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S9S12ZVL32F0VLC S9S12ZVL32F0VLC NXP USA Inc. S9S12ZVL_FamilyRefManual_DS.pdf Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
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MPF5301AMDA0ES NXP USA Inc. PF5300_SDS.pdf Description: IC REG BUCK ADJ 8A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 8A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
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FS32K146HRT0MLHT FS32K146HRT0MLHT NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MPXY8500DK016T1 MPXY8500DK016T1 NXP USA Inc. PHGL-S-A0003023996-1.pdf?t.download=true&u=5oefqw Description: RF TX IC FSK 315/434MHZ 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 8kB Flash, 512B SRAM
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: TPM (Tire Pressure Monitor)
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (9x9)
DigiKey Programmable: Not Verified
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MIMXRT1015CAF4BR NXP USA Inc. IMXRT1015IEC.pdf Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+474.12 грн
10+405.24 грн
25+386.51 грн
50+349.94 грн
100+337.59 грн
250+321.92 грн
500+305.43 грн
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BUK9607-30B,118 NXP USA Inc. BUK9607-30B.pdf Description: MOSFET N-CH 30V 75A D2PAK
Packaging: Bulk
на замовлення 1087 шт:
термін постачання 21-31 дні (днів)
720+31.63 грн
Мінімальне замовлення: 720
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MGD3160AM315EKR2 MGD3160AM315EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
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MGD3160AM315EKR2 MGD3160AM315EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
на замовлення 740 шт:
термін постачання 21-31 дні (днів)
1+661.73 грн
10+496.47 грн
25+461.25 грн
100+396.57 грн
250+379.27 грн
500+368.84 грн
В кошику  од. на суму  грн.
MPC5200CBV400 MPC5200CBV400 NXP USA Inc. MPC5200.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC555LFCZP40 MPC555LFCZP40 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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MPC562CZP40 MPC562CZP40 NXP USA Inc. MPC561RM.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC8241LVR166D MPC8241LVR166D NXP USA Inc. MPC8241.pdf Description: IC MPU MPC82XX 166MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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MC9S08PL8SCTJR MC9S08PL8SCTJR NXP USA Inc. MC9S08PL16S.pdf Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
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LPC11E68JBD64K LPC11E68JBD64K NXP USA Inc. LPC11E6X.pdf Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
1+528.29 грн
10+357.46 грн
25+338.07 грн
100+267.15 грн
250+249.75 грн
500+245.73 грн
В кошику  од. на суму  грн.
MFS2613AMDH3AD MFS2613AMDH3AD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2613AMDH3AD
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MCF52221CVM80 MCF52221CVM80 NXP USA Inc. Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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88W8782-B0-NAPC/DZ NXP USA Inc. Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
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P3T2030DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030DUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
3500+26.08 грн
Мінімальне замовлення: 3500
В кошику  од. на суму  грн.
P3T2030DUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030DUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
4+98.12 грн
10+59.64 грн
25+50.28 грн
100+37.30 грн
250+32.46 грн
500+29.49 грн
1000+26.58 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
P3T2030EUKAZ P3T2030EUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030EUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
3500+25.44 грн
Мінімальне замовлення: 3500
В кошику  од. на суму  грн.
P3T2030EUKAZ P3T2030EUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030EUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
6+55.73 грн
10+38.32 грн
25+34.44 грн
100+28.31 грн
250+26.40 грн
500+25.25 грн
1000+23.90 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
P3T2030BUKAZ P3T2030BUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030BUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
6+54.95 грн
10+38.17 грн
25+34.26 грн
100+28.16 грн
250+26.26 грн
500+25.11 грн
1000+23.77 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
P3T2030FUKAZ P3T2030FUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030FUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030FUKAZ P3T2030FUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030FUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3497 шт:
термін постачання 21-31 дні (днів)
6+55.73 грн
10+38.32 грн
25+34.44 грн
100+28.31 грн
250+26.40 грн
500+25.25 грн
1000+23.90 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
P3T1035AUKAZ P3T1035AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035AUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T1035AUKAZ P3T1035AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T1035AUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3418 шт:
термін постачання 21-31 дні (днів)
6+52.16 грн
10+49.44 грн
25+43.44 грн
50+41.40 грн
100+39.56 грн
500+35.24 грн
1000+33.88 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MC68360ZQ25VL MC68360ZQ25VL NXP USA Inc. MC68360.pdf Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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P1017NSE5CFB NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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74HCT30DB,118 74HCT30DB,118 NXP USA Inc. 74HC_HCT30.pdf Description: IC GATE NAND 1CH 8-INP 14-SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 8
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
на замовлення 14000 шт:
термін постачання 21-31 дні (днів)
1776+12.80 грн
Мінімальне замовлення: 1776
В кошику  од. на суму  грн.
SPC5606SF2CLU6 SPC5606SF2CLU6 NXP USA Inc. MPC5606S.pdf Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
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NT2H1511G0DUDZ NXP USA Inc. NTAG213_215_216.pdf Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
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NT2H1511G0DUDV NXP USA Inc. NTAG213_215_216.pdf Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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ON5088,115 ON5088,115 NXP USA Inc. ON5088.pdf Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
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ON5088,115 ON5088,115 NXP USA Inc. ON5088.pdf Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
на замовлення 1704 шт:
термін постачання 21-31 дні (днів)
11+29.83 грн
15+21.39 грн
25+19.08 грн
100+15.22 грн
250+13.76 грн
500+12.80 грн
1000+11.77 грн
Мінімальне замовлення: 11
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LPC11U14FET48/201, LPC11U14FET48/201, NXP USA Inc. LPC11U1X.pdf Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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FS32R294HFK0MJDT NXP USA Inc. S32R29XFS.pdf Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tray
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FS32R294HFK0MJDR NXP USA Inc. S32R29XFS.pdf Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)
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PR5331C3HN/C350,55 PR5331C3HN/C350,55 NXP USA Inc. PR533.pdf Description: IC RFID READER 13.56MHZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
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MCF51EM128CLL MCF51EM128CLL NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
на замовлення 2324 шт:
термін постачання 21-31 дні (днів)
34+648.04 грн
Мінімальне замовлення: 34
В кошику  од. на суму  грн.
MCF51EM128CLL MCF51EM128CLL NXP USA Inc. MCF51EM256.pdf Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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FX32K118LAT0MLHT NXP USA Inc. S32K1xx.pdf Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
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MVR5510AVMANEP MVR5510AVMANEP NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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FC32K116LAT0MLFT NXP USA Inc. Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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MCXC144VFT MCXC144VFT NXP USA Inc. MCXCFS.pdf Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
на замовлення 1280 шт:
термін постачання 21-31 дні (днів)
2+253.55 грн
10+187.77 грн
25+174.67 грн
100+143.67 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
SAF775CHN/N208W/DK NXP USA Inc. Description: CAR DISP
Packaging: Tray
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MPC8245LZU350D MPC8245LZU350D NXP USA Inc. MPC8245.pdf Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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S9S08SL16F1VTL S9S08SL16F1VTL NXP USA Inc. Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08AC8MFDE MC9S08AC8MFDE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC33FS8510A0KS MC33FS8510A0KS NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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S912ZVL96AVFM NXP USA Inc. Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
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MFS2630AMBA0AD NXP USA Inc. PB_FS26.pdf Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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S32K310NHT0MLFSR NXP USA Inc. S32K3xx.pdf Description: IC MCU
Packaging: Bulk
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S32K310NHT0MLFST S32K310NHT0MLFST NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0MLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K310NHT0MPAST S32K310NHT0MPAST NXP USA Inc. S32K3xx.pdf Description: S32K310NHT0MPAST
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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MRF7S19100NBR1 MRF7S19100NBR1 NXP USA Inc. MRF7S19100N.pdf Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 1.93GHz ~ 1.99GHz
Power - Output: 29W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1 A
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MMA5224KW NXP USA Inc. MMA52xxKW.pdf Description: ACCELEROMETER 240G PCM/SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±240g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 2
Grade: Automotive
Qualification: AEC-Q100
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MC9S08QE96CFT MC9S08QE96CFT NXP USA Inc. MC9S08QE128.pdf Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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S32K314NHT1MPBSR S32K314NHT1MPBSR NXP USA Inc. S32K3xx.pdf Description: S32K314NHT1MPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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S32K314NHT1VPBSR S32K314NHT1VPBSR NXP USA Inc. S32K3xx.pdf Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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MCZ33903C5EK MCZ33903C5EK NXP USA Inc. MC33903%2C4%2C5.pdf Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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S9S12ZVL32F0VLC S9S12ZVL_FamilyRefManual_DS.pdf
S9S12ZVL32F0VLC
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 19
DigiKey Programmable: Not Verified
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MPF5301AMDA0ES PF5300_SDS.pdf
Виробник: NXP USA Inc.
Description: IC REG BUCK ADJ 8A 24HWQFN
Packaging: Tray
Package / Case: 24-PowerWFQFN
Output Type: Adjustable
Mounting Type: Surface Mount, Wettable Flank
Number of Outputs: 1
Function: Step-Down
Current - Output: 8A
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz ~ 3MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 24-HWQFN (4.5x3.5)
Synchronous Rectifier: No
Voltage - Output (Max): 1.2V
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 0.5V
товару немає в наявності
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FS32K146HRT0MLHT S32K1xx.pdf
FS32K146HRT0MLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MPXY8500DK016T1 PHGL-S-A0003023996-1.pdf?t.download=true&u=5oefqw
MPXY8500DK016T1
Виробник: NXP USA Inc.
Description: RF TX IC FSK 315/434MHZ 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-QFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Memory Size: 8kB Flash, 512B SRAM
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.3V ~ 3.6V
Applications: TPM (Tire Pressure Monitor)
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 32-QFN (9x9)
DigiKey Programmable: Not Verified
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MIMXRT1015CAF4BR IMXRT1015IEC.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB ROM 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 400MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V
Connectivity: EBI/EMI, I2C, SAI, SPDIF, SPI, UART/USART, USB2.0 OTG
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 57
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+474.12 грн
10+405.24 грн
25+386.51 грн
50+349.94 грн
100+337.59 грн
250+321.92 грн
500+305.43 грн
В кошику  од. на суму  грн.
BUK9607-30B,118 BUK9607-30B.pdf
Виробник: NXP USA Inc.
Description: MOSFET N-CH 30V 75A D2PAK
Packaging: Bulk
на замовлення 1087 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
720+31.63 грн
Мінімальне замовлення: 720
В кошику  од. на суму  грн.
MGD3160AM315EKR2 GD3160.pdf
MGD3160AM315EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
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MGD3160AM315EKR2 GD3160.pdf
MGD3160AM315EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: General Purpose
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: IGBT
Voltage - Load: 4.5V ~ 40V
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive
на замовлення 740 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+661.73 грн
10+496.47 грн
25+461.25 грн
100+396.57 грн
250+379.27 грн
500+368.84 грн
В кошику  од. на суму  грн.
MPC5200CBV400 MPC5200.pdf
MPC5200CBV400
Виробник: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 272-PBGA (27x27)
Ethernet: 10/100Mbps (1)
USB: USB 1.1 (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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MPC555LFCZP40 MPC555PB.pdf
MPC555LFCZP40
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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MPC562CZP40 MPC561RM.pdf
MPC562CZP40
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
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MPC8241LVR166D MPC8241.pdf
MPC8241LVR166D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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MC9S08PL8SCTJR MC9S08PL16S.pdf
MC9S08PL8SCTJR
Виробник: NXP USA Inc.
Description: PL16S, 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: HCS08
Data Converters: A/D 12x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 18
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LPC11E68JBD64K LPC11E6X.pdf
LPC11E68JBD64K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
на замовлення 800 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+528.29 грн
10+357.46 грн
25+338.07 грн
100+267.15 грн
250+249.75 грн
500+245.73 грн
В кошику  од. на суму  грн.
MFS2613AMDH3AD MFS2633AMDAJAD.pdf
MFS2613AMDH3AD
Виробник: NXP USA Inc.
Description: MFS2613AMDH3AD
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MCF52221CVM80
MCF52221CVM80
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Tray
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 56
DigiKey Programmable: Not Verified
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88W8782-B0-NAPC/DZ
Виробник: NXP USA Inc.
Description: IC RF 68HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 68-HVQFN (8x8)
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P3T2030DUKAZ P3T1035XUK_P3T2030XUK.pdf
Виробник: NXP USA Inc.
Description: P3T2030DUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3500+26.08 грн
Мінімальне замовлення: 3500
В кошику  од. на суму  грн.
P3T2030DUKAZ P3T1035XUK_P3T2030XUK.pdf
Виробник: NXP USA Inc.
Description: P3T2030DUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+98.12 грн
10+59.64 грн
25+50.28 грн
100+37.30 грн
250+32.46 грн
500+29.49 грн
1000+26.58 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
P3T2030EUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030EUKAZ
Виробник: NXP USA Inc.
Description: P3T2030EUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3500+25.44 грн
Мінімальне замовлення: 3500
В кошику  од. на суму  грн.
P3T2030EUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030EUKAZ
Виробник: NXP USA Inc.
Description: P3T2030EUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+55.73 грн
10+38.32 грн
25+34.44 грн
100+28.31 грн
250+26.40 грн
500+25.25 грн
1000+23.90 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
P3T2030BUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030BUKAZ
Виробник: NXP USA Inc.
Description: P3T2030BUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+54.95 грн
10+38.17 грн
25+34.26 грн
100+28.16 грн
250+26.26 грн
500+25.11 грн
1000+23.77 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
P3T2030FUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030FUKAZ
Виробник: NXP USA Inc.
Description: P3T2030FUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
товару немає в наявності
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P3T2030FUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030FUKAZ
Виробник: NXP USA Inc.
Description: P3T2030FUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3497 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+55.73 грн
10+38.32 грн
25+34.44 грн
100+28.31 грн
250+26.40 грн
500+25.25 грн
1000+23.90 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
P3T1035AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035AUKAZ
Виробник: NXP USA Inc.
Description: P3T1035AUKAZ
Packaging: Tape & Reel (TR)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
товару немає в наявності
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P3T1035AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T1035AUKAZ
Виробник: NXP USA Inc.
Description: P3T1035AUKAZ
Packaging: Cut Tape (CT)
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±0.5%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3418 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+52.16 грн
10+49.44 грн
25+43.44 грн
50+41.40 грн
100+39.56 грн
500+35.24 грн
1000+33.88 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MC68360ZQ25VL MC68360.pdf
MC68360ZQ25VL
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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P1017NSE5CFB P1_Series_FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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74HCT30DB,118 74HC_HCT30.pdf
74HCT30DB,118
Виробник: NXP USA Inc.
Description: IC GATE NAND 1CH 8-INP 14-SSOP
Packaging: Bulk
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 4mA, 4mA
Number of Inputs: 8
Supplier Device Package: 14-SSOP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 28ns @ 4.5V, 50pF
Number of Circuits: 1
Current - Quiescent (Max): 2 µA
на замовлення 14000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1776+12.80 грн
Мінімальне замовлення: 1776
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SPC5606SF2CLU6 MPC5606S.pdf
SPC5606SF2CLU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 16x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 136
DigiKey Programmable: Not Verified
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NT2H1511G0DUDZ NTAG213_215_216.pdf
Виробник: NXP USA Inc.
Description: IC RFID TRANSP 13.56MHZ DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 75°C
Standards: ISO 14443
Supplier Device Package: Die
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NT2H1511G0DUDV NTAG213_215_216.pdf
Виробник: NXP USA Inc.
Description: NFC FORUM TYPE 2 TAG COMPLIANT I
Packaging: Tray
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader/Transponder
Operating Temperature: -25°C ~ 70°C (TA)
Standards: Mifare, NFC
Supplier Device Package: Wafer
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ON5088,115 ON5088.pdf
ON5088,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Tape & Reel (TR)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
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ON5088,115 ON5088.pdf
ON5088,115
Виробник: NXP USA Inc.
Description: RF TRANS NPN 10V 55GHZ 4DFP
Packaging: Cut Tape (CT)
Package / Case: SOT-343F
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 13dB
Power - Max: 136mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 10V
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 10mA, 2V
Frequency - Transition: 55GHz
Noise Figure (dB Typ @ f): 1.1dB @ 12GHz
Supplier Device Package: 4-DFP
на замовлення 1704 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
11+29.83 грн
15+21.39 грн
25+19.08 грн
100+15.22 грн
250+13.76 грн
500+12.80 грн
1000+11.77 грн
Мінімальне замовлення: 11
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LPC11U14FET48/201, LPC11U1X.pdf
LPC11U14FET48/201,
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 40
DigiKey Programmable: Not Verified
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FS32R294HFK0MJDT S32R29XFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tray
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FS32R294HFK0MJDR S32R29XFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2.5MB CRAM 269LFBGA
Packaging: Tape & Reel (TR)
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PR5331C3HN/C350,55 PR533.pdf
PR5331C3HN/C350,55
Виробник: NXP USA Inc.
Description: IC RFID READER 13.56MHZ 40HVQFN
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, UART
Type: RFID Reader
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Standards: FeliCa, ISO 14443, MIFARE, NFC
Supplier Device Package: 40-HVQFN (6x6)
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MCF51EM128CLL MCF51EM256.pdf
MCF51EM128CLL
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
на замовлення 2324 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
34+648.04 грн
Мінімальне замовлення: 34
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MCF51EM128CLL MCF51EM256.pdf
MCF51EM128CLL
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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FX32K118LAT0MLHT S32K1xx.pdf
Виробник: NXP USA Inc.
Description: S32K118 ARM CORTEX-M0+, 48 MHZ,
Packaging: Tray
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MVR5510AVMANEP VR5510.pdf
MVR5510AVMANEP
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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FC32K116LAT0MLFT
Виробник: NXP USA Inc.
Description: S32K116 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
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MCXC144VFT MCXCFS.pdf
MCXC144VFT
Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+
Packaging: Tray
Package / Case: 48-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 40
на замовлення 1280 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+253.55 грн
10+187.77 грн
25+174.67 грн
100+143.67 грн
Мінімальне замовлення: 2
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SAF775CHN/N208W/DK
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Tray
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MPC8245LZU350D MPC8245.pdf
MPC8245LZU350D
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 350MHZ 352TBGA
Packaging: Tray
Package / Case: 352-LBGA
Mounting Type: Surface Mount
Speed: 350MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC 603e
Voltage - I/O: 3.3V
Supplier Device Package: 352-TBGA (35x35)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, I²O, PCI, UART
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S9S08SL16F1VTL
S9S08SL16F1VTL
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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MC9S08AC8MFDE MC9S08AC16.pdf
MC9S08AC8MFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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MC33FS8510A0KS FS84_FS85C_DS.pdf
MC33FS8510A0KS
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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S912ZVL96AVFM
Виробник: NXP USA Inc.
Description: S12Z CPU, 96K FLASH
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 32MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 6x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN-EP (5x5)
Number of I/O: 19
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MFS2630AMBA0AD PB_FS26.pdf
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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S32K310NHT0MLFSR S32K3xx.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
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S32K310NHT0MLFST S32K3xx.pdf
S32K310NHT0MLFST
Виробник: NXP USA Inc.
Description: S32K310NHT0MLFST
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 48-LQFP (7x7)
Grade: Automotive
Number of I/O: 42
Qualification: AEC-Q100
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S32K310NHT0MPAST S32K3xx.pdf
S32K310NHT0MPAST
Виробник: NXP USA Inc.
Description: S32K310NHT0MPAST
Packaging: Tray
Package / Case: 100-QFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 100-MaxQFP (10x10)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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MRF7S19100NBR1 MRF7S19100N.pdf
MRF7S19100NBR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO272-4
Packaging: Tape & Reel (TR)
Package / Case: TO-272BB
Mounting Type: Chassis Mount
Frequency: 1.93GHz ~ 1.99GHz
Power - Output: 29W
Gain: 17.5dB
Technology: LDMOS
Supplier Device Package: TO-272 WB-4
Voltage - Rated: 65 V
Voltage - Test: 28 V
Current - Test: 1 A
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MMA5224KW MMA52xxKW.pdf
Виробник: NXP USA Inc.
Description: ACCELEROMETER 240G PCM/SPI 16QFN
Features: Selectable Low Pass Filter
Packaging: Tube
Package / Case: 16-QFN Exposed Pad
Output Type: PCM, SPI
Mounting Type: Surface Mount
Type: Digital
Axis: X
Acceleration Range: ±240g
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.2V ~ 17V
Supplier Device Package: 16-QFN (6x6)
Sensitivity (LSB/g): 2
Grade: Automotive
Qualification: AEC-Q100
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MC9S08QE96CFT MC9S08QE128.pdf
MC9S08QE96CFT
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 38
DigiKey Programmable: Not Verified
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S32K314NHT1MPBSR S32K3xx.pdf
S32K314NHT1MPBSR
Виробник: NXP USA Inc.
Description: S32K314NHT1MPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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S32K314NHT1VPBSR S32K3xx.pdf
S32K314NHT1VPBSR
Виробник: NXP USA Inc.
Description: S32K314 ARM CORTEX-M7, 160 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 218
Qualification: AEC-Q100
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MCZ33903C5EK MC33903%2C4%2C5.pdf
MCZ33903C5EK
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Applications: System Basis Chip
Supplier Device Package: 32-SOIC-EP
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