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LFJ34INTPQA NXP USA Inc. Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
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MCIMX6D6AVT08AD MCIMX6D6AVT08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
1+4655.20 грн
10+3730.60 грн
60+3499.94 грн
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QN9083DUKZ QN9083DUKZ NXP USA Inc. QN908x.pdf Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
2000+453.00 грн
Мінімальне замовлення: 2000
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QN9083DUKZ QN9083DUKZ NXP USA Inc. QN908x.pdf Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 2217 шт:
термін постачання 21-31 дні (днів)
1+700.97 грн
10+586.02 грн
25+555.03 грн
100+480.96 грн
250+457.08 грн
500+440.21 грн
1000+417.37 грн
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MC34PF1550A2EP MC34PF1550A2EP NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+368.68 грн
10+271.37 грн
25+250.47 грн
100+213.43 грн
490+197.08 грн
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MC908QT1AMDWE MC908QT1AMDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QT1AMDWER MC908QT1AMDWER NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCIMX6U1AVM08AC MCIMX6U1AVM08AC NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 859 шт:
термін постачання 21-31 дні (днів)
1+2744.54 грн
10+2166.35 грн
60+1979.63 грн
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P2041NSN7MMC P2041NSN7MMC NXP USA Inc. P2040_Rev2.pdf Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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MCIMX6L8DVN10AA MCIMX6L8DVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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FS32K148UJT0VMHR FS32K148UJT0VMHR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Number of I/O: 89
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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IP4284CZ10-TB,115 IP4284CZ10-TB,115 NXP USA Inc. IP4284CZ10-TB_TT_Rev02.pdf Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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MCF5483CVR166 MCF5483CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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TJA1465B-EVB NXP USA Inc. Description: TJA1465B-EVB
Utilized IC / Part: TJA1465B
Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Bulk
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MCDXTM4CK344 NXP USA Inc. Description: MCDXTM4CK344
Packaging: Bulk
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SAF4000EL/101Q53BY NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tape & Reel (TR)
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FS32K148HET0VLLT FS32K148HET0VLLT NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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PCAL9722HNHP PCAL9722HNHP NXP USA Inc. PCAL9722.pdf Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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PCAL9722HN/Q900HP PCAL9722HN/Q900HP NXP USA Inc. PCAL9722.pdf Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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A3T19H455W23SR6 NXP USA Inc. A3T19H455W23S.pdf Description: RF MOSFET
Packaging: Bulk
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
2+9916.04 грн
Мінімальне замовлення: 2
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LS1048ASN7PTA LS1048ASN7PTA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MC56F8122VFAE MC56F8122VFAE NXP USA Inc. MC56F8322.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
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T2081NSN8T1B NXP USA Inc. T2080FS.pdf Description: QORIQ T2080 AND T2081 MULTICORE
Packaging: Bulk
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
1+23507.82 грн
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MKV30F64VLF10 MKV30F64VLF10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
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P3H2840HN-ARD NXP USA Inc. Description: P3H2840HN-ARD
Packaging: Bulk
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LFINTPL3QA NXP USA Inc. Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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MX95LP4XEVK-15CM NXP USA Inc. Description: MX95LP4XEVK-15CM
Packaging: Bulk
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MPXV10GC7U MPXV10GC7U NXP USA Inc. MPX10.pdf Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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MIMXRT1181CVP2C MIMXRT1181CVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182CVP2C MIMXRT1182CVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1181XVP2C MIMXRT1181XVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182XVP2C MIMXRT1182XVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1186CVJ8C MIMXRT1186CVJ8C NXP USA Inc. Description: RT1180,INDUS,196BGA,C0
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 105°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Packaging: Tray
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MIMXRT1186XVJ8C MIMXRT1186XVJ8C NXP USA Inc. Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
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MIMXRT1187CVM8C MIMXRT1187CVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1187XVM8C MIMXRT1187XVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
1+1409.06 грн
10+1081.08 грн
25+1012.24 грн
152+862.40 грн
304+838.95 грн
608+819.64 грн
В кошику  од. на суму  грн.
MIMXRT1189CVM8C MIMXRT1189CVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1186JVJ8C NXP USA Inc. Description: RT1180,INDUS,196BGA,C0
Packaging: Tray
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MIMXRT1186KVJ8C NXP USA Inc. Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
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SC16IS762IPW,128 SC16IS762IPW,128 NXP USA Inc. SC16IS752_SC16IS762.pdf Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
2500+320.04 грн
Мінімальне замовлення: 2500
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SC16IS762IPW,128 SC16IS762IPW,128 NXP USA Inc. SC16IS752_SC16IS762.pdf Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7892 шт:
термін постачання 21-31 дні (днів)
1+544.32 грн
10+405.23 грн
25+375.63 грн
100+321.95 грн
250+313.83 грн
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SPC5748GK0AMMJ6 SPC5748GK0AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
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S912DG12CE1VPVER S912DG12CE1VPVER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
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S912DG12CE1VPVE S912DG12CE1VPVE NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MC9S08DZ60CLC MC9S08DZ60CLC NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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BUK95150-55A,127 BUK95150-55A,127 NXP USA Inc. BUK9%285%2C6%29150-55A.pdf Description: MOSFET N-CH 55V 13A TO220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Grade: Automotive
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 53W (Tc)
Rds On (Max) @ Id, Vgs: 137mOhm @ 13A, 10V
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 339 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±10V
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S32M241LCABMKHSR S32M241LCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M241LCABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S32M242LCABMKHSR S32M242LCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M242LCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M241CCABMKHSR S32M241CCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M241CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M242CCABMKHSR S32M242CCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M242CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M241LCABMKHST S32M241LCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M241LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M242LCABMKHST S32M242LCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M242LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M241CCABMKHST S32M241CCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M241CCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M244LCABMKHSR S32M244LCABMKHSR NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M244CCABMKHSR S32M244CCABMKHSR NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M244LCABMKHST S32M244LCABMKHST NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S32M244CCABMKHST S32M244CCABMKHST NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
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S32M274CHABMKHSR S32M274CHABMKHSR NXP USA Inc. Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S32M274LHABMKHSR S32M274LHABMKHSR NXP USA Inc. Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S32M276CHABMKHSR S32M276CHABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M276CHABMKHSR
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
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LFJ34INTPQA
Виробник: NXP USA Inc.
Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
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MCIMX6D6AVT08AD IMX6DQAEC.pdf
MCIMX6D6AVT08AD
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
SATA: SATA 3Gbps (1)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (4)
Ethernet: 10/100/1000Mbps (1)
Supplier Device Package: 624-FCBGA (21x21)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Core Processor: ARM® Cortex®-A9
Operating Temperature: -40°C ~ 125°C (TJ)
Speed: 852MHz
Mounting Type: Surface Mount
Package / Case: 624-FBGA, FCBGA
Packaging: Tray
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4655.20 грн
10+3730.60 грн
60+3499.94 грн
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QN9083DUKZ QN908x.pdf
QN9083DUKZ
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2000+453.00 грн
Мінімальне замовлення: 2000
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QN9083DUKZ QN908x.pdf
QN9083DUKZ
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 2217 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+700.97 грн
10+586.02 грн
25+555.03 грн
100+480.96 грн
250+457.08 грн
500+440.21 грн
1000+417.37 грн
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MC34PF1550A2EP PF1550.pdf
MC34PF1550A2EP
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+368.68 грн
10+271.37 грн
25+250.47 грн
100+213.43 грн
490+197.08 грн
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MC908QT1AMDWE MC68HC908QY4A.pdf
MC908QT1AMDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QT1AMDWER MC68HC908QY4A.pdf
MC908QT1AMDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCIMX6U1AVM08AC IMX6SDLAEC.pdf
MCIMX6U1AVM08AC
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 859 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2744.54 грн
10+2166.35 грн
60+1979.63 грн
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P2041NSN7MMC P2040_Rev2.pdf
P2041NSN7MMC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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MCIMX6L8DVN10AA IMX6SLCEC.pdf
MCIMX6L8DVN10AA
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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FS32K148UJT0VMHR S32K1xx.pdf
FS32K148UJT0VMHR
Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Number of I/O: 89
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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IP4284CZ10-TB,115 IP4284CZ10-TB_TT_Rev02.pdf
IP4284CZ10-TB,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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MCF5483CVR166 MCF5485EC.pdf
MCF5483CVR166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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TJA1465B-EVB
Виробник: NXP USA Inc.
Description: TJA1465B-EVB
Utilized IC / Part: TJA1465B
Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Bulk
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MCDXTM4CK344
Виробник: NXP USA Inc.
Description: MCDXTM4CK344
Packaging: Bulk
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SAF4000EL/101Q53BY
Виробник: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tape & Reel (TR)
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FS32K148HET0VLLT S32K1xx.pdf
FS32K148HET0VLLT
Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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PCAL9722HNHP PCAL9722.pdf
PCAL9722HNHP
Виробник: NXP USA Inc.
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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PCAL9722HN/Q900HP PCAL9722.pdf
PCAL9722HN/Q900HP
Виробник: NXP USA Inc.
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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A3T19H455W23SR6 A3T19H455W23S.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+9916.04 грн
Мінімальне замовлення: 2
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LS1048ASN7PTA LS1088AFS.pdf
LS1048ASN7PTA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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MC56F8122VFAE MC56F8322.pdf
MC56F8122VFAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
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T2081NSN8T1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: QORIQ T2080 AND T2081 MULTICORE
Packaging: Bulk
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+23507.82 грн
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MKV30F64VLF10 KV30P64M100SFA.pdf
MKV30F64VLF10
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
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P3H2840HN-ARD
Виробник: NXP USA Inc.
Description: P3H2840HN-ARD
Packaging: Bulk
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LFINTPL3QA
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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MX95LP4XEVK-15CM
Виробник: NXP USA Inc.
Description: MX95LP4XEVK-15CM
Packaging: Bulk
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MPXV10GC7U MPX10.pdf
MPXV10GC7U
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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MIMXRT1181CVP2C IMXRT1180EC.pdf
MIMXRT1181CVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182CVP2C IMXRT1180EC.pdf
MIMXRT1182CVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1181XVP2C IMXRT1180EC.pdf
MIMXRT1181XVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182XVP2C IMXRT1180EC.pdf
MIMXRT1182XVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1186CVJ8C
MIMXRT1186CVJ8C
Виробник: NXP USA Inc.
Description: RT1180,INDUS,196BGA,C0
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 105°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Packaging: Tray
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MIMXRT1186XVJ8C
MIMXRT1186XVJ8C
Виробник: NXP USA Inc.
Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
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MIMXRT1187CVM8C IMXRT1180EC.pdf
MIMXRT1187CVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1187XVM8C IMXRT1180EC.pdf
MIMXRT1187XVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1409.06 грн
10+1081.08 грн
25+1012.24 грн
152+862.40 грн
304+838.95 грн
608+819.64 грн
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MIMXRT1189CVM8C IMXRT1180EC.pdf
MIMXRT1189CVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1186JVJ8C
Виробник: NXP USA Inc.
Description: RT1180,INDUS,196BGA,C0
Packaging: Tray
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MIMXRT1186KVJ8C
Виробник: NXP USA Inc.
Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
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SC16IS762IPW,128 SC16IS752_SC16IS762.pdf
SC16IS762IPW,128
Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+320.04 грн
Мінімальне замовлення: 2500
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SC16IS762IPW,128 SC16IS752_SC16IS762.pdf
SC16IS762IPW,128
Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7892 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+544.32 грн
10+405.23 грн
25+375.63 грн
100+321.95 грн
250+313.83 грн
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SPC5748GK0AMMJ6 MPC5746C.pdf
SPC5748GK0AMMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
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S912DG12CE1VPVER 9S12DT128DGV2.pdf
S912DG12CE1VPVER
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
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S912DG12CE1VPVE 9S12DT128DGV2.pdf
S912DG12CE1VPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
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MC9S08DZ60CLC
MC9S08DZ60CLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
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BUK95150-55A,127 BUK9%285%2C6%29150-55A.pdf
BUK95150-55A,127
Виробник: NXP USA Inc.
Description: MOSFET N-CH 55V 13A TO220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Grade: Automotive
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 53W (Tc)
Rds On (Max) @ Id, Vgs: 137mOhm @ 13A, 10V
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 339 pF @ 25 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±10V
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S32M241LCABMKHSR S32M2xx_DS.pdf
S32M241LCABMKHSR
Виробник: NXP USA Inc.
Description: S32M241LCABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S32M242LCABMKHSR S32M2xx_DS.pdf
S32M242LCABMKHSR
Виробник: NXP USA Inc.
Description: S32M242LCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M241CCABMKHSR S32M2xx_DS.pdf
S32M241CCABMKHSR
Виробник: NXP USA Inc.
Description: S32M241CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M242CCABMKHSR S32M2xx_DS.pdf
S32M242CCABMKHSR
Виробник: NXP USA Inc.
Description: S32M242CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M241LCABMKHST S32M2xx_DS.pdf
S32M241LCABMKHST
Виробник: NXP USA Inc.
Description: S32M241LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M242LCABMKHST S32M2xx_DS.pdf
S32M242LCABMKHST
Виробник: NXP USA Inc.
Description: S32M242LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M241CCABMKHST S32M2xx_DS.pdf
S32M241CCABMKHST
Виробник: NXP USA Inc.
Description: S32M241CCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M244LCABMKHSR
S32M244LCABMKHSR
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M244CCABMKHSR
S32M244CCABMKHSR
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
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S32M244LCABMKHST
S32M244LCABMKHST
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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S32M244CCABMKHST
S32M244CCABMKHST
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
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S32M274CHABMKHSR
S32M274CHABMKHSR
Виробник: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S32M274LHABMKHSR
S32M274LHABMKHSR
Виробник: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
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S32M276CHABMKHSR S32M2xx_DS.pdf
S32M276CHABMKHSR
Виробник: NXP USA Inc.
Description: S32M276CHABMKHSR
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
товару немає в наявності
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