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PEMI2QFN/HR,115 PEMI2QFN/HR,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 2
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PS-SUPPORT-050 NXP USA Inc. PROFSUPPFS.pdf Description: PREMIUM SUPPORT - 50 HOURS - PHY
Packaging: Bulk
Type: Tech Support
Applications: Programming
Edition: Premium
License - User Details: 50 Hours
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FXAS21002CQR1 FXAS21002CQR1 NXP USA Inc. FXAS21002.pdf Description: GYROSCOPE 3-AXIS 24QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 24-TFQFN Exposed Pad
Output Type: I2C, SPI
Type: Digital
Axis: X (Pitch), Y (Roll), Z (Yaw)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 4Hz ~ 256Hz
Range °/s: ±250, 500, 1000, 2000
Sensitivity (LSB/(°/s)): 16 ~ 128
Current - Supply: 2.7 mA
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MCF5235CVM100J MCF5235CVM100J NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVF150 MCF5235CVF150 NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVM150J MCF5235CVM150J NXP USA Inc. MCF523x.pdf Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCXA156VLH MCXA156VLH NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
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MPF9453AVMB1HNR2 NXP USA Inc. PF9453_SDS.pdf Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMB1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMB1HN NXP USA Inc. PF9453.pdf Description: IC
Packaging: Tray
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MPF9453AVMB1HN NXP USA Inc. PF9453.pdf Description: IC
Packaging: Tray
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MPF9453ACMA1HNR2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMA1HN NXP USA Inc. Description: IC
Packaging: Tray
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A5G26H606W19NR3 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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MC33879BPEKR2 MC33879BPEKR2 NXP USA Inc. MC33879.pdf Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
на замовлення 1900 шт:
термін постачання 21-31 дні (днів)
1+393.66 грн
10+289.06 грн
25+266.63 грн
100+227.14 грн
250+216.13 грн
500+209.49 грн
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BZX84-C62/LF1R BZX84-C62/LF1R NXP USA Inc. PHGLS29437-1.pdf?t.download=true&u=5oefqw Description: DIODE ZENER 62V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Qualification: AEC-Q101
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LPC11U36FBD64/401, LPC11U36FBD64/401, NXP USA Inc. LPC11U6X.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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FXLS8971CFR1 FXLS8971CFR1 NXP USA Inc. FXLS8971CF.pdf Description: FXLS8971CFR1
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
1250+120.10 грн
Мінімальне замовлення: 1250
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FXLS8971CFR1 FXLS8971CFR1 NXP USA Inc. FXLS8971CF.pdf Description: FXLS8971CFR1
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Selectable Scale
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
на замовлення 1652 шт:
термін постачання 21-31 дні (днів)
2+185.25 грн
5+159.23 грн
10+151.96 грн
25+134.43 грн
50+128.86 грн
100+123.77 грн
500+111.65 грн
Мінімальне замовлення: 2
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KIT-STBI-A8971 KIT-STBI-A8971 NXP USA Inc. UM11910.pdf Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+6922.07 грн
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LPC55S66JEV59Y LPC55S66JEV59Y NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S66JEV59E LPC55S66JEV59E NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59Y LPC5528JEV59Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59E LPC5528JEV59E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59Y LPC55S28JEV59Y NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59E LPC55S28JEV59E NXP USA Inc. LPC55S2x_LPC552x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59Y LPC55S69JEV59Y NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59E LPC55S69JEV59E NXP USA Inc. LPC55S6x.pdf Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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P1023NXE5CFB NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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MC33FS6518NAER2 MC33FS6518NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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NCX8200UKZ NCX8200UKZ NXP USA Inc. NCX8200.pdf Description: IC AUDIO SWITCH 9WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)
974+24.52 грн
Мінімальне замовлення: 974
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MPC8541VTAJD MPC8541VTAJD NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
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TJA1465ATK/0J TJA1465ATK/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
6000+67.43 грн
Мінімальне замовлення: 6000
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TJA1465ATK/0J TJA1465ATK/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
3+137.22 грн
10+97.45 грн
25+88.60 грн
100+74.03 грн
250+69.68 грн
500+67.06 грн
1000+63.84 грн
2500+61.60 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TJA1465AT/0Z TJA1465AT/0Z NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+69.30 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1465AT/0Z TJA1465AT/0Z NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
3+137.22 грн
10+97.45 грн
25+88.60 грн
100+74.03 грн
250+69.68 грн
500+67.06 грн
1000+63.84 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TJA1465BHG/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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В кошику  од. на суму  грн.
TJA1465BHG/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1466AHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466AHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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В кошику  од. на суму  грн.
TJA1466BHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
В кошику  од. на суму  грн.
TJA1466BHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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В кошику  од. на суму  грн.
MC9S08DV48ACLH MC9S08DV48ACLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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S9S12XS128J1VAA S9S12XS128J1VAA NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
MVR5510AMDALES MVR5510AMDALES NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
1+1012.88 грн
10+767.00 грн
25+714.95 грн
100+617.32 грн
В кошику  од. на суму  грн.
PCA9554CBSHP PCA9554CBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
6000+50.34 грн
Мінімальне замовлення: 6000
В кошику  од. на суму  грн.
PCA9554CBSHP PCA9554CBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 6139 шт:
термін постачання 21-31 дні (днів)
4+105.49 грн
10+73.75 грн
25+66.90 грн
100+55.69 грн
250+52.30 грн
500+50.26 грн
1000+47.79 грн
2500+46.04 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PCA9554CPWJ PCA9554CPWJ NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+54.68 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9554BBSHP PCA9554BBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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В кошику  од. на суму  грн.
MF1PH4230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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В кошику  од. на суму  грн.
LD6836TD/20H,125 LD6836TD/20H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
2184+11.07 грн
Мінімальне замовлення: 2184
В кошику  од. на суму  грн.
MCF5470VR200 MCF5470VR200 NXP USA Inc. MCF5475EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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RDBESS774A1EVB NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RDBESS772BJBEVB NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD33772C14VEVM NXP USA Inc. getting-started-with-the-rd33772c14vevm-reference-design:GS-RD33772C14VEVM Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU
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RD-BESS1500BUN NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD-BESS1-PREM NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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MPL115A2ST1 MPL115A2ST1 NXP USA Inc. MPL115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
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PEMI2QFN/HR,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/HR,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 2
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PS-SUPPORT-050 PROFSUPPFS.pdf
Виробник: NXP USA Inc.
Description: PREMIUM SUPPORT - 50 HOURS - PHY
Packaging: Bulk
Type: Tech Support
Applications: Programming
Edition: Premium
License - User Details: 50 Hours
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FXAS21002CQR1 FXAS21002.pdf
FXAS21002CQR1
Виробник: NXP USA Inc.
Description: GYROSCOPE 3-AXIS 24QFN
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Tape & Reel (TR)
Package / Case: 24-TFQFN Exposed Pad
Output Type: I2C, SPI
Type: Digital
Axis: X (Pitch), Y (Roll), Z (Yaw)
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.95V ~ 3.6V
Bandwidth: 4Hz ~ 256Hz
Range °/s: ±250, 500, 1000, 2000
Sensitivity (LSB/(°/s)): 16 ~ 128
Current - Supply: 2.7 mA
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MCF5235CVM100J MCF523x.pdf
MCF5235CVM100J
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 100MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVF150 MCF523x.pdf
MCF5235CVF150
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 113
DigiKey Programmable: Not Verified
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MCF5235CVM150J MCF523x.pdf
MCF5235CVM150J
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 256MAPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 256-MAPBGA (17x17)
Number of I/O: 97
DigiKey Programmable: Not Verified
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MCXA156VLH
MCXA156VLH
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 96MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART, USB
Peripherals: DMA, LVD/HVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 52
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MPF9453AVMB1HNR2 PF9453_SDS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMB1HNR2
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMB1HN PF9453.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MPF9453AVMB1HN PF9453.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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MPF9453ACMA1HNR2
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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MPF9453ACMA1HN
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
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A5G26H606W19NR3
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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MC33879BPEKR2 MC33879.pdf
MC33879BPEKR2
Виробник: NXP USA Inc.
Description: IC SW SERIAL OCTAL 32SOIC
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 8
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High/Low Side
Rds On (Typ): 750mOhm
Input Type: Non-Inverting
Voltage - Load: 5.5V ~ 27.5V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 5.5V
Current - Output (Max): 1.2A
Ratio - Input:Output: 1:8
Supplier Device Package: 32-SOIC-EP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, Short Circuit, UVLO
на замовлення 1900 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+393.66 грн
10+289.06 грн
25+266.63 грн
100+227.14 грн
250+216.13 грн
500+209.49 грн
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BZX84-C62/LF1R PHGLS29437-1.pdf?t.download=true&u=5oefqw
BZX84-C62/LF1R
Виробник: NXP USA Inc.
Description: DIODE ZENER 62V 250MW SOT23
Tolerance: ±5%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C
Voltage - Zener (Nom) (Vz): 62 V
Impedance (Max) (Zzt): 215 Ohms
Supplier Device Package: SOT-23 (TO-236AB)
Grade: Automotive
Power - Max: 250 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 43.4 V
Qualification: AEC-Q101
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LPC11U36FBD64/401, LPC11U6X.pdf
LPC11U36FBD64/401,
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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FXLS8971CFR1 FXLS8971CF.pdf
FXLS8971CFR1
Виробник: NXP USA Inc.
Description: FXLS8971CFR1
Packaging: Tape & Reel (TR)
Features: Adjustable Bandwidth, Selectable Scale
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
на замовлення 1250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1250+120.10 грн
Мінімальне замовлення: 1250
В кошику  од. на суму  грн.
FXLS8971CFR1 FXLS8971CF.pdf
FXLS8971CFR1
Виробник: NXP USA Inc.
Description: FXLS8971CFR1
Packaging: Cut Tape (CT)
Features: Adjustable Bandwidth, Selectable Scale
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
на замовлення 1652 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+185.25 грн
5+159.23 грн
10+151.96 грн
25+134.43 грн
50+128.86 грн
100+123.77 грн
500+111.65 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
KIT-STBI-A8971 UM11910.pdf
KIT-STBI-A8971
Виробник: NXP USA Inc.
Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6922.07 грн
В кошику  од. на суму  грн.
LPC55S66JEV59Y LPC55S6x.pdf
LPC55S66JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S66JEV59E LPC55S6x.pdf
LPC55S66JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59Y LPC55S2x_LPC552x.pdf
LPC5528JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59E LPC55S2x_LPC552x.pdf
LPC5528JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59Y LPC55S2x_LPC552x.pdf
LPC55S28JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59E LPC55S2x_LPC552x.pdf
LPC55S28JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59Y LPC55S6x.pdf
LPC55S69JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59E LPC55S6x.pdf
LPC55S69JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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P1023NXE5CFB P1_Series_FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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MC33FS6518NAER2 35FS4500-35FS6500-ASILB.pdf
MC33FS6518NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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NCX8200UKZ NCX8200.pdf
NCX8200UKZ
Виробник: NXP USA Inc.
Description: IC AUDIO SWITCH 9WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
974+24.52 грн
Мінімальне замовлення: 974
В кошику  од. на суму  грн.
MPC8541VTAJD MPC8541EEC.pdf
MPC8541VTAJD
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
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TJA1465ATK/0J TJA1465.pdf
TJA1465ATK/0J
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6000+67.43 грн
Мінімальне замовлення: 6000
В кошику  од. на суму  грн.
TJA1465ATK/0J TJA1465.pdf
TJA1465ATK/0J
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+137.22 грн
10+97.45 грн
25+88.60 грн
100+74.03 грн
250+69.68 грн
500+67.06 грн
1000+63.84 грн
2500+61.60 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TJA1465AT/0Z TJA1465.pdf
TJA1465AT/0Z
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+69.30 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1465AT/0Z TJA1465.pdf
TJA1465AT/0Z
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+137.22 грн
10+97.45 грн
25+88.60 грн
100+74.03 грн
250+69.68 грн
500+67.06 грн
1000+63.84 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TJA1465BHG/0J TJA1465.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1465BHG/0J TJA1465.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1466AHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466AHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
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TJA1466CHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466BHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466BHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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MC9S08DV48ACLH MC9S08DV60.pdf
MC9S08DV48ACLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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S9S12XS128J1VAA MC9S12XS256RMV1.pdf
S9S12XS128J1VAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MVR5510AMDALES VR5510.pdf
MVR5510AMDALES
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1012.88 грн
10+767.00 грн
25+714.95 грн
100+617.32 грн
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PCA9554CBSHP PCA9554B_PCA9554C.pdf
PCA9554CBSHP
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6000+50.34 грн
Мінімальне замовлення: 6000
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PCA9554CBSHP PCA9554B_PCA9554C.pdf
PCA9554CBSHP
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 6139 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+105.49 грн
10+73.75 грн
25+66.90 грн
100+55.69 грн
250+52.30 грн
500+50.26 грн
1000+47.79 грн
2500+46.04 грн
Мінімальне замовлення: 4
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PCA9554CPWJ PCA9554B_PCA9554C.pdf
PCA9554CPWJ
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+54.68 грн
Мінімальне замовлення: 2500
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PCA9554BBSHP PCA9554B_PCA9554C.pdf
PCA9554BBSHP
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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MF1PH4230DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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LD6836TD/20H,125 LD6836.pdf
LD6836TD/20H,125
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2184+11.07 грн
Мінімальне замовлення: 2184
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MCF5470VR200 MCF5475EC.pdf
MCF5470VR200
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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RDBESS774A1EVB BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RDBESS772BJBEVB BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD33772C14VEVM getting-started-with-the-rd33772c14vevm-reference-design:GS-RD33772C14VEVM
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU
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RD-BESS1500BUN BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD-BESS1-PREM BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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MPL115A2ST1 MPL115A2.pdf
MPL115A2ST1
Виробник: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Packaging: Tape & Reel (TR)
Features: Temperature Compensated
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
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