Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36377) > Сторінка 543 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| S912ZVCA19A1WKHR | NXP USA Inc. |
Description: S12Z, 64LQFP-EP, 192K FLASH Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S912ZVCA19A1WKH | NXP USA Inc. |
Description: S12Z, 64LQFP-EP, 192K FLASH Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF775CHN/N208W/MP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF775CHN/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MPC8260ACZUMHBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGAAdditional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMX9121DVVXCAA | NXP USA Inc. |
Description: MIMX9121DVVXCAAPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MIMX9121CVVXCAA | NXP USA Inc. |
Description: MIMX9121CVVXCAAPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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T1024NSN7KQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 780FBGAPackaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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BYV25D-600,118 | NXP USA Inc. |
Description: DIODE RECT 600V 5A DPAKPackaging: Bulk |
на замовлення 76500 шт: термін постачання 21-31 дні (днів) |
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MKE14Z64VLF4R | NXP USA Inc. |
Description: MT64P 48LQFPDigiKey Programmable: Not Verified Number of I/O: 42 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 12x12b SAR Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Cut Tape (CT) |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MKE14F512VLL16R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MKE14F512VLL16R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Cut Tape (CT) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 1010 шт: термін постачання 21-31 дні (днів) |
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| TJA1104AHN/0J | NXP USA Inc. |
Description: TJA1104AHN/0J Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S9S08SG16E1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOPPackaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
на замовлення 35000 шт: термін постачання 21-31 дні (днів) |
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| AFM912NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 16DFNPackaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 136MHz ~ 941MHz Gain: 13.3dB Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Voltage - Rated: 30 V |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC9RS08LA8CLF | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08AC8CFJE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 22 DigiKey Programmable: Not Verified |
на замовлення 1050 шт: термін постачання 21-31 дні (днів) |
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PEMI4QFN/LK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/13.5PF SMDNumber of Channels: 4 ESD Protection: Yes Resistance - Channel (Ohms): 65 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 15dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 65Ohms, C = 13.5pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 64000 шт: термін постачання 21-31 дні (днів) |
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| MFS2611AMBA0ADR2 | NXP USA Inc. |
Description: AUTO SBCPackaging: Tape & Reel (TR) Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MFS2632AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MFS2611AMBA0AD | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MFS2632AMDA0AD | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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CBT3245ADS,118 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOPSupplier Device Package: 20-SSOP Voltage Supply Source: Single Supply Independent Circuits: 1 Voltage - Supply: 4V ~ 5.5V Operating Temperature: -40°C ~ 85°C Type: Bus Switch Circuit: 8 x 1:1 Mounting Type: Surface Mount Package / Case: 20-SSOP (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P1010NSE5DFA | NXP USA Inc. |
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGAPackaging: Tray Package / Case: 425-FBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500v2 Supplier Device Package: 425-TEPBGA I (19x19) Ethernet: 10/100/1000Mbps (3) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC 4.4 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox SATA: SATA 3Gbps (2) Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74AUP2G157GD,125 | NXP USA Inc. |
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1Supplier Device Package: 8-XSON (2x3) Voltage Supply Source: Single Supply Current - Output High, Low: 4mA, 4mA Independent Circuits: 1 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: Multiplexer Circuit: 1 x 2:1 Mounting Type: Surface Mount Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 93975 шт: термін постачання 21-31 дні (днів) |
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MK50DX256CLK10 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 30x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 560 шт: термін постачання 21-31 дні (днів) |
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| MKE02Z64VFM4R | NXP USA Inc. |
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 40MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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74LV373PW,112 | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOPPackaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 16mA, 16mA Delay Time - Propagation: 20ns Supplier Device Package: 20-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MFS2303BMBA3EPR2 | NXP USA Inc. |
Description: MFS2303BMBA3EPR2Supplier Device Package: 48-HVQFN (7x7) Current - Supply: 40µA Applications: System Basis Chip Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MFS2620AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MFS2611AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MPF7100BMBA0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX 8, I.MQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HVQFN (7x7) Current - Supply: 10µA Applications: i.MX Processors Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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C9KEAZN16AMLCR | NXP USA Inc. |
Description: C9KEAZN16AMLCR Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 57 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC8360VVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGACo-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Graphics Acceleration: No RAM Controllers: DDR, DDR2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPX2202ASX | NXP USA Inc. |
Description: SENSOR 29.01PSIA 0.19" .04VFeatures: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPX2202A | NXP USA Inc. |
Description: SENSOR 29.01PSIA .04VFeatures: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Applications: Board Mount Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PDTA114TE,115 | NXP USA Inc. |
Description: TRANS PREBIASPackaging: Bulk |
на замовлення 84000 шт: термін постачання 21-31 дні (днів) |
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| LFTAK46MQL3A | NXP USA Inc. |
Description: 208 1.0MM PGA TO 144 PIN 0.5MM E Packaging: Bulk For Use With/Related Products: MPC5746M Module/Board Type: Socket Adapter |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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74LVT574PW,112 | NXP USA Inc. |
Description: IC FF D-TYPE SNGL 8BIT 20TSSOPNumber of Bits per Element: 8 Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF Supplier Device Package: 20-TSSOP Input Capacitance: 4 pF Clock Frequency: 150 MHz Trigger Type: Positive Edge Current - Output High, Low: 32mA, 64mA Current - Quiescent (Iq): 190 µA Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Type: D-Type Function: Standard Number of Elements: 1 Mounting Type: Surface Mount Output Type: Tri-State, Non-Inverted Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tube |
на замовлення 4363 шт: термін постачання 21-31 дні (днів) |
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SPC5604CAMLL6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 48K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5604CAMLL6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 79 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 28x10b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 48K x 8 Program Memory Size: 512KB (512K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| S9S12GN48J0MLHR | NXP USA Inc. |
Description: S12 CORE,48K FLASH Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S9S12GN48J0MLH | NXP USA Inc. |
Description: S12 CORE,48K FLASH Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S9S12G64J0CLHR | NXP USA Inc. |
Description: S12 CORE,64K FLASH Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| S9S12G64J0CLH | NXP USA Inc. |
Description: S12 CORE,64K FLASH Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S9S12G48J0MLH | NXP USA Inc. |
Description: IC MCU 16BIT 48KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 48KB (48K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1.5K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| S9S12G64J0MLH | NXP USA Inc. |
Description: S12 CORE,64K FLASH Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S12 Data Converters: A/D 12x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
UJA1132AHW/5F4/0Y | NXP USA Inc. |
Description: UJA1132AHW/5F4/0YPackaging: Bulk |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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| MCIMX93AUTO-EVK | NXP USA Inc. |
Description: ICPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
PCF7961MTT/D1AC13J | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 20TSSOPMounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Supplier Device Package: 20-TSSOP |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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PCF7961MTT/D1AC13J | NXP USA Inc. |
Description: IC REMOTE KEYLESS ENTRY 20TSSOPDigiKey Programmable: Not Verified Supplier Device Package: 20-TSSOP Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
на замовлення 4999 шт: термін постачання 21-31 дні (днів) |
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BFU910FX | NXP USA Inc. |
Description: RF TRANS NPN 9.5V SOT343FPackaging: Bulk Package / Case: SOT-343F Mounting Type: Surface Mount Transistor Type: NPN Operating Temperature: -40°C ~ 150°C (TJ) Gain: 13.5dB Power - Max: 300mW Current - Collector (Ic) (Max): 15mA Voltage - Collector Emitter Breakdown (Max): 9.5V Supplier Device Package: 4-DFP |
на замовлення 882540 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G3CVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 272MAPBGAPackaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| PCA9420KUKZ | NXP USA Inc. |
Description: PCA9420KUKZPackaging: Bulk Package / Case: 25-UFBGA, WLCSP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 3.3V ~ 5.5V Applications: Microcontroller, MCU Current - Supply: 4.5µA Supplier Device Package: 25-WLCSP (2.09x2.09) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
MC13892JVK | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGAPackaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC13892VK | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGAPackaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC13892BJVK | NXP USA Inc. |
Description: IC PMU I.MX51/37/35/27 139MAPBGAPackaging: Tray Package / Case: 139-TFBGA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply Supplier Device Package: 139-PBGA (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC56F82743VLC | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 32LQFPPackaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800EX Data Converters: A/D 6x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 DigiKey Programmable: Not Verified |
на замовлення 283 шт: термін постачання 21-31 дні (днів) |
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MM908E624ACPEW | NXP USA Inc. |
Description: IC SW TRPL HISIDE MCU/LIN 54SOICPackaging: Tube Package / Case: 54-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Interface: SCI, SPI RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 5.5V ~ 18V Controller Series: 908E Program Memory Type: FLASH (16kB) Applications: Mirror Control Core Processor: HC08 Supplier Device Package: 54-SOIC Grade: Automotive Number of I/O: 16 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5643LFF2MMM1 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 257MAPBGAPackaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 32x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 257-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| MPC8260ACZUMHBB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| T1024NSN7KQA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| BYV25D-600,118 |
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на замовлення 76500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 859+ | 25.82 грн |
| MKE14Z64VLF4R |
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Виробник: NXP USA Inc.
Description: MT64P 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Description: MT64P 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 278.49 грн |
| 10+ | 202.35 грн |
| 25+ | 185.83 грн |
| 100+ | 157.34 грн |
| 250+ | 149.22 грн |
| 500+ | 144.32 грн |
| 1000+ | 137.99 грн |
| MKE14F512VLL16R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1000+ | 394.21 грн |
| MKE14F512VLL16R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 1010 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 656.67 грн |
| 10+ | 491.86 грн |
| 25+ | 456.78 грн |
| 100+ | 392.47 грн |
| 250+ | 377.99 грн |
| S9S08SG16E1CTJR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 35000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 141+ | 144.77 грн |
| AFM912NT1 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 30 V
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 30 V
товару немає в наявності
В кошику
од. на суму грн.
| MC9RS08LA8CLF |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08AC8CFJE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 1050 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 583.88 грн |
| 10+ | 435.63 грн |
| 25+ | 404.03 грн |
| 100+ | 346.51 грн |
| 250+ | 330.95 грн |
| 500+ | 321.57 грн |
| PEMI4QFN/LK,132 |
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Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/13.5PF SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
Description: FILTER RC(PI) 65 OHM/13.5PF SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 64000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2959+ | 7.53 грн |
| MFS2611AMBA0ADR2 |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
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| MFS2632AMDA0ADR2 |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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| MFS2611AMBA0AD |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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| MFS2632AMDA0AD |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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| CBT3245ADS,118 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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| P1010NSE5DFA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P1 1.0GHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (3)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.4
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Random Number Generator, Secure Fusebox
SATA: SATA 3Gbps (2)
Additional Interfaces: CAN, DUART, I2C, MMC/SD, SPI
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| 74AUP2G157GD,125 |
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Виробник: NXP USA Inc.
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (2x3)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (2x3)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 93975 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2664+ | 8.35 грн |
| MK50DX256CLK10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 560 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1084.68 грн |
| 10+ | 826.31 грн |
| 96+ | 713.50 грн |
| 192+ | 648.47 грн |
| 288+ | 637.90 грн |
| MKE02Z64VFM4R |
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Виробник: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 40MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 40MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 246.84 грн |
| 10+ | 211.42 грн |
| 25+ | 201.59 грн |
| 50+ | 182.48 грн |
| 100+ | 176.04 грн |
| 250+ | 167.86 грн |
| 500+ | 159.26 грн |
| 1000+ | 153.62 грн |
| 74LV373PW,112 |
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Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-TSSOP
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-TSSOP
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| MFS2303BMBA3EPR2 |
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Виробник: NXP USA Inc.
Description: MFS2303BMBA3EPR2
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 40µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: MFS2303BMBA3EPR2
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 40µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MFS2620AMDA0ADR2 |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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| MFS2611AMDA0ADR2 |
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Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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| MPF7100BMBA0ESR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8, I.M
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC, I.MX 8, I.M
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| C9KEAZN16AMLCR |
Виробник: NXP USA Inc.
Description: C9KEAZN16AMLCR
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Description: C9KEAZN16AMLCR
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
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| MPC8360VVAGDGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Description: IC MPU MPC83XX 400MHZ 740TBGA
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
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| MPX2202ASX |
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Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
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| MPX2202A | ![]() |
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Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIA .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 29.01PSIA .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
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| PDTA114TE,115 |
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на замовлення 84000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 13172+ | 1.51 грн |
| LFTAK46MQL3A |
Виробник: NXP USA Inc.
Description: 208 1.0MM PGA TO 144 PIN 0.5MM E
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
Description: 208 1.0MM PGA TO 144 PIN 0.5MM E
Packaging: Bulk
For Use With/Related Products: MPC5746M
Module/Board Type: Socket Adapter
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| 74LVT574PW,112 |
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Виробник: NXP USA Inc.
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Description: IC FF D-TYPE SNGL 8BIT 20TSSOP
Number of Bits per Element: 8
Max Propagation Delay @ V, Max CL: 5.9ns @ 3.3V, 50pF
Supplier Device Package: 20-TSSOP
Input Capacitance: 4 pF
Clock Frequency: 150 MHz
Trigger Type: Positive Edge
Current - Output High, Low: 32mA, 64mA
Current - Quiescent (Iq): 190 µA
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Type: D-Type
Function: Standard
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Tri-State, Non-Inverted
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
на замовлення 4363 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1665+ | 13.55 грн |
| SPC5604CAMLL6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
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| SPC5604CAMLL6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 28x10b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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| S9S12GN48J0MLHR |
Виробник: NXP USA Inc.
Description: S12 CORE,48K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,48K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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| S9S12GN48J0MLH |
Виробник: NXP USA Inc.
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,48K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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| S9S12G64J0CLHR |
Виробник: NXP USA Inc.
Description: S12 CORE,64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,64K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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| S9S12G64J0CLH |
Виробник: NXP USA Inc.
Description: S12 CORE,64K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,64K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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| S9S12G48J0MLH |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: IC MCU 16BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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| S9S12G64J0MLH |
Виробник: NXP USA Inc.
Description: S12 CORE,64K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
Description: S12 CORE,64K FLASH
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12
Data Converters: A/D 12x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
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| UJA1132AHW/5F4/0Y |
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на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 466.79 грн |
| 10+ | 346.34 грн |
| 25+ | 320.53 грн |
| 100+ | 274.19 грн |
| 250+ | 261.50 грн |
| 500+ | 253.85 грн |
| 1500+ | 240.39 грн |
| PCF7961MTT/D1AC13J |
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Виробник: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 20-TSSOP
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Supplier Device Package: 20-TSSOP
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2500+ | 264.32 грн |
| PCF7961MTT/D1AC13J |
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Виробник: NXP USA Inc.
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
DigiKey Programmable: Not Verified
Supplier Device Package: 20-TSSOP
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC REMOTE KEYLESS ENTRY 20TSSOP
DigiKey Programmable: Not Verified
Supplier Device Package: 20-TSSOP
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
на замовлення 4999 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 463.62 грн |
| 10+ | 343.68 грн |
| 25+ | 318.00 грн |
| 100+ | 271.97 грн |
| 250+ | 259.34 грн |
| 500+ | 251.74 грн |
| 1000+ | 244.23 грн |
| BFU910FX |
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Виробник: NXP USA Inc.
Description: RF TRANS NPN 9.5V SOT343F
Packaging: Bulk
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 13.5dB
Power - Max: 300mW
Current - Collector (Ic) (Max): 15mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
Supplier Device Package: 4-DFP
Description: RF TRANS NPN 9.5V SOT343F
Packaging: Bulk
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: -40°C ~ 150°C (TJ)
Gain: 13.5dB
Power - Max: 300mW
Current - Collector (Ic) (Max): 15mA
Voltage - Collector Emitter Breakdown (Max): 9.5V
Supplier Device Package: 4-DFP
на замовлення 882540 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4157+ | 4.97 грн |
| MCIMX6G3CVK05AA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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| PCA9420KUKZ |
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Виробник: NXP USA Inc.
Description: PCA9420KUKZ
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
Description: PCA9420KUKZ
Packaging: Bulk
Package / Case: 25-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.3V ~ 5.5V
Applications: Microcontroller, MCU
Current - Supply: 4.5µA
Supplier Device Package: 25-WLCSP (2.09x2.09)
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| MC13892JVK |
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Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
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| MC13892VK |
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Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
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| MC13892BJVK |
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Виробник: NXP USA Inc.
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
Description: IC PMU I.MX51/37/35/27 139MAPBGA
Packaging: Tray
Package / Case: 139-TFBGA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Applications: Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply
Supplier Device Package: 139-PBGA (7x7)
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| MC56F82743VLC |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 32LQFP
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800EX
Data Converters: A/D 6x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
DigiKey Programmable: Not Verified
на замовлення 283 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 60+ | 336.88 грн |
| MM908E624ACPEW |
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Виробник: NXP USA Inc.
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC
Grade: Automotive
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC SW TRPL HISIDE MCU/LIN 54SOIC
Packaging: Tube
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: SCI, SPI
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 5.5V ~ 18V
Controller Series: 908E
Program Memory Type: FLASH (16kB)
Applications: Mirror Control
Core Processor: HC08
Supplier Device Package: 54-SOIC
Grade: Automotive
Number of I/O: 16
DigiKey Programmable: Not Verified
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| SPC5643LFF2MMM1 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 257MAPBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 32x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 257-LFBGA (14x14)
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.




























