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MMRF5014HR5 MMRF5014HR5 NXP USA Inc. MMRF5014H.pdf Description: RF MOSFET HEMT 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360H-2SB
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 125W
Gain: 18dB
Technology: HEMT
Supplier Device Package: NI-360H-2SB
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
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S32G274AABK1VUCT S32G274AABK1VUCT NXP USA Inc. S32G2.pdf Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 204 шт:
термін постачання 21-31 дні (днів)
1+8217.02 грн
10+6651.19 грн
25+6336.33 грн
100+5621.68 грн
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MFS2613AMDA6ADR2 MFS2613AMDA6ADR2 NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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LS1026AXE8T1A LS1026AXE8T1A NXP USA Inc. LS1046AFS.pdf Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MIMX8QX1AVLFZACR MIMX8QX1AVLFZACR NXP USA Inc. IMX8QXPAEC.pdf Description: MICROPROCESSORS - MPU I.MX 8QUAD
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
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BFU790F,115 BFU790F,115 NXP USA Inc. BFU790F.pdf Description: RF TRANS NPN 2.8V 25GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 234mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 235 @ 10mA, 2V
Frequency - Transition: 25GHz
Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz
Supplier Device Package: 4-DFP
на замовлення 850 шт:
термін постачання 21-31 дні (днів)
4+99.69 грн
10+60.64 грн
100+40.32 грн
500+29.63 грн
Мінімальне замовлення: 4 шт
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S912ZVLA12ACLFR S912ZVLA12ACLFR NXP USA Inc. Description: S12Z CPU, 128K FLASH
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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MF3E23A0DA8/01J NXP USA Inc. MF3E(H)x3_SDS.pdf Description: IC
Packaging: Tape & Reel (TR)
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S9KEAZ128BMLHR NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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S9S12GN48F0WLF S9S12GN48F0WLF NXP USA Inc. Description: IC MCU 16BIT 48KB FLASH 48LQFP
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
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MC908AZ60ACFUER MC908AZ60ACFUER NXP USA Inc. MC68HC08AS32.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MC908AZ60ACFUER MC908AZ60ACFUER NXP USA Inc. MC68HC08AS32.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 648 шт:
термін постачання 21-31 дні (днів)
1+2343.42 грн
10+1831.13 грн
25+1725.03 грн
100+1509.44 грн
250+1457.27 грн
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AFT18HW355SR5 AFT18HW355SR5 NXP USA Inc. AFT18HW355SR6.pdf Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Configuration: Dual
Power - Output: 63W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
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S32E288-975EVB NXP USA Inc. Description: IC
Packaging: Bulk
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TDF8530TH/N2,118 TDF8530TH/N2,118 NXP USA Inc. 75017410.pdf Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
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IW610FHN/A1ZMIK NXP USA Inc. Description: IC
Packaging: Tray
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FS32V234CON1VUB FS32V234CON1VUB NXP USA Inc. S32V234.pdf Description: IC MPU FS32V23 1GHZ 621FCPBGA
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Ethernet: 1Gbps
Supplier Device Package: 621-FCPBGA (17x17)
Voltage - I/O: 1V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: I2C, SPI, PCI, UART
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
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SAF7770EL/101Z130Y NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
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SAF7770EL/101Z130K NXP USA Inc. Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
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SAF7770EL/102Z120Y NXP USA Inc. Description: SAF7770EL
Packaging: Tape & Reel (TR)
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SAF7770EL/102Z120K NXP USA Inc. Description: SAF7770EL
Packaging: Tray
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MC56F83769AMLLA MC56F83769AMLLA NXP USA Inc. MC56F837XXDS.pdf Description: IC MCU 32BIT 128MB FLASH 100LQFP
Number of I/O: 82
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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MCXC444VMP MCXC444VMP NXP USA Inc. MCXC24XP64M48SF2.pdf Description: 48MHz, Cortex-M0+, USB, SLCD 256
Number of I/O: 50
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
на замовлення 2993 шт:
термін постачання 21-31 дні (днів)
2+234.18 грн
10+169.06 грн
25+155.05 грн
100+131.03 грн
250+124.13 грн
500+119.97 грн
1000+114.64 грн
Мінімальне замовлення: 2 шт
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S32G233AABK0CUCR S32G233AABK0CUCR NXP USA Inc. S32G2.pdf Description: S32G233A ARM CORTEX-M7 AND -A53
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
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S32G233AABK0CUCT S32G233AABK0CUCT NXP USA Inc. S32G2.pdf Description: S32G233A ARM CORTEX-M7 AND -A53
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
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AFSC5G37E38-EVB NXP USA Inc. AFSC5G37E38.pdf Description: AFSC5G37E38 3600-3800 MHZ REFERE
Contents: Board(s)
Type: Power Amplifier
Frequency: 3.6GHz ~ 3.8GHz
Packaging: Bulk
Utilized IC / Part: AFSC5G37E38
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AFSC5G26E38-EVB NXP USA Inc. AFSC5G26E38.pdf Description: AFSC5G26E38 2496-2690 MHZ REFERE
Utilized IC / Part: AFSC5G26E38
Contents: Board(s)
Type: Power Amplifier
Frequency: 2.49GHz ~ 2.69GHz
Packaging: Bulk
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LFDAS32KHH1A NXP USA Inc. Description: NXP S32K144 100 PIN LQFP TO 100-
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: S32K
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MX95MBDES10001 NXP USA Inc. IMX95LPD5EVK-19CM.pdf Description: OX03C10 SERIALIZER/DESERIALIZER
Packaging: Bulk
Function: Camera, Deserializer, Serializer
Type: Multiple
Contents: Board(s)
Utilized IC / Part: OX03C10
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+47565.50 грн
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S32G234MABK0VUCR S32G234MABK0VUCR NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE, LLC
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
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S32G234MABK0VUCT S32G234MABK0VUCT NXP USA Inc. S32G2.pdf Description: S32G234M ARM CORTEX-M7, HSE, LLC
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
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LPC2368FET100,518 LPC2368FET100,518 NXP USA Inc. LPC2364_65_66_67_68.pdf Description: IC MCU 16/32BIT 512KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+948.18 грн
Мінімальне замовлення: 1000 шт
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SAF4000EL/102Z223K NXP USA Inc. Description: SAF4000EL
Packaging: Tray
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AFT05MP075GNR1 AFT05MP075GNR1 NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
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AFT05MP075GNR1 AFT05MP075GNR1 NXP USA Inc. AFT05MP075N.pdf Description: RF MOSFET LDMOS 12.5V TO270-4
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Cut Tape (CT)
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
на замовлення 446 шт:
термін постачання 21-31 дні (днів)
1+2193.89 грн
10+1711.67 грн
25+1611.43 грн
100+1408.86 грн
250+1367.72 грн
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MMA5212KW NXP USA Inc. MMA52xxWR2.pdf Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±120g
Voltage - Supply: 4.2V ~ 17V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
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NXQ1TXH5/101J NXQ1TXH5/101J NXP USA Inc. NXQ1TXL5_SDS.pdf Description: NXQ1TXH5 - ONE-CHIP 5 V QI WIREL
DigiKey Programmable: Not Verified
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
4+5083.42 грн
Мінімальне замовлення: 4 шт
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MC34PF1550A3EPR2 MC34PF1550A3EPR2 NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PCA9958HN/Q900Y PCA9958HN/Q900Y NXP USA Inc. PCA9958.pdf Description: PCA9958HN/Q900Y
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 3984 шт:
термін постачання 21-31 дні (днів)
2+227.06 грн
10+164.56 грн
25+150.94 грн
100+127.59 грн
250+120.89 грн
500+116.85 грн
1000+111.66 грн
Мінімальне замовлення: 2 шт
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MCIMX6G3DVK05AA MCIMX6G3DVK05AA NXP USA Inc. MCIMX6GxDVx05AA.pdf Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MC12311CHN MC12311CHN NXP USA Inc. Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: SPI, UART
RF Family/Standard: General ISM < 1GHz
Modulation: FSK, GFSK, GMSK, MSK, OOK
GPIO: 34
Supplier Device Package: 60-VFLGA (8x8)
Current - Transmitting: 16mA ~ 95mA
Data Rate (Max): 300kbps
Current - Receiving: 16mA
Power - Output: 17dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 32kB Flash, 2kB RAM
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Mounting Type: Surface Mount
Sensitivity: -120dBm
Package / Case: 60-VFLGA Exposed Pad
Packaging: Tray
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BAP1321-03,115 BAP1321-03,115 NXP USA Inc. BAP1321-03_Rev_Oct2010.pdf Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Tape & Reel (TR)
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MC908QT2ACDWE MC908QT2ACDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCZ33972EWR2 MCZ33972EWR2 NXP USA Inc. MC33972.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 8V ~ 26V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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PTN3393BSY PTN3393BSY NXP USA Inc. PTN3393.pdf Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 118 шт:
термін постачання 21-31 дні (днів)
118+126.23 грн
Мінімальне замовлення: 118 шт
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SAF4001EL/101Q305Y NXP USA Inc. Description: AUDIO DSPS SAF4001EL/101Q3050
Packaging: Tape & Reel (TR)
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NX3DV3899GU,115 NX3DV3899GU,115 NXP USA Inc. NX3DV3899.pdf Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Number of Circuits: 2
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
4+90.19 грн
10+63.08 грн
25+57.11 грн
100+47.42 грн
250+44.48 грн
500+42.71 грн
1000+40.58 грн
Мінімальне замовлення: 4 шт
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MKL26Z256VMC4R MKL26Z256VMC4R NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
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MKL26Z256VMC4 MKL26Z256VMC4 NXP USA Inc. KL26P121M48SF4.pdf Description: IC MCU 32B 256KB FLASH 121MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
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FS32K148UAT0VLLR FS32K148UAT0VLLR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 156
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
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N74F373D,602 N74F373D,602 NXP USA Inc. 74F373%2C374.pdf Description: IC D-TYPE TRANSP 8:8 20-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Delay Time - Propagation: 2ns
Current - Output High, Low: 3mA, 24mA
Independent Circuits: 1
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MC33SA0528ACR2 MC33SA0528ACR2 NXP USA Inc. MC33SA0528.pdf Description: IC TRANSCEIVER FULL 2/2 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V
Number of Drivers/Receivers: 2/2
Data Rate: 125kbps
Protocol: DSI
Supplier Device Package: 32-LQFP (7x7)
Receiver Hysteresis: 350 mV
Duplex: Full
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MC68360AI33L MC68360AI33L NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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MPC8536BVJANGA MPC8536BVJANGA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536AVTATHA MPC8536AVTATHA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 157 шт:
термін постачання 21-31 дні (днів)
2+11090.12 грн
Мінімальне замовлення: 2 шт
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MPC8536AVTATHA MPC8536AVTATHA NXP USA Inc. MPC8536E.pdf Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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S912ZVHY32F1CLQ S912ZVHY32F1CLQ NXP USA Inc. FSCLS11435-1.pdf?t.download=true&u=5oefqw Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
на замовлення 212 шт:
термін постачання 21-31 дні (днів)
36+568.38 грн
Мінімальне замовлення: 36 шт
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MC35FS6517CAER2 MC35FS6517CAER2 NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6517CAE MC35FS6517CAE NXP USA Inc. 35FS4500-35FS6500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT1189XVM8C MIMXRT1189XVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MMRF5014HR5 MMRF5014H.pdf
MMRF5014HR5
Виробник: NXP USA Inc.
Description: RF MOSFET HEMT 50V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360H-2SB
Mounting Type: Chassis Mount
Frequency: 2.5GHz
Power - Output: 125W
Gain: 18dB
Technology: HEMT
Supplier Device Package: NI-360H-2SB
Voltage - Rated: 125 V
Voltage - Test: 50 V
Current - Test: 350 mA
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S32G274AABK1VUCT S32G2.pdf
S32G274AABK1VUCT
Виробник: NXP USA Inc.
Description: IC MPU AEC-Q100 1GHZ 525FCPBGA
Packaging: Tray
Package / Case: 525-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 400MHz, 1GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 525-FCPBGA (19x19)
Ethernet: 1/2.5Gbps (4)
USB: USB 2.0 OTG (1)
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Grade: Automotive
Qualification: AEC-Q100
на замовлення 204 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8217.02 грн
10+6651.19 грн
25+6336.33 грн
100+5621.68 грн
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MFS2613AMDA6ADR2 FS26_PB.pdf
MFS2613AMDA6ADR2
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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LS1026AXE8T1A LS1046AFS.pdf
LS1026AXE8T1A
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.8GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: -40°C ~ 105°C
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4)
USB: USB 3.0 (3) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MIMX8QX1AVLFZACR IMX8QXPAEC.pdf
MIMX8QX1AVLFZACR
Виробник: NXP USA Inc.
Description: MICROPROCESSORS - MPU I.MX 8QUAD
Packaging: Tape & Reel (TR)
Package / Case: 609-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 609-FBGA (21x21)
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BFU790F,115 BFU790F.pdf
BFU790F,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 2.8V 25GHZ 4-DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 234mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 2.8V
DC Current Gain (hFE) (Min) @ Ic, Vce: 235 @ 10mA, 2V
Frequency - Transition: 25GHz
Noise Figure (dB Typ @ f): 0.4dB ~ 0.5dB @ 1.5GHz ~ 2.4GHz
Supplier Device Package: 4-DFP
на замовлення 850 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+99.69 грн
10+60.64 грн
100+40.32 грн
500+29.63 грн
Мінімальне замовлення: 4 шт
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S912ZVLA12ACLFR
S912ZVLA12ACLFR
Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Number of I/O: 34
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, SPI
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
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MF3E23A0DA8/01J MF3E(H)x3_SDS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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S9KEAZ128BMLHR
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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S9S12GN48F0WLF
S9S12GN48F0WLF
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 48KB FLASH 48LQFP
EEPROM Size: 1.5K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
RAM Size: 4K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 40
Supplier Device Package: 48-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: IrDA, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: 12V1
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MC908AZ60ACFUER MC68HC08AS32.pdf
MC908AZ60ACFUER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
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MC908AZ60ACFUER MC68HC08AS32.pdf
MC908AZ60ACFUER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 648 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2343.42 грн
10+1831.13 грн
25+1725.03 грн
100+1509.44 грн
250+1457.27 грн
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AFT18HW355SR5 AFT18HW355SR6.pdf
AFT18HW355SR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230S
Mounting Type: Chassis Mount
Frequency: 1.88GHz
Configuration: Dual
Power - Output: 63W
Gain: 15.2dB
Technology: LDMOS
Supplier Device Package: NI-1230S
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1.1 A
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S32E288-975EVB
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
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TDF8530TH/N2,118 75017410.pdf
TDF8530TH/N2,118
Виробник: NXP USA Inc.
Description: IC AMP CLASS D QUAD 100W 44HSOP
Features: Depop, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 4-Channel (Quad)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 100W x 4 @ 2Ohm
Supplier Device Package: 44-HSOP
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IW610FHN/A1ZMIK
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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FS32V234CON1VUB S32V234.pdf
FS32V234CON1VUB
Виробник: NXP USA Inc.
Description: IC MPU FS32V23 1GHZ 621FCPBGA
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Ethernet: 1Gbps
Supplier Device Package: 621-FCPBGA (17x17)
Voltage - I/O: 1V, 1.8V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1GHz
Mounting Type: Surface Mount
Package / Case: 621-FBGA, FCBGA
Packaging: Tray
Additional Interfaces: I2C, SPI, PCI, UART
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Graphics Acceleration: Yes
RAM Controllers: DDR3, DDR3L, LPDDR2
Co-Processors/DSP: Multimedia; NEON™ MPE
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SAF7770EL/101Z130Y
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
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SAF7770EL/101Z130K
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
Package / Case: 364-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 364-LFBGA (15x15)
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SAF7770EL/102Z120Y
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tape & Reel (TR)
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SAF7770EL/102Z120K
Виробник: NXP USA Inc.
Description: SAF7770EL
Packaging: Tray
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MC56F83769AMLLA MC56F837XXDS.pdf
MC56F83769AMLLA
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128MB FLASH 100LQFP
Number of I/O: 82
Supplier Device Package: 100-LQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, SPI, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x12b; D/A 2x12b
Core Processor: 56800EX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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MCXC444VMP MCXC24XP64M48SF2.pdf
MCXC444VMP
Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB, SLCD 256
Number of I/O: 50
Supplier Device Package: 64-MAPBGA (5x5)
Peripherals: DMA, LCD, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Packaging: Tray
на замовлення 2993 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+234.18 грн
10+169.06 грн
25+155.05 грн
100+131.03 грн
250+124.13 грн
500+119.97 грн
1000+114.64 грн
Мінімальне замовлення: 2 шт
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S32G233AABK0CUCR S32G2.pdf
S32G233AABK0CUCR
Виробник: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
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S32G233AABK0CUCT S32G2.pdf
S32G233AABK0CUCT
Виробник: NXP USA Inc.
Description: S32G233A ARM CORTEX-M7 AND -A53
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
RAM Controllers: DDR3L, LPDDR4
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 1 Core, 64-Bit/2 Core, 32-Bit
USB: USB 2.0 OTG (1)
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz, 1GHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
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AFSC5G37E38-EVB AFSC5G37E38.pdf
Виробник: NXP USA Inc.
Description: AFSC5G37E38 3600-3800 MHZ REFERE
Contents: Board(s)
Type: Power Amplifier
Frequency: 3.6GHz ~ 3.8GHz
Packaging: Bulk
Utilized IC / Part: AFSC5G37E38
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AFSC5G26E38-EVB AFSC5G26E38.pdf
Виробник: NXP USA Inc.
Description: AFSC5G26E38 2496-2690 MHZ REFERE
Utilized IC / Part: AFSC5G26E38
Contents: Board(s)
Type: Power Amplifier
Frequency: 2.49GHz ~ 2.69GHz
Packaging: Bulk
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LFDAS32KHH1A
Виробник: NXP USA Inc.
Description: NXP S32K144 100 PIN LQFP TO 100-
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: S32K
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MX95MBDES10001 IMX95LPD5EVK-19CM.pdf
Виробник: NXP USA Inc.
Description: OX03C10 SERIALIZER/DESERIALIZER
Packaging: Bulk
Function: Camera, Deserializer, Serializer
Type: Multiple
Contents: Board(s)
Utilized IC / Part: OX03C10
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+47565.50 грн
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S32G234MABK0VUCR S32G2.pdf
S32G234MABK0VUCR
Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE, LLC
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
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S32G234MABK0VUCT S32G2.pdf
S32G234MABK0VUCT
Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE, LLC
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
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LPC2368FET100,518 LPC2364_65_66_67_68.pdf
LPC2368FET100,518
Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+948.18 грн
Мінімальне замовлення: 1000 шт
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SAF4000EL/102Z223K
Виробник: NXP USA Inc.
Description: SAF4000EL
Packaging: Tray
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AFT05MP075GNR1 AFT05MP075N.pdf
AFT05MP075GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
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AFT05MP075GNR1 AFT05MP075N.pdf
AFT05MP075GNR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Cut Tape (CT)
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
на замовлення 446 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2193.89 грн
10+1711.67 грн
25+1611.43 грн
100+1408.86 грн
250+1367.72 грн
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MMA5212KW MMA52xxWR2.pdf
Виробник: NXP USA Inc.
Description: IC SENSOR ACCELEROMETER 16QFN
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Mounting Type: Surface Mount
Axis: X
Acceleration Range: ±120g
Voltage - Supply: 4.2V ~ 17V
Bandwidth: 400Hz
Supplier Device Package: 16-QFN (6x6)
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NXQ1TXH5/101J NXQ1TXL5_SDS.pdf
NXQ1TXH5/101J
Виробник: NXP USA Inc.
Description: NXQ1TXH5 - ONE-CHIP 5 V QI WIREL
DigiKey Programmable: Not Verified
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+5083.42 грн
Мінімальне замовлення: 4 шт
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MC34PF1550A3EPR2 PF1550.pdf
MC34PF1550A3EPR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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PCA9958HN/Q900Y PCA9958.pdf
PCA9958HN/Q900Y
Виробник: NXP USA Inc.
Description: PCA9958HN/Q900Y
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 3984 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+227.06 грн
10+164.56 грн
25+150.94 грн
100+127.59 грн
250+120.89 грн
500+116.85 грн
1000+111.66 грн
Мінімальне замовлення: 2 шт
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MCIMX6G3DVK05AA MCIMX6GxDVx05AA.pdf
MCIMX6G3DVK05AA
Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
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MC12311CHN
MC12311CHN
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: SPI, UART
RF Family/Standard: General ISM < 1GHz
Modulation: FSK, GFSK, GMSK, MSK, OOK
GPIO: 34
Supplier Device Package: 60-VFLGA (8x8)
Current - Transmitting: 16mA ~ 95mA
Data Rate (Max): 300kbps
Current - Receiving: 16mA
Power - Output: 17dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 32kB Flash, 2kB RAM
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Mounting Type: Surface Mount
Sensitivity: -120dBm
Package / Case: 60-VFLGA Exposed Pad
Packaging: Tray
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BAP1321-03,115 BAP1321-03_Rev_Oct2010.pdf
BAP1321-03,115
Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Tape & Reel (TR)
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MC908QT2ACDWE MC68HC908QY4A.pdf
MC908QT2ACDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCZ33972EWR2 MC33972.pdf
MCZ33972EWR2
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 8V ~ 26V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
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PTN3393BSY PTN3393.pdf
PTN3393BSY
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 118 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
118+126.23 грн
Мінімальне замовлення: 118 шт
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SAF4001EL/101Q305Y
Виробник: NXP USA Inc.
Description: AUDIO DSPS SAF4001EL/101Q3050
Packaging: Tape & Reel (TR)
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NX3DV3899GU,115 NX3DV3899.pdf
NX3DV3899GU,115
Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Number of Circuits: 2
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+90.19 грн
10+63.08 грн
25+57.11 грн
100+47.42 грн
250+44.48 грн
500+42.71 грн
1000+40.58 грн
Мінімальне замовлення: 4 шт
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MKL26Z256VMC4R KL26P121M48SF4.pdf
MKL26Z256VMC4R
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
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MKL26Z256VMC4 KL26P121M48SF4.pdf
MKL26Z256VMC4
Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
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FS32K148UAT0VLLR S32K1xx.pdf
FS32K148UAT0VLLR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 156
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
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N74F373D,602 74F373%2C374.pdf
N74F373D,602
Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 8:8 20-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Delay Time - Propagation: 2ns
Current - Output High, Low: 3mA, 24mA
Independent Circuits: 1
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MC33SA0528ACR2 MC33SA0528.pdf
MC33SA0528ACR2
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V
Number of Drivers/Receivers: 2/2
Data Rate: 125kbps
Protocol: DSI
Supplier Device Package: 32-LQFP (7x7)
Receiver Hysteresis: 350 mV
Duplex: Full
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MC68360AI33L MC68360.pdf
MC68360AI33L
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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MPC8536BVJANGA MPC8536E.pdf
MPC8536BVJANGA
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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MPC8536AVTATHA MPC8536E.pdf
MPC8536AVTATHA
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 157 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+11090.12 грн
Мінімальне замовлення: 2 шт
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MPC8536AVTATHA MPC8536E.pdf
MPC8536AVTATHA
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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S912ZVHY32F1CLQ FSCLS11435-1.pdf?t.download=true&u=5oefqw
S912ZVHY32F1CLQ
Виробник: NXP USA Inc.
Description: MAGNIV 16-BIT MCU, S12Z CORE, 32
DigiKey Programmable: Not Verified
Number of I/O: 100
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: S12Z
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Bulk
на замовлення 212 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
36+568.38 грн
Мінімальне замовлення: 36 шт
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MC35FS6517CAER2 35FS4500-35FS6500-ASILD.pdf
MC35FS6517CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6517CAE 35FS4500-35FS6500-ASILD.pdf
MC35FS6517CAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MIMXRT1189XVM8C IMXRT1180EC.pdf
MIMXRT1189XVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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