Quad-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, QSPI, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 176-HLQFP (24x24) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| S32X-MB | NXP USA Inc. |
Description: S32X-MB Packaging: Bulk Function: I/O Expansion Type: Interface Contents: Board(s) Utilized IC / Part: S32K37, S32K39 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S32K396BMS-EVB | NXP USA Inc. |
Description: S32K396BMS-EVB Packaging: Bulk |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| S32K396-BGA-DC1 | NXP USA Inc. |
Description: S32K396-BGA-DC1 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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AFV10700HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI780 Packaging: Bulk Package / Case: NI-780-4 Current Rating (Amps): 1µA Mounting Type: Chassis Mount Frequency: 1.03GHz ~ 1.09GHz Configuration: Dual Power - Output: 770W Gain: 19.2dB Technology: LDMOS Supplier Device Package: NI-780-4 Voltage - Rated: 105 V Voltage - Test: 50 V Current - Test: 100 mA |
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В кошику од. на суму грн. | ||||||||||||||||
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MCIMX6S4AVM08AB | NXP USA Inc. |
Description: IC MPU I.MX6S 800MHZ 624MAPBGA Packaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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SE050F2HQ1/Z018HZ | NXP USA Inc. |
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN Packaging: Tape & Reel (TR) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: Plug and Trust Secure Element Supplier Device Package: 20-HX2QFN (3x3) DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||||||
| PCA9481AUKZ | NXP USA Inc. |
Description: SWITCHED CAPACITOR CHARGER Packaging: Tape & Reel (TR) Package / Case: 70-UFBGA, WLCSP Number of Cells: 1 Mounting Type: Surface Mount Interface: I2C Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 70-WLCSP (4.16x2.96) Charge Current - Max: 10A Programmable Features: Timer Fault Protection: Over Temperature, Over-Under Voltage Voltage - Supply (Max): 16.5V Battery Pack Voltage: 7V (Max) Current - Charging: Constant |
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WPR1500-HVMPP | NXP USA Inc. |
Description: WPR1500-HVMPP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| K32W042S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK/THREAD WLCSP Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 191-WLCSP (5.97x5.85) Number of I/O: 104 DigiKey Programmable: Not Verified |
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| K32W032S1M2VPJAT | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK 176-VFBGA Packaging: Tray Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 105°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 176-VFBGA Number of I/O: 104 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | |||||||||||||||||
| MPC8343CRADDB | NXP USA Inc. |
Description: POWERQUICC II PRO PROCESSOR Packaging: Bulk Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-TEPBGA II (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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MPC8343CVRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8343EVRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8343ZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| NTP53121G0JUAV | NXP USA Inc. |
Description: NTAG Packaging: Bulk Frequency: 13.56MHz Memory Type: Read/Write Operating Temperature: -40°C ~ 105°C Standards: ISO 15693, NFC Writable Memory: 16kb (User) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MIMXRT106VDVL6B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
на замовлення 456 шт: термін постачання 21-31 дні (днів) |
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MIMXRT106DDVL6B | NXP USA Inc. |
Description: IC MCU Packaging: Tray |
на замовлення 480 шт: термін постачання 21-31 дні (днів) |
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S912XEQ512BCAA | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512J2CAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512F1CAG | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512F1CAGR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512BVAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512F1VAL | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 16x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 91 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEQ512J3MAAR | NXP USA Inc. |
Description: IC MCU 16BIT 512KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC908LJ24CFUER | NXP USA Inc. |
Description: IC MCU 8BIT 24KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 24KB (24K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: I2C, IRSCI, SPI Peripherals: LCD, LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Number of I/O: 40 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MFS8632BMDA0ESR2 | NXP USA Inc. |
Description: SAFETY SYSTEM BASIS CHIP FOR DOM Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 36V Applications: Camera Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MK12DX256VLF5 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 18x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 33 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKV10Z16VFM7 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFN Packaging: Bulk Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 75MHz Program Memory Size: 16KB (16K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 139 шт: термін постачання 21-31 дні (днів) |
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MKV10Z16VFM7 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32QFN Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 75MHz Program Memory Size: 16KB (16K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MW7IC2750NBR1 | NXP USA Inc. |
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-14 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: WiMax Voltage - Supply: 28V Gain: 26dB Current - Supply: 550mA P1dB: 47dBm Test Frequency: 2.7GHz Supplier Device Package: TO-272 WB-14 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BFU550WF | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70 Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 12dB Power - Max: 450mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Supplier Device Package: SC-70 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BFU550WF | NXP USA Inc. |
Description: RF TRANS NPN 12V 11GHZ SC-70 Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 12dB Power - Max: 450mW Current - Collector (Ic) (Max): 50mA Voltage - Collector Emitter Breakdown (Max): 12V DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz Supplier Device Package: SC-70 |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| 8MPNAVQ-8GB-XG |
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Виробник: NXP USA Inc.
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
Description: DEV KIT
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53
Utilized IC / Part: i.MX 8M Plus
товару немає в наявності
В кошику
од. на суму грн.
| MC9328MXLVP20R2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MXL 200MHZ 225MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 225-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM920T
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 225-MAPBGA (13x13)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Additional Interfaces: I2C, I2S, SPI, SSI, MMC/SD, UART
товару немає в наявності
В кошику
од. на суму грн.
| K32W061Y |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU 802.15.4 40HVQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -101.3dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 640kB Flash, 152kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 11.2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 4.3mA
Data Rate (Max): 2Mbps
Current - Transmitting: 7.4mA ~ 20.3mA
Supplier Device Package: 40-HVQFN (6x6)
GPIO: 22
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: I2C, SPI, PWM, UART
DigiKey Programmable: Not Verified
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 794.02 грн |
| 10+ | 591.49 грн |
| 25+ | 540.25 грн |
| 100+ | 448.41 грн |
| 250+ | 417.59 грн |
| 500+ | 397.75 грн |
| 1000+ | 374.27 грн |
| PCF2120TK/1,118 |
|
Виробник: NXP USA Inc.
Description: IC OSC XTAL 32KHZ 10-HVSON
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 32kHz
Type: Oscillator, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Supplier Device Package: 10-HVSON (3x3)
Current - Supply: 1.39 µA
Description: IC OSC XTAL 32KHZ 10-HVSON
Packaging: Bulk
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 32kHz
Type: Oscillator, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.5V ~ 5.5V
Supplier Device Package: 10-HVSON (3x3)
Current - Supply: 1.39 µA
на замовлення 10953 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 289+ | 80.18 грн |
| MC9S08SH8MTJR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 17
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LD6806F/25P,115 |
|
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2.5V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 2.5V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 2.5V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2219+ | 11.14 грн |
| MC35FS6518CAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 834.97 грн |
| 10+ | 713.66 грн |
| 25+ | 680.52 грн |
| 40+ | 623.27 грн |
| 80+ | 601.21 грн |
| 250+ | 566.60 грн |
| OM40002UL |
|
Виробник: NXP USA Inc.
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC8N04
Description: LPC8N04 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: LPC8N04
на замовлення 18 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 18+ | 2213.69 грн |
| P1015NSN5FFB |
|
Виробник: NXP USA Inc.
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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| P1015NXN5FFB |
|
Виробник: NXP USA Inc.
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
Description: IC MPU 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Supplier Device Package: 561-TEPBGA I (23x23)
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| P1016NXN5FFB |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 667MHZ 561TEPBGA
Packaging: Tray
Package / Case: 561-FBGA
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 561-TEPBGA I (23x23)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| S32K396EHT1MKUST |
|
на замовлення 200 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3711.83 грн |
| 10+ | 2754.61 грн |
| 25+ | 2545.23 грн |
| 200+ | 2176.92 грн |
| S32K310NHT0VLFSR |
|
Виробник: NXP USA Inc.
Description: S32K310NHT0VLFSR
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S32K310NHT0VLFSR
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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| S32K310NHT0VLFST |
|
Виробник: NXP USA Inc.
Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S32K310NHT0VLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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| S32K311NHT0VPASR |
|
Виробник: NXP USA Inc.
Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K311NHT0VPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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| S32K311NHT0MPAIR |
|
Виробник: NXP USA Inc.
Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K311NHT0MPAIR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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| S32K312NHT0MPAIR |
|
Виробник: NXP USA Inc.
Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K312NHT0MPAIR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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| S32K312NHT0MPASR |
|
Виробник: NXP USA Inc.
Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K312NHT0MPASR
Packaging: Tape & Reel (TR)
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, I3C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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| S32K394EHT1MJBSR |
|
Виробник: NXP USA Inc.
Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K394EHT1MJBSR
Packaging: Tape & Reel (TR)
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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| S32K394NHT1MJBST |
|
Виробник: NXP USA Inc.
Description: S32K394NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K394NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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| S32K394EHT1MJBST |
|
Виробник: NXP USA Inc.
Description: S32K394EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
Description: S32K394EHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Number of I/O: 209
Qualification: AEC-Q100
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| S32K396NHT1MJBST |
|
Виробник: NXP USA Inc.
Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396NHT1MJBST
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
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| S32K396NHT1MKUSR |
|
Виробник: NXP USA Inc.
Description: S32K396NHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396NHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
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| S32K396EHT1MKUSR |
|
Виробник: NXP USA Inc.
Description: S32K396EHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396EHT1MKUSR
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
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| S32K396NHT1MKUST |
|
Виробник: NXP USA Inc.
Description: S32K396NHT1MKUST
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-HLQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
Description: S32K396NHT1MKUST
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 800K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 69x12b SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, QSPI, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 176-HLQFP (24x24)
Grade: Automotive
Qualification: AEC-Q100
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| S32X-MB |
Виробник: NXP USA Inc.
Description: S32X-MB
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: S32K37, S32K39
Description: S32X-MB
Packaging: Bulk
Function: I/O Expansion
Type: Interface
Contents: Board(s)
Utilized IC / Part: S32K37, S32K39
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| S32K396BMS-EVB |
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 75289.66 грн |
| AFV10700HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
Description: RF MOSFET LDMOS 50V NI780
Packaging: Bulk
Package / Case: NI-780-4
Current Rating (Amps): 1µA
Mounting Type: Chassis Mount
Frequency: 1.03GHz ~ 1.09GHz
Configuration: Dual
Power - Output: 770W
Gain: 19.2dB
Technology: LDMOS
Supplier Device Package: NI-780-4
Voltage - Rated: 105 V
Voltage - Test: 50 V
Current - Test: 100 mA
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| MCIMX6S4AVM08AB |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6S 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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| SE050F2HQ1/Z018HZ |
|
Виробник: NXP USA Inc.
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Plug and Trust Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
Description: IC PLUG/TRUST SEC ELEM 20HX2QFN
Packaging: Tape & Reel (TR)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Plug and Trust Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
DigiKey Programmable: Not Verified
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| PCA9481AUKZ |
|
Виробник: NXP USA Inc.
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 70-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 70-WLCSP (4.16x2.96)
Charge Current - Max: 10A
Programmable Features: Timer
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 16.5V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
Description: SWITCHED CAPACITOR CHARGER
Packaging: Tape & Reel (TR)
Package / Case: 70-UFBGA, WLCSP
Number of Cells: 1
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 70-WLCSP (4.16x2.96)
Charge Current - Max: 10A
Programmable Features: Timer
Fault Protection: Over Temperature, Over-Under Voltage
Voltage - Supply (Max): 16.5V
Battery Pack Voltage: 7V (Max)
Current - Charging: Constant
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| K32W042S1M2CAVAR |
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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| K32W032S1M2VPJAT |
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
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| MPC8343CRADDB |
|
Виробник: NXP USA Inc.
Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-TEPBGA II (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: POWERQUICC II PRO PROCESSOR
Packaging: Bulk
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-TEPBGA II (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 8+ | 3671.08 грн |
| MPC8343CVRADDB |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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| MPC8343EVRADDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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| MPC8343ZQADDB |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI, SPI
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| NTP53121G0JUAV |
Виробник: NXP USA Inc.
Description: NTAG
Packaging: Bulk
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
Description: NTAG
Packaging: Bulk
Frequency: 13.56MHz
Memory Type: Read/Write
Operating Temperature: -40°C ~ 105°C
Standards: ISO 15693, NFC
Writable Memory: 16kb (User)
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| MIMXRT106VDVL6B |
|
на замовлення 456 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 999.63 грн |
| 10+ | 854.51 грн |
| 25+ | 814.77 грн |
| 40+ | 746.20 грн |
| 80+ | 719.80 грн |
| 240+ | 679.79 грн |
| MIMXRT106DDVL6B |
|
на замовлення 480 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1071.51 грн |
| 10+ | 915.84 грн |
| 25+ | 873.43 грн |
| 40+ | 799.93 грн |
| 80+ | 771.68 грн |
| 240+ | 728.83 грн |
| 480+ | 691.45 грн |
| S912XEQ512BCAA |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| S912XEQ512BCAAR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| S912XEQ512J2CAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| S912XEQ512F1CAG |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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| S912XEQ512F1CAGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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| S912XEQ512BVAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| S912XEQ512F1VAL |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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| S912XEQ512J3MAAR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| MC908LJ24CFUER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 24KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: I2C, IRSCI, SPI
Peripherals: LCD, LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 40
DigiKey Programmable: Not Verified
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| MFS8632BMDA0ESR2 |
|
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 36V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MK12DX256VLF5 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 18x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 33
DigiKey Programmable: Not Verified
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| MKV10Z16VFM7 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 139 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 131+ | 165.31 грн |
| MKV10Z16VFM7 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 75MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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| MW7IC2750NBR1 |
|
Виробник: NXP USA Inc.
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-14
Description: IC AMP WIMAX 2.3-2.7GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: WiMax
Voltage - Supply: 28V
Gain: 26dB
Current - Supply: 550mA
P1dB: 47dBm
Test Frequency: 2.7GHz
Supplier Device Package: TO-272 WB-14
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| BFU550WF |
|
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Supplier Device Package: SC-70
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| BFU550WF |
|
Виробник: NXP USA Inc.
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Supplier Device Package: SC-70
Description: RF TRANS NPN 12V 11GHZ SC-70
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 12dB
Power - Max: 450mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 15mA, 8V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 1.3dB @ 1.8GHz
Supplier Device Package: SC-70
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11+ | 32.60 грн |
| 15+ | 22.13 грн |
| 25+ | 19.70 грн |
| 100+ | 16.04 грн |
| 250+ | 14.86 грн |
| 500+ | 14.16 грн |
| 1000+ | 13.35 грн |
| 2500+ | 12.75 грн |