Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36395) > Сторінка 564 з 607
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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| SAF776DEL/200ZK | NXP USA Inc. |
Description: SAF776DEL Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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IP4352CX24/LF,135 | NXP USA Inc. |
Description: TVS DIODE 24WLCSPPackaging: Bulk |
на замовлення 841500 шт: термін постачання 21-31 дні (днів) |
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MPC8541EVTAJD | NXP USA Inc. |
Description: IC MPU MPC85XX 533MHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 533MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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BB152,115 | NXP USA Inc. |
Description: DIODE VHF VAR CAP 32V SOD323Packaging: Cut Tape (CT) Package / Case: SC-76, SOD-323 Mounting Type: Surface Mount Diode Type: Single Operating Temperature: -55°C ~ 125°C (TJ) Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz Capacitance Ratio Condition: C1/C28 Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 32 V Capacitance Ratio: 22.0 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC852TZT100A | NXP USA Inc. |
Description: POWERQUICC RISC MICROPROCESSOR,Packaging: Bulk |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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MPC852TZT100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 256BGAPackaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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K32L2A31VLL1A | NXP USA Inc. |
Description: K32 L2A 100LQFPPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 256KB (256K x 8) RAM Size: 128K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB Peripherals: DMA, LCD, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX5P1000UKZ | NXP USA Inc. |
Description: NX5P1000 - LOGIC CONTROLLED HIGHPackaging: Bulk |
на замовлення 17231 шт: термін постачання 21-31 дні (днів) |
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| S9KEAZN8ACFKR | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 24QFNDigiKey Programmable: Not Verified Number of I/O: 22 Supplier Device Package: 24-QFN (4x4) Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SE052F2HN2/Z019HJ | NXP USA Inc. |
Description: SE052F2HN2/Z019HJPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCF51JE128CMB | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGADigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 81-MAPBGA (10x10) Peripherals: LVD, PWM, WDT Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b; D/A 1x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 81-LBGA Packaging: Box |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW610BUK/A2IZ | NXP USA Inc. |
Description: RW610BUK/A2IZPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW610BHN/A2IMP | NXP USA Inc. |
Description: RW610BHN/A2IMPPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW610BHN/A2IK | NXP USA Inc. |
Description: RW610BHN/A2IKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW610BET/A2IY | NXP USA Inc. |
Description: RW610BET/A2IYPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW610BET/A2IK | NXP USA Inc. |
Description: RW610BET/A2IKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW612CHN/A2IMP | NXP USA Inc. |
Description: RW612CHN/A2IMPPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW612CHN/A2IK | NXP USA Inc. |
Description: RW612CHN/A2IKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW612CET/A2IY | NXP USA Inc. |
Description: RW612CET/A2IYPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RW612CET/A2IK | NXP USA Inc. |
Description: RW612CET/A2IKPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74LVC1G384GXH | NXP USA Inc. |
Description: IC SWITCH SPST-NCX1 10OHM 5X2SONNumber of Circuits: 1 Current - Leakage (IS(off)) (Max): 5µA Channel Capacitance (CS(off), CD(off)): 5pF Switch Time (Ton, Toff) (Max): 4.2ns, 5ns Multiplexer/Demultiplexer Circuit: 1:1 Switch Circuit: SPST - NC Charge Injection: 7.5pC Voltage - Supply, Single (V+): 1.65V ~ 5.5V Supplier Device Package: 5-X2SON (0.80x0.80) -3db Bandwidth: 500MHz On-State Resistance (Max): 10Ohm Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 4-XFDFN Exposed Pad Packaging: Bulk |
на замовлення 833262 шт: термін постачання 21-31 дні (днів) |
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SE051C2HQ1/Z01XDZ | NXP USA Inc. |
Description: SE051C2HQ1Packaging: Cut Tape (CT) Package / Case: 20-XFQFN Exposed Pad Mounting Type: Surface Mount Type: IoT Secure Element Supplier Device Package: 20-HX2QFN (3x3) |
на замовлення 1478 шт: термін постачання 21-31 дні (днів) |
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BGU8019X | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSONPackaging: Tape & Reel (TR) Supplier Device Package: 6-XSON (1.1x0.7) Test Frequency: 1.575GHz P1dB: -7dBm Noise Figure: 0.55dB Current - Supply: 4.6mA Gain: 18.5dB Voltage - Supply: 1.5V ~ 3.1V RF Type: Galileo, GLONASS, GPS Frequency: 1.559GHz ~ 1.61GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN |
на замовлення 45000 шт: термін постачання 21-31 дні (днів) |
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BGU8019X | NXP USA Inc. |
Description: IC AMP GALI 1.559-1.61GHZ 6XSONSupplier Device Package: 6-XSON (1.1x0.7) Test Frequency: 1.575GHz P1dB: -7dBm Noise Figure: 0.55dB Current - Supply: 4.6mA Gain: 18.5dB Voltage - Supply: 1.5V ~ 3.1V RF Type: Galileo, GLONASS, GPS Frequency: 1.559GHz ~ 1.61GHz Mounting Type: Surface Mount Package / Case: 6-XFDFN Packaging: Cut Tape (CT) |
на замовлення 45192 шт: термін постачання 21-31 дні (днів) |
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PZU8.2B,115 | NXP USA Inc. |
Description: DIODE ZENER 8.2V 310MW SOD323FPackaging: Bulk |
на замовлення 25464 шт: термін постачання 21-31 дні (днів) |
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S9S08QD2J1MSC | NXP USA Inc. |
Description: IC MCU 8BIT 2KB FLASH 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Speed: 16MHz Program Memory Size: 2KB (2K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 4x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 8-SOIC Number of I/O: 4 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC68020CRC25E | NXP USA Inc. |
Description: IC MPU M680X0 25MHZ 114PGAPackaging: Tray Package / Case: 114-BPGA Mounting Type: Through Hole Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: 68020 Voltage - I/O: 5.0V Supplier Device Package: 114-PGA (34.55x34.55) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| S912ZVC64ACLFR | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Grade: Automotive Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 10x10b SAR Core Processor: S12Z EEPROM Size: 1K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Number of I/O: 28 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| S912ZVC64ACLF | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 48LQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 32MHz Program Memory Size: 64KB (64K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: S12Z Data Converters: A/D 10x10b SAR Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 48-LQFP (7x7) Grade: Automotive Number of I/O: 28 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| FH32K144HAT0MLFT | NXP USA Inc. |
Description: S32K144, 512K FLASH, 64K RAM Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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LPC11U37HFBD64/4QL | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 10K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 54 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC7448HX1250ND | NXP USA Inc. |
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGAPackaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.5V, 1.8V, 2.5V Supplier Device Package: 360-FCCBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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P3A9606JK-EVB | NXP USA Inc. |
Description: EVAL BOARD FOR P3A9606Embedded: No Primary Attributes: 2-Channel (Dual) Utilized IC / Part: P3A9606 Contents: Board(s) Type: Interface Function: Level Shifter Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74AUP1G07GX,125 | NXP USA Inc. |
Description: IC BUFFER NON-INVERT 3.6V 5X2SONPackaging: Bulk Package / Case: 4-XFDFN Exposed Pad Output Type: Open Drain Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: -, 4mA Supplier Device Package: 5-X2SON (0.80x0.80) |
на замовлення 9500 шт: термін постачання 21-31 дні (днів) |
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MC9S08LC36LH | NXP USA Inc. |
Description: IC MCU 8BIT 36KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 36KB (36K x 8) RAM Size: 2.5K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 18 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC9S08LC36LH | NXP USA Inc. |
Description: MICROCONTROLLER, 8-BIT, HC08/S08Packaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 36KB (36K x 8) RAM Size: 2.5K x 8 Operating Temperature: 0°C ~ 70°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 2x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 18 DigiKey Programmable: Not Verified |
на замовлення 700 шт: термін постачання 21-31 дні (днів) |
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| ON5200,118 | NXP USA Inc. |
Description: RF MOSFET D2PAK Packaging: Tape & Reel (TR) Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB Mounting Type: Surface Mount Supplier Device Package: D2PAK |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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S912XEP100J5CAG | NXP USA Inc. |
Description: IC MCU 16BIT 1MB FLASH 144LQFP DigiKey Programmable: Not Verified Number of I/O: 119 Supplier Device Package: 144-LQFP (20x20) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x12b Core Processor: HCS12X EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 1MB (1M x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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74LVC623AD,118 | NXP USA Inc. |
Description: IC TXRX NON-INVERT 3.6V 20SOSupplier Device Package: 20-SO Current - Output High, Low: 24mA, 24mA Number of Bits per Element: 8 Voltage - Supply: 1.2V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Bulk |
на замовлення 3220 шт: термін постачання 21-31 дні (днів) |
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MC35FS6507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCOQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC35FS6507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCOQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33AR6000BGT | NXP USA Inc. |
Description: IC REG ALTERNATOR 1OUT TO220-5Grade: Automotive Supplier Device Package: TO-220-5 Applications: Alternator, 3-Phase Operating Temperature: -40°C ~ 125°C (TA) Voltage - Input: 5V ~ 16.5V Number of Outputs: 1 Mounting Type: Through Hole Voltage - Output: 10.6V ~ 16V Package / Case: TO-220-5 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MK20DX256VLK10R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFPPackaging: Tape & Reel (TR) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MK20DX256VLK10R | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLASH 80FQFPPackaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 100MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 27x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 80-FQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
на замовлення 500 шт: термін постачання 21-31 дні (днів) |
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| A3T21H456W23SR6 | NXP USA Inc. |
Description: RF MOSFET LDMOSPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| RDA777T2 | NXP USA Inc. |
Description: RDA777T2 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MF1PH4230DA4/00J | NXP USA Inc. |
Description: MIFAREA PLUS EV2Operating Temperature: -25°C ~ 85°C (TA) Type: RFID Reader Frequency: 13.56MHz Mounting Type: Surface Mount Package / Case: MOA4, Smart Card Module Packaging: Tape & Reel (TR) Supplier Device Package: PLLMC Standards: Mifare, NFC |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SPC5643AF0MVZ2 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLASH 324PBGADigiKey Programmable: Not Verified Number of I/O: 151 Supplier Device Package: 324-PBGA (23x23) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V Core Size: 32-Bit Single-Core Data Converters: A/D 40x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 3MB (3M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 324-BBGA Packaging: Tray |
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В кошику од. на суму грн. | ||||||||||||||
| S32G233ASBK0VUCT | NXP USA Inc. |
Description: S32G233A ARM CORTEX-M7 AND -A53,Package / Case: 525-FBGA, FCBGA Packaging: Tray Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No RAM Controllers: DDR3L, LPDDR4 Co-Processors/DSP: Multimedia; NEON Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit USB: USB 2.0 OTG (1) Ethernet: GbE (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz, 1GHz Mounting Type: Surface Mount Qualification: AEC-Q100 Grade: Automotive |
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В кошику од. на суму грн. | |||||||||||||||
| SLS1046ASN8T1A | NXP USA Inc. |
Description: SLS1046A ST 1.8GHZ DDR 2100 MT/ Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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TDA8034T/C1,112 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 16SOSupplier Device Package: 16-SO Voltage - Supply: 3V, 5V Interface: Analog Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Packaging: Tube |
на замовлення 653 шт: термін постачання 21-31 дні (днів) |
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MC9S12GC64MFUE | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 80QFPCore Processor: HCS12 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Program Memory Size: 64KB (64K x 8) Speed: 25MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 60 Supplier Device Package: 80-QFP (14x14) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b |
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В кошику од. на суму грн. | ||||||||||||||
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MC35FS6518CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOApplications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) |
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В кошику од. на суму грн. | ||||||||||||||
| S32G234MSBK1VUCR | NXP USA Inc. |
Description: S32G234M ARM CORTEX-M7, HSE W/PRQualification: AEC-Q100 Grade: Automotive Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No Co-Processors/DSP: Multimedia; NEON Number of Cores/Bus Width: 3 Core, 32/64-Bit Ethernet: 1/2.5Gbps (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tape & Reel (TR) |
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В кошику од. на суму грн. | |||||||||||||||
| NCK2982RHN/10101Y | NXP USA Inc. |
Description: NCK2982RHN Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MIMX8UD7CVP08SC | NXP USA Inc. |
Description: I.MX8ULP, DUAL 800MHZSupplier Device Package: 485-LFBGA (15x15) Mounting Type: Surface Mount Package / Case: 485-LFBGA Packaging: Tray |
на замовлення 170 шт: термін постачання 21-31 дні (днів) |
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MPF5020CMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 3Packaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 40-HVQFN (6x6) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 487 шт: термін постачання 21-31 дні (днів) |
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MPF5024CMBA0ES | NXP USA Inc. |
Description: POWER MANAGEMENT IC, PRE-PROG, 4Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 40-HVQFN (6x6) Applications: High Performance i.MX 8 Processor Based Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Tray |
на замовлення 480 шт: термін постачання 21-31 дні (днів) |
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MPF7100BVMA3ES | NXP USA Inc. |
Description: PF7100 PMIC I.MX8DXP/DXQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HVQFN (7x7) Current - Supply: 10µA Applications: i.MX Processors Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 48-VFQFN Exposed Pad Packaging: Tray |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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MIMX8US5DVP08SC | NXP USA Inc. |
Description: I.MX8ULP, SOLO 800MHZPackaging: Tray Package / Case: 485-LFBGA Mounting Type: Surface Mount Supplier Device Package: 485-LFBGA (15x15) |
на замовлення 530 шт: термін постачання 21-31 дні (днів) |
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| IP4352CX24/LF,135 |
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на замовлення 841500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 606+ | 37.87 грн |
| MPC8541EVTAJD |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI
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| BB152,115 |
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Виробник: NXP USA Inc.
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
Description: DIODE VHF VAR CAP 32V SOD323
Packaging: Cut Tape (CT)
Package / Case: SC-76, SOD-323
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 2.89pF @ 28V, 1MHz
Capacitance Ratio Condition: C1/C28
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 32 V
Capacitance Ratio: 22.0
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| MPC852TZT100A |
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на замовлення 57 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 12+ | 2004.81 грн |
| MPC852TZT100A |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
Description: IC MPU MPC8XX 100MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, PCMCIA, SPI, UART
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В кошику
од. на суму грн.
| K32L2A31VLL1A |
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Виробник: NXP USA Inc.
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Description: K32 L2A 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals: DMA, LCD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
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| NX5P1000UKZ |
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на замовлення 17231 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 379+ | 53.98 грн |
| S9KEAZN8ACFKR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8KB FLASH 24QFN
DigiKey Programmable: Not Verified
Number of I/O: 22
Supplier Device Package: 24-QFN (4x4)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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| MCF51JE128CMB |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
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| 74LVC1G384GXH |
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Виробник: NXP USA Inc.
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 5µA
Channel Capacitance (CS(off), CD(off)): 5pF
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 7.5pC
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Supplier Device Package: 5-X2SON (0.80x0.80)
-3db Bandwidth: 500MHz
On-State Resistance (Max): 10Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 4-XFDFN Exposed Pad
Packaging: Bulk
Description: IC SWITCH SPST-NCX1 10OHM 5X2SON
Number of Circuits: 1
Current - Leakage (IS(off)) (Max): 5µA
Channel Capacitance (CS(off), CD(off)): 5pF
Switch Time (Ton, Toff) (Max): 4.2ns, 5ns
Multiplexer/Demultiplexer Circuit: 1:1
Switch Circuit: SPST - NC
Charge Injection: 7.5pC
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Supplier Device Package: 5-X2SON (0.80x0.80)
-3db Bandwidth: 500MHz
On-State Resistance (Max): 10Ohm
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 4-XFDFN Exposed Pad
Packaging: Bulk
на замовлення 833262 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2953+ | 7.30 грн |
| SE051C2HQ1/Z01XDZ |
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Виробник: NXP USA Inc.
Description: SE051C2HQ1
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
Description: SE051C2HQ1
Packaging: Cut Tape (CT)
Package / Case: 20-XFQFN Exposed Pad
Mounting Type: Surface Mount
Type: IoT Secure Element
Supplier Device Package: 20-HX2QFN (3x3)
на замовлення 1478 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 353.65 грн |
| 10+ | 259.26 грн |
| 25+ | 239.01 грн |
| 100+ | 203.42 грн |
| 250+ | 194.31 грн |
| BGU8019X |
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Виробник: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Packaging: Tape & Reel (TR)
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
на замовлення 45000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 13.41 грн |
| 10000+ | 12.40 грн |
| 15000+ | 12.11 грн |
| 25000+ | 11.04 грн |
| 35000+ | 10.83 грн |
| BGU8019X |
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Виробник: NXP USA Inc.
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
Description: IC AMP GALI 1.559-1.61GHZ 6XSON
Supplier Device Package: 6-XSON (1.1x0.7)
Test Frequency: 1.575GHz
P1dB: -7dBm
Noise Figure: 0.55dB
Current - Supply: 4.6mA
Gain: 18.5dB
Voltage - Supply: 1.5V ~ 3.1V
RF Type: Galileo, GLONASS, GPS
Frequency: 1.559GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Cut Tape (CT)
на замовлення 45192 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 14+ | 22.94 грн |
| 16+ | 19.05 грн |
| 25+ | 17.98 грн |
| 100+ | 15.43 грн |
| 250+ | 14.55 грн |
| 500+ | 13.93 грн |
| 1000+ | 13.13 грн |
| PZU8.2B,115 |
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на замовлення 25464 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10804+ | 2.27 грн |
| S9S08QD2J1MSC |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 2KB FLASH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 2KB (2K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 8-SOIC
Number of I/O: 4
DigiKey Programmable: Not Verified
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| MC68020CRC25E |
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Виробник: NXP USA Inc.
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 25MHZ 114PGA
Packaging: Tray
Package / Case: 114-BPGA
Mounting Type: Through Hole
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: 68020
Voltage - I/O: 5.0V
Supplier Device Package: 114-PGA (34.55x34.55)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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од. на суму грн.
| S912ZVC64ACLFR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 28
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Grade: Automotive
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b SAR
Core Processor: S12Z
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Number of I/O: 28
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| S912ZVC64ACLF |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
Description: IC MCU 16BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, SCI, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 28
Qualification: AEC-Q100
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| LPC11U37HFBD64/4QL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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| MC7448HX1250ND |
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Виробник: NXP USA Inc.
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
Description: IC MPU MPC74XX 1.25GHZ 360FCCBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.5V, 1.8V, 2.5V
Supplier Device Package: 360-FCCBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; SIMD
Graphics Acceleration: No
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| P3A9606JK-EVB |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
Description: EVAL BOARD FOR P3A9606
Embedded: No
Primary Attributes: 2-Channel (Dual)
Utilized IC / Part: P3A9606
Contents: Board(s)
Type: Interface
Function: Level Shifter
Packaging: Bulk
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| 74AUP1G07GX,125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
Description: IC BUFFER NON-INVERT 3.6V 5X2SON
Packaging: Bulk
Package / Case: 4-XFDFN Exposed Pad
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: -, 4mA
Supplier Device Package: 5-X2SON (0.80x0.80)
на замовлення 9500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4661+ | 4.54 грн |
| MC9S08LC36LH |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 36KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
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| MC9S08LC36LH |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8-BIT, HC08/S08
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 36KB (36K x 8)
RAM Size: 2.5K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 2x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 18
DigiKey Programmable: Not Verified
на замовлення 700 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 49+ | 471.84 грн |
| ON5200,118 |
Виробник: NXP USA Inc.
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Description: RF MOSFET D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
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| S912XEP100J5CAG |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 16BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 119
Supplier Device Package: 144-LQFP (20x20)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x12b
Core Processor: HCS12X
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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| 74LVC623AD,118 |
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Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
Description: IC TXRX NON-INVERT 3.6V 20SO
Supplier Device Package: 20-SO
Current - Output High, Low: 24mA, 24mA
Number of Bits per Element: 8
Voltage - Supply: 1.2V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Bulk
на замовлення 3220 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 720+ | 31.81 грн |
| MC35FS6507NAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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| MC35FS6507NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, DCDC 0.8A VCO
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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| MC33AR6000BGT |
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Виробник: NXP USA Inc.
Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
Description: IC REG ALTERNATOR 1OUT TO220-5
Grade: Automotive
Supplier Device Package: TO-220-5
Applications: Alternator, 3-Phase
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Input: 5V ~ 16.5V
Number of Outputs: 1
Mounting Type: Through Hole
Voltage - Output: 10.6V ~ 16V
Package / Case: TO-220-5
Packaging: Tape & Reel (TR)
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| MK20DX256VLK10R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
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| MK20DX256VLK10R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 27x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 841.01 грн |
| 10+ | 636.00 грн |
| 25+ | 592.45 грн |
| 100+ | 511.10 грн |
| 250+ | 502.66 грн |
| MF1PH4230DA4/00J |
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Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
Description: MIFAREA PLUS EV2
Operating Temperature: -25°C ~ 85°C (TA)
Type: RFID Reader
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: MOA4, Smart Card Module
Packaging: Tape & Reel (TR)
Supplier Device Package: PLLMC
Standards: Mifare, NFC
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| SPC5643AF0MVZ2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
Description: IC MCU 32BIT 3MB FLASH 324PBGA
DigiKey Programmable: Not Verified
Number of I/O: 151
Supplier Device Package: 324-PBGA (23x23)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.14V ~ 5.25V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 3MB (3M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Packaging: Tray
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| S32G233ASBK0VUCT |
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Виробник: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
Description: S32G233A ARM CORTEX-M7 AND -A53,
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Qualification: AEC-Q100
Grade: Automotive
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| TDA8034T/C1,112 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Description: IC INTERFACE SPECIALIZED 16SO
Supplier Device Package: 16-SO
Voltage - Supply: 3V, 5V
Interface: Analog
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Packaging: Tube
на замовлення 653 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 4+ | 83.86 грн |
| 10+ | 58.59 грн |
| 50+ | 49.55 грн |
| 100+ | 43.87 грн |
| 250+ | 41.09 грн |
| 500+ | 39.42 грн |
| MC9S12GC64MFUE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Description: IC MCU 16BIT 64KB FLASH 80QFP
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 60
Supplier Device Package: 80-QFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
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| MC35FS6518CAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
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| S32G234MSBK1VUCR |
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Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Description: S32G234M ARM CORTEX-M7, HSE W/PR
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: 1/2.5Gbps (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
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| MIMX8UD7CVP08SC |
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Виробник: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
Description: I.MX8ULP, DUAL 800MHZ
Supplier Device Package: 485-LFBGA (15x15)
Mounting Type: Surface Mount
Package / Case: 485-LFBGA
Packaging: Tray
на замовлення 170 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1788.03 грн |
| 10+ | 1386.28 грн |
| 25+ | 1302.29 грн |
| 100+ | 1135.60 грн |
| MPF5020CMBA0ES |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 487 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 506.34 грн |
| 10+ | 376.05 грн |
| 25+ | 348.23 грн |
| 100+ | 298.07 грн |
| MPF5024CMBA0ES |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
Description: POWER MANAGEMENT IC, PRE-PROG, 4
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 40-HVQFN (6x6)
Applications: High Performance i.MX 8 Processor Based
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tray
на замовлення 480 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 500.81 грн |
| 10+ | 372.47 грн |
| 25+ | 344.97 грн |
| 100+ | 295.37 грн |
| MPF7100BVMA3ES |
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Виробник: NXP USA Inc.
Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Description: PF7100 PMIC I.MX8DXP/DX
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HVQFN (7x7)
Current - Supply: 10µA
Applications: i.MX Processors
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
на замовлення 260 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 540.36 грн |
| 10+ | 402.87 грн |
| 25+ | 373.43 грн |
| 100+ | 320.13 грн |
| 260+ | 305.14 грн |
| MIMX8US5DVP08SC |
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Виробник: NXP USA Inc.
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
Description: I.MX8ULP, SOLO 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 530 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1306.21 грн |
| 10+ | 1001.01 грн |
| 25+ | 936.91 грн |
| 100+ | 813.09 грн |
| 250+ | 781.56 грн |




























