Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35738) > Сторінка 542 з 596
Фото | Назва | Виробник | Інформація |
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SPC5746GBK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 3MB FLASH Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
HVP-56F81768 | NXP USA Inc. |
![]() Packaging: Bulk Mounting Type: Fixed Contents: Board(s) Core Processor: 56800EX |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
LPC5526JBD64E | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 64-HTQFP (10x10) Number of I/O: 36 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MIMXRT1041DFP6BR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 90°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 169-LFBGA (9x9) Number of I/O: 114 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
MIMXRT1041DFP6BR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 169-LFBGA Mounting Type: Surface Mount Speed: 600MHz Program Memory Size: 128KB (128K x 8) RAM Size: 512K x 8 Operating Temperature: 0°C ~ 90°C (TJ) Oscillator Type: External, Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M7 Data Converters: A/D 12x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Supplier Device Package: 169-LFBGA (9x9) Number of I/O: 114 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MIMXRT1051DVL6BR | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 196-LFBGA Mounting Type: Surface Mount Speed: 600MHz RAM Size: 512K x 8 Operating Temperature: 0°C ~ 95°C (TJ) Oscillator Type: External, Internal Program Memory Type: External Program Memory Core Processor: ARM® Cortex®-M7 Data Converters: A/D 20x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 196-LFBGA (10x10) Number of I/O: 127 DigiKey Programmable: Not Verified |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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BZX884-C75,315 | NXP USA Inc. |
![]() Packaging: Bulk |
на замовлення 70000 шт: термін постачання 21-31 дні (днів) |
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SPC5602BK0VLL4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5602CF2MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 256KB (256K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 8x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5604CF2MLH6 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 48K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 28x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 79 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5604PEF1MLQ6R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 40K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 30x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 108 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08SE4CWL | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 4KB (4K x 8) RAM Size: 256 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: LINbus, SCI Peripherals: LVD, POR, PWM Supplier Device Package: 28-SOIC Number of I/O: 24 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
FB32K148HAT0MLQR | NXP USA Inc. |
Description: S32K148 32-BIT MCU, ARM CORTEX- Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FD32K146HAT0VLHR | NXP USA Inc. |
Description: S32K146 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
NZX6V2E,133 | NXP USA Inc. |
Description: DIODE ZENER 6.2V 500MW ALF2 Packaging: Bulk |
на замовлення 44558 шт: термін постачання 21-31 дні (днів) |
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FXLS93220AESR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-LQFN Exposed Pad Output Type: I2C, SPI Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C Supplier Device Package: 16-HLQFNR (4x4) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FX32K142HAT0MLFT | NXP USA Inc. |
![]() Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FX32K142UAT0VLLR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FX32K144HAT0MLFT | NXP USA Inc. |
![]() Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FX32K144HAT0MLLR | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FX32K146UAT0VLLT | NXP USA Inc. |
![]() Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
FB32K146HAT0VLLT | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
JN5168/001K | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Sensitivity: -96dBm Mounting Type: Surface Mount Frequency: 2.4GHz ~ 2.485GHz Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2V ~ 3.6V Power - Output: 2.5dBm Protocol: Zigbee® Current - Receiving: 17mA Data Rate (Max): 1Mbps Current - Transmitting: 15mA Supplier Device Package: 40-HVQFN (6x6) RF Family/Standard: 802.15.4 Serial Interfaces: I2C, JTAG, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MFS2320BMBB1EPR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MFS2320BMBB1EP | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5.5V ~ 40V Applications: System Basis Chip Current - Supply: 30µA Supplier Device Package: 48-HVQFN (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC857DSLVR50B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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MPC857DSLVR50B | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NTS0102JKZ | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 8-XFDFN Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Data Rate: 50Mbps Supplier Device Package: 8-X2SON (1.35x1) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 2 Voltage - VCCA: 1.65 V ~ 3.6 V Voltage - VCCB: 2.3 V ~ 5.5 V Number of Circuits: 1 |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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LD6836CX4/14H,315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 300mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 1.4V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.16V @ 300mA Protection Features: Over Current, Over Temperature Current - Supply (Max): 250 µA |
на замовлення 27000 шт: термін постачання 21-31 дні (днів) |
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LFTQSE2T | NXP USA Inc. |
Description: 64 PIN 0.5MM QFP SURFACE MOUNT T Packaging: Bulk Module/Board Type: Socket Module - QFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
WLAN7301HY | NXP USA Inc. |
Description: WLAN7301H Packaging: Tape & Reel (TR) Package / Case: 18-WFLGA Exposed Pad Frequency: 2.4GHz RF Type: Bluetooth, WLAN Supplier Device Package: 18-HWFLGA (2.4x2) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
NCK2982RHN/00101Y | NXP USA Inc. |
Description: MANTRA CS Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MRF24301HSR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S Mounting Type: Chassis Mount Frequency: 2.4GHz ~ 2.5GHz Power - Output: 300W Gain: 13.5dB Technology: LDMOS Supplier Device Package: NI-780S |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SC16C754BIA68,529 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 68-LCC (J-Lead) Number of Channels: 4, QUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 64 Byte Data Rate (Max): 5Mbps Supplier Device Package: 68-PLCC (24.18x24.18) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74AHCU04PW,112 | NXP USA Inc. |
![]() Packaging: Tube Package / Case: 14-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Logic Type: Inverter Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 5.5V Current - Output High, Low: 8mA, 8mA Number of Inputs: 1 Supplier Device Package: 14-TSSOP Input Logic Level - High: 1.7V ~ 4.4V Input Logic Level - Low: 0.3V ~ 1.1V Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF Number of Circuits: 6 Current - Quiescent (Max): 2 µA |
на замовлення 6816 шт: термін постачання 21-31 дні (днів) |
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MKL02Z16VFG4R | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MKL02Z16VFG4R | NXP USA Inc. |
![]() Packaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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PCA9550D,118 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Outputs: 2 Frequency: 400kHz Type: Linear Operating Temperature: -40°C ~ 85°C (TA) Current - Output / Channel: 25mA Internal Switch(s): Yes Supplier Device Package: 8-SO Dimming: I2C Voltage - Supply (Min): 2.3V Voltage - Supply (Max): 5.5V |
на замовлення 2500 шт: термін постачання 21-31 дні (днів) |
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MWCT1013AVLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.7V ~ 3.6V Supplier Device Package: 64-LQFP (10x10) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
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S32K358GHT1VPCSR | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 172-QFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 8MB (8M x 8) RAM Size: 1.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP-EP Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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S32K311NHT0MLFSR | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 42 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S32K311NHT0MPASR | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 100-QFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1MB (1M x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 100-MaxQFP (10x10) Grade: Automotive Number of I/O: 84 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
J3R150PZU15/0ZA4FV | NXP USA Inc. |
Description: J3R150PZU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
J3R200PZU15/0ZA76V | NXP USA Inc. |
Description: J3R200PZU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
J3R200PZU15/0ZA7AV | NXP USA Inc. |
Description: J3R200PZU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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BF1100WR,115 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: SC-82A, SOT-343 Current Rating (Amps): 30mA Mounting Type: Surface Mount Frequency: 800MHz Configuration: N-Channel Dual Gate Technology: MOSFET (Metal Oxide) Noise Figure: 2dB Supplier Device Package: CMPAK-4 Voltage - Rated: 14 V Voltage - Test: 9 V Current - Test: 10 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33774ATP1AE | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 64-LQFP Exposed Pad Number of Cells: 4 ~ 18 Mounting Type: Surface Mount Function: Multi-Function Controller Interface: I2C, SPI Operating Temperature: -40°C ~ 125°C (TA) Battery Chemistry: Lithium Ion Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Temperature Grade: Automotive Qualification: AEC-Q100 |
на замовлення 234 шт: термін постачання 21-31 дні (днів) |
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A5G26H110N-2496 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 6-LDFN Exposed Pad Mounting Type: Surface Mount Frequency: 2.496GHz ~ 2.69GHz Power - Output: 15W Gain: 17.7dB Supplier Device Package: 6-PDFN (7x6.5) Voltage - Rated: 125 V Voltage - Test: 48 V Current - Test: 50 mA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MGD3100BM58EKR2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5V Supplier Device Package: 32-SOIC Channel Type: Single Driven Configuration: Half-Bridge Number of Drivers: 1 Gate Type: IGBT, MOSFET (N-Channel) Current - Peak Output (Source, Sink): 15A, 15A Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08DV60MLH | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 3K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 16x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08DZ60MLC | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08DZ60MLH | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 60KB (60K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: S08 Data Converters: A/D 24x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 53 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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LD6816CX4/30P,315 | NXP USA Inc. |
![]() Packaging: Bulk Package / Case: 4-XFBGA, WLCSP Output Type: Fixed Mounting Type: Surface Mount Current - Output: 150mA Operating Temperature: -40°C ~ 85°C Output Configuration: Positive Current - Quiescent (Iq): 100 µA Voltage - Input (Max): 5.5V Number of Regulators: 1 Supplier Device Package: 4-WLCSP (0.76x0.76) Voltage - Output (Min/Fixed): 3V Control Features: Enable PSRR: 55dB (1kHz) Voltage Dropout (Max): 0.075V @ 150mA Protection Features: Over Current, Over Temperature, Transient Voltage Current - Supply (Max): 250 µA |
на замовлення 36000 шт: термін постачання 21-31 дні (днів) |
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MPC8378VRAJFA | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 689-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 125°C (TA) Core Processor: PowerPC e300c4s Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 689-TEPBGA II (31x31) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
P3T1035XUK-ARD | NXP USA Inc. |
![]() Packaging: Box Function: Temperature Type: Sensor Contents: Board(s) Utilized IC / Part: P3T1035xUK |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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MCIMX535DVP1C2R2 | NXP USA Inc. |
![]() Packaging: Tape & Reel (TR) Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX535DVP1C2 | NXP USA Inc. |
Description: IC MPU I.MX53 1GHZ 529FBGA Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
на замовлення 412 шт: термін постачання 21-31 дні (днів) |
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MCIMX535DVV2C | NXP USA Inc. |
![]() Packaging: Tray Package / Case: 529-FBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V Supplier Device Package: 529-FBGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (2), USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR2, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 1.5Gbps (1) Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
LFTAS32KQM2A | NXP USA Inc. |
Description: NXP S32K FAMILY 176 LQFP TARGET Packaging: Bulk For Use With/Related Products: S32K Module/Board Type: Socket Module - LQFP |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
RD33774CNT2EVB | NXP USA Inc. |
Description: RD33774CNT2EVB Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. |
HVP-56F81768 |
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Виробник: NXP USA Inc.
Description: HVP-56F81768
Packaging: Bulk
Mounting Type: Fixed
Contents: Board(s)
Core Processor: 56800EX
Description: HVP-56F81768
Packaging: Bulk
Mounting Type: Fixed
Contents: Board(s)
Core Processor: 56800EX
товару немає в наявності
В кошику
од. на суму грн.
LPC5526JBD64E |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Number of I/O: 36
товару немає в наявності
В кошику
од. на суму грн.
MIMXRT1041DFP6BR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 90°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
Number of I/O: 114
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 90°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
Number of I/O: 114
товару немає в наявності
В кошику
од. на суму грн.
MIMXRT1041DFP6BR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 90°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
Number of I/O: 114
Description: IC MCU 32BIT 128KB ROM 169LFBGA
Packaging: Cut Tape (CT)
Package / Case: 169-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 90°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 12x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 169-LFBGA (9x9)
Number of I/O: 114
товару немає в наявності
В кошику
од. на суму грн.
MIMXRT1051DVL6BR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 862.96 грн |
10+ | 650.73 грн |
25+ | 605.81 грн |
100+ | 522.18 грн |
250+ | 500.08 грн |
500+ | 486.76 грн |
BZX884-C75,315 |
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на замовлення 70000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
13053+ | 1.43 грн |
SPC5602BK0VLL4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
SPC5602CF2MLH4 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
SPC5604CF2MLH6 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 28x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 79
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
SPC5604PEF1MLQ6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 30x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 108
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
MC9S08SE4CWL |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Number of I/O: 24
DigiKey Programmable: Not Verified
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NZX6V2E,133 |
на замовлення 44558 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
13172+ | 1.47 грн |
FXLS93220AESR2 |
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Виробник: NXP USA Inc.
Description: PSI5 X SINGLE-AXIS MEDIUM-G INE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
Description: PSI5 X SINGLE-AXIS MEDIUM-G INE
Packaging: Tape & Reel (TR)
Package / Case: 16-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C
Supplier Device Package: 16-HLQFNR (4x4)
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JN5168/001K |
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Виробник: NXP USA Inc.
Description: ZIGBEE AND IEEE802.15.4 WIRELESS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.485GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
Description: ZIGBEE AND IEEE802.15.4 WIRELESS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -96dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.485GHz
Memory Size: 256kB Flash, 4kB EEPROM, 32kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 3.6V
Power - Output: 2.5dBm
Protocol: Zigbee®
Current - Receiving: 17mA
Data Rate (Max): 1Mbps
Current - Transmitting: 15mA
Supplier Device Package: 40-HVQFN (6x6)
RF Family/Standard: 802.15.4
Serial Interfaces: I2C, JTAG, SPI, UART
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MFS2320BMBB1EPR2 |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
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MFS2320BMBB1EP |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 30µA
Supplier Device Package: 48-HVQFN (7x7)
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MPC857DSLVR50B |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
8+ | 2908.82 грн |
MPC857DSLVR50B |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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NTS0102JKZ |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLTR BIDIRECTIONAL 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Data Rate: 50Mbps
Supplier Device Package: 8-X2SON (1.35x1)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1.65 V ~ 3.6 V
Voltage - VCCB: 2.3 V ~ 5.5 V
Number of Circuits: 1
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
6000+ | 16.99 грн |
LD6836CX4/14H,315 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 1.4V 300MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.4V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.16V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 27000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2664+ | 8.06 грн |
LFTQSE2T |
Виробник: NXP USA Inc.
Description: 64 PIN 0.5MM QFP SURFACE MOUNT T
Packaging: Bulk
Module/Board Type: Socket Module - QFP
Description: 64 PIN 0.5MM QFP SURFACE MOUNT T
Packaging: Bulk
Module/Board Type: Socket Module - QFP
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WLAN7301HY |
Виробник: NXP USA Inc.
Description: WLAN7301H
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: Bluetooth, WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
Description: WLAN7301H
Packaging: Tape & Reel (TR)
Package / Case: 18-WFLGA Exposed Pad
Frequency: 2.4GHz
RF Type: Bluetooth, WLAN
Supplier Device Package: 18-HWFLGA (2.4x2)
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NCK2982RHN/00101Y |
Виробник: NXP USA Inc.
Description: MANTRA CS
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: MANTRA CS
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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MRF24301HSR5 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
Description: RF MOSFET LDMOS NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 2.4GHz ~ 2.5GHz
Power - Output: 300W
Gain: 13.5dB
Technology: LDMOS
Supplier Device Package: NI-780S
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SC16C754BIA68,529 |
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Виробник: NXP USA Inc.
Description: IC UART QUAD 64BYTE 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: IC UART QUAD 64BYTE 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Number of Channels: 4, QUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 64 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 68-PLCC (24.18x24.18)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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74AHCU04PW,112 |
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Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.4V
Input Logic Level - Low: 0.3V ~ 1.1V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 5.5V
Current - Output High, Low: 8mA, 8mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.7V ~ 4.4V
Input Logic Level - Low: 0.3V ~ 1.1V
Max Propagation Delay @ V, Max CL: 7ns @ 5V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 2 µA
на замовлення 6816 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3328+ | 6.80 грн |
MKL02Z16VFG4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5000+ | 100.05 грн |
MKL02Z16VFG4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 209.59 грн |
10+ | 150.45 грн |
25+ | 137.67 грн |
100+ | 115.98 грн |
250+ | 109.69 грн |
500+ | 105.89 грн |
1000+ | 101.08 грн |
2500+ | 97.84 грн |
PCA9550D,118 |
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Виробник: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 2
Frequency: 400kHz
Type: Linear
Operating Temperature: -40°C ~ 85°C (TA)
Current - Output / Channel: 25mA
Internal Switch(s): Yes
Supplier Device Package: 8-SO
Dimming: I2C
Voltage - Supply (Min): 2.3V
Voltage - Supply (Max): 5.5V
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
235+ | 93.83 грн |
MWCT1013AVLH |
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Виробник: NXP USA Inc.
Description: 15W MULTI-COIL AUTO PREMIUM L
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
Description: 15W MULTI-COIL AUTO PREMIUM L
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 800 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1286.11 грн |
10+ | 1138.17 грн |
25+ | 1091.05 грн |
160+ | 902.15 грн |
320+ | 857.87 грн |
480+ | 802.52 грн |
S32K358GHT1VPCSR |
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Виробник: NXP USA Inc.
Description: S32K358GHT1VPCSR
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: S32K358GHT1VPCSR
Packaging: Bulk
Package / Case: 172-QFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP-EP
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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S32K311NHT0MLFSR |
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Виробник: NXP USA Inc.
Description: S32K311NHT0MLFSR
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
Description: S32K311NHT0MLFSR
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K311NHT0MPASR |
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Виробник: NXP USA Inc.
Description: S32K311NHT0MPASR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Description: S32K311NHT0MPASR
Packaging: Bulk
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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BF1100WR,115 |
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Виробник: NXP USA Inc.
Description: RF MOSFET 9V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
Description: RF MOSFET 9V CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Technology: MOSFET (Metal Oxide)
Noise Figure: 2dB
Supplier Device Package: CMPAK-4
Voltage - Rated: 14 V
Voltage - Test: 9 V
Current - Test: 10 mA
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MC33774ATP1AE |
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Виробник: NXP USA Inc.
Description: MC33774ATP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
Description: MC33774ATP1AE
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 4 ~ 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature
Grade: Automotive
Qualification: AEC-Q100
на замовлення 234 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 862.96 грн |
10+ | 651.34 грн |
25+ | 606.61 грн |
160+ | 511.15 грн |
A5G26H110N-2496 |
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Виробник: NXP USA Inc.
Description: RF MOSFET 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA
Description: RF MOSFET 48V 6DFN
Packaging: Bulk
Package / Case: 6-LDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.496GHz ~ 2.69GHz
Power - Output: 15W
Gain: 17.7dB
Supplier Device Package: 6-PDFN (7x6.5)
Voltage - Rated: 125 V
Voltage - Test: 48 V
Current - Test: 50 mA
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MGD3100BM58EKR2 |
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Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
Description: IC GATE DRVR HALF-BRIDGE 32BSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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MC9S08DV60MLH |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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MC9S08DZ60MLC |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DZ60MLH |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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LD6816CX4/30P,315 |
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Виробник: NXP USA Inc.
Description: IC REG LINEAR 3V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
Description: IC REG LINEAR 3V 150MA 4WLCSP
Packaging: Bulk
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 150mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 3V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.075V @ 150mA
Protection Features: Over Current, Over Temperature, Transient Voltage
Current - Supply (Max): 250 µA
на замовлення 36000 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3328+ | 6.69 грн |
MPC8378VRAJFA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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P3T1035XUK-ARD |
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Виробник: NXP USA Inc.
Description: P3T1035XUK ARDUINO EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1035xUK
Description: P3T1035XUK ARDUINO EVAL BOARD
Packaging: Box
Function: Temperature
Type: Sensor
Contents: Board(s)
Utilized IC / Part: P3T1035xUK
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3886.90 грн |
MCIMX535DVP1C2R2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tape & Reel (TR)
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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MCIMX535DVP1C2 |
Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
на замовлення 412 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4443.41 грн |
10+ | 3532.93 грн |
84+ | 3163.46 грн |
168+ | 2893.80 грн |
MCIMX535DVV2C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Description: IC MPU I.MX53 1.2GHZ 529FBGA
Packaging: Tray
Package / Case: 529-FBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
Supplier Device Package: 529-FBGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2), USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR2, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 1.5Gbps (1)
Additional Interfaces: 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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LFTAS32KQM2A |
Виробник: NXP USA Inc.
Description: NXP S32K FAMILY 176 LQFP TARGET
Packaging: Bulk
For Use With/Related Products: S32K
Module/Board Type: Socket Module - LQFP
Description: NXP S32K FAMILY 176 LQFP TARGET
Packaging: Bulk
For Use With/Related Products: S32K
Module/Board Type: Socket Module - LQFP
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