Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35985) > Сторінка 567 з 600
| Фото | Назва | Виробник | Інформація |
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MKE04Z128VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Tape & Reel (TR) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKE04Z128VLH4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64LQFPPackaging: Cut Tape (CT) Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-LQFP (10x10) Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 1029 шт: термін постачання 21-31 дні (днів) |
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MCIMX6U1AVM10AD | NXP USA Inc. |
Description: IC MPU I.MX6DL 1GHZ 624MAPBGAPackaging: Tray Package / Case: 624-LFBGA Mounting Type: Surface Mount Speed: 1GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-MAPBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PDTA115EMB,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.02A 3DFNPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 20 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 100 kOhms Resistor - Emitter Base (R2): 100 kOhms |
на замовлення 190000 шт: термін постачання 21-31 дні (днів) |
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PDTA115TMB,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A 3DFNPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 100 kOhms |
на замовлення 159975 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFNPackaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| MWCT20D2VLH | NXP USA Inc. |
Description: MWCT20D2VLHPackaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MC56F81746LMLF | NXP USA Inc. |
Description: MC56F81746LMLFPackaging: Bulk Package / Case: 48-LQFP Mounting Type: Surface Mount Interface: DMA, I2C, LINbus, SCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 125°C (TA) Non-Volatile Memory: FLASH (64kB) On-Chip RAM: 12kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 48-LQFP (7x7) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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74ABT16373BDL,112 | NXP USA Inc. |
Description: IC 16BIT D TYPE LATCH 48SSOPPackaging: Tube Package / Case: 48-BSSOP (0.295", 7.50mm Width) Output Type: Tri-State Mounting Type: Surface Mount Circuit: 8:8 Logic Type: D-Type Transparent Latch Operating Temperature: -40°C ~ 85°C Voltage - Supply: 4.5V ~ 5.5V Independent Circuits: 2 Current - Output High, Low: 32mA, 64mA Delay Time - Propagation: 2ns Supplier Device Package: 48-SSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| MPC567XKIT516-PT | NXP USA Inc. |
Description: MPC567X EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: e200 Utilized IC / Part: MPC567x |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MPC860TCZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC860DECZQ50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MPC860ENZQ50D4R2 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGAPackaging: Tape & Reel (TR) Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX515DJM8CR2 | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGAPackaging: Tape & Reel (TR) Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCIMX515DJM8CR2 | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGAPackaging: Bulk Package / Case: 529-LFBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: -20°C ~ 85°C (TC) Core Processor: ARM® Cortex®-A8 Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Supplier Device Package: 529-BGA (19x19) Ethernet: 10/100Mbps (1) USB: USB 2.0 (3), USB 2.0 + PHY (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART |
на замовлення 3651 шт: термін постачання 21-31 дні (днів) |
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MCIMX31LDVKN5D | NXP USA Inc. |
Description: IC MPU I.MX31 532MHZ 457LFBGAPackaging: Bulk Package / Case: 457-LFBGA Mounting Type: Surface Mount Speed: 532MHz Operating Temperature: -20°C ~ 70°C (TA) Core Processor: ARM1136JF-S Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V Supplier Device Package: 457-LFBGA (14x14) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP RAM Controllers: DDR Graphics Acceleration: Yes Display & Interface Controllers: Keyboard, Keypad, LCD Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART |
на замовлення 2019 шт: термін постачання 21-31 дні (днів) |
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| FC32K146UAT0VLLR | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| FC32K146UAT0VLLT | NXP USA Inc. |
Description: S32K144 32-BIT MCU, ARM CORTEX-M Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MRF9060NR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 26V TO270-2Packaging: Tape & Reel (TR) Package / Case: TO-270AA Mounting Type: Surface Mount Frequency: 945MHz Power - Output: 60W Gain: 18dB Technology: LDMOS Supplier Device Package: TO-270-2 Voltage - Rated: 65 V Voltage - Test: 26 V Current - Test: 450 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PESD2NFC-LYL | NXP USA Inc. |
Description: TVS DIODE 24VWM DFN1006-2Packaging: Bulk Package / Case: SOD-882 Mounting Type: Surface Mount Type: Zener Voltage - Reverse Standoff (Typ): 24V (Max) Supplier Device Package: DFN1006-2 Bidirectional Channels: 1 Power Line Protection: No |
на замовлення 3760 шт: термін постачання 21-31 дні (днів) |
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74HCT4053PW,112 | NXP USA Inc. |
Description: IC MUX/DEMUX TRIPLE 2X1 16TSSOPPackaging: Bulk |
на замовлення 16005 шт: термін постачання 21-31 дні (днів) |
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MKE02Z16VLC2R | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MKE02Z16VLC2R | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFPPackaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 2000 шт: термін постачання 21-31 дні (днів) |
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MKE02Z16VLC4R | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 32LQFPPackaging: Cut Tape (CT) Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 28 |
на замовлення 1359 шт: термін постачання 21-31 дні (днів) |
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| MKL02Z8VFG4R | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16QFNPackaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| MKL02Z8VFG4R | NXP USA Inc. |
Description: IC MCU 32BIT 8KB FLASH 16QFNPackaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| MKL02Z32VFG4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 16QFNPackaging: Tape & Reel (TR) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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| MKL02Z32VFG4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 16QFNPackaging: Cut Tape (CT) Package / Case: 16-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 16-QFN (3x3) Number of I/O: 14 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MKL02Z32VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MKL02Z32VFM4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 32QFNPackaging: Cut Tape (CT) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Speed: 48MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 14x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Supplier Device Package: 32-HVQFN (5x5) Number of I/O: 28 DigiKey Programmable: Not Verified |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VLD2R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPPackaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VLD2R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPPackaging: Cut Tape (CT) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 20MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VLD4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPPackaging: Tape & Reel (TR) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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MKE02Z32VLD4R | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 44LQFPPackaging: Cut Tape (CT) Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 256 x 8 Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 37 DigiKey Programmable: Not Verified |
на замовлення 1500 шт: термін постачання 21-31 дні (днів) |
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| MKE15Z64VFP4R | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 40VFQFNPackaging: Cut Tape (CT) Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 64KB (64K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Supplier Device Package: 40-HVQFN (5x5) Number of I/O: 36 |
на замовлення 5000 шт: термін постачання 21-31 дні (днів) |
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MKE04Z128VQH4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFPPackaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 58 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MKE04Z128VQH4R | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 64QFPPackaging: Cut Tape (CT) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x12b; D/A 2x6b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Supplier Device Package: 64-QFP (14x14) Number of I/O: 58 DigiKey Programmable: Not Verified |
на замовлення 456 шт: термін постачання 21-31 дні (днів) |
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| MRF1K50H-27MHZ | NXP USA Inc. |
Description: MRF1K50H-27MHZPackaging: Bulk Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MRF1K50H-230MHZ | NXP USA Inc. |
Description: MRF1K50H-230MHZPackaging: Bulk Contents: Board(s) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MRF8HP21130HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Packaging: Tape & Reel (TR) Package / Case: NI-780S-4L Mounting Type: Surface Mount Frequency: 2.17GHz Configuration: Dual Power - Output: 28W Gain: 14dB Technology: LDMOS Supplier Device Package: NI-780S-4L Voltage - Rated: 65 V Voltage - Test: 28 V Current - Test: 360 mA |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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P5020NSE7TNB | NXP USA Inc. |
Description: IC MPU QORIQ P5 2.0GHZ 1295BGAPackaging: Tray Package / Case: 1295-BBGA, FCBGA Mounting Type: Surface Mount Speed: 2.0GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e5500 Supplier Device Package: 1295-FCPBGA (37.5x37.5) Ethernet: 1Gbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Security; SEC 4.2 RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC33FS6504LAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP DCDC 0.8A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) |
на замовлення 249 шт: термін постачання 21-31 дні (днів) |
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S9S12GN16J1MLC | NXP USA Inc. |
Description: IC MCU 16BIT 16KB FLASH 32LQFP Packaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 25MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S12 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 26 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCF5274LVF166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 196MAPBGAPackaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Speed: 166MHz RAM Size: 64K x 8 Operating Temperature: 0°C ~ 70°C Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V2 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, WDT Supplier Device Package: 196-LBGA (15x15) Number of I/O: 61 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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SPC5744BSK1AVKU2 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP Packaging: Tray Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z4 Data Converters: A/D 36x10b, 16x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Peripherals: DMA, I2S, POR, WDT Supplier Device Package: 176-LQFP (24x24) Number of I/O: 129 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEG128BVAAR | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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S912XEG128BVAA | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 12K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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FRDM-RW612 | NXP USA Inc. |
Description: EVAL BOARD FOR RW612Packaging: Box Frequency: 2.4GHz, 5GHz Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE) Contents: Board(s), Cable(s) Utilized IC / Part: RW612 Antenna Type: PCB Trace Antenna(s) On-Board |
на замовлення 137 шт: термін постачання 21-31 дні (днів) |
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74AUP2G34GF,132 | NXP USA Inc. |
Description: IC BUFF DL LOW PWR N-INV 6XSONPackaging: Bulk Package / Case: 6-XFDFN Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 2 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 0.8V ~ 3.6V Number of Bits per Element: 1 Current - Output High, Low: 4mA, 4mA Supplier Device Package: 6-XSON, SOT891 (1x1) |
на замовлення 73750 шт: термін постачання 21-31 дні (днів) |
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MMA9550LR1 | NXP USA Inc. |
Description: ACCELEROMETER 2-8G I2C/SPI 16LGAFeatures: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor Packaging: Bulk Package / Case: 16-VFLGA Output Type: I2C, SPI Mounting Type: Surface Mount Type: Digital Axis: X, Y, Z Acceleration Range: ±2g, 4g, 8g Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.71V ~ 1.89V Bandwidth: 1.9Hz ~ 244Hz Supplier Device Package: 16-LGA (3x3) Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g) |
на замовлення 1000 шт: термін постачання 21-31 дні (днів) |
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MMA6255AKEG | NXP USA Inc. |
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC Packaging: Bulk Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Axis: X, Y Acceleration Range: ±50g Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V Bandwidth: 3kHz Supplier Device Package: 20-SOIC |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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MC9328MX21SCVK | NXP USA Inc. |
Description: IC MPU I.MX21 266MHZ 289LFBGAPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: ARM926EJ-S Voltage - I/O: 1.8V, 3.0V Supplier Device Package: 289-LFBGA (14x14) USB: USB 1.x (2) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MCZ33897TEF | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOICPackaging: Tube Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PVR100AZ-B12V,115 | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A SC-73Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN + Zener Operating Temperature: 150°C (TJ) Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Supplier Device Package: SC-73 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 550 mW |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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PVR100AZ-B2V5,115 | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A SC-73Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN + Zener Operating Temperature: 150°C (TJ) Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Supplier Device Package: SC-73 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 550 mW |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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PVR100AZ-B3V3,115 | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A SC-73Packaging: Bulk Package / Case: TO-261-4, TO-261AA Mounting Type: Surface Mount Transistor Type: NPN + Zener Operating Temperature: 150°C (TJ) Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Supplier Device Package: SC-73 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 45 V Power - Max: 550 mW |
на замовлення 3000 шт: термін постачання 21-31 дні (днів) |
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| NZX6V8C,133 | NXP USA Inc. |
Description: DIODE ZENER 6.8V 500MW ALF2Packaging: Bulk |
на замовлення 48290 шт: термін постачання 21-31 дні (днів) |
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MC68302CAG16VC | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: M68000 Voltage - I/O: 3.3V Supplier Device Package: 144-LQFP (20x20) Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC68302CEH20C | NXP USA Inc. |
Description: IC MPU M683XX 20MHZ 132PQFPPackaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 20MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: M68000 Voltage - I/O: 5.0V Supplier Device Package: 132-PQFP (46x46) Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI |
товару немає в наявності |
В кошику од. на суму грн. |
| MKE04Z128VLH4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MKE04Z128VLH4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 1029 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 375.28 грн |
| 10+ | 235.18 грн |
| 25+ | 233.76 грн |
| 100+ | 218.09 грн |
| 250+ | 207.19 грн |
| 500+ | 191.15 грн |
| MCIMX6U1AVM10AD |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6DL 1GHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 1GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
товару немає в наявності
В кошику
од. на суму грн.
| PDTA115EMB,315 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.02A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
Description: TRANS PREBIAS PNP 50V 0.02A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 20 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 100 kOhms
Resistor - Emitter Base (R2): 100 kOhms
на замовлення 190000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11225+ | 2.39 грн |
| PDTA115TMB,315 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 100 kOhms
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 100 kOhms
на замовлення 159975 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11225+ | 2.39 грн |
| MKE02Z32VFM4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 130.97 грн |
| MKE02Z32VFM4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 267.46 грн |
| 10+ | 193.73 грн |
| 25+ | 177.74 грн |
| 100+ | 150.25 грн |
| 250+ | 142.37 грн |
| 500+ | 137.61 грн |
| 1000+ | 131.51 грн |
| 2500+ | 127.44 грн |
| MC56F81746LMLF |
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Виробник: NXP USA Inc.
Description: MC56F81746LMLF
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
Description: MC56F81746LMLF
Packaging: Bulk
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 125°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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| 74ABT16373BDL,112 |
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Виробник: NXP USA Inc.
Description: IC 16BIT D TYPE LATCH 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2ns
Supplier Device Package: 48-SSOP
Description: IC 16BIT D TYPE LATCH 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Circuit: 8:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 2
Current - Output High, Low: 32mA, 64mA
Delay Time - Propagation: 2ns
Supplier Device Package: 48-SSOP
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| MPC567XKIT516-PT |
Виробник: NXP USA Inc.
Description: MPC567X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC567x
Description: MPC567X EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: e200
Utilized IC / Part: MPC567x
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| MPC860TCZQ50D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPC860DECZQ50D4 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPC860ENZQ50D4R2 |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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од. на суму грн.
| MCIMX515DJM8CR2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Tape & Reel (TR)
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
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| MCIMX515DJM8CR2 |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Description: IC MPU I.MX51 800MHZ 529BGA
Packaging: Bulk
Package / Case: 529-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -20°C ~ 85°C (TC)
Core Processor: ARM® Cortex®-A8
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Supplier Device Package: 529-BGA (19x19)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
на замовлення 3651 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 3485.80 грн |
| MCIMX31LDVKN5D |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 457LFBGA
Packaging: Bulk
Package / Case: 457-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 457-LFBGA (14x14)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
Description: IC MPU I.MX31 532MHZ 457LFBGA
Packaging: Bulk
Package / Case: 457-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 457-LFBGA (14x14)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
на замовлення 2019 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10+ | 2213.22 грн |
| MRF9060NR1 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 26V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 945MHz
Power - Output: 60W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 450 mA
Description: RF MOSFET LDMOS 26V TO270-2
Packaging: Tape & Reel (TR)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 945MHz
Power - Output: 60W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Voltage - Rated: 65 V
Voltage - Test: 26 V
Current - Test: 450 mA
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| PESD2NFC-LYL |
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Виробник: NXP USA Inc.
Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
Description: TVS DIODE 24VWM DFN1006-2
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Voltage - Reverse Standoff (Typ): 24V (Max)
Supplier Device Package: DFN1006-2
Bidirectional Channels: 1
Power Line Protection: No
на замовлення 3760 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3760+ | 7.16 грн |
| 74HCT4053PW,112 |
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на замовлення 16005 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1723+ | 13.53 грн |
| MKE02Z16VLC2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2000+ | 112.22 грн |
| MKE02Z16VLC2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 2000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 213.13 грн |
| 10+ | 152.60 грн |
| 25+ | 139.56 грн |
| 100+ | 117.51 грн |
| 250+ | 111.09 грн |
| 500+ | 107.22 грн |
| 1000+ | 102.33 грн |
| MKE02Z16VLC4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
Description: IC MCU 32BIT 16KB FLASH 32LQFP
Packaging: Cut Tape (CT)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 28
на замовлення 1359 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 210.62 грн |
| 10+ | 151.15 грн |
| 25+ | 138.27 грн |
| 100+ | 116.92 грн |
| 250+ | 110.50 грн |
| 500+ | 106.23 грн |
| 1000+ | 101.68 грн |
| MKL02Z8VFG4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 110.23 грн |
| MKL02Z8VFG4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 214.80 грн |
| 10+ | 154.05 грн |
| 25+ | 140.85 грн |
| 100+ | 118.63 грн |
| 250+ | 112.16 грн |
| 500+ | 108.26 грн |
| 1000+ | 103.33 грн |
| 2500+ | 99.99 грн |
| MKL02Z32VFG4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Tape & Reel (TR)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 106.71 грн |
| MKL02Z32VFG4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 16QFN
Packaging: Cut Tape (CT)
Package / Case: 16-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 14
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 223.16 грн |
| 10+ | 160.33 грн |
| 25+ | 146.68 грн |
| 100+ | 123.62 грн |
| 250+ | 116.92 грн |
| 500+ | 112.89 грн |
| 1000+ | 107.77 грн |
| 2500+ | 104.32 грн |
| MKL02Z32VFM4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5000+ | 124.10 грн |
| MKL02Z32VFM4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 236.53 грн |
| 10+ | 171.27 грн |
| 25+ | 157.04 грн |
| 100+ | 132.70 грн |
| 250+ | 125.71 грн |
| 500+ | 121.49 грн |
| 1000+ | 116.09 грн |
| 2500+ | 112.48 грн |
| MKE02Z32VLD2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1500+ | 163.92 грн |
| MKE02Z32VLD2R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 298.38 грн |
| 10+ | 216.67 грн |
| 25+ | 198.99 грн |
| 100+ | 168.54 грн |
| 250+ | 159.84 грн |
| 500+ | 154.60 грн |
| MKE02Z32VLD4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1500+ | 146.90 грн |
| MKE02Z32VLD4R |
![]() |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 44LQFP
Packaging: Cut Tape (CT)
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 37
DigiKey Programmable: Not Verified
на замовлення 1500 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 296.71 грн |
| 10+ | 215.54 грн |
| 25+ | 197.93 грн |
| 100+ | 167.64 грн |
| 250+ | 158.99 грн |
| 500+ | 153.78 грн |
| MKE15Z64VFP4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
Description: IC MCU 32BIT 64KB FLASH 40VFQFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 40-HVQFN (5x5)
Number of I/O: 36
на замовлення 5000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 301.73 грн |
| 10+ | 219.40 грн |
| 25+ | 201.57 грн |
| 100+ | 170.75 грн |
| 250+ | 161.97 грн |
| 500+ | 156.68 грн |
| 1000+ | 149.83 грн |
| 2500+ | 145.31 грн |
| MKE04Z128VQH4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 58
DigiKey Programmable: Not Verified
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| MKE04Z128VQH4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 58
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLASH 64QFP
Packaging: Cut Tape (CT)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b; D/A 2x6b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 58
DigiKey Programmable: Not Verified
на замовлення 456 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 372.77 грн |
| 10+ | 233.65 грн |
| 25+ | 232.28 грн |
| 100+ | 216.69 грн |
| 250+ | 205.86 грн |
| MRF8HP21130HSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S-4L
Mounting Type: Surface Mount
Frequency: 2.17GHz
Configuration: Dual
Power - Output: 28W
Gain: 14dB
Technology: LDMOS
Supplier Device Package: NI-780S-4L
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 360 mA
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| P5020NSE7TNB |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
Description: IC MPU QORIQ P5 2.0GHZ 1295BGA
Packaging: Tray
Package / Case: 1295-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e5500
Supplier Device Package: 1295-FCPBGA (37.5x37.5)
Ethernet: 1Gbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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| MC33FS6504LAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 249 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 772.29 грн |
| 10+ | 581.67 грн |
| 25+ | 541.09 грн |
| 100+ | 465.97 грн |
| S9S12GN16J1MLC |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
Description: IC MCU 16BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 26
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| MCF5274LVF166 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 196MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V2
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.4V ~ 1.6V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, WDT
Supplier Device Package: 196-LBGA (15x15)
Number of I/O: 61
DigiKey Programmable: Not Verified
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| SPC5744BSK1AVKU2 |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1.5MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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| S912XEG128BVAAR |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| S912XEG128BVAA |
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| FRDM-RW612 |
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Виробник: NXP USA Inc.
Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Utilized IC / Part: RW612
Antenna Type: PCB Trace Antenna(s) On-Board
Description: EVAL BOARD FOR RW612
Packaging: Box
Frequency: 2.4GHz, 5GHz
Type: Transceiver; 802.11 a/b/g/n/ac/ax (Wi-Fi, WiFi, WLAN), 802.15.4 (Thread, Zigbee®), Bluetooth® 5.x (BLE)
Contents: Board(s), Cable(s)
Utilized IC / Part: RW612
Antenna Type: PCB Trace Antenna(s) On-Board
на замовлення 137 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2071.97 грн |
| 74AUP2G34GF,132 |
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Виробник: NXP USA Inc.
Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
Description: IC BUFF DL LOW PWR N-INV 6XSON
Packaging: Bulk
Package / Case: 6-XFDFN
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 6-XSON, SOT891 (1x1)
на замовлення 73750 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1845+ | 12.83 грн |
| MMA9550LR1 |
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Виробник: NXP USA Inc.
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
Description: ACCELEROMETER 2-8G I2C/SPI 16LGA
Features: Adjustable Bandwidth, Selectable Scale, Sleep Mode, Temperature Sensor
Packaging: Bulk
Package / Case: 16-VFLGA
Output Type: I2C, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 1.89V
Bandwidth: 1.9Hz ~ 244Hz
Supplier Device Package: 16-LGA (3x3)
Sensitivity (LSB/g): 16393 (±2g) ~ 4098 (±8g)
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 107+ | 226.13 грн |
| MMA6255AKEG |
Виробник: NXP USA Inc.
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
Description: IC SENSOR ACCEL DUAL AXIS 20SOIC
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Axis: X, Y
Acceleration Range: ±50g
Voltage - Supply: 3.15V ~ 3.45V, 4.75V ~ 5.25V
Bandwidth: 3kHz
Supplier Device Package: 20-SOIC
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 27+ | 892.49 грн |
| MC9328MX21SCVK |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
Description: IC MPU I.MX21 266MHZ 289LFBGA
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: ARM926EJ-S
Voltage - I/O: 1.8V, 3.0V
Supplier Device Package: 289-LFBGA (14x14)
USB: USB 1.x (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD
Additional Interfaces: 1-Wire, I2C, I2S, SPI, SSI, MMC/SD, UART
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| MCZ33897TEF |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
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| PVR100AZ-B12V,115 |
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Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN + Zener
Operating Temperature: 150°C (TJ)
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 550 mW
Description: TRANS NPN 45V 0.1A SC-73
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN + Zener
Operating Temperature: 150°C (TJ)
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 550 mW
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 8.82 грн |
| PVR100AZ-B2V5,115 |
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Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN + Zener
Operating Temperature: 150°C (TJ)
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 550 mW
Description: TRANS NPN 45V 0.1A SC-73
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN + Zener
Operating Temperature: 150°C (TJ)
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 550 mW
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 8.82 грн |
| PVR100AZ-B3V3,115 |
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Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A SC-73
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN + Zener
Operating Temperature: 150°C (TJ)
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 550 mW
Description: TRANS NPN 45V 0.1A SC-73
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN + Zener
Operating Temperature: 150°C (TJ)
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Supplier Device Package: SC-73
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 550 mW
на замовлення 3000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3000+ | 8.82 грн |
| NZX6V8C,133 |
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на замовлення 48290 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 13172+ | 1.60 грн |
| MC68302CAG16VC |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Description: IC MPU M683XX 16MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
товару немає в наявності
В кошику
од. на суму грн.
| MC68302CEH20C |
![]() |
Виробник: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Description: IC MPU M683XX 20MHZ 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 20MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 132-PQFP (46x46)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
товару немає в наявності
В кошику
од. на суму грн.































