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LPC55S16JEV59Y LPC55S16JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S16JEV59Y LPC55S16JEV59Y NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
на замовлення 2991 шт:
термін постачання 21-31 дні (днів)
1+456.50 грн
10+337.89 грн
25+312.48 грн
100+267.07 грн
250+255.77 грн
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S9S08SG32E1MTJR S9S08SG32E1MTJR NXP USA Inc. MC9S08SG32.pdf Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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PEMI8QFN/BYP,132 PEMI8QFN/BYP,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) ESD SMD
Number of Channels: 8
ESD Protection: Yes
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Height: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
на замовлення 56000 шт:
термін постачання 21-31 дні (днів)
1567+14.31 грн
Мінімальне замовлення: 1567
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MCIMX6D4AVT10AC MCIMX6D4AVT10AC NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
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S9S08DZ60F2CLHR S9S08DZ60F2CLHR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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LFTAS32K3NMQA NXP USA Inc. Description: LFTAS32K3NMQA
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
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MMW9004KCAZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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MMW9002KCAZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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MMW9002KCZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
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MMW9004KCZ NXP USA Inc. Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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MCXA145VLL NXP USA Inc. MCXAP64M96FS3.pdf Description: IC MCU 32BIT 512KB FLASH
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Packaging: Tray
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
1+360.77 грн
10+252.71 грн
90+205.20 грн
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MC56F83786VLK MC56F83786VLK NXP USA Inc. MC56F83XXXFS.pdf Description: IC MCU 32BIT 256KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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MIMX8US5CVP08SC MIMX8US5CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 606 шт:
термін постачання 21-31 дні (днів)
1+1368.71 грн
10+1052.05 грн
25+985.60 грн
100+856.37 грн
250+823.69 грн
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MIMX8UD5CVP08SC MIMX8UD5CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 478 шт:
термін постачання 21-31 дні (днів)
1+1434.38 грн
10+1104.32 грн
25+1035.00 грн
100+899.89 грн
250+865.84 грн
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MIMX8UD3CVP08SC MIMX8UD3CVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 447 шт:
термін постачання 21-31 дні (днів)
1+1574.41 грн
10+1215.17 грн
25+1140.08 грн
100+992.48 грн
250+955.56 грн
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MC33GD3100BEK MC33GD3100BEK NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
1+655.08 грн
10+491.70 грн
42+440.72 грн
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MC33GD3100B3EK MC33GD3100B3EK NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
1+655.08 грн
10+491.70 грн
42+440.72 грн
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MFS5600AVMADEPR2 NXP USA Inc. FS5600.pdf Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS5600AVMABEPR2 NXP USA Inc. FS5600.pdf Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MCIMX516AJM6C MCIMX516AJM6C NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
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MCIMX516AJM6CR2 MCIMX516AJM6CR2 NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX516AJM6CR2 MCIMX516AJM6CR2 NXP USA Inc. IMX51AEC.pdf Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Bulk
на замовлення 723 шт:
термін постачання 21-31 дні (днів)
5+3958.50 грн
Мінімальне замовлення: 5
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88Q9098-A2-NYGA/AK 88Q9098-A2-NYGA/AK NXP USA Inc. 2-4-5-ghz-dual-band-2x2-wi-fi-6-802-11ax-plus-bluetooth-5-3-automotive-solution:88Q9098 Description: 88Q9098-A2-NYGA/AK
Packaging: Bulk
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SE051A2HQ1/Z01XEZ SE051A2HQ1/Z01XEZ NXP USA Inc. AN13013.pdf Description: SE051A2HQ1
Packaging: Tape & Reel (TR)
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S912ZVMAL1F0WLF S912ZVMAL1F0WLF NXP USA Inc. S12ZVMAFS.pdf Description: S912ZVMAL1F0WLF
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Core Size: 16-Bit
Data Converters: A/D 7x12b SAR
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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PESD5V0V1USF,315 PESD5V0V1USF,315 NXP USA Inc. PHGLS25492-1.pdf?t.download=true&u=5oefqw Description: TVS DIODE 5VWM DSN0603-2
Power Line Protection: No
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DSN0603-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Capacitance @ Frequency: 4pF @ 1MHz
Applications: Telecom
Operating Temperature: -55°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Packaging: Bulk
на замовлення 1575000 шт:
термін постачання 21-31 дні (днів)
5323+4.52 грн
Мінімальне замовлення: 5323
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MC908MR32VFUE MC908MR32VFUE NXP USA Inc. MC68HC908MR8.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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S32M24XEVB-L064 S32M24XEVB-L064 NXP USA Inc. S32M24xEVB-L064.pdf Description: S32M24XEVB-L064
Embedded: Yes, MCU, 32-Bit
Primary Attributes: Motors (BLDC, PMSM)
Utilized IC / Part: S32M24X
Contents: Board(s)
Type: Power Management
Function: Motor Controller/Driver
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+14259.13 грн
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FRDM-MCXN236 FRDM-MCXN236 NXP USA Inc. Description: FREEDOM MCXN236 EVAL BRD
Platform: Freedom
Utilized IC / Part: MCXN236
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+1495.30 грн
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MK51DX128CMC7 MK51DX128CMC7 NXP USA Inc. K51P100M72SF1.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 35x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK21DX128VMC5 MK21DX128VMC5 NXP USA Inc. K20P121M100SF2.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
на замовлення 348 шт:
термін постачання 21-31 дні (днів)
53+428.47 грн
Мінімальне замовлення: 53
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MK21DX128VMC5 MK21DX128VMC5 NXP USA Inc. K20P121M100SF2.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK40DX128VMC7 MK40DX128VMC7 NXP USA Inc. KNTSK40FMLYFS.pdf Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 74
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK51DX128CLK7 MK51DX128CLK7 NXP USA Inc. K51P81M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
1+580.71 грн
10+432.43 грн
25+400.74 грн
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MK20DX128VFT5 MK20DX128VFT5 NXP USA Inc. K20P48M50SF0.pdf Description: IC MCU 32BIT 128KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MK40DX128VLK7 MK40DX128VLK7 NXP USA Inc. K40P81M72SF1.pdf Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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TEA19051BARTK/1J NXP USA Inc. TEA19051BTK.pdf Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
190+106.02 грн
Мінімальне замовлення: 190
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P1011NXN2HFB P1011NXN2HFB NXP USA Inc. QorIQ_P1.pdf Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1010NXN5HFB P1010NXN5HFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
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MF4SAM3X84/9BA6AAJ NXP USA Inc. Description: MIFARE SAM AV3
Supplier Device Package: PCM1.1
Standards: ISO 7816, Mifare
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C, UART
Mounting Type: Surface Mount
Package / Case: Module
Packaging: Bulk
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MCIMX507CVM1B MCIMX507CVM1B NXP USA Inc. IMX50CEC.pdf Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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BTA202X-600D,127 NXP USA Inc. BTA202X-600D_127.pdf Description: TRIAC SENS GATE 600V 2A TO220-3
Voltage - Off State: 600 V
Current - On State (It (RMS)) (Max): 2 A
Supplier Device Package: TO-220F
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Hold (Ih) (Max): 5 mA
Operating Temperature: 125°C (TJ)
Configuration: Single
Triac Type: Logic - Sensitive Gate
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Bulk
на замовлення 4057 шт:
термін постачання 21-31 дні (днів)
943+23.35 грн
Мінімальне замовлення: 943
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S912XEG256BVAL S912XEG256BVAL NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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NXH2004UK/A2Z NXP USA Inc. Description: NXH2004UK/A2Z
Packaging: Bulk
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S912ZVC19F1WLFR S912ZVC19F1WLFR NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVC19F1WLF S912ZVC19F1WLF NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S912ZVCA19F1WLF S912ZVCA19F1WLF NXP USA Inc. Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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KIT-UCANS32K1SCT NXP USA Inc. getting-started-with-the-ucans32k1sct-evaluation-board:GS-UCANS32K1SCT Description: EVAL BOARD FOR TJA1153A
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: TJA1153A
Contents: Board(s), Cable(s)
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
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74AUP2G3407GMH 74AUP2G3407GMH NXP USA Inc. PHGLS28868-1.pdf?t.download=true&u=5oefqw Description: IC BUFFER NON-INVERT 3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
на замовлення 90000 шт:
термін постачання 21-31 дні (днів)
678+29.59 грн
Мінімальне замовлення: 678
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S9S12G64ACLHR S9S12G64ACLHR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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S9S12G48AMLHR S9S12G48AMLHR NXP USA Inc. S12G%20Family%20Fact%20Sheet.pdf Description: IC MCU 16BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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S9S12G64ACLH S9S12G64ACLH NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G48AMLH S9S12G48AMLH NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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NCF29AGVHNF/0500ZY NXP USA Inc. Description: NCF29AGVHNF/0500ZY
Packaging: Tape & Reel (TR)
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NCF29AGXHN4/0500ZY NXP USA Inc. Description: NCF29AGXHN4/0500ZY
Packaging: Tape & Reel (TR)
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S9S12GN16J0MLFR NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12GN16J0MLF NXP USA Inc. Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12G64J1VLC NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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S9S12G64J1MLC NXP USA Inc. Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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LPC55S16JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S16JEV59Y LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV59Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 59BGA
Packaging: Cut Tape (CT)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
на замовлення 2991 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+456.50 грн
10+337.89 грн
25+312.48 грн
100+267.07 грн
250+255.77 грн
В кошику  од. на суму  грн.
S9S08SG32E1MTJR MC9S08SG32.pdf
S9S08SG32E1MTJR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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PEMI8QFN/BYP,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI8QFN/BYP,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) ESD SMD
Number of Channels: 8
ESD Protection: Yes
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Height: 0.020" (0.50mm)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Package / Case: 16-XFDFN Exposed Pad
Packaging: Bulk
на замовлення 56000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1567+14.31 грн
Мінімальне замовлення: 1567
В кошику  од. на суму  грн.
MCIMX6D4AVT10AC IMX6DQAEC.pdf
MCIMX6D4AVT10AC
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 1.0GHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
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S9S08DZ60F2CLHR
S9S08DZ60F2CLHR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 24x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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LFTAS32K3NMQA
Виробник: NXP USA Inc.
Description: LFTAS32K3NMQA
Packaging: Box
For Use With/Related Products: S32K3
Module/Board Type: Adapter Board
Utilized IC / Part: S32K3
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MMW9004KCAZ
Виробник: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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MMW9002KCAZ
Виробник: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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MMW9002KCZ
Виробник: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 26.5GHz ~ 29.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Packaging: Tape & Reel (TR)
Package / Case: 56-UFBGA, WLCSP
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MMW9004KCZ
Виробник: NXP USA Inc.
Description: 4-CHANNEL ANALOG BEAMFORMING INT
Supplier Device Package: 56-WLCSP (4.39x3.59)
Secondary Attributes: SPI Interface
RF Type: General Purpose
Frequency: 24.25GHz ~ 27.5GHz
Function: Transmitter
Mounting Type: Surface Mount
Package / Case: 56-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
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MCXA145VLL MCXAP64M96FS3.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH
Peripherals: POR, PWM, WDT
Connectivity: I2C, I3C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 48MHz
Packaging: Tray
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+360.77 грн
10+252.71 грн
90+205.20 грн
В кошику  од. на суму  грн.
MC56F83786VLK MC56F83XXXFS.pdf
MC56F83786VLK
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 68
Supplier Device Package: 80-FQFP (12x12)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 64K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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MIMX8US5CVP08SC IMX8ULPIEC.pdf
MIMX8US5CVP08SC
Виробник: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 606 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1368.71 грн
10+1052.05 грн
25+985.60 грн
100+856.37 грн
250+823.69 грн
В кошику  од. на суму  грн.
MIMX8UD5CVP08SC IMX8ULPIEC.pdf
MIMX8UD5CVP08SC
Виробник: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 478 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1434.38 грн
10+1104.32 грн
25+1035.00 грн
100+899.89 грн
250+865.84 грн
В кошику  од. на суму  грн.
MIMX8UD3CVP08SC IMX8ULPIEC.pdf
MIMX8UD3CVP08SC
Виробник: NXP USA Inc.
Description: 8ULP DUAL CORTEX A35
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 447 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1574.41 грн
10+1215.17 грн
25+1140.08 грн
100+992.48 грн
250+955.56 грн
В кошику  од. на суму  грн.
MC33GD3100BEK MC33GD3100_SDS.pdf
MC33GD3100BEK
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+655.08 грн
10+491.70 грн
42+440.72 грн
В кошику  од. на суму  грн.
MC33GD3100B3EK MC33GD3100_SDS.pdf
MC33GD3100B3EK
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tube
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+655.08 грн
10+491.70 грн
42+440.72 грн
В кошику  од. на суму  грн.
MFS5600AVMADEPR2 FS5600.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS5600AVMABEPR2 FS5600.pdf
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT SPECIALIZED
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Applications: Automotive
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MCIMX516AJM6C IMX51AEC.pdf
MCIMX516AJM6C
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
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MCIMX516AJM6CR2 IMX51AEC.pdf
MCIMX516AJM6CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tape & Reel (TR)
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MCIMX516AJM6CR2 IMX51AEC.pdf
MCIMX516AJM6CR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX51 600MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 600MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Bulk
на замовлення 723 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+3958.50 грн
Мінімальне замовлення: 5
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88Q9098-A2-NYGA/AK 2-4-5-ghz-dual-band-2x2-wi-fi-6-802-11ax-plus-bluetooth-5-3-automotive-solution:88Q9098
88Q9098-A2-NYGA/AK
Виробник: NXP USA Inc.
Description: 88Q9098-A2-NYGA/AK
Packaging: Bulk
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SE051A2HQ1/Z01XEZ AN13013.pdf
SE051A2HQ1/Z01XEZ
Виробник: NXP USA Inc.
Description: SE051A2HQ1
Packaging: Tape & Reel (TR)
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S912ZVMAL1F0WLF S12ZVMAFS.pdf
S912ZVMAL1F0WLF
Виробник: NXP USA Inc.
Description: S912ZVMAL1F0WLF
Qualification: AEC-Q100
Number of I/O: 31
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.5V ~ 20V
Core Size: 16-Bit
Data Converters: A/D 7x12b SAR
Core Processor: S12Z
EEPROM Size: 128 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 2K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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PESD5V0V1USF,315 PHGLS25492-1.pdf?t.download=true&u=5oefqw
PESD5V0V1USF,315
Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM DSN0603-2
Power Line Protection: No
Voltage - Breakdown (Min): 6V
Unidirectional Channels: 1
Supplier Device Package: DSN0603-2
Voltage - Reverse Standoff (Typ): 5V (Max)
Capacitance @ Frequency: 4pF @ 1MHz
Applications: Telecom
Operating Temperature: -55°C ~ 150°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: 0201 (0603 Metric)
Packaging: Bulk
на замовлення 1575000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5323+4.52 грн
Мінімальне замовлення: 5323
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MC908MR32VFUE MC68HC908MR8.pdf
MC908MR32VFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 44
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 768 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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S32M24XEVB-L064 S32M24xEVB-L064.pdf
S32M24XEVB-L064
Виробник: NXP USA Inc.
Description: S32M24XEVB-L064
Embedded: Yes, MCU, 32-Bit
Primary Attributes: Motors (BLDC, PMSM)
Utilized IC / Part: S32M24X
Contents: Board(s)
Type: Power Management
Function: Motor Controller/Driver
Packaging: Bulk
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14259.13 грн
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FRDM-MCXN236
FRDM-MCXN236
Виробник: NXP USA Inc.
Description: FREEDOM MCXN236 EVAL BRD
Platform: Freedom
Utilized IC / Part: MCXN236
Core Processor: ARM® Cortex®-M33
Contents: Board(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1495.30 грн
В кошику  од. на суму  грн.
MK51DX128CMC7 K51P100M72SF1.pdf
MK51DX128CMC7
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 35x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK21DX128VMC5 K20P121M100SF2.pdf
MK21DX128VMC5
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
на замовлення 348 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
53+428.47 грн
Мінімальне замовлення: 53
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MK21DX128VMC5 K20P121M100SF2.pdf
MK21DX128VMC5
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK40DX128VMC7 KNTSK40FMLYFS.pdf
MK40DX128VMC7
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 74
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 34x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
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MK51DX128CLK7 K51P81M72SF1.pdf
MK51DX128CLK7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 30x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
на замовлення 89 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+580.71 грн
10+432.43 грн
25+400.74 грн
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MK20DX128VFT5 K20P48M50SF0.pdf
MK20DX128VFT5
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 29
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 11x16b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MK40DX128VLK7 K40P81M72SF1.pdf
MK40DX128VLK7
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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TEA19051BARTK/1J TEA19051BTK.pdf
Виробник: NXP USA Inc.
Description: SMARTCHARG PROTOC CONTR QC4
Packaging: Bulk
DigiKey Programmable: Not Verified
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
190+106.02 грн
Мінімальне замовлення: 190
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P1011NXN2HFB QorIQ_P1.pdf
P1011NXN2HFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ PBGA689
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Graphics Acceleration: No
RAM Controllers: DDR2, DDR3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 689-TEPBGA II (31x31)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 689-BBGA Exposed Pad
Packaging: Tray
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P1010NXN5HFB QP1010FS.pdf
P1010NXN5HFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 425-TEPBGA I (19x19)
Core Processor: PowerPC e500v2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 425-FBGA
Packaging: Tray
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MF4SAM3X84/9BA6AAJ
Виробник: NXP USA Inc.
Description: MIFARE SAM AV3
Supplier Device Package: PCM1.1
Standards: ISO 7816, Mifare
Voltage - Supply: 1.62V ~ 1.98V, 2.7V ~ 3.3V, 4.5V ~ 5.5V
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Interface: I2C, UART
Mounting Type: Surface Mount
Package / Case: Module
Packaging: Bulk
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MCIMX507CVM1B IMX50CEC.pdf
MCIMX507CVM1B
Виробник: NXP USA Inc.
Description: IC MPU I.MX50 800MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, LPDDR2, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: LCD
Security Features: Boot Security, Cryptography, Secure JTAG
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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BTA202X-600D,127 BTA202X-600D_127.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 2A TO220-3
Voltage - Off State: 600 V
Current - On State (It (RMS)) (Max): 2 A
Supplier Device Package: TO-220F
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Current - Non Rep. Surge 50, 60Hz (Itsm): 14A, 15.4A
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Hold (Ih) (Max): 5 mA
Operating Temperature: 125°C (TJ)
Configuration: Single
Triac Type: Logic - Sensitive Gate
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Bulk
на замовлення 4057 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
943+23.35 грн
Мінімальне замовлення: 943
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S912XEG256BVAL
S912XEG256BVAL
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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NXH2004UK/A2Z
Виробник: NXP USA Inc.
Description: NXH2004UK/A2Z
Packaging: Bulk
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S912ZVC19F1WLFR
S912ZVC19F1WLFR
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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S912ZVC19F1WLF
S912ZVC19F1WLF
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S912ZVCA19F1WLF
S912ZVCA19F1WLF
Виробник: NXP USA Inc.
Description: S12Z, 48LQFP, 192K FLASH
Number of I/O: 28
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x12b SAR; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 12K x 8
Program Memory Size: 192KB (192K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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KIT-UCANS32K1SCT getting-started-with-the-ucans32k1sct-evaluation-board:GS-UCANS32K1SCT
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TJA1153A
Embedded: Yes, MCU, 32-Bit
Utilized IC / Part: TJA1153A
Contents: Board(s), Cable(s)
Type: Interface
Function: CAN Transceiver
Packaging: Bulk
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74AUP2G3407GMH PHGLS28868-1.pdf?t.download=true&u=5oefqw
74AUP2G3407GMH
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 6-XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA; 4mA, 4mA
Supplier Device Package: 6-XSON (1.45x1)
на замовлення 90000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
678+29.59 грн
Мінімальне замовлення: 678
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S9S12G64ACLHR S12G%20Family%20Fact%20Sheet.pdf
S9S12G64ACLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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S9S12G48AMLHR S12G%20Family%20Fact%20Sheet.pdf
S9S12G48AMLHR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
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S9S12G64ACLH
S9S12G64ACLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Supplier Device Package: 64-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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S9S12G48AMLH
S9S12G48AMLH
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: 12V1
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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NCF29AGVHNF/0500ZY
Виробник: NXP USA Inc.
Description: NCF29AGVHNF/0500ZY
Packaging: Tape & Reel (TR)
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NCF29AGXHN4/0500ZY
Виробник: NXP USA Inc.
Description: NCF29AGXHN4/0500ZY
Packaging: Tape & Reel (TR)
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S9S12GN16J0MLFR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12GN16J0MLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
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S9S12G64J1VLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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S9S12G64J1MLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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