Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36604) > Сторінка 539 з 611
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
S9S12G64F0WLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFPData Converters: A/D 12x10b Core Processor: 12V1 EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 40 Supplier Device Package: 48-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||||
|
LPC54605J256BD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFPDigiKey Programmable: Not Verified Number of I/O: 64 Supplier Device Package: 100-LQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M4 EEPROM Size: 16K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 136K x 8 Program Memory Size: 256KB (256K x 8) Speed: 180MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 90 шт В кошику од. на суму грн. | ||||||||||||||||
| LFVBBOM67W1A | NXP USA Inc. |
Description: QORIVVA MPC5567 422 PIN 1.0MM VE Accessory Type: Base Board For Use With/Related Products: MPC5567 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBBOM67U2A | NXP USA Inc. |
Description: QORIVVA MPC5567 330 PIN 1.0MM VE Accessory Type: Base Board For Use With/Related Products: MPC5567 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| LFVBBOM65U2A | NXP USA Inc. |
Description: QORIVVA MPC5565 330 PIN 1.0MM VE Accessory Type: Base Board For Use With/Related Products: MPC5565 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
MIMXRT1024CAG4B | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 396MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M7 Data Converters: A/D 19x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 90 |
на замовлення 309 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| PIMX9131CVVXJAA | NXP USA Inc. |
Description: PIMX9131CVVXJAA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 176 шт В кошику од. на суму грн. | |||||||||||||||||
|
B4860NSE7QUMD | NXP USA Inc. |
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGAPackaging: Box Package / Case: 1020-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e6500 Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Supplier Device Package: 1020-FCPBGA (33x33) Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 4 Core, 64-Bit Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 24 шт В кошику од. на суму грн. | ||||||||||||||||
| FS32K144UAT0VLFR | NXP USA Inc. |
Description: S32K144 ARM CORTEX-M4F, 112 MHZ,Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
|
|
MK22FN128VLH10R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
MK22FN128VLH10R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 128KB (128K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 22x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 1188 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
|
MKE14Z256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPeripherals: DMA, LVD, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 1x8b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 34K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 72MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 58 Supplier Device Package: 64-LQFP (10x10) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
MKE14Z256VLH7R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFPPackaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 34K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 1448 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| MFS2633AMDAHADR2 | NXP USA Inc. |
Description: MFS2633AMDAHADR2Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| MC33FS6527NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
|
MC33VR5500V0KSR2 | NXP USA Inc. |
Description: 1 BUCK, QM, INFOTAINMENTPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: SMPS Start-Up Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||
| MPXV6115V6T1 | NXP USA Inc. |
Description: SENSOR 16.68PSI 4.6V 8SOPFeatures: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD, Gull Wing Output Type: Analog Voltage Mounting Type: Surface Mount Output: 0.2 V ~ 4.6 V Operating Pressure: -16.68PSI (-115kPa) Pressure Type: Vacuum Accuracy: ±1.5% Operating Temperature: -40°C ~ 125°C Voltage - Supply: 4.75V ~ 5.25V Applications: Board Mount Supplier Device Package: 8-SOP Port Style: No Port Maximum Pressure: -58.02PSI (-400kPa) |
товару немає в наявності |
Мінімальне замовлення: 600 шт В кошику од. на суму грн. | |||||||||||||||||
|
LD6806F/30P,115 | NXP USA Inc. |
Description: IC REG LINEAR 3V 200MA 6XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Fixed Mounting Type: Surface Mount Current - Output: 200mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 6-XSON, SOT886 (1.45x1) Voltage - Output (Min/Fixed): 3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.13V @ 200mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 33935 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| NJJ29C2A5HN5/045Y | NXP USA Inc. |
Description: NJJ29C2A5HN5 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||
|
|
SPC5602BAVLH4R | NXP USA Inc. |
Description: NXP 32-BIT MCU, POWER ARCH CORE, Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0 Data Converters: A/D 36x10b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, FlexRay, LINbus, SCI, SPI Peripherals: POR, LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||||
| SPC5603BACLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 384KB FLASH 100LQFP Number of I/O: 79 Supplier Device Package: 100-LQFP (14x14) Peripherals: POR, LVD, PWM, WDT Connectivity: CANbus, FlexRay, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 36x10b SAR Core Processor: e200z0 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 28K x 8 Program Memory Size: 384KB (384K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | |||||||||||||||||
|
MC68HC908GP16CFB | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFPDigiKey Programmable: Not Verified Number of I/O: 33 Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
MC908GP16CBE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 42DIPCore Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Through Hole Package / Case: 42-SDIP (0.600", 15.24mm) Packaging: Tube DigiKey Programmable: Not Verified Number of I/O: 31 Supplier Device Package: 42-PDIP Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC908GP16CFBE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44QFPDigiKey Programmable: Not Verified Number of I/O: 33 Supplier Device Package: 44-QFP (10x10) Peripherals: LVD, POR, PWM Connectivity: SCI, SPI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 512 x 8 Program Memory Size: 16KB (16K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC32PF3001A7EPR2 | NXP USA Inc. |
Description: IC PWR MGMT I.MX7 6LDO QFN 48Supplier Device Package: 48-HVQFN (7x7) Applications: Processor Voltage - Supply: 2.8V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||
| S912ZVCA19A1WKHR | NXP USA Inc. |
Description: S12Z, 64LQFP-EP, 192K FLASH Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | |||||||||||||||||
| S912ZVCA19A1WKH | NXP USA Inc. |
Description: S12Z, 64LQFP-EP, 192K FLASH Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | |||||||||||||||||
| SAF775CHN/N208W/MP | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| SAF775CHN/N208W/KK | NXP USA Inc. |
Description: CAR RADIO TUNER & AUDIO DSP Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 840 шт В кошику од. на суму грн. | |||||||||||||||||
|
MPC8260ACZUMHBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGAAdditional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MIMX9121DVVXCAA | NXP USA Inc. |
Description: MIMX9121DVVXCAAPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MIMX9121CVVXCAA | NXP USA Inc. |
Description: MIMX9121CVVXCAAPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
T1024NSN7KQA | NXP USA Inc. |
Description: IC MPU QORIQ T1 1GHZ 780FBGAPackaging: Tray Package / Case: 780-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 780-FBGA (23x23) Ethernet: GbE (8) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage SATA: SATA 3Gbps (2) Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||||||
|
BYV25D-600,118 | NXP USA Inc. |
Description: DIODE RECT 600V 5A DPAKPackaging: Bulk |
на замовлення 76500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE14Z64VLF4R | NXP USA Inc. |
Description: MT64P 48LQFPDigiKey Programmable: Not Verified Number of I/O: 42 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: FlexIO, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 12x12b SAR Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Cut Tape (CT) |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE14F512VLL16R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE14F512VLL16R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFPPackaging: Cut Tape (CT) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 168MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 68K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 16x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: FlexIO, I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 89 DigiKey Programmable: Not Verified |
на замовлення 1010 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| TJA1104AHN/0J | NXP USA Inc. |
Description: TJA1104AHN/0J Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||
|
S9S08SG16E1CTJR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 20TSSOPPackaging: Bulk Package / Case: 20-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 12x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 20-TSSOP Number of I/O: 16 DigiKey Programmable: Not Verified |
на замовлення 35000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| AFM912NT1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 16DFNPackaging: Tape & Reel (TR) Package / Case: 16-VDFN Exposed Pad Current Rating (Amps): 10µA Mounting Type: Surface Mount Frequency: 136MHz ~ 941MHz Gain: 13.3dB Technology: LDMOS Supplier Device Package: 16-DFN (4x6) Voltage - Rated: 30 V |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||
|
MC9RS08LA8CLF | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 8KB (8K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: RS08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 31 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||||
|
MC9S08AC8CFJE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 22 DigiKey Programmable: Not Verified |
на замовлення 1050 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
PEMI4QFN/LK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 65 OHM/13.5PF SMDNumber of Channels: 4 ESD Protection: Yes Resistance - Channel (Ohms): 65 Technology: RC (Pi) Applications: LAN, PCS, WAN Filter Order: 2nd Attenuation Value: 15dB @ 800MHz ~ 3GHz Height: 0.020" (0.50mm) Values: R = 65Ohms, C = 13.5pF (Total) Operating Temperature: -40°C ~ 85°C Type: Low Pass Mounting Type: Surface Mount Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm) Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 64000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| MFS2611AMBA0ADR2 | NXP USA Inc. |
Description: AUTO SBCPackaging: Tape & Reel (TR) Grade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| MFS2632AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| MFS2611AMBA0AD | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | |||||||||||||||||
| MFS2632AMDA0AD | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | |||||||||||||||||
|
CBT3245ADS,118 | NXP USA Inc. |
Description: IC BUS SWITCH 8 X 1:1 20SSOPSupplier Device Package: 20-SSOP Voltage Supply Source: Single Supply Independent Circuits: 1 Voltage - Supply: 4V ~ 5.5V Operating Temperature: -40°C ~ 85°C Type: Bus Switch Circuit: 8 x 1:1 Mounting Type: Surface Mount Package / Case: 20-SSOP (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
74AUP2G157GD,125 | NXP USA Inc. |
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1Supplier Device Package: 8-XSON (2x3) Voltage Supply Source: Single Supply Current - Output High, Low: 4mA, 4mA Independent Circuits: 1 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Type: Multiplexer Circuit: 1 x 2:1 Mounting Type: Surface Mount Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 93975 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MK50DX256CLK10 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFPPackaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 30x16b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 39 DigiKey Programmable: Not Verified |
на замовлення 560 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| MKE02Z64VFM4R | NXP USA Inc. |
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b SAR Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 40MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
|
74LV373PW,112 | NXP USA Inc. |
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOPPackaging: Tube Package / Case: 20-TSSOP (0.173", 4.40mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5.5V Independent Circuits: 1 Current - Output High, Low: 16mA, 16mA Delay Time - Propagation: 20ns Supplier Device Package: 20-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MFS2303BMBA3EPR2 | NXP USA Inc. |
Description: MFS2303BMBA3EPR2Supplier Device Package: 48-HVQFN (7x7) Current - Supply: 40µA Applications: System Basis Chip Voltage - Supply: 5.5V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||
| MFS2620AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| MFS2611AMDA0ADR2 | NXP USA Inc. |
Description: AUTO SBCGrade: Automotive Supplier Device Package: 48-LQFP-EP (7x7) Current - Supply: 30µA Voltage - Supply: 3.2V ~ 40V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
|
MPF7100BMBA0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC, I.MX 8, I.MQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HVQFN (7x7) Current - Supply: 10µA Applications: i.MX Processors Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||
|
C9KEAZN16AMLCR | NXP USA Inc. |
Description: C9KEAZN16AMLCR Packaging: Bulk Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256K x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 57 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
|
MPC8360VVAGDGA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 740TBGACo-Processors/DSP: Communications; QUICC Engine Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 1.x (1) Ethernet: 10/100/1000Mbps (1) Supplier Device Package: 740-TBGA (37.5x37.5) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 740-LBGA Packaging: Tray Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART Graphics Acceleration: No RAM Controllers: DDR, DDR2 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
MPX2202ASX | NXP USA Inc. |
Description: SENSOR 29.01PSIA 0.19" .04VFeatures: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Port Size: Male - 0.19" (4.93mm) Tube Applications: Board Mount Port Style: Barbed Maximum Pressure: 58.02PSI (400kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MPX2202A | NXP USA Inc. |
Description: SENSOR 29.01PSIA .04VFeatures: Temperature Compensated Packaging: Tray Package / Case: 4-SIP Module Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 10V ~ 16V Applications: Board Mount Port Style: No Port Maximum Pressure: 58.02PSI (400kPa) |
товару немає в наявності |
В кошику од. на суму грн. |
| S9S12G64F0WLF |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Data Converters: A/D 12x10b
Core Processor: 12V1
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| LPC54605J256BD100E |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M4
EEPROM Size: 16K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 136K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 180MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 90 шт
В кошику
од. на суму грн.
| LFVBBOM67W1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5567 422 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
Description: QORIVVA MPC5567 422 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBOM67U2A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5567 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
Description: QORIVVA MPC5567 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5567
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBOM65U2A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5565 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5565
Packaging: Bulk
Description: QORIVVA MPC5565 330 PIN 1.0MM VE
Accessory Type: Base Board
For Use With/Related Products: MPC5565
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| MIMXRT1024CAG4B |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 396MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 90
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 396MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 19x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 90
на замовлення 309 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 934.54 грн |
| 10+ | 708.30 грн |
| 60+ | 624.96 грн |
| 120+ | 565.34 грн |
| 300+ | 542.99 грн |
| B4860NSE7QUMD |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
Description: IC MPU QORIQ 1.8GHZ 1020FCPBGA
Packaging: Box
Package / Case: 1020-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Voltage - I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Supplier Device Package: 1020-FCPBGA (33x33)
Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 4 Core, 64-Bit
Co-Processors/DSP: Signal Processing; SC3900FP FVP - 6 Core
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Additional Interfaces: I2C, MMC/SD, RapidIO, SPI, UART
товару немає в наявності
Мінімальне замовлення: 24 шт
В кошику
од. на суму грн.
| MK22FN128VLH10R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MK22FN128VLH10R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 22x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 1188 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 425.42 грн |
| 10+ | 314.68 грн |
| 25+ | 290.84 грн |
| 100+ | 248.36 грн |
| 250+ | 237.22 грн |
| MKE14Z256VLH7R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 34K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Peripherals: DMA, LVD, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 34K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 72MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-LQFP (10x10)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MKE14Z256VLH7R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 34K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 34K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 1448 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 398.30 грн |
| 10+ | 260.95 грн |
| 25+ | 254.58 грн |
| 100+ | 233.58 грн |
| 250+ | 222.88 грн |
| 500+ | 212.78 грн |
| MC33FS6527NAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 2.2A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC33VR5500V0KSR2 |
![]() |
Виробник: NXP USA Inc.
Description: 1 BUCK, QM, INFOTAINMENT
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: SMPS Start-Up
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: 1 BUCK, QM, INFOTAINMENT
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: SMPS Start-Up
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| MPXV6115V6T1 |
![]() |
Виробник: NXP USA Inc.
Description: SENSOR 16.68PSI 4.6V 8SOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.6 V
Operating Pressure: -16.68PSI (-115kPa)
Pressure Type: Vacuum
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: No Port
Maximum Pressure: -58.02PSI (-400kPa)
Description: SENSOR 16.68PSI 4.6V 8SOP
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing
Output Type: Analog Voltage
Mounting Type: Surface Mount
Output: 0.2 V ~ 4.6 V
Operating Pressure: -16.68PSI (-115kPa)
Pressure Type: Vacuum
Accuracy: ±1.5%
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.75V ~ 5.25V
Applications: Board Mount
Supplier Device Package: 8-SOP
Port Style: No Port
Maximum Pressure: -58.02PSI (-400kPa)
товару немає в наявності
Мінімальне замовлення: 600 шт
В кошику
од. на суму грн.
| LD6806F/30P,115 |
![]() |
Виробник: NXP USA Inc.
Description: IC REG LINEAR 3V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3V 200MA 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.13V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 33935 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2219+ | 10.12 грн |
| SPC5602BAVLH4R |
Виробник: NXP USA Inc.
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
Description: NXP 32-BIT MCU, POWER ARCH CORE,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0
Data Converters: A/D 36x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Peripherals: POR, LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| SPC5603BACLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, LVD, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 36x10b SAR
Core Processor: e200z0
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Number of I/O: 79
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, LVD, PWM, WDT
Connectivity: CANbus, FlexRay, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 36x10b SAR
Core Processor: e200z0
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 28K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику
од. на суму грн.
| MC68HC908GP16CFB |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC908GP16CBE |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 42DIP
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 42-SDIP (0.600", 15.24mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 31
Supplier Device Package: 42-PDIP
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Description: IC MCU 8BIT 16KB FLASH 42DIP
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 42-SDIP (0.600", 15.24mm)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 31
Supplier Device Package: 42-PDIP
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
товару немає в наявності
В кошику
од. на суму грн.
| MC908GP16CFBE |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Description: IC MCU 8BIT 16KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 33
Supplier Device Package: 44-QFP (10x10)
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC32PF3001A7EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Supplier Device Package: 48-HVQFN (7x7)
Applications: Processor
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC PWR MGMT I.MX7 6LDO QFN 48
Supplier Device Package: 48-HVQFN (7x7)
Applications: Processor
Voltage - Supply: 2.8V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| SAF775CHN/N208W/MP |
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MPC8260ACZUMHBB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| T1024NSN7KQA |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
Description: IC MPU QORIQ T1 1GHZ 780FBGA
Packaging: Tray
Package / Case: 780-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 780-FBGA (23x23)
Ethernet: GbE (8)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| BYV25D-600,118 |
![]() |
на замовлення 76500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 859+ | 25.29 грн |
| MKE14Z64VLF4R |
![]() |
Виробник: NXP USA Inc.
Description: MT64P 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
Description: MT64P 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 42
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: FlexIO, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 272.77 грн |
| 10+ | 198.19 грн |
| 25+ | 182.01 грн |
| 100+ | 154.11 грн |
| 250+ | 146.16 грн |
| 500+ | 141.36 грн |
| 1000+ | 135.16 грн |
| MKE14F512VLL16R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1000+ | 386.11 грн |
| MKE14F512VLL16R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 168MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 68K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: FlexIO, I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
на замовлення 1010 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 643.17 грн |
| 10+ | 481.75 грн |
| 25+ | 447.40 грн |
| 100+ | 384.40 грн |
| 250+ | 370.22 грн |
| S9S08SG16E1CTJR |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
на замовлення 35000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 141+ | 141.80 грн |
| AFM912NT1 |
![]() |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 30 V
Description: RF MOSFET LDMOS 16DFN
Packaging: Tape & Reel (TR)
Package / Case: 16-VDFN Exposed Pad
Current Rating (Amps): 10µA
Mounting Type: Surface Mount
Frequency: 136MHz ~ 941MHz
Gain: 13.3dB
Technology: LDMOS
Supplier Device Package: 16-DFN (4x6)
Voltage - Rated: 30 V
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MC9RS08LA8CLF |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| MC9S08AC8CFJE |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 1050 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 571.88 грн |
| 10+ | 426.68 грн |
| 25+ | 395.73 грн |
| 100+ | 339.39 грн |
| 250+ | 324.15 грн |
| 500+ | 314.96 грн |
| PEMI4QFN/LK,132 |
![]() |
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHM/13.5PF SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
Description: FILTER RC(PI) 65 OHM/13.5PF SMD
Number of Channels: 4
ESD Protection: Yes
Resistance - Channel (Ohms): 65
Technology: RC (Pi)
Applications: LAN, PCS, WAN
Filter Order: 2nd
Attenuation Value: 15dB @ 800MHz ~ 3GHz
Height: 0.020" (0.50mm)
Values: R = 65Ohms, C = 13.5pF (Total)
Operating Temperature: -40°C ~ 85°C
Type: Low Pass
Mounting Type: Surface Mount
Size / Dimension: 0.067" L x 0.047" W (1.70mm x 1.20mm)
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 64000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2959+ | 7.38 грн |
| MFS2611AMBA0ADR2 |
![]() |
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MFS2632AMDA0ADR2 |
![]() |
Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MFS2611AMBA0AD |
![]() |
Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| MFS2632AMDA0AD |
![]() |
Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| CBT3245ADS,118 |
![]() |
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: IC BUS SWITCH 8 X 1:1 20SSOP
Supplier Device Package: 20-SSOP
Voltage Supply Source: Single Supply
Independent Circuits: 1
Voltage - Supply: 4V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Type: Bus Switch
Circuit: 8 x 1:1
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| 74AUP2G157GD,125 |
![]() |
Виробник: NXP USA Inc.
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (2x3)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
Description: MULTIPLEXER, AUP/ULP/V SERIES, 1
Supplier Device Package: 8-XSON (2x3)
Voltage Supply Source: Single Supply
Current - Output High, Low: 4mA, 4mA
Independent Circuits: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Type: Multiplexer
Circuit: 1 x 2:1
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 93975 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2664+ | 8.18 грн |
| MK50DX256CLK10 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 30x16b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 39
DigiKey Programmable: Not Verified
на замовлення 560 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1062.40 грн |
| 10+ | 809.34 грн |
| 96+ | 698.84 грн |
| 192+ | 635.15 грн |
| 288+ | 624.79 грн |
| MKE02Z64VFM4R |
![]() |
Виробник: NXP USA Inc.
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 40MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: KINETIS KE02: 40MHZ CORTEX-M0+ 5
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 40MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 241.77 грн |
| 10+ | 207.07 грн |
| 25+ | 197.45 грн |
| 50+ | 178.73 грн |
| 100+ | 172.42 грн |
| 250+ | 164.41 грн |
| 500+ | 155.99 грн |
| 1000+ | 150.46 грн |
| 74LV373PW,112 |
![]() |
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-TSSOP
Description: IC D-TYPE TRANSP SGL 8:8 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 16mA, 16mA
Delay Time - Propagation: 20ns
Supplier Device Package: 20-TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| MFS2303BMBA3EPR2 |
![]() |
Виробник: NXP USA Inc.
Description: MFS2303BMBA3EPR2
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 40µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: MFS2303BMBA3EPR2
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 40µA
Applications: System Basis Chip
Voltage - Supply: 5.5V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| MFS2620AMDA0ADR2 |
![]() |
Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MFS2611AMDA0ADR2 |
![]() |
Виробник: NXP USA Inc.
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: AUTO SBC
Grade: Automotive
Supplier Device Package: 48-LQFP-EP (7x7)
Current - Supply: 30µA
Voltage - Supply: 3.2V ~ 40V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MPF7100BMBA0ESR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, I.MX 8, I.M
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC, I.MX 8, I.M
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| C9KEAZN16AMLCR |
Виробник: NXP USA Inc.
Description: C9KEAZN16AMLCR
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
Description: C9KEAZN16AMLCR
Packaging: Bulk
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 57
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MPC8360VVAGDGA |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 740TBGA
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Description: IC MPU MPC83XX 400MHZ 740TBGA
Co-Processors/DSP: Communications; QUICC Engine
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.x (1)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 740-TBGA (37.5x37.5)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 740-LBGA
Packaging: Tray
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
товару немає в наявності
В кошику
од. на суму грн.
| MPX2202ASX |
![]() |
Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 29.01PSIA 0.19" .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.19" (4.93mm) Tube
Applications: Board Mount
Port Style: Barbed
Maximum Pressure: 58.02PSI (400kPa)
товару немає в наявності
В кошику
од. на суму грн.
| MPX2202A |
![]() |
Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIA .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 29.01PSIA .04V
Features: Temperature Compensated
Packaging: Tray
Package / Case: 4-SIP Module
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 10V ~ 16V
Applications: Board Mount
Port Style: No Port
Maximum Pressure: 58.02PSI (400kPa)
товару немає в наявності
В кошику
од. на суму грн.


























