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MCF5483CVR166 MCF5483CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 200 шт
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TJA1465B-EVB NXP USA Inc. Description: TJA1465B-EVB
Utilized IC / Part: TJA1465B
Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Bulk
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MCDXTM4CK344 NXP USA Inc. Description: MCDXTM4CK344
Packaging: Bulk
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SAF4000EL/101Q53BY NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 1000 шт
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FS32K148HET0VLLT FS32K148HET0VLLT NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
товару немає в наявності
 Мінімальне замовлення: 450 шт
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PCAL9722HNHP PCAL9722HNHP NXP USA Inc. PCAL9722.pdf Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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PCAL9722HN/Q900HP PCAL9722HN/Q900HP NXP USA Inc. PCAL9722.pdf Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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A3T19H455W23SR6 NXP USA Inc. A3T19H455W23S.pdf Description: RF MOSFET
Packaging: Bulk
на замовлення 1036 шт:
термін постачання 21-31 дні (днів)
2+10381.05 грн
Мінімальне замовлення: 2 шт
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LS1048ASN7PTA LS1048ASN7PTA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товару немає в наявності
 Мінімальне замовлення: 60 шт
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MC56F8122VFAE MC56F8122VFAE NXP USA Inc. MC56F8322.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
товару немає в наявності
 Мінімальне замовлення: 1250 шт
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T2081NSN8T1B NXP USA Inc. T2080FS.pdf Description: QORIQ T2080 AND T2081 MULTICORE
Packaging: Bulk
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
1+23024.83 грн
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MKV30F64VLF10 MKV30F64VLF10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
товару немає в наявності
 Мінімальне замовлення: 1250 шт
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P3H2840HN-ARD NXP USA Inc. Description: P3H2840HN-ARD
Packaging: Bulk
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LFINTPL3QA NXP USA Inc. Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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MX95LP4XEVK-15CM NXP USA Inc. Description: MX95LP4XEVK-15CM
Packaging: Bulk
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MPXV10GC7U MPXV10GC7U NXP USA Inc. MPX10.pdf Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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MIMXRT1181CVP2C MIMXRT1181CVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182CVP2C MIMXRT1182CVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1181XVP2C MIMXRT1181XVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182XVP2C MIMXRT1182XVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1186CVJ8C MIMXRT1186CVJ8C NXP USA Inc. Description: RT1180,INDUS,196BGA,C0
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 105°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Packaging: Tray
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MIMXRT1186XVJ8C MIMXRT1186XVJ8C NXP USA Inc. Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
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MIMXRT1187CVM8C MIMXRT1187CVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1187XVM8C MIMXRT1187XVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
1+1380.11 грн
10+1058.87 грн
25+991.44 грн
152+844.68 грн
304+821.71 грн
608+802.80 грн
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MIMXRT1189CVM8C MIMXRT1189CVM8C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1186JVJ8C NXP USA Inc. Description: RT1180,INDUS,196BGA,C0
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 189 шт
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MIMXRT1186KVJ8C NXP USA Inc. Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 189 шт
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SC16IS762IPW,128 SC16IS762IPW,128 NXP USA Inc. SC16IS752_SC16IS762.pdf Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
2500+383.58 грн
Мінімальне замовлення: 2500 шт
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SC16IS762IPW,128 SC16IS762IPW,128 NXP USA Inc. SC16IS752_SC16IS762.pdf Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7780 шт:
термін постачання 21-31 дні (днів)
1+643.17 грн
10+481.68 грн
25+447.31 грн
100+384.35 грн
250+377.38 грн
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SPC5748GK0AMMJ6 SPC5748GK0AMMJ6 NXP USA Inc. MPC5746C.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
товару немає в наявності
 Мінімальне замовлення: 450 шт
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S912DG12CE1VPVER S912DG12CE1VPVER NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 500 шт
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S912DG12CE1VPVE S912DG12CE1VPVE NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
товару немає в наявності
 Мінімальне замовлення: 300 шт
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MC9S08DZ60CLC MC9S08DZ60CLC NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 1250 шт
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S32M241LCABMKHSR S32M241LCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M241LCABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M242LCABMKHSR S32M242LCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M242LCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M241CCABMKHSR S32M241CCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M241CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M242CCABMKHSR S32M242CCABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M242CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M241LCABMKHST S32M241LCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M241LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M242LCABMKHST S32M242LCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M242LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M241CCABMKHST S32M241CCABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M241CCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M244LCABMKHSR S32M244LCABMKHSR NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M244CCABMKHSR S32M244CCABMKHSR NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M244LCABMKHST S32M244LCABMKHST NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M244CCABMKHST S32M244CCABMKHST NXP USA Inc. Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M274CHABMKHSR S32M274CHABMKHSR NXP USA Inc. Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M274LHABMKHSR S32M274LHABMKHSR NXP USA Inc. Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M276CHABMKHSR S32M276CHABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M276CHABMKHSR
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M276LHABMKHSR S32M276LHABMKHSR NXP USA Inc. S32M2xx_DS.pdf Description: S32M276LHABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M274LHABMKHST S32M274LHABMKHST NXP USA Inc. S32M2xx_DS.pdf Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M274CHABMKHST S32M274CHABMKHST NXP USA Inc. Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
 Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
NX3P190UK,012 NX3P190UK,012 NXP USA Inc. NX3P190.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
NX3P191UK,012 NX3P191UK,012 NXP USA Inc. NX3P191.pdf Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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A7102CLTK2/T0BC2AJ NXP USA Inc. A71CH.pdf?pspll=1 Description: A7102CLTK2
Supplier Device Package: 8-HVSON (4x4)
Applications: Security
Controller Series: A7102CLTK2
Operating Temperature: -40°C ~ 90°C
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
 Мінімальне замовлення: 6000 шт
В кошику  од. на суму  грн.
S9S12GN32J0MFT S9S12GN32J0MFT NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
товару немає в наявності
 Мінімальне замовлення: 260 шт
В кошику  од. на суму  грн.
PDZ7.5B/ZLX NXP USA Inc. Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику  од. на суму  грн.
MRF1K50GNR5 MRF1K50GNR5 NXP USA Inc. MRF1K50N.pdf Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Bulk
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Voltage - Rated: 50 V
Voltage - Test: 50 V
на замовлення 110 шт:
термін постачання 21-31 дні (днів)
1+18170.04 грн
В кошику  од. на суму  грн.
MGD3160AM335EKR2 MGD3160AM335EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1000 шт
В кошику  од. на суму  грн.
MGD3160AM335EKR2 MGD3160AM335EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 995 шт:
термін постачання 21-31 дні (днів)
1+636.97 грн
10+477.87 грн
25+443.99 грн
100+381.73 грн
250+365.08 грн
500+355.04 грн
В кошику  од. на суму  грн.
MGD3160AM535EKR2 MGD3160AM535EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 697 шт:
термін постачання 21-31 дні (днів)
1+636.97 грн
10+477.87 грн
25+443.99 грн
100+381.73 грн
250+365.08 грн
500+355.04 грн
В кошику  од. на суму  грн.
MC33GD3100BEKR2 MC33GD3100BEKR2 NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
 Мінімальне замовлення: 1000 шт
В кошику  од. на суму  грн.
MCF5483CVR166 MCF5485EC.pdf
MCF5483CVR166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику  од. на суму  грн.
TJA1465B-EVB
Виробник: NXP USA Inc.
Description: TJA1465B-EVB
Utilized IC / Part: TJA1465B
Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Bulk
товару немає в наявності
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MCDXTM4CK344
Виробник: NXP USA Inc.
Description: MCDXTM4CK344
Packaging: Bulk
товару немає в наявності
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SAF4000EL/101Q53BY
Виробник: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику  од. на суму  грн.
FS32K148HET0VLLT S32K1xx.pdf
FS32K148HET0VLLT
Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику  од. на суму  грн.
PCAL9722HNHP PCAL9722.pdf
PCAL9722HNHP
Виробник: NXP USA Inc.
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
товару немає в наявності
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PCAL9722HN/Q900HP PCAL9722.pdf
PCAL9722HN/Q900HP
Виробник: NXP USA Inc.
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
товару немає в наявності
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A3T19H455W23SR6 A3T19H455W23S.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
на замовлення 1036 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
2+10381.05 грн
Мінімальне замовлення: 2 шт
В кошику  од. на суму  грн.
LS1048ASN7PTA LS1088AFS.pdf
LS1048ASN7PTA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товару немає в наявності
Мінімальне замовлення: 60 шт
В кошику  од. на суму  грн.
MC56F8122VFAE MC56F8322.pdf
MC56F8122VFAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику  од. на суму  грн.
T2081NSN8T1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: QORIQ T2080 AND T2081 MULTICORE
Packaging: Bulk
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+23024.83 грн
В кошику  од. на суму  грн.
MKV30F64VLF10 KV30P64M100SFA.pdf
MKV30F64VLF10
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику  од. на суму  грн.
P3H2840HN-ARD
Виробник: NXP USA Inc.
Description: P3H2840HN-ARD
Packaging: Bulk
товару немає в наявності
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LFINTPL3QA
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
товару немає в наявності
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MX95LP4XEVK-15CM
Виробник: NXP USA Inc.
Description: MX95LP4XEVK-15CM
Packaging: Bulk
товару немає в наявності
В кошику  од. на суму  грн.
MPXV10GC7U MPX10.pdf
MPXV10GC7U
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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MIMXRT1181CVP2C IMXRT1180EC.pdf
MIMXRT1181CVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182CVP2C IMXRT1180EC.pdf
MIMXRT1182CVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1181XVP2C IMXRT1180EC.pdf
MIMXRT1181XVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1182XVP2C IMXRT1180EC.pdf
MIMXRT1182XVP2C
Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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MIMXRT1186CVJ8C
MIMXRT1186CVJ8C
Виробник: NXP USA Inc.
Description: RT1180,INDUS,196BGA,C0
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 105°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Packaging: Tray
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MIMXRT1186XVJ8C
MIMXRT1186XVJ8C
Виробник: NXP USA Inc.
Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
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MIMXRT1187CVM8C IMXRT1180EC.pdf
MIMXRT1187CVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1187XVM8C IMXRT1180EC.pdf
MIMXRT1187XVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+1380.11 грн
10+1058.87 грн
25+991.44 грн
152+844.68 грн
304+821.71 грн
608+802.80 грн
В кошику  од. на суму  грн.
MIMXRT1189CVM8C IMXRT1180EC.pdf
MIMXRT1189CVM8C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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MIMXRT1186JVJ8C
Виробник: NXP USA Inc.
Description: RT1180,INDUS,196BGA,C0
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 189 шт
В кошику  од. на суму  грн.
MIMXRT1186KVJ8C
Виробник: NXP USA Inc.
Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 189 шт
В кошику  од. на суму  грн.
SC16IS762IPW,128 SC16IS752_SC16IS762.pdf
SC16IS762IPW,128
Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
2500+383.58 грн
Мінімальне замовлення: 2500 шт
В кошику  од. на суму  грн.
SC16IS762IPW,128 SC16IS752_SC16IS762.pdf
SC16IS762IPW,128
Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7780 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+643.17 грн
10+481.68 грн
25+447.31 грн
100+384.35 грн
250+377.38 грн
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SPC5748GK0AMMJ6 MPC5746C.pdf
SPC5748GK0AMMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
товару немає в наявності
Мінімальне замовлення: 450 шт
В кошику  од. на суму  грн.
S912DG12CE1VPVER 9S12DT128DGV2.pdf
S912DG12CE1VPVER
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику  од. на суму  грн.
S912DG12CE1VPVE 9S12DT128DGV2.pdf
S912DG12CE1VPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 300 шт
В кошику  од. на суму  грн.
MC9S08DZ60CLC
MC9S08DZ60CLC
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 25
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x12b
Core Processor: S08
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику  од. на суму  грн.
S32M241LCABMKHSR S32M2xx_DS.pdf
S32M241LCABMKHSR
Виробник: NXP USA Inc.
Description: S32M241LCABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M242LCABMKHSR S32M2xx_DS.pdf
S32M242LCABMKHSR
Виробник: NXP USA Inc.
Description: S32M242LCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M241CCABMKHSR S32M2xx_DS.pdf
S32M241CCABMKHSR
Виробник: NXP USA Inc.
Description: S32M241CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M242CCABMKHSR S32M2xx_DS.pdf
S32M242CCABMKHSR
Виробник: NXP USA Inc.
Description: S32M242CCABMKHSR
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M241LCABMKHST S32M2xx_DS.pdf
S32M241LCABMKHST
Виробник: NXP USA Inc.
Description: S32M241LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M242LCABMKHST S32M2xx_DS.pdf
S32M242LCABMKHST
Виробник: NXP USA Inc.
Description: S32M242LCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M241CCABMKHST S32M2xx_DS.pdf
S32M241CCABMKHST
Виробник: NXP USA Inc.
Description: S32M241CCABMKHST
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M244LCABMKHSR
S32M244LCABMKHSR
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M244CCABMKHSR
S32M244CCABMKHSR
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M244LCABMKHST
S32M244LCABMKHST
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,LIN, CSEC,
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M244CCABMKHST
S32M244CCABMKHST
Виробник: NXP USA Inc.
Description: MC IS,CM4,80MHZ,512K,CAN, CSEC,
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M274CHABMKHSR
S32M274CHABMKHSR
Виробник: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M274LHABMKHSR
S32M274LHABMKHSR
Виробник: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M276CHABMKHSR S32M2xx_DS.pdf
S32M276CHABMKHSR
Виробник: NXP USA Inc.
Description: S32M276CHABMKHSR
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M276LHABMKHSR S32M2xx_DS.pdf
S32M276LHABMKHSR
Виробник: NXP USA Inc.
Description: S32M276LHABMKHSR
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M7F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику  од. на суму  грн.
S32M274LHABMKHST S32M2xx_DS.pdf
S32M274LHABMKHST
Виробник: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
S32M274CHABMKHST
S32M274CHABMKHST
Виробник: NXP USA Inc.
Description: S32M2 MC IS,CM7,120MHZ,512K FLAS
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 6x12b SAR; D/A 2x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 112K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику  од. на суму  грн.
NX3P190UK,012 NX3P190.pdf
NX3P190UK,012
Виробник: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
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NX3P191UK,012 NX3P191.pdf
NX3P191UK,012
Виробник: NXP USA Inc.
Description: IC PWR SWITCH P-CHAN 1:1 4WLCSP
Supplier Device Package: 4-WLCSP (0.76x0.76)
Ratio - Input:Output: 1:1
Current - Output (Max): 500mA
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 1.1V ~ 3.6V
Input Type: Non-Inverting
Rds On (Typ): 65mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 125°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: P-Channel
Package / Case: 4-UFBGA, WLCSP
Features: Load Discharge, Slew Rate Controlled
Packaging: Tape & Reel (TR)
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A7102CLTK2/T0BC2AJ A71CH.pdf?pspll=1
Виробник: NXP USA Inc.
Description: A7102CLTK2
Supplier Device Package: 8-HVSON (4x4)
Applications: Security
Controller Series: A7102CLTK2
Operating Temperature: -40°C ~ 90°C
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 6000 шт
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S9S12GN32J0MFT
S9S12GN32J0MFT
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48TFQFN
Packaging: Tray
Package / Case: 48-TFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN-EP (7x7)
Number of I/O: 40
товару немає в наявності
Мінімальне замовлення: 260 шт
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PDZ7.5B/ZLX
Виробник: NXP USA Inc.
Description: DIODE ZENER SOD323
Packaging: Tape & Reel (TR)
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MRF1K50GNR5 MRF1K50N.pdf
MRF1K50GNR5
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V OM1230G-4
Packaging: Bulk
Package / Case: OM-1230G-4L
Mounting Type: Chassis Mount
Frequency: 1.8MHz ~ 500MHz
Power - Output: 1500W
Gain: 23dB
Technology: LDMOS
Supplier Device Package: OM-1230G-4L
Voltage - Rated: 50 V
Voltage - Test: 50 V
на замовлення 110 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+18170.04 грн
В кошику  од. на суму  грн.
MGD3160AM335EKR2 GD3160.pdf
MGD3160AM335EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику  од. на суму  грн.
MGD3160AM335EKR2 GD3160.pdf
MGD3160AM335EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 995 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+636.97 грн
10+477.87 грн
25+443.99 грн
100+381.73 грн
250+365.08 грн
500+355.04 грн
В кошику  од. на суму  грн.
MGD3160AM535EKR2 GD3160.pdf
MGD3160AM535EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 697 шт:
термін постачання 21-31 дні (днів)
КількістьЦіна без ПДВ
1+636.97 грн
10+477.87 грн
25+443.99 грн
100+381.73 грн
250+365.08 грн
500+355.04 грн
В кошику  од. на суму  грн.
MC33GD3100BEKR2 MC33GD3100_SDS.pdf
MC33GD3100BEKR2
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику  од. на суму  грн.
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