| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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EPC2100 | EPC |
Description: MOSFET 2N-CH 30V 10A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2100 | EPC |
Description: MOSFET 2N-CH 30V 10A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
на замовлення 220 шт: термін постачання 21-31 дні (днів) |
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EPC2100ENG | EPC |
Description: TRANS GAN 2N-CH 30V BUMPED DIE |
на замовлення 270 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2100ENGRT | EPC |
Description: GANFET 2 N-CH 30V 9.5A/38A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2100ENGRT | EPC |
Description: GANFET 2 N-CH 30V 9.5A/38A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2101 | EPC |
Description: MOSFET 2N-CH 60V 9.5A/38A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA Supplier Device Package: Die Part Status: Active |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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EPC2101 | EPC |
Description: MOSFET 2N-CH 60V 9.5A/38A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA Supplier Device Package: Die Part Status: Active |
на замовлення 563 шт: термін постачання 21-31 дні (днів) |
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EPC2101ENG | EPC |
Description: TRANS GAN 2N-CH 60V BUMPED DIE |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2101ENGRT | EPC |
Description: GANFET 2N-CH 60V 9.5A/38A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2mA Supplier Device Package: Die Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2101ENGRT | EPC |
Description: GANFET 2N-CH 60V 9.5A/38A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2mA Supplier Device Package: Die Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2102 | EPC |
GaN FETs EPC eGaN Symetrical Half Bridge,60 V, 4.9 milliohm at 5 V, BGA 6.05 x 2.3 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2102 | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active |
на замовлення 1378 шт: термін постачання 21-31 дні (днів) |
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EPC2102 | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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EPC2102ENG | EPC |
Description: TRANS GAN 2N-CH 60V BUMPED DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2102ENGRT | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A (Tj) Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2102ENGRT | EPC |
Description: MOSFET 2N-CH 60V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: 23A (Tj) Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Discontinued at Digi-Key |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2103 | EPC |
Description: MOSFET 2N-CH 80V 28A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 28A Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
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EPC2103 | EPC |
Description: MOSFET 2N-CH 80V 28A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 28A Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die Part Status: Active |
на замовлення 8040 шт: термін постачання 21-31 дні (днів) |
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EPC2103ENG | EPC |
Description: GAN TRANS 2N-CH 80V BUMPED DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2103ENGRT | EPC |
Description: GANFET 2N-CH 80V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2103ENGRT | EPC |
Description: GANFET 2N-CH 80V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 7mA Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2104 | EPC |
Description: MOSFET 2N-CH 100V 23A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 5.5mA Supplier Device Package: Die Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2104 | EPC |
Description: MOSFET 2N-CH 100V 23A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 23A Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 5.5mA Supplier Device Package: Die Part Status: Active |
на замовлення 1880 шт: термін постачання 21-31 дні (днів) |
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EPC2104ENG | EPC |
Description: TRANS GAN 2N-CH 100V BUMPED DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2104ENGRT | EPC |
Description: GANFET 2NCH 100V 23A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2104ENGRT | EPC |
Description: GANFET 2NCH 100V 23A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2105 | EPC |
Description: MOSFET 2N-CH 80V 9.5A/38A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA Supplier Device Package: Die Part Status: Active |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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EPC2105 | EPC |
Description: MOSFET 2N-CH 80V 9.5A/38A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 80V Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA Supplier Device Package: Die Part Status: Active |
на замовлення 1364 шт: термін постачання 21-31 дні (днів) |
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EPC2105ENG | EPC |
Description: TRANS GAN 2N-CH 80V BUMPED DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2105ENGRT | EPC |
Description: GANFET 2NCH 80V 9.5A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2105ENGRT | EPC |
Description: GANFET 2NCH 80V 9.5A DIE |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2106 | EPC |
GaN FETs EPC eGaN Dual FET,100 V, 70 milliohm at 5 V, BGA 1.35 x 1.35 |
на замовлення 2090 шт: термін постачання 21-30 дні (днів) |
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EPC2106 | EPC |
Description: MOSFET 2N-CH 100V 1.7A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 600µA Supplier Device Package: Die Part Status: Active |
на замовлення 12500 шт: термін постачання 21-31 дні (днів) |
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EPC2106 | EPC |
Description: MOSFET 2N-CH 100V 1.7A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 600µA Supplier Device Package: Die Part Status: Active |
на замовлення 13457 шт: термін постачання 21-31 дні (днів) |
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EPC2106ENGRT | EPC |
Description: GANFET 2N-CH 100V 1.7A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 600µA Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2106ENGRT | EPC |
Description: GANFET 2N-CH 100V 1.7A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 600µA Supplier Device Package: Die |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2107 | EPC |
Description: MOSFET 3N-CH 100V 9BGAPackaging: Tape & Reel (TR) Package / Case: 9-VFBGA Mounting Type: Surface Mount Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Supplier Device Package: 9-BGA (1.35x1.35) Part Status: Active |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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EPC2107 | EPC |
Description: MOSFET 3N-CH 100V 9BGAPackaging: Cut Tape (CT) Package / Case: 9-VFBGA Mounting Type: Surface Mount Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 100V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Supplier Device Package: 9-BGA (1.35x1.35) Part Status: Active |
на замовлення 5068 шт: термін постачання 21-31 дні (днів) |
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EPC2107ENGRT | EPC |
Description: TRANS GAN 3N-CH 100V BUMPED DIE |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2107ENGRT | EPC |
Description: TRANS GAN 3N-CH 100V BUMPED DIE |
на замовлення 4617 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2107ENGRT | EPC |
Description: TRANS GAN 3N-CH 100V BUMPED DIE |
на замовлення 4617 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2108 | EPC |
Description: MOSFET 3N-CH 60V/100V 9BGAPackaging: Cut Tape (CT) Package / Case: 9-VFBGA Mounting Type: Surface Mount Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V, 100V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Supplier Device Package: 9-BGA (1.35x1.35) Part Status: Obsolete |
на замовлення 636 шт: термін постачання 21-31 дні (днів) |
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EPC2108 | EPC |
Description: MOSFET 3N-CH 60V/100V 9BGAPackaging: Tape & Reel (TR) Package / Case: 9-VFBGA Mounting Type: Surface Mount Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 60V, 100V Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA Supplier Device Package: 9-BGA (1.35x1.35) Part Status: Obsolete |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2108ENGRT | EPC |
Description: TRANS GAN 3N-CH BUMPED DIE |
на замовлення 4690 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2108ENGRT | EPC |
Description: TRANS GAN 3N-CH BUMPED DIE |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2108ENGRT | EPC |
Description: TRANS GAN 3N-CH BUMPED DIE |
на замовлення 4840 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2110 | EPC |
Description: MOSFET 2N-CH 120V 3.4A DIEPackaging: Tape & Reel (TR) Package / Case: Die Configuration: 2 N-Channel (Dual) Common Source Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 120V Current - Continuous Drain (Id) @ 25°C: 3.4A Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 700µA Supplier Device Package: Die |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
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EPC2110 | EPC |
Description: MOSFET 2N-CH 120V 3.4A DIEPackaging: Cut Tape (CT) Package / Case: Die Configuration: 2 N-Channel (Dual) Common Source Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 120V Current - Continuous Drain (Id) @ 25°C: 3.4A Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 700µA Supplier Device Package: Die |
на замовлення 12120 шт: термін постачання 21-31 дні (днів) |
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EPC2110ENGRT | EPC |
Description: GAN TRANS 2N-CH 120V BUMPED DIE |
на замовлення 10000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2110ENGRT | EPC |
Description: GAN TRANS 2N-CH 120V BUMPED DIE |
на замовлення 11681 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2111 | EPC |
Description: MOSFET 2N-CH 30V 16A DIEPackaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 16A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 15V, 595pF @ 15V Rds On (Max) @ Id, Vgs: 19mOhm @ 15A, 5V, 8mOhm @ 15A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.2nC @ 5V, 5.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2mA, 2.5V @ 5mA Supplier Device Package: Die Part Status: Active |
на замовлення 15523 шт: термін постачання 21-31 дні (днів) |
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EPC2111 | EPC |
Description: MOSFET 2N-CH 30V 16A DIEPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Configuration: 2 N-Channel (Half Bridge) Operating Temperature: -40°C ~ 150°C (TJ) Technology: GaNFET (Gallium Nitride) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 16A (Ta) Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 15V, 595pF @ 15V Rds On (Max) @ Id, Vgs: 19mOhm @ 15A, 5V, 8mOhm @ 15A, 5V Gate Charge (Qg) (Max) @ Vgs: 2.2nC @ 5V, 5.8nC @ 5V Vgs(th) (Max) @ Id: 2.5V @ 2mA, 2.5V @ 5mA Supplier Device Package: Die Part Status: Active |
на замовлення 15000 шт: термін постачання 21-31 дні (днів) |
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EPC2111ENGRT | EPC |
Description: GAN TRANS ASYMMETRICAL HALF BRID |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2111ENGRT | EPC |
Description: GAN TRANS ASYMMETRICAL HALF BRID |
на замовлення 6776 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||||||||||
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EPC2112ENGRT | EPC |
Description: IC LOW SIDE DRIVER 10A 10BGA Packaging: Tape & Reel (TR) Package / Case: 10-VFBGA Mounting Type: Surface Mount Interface: On/Off Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Voltage - Supply: 4.5V ~ 5.5V Rds On (Typ): 32mOhm Applications: DC-DC Converters Current - Output / Channel: 10A Current - Peak Output: 40A Technology: Gallium Nitride (GaN) FETs Voltage - Load: 160V (Max) Supplier Device Package: 10-BGA (2.9x1.1) Load Type: Inductive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2115ENGRT | EPC |
Description: IC LOW SIDE DRIVER 5A 10BGAPackaging: Cut Tape (CT) Package / Case: 10-VFBGA Mounting Type: Surface Mount Interface: On/Off Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Voltage - Supply: 4.5V ~ 5.5V Rds On (Typ): 70mOhm Applications: DC-DC Converters Current - Output / Channel: 5A Current - Peak Output: 18A Technology: Gallium Nitride (GaN) FETs Voltage - Load: 120V (Max) Supplier Device Package: 10-BGA (2.9x1.1) Load Type: Inductive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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EPC2115ENGRT | EPC |
Description: IC LOW SIDE DRIVER 5A 10BGAPackaging: Tape & Reel (TR) Package / Case: 10-VFBGA Mounting Type: Surface Mount Interface: On/Off Operating Temperature: -40°C ~ 150°C (TJ) Output Configuration: Low Side Voltage - Supply: 4.5V ~ 5.5V Rds On (Typ): 70mOhm Applications: DC-DC Converters Current - Output / Channel: 5A Current - Peak Output: 18A Technology: Gallium Nitride (GaN) FETs Voltage - Load: 120V (Max) Supplier Device Package: 10-BGA (2.9x1.1) Load Type: Inductive |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| EPC2121 | EPC |
Description: IC BIDIRECT SW 100V .045OHM 4BGAPackaging: Tape & Reel (TR) |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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| EPC2121 | EPC |
Description: IC BIDIRECT SW 100V .045OHM 4BGAPackaging: Cut Tape (CT) |
на замовлення 4806 шт: термін постачання 21-31 дні (днів) |
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EPC2152 | EPC |
Description: IC HALF BRIDGE DRVR 12.5A 12LGAFeatures: Bootstrap Circuit Packaging: Cut Tape (CT) Package / Case: Die Mounting Type: Surface Mount Interface: PWM Operating Temperature: -40°C ~ 125°C (TJ) Output Configuration: Half Bridge Voltage - Supply: 11V ~ 13V Rds On (Typ): 10mOhm LS + HS Applications: DC Motors, DC-DC Converters Current - Output / Channel: 15A Voltage - Load: 0V ~ 60V Supplier Device Package: Die Fault Protection: Over Voltage, UVLO Load Type: Inductive, Capacitive |
на замовлення 8349 шт: термін постачання 21-31 дні (днів) |
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| EPC2100 |
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Виробник: EPC
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EPC2100 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 10A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
на замовлення 220 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 721.17 грн |
| 10+ | 479.67 грн |
| 100+ | 358.53 грн |
| EPC2100ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 30V BUMPED DIE
Description: TRANS GAN 2N-CH 30V BUMPED DIE
на замовлення 270 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2100ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2 N-CH 30V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: GANFET 2 N-CH 30V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EPC2100ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2 N-CH 30V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
Description: GANFET 2 N-CH 30V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 10A (Ta), 40A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 475pF @ 15V, 1960pF @ 15V
Rds On (Max) @ Id, Vgs: 8.2mOhm @ 25A, 5V, 2.1mOhm @ 25A, 5V
Gate Charge (Qg) (Max) @ Vgs: 4.9nC @ 15V, 19nC @ 15V
Vgs(th) (Max) @ Id: 2.5V @ 4mA, 2.5V @ 16mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EPC2101 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 500+ | 334.38 грн |
| EPC2101 |
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Виробник: EPC
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V, 1200pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V, 2.7mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V, 12nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 3mA, 2.5V @ 12mA
Supplier Device Package: Die
Part Status: Active
на замовлення 563 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 711.05 грн |
| 10+ | 472.70 грн |
| 100+ | 394.12 грн |
| EPC2101ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 60V BUMPED DIE
Description: TRANS GAN 2N-CH 60V BUMPED DIE
на замовлення 110 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2101ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 60V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
Description: GANFET 2N-CH 60V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
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В кошику
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| EPC2101ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 60V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
Description: GANFET 2N-CH 60V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
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В кошику
од. на суму грн.
| EPC2102 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN Symetrical Half Bridge,60 V, 4.9 milliohm at 5 V, BGA 6.05 x 2.3
GaN FETs EPC eGaN Symetrical Half Bridge,60 V, 4.9 milliohm at 5 V, BGA 6.05 x 2.3
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| EPC2102 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1378 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 683.79 грн |
| 10+ | 453.80 грн |
| 100+ | 374.66 грн |
| EPC2102 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 500+ | 317.87 грн |
| EPC2102ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 60V BUMPED DIE
Description: TRANS GAN 2N-CH 60V BUMPED DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2102ENGRT |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
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| EPC2102ENGRT |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
Description: MOSFET 2N-CH 60V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 23A (Tj)
Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Discontinued at Digi-Key
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В кошику
од. на суму грн.
| EPC2103 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 28A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 28A
Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 80V 28A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 28A
Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 500+ | 336.86 грн |
| 1000+ | 322.68 грн |
| EPC2103 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 28A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 28A
Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 80V 28A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 28A
Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Part Status: Active
на замовлення 8040 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 761.67 грн |
| 10+ | 506.82 грн |
| 100+ | 394.96 грн |
| EPC2103ENG |
![]() |
Виробник: EPC
Description: GAN TRANS 2N-CH 80V BUMPED DIE
Description: GAN TRANS 2N-CH 80V BUMPED DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2103ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
товару немає в наявності
В кошику
од. на суму грн.
| EPC2103ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
Description: GANFET 2N-CH 80V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 7mA
Supplier Device Package: Die
товару немає в наявності
В кошику
од. на суму грн.
| EPC2104 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| EPC2104 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 23A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 23A
Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1880 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 732.85 грн |
| 10+ | 486.65 грн |
| 100+ | 375.45 грн |
| EPC2104ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 100V BUMPED DIE
Description: TRANS GAN 2N-CH 100V BUMPED DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2104ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 100V 23A DIE
Description: GANFET 2NCH 100V 23A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2104ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 100V 23A DIE
Description: GANFET 2NCH 100V 23A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2105 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 500+ | 358.79 грн |
| EPC2105 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 80V 9.5A/38A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 80V
Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 40V, 1100pF @ 40V
Rds On (Max) @ Id, Vgs: 14.5mOhm @ 20A, 5V, 3.4mOhm @ 20A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.5nC @ 5V, 10nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2.5mA, 2.5V @ 10mA
Supplier Device Package: Die
Part Status: Active
на замовлення 1364 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 771.79 грн |
| 10+ | 512.22 грн |
| 100+ | 381.95 грн |
| EPC2105ENG |
![]() |
Виробник: EPC
Description: TRANS GAN 2N-CH 80V BUMPED DIE
Description: TRANS GAN 2N-CH 80V BUMPED DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2105ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 80V 9.5A DIE
Description: GANFET 2NCH 80V 9.5A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2105ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2NCH 80V 9.5A DIE
Description: GANFET 2NCH 80V 9.5A DIE
товару немає в наявності
В кошику
од. на суму грн.
| EPC2106 |
![]() |
Виробник: EPC
GaN FETs EPC eGaN Dual FET,100 V, 70 milliohm at 5 V, BGA 1.35 x 1.35
GaN FETs EPC eGaN Dual FET,100 V, 70 milliohm at 5 V, BGA 1.35 x 1.35
на замовлення 2090 шт:
термін постачання 21-30 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 184.95 грн |
| 10+ | 117.03 грн |
| 100+ | 69.92 грн |
| 500+ | 56.49 грн |
| 1000+ | 55.17 грн |
| 2500+ | 47.97 грн |
| EPC2106 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
на замовлення 12500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 56.07 грн |
| 5000+ | 50.62 грн |
| 7500+ | 49.40 грн |
| EPC2106 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 100V 1.7A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Part Status: Active
на замовлення 13457 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 187.69 грн |
| 10+ | 116.84 грн |
| 100+ | 80.16 грн |
| 500+ | 60.51 грн |
| 1000+ | 56.74 грн |
| EPC2106ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 100V 1.7A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Description: GANFET 2N-CH 100V 1.7A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
товару немає в наявності
В кошику
од. на суму грн.
| EPC2106ENGRT |
![]() |
Виробник: EPC
Description: GANFET 2N-CH 100V 1.7A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
Description: GANFET 2N-CH 100V 1.7A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A
Input Capacitance (Ciss) (Max) @ Vds: 75pF @ 50V
Rds On (Max) @ Id, Vgs: 70mOhm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.73nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 600µA
Supplier Device Package: Die
товару немає в наявності
В кошику
од. на суму грн.
| EPC2107 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 100V 9BGA
Packaging: Tape & Reel (TR)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Active
Description: MOSFET 3N-CH 100V 9BGA
Packaging: Tape & Reel (TR)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Active
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 58.20 грн |
| EPC2107 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 100V 9BGA
Packaging: Cut Tape (CT)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Active
Description: MOSFET 3N-CH 100V 9BGA
Packaging: Cut Tape (CT)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 16pF @ 50V, 7pF @ 50V
Rds On (Max) @ Id, Vgs: 320mOhm @ 2A, 5V, 3.3Ohm @ 2A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.16nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Active
на замовлення 5068 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 194.70 грн |
| 10+ | 121.19 грн |
| 100+ | 83.46 грн |
| 500+ | 64.38 грн |
| EPC2107ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH 100V BUMPED DIE
Description: TRANS GAN 3N-CH 100V BUMPED DIE
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2107ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH 100V BUMPED DIE
Description: TRANS GAN 3N-CH 100V BUMPED DIE
на замовлення 4617 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2107ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH 100V BUMPED DIE
Description: TRANS GAN 3N-CH 100V BUMPED DIE
на замовлення 4617 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2108 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 60V/100V 9BGA
Packaging: Cut Tape (CT)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V, 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Obsolete
Description: MOSFET 3N-CH 60V/100V 9BGA
Packaging: Cut Tape (CT)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V, 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Obsolete
на замовлення 636 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 172.11 грн |
| 10+ | 106.87 грн |
| 100+ | 73.17 грн |
| 500+ | 55.14 грн |
| EPC2108 |
![]() |
Виробник: EPC
Description: MOSFET 3N-CH 60V/100V 9BGA
Packaging: Tape & Reel (TR)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V, 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Obsolete
Description: MOSFET 3N-CH 60V/100V 9BGA
Packaging: Tape & Reel (TR)
Package / Case: 9-VFBGA
Mounting Type: Surface Mount
Configuration: 3 N-Channel (Half Bridge + Synchronous Bootstrap)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 60V, 100V
Current - Continuous Drain (Id) @ 25°C: 1.7A, 500mA
Input Capacitance (Ciss) (Max) @ Vds: 22pF @ 30V, 7pF @ 30V
Rds On (Max) @ Id, Vgs: 190mOhm @ 2.5A, 5V, 3.3Ohm @ 2.5A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.22nC @ 5V, 0.044nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 100µA, 2.5V @ 20µA
Supplier Device Package: 9-BGA (1.35x1.35)
Part Status: Obsolete
товару немає в наявності
В кошику
од. на суму грн.
| EPC2108ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH BUMPED DIE
Description: TRANS GAN 3N-CH BUMPED DIE
на замовлення 4690 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2108ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH BUMPED DIE
Description: TRANS GAN 3N-CH BUMPED DIE
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2108ENGRT |
![]() |
Виробник: EPC
Description: TRANS GAN 3N-CH BUMPED DIE
Description: TRANS GAN 3N-CH BUMPED DIE
на замовлення 4840 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2110 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 120V 3.4A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Configuration: 2 N-Channel (Dual) Common Source
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 120V
Current - Continuous Drain (Id) @ 25°C: 3.4A
Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V
Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 700µA
Supplier Device Package: Die
Description: MOSFET 2N-CH 120V 3.4A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Configuration: 2 N-Channel (Dual) Common Source
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 120V
Current - Continuous Drain (Id) @ 25°C: 3.4A
Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V
Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 700µA
Supplier Device Package: Die
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 71.84 грн |
| EPC2110 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 120V 3.4A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Configuration: 2 N-Channel (Dual) Common Source
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 120V
Current - Continuous Drain (Id) @ 25°C: 3.4A
Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V
Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 700µA
Supplier Device Package: Die
Description: MOSFET 2N-CH 120V 3.4A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Configuration: 2 N-Channel (Dual) Common Source
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 120V
Current - Continuous Drain (Id) @ 25°C: 3.4A
Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V
Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V
Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 700µA
Supplier Device Package: Die
на замовлення 12120 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 229.75 грн |
| 10+ | 143.92 грн |
| 100+ | 99.83 грн |
| 500+ | 76.00 грн |
| 1000+ | 70.32 грн |
| EPC2110ENGRT |
![]() |
Виробник: EPC
Description: GAN TRANS 2N-CH 120V BUMPED DIE
Description: GAN TRANS 2N-CH 120V BUMPED DIE
на замовлення 10000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2110ENGRT |
![]() |
Виробник: EPC
Description: GAN TRANS 2N-CH 120V BUMPED DIE
Description: GAN TRANS 2N-CH 120V BUMPED DIE
на замовлення 11681 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2111 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 30V 16A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 16A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 15V, 595pF @ 15V
Rds On (Max) @ Id, Vgs: 19mOhm @ 15A, 5V, 8mOhm @ 15A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.2nC @ 5V, 5.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA, 2.5V @ 5mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 16A DIE
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 16A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 15V, 595pF @ 15V
Rds On (Max) @ Id, Vgs: 19mOhm @ 15A, 5V, 8mOhm @ 15A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.2nC @ 5V, 5.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA, 2.5V @ 5mA
Supplier Device Package: Die
Part Status: Active
на замовлення 15523 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 310.74 грн |
| 10+ | 197.54 грн |
| 100+ | 139.57 грн |
| 500+ | 107.75 грн |
| 1000+ | 100.29 грн |
| EPC2111 |
![]() |
Виробник: EPC
Description: MOSFET 2N-CH 30V 16A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 16A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 15V, 595pF @ 15V
Rds On (Max) @ Id, Vgs: 19mOhm @ 15A, 5V, 8mOhm @ 15A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.2nC @ 5V, 5.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA, 2.5V @ 5mA
Supplier Device Package: Die
Part Status: Active
Description: MOSFET 2N-CH 30V 16A DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 16A (Ta)
Input Capacitance (Ciss) (Max) @ Vds: 230pF @ 15V, 595pF @ 15V
Rds On (Max) @ Id, Vgs: 19mOhm @ 15A, 5V, 8mOhm @ 15A, 5V
Gate Charge (Qg) (Max) @ Vgs: 2.2nC @ 5V, 5.8nC @ 5V
Vgs(th) (Max) @ Id: 2.5V @ 2mA, 2.5V @ 5mA
Supplier Device Package: Die
Part Status: Active
на замовлення 15000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 101.37 грн |
| EPC2111ENGRT |
![]() |
Виробник: EPC
Description: GAN TRANS ASYMMETRICAL HALF BRID
Description: GAN TRANS ASYMMETRICAL HALF BRID
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2111ENGRT |
![]() |
Виробник: EPC
Description: GAN TRANS ASYMMETRICAL HALF BRID
Description: GAN TRANS ASYMMETRICAL HALF BRID
на замовлення 6776 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
| EPC2112ENGRT |
Виробник: EPC
Description: IC LOW SIDE DRIVER 10A 10BGA
Packaging: Tape & Reel (TR)
Package / Case: 10-VFBGA
Mounting Type: Surface Mount
Interface: On/Off
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Voltage - Supply: 4.5V ~ 5.5V
Rds On (Typ): 32mOhm
Applications: DC-DC Converters
Current - Output / Channel: 10A
Current - Peak Output: 40A
Technology: Gallium Nitride (GaN) FETs
Voltage - Load: 160V (Max)
Supplier Device Package: 10-BGA (2.9x1.1)
Load Type: Inductive
Description: IC LOW SIDE DRIVER 10A 10BGA
Packaging: Tape & Reel (TR)
Package / Case: 10-VFBGA
Mounting Type: Surface Mount
Interface: On/Off
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Voltage - Supply: 4.5V ~ 5.5V
Rds On (Typ): 32mOhm
Applications: DC-DC Converters
Current - Output / Channel: 10A
Current - Peak Output: 40A
Technology: Gallium Nitride (GaN) FETs
Voltage - Load: 160V (Max)
Supplier Device Package: 10-BGA (2.9x1.1)
Load Type: Inductive
товару немає в наявності
В кошику
од. на суму грн.
| EPC2115ENGRT |
![]() |
Виробник: EPC
Description: IC LOW SIDE DRIVER 5A 10BGA
Packaging: Cut Tape (CT)
Package / Case: 10-VFBGA
Mounting Type: Surface Mount
Interface: On/Off
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Voltage - Supply: 4.5V ~ 5.5V
Rds On (Typ): 70mOhm
Applications: DC-DC Converters
Current - Output / Channel: 5A
Current - Peak Output: 18A
Technology: Gallium Nitride (GaN) FETs
Voltage - Load: 120V (Max)
Supplier Device Package: 10-BGA (2.9x1.1)
Load Type: Inductive
Description: IC LOW SIDE DRIVER 5A 10BGA
Packaging: Cut Tape (CT)
Package / Case: 10-VFBGA
Mounting Type: Surface Mount
Interface: On/Off
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Voltage - Supply: 4.5V ~ 5.5V
Rds On (Typ): 70mOhm
Applications: DC-DC Converters
Current - Output / Channel: 5A
Current - Peak Output: 18A
Technology: Gallium Nitride (GaN) FETs
Voltage - Load: 120V (Max)
Supplier Device Package: 10-BGA (2.9x1.1)
Load Type: Inductive
товару немає в наявності
В кошику
од. на суму грн.
| EPC2115ENGRT |
![]() |
Виробник: EPC
Description: IC LOW SIDE DRIVER 5A 10BGA
Packaging: Tape & Reel (TR)
Package / Case: 10-VFBGA
Mounting Type: Surface Mount
Interface: On/Off
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Voltage - Supply: 4.5V ~ 5.5V
Rds On (Typ): 70mOhm
Applications: DC-DC Converters
Current - Output / Channel: 5A
Current - Peak Output: 18A
Technology: Gallium Nitride (GaN) FETs
Voltage - Load: 120V (Max)
Supplier Device Package: 10-BGA (2.9x1.1)
Load Type: Inductive
Description: IC LOW SIDE DRIVER 5A 10BGA
Packaging: Tape & Reel (TR)
Package / Case: 10-VFBGA
Mounting Type: Surface Mount
Interface: On/Off
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Voltage - Supply: 4.5V ~ 5.5V
Rds On (Typ): 70mOhm
Applications: DC-DC Converters
Current - Output / Channel: 5A
Current - Peak Output: 18A
Technology: Gallium Nitride (GaN) FETs
Voltage - Load: 120V (Max)
Supplier Device Package: 10-BGA (2.9x1.1)
Load Type: Inductive
товару немає в наявності
В кошику
од. на суму грн.
| EPC2121 |
![]() |
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 40.46 грн |
| EPC2121 |
![]() |
на замовлення 4806 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 142.52 грн |
| 10+ | 87.59 грн |
| 25+ | 74.55 грн |
| 100+ | 56.16 грн |
| 250+ | 49.44 грн |
| 500+ | 45.32 грн |
| 1000+ | 41.21 грн |
| EPC2152 |
![]() |
Виробник: EPC
Description: IC HALF BRIDGE DRVR 12.5A 12LGA
Features: Bootstrap Circuit
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 11V ~ 13V
Rds On (Typ): 10mOhm LS + HS
Applications: DC Motors, DC-DC Converters
Current - Output / Channel: 15A
Voltage - Load: 0V ~ 60V
Supplier Device Package: Die
Fault Protection: Over Voltage, UVLO
Load Type: Inductive, Capacitive
Description: IC HALF BRIDGE DRVR 12.5A 12LGA
Features: Bootstrap Circuit
Packaging: Cut Tape (CT)
Package / Case: Die
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 11V ~ 13V
Rds On (Typ): 10mOhm LS + HS
Applications: DC Motors, DC-DC Converters
Current - Output / Channel: 15A
Voltage - Load: 0V ~ 60V
Supplier Device Package: Die
Fault Protection: Over Voltage, UVLO
Load Type: Inductive, Capacitive
на замовлення 8349 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 605.91 грн |
| 10+ | 453.20 грн |
| 25+ | 420.67 грн |
| 100+ | 361.26 грн |
| 250+ | 354.18 грн |

















