Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (37085) > Сторінка 564 з 619
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
TDA8029HL/C206,118 | NXP USA Inc. |
 Description: IC INTERFACE SPECIALIZED 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 2.7V ~ 6V Applications: Smart Card Supplier Device Package: 32-LQFP (7x7) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
 |
UBX100AHN/00200Y | NXP USA Inc. |
Description: SUB-GHZ RF TRANSCEIVER Packaging: Tape & Reel (TR) Package / Case: 48-VFQFN Exposed Pad Sensitivity: -128dBm Mounting Type: Surface Mount Frequency: 1GHz Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.9V ~ 3.6V Power - Output: 14dBm Data Rate (Max): 2Mbps Supplier Device Package: 48-HVQFN (7x7) RF Family/Standard: General ISM < 1GHz Serial Interfaces: SPI |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||||||
 |
SJA1110AEL/1Y | NXP USA Inc. |
Description: SJA1110AEL/1Y Packaging: Tape & Reel (TR) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
SJA1110AEL/1Y | NXP USA Inc. |
Description: SJA1110AEL/1Y Packaging: Cut Tape (CT) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
на замовлення 497 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
| SJA1110CEL/1Y | NXP USA Inc. |
Description: SJA1110CEL/1Y Packaging: Tape & Reel (TR) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||
| SJA1110CEL/1Y | NXP USA Inc. |
Description: SJA1110CEL/1Y Packaging: Cut Tape (CT) Package / Case: 256-LFBGA Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Protocol: Ethernet Standards: 10/100 Base-T/TX PHY Supplier Device Package: 256-LFBGA (14x14) DigiKey Programmable: Not Verified |
на замовлення 330 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
 |
CGY1032,112 | NXP USA Inc. |
Description: IC AMP CATV SOT115J Packaging: Bulk Package / Case: SOT-115J Mounting Type: Chassis Mount Applications: CATV Supplier Device Package: SOT115J Number of Circuits: 1 Current - Supply: 265 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
MPC8314CVRAFDA | NXP USA Inc. |
Description: IC MPU MPC83XX 333MHZ 620HBGA Packaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300c3 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR, DDR2 Graphics Acceleration: No Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM |
товару немає в наявності |
Мінімальне замовлення: 180 шт В кошику од. на суму грн. | ||||||||||||||||
| SC33PF8200KKES | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
 |
MFS2613AMDH3AD | NXP USA Inc. |
Description: MFS2613AMDH3AD Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 3.2V ~ 36V Applications: System Basis Chip Supplier Device Package: 48-LQFP-EP (7x7) |
на замовлення 487 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
PBLS1503V,115 | NXP USA Inc. |
Description: TRANS PREBIAS 1NPN 1PNP SOT-666 Packaging: Tape & Reel (TR) Package / Case: SOT-563, SOT-666 Mounting Type: Surface Mount Transistor Type: 1 NPN Pre-Biased, 1 PNP Power - Max: 300mW Current - Collector (Ic) (Max): 100mA, 500mA Voltage - Collector Emitter Breakdown (Max): 50V, 15V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 1µA, 100nA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V Frequency - Transition: 280MHz Resistor - Base (R1): 10kOhms Resistor - Emitter Base (R2): 10kOhms Supplier Device Package: SOT-666 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
MC33776ATA1AER2 | NXP USA Inc. |
Description: BATTERY JUNCTION BOX CONTROLLER Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: TPL Operating Temperature: -40°C ~ 150°C (TJ) Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Current, Over/Under Voltage |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
MC33778ASA1AER2 | NXP USA Inc. |
Description: BATTERY JUNCTION BOX CONTROLLER Packaging: Tape & Reel (TR) Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Current, Over/Under Voltage |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
MC33778ASA1AE | NXP USA Inc. |
Description: BATTERY JUNCTION BOX CONTROLLER Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: SPI Operating Temperature: -40°C ~ 150°C (TJ) Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Current, Over/Under Voltage |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
MC33778ATA1AE | NXP USA Inc. |
Description: BATTERY JUNCTION BOX CONTROLLER Packaging: Tray Package / Case: 64-LQFP Exposed Pad Mounting Type: Surface Mount Function: Battery Monitor Interface: TPL Operating Temperature: -40°C ~ 150°C (TJ) Supplier Device Package: 64-LQFP (10x10) Fault Protection: Over Current, Over/Under Voltage |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||||
| RD-K358WBMU | NXP USA Inc. |
Description: RD-K358WBMU Packaging: Bulk Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
NT4PLDJUK/20038YZ | NXP USA Inc. |
Description: WLCSP16 Packaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 105°C (TA) Standards: ISO 14443-4, ISO 7816-4, NFC Supplier Device Package: 16-WLCSP (1.84x1.87) |
товару немає в наявності |
Мінімальне замовлення: 10000 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
NT4PLDJUK/20038YZ | NXP USA Inc. |
Description: WLCSP16 Packaging: Cut Tape (CT) Package / Case: 16-UFBGA, WLCSP Mounting Type: Surface Mount Frequency: 13.56MHz Type: RFID Transponder Operating Temperature: -40°C ~ 105°C (TA) Standards: ISO 14443-4, ISO 7816-4, NFC Supplier Device Package: 16-WLCSP (1.84x1.87) |
на замовлення 7409 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
MC35FS6517NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
MC35FS6517NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||||||
 |
MC9S08EL16CTLR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOP Packaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||||||
| SPF5020AMBACESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||||||
| SC33PF8100CCESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||
| SC33PF8100JCESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||
| SC33PF8200KCESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||
| MVR5510AMBA4TSR2 | NXP USA Inc. |
Description: PMIC, 3BUCK , 3 LDOS,BOOST Packaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 2.7V ~ 60V Current - Supply: 15mA Supplier Device Package: 56-HVQFN (8x8) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||||||
 |
74ABT125N,602 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 14-DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 14-DIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MIMX9321CVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 1300 шт В кошику од. на суму грн. | |||||||||||||||||
| MIMX9312XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
| MIMX9322CVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
| MIMX9321XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
| MIMX9322XVXXMBB | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
| MIMX9322XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
| MIMX9322XVXXMBC | NXP USA Inc. |
Description: I.MX93 BGA9 Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||||||
 |
TJA1120AHN/0J | NXP USA Inc. |
Description: ICETHERNET PHY TXRX 36-HVQFN Packaging: Tape & Reel (TR) |
на замовлення 8000 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
|
|
TJA1120AHN/0J | NXP USA Inc. |
Description: ICETHERNET PHY TXRX 36-HVQFN Packaging: Cut Tape (CT) |
на замовлення 10253 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
MC68340CAG25E | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: CPU32 Voltage - I/O: 5.0V Supplier Device Package: 144-LQFP (20x20) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| P3H2841HN-ARD | NXP USA Inc. |
Description: P3H2841HN-ARD Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MCIMX31DVMN5D | NXP USA Inc. |
Description: I.MX31 32-BIT MPU, ARM1136JF-S C Packaging: Bulk |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
| LFJ34INTPQA | NXP USA Inc. |
Description: QORIVVA MPC5634M ON A 208 BGA TO Packaging: Bulk Module/Board Type: Socket Adapter Utilized IC / Part: MPC5634M |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
 |
QN9083DUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 47WLSCP Packaging: Tape & Reel (TR) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 32MHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Data Rate (Max): 16Mbps Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||||
|
|
QN9083DUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 47WLSCP Packaging: Cut Tape (CT) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 32MHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Data Rate (Max): 16Mbps Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB DigiKey Programmable: Not Verified |
на замовлення 216 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
MC34PF1550A2EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGS Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||||
 |
MC908QT1AMDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SO Packaging: Tube Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
MC908QT1AMDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
P2041NSN7MMC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA Packaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
MCIMX6L8DVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA Packaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||||
 |
FS32K148UJT0VMHR | NXP USA Inc. |
Description: S32K148 ARM CORTEX-M4F, 112 MHZ, Packaging: Tape & Reel (TR) Package / Case: 100-LFBGA Mounting Type: Surface Mount Speed: 112MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 100-MAPBGA (11x11) Number of I/O: 89 |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||||||
 |
MCF5483CVR166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 166MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V4E Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 99 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||||||
| TJA1465B-EVB | NXP USA Inc. |
Description: TJA1465B-EVB Packaging: Bulk Function: CANbus Type: Interface Contents: Board(s) Utilized IC / Part: TJA1465B |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MCDXTM4CK344 | NXP USA Inc. |
Description: MCDXTM4CK344 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SAF4000EL/101Q53BY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5342 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||||
 |
FS32K148HET0VLLT | NXP USA Inc. |
Description: S32K148 32-BIT MCU, ARM CORTEX-M Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 156 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
 |
PCAL9722HNHP | NXP USA Inc. |
Description: PCAL9722HN Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
|
|
PCAL9722HN/Q900HP | NXP USA Inc. |
Description: PCAL9722HN/Q900 Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| A3T19H455W23SR6 | NXP USA Inc. |
Description: RF MOSFET Packaging: Bulk |
на замовлення 1036 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
 |
LS1048ASN7PTA | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||||||
 |
MC56F8122VFAE | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (16K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 6x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||||
| T2081NSN8T1B | NXP USA Inc. |
Description: QORIQ T2080 AND T2081 MULTICORE Packaging: Bulk |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||||
|
|
MKV30F64VLF10 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 64KB (64K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 2x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 35 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. |
| TDA8029HL/C206,118 |
|
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| UBX100AHN/00200Y |
|
Виробник: NXP USA Inc.
Description: SUB-GHZ RF TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -128dBm
Mounting Type: Surface Mount
Frequency: 1GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 14dBm
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
Description: SUB-GHZ RF TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -128dBm
Mounting Type: Surface Mount
Frequency: 1GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 14dBm
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| SJA1110AEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110AEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110AEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| SJA1110AEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110AEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110AEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 497 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1424.42 грн |
| 10+ | 1091.77 грн |
| 25+ | 1021.76 грн |
| 100+ | 895.23 грн |
| 250+ | 844.56 грн |
| SJA1110CEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110CEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110CEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| SJA1110CEL/1Y |
Виробник: NXP USA Inc.
Description: SJA1110CEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
Description: SJA1110CEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 330 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1169.37 грн |
| 10+ | 893.05 грн |
| 25+ | 834.98 грн |
| 100+ | 727.93 грн |
| CGY1032,112 |
|
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 265 mA
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 265 mA
товару немає в наявності
В кошику
од. на суму грн.
| MPC8314CVRAFDA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
товару немає в наявності
Мінімальне замовлення: 180 шт
В кошику
од. на суму грн.
| MFS2613AMDH3AD |
|
Виробник: NXP USA Inc.
Description: MFS2613AMDH3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
Description: MFS2613AMDH3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
на замовлення 487 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 595.91 грн |
| 10+ | 445.48 грн |
| 25+ | 413.48 грн |
| 100+ | 360.58 грн |
| PBLS1503V,115 |
|
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
товару немає в наявності
В кошику
од. на суму грн.
| MC33776ATA1AER2 |
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MC33778ASA1AER2 |
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MC33778ASA1AE |
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| MC33778ATA1AE |
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| NT4PLDJUK/20038YZ |
|
Виробник: NXP USA Inc.
Description: WLCSP16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
Description: WLCSP16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
товару немає в наявності
Мінімальне замовлення: 10000 шт
В кошику
од. на суму грн.
| NT4PLDJUK/20038YZ |
|
Виробник: NXP USA Inc.
Description: WLCSP16
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
Description: WLCSP16
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
на замовлення 7409 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 131.53 грн |
| 10+ | 109.59 грн |
| 25+ | 103.40 грн |
| 100+ | 89.06 грн |
| 250+ | 84.28 грн |
| 500+ | 80.91 грн |
| 1000+ | 76.45 грн |
| 5000+ | 69.85 грн |
| MC35FS6517NAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC35FS6517NAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| MC9S08EL16CTLR |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| MVR5510AMBA4TSR2 |
|
Виробник: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| 74ABT125N,602 |
|
Виробник: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 14-DIP
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 14-DIP
товару немає в наявності
В кошику
од. на суму грн.
| MIMX9321CVXXMAC |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 1300 шт
В кошику
од. на суму грн.
| MIMX9312XVXXMAC |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322CVXXMAC |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9321XVXXMAC |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322XVXXMBB |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322XVXXMAC |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322XVXXMBC |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| TJA1120AHN/0J |
|
на замовлення 8000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4000+ | 175.20 грн |
| TJA1120AHN/0J |
|
на замовлення 10253 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 317.61 грн |
| 10+ | 231.93 грн |
| 25+ | 213.41 грн |
| 100+ | 181.19 грн |
| 250+ | 172.08 грн |
| 500+ | 171.80 грн |
| MC68340CAG25E |
|
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX31DVMN5D |
|
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 7719.95 грн |
| LFJ34INTPQA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
товару немає в наявності
В кошику
од. на суму грн.
| QN9083DUKZ |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| QN9083DUKZ |
|
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 216 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 733.06 грн |
| 10+ | 612.61 грн |
| 25+ | 580.27 грн |
| 100+ | 502.84 грн |
| MC34PF1550A2EP |
|
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 522.93 грн |
| 10+ | 387.94 грн |
| 25+ | 359.13 грн |
| 100+ | 307.29 грн |
| 490+ | 284.78 грн |
| MC908QT1AMDWE |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MC908QT1AMDWER |
|
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| P2041NSN7MMC |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX6L8DVN10AA |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| FS32K148UJT0VMHR |
|
Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MCF5483CVR166 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| TJA1465B-EVB |
Виробник: NXP USA Inc.
Description: TJA1465B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1465B
Description: TJA1465B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1465B
товару немає в наявності
В кошику
од. на суму грн.
| SAF4000EL/101Q53BY |
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| FS32K148HET0VLLT |
|
Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
товару немає в наявності
В кошику
од. на суму грн.
| PCAL9722HNHP |
|
Виробник: NXP USA Inc.
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| PCAL9722HN/Q900HP |
|
Виробник: NXP USA Inc.
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
товару немає в наявності
В кошику
од. на суму грн.
| A3T19H455W23SR6 |
|
на замовлення 1036 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 10744.48 грн |
| LS1048ASN7PTA |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику
од. на суму грн.
| MC56F8122VFAE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.
| T2081NSN8T1B |
|
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 23830.91 грн |
| MKV30F64VLF10 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
од. на суму грн.