Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36595) > Сторінка 575 з 610
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSPFeatures: Slew Rate Controlled Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
на замовлення 1845 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
MC35FS4507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A VQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
MC35FS4507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A VMounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
|
LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
|
|
LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFPPackaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 974 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
|
LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFPPackaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 993 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
LPC55S28JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFPNumber of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 925 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
LPC5528JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFPNumber of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tray |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
LPC5526JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFPPackaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| BC860C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 100MA SOT23Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| JN5121-000-AIV | NXP USA Inc. |
Description: IC MCU 802.15.4 32BIT 2.4G 56QFNPackaging: Tape & Reel (TR) Package / Case: 56-QFN Interface: 2-Wire Serial, SPI Serial, UART RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V Controller Series: IEEE802.15.4 Program Memory Type: ROM (64kB) Applications: Wireless Number of I/O: 21 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
|
MPC885ZP66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BTA412Y-800C,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220AB-3Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS23LDOEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
| KITFS23SKTEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
| KITFS27-SP48VEVM | NXP USA Inc. |
Description: KITFS27-SP48VEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27EVM | NXP USA Inc. |
Description: KITFS27EVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27SKTEVM | NXP USA Inc. |
Description: KITFS27SKTEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27-24VEVM | NXP USA Inc. |
Description: KITFS27-24VEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27-48VEVM | NXP USA Inc. |
Description: KITFS27-48VEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
74HC597DB,118 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOPPackaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74HC597DB,112 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOPPackaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74HC597D,652 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SOPackaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BT139B-800F,118 | NXP USA Inc. |
Description: TRIAC 800V 16A D2PAKPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139-600E,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 16A TO220ABPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BUX87P,127 | NXP USA Inc. | Description: TRANS BJT NPN 450V SOT-82 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
SC16C2550BIBS,151 | NXP USA Inc. |
Description: SERIAL I/O CONTROLLER, 2 CHANNELPackaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
HEF4047BT,652 | NXP USA Inc. |
Description: IC MONO/ASTBL MULTVIBRATR 14SOICPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
TDA1560Q/N4,112 | NXP USA Inc. |
Description: IC AUDIO AMP B, H DBS17PFeatures: Mute, Standby Packaging: Tube Package / Case: 17-SIP Formed Leads Output Type: 1-Channel (Mono) Mounting Type: Through Hole Type: Class B, Class H Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 40W x1 @ 8Ohm Supplier Device Package: DBS17P |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
|
TDA1519CTH/N3,512 | NXP USA Inc. |
Description: IC AUDIO AMP B 20-HSOPPackaging: Tube Features: Mute, Standby Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class B Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm Supplier Device Package: 20-HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BSC9132NXN7MNMB | NXP USA Inc. |
Description: IC MPU QORIQ 1.333GHZ 780FCBGAPackaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCBGA (23x23) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
|
74HC4024D,652 | NXP USA Inc. |
Description: IC COUNTER 7STAGE BINARY 14SOICPackaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
товару немає в наявності |
Мінімальне замовлення: 1140 шт В кошику од. на суму грн. | ||||||||||||||
|
|
74HC4024D,653 | NXP USA Inc. |
Description: IC 7STAGE BINARY RIPPLE 14SOICPackaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||
|
BC847CQAZ | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A DFN1010D-3Qualification: AEC-Q101 Power - Max: 280 mW Voltage - Collector Emitter Breakdown (Max): 45 V Current - Collector (Ic) (Max): 100 mA Grade: Automotive Supplier Device Package: DFN1010D-3 Frequency - Transition: 100MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Current - Collector Cutoff (Max): 15nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: 3-XDFN Exposed Pad Packaging: Bulk |
на замовлення 24340 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
74AHC245D,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20SOICPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PHD38N02LT,118 | NXP USA Inc. |
Description: MOSFET N-CH 20V 44.7A DPAKPackaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
PN7642EV/C101Y | NXP USA Inc. |
Description: PN7642EV/C101YPackaging: Cut Tape (CT) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
на замовлення 1281 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
PNX1501E/G,557 | NXP USA Inc. |
Description: IC MEDIA PROC 266MHZ 456-BGAPackaging: Tray Package / Case: 456-BGA Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Operating Temperature: 0°C ~ 85°C Voltage - Supply: 1.14V ~ 1.26V Controller Series: Nexperia Applications: Multimedia Core Processor: TM3260 Supplier Device Package: 456-BGA (27x27) Number of I/O: 61 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||||
| FS32R294LDK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGAPackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 760 шт В кошику од. на суму грн. | |||||||||||||||
|
FS32R294LDK0MJDR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGAPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
| FS32R294LCK0MJDT | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGAPackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 760 шт В кошику од. на суму грн. | |||||||||||||||
| FS32R294LCK0MJDR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB CRAM 269LFBGAPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
|
|
SPC5601DF1MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
на замовлення 1872 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
|
|
SPC5601DF1MLH4 | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4K x 16 Core Processor: e200z0h Data Converters: A/D 16x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 45 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||||
| BT138-800,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220ABPackaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
|
74HC238D,653 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 3:8 16-SOPackaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74HC238D,652 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1 X 3:8 16-SOPackaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-SO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
74HC238PW,112 | NXP USA Inc. |
Description: IC DECODER/DEMUX 1X3:8 16-TSSOPPackaging: Tube Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Circuit: 1 x 3:8 Type: Decoder/Demultiplexer Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Independent Circuits: 1 Current - Output High, Low: 5.2mA, 5.2mA Voltage Supply Source: Single Supply Supplier Device Package: 16-TSSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BLF6G20-75,112 | NXP USA Inc. |
Description: TRANSISTOR PWR LDMOS SOT502APackaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | |||||||||||||||
|
PEMI8QFN/RK,132 | NXP USA Inc. |
Description: FILTER RC(PI) 100 OHMS ESD SMDPackaging: Tape & Reel (TR) Package / Case: 16-XFDFN Exposed Pad Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm) Mounting Type: Surface Mount Type: Low Pass Operating Temperature: -40°C ~ 85°C Values: R = 100Ohms, C = 13.5pF (Total) Height: 0.020" (0.50mm) Attenuation Value: 18dB @ 800MHz ~ 3GHz Filter Order: 2nd Applications: LAN, PCS, WAN Technology: RC (Pi) Resistance - Channel (Ohms): 100 ESD Protection: Yes Number of Channels: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
MCXA346VLL | NXP USA Inc. |
Description: 180MHZ, CORTEX-M33Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 180MHz Program Memory Size: 1MB (1M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33F Data Converters: A/D 64x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD/HVD, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 86 |
на замовлення 438 шт: термін постачання 21-31 дні (днів) |
|
||||||||||||||
| FB32K144HFT0MLLT | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. | |||||||||||||||
| TJA1103-SDBS | NXP USA Inc. |
Description: SABRE DEV BOARD ETHERNET PHY Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA11xx Embedded: No |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
|
|||||||||||||||
| MWCT2D16SHVPB | NXP USA Inc. |
Description: MWCT2D16S, MAXQFP172Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | |||||||||||||||
| MWCT2D16SHVPBR | NXP USA Inc. |
Description: MWCT2D16SHVPBRPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 300 шт В кошику од. на суму грн. | |||||||||||||||
| FB32K146HRT0MLLR | NXP USA Inc. |
Description: S32K146, M4F, FLASH 1M, RAM 128K Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
| FB32K146HFT0VLLR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
| FB32K146HRT0VLHT | NXP USA Inc. |
Description: S32K146 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | |||||||||||||||
| FB32K148HFT0VLQR | NXP USA Inc. |
Description: S32K148 144 LQFP Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. |
| NX5P1100UKZ |
![]() |
Виробник: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
на замовлення 1845 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 73.62 грн |
| 10+ | 51.04 грн |
| 25+ | 46.15 грн |
| 100+ | 38.23 грн |
| 250+ | 35.80 грн |
| 500+ | 34.34 грн |
| 1000+ | 32.60 грн |
| MC35FS4507NAE |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC35FS4507NAER2 |
![]() |
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
товару немає в наявності
В кошику
од. на суму грн.
| LPC5528JBD100Y |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| LPC5528JBD100Y |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 974 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 530.81 грн |
| 10+ | 395.27 грн |
| 25+ | 366.33 грн |
| 100+ | 313.92 грн |
| 250+ | 300.06 грн |
| LPC5526JBD100Y |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
товару немає в наявності
В кошику
од. на суму грн.
| LPC5526JBD100Y |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 993 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 457.97 грн |
| 10+ | 340.12 грн |
| 25+ | 314.57 грн |
| 100+ | 268.85 грн |
| 250+ | 256.88 грн |
| 500+ | 249.10 грн |
| LPC55S28JBD100Y |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 925 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 544.76 грн |
| 10+ | 406.61 грн |
| 25+ | 377.04 грн |
| 100+ | 323.39 грн |
| 250+ | 308.85 грн |
| 500+ | 300.10 грн |
| LPC5528JBD100E |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 411.48 грн |
| 10+ | 369.45 грн |
| LPC5526JBD100E |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 462.62 грн |
| 10+ | 342.96 грн |
| 90+ | 291.10 грн |
| JN5121-000-AIV |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| MPC885ZP66 |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
В кошику
од. на суму грн.
| KITFS23LDOEVM |
![]() |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14033.58 грн |
| KITFS23SKTEVM |
![]() |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15638.41 грн |
| 74HC597DB,118 |
![]() |
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
товару немає в наявності
В кошику
од. на суму грн.
| 74HC597DB,112 |
![]() |
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
товару немає в наявності
В кошику
од. на суму грн.
| 74HC597D,652 |
![]() |
Виробник: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
товару немає в наявності
В кошику
од. на суму грн.
| BUX87P,127 |
Виробник: NXP USA Inc.
Description: TRANS BJT NPN 450V SOT-82
Description: TRANS BJT NPN 450V SOT-82
товару немає в наявності
В кошику
од. на суму грн.
| SC16C2550BIBS,151 |
![]() |
Виробник: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
товару немає в наявності
В кошику
од. на суму грн.
| TDA1560Q/N4,112 |
![]() |
Виробник: NXP USA Inc.
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
товару немає в наявності
В кошику
од. на суму грн.
| TDA1519CTH/N3,512 |
![]() |
Виробник: NXP USA Inc.
Description: IC AUDIO AMP B 20-HSOP
Packaging: Tube
Features: Mute, Standby
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
Description: IC AUDIO AMP B 20-HSOP
Packaging: Tube
Features: Mute, Standby
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
товару немає в наявності
В кошику
од. на суму грн.
| BSC9132NXN7MNMB |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
товару немає в наявності
В кошику
од. на суму грн.
| 74HC4024D,652 |
![]() |
Виробник: NXP USA Inc.
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
товару немає в наявності
Мінімальне замовлення: 1140 шт
В кошику
од. на суму грн.
| 74HC4024D,653 |
![]() |
Виробник: NXP USA Inc.
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| BC847CQAZ |
![]() |
Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A DFN1010D-3
Qualification: AEC-Q101
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
Description: TRANS NPN 45V 0.1A DFN1010D-3
Qualification: AEC-Q101
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
на замовлення 24340 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3877+ | 5.35 грн |
| PN7642EV/C101Y |
![]() |
Виробник: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
на замовлення 1281 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 850.85 грн |
| 10+ | 712.03 грн |
| 25+ | 674.63 грн |
| 100+ | 585.02 грн |
| 250+ | 556.22 грн |
| 500+ | 535.90 грн |
| 1000+ | 508.30 грн |
| PNX1501E/G,557 |
![]() |
Виробник: NXP USA Inc.
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.
| SPC5601DF1MLH4 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
на замовлення 1872 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 32+ | 625.79 грн |
| SPC5601DF1MLH4 |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 16
Core Processor: e200z0h
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 45
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| 74HC238D,653 |
![]() |
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
товару немає в наявності
В кошику
од. на суму грн.
| 74HC238D,652 |
![]() |
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO
товару немає в наявності
В кошику
од. на суму грн.
| 74HC238PW,112 |
![]() |
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
Description: IC DECODER/DEMUX 1X3:8 16-TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-TSSOP
товару немає в наявності
В кошику
од. на суму грн.
| PEMI8QFN/RK,132 |
![]() |
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 8
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.047" W (3.30mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 13.5pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 8
товару немає в наявності
В кошику
од. на суму грн.
| MCXA346VLL |
![]() |
Виробник: NXP USA Inc.
Description: 180MHZ, CORTEX-M33
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 64x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
Description: 180MHZ, CORTEX-M33
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 64x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 86
на замовлення 438 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 344.06 грн |
| 10+ | 251.92 грн |
| 25+ | 232.22 грн |
| 100+ | 197.57 грн |
| TJA1103-SDBS |
Виробник: NXP USA Inc.
Description: SABRE DEV BOARD ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
Description: SABRE DEV BOARD ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 16094.83 грн |



















