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SC33PF8200KKESR2 NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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PMCM6501VNEZ PMCM6501VNEZ NXP USA Inc. PMCM6501VNE.pdf Description: PMCM6501VNE - 12V, N-CHANNEL TRE
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V
на замовлення 2036138 шт:
термін постачання 21-31 дні (днів)
1254+16.18 грн
Мінімальне замовлення: 1254
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PMCM6501UNEZ PMCM6501UNEZ NXP USA Inc. PMCM6501UNE.pdf Description: PMCM6501UNE - 20V, N-CHANNEL TRE
Packaging: Bulk
на замовлення 4464 шт:
термін постачання 21-31 дні (днів)
1254+16.18 грн
Мінімальне замовлення: 1254
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SL2S2602FUD/BGZ NXP USA Inc. SL2S2602.pdf Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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BGU8063J BGU8063J NXP USA Inc. BGU8063.pdf Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Supplier Device Package: 10-HVSON (3x3)
P1dB: 19dBm
Noise Figure: 1.4dB
Current - Supply: 75mA
Gain: 20dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 2.5GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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ASL2507SHNY ASL2507SHNY NXP USA Inc. ASL2500SHN.pdf Description: BOOST CONVERTER + FSO
Packaging: Tape & Reel (TR)
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KIT-TJA1121-SDBR NXP USA Inc. KIT-TJA1121-UG.pdf Description: KIT-TJA1121-SDBR
Packaging: Bulk
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P3A1604UKAZ P3A1604UKAZ NXP USA Inc. P3A1604UK.pdf Description: IC XLTR VL BIDIR 12-WLCSP
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
на замовлення 4400 шт:
термін постачання 21-31 дні (днів)
4400+44.99 грн
Мінімальне замовлення: 4400
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P3A1604UKAZ P3A1604UKAZ NXP USA Inc. P3A1604UK.pdf Description: IC XLTR VL BIDIR 12-WLCSP
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
на замовлення 4400 шт:
термін постачання 21-31 дні (днів)
4+93.36 грн
10+65.44 грн
25+59.33 грн
100+49.35 грн
250+46.34 грн
500+45.25 грн
Мінімальне замовлення: 4
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MFS2401AVMAFESR2 MFS2401AVMAFESR2 NXP USA Inc. FS2400.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS2401AVMAFES MFS2401AVMAFES NXP USA Inc. FS2400.pdf Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MBMI7014TA2AER2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZADR2 NXP USA Inc. Description: AUTO SBC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZAD NXP USA Inc. Description: AUTO SBC
Packaging: Tray
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MBMI7014TA2AE MBMI7014TA2AE NXP USA Inc. BMI7014-MIM-PSP-TEST.pdf Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
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MCXN235VDFR NXP USA Inc. MCXN23x.pdf Description: IC
Packaging: Tape & Reel (TR)
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SC33FS8520DVKSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: FS8500
Packaging: Tape & Reel (TR)
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MIMX9101DVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121DVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MFS2300BMBA0EPR2 MFS2300BMBA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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MC9S12E256VPVE MC9S12E256VPVE NXP USA Inc. MC9S12E256V1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 2x8b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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MIMX8UD7DVP08SC MIMX8UD7DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 492 шт:
термін постачання 21-31 дні (днів)
1+1413.02 грн
10+1086.11 грн
25+1017.39 грн
100+883.91 грн
250+850.13 грн
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MIMX8MN2DVTJZAA MIMX8MN2DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
1+1905.91 грн
10+1479.15 грн
25+1390.03 грн
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
на замовлення 2818 шт:
термін постачання 21-31 дні (днів)
1+318.84 грн
10+233.13 грн
25+214.69 грн
100+182.43 грн
250+173.39 грн
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MC32PF4210A4ESR2 MC32PF4210A4ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC32PF4210A4ES MC32PF4210A4ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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PCAL9539AHF,128 PCAL9539AHF,128 NXP USA Inc. PCAL9539A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BTS6201UJ BTS6201UJ NXP USA Inc. BTS6201U.pdf Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
на замовлення 5817 шт:
термін постачання 21-31 дні (днів)
2+289.57 грн
10+240.52 грн
25+227.40 грн
100+196.43 грн
250+186.25 грн
500+179.06 грн
1000+169.46 грн
Мінімальне замовлення: 2
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CWA-VSPA--FL NXP USA Inc. Description: IC
Packaging: Bulk
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ZK-HC08AX-A NXP USA Inc. Description: MC68HC908AB/AS/AZ EVAL BRD
Utilized IC / Part: MC68HC908AB/AS/AZ
Core Processor: HC08
Contents: Board(s), Cable(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Socket
Packaging: Box
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MRFE6S9160HSR3 MRFE6S9160HSR3 NXP USA Inc. MRFE6S9160HR3H%28S%29R3.pdf Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 21dB
Power - Output: 35W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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SE050D2HQ1/Z01PAZ NXP USA Inc. Description: SE050D2HQ1/Z01PAZ
DigiKey Programmable: Not Verified
Packaging: Bulk
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MC35FS4505NAER2 MC35FS4505NAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE MC35FS4505NAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC50XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC22XS4200DEKR2 MC22XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MC50XS4200DEK MC50XS4200DEK NXP USA Inc. MC20XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
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MC17XS6400DEKR2 MC17XS6400DEKR2 NXP USA Inc. MC07XS6517.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
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MC20XS4200BDFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC20XS4200DFK MC20XS4200DFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
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MC22XS4200DEK MC22XS4200DEK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
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MC17XS6400DEK MC17XS6400DEK NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
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MC20XS4200BDFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
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MC06XS4200DFKR2 MC06XS4200DFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 12A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: CMOS
Rds On (Typ): 12mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MGD3162AM551EKT MGD3162AM551EKT NXP USA Inc. SDS_GD3162.pdf Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
на замовлення 836 шт:
термін постачання 21-31 дні (днів)
1+753.98 грн
10+568.50 грн
25+529.16 грн
176+443.47 грн
352+430.60 грн
528+424.15 грн
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NAFE11348B40BSK NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34DCH NXP USA Inc. 74AUP3G34.pdf Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Supplier Device Package: 8-VSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 3
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
716+28.32 грн
Мінімальне замовлення: 716
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LS2084ASE7V17B NXP USA Inc. LS2084A%2C%20LS2044A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Tray
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SPC5747GK0AVKU6 SPC5747GK0AVKU6 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB MPC8349VVAJDB NXP USA Inc. Description: IC MPU 672LBGA
Supplier Device Package: 672-LBGA (35x35)
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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PCA1626U/F2,026 NXP USA Inc. PCA16XX.pdf Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB MIMX8QM5CVUFFAB NXP USA Inc. Download?colCode=IMX8QMAEC&amp;location=null Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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SC33PF8200KKESR2
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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PMCM6501VNEZ PMCM6501VNE.pdf
PMCM6501VNEZ
Виробник: NXP USA Inc.
Description: PMCM6501VNE - 12V, N-CHANNEL TRE
Packaging: Bulk
Package / Case: 6-XFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Ta)
Rds On (Max) @ Id, Vgs: 18mOhm @ 3A, 4.5V
Power Dissipation (Max): 556mW (Ta), 12.5W (Tc)
Vgs(th) (Max) @ Id: 900mV @ 250µA
Supplier Device Package: 6-WLCSP (1.48x0.98)
Drive Voltage (Max Rds On, Min Rds On): 1.5V, 4.5V
Vgs (Max): ±8V
Drain to Source Voltage (Vdss): 12 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 920 pF @ 6 V
на замовлення 2036138 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1254+16.18 грн
Мінімальне замовлення: 1254
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PMCM6501UNEZ PMCM6501UNE.pdf
PMCM6501UNEZ
Виробник: NXP USA Inc.
Description: PMCM6501UNE - 20V, N-CHANNEL TRE
Packaging: Bulk
на замовлення 4464 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1254+16.18 грн
Мінімальне замовлення: 1254
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SL2S2602FUD/BGZ SL2S2602.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ WAFER
Supplier Device Package: Wafer
Standards: ISO 15693
Type: RFID Transponder
Frequency: 13.56MHz
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Tray
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BGU8063J BGU8063.pdf
BGU8063J
Виробник: NXP USA Inc.
Description: IC AMP GPS 2.5GHZ-4GHZ 10HVSON
Supplier Device Package: 10-HVSON (3x3)
P1dB: 19dBm
Noise Figure: 1.4dB
Current - Supply: 75mA
Gain: 20dB
Voltage - Supply: 4.75V ~ 5.25V
RF Type: General Purpose
Frequency: 2.5GHz ~ 4GHz
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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ASL2507SHNY ASL2500SHN.pdf
ASL2507SHNY
Виробник: NXP USA Inc.
Description: BOOST CONVERTER + FSO
Packaging: Tape & Reel (TR)
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KIT-TJA1121-SDBR KIT-TJA1121-UG.pdf
Виробник: NXP USA Inc.
Description: KIT-TJA1121-SDBR
Packaging: Bulk
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P3A1604UKAZ P3A1604UK.pdf
P3A1604UKAZ
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Tape & Reel (TR)
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
на замовлення 4400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4400+44.99 грн
Мінімальне замовлення: 4400
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P3A1604UKAZ P3A1604UK.pdf
P3A1604UKAZ
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 12-WLCSP
Number of Circuits: 1
Voltage - VCCB: 1.62 V ~ 3.63 V
Voltage - VCCA: 0.72 V ~ 1.98 V
Channels per Circuit: 4
Translator Type: Voltage Level
Channel Type: Bidirectional
Supplier Device Package: 12-WLCSP (1.06x1.41)
Data Rate: 40Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 12-UFBGA, WLCSP
Packaging: Cut Tape (CT)
на замовлення 4400 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+93.36 грн
10+65.44 грн
25+59.33 грн
100+49.35 грн
250+46.34 грн
500+45.25 грн
Мінімальне замовлення: 4
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MFS2401AVMAFESR2 FS2400.pdf
MFS2401AVMAFESR2
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MFS2401AVMAFES FS2400.pdf
MFS2401AVMAFES
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 115°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MBMI7014TA2AER2
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZADR2
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZAD
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
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MBMI7014TA2AE BMI7014-MIM-PSP-TEST.pdf
MBMI7014TA2AE
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
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MCXN235VDFR MCXN23x.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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SC33FS8520DVKSR2 FS84_FS85C_DS.pdf
Виробник: NXP USA Inc.
Description: FS8500
Packaging: Tape & Reel (TR)
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MIMX9101DVXXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121DVVXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MFS2300BMBA0EPR2 FS23DS.pdf
MFS2300BMBA0EPR2
Виробник: NXP USA Inc.
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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MC9S12E256VPVE MC9S12E256V1.pdf
MC9S12E256VPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
DigiKey Programmable: Not Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Core Size: 16-Bit
Data Converters: A/D 16x10b; D/A 2x8b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
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MIMX8UD7DVP08SC IMX8ULPIEC.pdf
MIMX8UD7DVP08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 492 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1413.02 грн
10+1086.11 грн
25+1017.39 грн
100+883.91 грн
250+850.13 грн
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MIMX8MN2DVTJZAA IMX8MNCEC.pdf
MIMX8MN2DVTJZAA
Виробник: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1905.91 грн
10+1479.15 грн
25+1390.03 грн
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Виробник: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Виробник: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
на замовлення 2818 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+318.84 грн
10+233.13 грн
25+214.69 грн
100+182.43 грн
250+173.39 грн
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MC32PF4210A4ESR2 PF4210.pdf
MC32PF4210A4ESR2
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC32PF4210A4ES PF4210.pdf
MC32PF4210A4ES
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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PCAL9539AHF,128 PCAL9539A.pdf
PCAL9539AHF,128
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BTS6201UJ BTS6201U.pdf
BTS6201UJ
Виробник: NXP USA Inc.
Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
на замовлення 5817 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+289.57 грн
10+240.52 грн
25+227.40 грн
100+196.43 грн
250+186.25 грн
500+179.06 грн
1000+169.46 грн
Мінімальне замовлення: 2
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CWA-VSPA--FL
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
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ZK-HC08AX-A
Виробник: NXP USA Inc.
Description: MC68HC908AB/AS/AZ EVAL BRD
Utilized IC / Part: MC68HC908AB/AS/AZ
Core Processor: HC08
Contents: Board(s), Cable(s), Power Supply
Type: MCU 8-Bit
Mounting Type: Socket
Packaging: Box
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MRFE6S9160HSR3 MRFE6S9160HR3H%28S%29R3.pdf
MRFE6S9160HSR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.2 A
Voltage - Test: 28 V
Voltage - Rated: 66 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 21dB
Power - Output: 35W
Frequency: 880MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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SE050D2HQ1/Z01PAZ
Виробник: NXP USA Inc.
Description: SE050D2HQ1/Z01PAZ
DigiKey Programmable: Not Verified
Packaging: Bulk
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MC35FS4505NAER2 FS6500-FS4500-ASILD.pdf
MC35FS4505NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE FS6500-FS4500-ASILD.pdf
MC35FS4505NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC22XS4200.pdf
MC50XS4200DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC22XS4200DEKR2 MC22XS4200.pdf
MC22XS4200DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MC50XS4200DEK MC20XS4200.pdf
MC50XS4200DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Current - Output (Max): 1.65A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 41mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
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MC17XS6400DEKR2 MC07XS6517.pdf
MC17XS6400DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
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MC20XS4200BDFKR2 MC22XS4200.pdf
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
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MC20XS4200DFK MC22XS4200.pdf
MC20XS4200DFK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
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MC22XS4200DEK MC22XS4200.pdf
MC22XS4200DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Packaging: Tube
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:1
Current - Output (Max): 4.2A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 18.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: Internal PWM, Slew Rate Controlled
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MC17XS6400DEK MC12XS6D3.pdf
MC17XS6400DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Qualification: AEC-Q100
Grade: Automotive
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Supplier Device Package: 32-HSOP
Ratio - Input:Output: 1:6
Current - Output (Max): 11A
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Voltage - Load: 7V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 15mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 6
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
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MC20XS4200BDFK MC22XS4200.pdf
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 4.4A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: Non-Inverting
Rds On (Typ): 20mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
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MC06XS4200DFKR2 MC22XS4200.pdf
MC06XS4200DFKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Supplier Device Package: 23-PQFN (12x12)
Ratio - Input:Output: 1:1
Current - Output (Max): 12A
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Voltage - Load: 8V ~ 36V
Input Type: CMOS
Rds On (Typ): 12mOhm (Max)
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TA)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 2
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 23-PowerQFN
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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MGD3162AM551EKT SDS_GD3162.pdf
MGD3162AM551EKT
Виробник: NXP USA Inc.
Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
на замовлення 836 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+753.98 грн
10+568.50 грн
25+529.16 грн
176+443.47 грн
352+430.60 грн
528+424.15 грн
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NAFE11348B40BSK NAFE11388.pdf
Виробник: NXP USA Inc.
Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NAFE11388.pdf
Виробник: NXP USA Inc.
Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34.pdf
74AUP3G34DCH
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Supplier Device Package: 8-VSSOP
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 3
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Packaging: Bulk
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
716+28.32 грн
Мінімальне замовлення: 716
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LS2084ASE7V17B LS2084A%2C%20LS2044A.pdf
Виробник: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
SATA: SATA 6Gbps (2)
Security Features: Secure Boot, TrustZone®
Graphics Acceleration: No
RAM Controllers: DDR4, SDRAM
Number of Cores/Bus Width: 8 Core, 64-Bit
USB: USB 3.0 + PHY (2)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Core Processor: ARM® Cortex®-A72
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 2GHz
Mounting Type: Surface Mount
Package / Case: 1292-BBGA, FCBGA
Packaging: Tray
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SPC5747GK0AVKU6 MPC5646C.pdf
SPC5747GK0AVKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB
MPC8349VVAJDB
Виробник: NXP USA Inc.
Description: IC MPU 672LBGA
Supplier Device Package: 672-LBGA (35x35)
Mounting Type: Surface Mount
Package / Case: 672-LBGA
Packaging: Tray
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PCA1626U/F2,026 PCA16XX.pdf
Виробник: NXP USA Inc.
Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB Download?colCode=IMX8QMAEC&amp;location=null
MIMX8QM5CVUFFAB
Виробник: NXP USA Inc.
Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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