| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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EPC2067 | EPC |
Description: TRANS GAN .0015OHM 40V 14LGAPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 69A (Ta) Rds On (Max) @ Id, Vgs: 1.55mOhm @ 37A, 5V Vgs(th) (Max) @ Id: 2.5V @ 18mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 40 V Gate Charge (Qg) (Max) @ Vgs: 22.3 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 3267 pF @ 20 V |
на замовлення 1481 шт: термін постачання 21-31 дні (днів) |
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EPC2069 | EPC |
Description: GAN FET 40V .002OHM 8BUMP DIEDrain to Source Voltage (Vdss): 40 V Vgs (Max): +6V, -4V Part Status: Not For New Designs FET Type: N-Channel Technology: GaNFET (Gallium Nitride) Packaging: Cut Tape (CT) |
на замовлення 8111 шт: термін постачання 21-31 дні (днів) |
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EPC2069 | EPC |
GaN FETs EPC eGaN FET,40 V, 2.25 milliohm at 5 V, LGA 3.25 x 3.25 |
на замовлення 1000 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2069 | EPC |
Description: GAN FET 40V .002OHM 8BUMP DIEFET Type: N-Channel Technology: GaNFET (Gallium Nitride) Packaging: Tape & Reel (TR) Drain to Source Voltage (Vdss): 40 V Vgs (Max): +6V, -4V Part Status: Not For New Designs |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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EPC2070 | EPC |
Description: TRANS GAN DIE 100V .022OHMPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta) Rds On (Max) @ Id, Vgs: 23mOhm @ 3A, 5V Vgs(th) (Max) @ Id: 2.5V @ 1.5mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 2.5 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 50 V |
на замовлення 1817 шт: термін постачання 21-31 дні (днів) |
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EPC2070 | EPC |
GaN FETs EPC eGaN FET,100 V, 23 milliohm at 5 V, BGA 1.3 x 0.85 |
на замовлення 14253 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2070 | EPC |
Description: TRANS GAN DIE 100V .022OHMPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta) Rds On (Max) @ Id, Vgs: 23mOhm @ 3A, 5V Vgs(th) (Max) @ Id: 2.5V @ 1.5mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 2.5 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 50 V |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||
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EPC2071 | EPC |
GaN FETs EPC eGaN FET,100 V, 2.2 milliohm at 5 V, LGA 4.45 x 2.3 |
на замовлення 460 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2071 | EPC |
Description: TRANS GAN 100V .0022OHM 21BMPDPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 64A (Ta) Rds On (Max) @ Id, Vgs: 2.2mOhm @ 30A, 5V Vgs(th) (Max) @ Id: 2.5V @ 13mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 3931 pF @ 50 V Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5 Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 50 |
на замовлення 13000 шт: термін постачання 21-31 дні (днів) |
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EPC2071 | EPC |
Description: TRANS GAN 100V .0022OHM 21BMPDPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 64A (Ta) Rds On (Max) @ Id, Vgs: 2.2mOhm @ 30A, 5V Vgs(th) (Max) @ Id: 2.5V @ 13mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 3931 pF @ 50 V Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5 Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 50 |
на замовлення 14259 шт: термін постачання 21-31 дні (днів) |
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EPC2088 | EPC |
Description: TRANS GAN 100V .0032OHM BMP DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 60A (Ta) Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 17.8 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 2703 pF @ 50 V |
на замовлення 33000 шт: термін постачання 21-31 дні (днів) |
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EPC2088 | EPC |
GaN FETs EPC eGaN FET,100 V, 3.2 milliohm at 5 V, LGA 3.5 x 2.0 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2088 | EPC |
Description: TRANS GAN 100V .0032OHM BMP DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 60A (Ta) Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 5V Vgs (Max): +6V, -4V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 17.8 nC @ 5 V Input Capacitance (Ciss) (Max) @ Vds: 2703 pF @ 50 V |
на замовлення 34776 шт: термін постачання 21-31 дні (днів) |
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EPC2090 | EPC |
GaN FETs 100 V eGaN FET, 5.2 mohm Rdson, 2.3 mm x 1.45 mm, Cu pillar CSP |
на замовлення 2139 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2091 | EPC |
GaN FETs 100 V eGaN FET, 2 mohm Rdson, 3.23 mm x 2.88 mm, Cu pillar CSP |
на замовлення 900 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2092 | EPC | GaN FETs 100 V eGaN FET, 3.2 mohm Rdson, 3.725 mm x 1.45 mm, Cu pillar CSP |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||
| EPC2100 | EPC |
|
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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EPC2100 | EPC |
Description: MOSFET 2N-CH 30V 10A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
на замовлення 220 шт: термін постачання 21-31 дні (днів) |
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EPC2100 | EPC |
Description: MOSFET 2N-CH 30V 10A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2100ENG | EPC |
Description: TRANS GAN 2N-CH 30V BUMPED DIE |
на замовлення 270 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | ||||||||||
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EPC2100ENGRT | EPC |
Description: MOSFET 2N-CH 30V 10A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||
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EPC2101 | EPC |
Description: MOSFET 2N-CH 60V 9.5A/38A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA Supplier Device Package: Die Part Status: Active |
на замовлення 521 шт: термін постачання 21-31 дні (днів) |
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EPC2101 | EPC |
Description: MOSFET 2N-CH 60V 9.5A/38A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA Supplier Device Package: Die Part Status: Active |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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EPC2101ENG | EPC |
Description: TRANS GAN 2N-CH 60V BUMPED DIE |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | ||||||||||
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EPC2101ENGRT | EPC |
Description: MOSFET 2N-CH 60V 9.5A/38A DIESupplier Device Package: Die Vgs(th) (Max) @ Id: 2.5V @ 2mA Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Drain to Source Voltage (Vdss): 60V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 2 N-Channel (Half Bridge) Mounting Type: Surface Mount Package / Case: Die Packaging: Tape & Reel (TR) Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2102 | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||
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EPC2102 | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active |
на замовлення 271 шт: термін постачання 21-31 дні (днів) |
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EPC2102 | EPC |
GaN FETs EPC eGaN Symetrical Half Bridge,60 V, 4.9 milliohm at 5 V, BGA 6.05 x 2.3 |
на замовлення 500 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2102ENG | EPC |
Description: TRANS GAN 2N-CH 60V BUMPED DIE |
товару немає в наявності |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | ||||||||||
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EPC2102ENGRT | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A (Tj) Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2103 | EPC |
Description: MOSFET 2N-CH 80V 28A DIE |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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EPC2103 | EPC |
Description: MOSFET 2N-CH 80V 28A DIE |
на замовлення 2129 шт: термін постачання 21-31 дні (днів) |
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EPC2103 | EPC |
GaN FETs EPC eGaN Symetrical Half Bridge80 V, 5.5 milliohm at 5 V, BGA 6.05 x 2.3 |
на замовлення 734 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2103ENG | EPC |
Description: GAN TRANS 2N-CH 80V BUMPED DIE |
товару немає в наявності |
Мінімальне замовлення: 100 шт В кошику од. на суму грн. | ||||||||||
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EPC2103ENGRT | EPC |
Description: GANFET 2N-CH 80V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2103ENGRT | EPC |
Description: GANFET 2N-CH 80V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2104 | EPC |
Description: MOSFET 2N-CH 100V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 5.5mA Supplier Device Package: Die Part Status: Active |
на замовлення 2250 шт: термін постачання 21-31 дні (днів) |
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EPC2104 | EPC |
Description: MOSFET 2N-CH 100V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 5.5mA Supplier Device Package: Die Part Status: Active |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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EPC2104ENG | EPC |
Description: TRANS GAN 2N-CH 100V BUMPED DIE |
товару немає в наявності |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | ||||||||||
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EPC2104ENGRT | EPC |
Description: GANFET 2NCH 100V 23A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2104ENGRT | EPC |
Description: GANFET 2NCH 100V 23A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2105 | EPC |
Description: MOSFET 2N-CH 80V 9.5A/38A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA Supplier Device Package: Die Part Status: Active |
на замовлення 1364 шт: термін постачання 21-31 дні (днів) |
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EPC2105 | EPC |
Description: MOSFET 2N-CH 80V 9.5A/38A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA Supplier Device Package: Die Part Status: Active |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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EPC2105ENG | EPC |
Description: TRANS GAN 2N-CH 80V BUMPED DIE |
товару немає в наявності |
Мінімальне замовлення: 10 шт В кошику од. на суму грн. | ||||||||||
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EPC2105ENGRT | EPC |
Description: GANFET 2NCH 80V 9.5A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2105ENGRT | EPC |
Description: GANFET 2NCH 80V 9.5A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2106 | EPC |
GaN FETs EPC eGaN Dual FET,100 V, 70 milliohm at 5 V, BGA 1.35 x 1.35 |
на замовлення 2048 шт: термін постачання 21-30 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2106 | EPC |
Description: MOSFET 2N-CH 100V 1.7A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 600µA Supplier Device Package: Die Part Status: Active |
на замовлення 37500 шт: термін постачання 21-31 дні (днів) |
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EPC2106 | EPC |
Description: MOSFET 2N-CH 100V 1.7A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 600µA Supplier Device Package: Die Part Status: Active |
на замовлення 38519 шт: термін постачання 21-31 дні (днів) |
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EPC2106ENGRT | EPC |
Description: GANFET 2N-CH 100V 1.7A DIESupplier Device Package: Die Vgs(th) (Max) @ Id: 2.5V @ 600µA Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Current - Continuous Drain (Id) @ 25°C: 1.7A Drain to Source Voltage (Vdss): 100V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 2 N-Channel (Half Bridge) Mounting Type: Surface Mount Package / Case: Die Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2106ENGRT | EPC |
Description: GANFET 2N-CH 100V 1.7A DIESupplier Device Package: Die Vgs(th) (Max) @ Id: 2.5V @ 600µA Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Current - Continuous Drain (Id) @ 25°C: 1.7A Drain to Source Voltage (Vdss): 100V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 2 N-Channel (Half Bridge) Mounting Type: Surface Mount Package / Case: Die Packaging: Cut Tape (CT) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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EPC2107 | EPC |
Description: MOSFET 3N-CH 100V 9BGAPart Status: Active Supplier Device Package: 9-BGA (1.35x1.35) Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Drain to Source Voltage (Vdss): 100V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Mounting Type: Surface Mount Package / Case: 9-VFBGA Packaging: Tape & Reel (TR) |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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EPC2107 | EPC |
Description: MOSFET 3N-CH 100V 9BGAPart Status: Active Supplier Device Package: 9-BGA (1.35x1.35) Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Drain to Source Voltage (Vdss): 100V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Mounting Type: Surface Mount Package / Case: 9-VFBGA Packaging: Cut Tape (CT) |
на замовлення 4858 шт: термін постачання 21-31 дні (днів) |
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EPC2107ENGRT | EPC |
Description: TRANS GAN 3N-CH 100V BUMPED DIE |
на замовлення 4617 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2107ENGRT | EPC |
Description: TRANS GAN 3N-CH 100V BUMPED DIE |
на замовлення 4617 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2107ENGRT | EPC |
Description: TRANS GAN 3N-CH 100V BUMPED DIE |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||
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EPC2108 | EPC |
Description: MOSFET 3N-CH 60V/100V 9BGAMounting Type: Surface Mount Package / Case: 9-VFBGA Packaging: Cut Tape (CT) Part Status: Obsolete Supplier Device Package: 9-BGA (1.35x1.35) Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Drain to Source Voltage (Vdss): 60V, 100V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) |
на замовлення 151 шт: термін постачання 21-31 дні (днів) |
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EPC2108 | EPC |
Description: MOSFET 3N-CH 60V/100V 9BGAPart Status: Obsolete Supplier Device Package: 9-BGA (1.35x1.35) Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Drain to Source Voltage (Vdss): 60V, 100V Technology: GaNFET (Gallium Nitride) Operating Temperature: -40°C ~ 150°C (TJ) Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Package / Case: 9-VFBGA |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||
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EPC2108ENGRT | EPC |
Description: TRANS GAN 3N-CH BUMPED DIE |
на замовлення 4840 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||
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EPC2108ENGRT | EPC |
Description: TRANS GAN 3N-CH BUMPED DIE |
на замовлення 4690 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. |
| EPC2067 |
![]() |
Виробник: EPC
Description: TRANS GAN .0015OHM 40V 14LGA
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 69A (Ta)
Rds On (Max) @ Id, Vgs: 1.55mOhm @ 37A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 18mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22.3 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3267 pF @ 20 V
Description: TRANS GAN .0015OHM 40V 14LGA
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 69A (Ta)
Rds On (Max) @ Id, Vgs: 1.55mOhm @ 37A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 18mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 22.3 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3267 pF @ 20 V
на замовлення 1481 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 423.42 грн |
| 10+ | 272.51 грн |
| 50+ | 214.45 грн |
| 100+ | 183.72 грн |
| 500+ | 167.76 грн |
| EPC2069 |
![]() |
Виробник: EPC
Description: GAN FET 40V .002OHM 8BUMP DIE
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): +6V, -4V
Part Status: Not For New Designs
FET Type: N-Channel
Technology: GaNFET (Gallium Nitride)
Packaging: Cut Tape (CT)
Description: GAN FET 40V .002OHM 8BUMP DIE
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): +6V, -4V
Part Status: Not For New Designs
FET Type: N-Channel
Technology: GaNFET (Gallium Nitride)
Packaging: Cut Tape (CT)
на замовлення 8111 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 476.55 грн |
| 10+ | 393.08 грн |
| 100+ | 327.60 грн |
| 500+ | 271.27 грн |
| EPC2069 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN FET,40 V, 2.25 milliohm at 5 V, LGA 3.25 x 3.25
GaN FETs EPC eGaN FET,40 V, 2.25 milliohm at 5 V, LGA 3.25 x 3.25
на замовлення 1000 шт:
термін постачання 21-30 дні (днів)
| EPC2069 |
![]() |
Виробник: EPC
Description: GAN FET 40V .002OHM 8BUMP DIE
FET Type: N-Channel
Technology: GaNFET (Gallium Nitride)
Packaging: Tape & Reel (TR)
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): +6V, -4V
Part Status: Not For New Designs
Description: GAN FET 40V .002OHM 8BUMP DIE
FET Type: N-Channel
Technology: GaNFET (Gallium Nitride)
Packaging: Tape & Reel (TR)
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): +6V, -4V
Part Status: Not For New Designs
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 270.16 грн |
| 2000+ | 243.77 грн |
| EPC2070 |
![]() |
Виробник: EPC
Description: TRANS GAN DIE 100V .022OHM
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 3A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 1.5mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 2.5 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 50 V
Description: TRANS GAN DIE 100V .022OHM
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 3A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 1.5mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 2.5 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 50 V
на замовлення 1817 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 127.66 грн |
| 10+ | 77.88 грн |
| 50+ | 58.46 грн |
| 100+ | 49.00 грн |
| 500+ | 38.68 грн |
| EPC2070 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN FET,100 V, 23 milliohm at 5 V, BGA 1.3 x 0.85
GaN FETs EPC eGaN FET,100 V, 23 milliohm at 5 V, BGA 1.3 x 0.85
на замовлення 14253 шт:
термін постачання 21-30 дні (днів)
| EPC2070 |
![]() |
Виробник: EPC
Description: TRANS GAN DIE 100V .022OHM
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 3A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 1.5mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 2.5 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 50 V
Description: TRANS GAN DIE 100V .022OHM
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
Rds On (Max) @ Id, Vgs: 23mOhm @ 3A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 1.5mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 2.5 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 386 pF @ 50 V
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| EPC2071 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN FET,100 V, 2.2 milliohm at 5 V, LGA 4.45 x 2.3
GaN FETs EPC eGaN FET,100 V, 2.2 milliohm at 5 V, LGA 4.45 x 2.3
на замовлення 460 шт:
термін постачання 21-30 дні (днів)
| EPC2071 |
![]() |
Виробник: EPC
Description: TRANS GAN 100V .0022OHM 21BMPD
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Ta)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 30A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 13mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3931 pF @ 50 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 50
Description: TRANS GAN 100V .0022OHM 21BMPD
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Ta)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 30A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 13mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3931 pF @ 50 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 50
на замовлення 13000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 215.98 грн |
| 2000+ | 207.47 грн |
| EPC2071 |
![]() |
Виробник: EPC
Description: TRANS GAN 100V .0022OHM 21BMPD
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Ta)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 30A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 13mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3931 pF @ 50 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 50
Description: TRANS GAN 100V .0022OHM 21BMPD
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Ta)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 30A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 13mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3931 pF @ 50 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 50
на замовлення 14259 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 551.09 грн |
| 10+ | 359.56 грн |
| 100+ | 262.57 грн |
| 500+ | 238.32 грн |
| EPC2088 |
![]() |
Виробник: EPC
Description: TRANS GAN 100V .0032OHM BMP DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 60A (Ta)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 17.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2703 pF @ 50 V
Description: TRANS GAN 100V .0032OHM BMP DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 60A (Ta)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 17.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2703 pF @ 50 V
на замовлення 33000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 138.45 грн |
| 2000+ | 125.73 грн |
| EPC2088 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN FET,100 V, 3.2 milliohm at 5 V, LGA 3.5 x 2.0
GaN FETs EPC eGaN FET,100 V, 3.2 milliohm at 5 V, LGA 3.5 x 2.0
товару немає в наявності
В кошику
од. на суму грн.
| EPC2088 |
![]() |
Виробник: EPC
Description: TRANS GAN 100V .0032OHM BMP DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 60A (Ta)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 17.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2703 pF @ 50 V
Description: TRANS GAN 100V .0032OHM BMP DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 60A (Ta)
Rds On (Max) @ Id, Vgs: 3.2mOhm @ 25A, 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs (Max): +6V, -4V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 17.8 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2703 pF @ 50 V
на замовлення 34776 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 375.85 грн |
| 10+ | 240.90 грн |
| 100+ | 172.08 грн |
| 500+ | 144.43 грн |
| EPC2090 |
![]() |
Виробник: EPC
GaN FETs 100 V eGaN FET, 5.2 mohm Rdson, 2.3 mm x 1.45 mm, Cu pillar CSP
GaN FETs 100 V eGaN FET, 5.2 mohm Rdson, 2.3 mm x 1.45 mm, Cu pillar CSP
на замовлення 2139 шт:
термін постачання 21-30 дні (днів)
| EPC2091 |
![]() |
Виробник: EPC
GaN FETs 100 V eGaN FET, 2 mohm Rdson, 3.23 mm x 2.88 mm, Cu pillar CSP
GaN FETs 100 V eGaN FET, 2 mohm Rdson, 3.23 mm x 2.88 mm, Cu pillar CSP
на замовлення 900 шт:
термін постачання 21-30 дні (днів)
| EPC2092 |
Виробник: EPC
GaN FETs 100 V eGaN FET, 3.2 mohm Rdson, 3.725 mm x 1.45 mm, Cu pillar CSP
GaN FETs 100 V eGaN FET, 3.2 mohm Rdson, 3.725 mm x 1.45 mm, Cu pillar CSP
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| EPC2100 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
на замовлення 220 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 781.03 грн |
| 10+ | 519.83 грн |
| 100+ | 388.55 грн |
| EPC2100 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EPC2100ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 30V BUMPED DIE
Description: TRANS GAN 2N-CH 30V BUMPED DIE
на замовлення 270 шт:
термін постачання 21-31 дні (днів)
| EPC2100ENGRT |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| EPC2101 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
на замовлення 521 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 797.69 грн |
| 10+ | 530.90 грн |
| 100+ | 396.85 грн |
| EPC2101 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 500+ | 352.86 грн |
| EPC2101ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 60V BUMPED DIE
Description: TRANS GAN 2N-CH 60V BUMPED DIE
на замовлення 110 шт:
термін постачання 21-31 дні (днів)
| EPC2101ENGRT |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Supplier Device Package: Die
Vgs(th) (Max) @ Id: 2.5V @ 2mA
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Drain to Source Voltage (Vdss): 60V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Half Bridge)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Supplier Device Package: Die
Vgs(th) (Max) @ Id: 2.5V @ 2mA
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Drain to Source Voltage (Vdss): 60V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Half Bridge)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| EPC2102 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| EPC2102 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
на замовлення 271 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 825.44 грн |
| 10+ | 550.45 грн |
| 50+ | 445.89 грн |
| 100+ | 406.00 грн |
| EPC2102 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN Symetrical Half Bridge,60 V, 4.9 milliohm at 5 V, BGA 6.05 x 2.3
GaN FETs EPC eGaN Symetrical Half Bridge,60 V, 4.9 milliohm at 5 V, BGA 6.05 x 2.3
на замовлення 500 шт:
термін постачання 21-30 дні (днів)
| EPC2102ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 60V BUMPED DIE
Description: TRANS GAN 2N-CH 60V BUMPED DIE
товару немає в наявності
Мінімальне замовлення: 10 шт
В кошику
од. на суму грн.
| EPC2102ENGRT |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
товару немає в наявності
В кошику
од. на суму грн.
| EPC2103 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 28A DIE
Description: MOSFET 2N-CH 80V 28A DIE
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 500+ | 345.47 грн |
| 1500+ | 330.93 грн |
| EPC2103 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 28A DIE
Description: MOSFET 2N-CH 80V 28A DIE
на замовлення 2129 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 781.03 грн |
| 10+ | 519.83 грн |
| 50+ | 420.48 грн |
| 100+ | 380.13 грн |
| EPC2103 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN Symetrical Half Bridge80 V, 5.5 milliohm at 5 V, BGA 6.05 x 2.3
GaN FETs EPC eGaN Symetrical Half Bridge80 V, 5.5 milliohm at 5 V, BGA 6.05 x 2.3
на замовлення 734 шт:
термін постачання 21-30 дні (днів)
| EPC2103ENG |
![]() |
Виробник: EPC
Description: GAN TRANS 2N-CH 80V BUMPED DIE
Description: GAN TRANS 2N-CH 80V BUMPED DIE
товару немає в наявності
Мінімальне замовлення: 100 шт
В кошику
од. на суму грн.
| EPC2103ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
товару немає в наявності
В кошику
од. на суму грн.
| EPC2103ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
товару немає в наявності
В кошику
од. на суму грн.
| EPC2104 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
на замовлення 2250 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 808.79 грн |
| 10+ | 538.92 грн |
| 50+ | 436.56 грн |
| 100+ | 397.50 грн |
| EPC2104 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 500+ | 359.43 грн |
| EPC2104ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 100V BUMPED DIE
Description: TRANS GAN 2N-CH 100V BUMPED DIE
товару немає в наявності
Мінімальне замовлення: 10 шт
В кошику
од. на суму грн.
| EPC2104ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 100V 23A DIE
Description: GANFET 2NCH 100V 23A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2104ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 100V 23A DIE
Description: GANFET 2NCH 100V 23A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2105 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1364 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.79 грн |
| 10+ | 521.51 грн |
| 100+ | 388.88 грн |
| EPC2105 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 500+ | 365.30 грн |
| EPC2105ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 80V BUMPED DIE
Description: TRANS GAN 2N-CH 80V BUMPED DIE
товару немає в наявності
Мінімальне замовлення: 10 шт
В кошику
од. на суму грн.
| EPC2105ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 80V 9.5A DIE
Description: GANFET 2NCH 80V 9.5A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2105ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 80V 9.5A DIE
Description: GANFET 2NCH 80V 9.5A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2106 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN Dual FET,100 V, 70 milliohm at 5 V, BGA 1.35 x 1.35
GaN FETs EPC eGaN Dual FET,100 V, 70 milliohm at 5 V, BGA 1.35 x 1.35
на замовлення 2048 шт:
термін постачання 21-30 дні (днів)
| EPC2106 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
на замовлення 37500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 60.95 грн |
| 7500+ | 53.70 грн |
| EPC2106 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
на замовлення 38519 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 204.58 грн |
| 10+ | 126.98 грн |
| 50+ | 96.87 грн |
| 100+ | 81.78 грн |
| 500+ | 65.78 грн |
| EPC2106ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 100V 1.7A DIE
Supplier Device Package: Die
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Half Bridge)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
Description: GANFET 2N-CH 100V 1.7A DIE
Supplier Device Package: Die
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Half Bridge)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| EPC2106ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 100V 1.7A DIE
Supplier Device Package: Die
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Half Bridge)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Cut Tape (CT)
Description: GANFET 2N-CH 100V 1.7A DIE
Supplier Device Package: Die
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Half Bridge)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Cut Tape (CT)
товару немає в наявності
В кошику
од. на суму грн.
| EPC2107 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 100V 9BGA
Part Status: Active
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Packaging: Tape & Reel (TR)
Description: MOSFET 3N-CH 100V 9BGA
Part Status: Active
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Packaging: Tape & Reel (TR)
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 500+ | 75.77 грн |
| 1000+ | 67.35 грн |
| 1500+ | 64.49 грн |
| 2500+ | 57.51 грн |
| EPC2107 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 100V 9BGA
Part Status: Active
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Packaging: Cut Tape (CT)
Description: MOSFET 3N-CH 100V 9BGA
Part Status: Active
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Packaging: Cut Tape (CT)
на замовлення 4858 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 210.92 грн |
| 10+ | 131.26 грн |
| 100+ | 90.44 грн |
| 500+ | 68.48 грн |
| 1000+ | 63.21 грн |
| EPC2107ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH 100V BUMPED DIE
Description: TRANS GAN 3N-CH 100V BUMPED DIE
на замовлення 4617 шт:
термін постачання 21-31 дні (днів)
| EPC2107ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH 100V BUMPED DIE
Description: TRANS GAN 3N-CH 100V BUMPED DIE
на замовлення 4617 шт:
термін постачання 21-31 дні (днів)
| EPC2107ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH 100V BUMPED DIE
Description: TRANS GAN 3N-CH 100V BUMPED DIE
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)
| EPC2108 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 60V/100V 9BGA
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 60V, 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Description: MOSFET 3N-CH 60V/100V 9BGA
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Packaging: Cut Tape (CT)
Part Status: Obsolete
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 60V, 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
на замовлення 151 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 190.30 грн |
| 10+ | 117.82 грн |
| 100+ | 80.70 грн |
| EPC2108 |
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Виробник: EPC
Description: MOSFET 3N-CH 60V/100V 9BGA
Part Status: Obsolete
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 60V, 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
Description: MOSFET 3N-CH 60V/100V 9BGA
Part Status: Obsolete
Supplier Device Package: 9-BGA (1.35x1.35)
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Drain to Source Voltage (Vdss): 60V, 100V
Technology: GaNFET (Gallium Nitride)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Package / Case: 9-VFBGA
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| EPC2108ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH BUMPED DIE
Description: TRANS GAN 3N-CH BUMPED DIE
на замовлення 4840 шт:
термін постачання 21-31 дні (днів)
| EPC2108ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH BUMPED DIE
Description: TRANS GAN 3N-CH BUMPED DIE
на замовлення 4690 шт:
термін постачання 21-31 дні (днів)

























