Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36395) > Сторінка 562 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MKL02Z32VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFNDigiKey Programmable: Not Verified Number of I/O: 28 Supplier Device Package: 32-HVQFN (5x5) Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 14x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 48MHz Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE02Z32VLD2R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPDigiKey Programmable: Not Verified Number of I/O: 37 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tape & Reel (TR) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE02Z32VLD2R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPDigiKey Programmable: Not Verified Number of I/O: 37 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Cut Tape (CT) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE02Z32VLD4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPDigiKey Programmable: Not Verified Number of I/O: 37 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Tape & Reel (TR) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MKE02Z32VLD4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPDigiKey Programmable: Not Verified Number of I/O: 37 Supplier Device Package: 44-LQFP (10x10) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ EEPROM Size: 256 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 44-LQFP Packaging: Cut Tape (CT) |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| MKE15Z64VFP4R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 40VFQFNNumber of I/O: 36 Supplier Device Package: 40-HVQFN (5x5) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 8K x 8 Program Memory Size: 64KB (64K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
|
MKE04Z128VQH4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFPDigiKey Programmable: Not Verified Number of I/O: 58 Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MKE04Z128VQH4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFPDigiKey Programmable: Not Verified Number of I/O: 58 Supplier Device Package: 64-QFP (14x14) Peripherals: LVD, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 16x12b; D/A 2x6b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 64-QFP Packaging: Cut Tape (CT) |
на замовлення 456 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| MRF1K50H-27MHZ | NXP USA Inc. |
Description: MRF1K50H-27MHZPackaging: Bulk Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MRF1K50H-230MHZ | NXP USA Inc. |
Description: MRF1K50H-230MHZPackaging: Bulk Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
MRF8HP21130HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: Dual Power - Output: 28W Gain: 14dB Technology: LDMOS Supplier Device Package: NI-780S-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 360 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
P5020NSE7TNB | NXP USA Inc. |
Description: IC MPU QORIQ P5 2.0GHZ 1295BGAAdditional Interfaces: DUART, I2C, MMC/SD, SPI SATA: SATA 3Gbps (2) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection Graphics Acceleration: No RAM Controllers: DDR3, DDR3L Co-Processors/DSP: Security; SEC 4.2 Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2) Ethernet: 1Gbps (5), 10Gbps (1) Supplier Device Package: 1295-FCPBGA (37.5x37.5) Core Processor: PowerPC e5500 Operating Temperature: 0°C ~ 105°C (TA) Speed: 2.0GHz Mounting Type: Surface Mount Package / Case: 1295-BBGA, FCBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC33FS6504LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOSupplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
на замовлення 249 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
S9S12GN16J1MLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFP Number of I/O: 26 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: IrDA, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: S12 EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MCF5274LVF166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGADigiKey Programmable: Not Verified Number of I/O: 61 Supplier Device Package: 196-LBGA (15x15) Peripherals: DMA, WDT Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Core Size: 32-Bit Single-Core Core Processor: Coldfire V2 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: 0°C ~ 70°C RAM Size: 64K x 8 Speed: 166MHz Mounting Type: Surface Mount Package / Case: 196-LBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
SPC5744BSK1AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP DigiKey Programmable: Not Verified Number of I/O: 129 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, I2S, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 36x10b, 16x12b Core Processor: e200z4 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
S912XEG128BVAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
S912XEG128BVAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
FRDM-RW612 | NXP USA Inc. |
Description: EVAL BOARD FOR RW612Packaging: Box Frequency: 2.4GHz, 5GHz Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Contents: Board(s), Cable(s) Antenna Type: PCB Trace Antenna(s) On-Board Utilized IC / Part: RW612 |
на замовлення 137 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
74AUP2G34GF,132 | NXP USA Inc. |
Description: IC BUFF DL LOW PWR N-INV 6XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON, SOT891 (1x1) |
на замовлення 73750 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MMA9550LR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 16LGAFeatures: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor Packaging: Bulk Package / Case: 16-VFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Bandwidth: 1.9Hz ~ 244Hz Supplier Device Package: 16-LGA (3x3) Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g) |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MMA6255AKEG | NXP USA Inc. |
Description: IC SENSOR ACCEL DUAL AXIS 20SOICPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X, Y Acceleration Range: ±50g Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MC9328MX21SCVK | NXP USA Inc. |
Description: IC MPU I.MX21 266MHZ 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 289-LFBGA (14x14) USB: USB 1.x (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MCZ33897TEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOICDuplex: Half Receiver Hysteresis: 500 mV Supplier Device Package: 14-SOIC Protocol: CANbus Data Rate: 83.33Kbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 12V Operating Temperature: -40°C ~ 125°C Type: Transceiver Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
PVR100AZ-B12V,115 | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A SC-73Power - Max: 550 mW Voltage - Collector Emitter Breakdown (Max): 45 V Current - Collector (Ic) (Max): 100 mA Supplier Device Package: SC-73 DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Current - Collector Cutoff (Max): 100nA (ICBO) Operating Temperature: 150°C (TJ) Transistor Type: NPN + Zener Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Packaging: Bulk |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
PVR100AZ-B2V5,115 | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A SC-73Power - Max: 550 mW Voltage - Collector Emitter Breakdown (Max): 45 V Current - Collector (Ic) (Max): 100 mA Supplier Device Package: SC-73 DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Current - Collector Cutoff (Max): 100nA (ICBO) Operating Temperature: 150°C (TJ) Transistor Type: NPN + Zener Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Packaging: Bulk |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
PVR100AZ-B3V3,115 | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A SC-73Power - Max: 550 mW Voltage - Collector Emitter Breakdown (Max): 45 V Current - Collector (Ic) (Max): 100 mA Supplier Device Package: SC-73 DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Current - Collector Cutoff (Max): 100nA (ICBO) Operating Temperature: 150°C (TJ) Transistor Type: NPN + Zener Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Packaging: Bulk |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| NZX6V8C,133 | NXP USA Inc. |
Description: DIODE ZENER 6.8V 500MW ALF2Packaging: Bulk |
на замовлення 48290 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
|
MC68302CAG16VC | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 144LQFPAdditional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 144-LQFP (20x20) Voltage - I/O: 3.3V Core Processor: M68000 Operating Temperature: -40°C ~ 85°C (TA) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC68302CEH20C | NXP USA Inc. |
Description: IC MPU M683XX 20MHZ 132PQFPAdditional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 8/16-Bit Supplier Device Package: 132-PQFP (46x46) Voltage - I/O: 5.0V Core Processor: M68000 Operating Temperature: -40°C ~ 85°C (TA) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| J3R200PAU15/0ZB86V | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200PMU15/0ZB42V | NXP USA Inc. |
Description: J3R200PMU15/0ZB42V Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200PIU15/0ZA3FV | NXP USA Inc. |
Description: J3R200PIU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200PAU15/0ZA3FV | NXP USA Inc. |
Description: J3R200PAU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200P1U15/0ZA45V | NXP USA Inc. |
Description: J3R200P1U15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200PBU15/0ZA3FV | NXP USA Inc. |
Description: J3R200PBU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200BDU15/0ZB40V | NXP USA Inc. |
Description: J3R200BDU15/0ZB40V Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R200PPU15/0ZA7CV | NXP USA Inc. |
Description: J3R200PPU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R150PPU15/0ZA7CV | NXP USA Inc. |
Description: J3R150PPU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| J3R150PTU15/0ZA96V | NXP USA Inc. |
Description: J3R150PTU15 Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MMA2612KW | NXP USA Inc. |
Description: IC SENSOR ACCELEROMETER 16QFN Packaging: Tube Package / Case: 16-QFN Exposed Pad Mounting Type: Surface Mount Axis: X Acceleration Range: ±125g Voltage - Supply: 4.75V ~ 5.25V Bandwidth: 400Hz Supplier Device Package: 16-QFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MC68F375BGMVR33 | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 217PBGAPackaging: Tray Package / Case: 217-BBGA Mounting Type: Surface Mount Speed: 33MHz Program Memory Size: 256KB (256K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: CPU32 Data Converters: A/D 16x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Connectivity: CANbus, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 217-PBGA (23x23) Number of I/O: 48 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
MC908KX2CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16SOICDigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-SOIC Peripherals: LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 192 x 8 Program Memory Size: 2KB (2K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC908KX2CDWER | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 16SOICDigiKey Programmable: Not Verified Number of I/O: 13 Supplier Device Package: 16-SOIC Peripherals: LVD, POR, PWM Connectivity: SCI Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 4x8b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 192 x 8 Program Memory Size: 2KB (2K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
74ALVC244D,118 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 20SOPackaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Output Type: 3-State Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.65V ~ 3.6V Number of Bits per Element: 4 Current - Output High, Low: 24mA, 24mA Supplier Device Package: 20-SO |
на замовлення 2010 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MIMX8ML2DVNLZAB | NXP USA Inc. |
Description: MIMX8ML2DVNLZABPackaging: Bulk Package / Case: 548-LFBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 548-LFBGA (15x15) Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, RDC Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
на замовлення 630 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MIMX8ML5DVNLZAB | NXP USA Inc. |
Description: MIMX8ML5DVNLZABPackaging: Bulk Package / Case: 548-LFBGA Mounting Type: Surface Mount Speed: 1.8GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 548-LFBGA (15x15) Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, RDC Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
на замовлення 630 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MIMX8ML5CVNKZAB | NXP USA Inc. |
Description: MIMX8ML5CVNKZABSpeed: 1.6GHz Mounting Type: Surface Mount Package / Case: 548-LFBGA Packaging: Bulk Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART Security Features: ARM TZ, CAAM, RDC Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Graphics Acceleration: Yes RAM Controllers: DDR4, LPDDR4 Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP Number of Cores/Bus Width: 2 Core, 64-Bit USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Ethernet: GbE (2) Supplier Device Package: 548-LFBGA (15x15) Core Processor: ARM® Cortex®-A53 Operating Temperature: -40°C ~ 105°C (TJ) |
на замовлення 620 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MIMX8ML2CVNKZAB | NXP USA Inc. |
Description: MIMX8ML2CVNKZABPackaging: Bulk Package / Case: 548-LFBGA Mounting Type: Surface Mount Speed: 1.6GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A53 Supplier Device Package: 548-LFBGA (15x15) Ethernet: GbE (2) USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Security Features: ARM TZ, CAAM, RDC Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
на замовлення 298 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
|
MC34PF8100CHEPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 PRE-PRPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
MC34PF8100CHEP | NXP USA Inc. |
Description: IC POWER MANAGEMENT I.MX8QMPackaging: Tray Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
PN7642EV/C101Y | NXP USA Inc. |
Description: PN7642EV/C101YPackaging: Tape & Reel (TR) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC9S08SH8MTGR | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16TSSOPPackaging: Tape & Reel (TR) Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 13 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
LPC55S16JBD64K | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 64TQFPNumber of I/O: 36 Supplier Device Package: 64-HTQFP (10x10) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x16b SAR Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 96K x 8 Program Memory Size: 256KB (256K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Packaging: Tray |
на замовлення 800 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
SPC5746RK1MMT5R | NXP USA Inc. |
Description: IC MCU 32BIT 4MB FLASH 252MAPBGA Packaging: Tape & Reel (TR) Package / Case: 252-LFBGA Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 4MB (4M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 12b SAR, 16b Sigma-Delta Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, Zipwire Supplier Device Package: 252-MAPBGA (17x17) Grade: Automotive DigiKey Programmable: Not Verified Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
MC56F8255MLD | NXP USA Inc. |
Description: MICROCONTROLLER, 16-BIT, FLASH,Packaging: Bulk Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 64KB (32K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 8x12b; D/A 1x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 35 DigiKey Programmable: Not Verified |
на замовлення 160 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
MFS8412AMBP7ES | NXP USA Inc. |
Description: SAFETY POWER MANAGEMENT IC, QFN4Packaging: Tray Package / Case: 48-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 60V Applications: System Basis Chip Current - Supply: 15mA Supplier Device Package: 48-HVQFN (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| LFVBBOJ76Z1A | NXP USA Inc. |
Description: QORIVVA MPC5676R 522 PIN 1.0MM P Packaging: Bulk For Use With/Related Products: MPC5676R Accessory Type: Base Board |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
|
BC69-16PASX | NXP USA Inc. |
Description: TRANS PNP 20V 2A DFN2020D-3Packaging: Bulk Package / Case: 3-UDFN Exposed Pad Mounting Type: Surface Mount Transistor Type: PNP Operating Temperature: 150°C (TJ) Vce Saturation (Max) @ Ib, Ic: 600mV @ 200mA, 2A Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V Frequency - Transition: 140MHz Supplier Device Package: DFN2020D-3 Current - Collector (Ic) (Max): 2 A Voltage - Collector Emitter Breakdown (Max): 20 V Power - Max: 420 mW |
на замовлення 66000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
S912XEG384BCAA | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 80QFPPackaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. |
| MKL02Z32VFM4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 32KB FLASH 32QFN
DigiKey Programmable: Not Verified
Number of I/O: 28
Supplier Device Package: 32-HVQFN (5x5)
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 14x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 223.90 грн |
| 10+ | 162.12 грн |
| 25+ | 148.65 грн |
| 100+ | 125.61 грн |
| 250+ | 118.99 грн |
| 500+ | 115.00 грн |
| 1000+ | 109.88 грн |
| 2500+ | 106.47 грн |
| MKE02Z32VLD2R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1500+ | 155.16 грн |
| MKE02Z32VLD2R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 282.45 грн |
| 10+ | 205.09 грн |
| 25+ | 188.36 грн |
| 100+ | 159.53 грн |
| 250+ | 151.30 грн |
| 500+ | 146.34 грн |
| MKE02Z32VLD4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tape & Reel (TR)
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1500+ | 139.05 грн |
| MKE02Z32VLD4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 37
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
EEPROM Size: 256 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Cut Tape (CT)
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 280.86 грн |
| 10+ | 204.03 грн |
| 25+ | 187.36 грн |
| 100+ | 158.68 грн |
| 250+ | 150.50 грн |
| 500+ | 145.56 грн |
| MKE15Z64VFP4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Number of I/O: 36
Supplier Device Package: 40-HVQFN (5x5)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Number of I/O: 36
Supplier Device Package: 40-HVQFN (5x5)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 285.61 грн |
| 10+ | 207.68 грн |
| 25+ | 190.80 грн |
| 100+ | 161.63 грн |
| 250+ | 153.32 грн |
| 500+ | 148.31 грн |
| 1000+ | 141.83 грн |
| 2500+ | 137.55 грн |
| MKE04Z128VQH4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| MKE04Z128VQH4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 128KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 58
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b; D/A 2x6b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
на замовлення 456 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 352.86 грн |
| 10+ | 221.17 грн |
| 25+ | 219.87 грн |
| 100+ | 205.11 грн |
| 250+ | 194.86 грн |
| MRF8HP21130HSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
товару немає в наявності
В кошику
од. на суму грн.
| P5020NSE7TNB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Additional Interfaces: DUART, I2C, MMC/SD, SPI
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
Graphics Acceleration: No
RAM Controllers: DDR3, DDR3L
Co-Processors/DSP: Security; SEC 4.2
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 1Gbps (5), 10Gbps (1)
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Core Processor: PowerPC e5500
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2.0GHz
Mounting Type: Surface Mount
Package / Case: 1295-BBGA, FCBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC33FS6504LAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
на замовлення 249 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 731.03 грн |
| 10+ | 550.60 грн |
| 25+ | 512.18 грн |
| 100+ | 441.08 грн |
| S9S12GN16J1MLC |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Number of I/O: 26
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MCF5274LVF166 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C
RAM Size: 64K x 8
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
Description: IC MCU 32BIT ROMLESS 196MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 61
Supplier Device Package: 196-LBGA (15x15)
Peripherals: DMA, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Core Size: 32-Bit Single-Core
Core Processor: Coldfire V2
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C
RAM Size: 64K x 8
Speed: 166MHz
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| SPC5744BSK1AVKU2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 129
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| S912XEG128BVAAR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| S912XEG128BVAA |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| FRDM-RW612 |
![]() |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Antenna Type: PCB Trace Antenna(s) On-Board
Utilized IC / Part: RW612
Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Antenna Type: PCB Trace Antenna(s) On-Board
Utilized IC / Part: RW612
на замовлення 137 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1961.29 грн |
| 74AUP2G34GF,132 |
![]() |
Виробник: NXP USA Inc.
Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
на замовлення 73750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1845+ | 12.14 грн |
| MMA9550LR1 |
![]() |
Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 94+ | 216.90 грн |
| MMA6255AKEG |
![]() |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 24+ | 850.80 грн |
| MC9328MX21SCVK |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
товару немає в наявності
В кошику
од. на суму грн.
| MCZ33897TEF |
![]() |
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Duplex: Half
Receiver Hysteresis: 500 mV
Supplier Device Package: 14-SOIC
Protocol: CANbus
Data Rate: 83.33Kbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 12V
Operating Temperature: -40°C ~ 125°C
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| PVR100AZ-B12V,115 |
![]() |
Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 8.35 грн |
| PVR100AZ-B2V5,115 |
![]() |
Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 8.35 грн |
| PVR100AZ-B3V3,115 |
![]() |
Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
Description: TRANS NPN 45V 0.1A SC-73
Power - Max: 550 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Supplier Device Package: SC-73
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Current - Collector Cutoff (Max): 100nA (ICBO)
Operating Temperature: 150°C (TJ)
Transistor Type: NPN + Zener
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Bulk
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 8.35 грн |
| NZX6V8C,133 |
![]() |
на замовлення 48290 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 13172+ | 1.52 грн |
| MC68302CAG16VC |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.3V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MPU M683XX 16MHZ 144LQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 144-LQFP (20x20)
Voltage - I/O: 3.3V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC68302CEH20C |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PQFP (46x46)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
Description: IC MPU M683XX 20MHZ 132PQFP
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Supplier Device Package: 132-PQFP (46x46)
Voltage - I/O: 5.0V
Core Processor: M68000
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 132-BQFP Bumpered
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MMA2612KW |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±125g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±125g
Voltage - Supply: 4.75V ~ 5.25V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MC68F375BGMVR33 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 217PBGA
Packaging: Tray
Package / Case: 217-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: CANbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 217-PBGA (23x23)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 217PBGA
Packaging: Tray
Package / Case: 217-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: CPU32
Data Converters: A/D 16x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: CANbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 217-PBGA (23x23)
Number of I/O: 48
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC908KX2CDWE |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
товару немає в наявності
В кошику
од. на суму грн.
| MC908KX2CDWER |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 2KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 192 x 8
Program Memory Size: 2KB (2K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| 74ALVC244D,118 |
![]() |
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
Description: IC BUFFER NON-INVERT 3.6V 20SO
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Number of Bits per Element: 4
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 20-SO
на замовлення 2010 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1116+ | 20.37 грн |
| MIMX8ML2DVNLZAB |
![]() |
Виробник: NXP USA Inc.
Description: MIMX8ML2DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Description: MIMX8ML2DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
на замовлення 630 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3095.03 грн |
| 10+ | 2434.68 грн |
| 25+ | 2298.35 грн |
| 126+ | 1997.83 грн |
| 252+ | 1948.90 грн |
| MIMX8ML5DVNLZAB |
![]() |
Виробник: NXP USA Inc.
Description: MIMX8ML5DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Description: MIMX8ML5DVNLZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
на замовлення 630 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2842.65 грн |
| 10+ | 2245.28 грн |
| 25+ | 2182.67 грн |
| MIMX8ML5CVNKZAB |
![]() |
Виробник: NXP USA Inc.
Description: MIMX8ML5CVNKZAB
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Bulk
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
Description: MIMX8ML5CVNKZAB
Speed: 1.6GHz
Mounting Type: Surface Mount
Package / Case: 548-LFBGA
Packaging: Bulk
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Security Features: ARM TZ, CAAM, RDC
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Graphics Acceleration: Yes
RAM Controllers: DDR4, LPDDR4
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
Number of Cores/Bus Width: 2 Core, 64-Bit
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Ethernet: GbE (2)
Supplier Device Package: 548-LFBGA (15x15)
Core Processor: ARM® Cortex®-A53
Operating Temperature: -40°C ~ 105°C (TJ)
на замовлення 620 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3084.74 грн |
| 10+ | 2442.75 грн |
| 25+ | 2384.75 грн |
| MIMX8ML2CVNKZAB |
![]() |
Виробник: NXP USA Inc.
Description: MIMX8ML2CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
Description: MIMX8ML2CVNKZAB
Packaging: Bulk
Package / Case: 548-LFBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 548-LFBGA (15x15)
Ethernet: GbE (2)
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, RDC
Additional Interfaces: CAN, I2C, I2S, PCIe, SD/SDIO, SPI, UART
на замовлення 298 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2911.48 грн |
| 10+ | 2289.16 грн |
| 25+ | 2160.58 грн |
| 126+ | 1877.55 грн |
| 252+ | 1831.37 грн |
| MC34PF8100CHEPR2 |
![]() |
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 PRE-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| MC34PF8100CHEP |
![]() |
Виробник: NXP USA Inc.
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: IC POWER MANAGEMENT I.MX8QM
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
товару немає в наявності
В кошику
од. на суму грн.
| PN7642EV/C101Y |
![]() |
Виробник: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7642EV/C101Y
Packaging: Tape & Reel (TR)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
товару немає в наявності
В кошику
од. на суму грн.
| MC9S08SH8MTGR |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 13
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| LPC55S16JBD64K |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Number of I/O: 36
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 256KB FLASH 64TQFP
Number of I/O: 36
Supplier Device Package: 64-HTQFP (10x10)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x16b SAR
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 96K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Packaging: Tray
на замовлення 800 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 340.99 грн |
| 10+ | 290.95 грн |
| 25+ | 277.53 грн |
| 40+ | 254.16 грн |
| 80+ | 245.17 грн |
| 230+ | 233.30 грн |
| SPC5746RK1MMT5R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Description: IC MCU 32BIT 4MB FLASH 252MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 252-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 12b SAR, 16b Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 252-MAPBGA (17x17)
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| MC56F8255MLD |
![]() |
Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 16-BIT, FLASH,
Packaging: Bulk
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 64KB (32K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 8x12b; D/A 1x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 35
DigiKey Programmable: Not Verified
на замовлення 160 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 34+ | 597.70 грн |
| MFS8412AMBP7ES |
![]() |
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SAFETY POWER MANAGEMENT IC, QFN4
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику
од. на суму грн.
| LFVBBOJ76Z1A |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5676R 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Base Board
Description: QORIVVA MPC5676R 522 PIN 1.0MM P
Packaging: Bulk
For Use With/Related Products: MPC5676R
Accessory Type: Base Board
товару немає в наявності
В кошику
од. на суму грн.
| BC69-16PASX |
![]() |
Виробник: NXP USA Inc.
Description: TRANS PNP 20V 2A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
Frequency - Transition: 140MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 420 mW
Description: TRANS PNP 20V 2A DFN2020D-3
Packaging: Bulk
Package / Case: 3-UDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 200mA, 2A
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 85 @ 500mA, 1V
Frequency - Transition: 140MHz
Supplier Device Package: DFN2020D-3
Current - Collector (Ic) (Max): 2 A
Voltage - Collector Emitter Breakdown (Max): 20 V
Power - Max: 420 mW
на замовлення 66000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3776+ | 6.07 грн |
| S912XEG384BCAA |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.






























