Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36849) > Сторінка 572 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
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TFF11115HN/N1,111 | NXP USA Inc. |
 Description: IC FREQUENCY GEN VSAT 24HVQFNPackaging: Tray Package / Case: 24-VFQFN Exposed Pad Mounting Type: Surface Mount Output: Clock Frequency - Max: 11.8GHz Input: Clock Operating Temperature: -40°C ~ 85°C Voltage - Supply: 3V ~ 3.6V Main Purpose: Ku band VSAT applications Ratio - Input:Output: 1:4 Differential - Input:Output: Yes/No Supplier Device Package: 24-HVQFN (4x4) PLL: Yes Number of Circuits: 1 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC855TCVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Graphics Acceleration: No RAM Controllers: DRAM Co-Processors/DSP: Communications; CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10Mbps (1), 10/100Mbps (1) Supplier Device Package: 357-PBGA (25x25) Voltage - I/O: 3.3V Core Processor: MPC8xx Operating Temperature: -40°C ~ 95°C (TA) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 357-BBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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S912ZVL64F0CLC | NXP USA Inc. |
Description: IC MCU 16BIT 64KB FLASH 32LQFP DigiKey Programmable: Not Verified Number of I/O: 19 Supplier Device Package: 32-LQFP (7x7) Peripherals: LVD, POR, PWM, WDT Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Core Size: 16-Bit Data Converters: A/D 6x10b Core Processor: S12Z EEPROM Size: 512 x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 64KB (64K x 8) Speed: 32MHz Mounting Type: Surface Mount Package / Case: 32-LQFP Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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FRDM-A-S32K312 | NXP USA Inc. |
Description: EVAL BOARD FOR S32K312 MCU Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TEA19051BAFTK/1J | NXP USA Inc. |
Description: IC SMPS CTRLR SMART CHRG HVSON16 Packaging: Bulk Package / Case: 16-VDFN Exposed Pad Function: Controller Interface: USB Operating Temperature: -20°C ~ 105°C (TJ) Voltage - Supply: 2.9V ~ 21V Current - Supply: 3mA Protocol: USB Standards: USB 2.0, USB 3.0 Supplier Device Package: 16-HVSON (3.5x5.5) DigiKey Programmable: Not Verified |
на замовлення 75967 шт: термін постачання 21-31 дні (днів) |
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S912XEQ384J3VAGR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 24x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 119 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MK51DX128CMC7 | NXP USA Inc. |
Description: IC MCU 32B 128KB FLASH 121MAPBGA Packaging: Bulk Package / Case: 121-LFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 35x16b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 121-MAPBGA (8x8) Number of I/O: 61 DigiKey Programmable: Not Verified |
на замовлення 980 шт: термін постачання 21-31 дні (днів) |
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| MIMX9332XVVXMACR | NXP USA Inc. |
Description: I.MX93 BGA11 Packaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LPC1104UK,118 | NXP USA Inc. |
Description: IC MCU 32BIT 32KB FLASH 16WLCSP Packaging: Tape & Reel (TR) Package / Case: 16-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 32KB (32K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 5x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 16-WLCSP (2.17x2.32) Number of I/O: 11 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 3000 шт В кошику од. на суму грн. | |||||||||||||||
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FRDM-MCXA346 | NXP USA Inc. |
Description: FREEDOM MCXA346 EVAL BRD Packaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M33 Utilized IC / Part: MCXA346 Platform: Freedom |
на замовлення 137 шт: термін постачання 21-31 дні (днів) |
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SPC5746CSK1MMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5746CHK1ACMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA Packaging: Tray Package / Case: 256-LBGA Mounting Type: Surface Mount Speed: 80MHz/160MHz Program Memory Size: 3MB (3M x 8) RAM Size: 512K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: e200z2, e200z4 Data Converters: A/D 80x10b, 64x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 256-MAPPBGA (17x17) Number of I/O: 178 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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SPC5742PGK1AMMM9 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLSH 257LFBGA Packaging: Tray Package / Case: 257-LFBGA Mounting Type: Surface Mount Speed: 80MHz, 200MHz Program Memory Size: 1.5MB (1.5M x 8) RAM Size: 192K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: e200z4 Data Converters: A/D 64x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Supplier Device Package: 257-LFBGA (14x14) Number of I/O: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| KIT-TJA1120-SDBR | NXP USA Inc. |
Description: EVAL BOARD FOR TJA1120 Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA1120 Embedded: No |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| KIT-TJA1120-SDBS | NXP USA Inc. |
Description: EVAL BOARD FOR TJA1120 Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA1120 Embedded: No |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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| KIT-TJA1103-SDBS | NXP USA Inc. |
Description: SABRE DEV KIT ETHERNET PHY Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA11xx Embedded: No |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KIT-TJA1103-SDBR | NXP USA Inc. |
Description: KIT-TJA1103-SDBR Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MPC8272VRMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCIMX6Q6AVT10AER | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA Packaging: Tape & Reel (TR) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| LFVBBOK77CW1C | NXP USA Inc. |
Description: NXP MPC5777C 422 PIN 1.0 MM PITC Packaging: Bulk Accessory Type: Calibration Unit Utilized IC / Part: MPCxxxx |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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MCF51JE128VMB | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: 81-MAPBGA (10x10) Peripherals: LVD, PWM, WDT Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 12x12b; D/A 1x12b Core Processor: Coldfire V1 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 128KB (128K x 8) Speed: 50MHz Mounting Type: Surface Mount Package / Case: 81-LBGA Packaging: Box |
товару немає в наявності |
Мінімальне замовлення: 1200 шт В кошику од. на суму грн. | ||||||||||||||
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MRF6VP3450HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 860MHz Configuration: Dual Power - Output: 90W Gain: 22.5dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 1.4 A |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSP Features: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSP Features: Slew Rate Controlled Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
на замовлення 1845 шт: термін постачання 21-31 дні (днів) |
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MC35FS4507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC35FS4507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive Supplier Device Package: 48-HLQFP (7x7) Applications: System Basis Chip Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
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LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 974 шт: термін постачання 21-31 дні (днів) |
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LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 993 шт: термін постачання 21-31 дні (днів) |
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LPC55S28JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFP Number of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 925 шт: термін постачання 21-31 дні (днів) |
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LPC5528JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Number of I/O: 64 Supplier Device Package: 100-HLQFP (14x14) Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 10x16b Core Processor: ARM® Cortex®-M33 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 512KB (512K x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Packaging: Tray |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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LPC5526JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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| BC860C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 100MA SOT23 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| JN5121-000-AIV | NXP USA Inc. |
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-QFN Interface: 2-Wire Serial, SPI Serial, UART RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V Controller Series: IEEE802.15.4 Program Memory Type: ROM (64kB) Applications: Wireless Number of I/O: 21 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
| BTA412Y-800C,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220AB-3 Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS23LDOEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| KITFS23SKTEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| KITFS27-SP48VEVM | NXP USA Inc. |
Description: KITFS27-SP48VEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27EVM | NXP USA Inc. |
Description: KITFS27EVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27SKTEVM | NXP USA Inc. |
Description: KITFS27SKTEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27-24VEVM | NXP USA Inc. |
Description: KITFS27-24VEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS27-48VEVM | NXP USA Inc. |
Description: KITFS27-48VEVM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
74HC597DB,118 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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|
74HC597DB,112 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
74HC597D,652 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BT139B-800F,118 | NXP USA Inc. |
Description: TRIAC 800V 16A D2PAK Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BUX87P,127 | NXP USA Inc. | Description: TRANS BJT NPN 450V SOT-82 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
SC16C2550BIBS,151 | NXP USA Inc. |
Description: SERIAL I/O CONTROLLER, 2 CHANNEL Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
HEF4047BT,652 | NXP USA Inc. |
Description: IC MONO/ASTBL MULTVIBRATR 14SOIC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1560Q/N4,112 | NXP USA Inc. |
Description: IC AUDIO AMP B, H DBS17P Features: Mute, Standby Packaging: Tube Package / Case: 17-SIP Formed Leads Output Type: 1-Channel (Mono) Mounting Type: Through Hole Type: Class B, Class H Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 40W x1 @ 8Ohm Supplier Device Package: DBS17P |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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TDA1519CTH/N3,512 | NXP USA Inc. |
Description: IC AUDIO AMP B 20-HSOP Packaging: Tube Features: Mute, Standby Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class B Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm Supplier Device Package: 20-HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BSC9132NXN7MNMB | NXP USA Inc. |
Description: IC MPU QORIQ 1.333GHZ 780FCBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCBGA (23x23) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
 |
74HC4024D,652 | NXP USA Inc. |
Description: IC COUNTER 7STAGE BINARY 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
товару немає в наявності |
Мінімальне замовлення: 1140 шт В кошику од. на суму грн. | ||||||||||||||
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74HC4024D,653 | NXP USA Inc. |
Description: IC 7STAGE BINARY RIPPLE 14SOIC Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Number of Elements: 1 Logic Type: Binary Counter Reset: Asynchronous Operating Temperature: -40°C ~ 125°C Direction: Up Trigger Type: Negative Edge Supplier Device Package: 14-SO Voltage - Supply: 2 V ~ 6 V Count Rate: 90 MHz Number of Bits per Element: 7 |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | ||||||||||||||
 |
BC847CQAZ | NXP USA Inc. |
Description: TRANS NPN 45V 0.1A DFN1010D-3 Qualification: AEC-Q101 Power - Max: 280 mW Voltage - Collector Emitter Breakdown (Max): 45 V Current - Collector (Ic) (Max): 100 mA Grade: Automotive Supplier Device Package: DFN1010D-3 Frequency - Transition: 100MHz DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Current - Collector Cutoff (Max): 15nA (ICBO) Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA Operating Temperature: 150°C (TJ) Transistor Type: NPN Mounting Type: Surface Mount Package / Case: 3-XDFN Exposed Pad Packaging: Bulk |
на замовлення 24340 шт: термін постачання 21-31 дні (днів) |
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74AHC245D,112 | NXP USA Inc. |
Description: IC TRANSCVR TRI-ST 8BIT 20SOIC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
PHD38N02LT,118 | NXP USA Inc. |
Description: MOSFET N-CH 20V 44.7A DPAK Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
PN7642EV/C101Y | NXP USA Inc. |
Description: PN7642EV/C101Y Packaging: Cut Tape (CT) Package / Case: 64-VFBGA Mounting Type: Surface Mount Frequency: 13.56MHz Interface: I2C, SPI, UART, USB Type: RFID Reader/Transponder Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.4V ~ 5.5V Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC Supplier Device Package: 64-VFBGA (4.5x4.5) |
на замовлення 1270 шт: термін постачання 21-31 дні (днів) |
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PNX1501E/G,557 | NXP USA Inc. |
Description: IC MEDIA PROC 266MHZ 456-BGA Packaging: Tray Package / Case: 456-BGA Mounting Type: Surface Mount Interface: I2C, 2-Wire Serial Operating Temperature: 0°C ~ 85°C Voltage - Supply: 1.14V ~ 1.26V Controller Series: Nexperia Applications: Multimedia Core Processor: TM3260 Supplier Device Package: 456-BGA (27x27) Number of I/O: 61 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. |
| TFF11115HN/N1,111 |
|
Виробник: NXP USA Inc.
Description: IC FREQUENCY GEN VSAT 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 11.8GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
Description: IC FREQUENCY GEN VSAT 24HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 11.8GHz
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Main Purpose: Ku band VSAT applications
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/No
Supplier Device Package: 24-HVQFN (4x4)
PLL: Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MPC855TCVR50D4 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
Description: IC MPU MPC8XX 50MHZ 357BGA
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Graphics Acceleration: No
RAM Controllers: DRAM
Co-Processors/DSP: Communications; CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10Mbps (1), 10/100Mbps (1)
Supplier Device Package: 357-PBGA (25x25)
Voltage - I/O: 3.3V
Core Processor: MPC8xx
Operating Temperature: -40°C ~ 95°C (TA)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 357-BBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| S912ZVL64F0CLC |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Bulk
Description: IC MCU 16BIT 64KB FLASH 32LQFP
DigiKey Programmable: Not Verified
Number of I/O: 19
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Core Size: 16-Bit
Data Converters: A/D 6x10b
Core Processor: S12Z
EEPROM Size: 512 x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 32MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| TEA19051BAFTK/1J |
|
Виробник: NXP USA Inc.
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Bulk
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
Description: IC SMPS CTRLR SMART CHRG HVSON16
Packaging: Bulk
Package / Case: 16-VDFN Exposed Pad
Function: Controller
Interface: USB
Operating Temperature: -20°C ~ 105°C (TJ)
Voltage - Supply: 2.9V ~ 21V
Current - Supply: 3mA
Protocol: USB
Standards: USB 2.0, USB 3.0
Supplier Device Package: 16-HVSON (3.5x5.5)
DigiKey Programmable: Not Verified
на замовлення 75967 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 190+ | 107.96 грн |
| S912XEQ384J3VAGR |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику
од. на суму грн.
| MK51DX128CMC7 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MCU 32B 128KB FLASH 121MAPBGA
Packaging: Bulk
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 35x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 121-MAPBGA (8x8)
Number of I/O: 61
DigiKey Programmable: Not Verified
на замовлення 980 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 28+ | 731.15 грн |
| MIMX9332XVVXMACR |
|
Виробник: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
В кошику
од. на суму грн.
| LPC1104UK,118 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 16-WLCSP (2.17x2.32)
Number of I/O: 11
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 16WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 5x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 16-WLCSP (2.17x2.32)
Number of I/O: 11
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 3000 шт
В кошику
од. на суму грн.
| FRDM-MCXA346 |
|
Виробник: NXP USA Inc.
Description: FREEDOM MCXA346 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXA346
Platform: Freedom
Description: FREEDOM MCXA346 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M33
Utilized IC / Part: MCXA346
Platform: Freedom
на замовлення 137 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1496.88 грн |
| SPC5746CSK1MMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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| SPC5746CHK1ACMJ6 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 3MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 3MB (3M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
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| SPC5742PGK1AMMM9 |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLSH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 16
Description: IC MCU 32BIT 1.5MB FLSH 257LFBGA
Packaging: Tray
Package / Case: 257-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: e200z4
Data Converters: A/D 64x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 257-LFBGA (14x14)
Number of I/O: 16
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| KIT-TJA1120-SDBR |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 32394.16 грн |
| KIT-TJA1120-SDBS |
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
Description: EVAL BOARD FOR TJA1120
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1120
Embedded: No
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 32554.77 грн |
| KIT-TJA1103-SDBS |
Виробник: NXP USA Inc.
Description: SABRE DEV KIT ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
Description: SABRE DEV KIT ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
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| MPC8272VRMIBA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| MCIMX6Q6AVT10AER |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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| LFVBBOK77CW1C |
Виробник: NXP USA Inc.
Description: NXP MPC5777C 422 PIN 1.0 MM PITC
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
Description: NXP MPC5777C 422 PIN 1.0 MM PITC
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
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| MCF51JE128VMB |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: 81-MAPBGA (10x10)
Peripherals: LVD, PWM, WDT
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 12x12b; D/A 1x12b
Core Processor: Coldfire V1
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 50MHz
Mounting Type: Surface Mount
Package / Case: 81-LBGA
Packaging: Box
товару немає в наявності
Мінімальне замовлення: 1200 шт
В кошику
од. на суму грн.
| MRF6VP3450HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 90W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 90W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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| NX5P1100UKZ |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
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| NX5P1100UKZ |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
на замовлення 1845 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 5+ | 75.16 грн |
| 10+ | 52.11 грн |
| 25+ | 47.11 грн |
| 100+ | 39.03 грн |
| 250+ | 36.56 грн |
| 500+ | 35.06 грн |
| 1000+ | 33.28 грн |
| MC35FS4507NAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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| MC35FS4507NAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
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| LPC5528JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
товару немає в наявності
Мінімальне замовлення: 1000 шт
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од. на суму грн.
| LPC5528JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 974 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 541.95 грн |
| 10+ | 403.56 грн |
| 25+ | 374.01 грн |
| 100+ | 320.51 грн |
| 250+ | 306.36 грн |
| LPC5526JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
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| LPC5526JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 993 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 467.58 грн |
| 10+ | 347.26 грн |
| 25+ | 321.17 грн |
| 100+ | 274.49 грн |
| 250+ | 262.27 грн |
| 500+ | 254.32 грн |
| LPC55S28JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 925 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 556.19 грн |
| 10+ | 415.14 грн |
| 25+ | 384.95 грн |
| 100+ | 330.17 грн |
| 250+ | 315.33 грн |
| 500+ | 306.39 грн |
| LPC5528JBD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Number of I/O: 64
Supplier Device Package: 100-HLQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 10x16b
Core Processor: ARM® Cortex®-M33
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 420.11 грн |
| 10+ | 377.20 грн |
| LPC5526JBD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 90 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 472.32 грн |
| 10+ | 350.15 грн |
| 90+ | 297.21 грн |
| JN5121-000-AIV |
|
Виробник: NXP USA Inc.
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1000 шт
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| KITFS23LDOEVM |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14327.96 грн |
| KITFS23SKTEVM |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 15966.46 грн |
| 74HC597DB,118 |
|
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| 74HC597DB,112 |
|
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| 74HC597D,652 |
|
Виробник: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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од. на суму грн.
| BUX87P,127 |
Виробник: NXP USA Inc.
Description: TRANS BJT NPN 450V SOT-82
Description: TRANS BJT NPN 450V SOT-82
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| SC16C2550BIBS,151 |
|
Виробник: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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В кошику
од. на суму грн.
| TDA1560Q/N4,112 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
Description: IC AUDIO AMP B, H DBS17P
Features: Mute, Standby
Packaging: Tube
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
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В кошику
од. на суму грн.
| TDA1519CTH/N3,512 |
|
Виробник: NXP USA Inc.
Description: IC AUDIO AMP B 20-HSOP
Packaging: Tube
Features: Mute, Standby
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
Description: IC AUDIO AMP B 20-HSOP
Packaging: Tube
Features: Mute, Standby
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
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| BSC9132NXN7MNMB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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| 74HC4024D,652 |
|
Виробник: NXP USA Inc.
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC COUNTER 7STAGE BINARY 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
товару немає в наявності
Мінімальне замовлення: 1140 шт
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| 74HC4024D,653 |
|
Виробник: NXP USA Inc.
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
Description: IC 7STAGE BINARY RIPPLE 14SOIC
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Binary Counter
Reset: Asynchronous
Operating Temperature: -40°C ~ 125°C
Direction: Up
Trigger Type: Negative Edge
Supplier Device Package: 14-SO
Voltage - Supply: 2 V ~ 6 V
Count Rate: 90 MHz
Number of Bits per Element: 7
товару немає в наявності
Мінімальне замовлення: 2500 шт
В кошику
од. на суму грн.
| BC847CQAZ |
|
Виробник: NXP USA Inc.
Description: TRANS NPN 45V 0.1A DFN1010D-3
Qualification: AEC-Q101
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
Description: TRANS NPN 45V 0.1A DFN1010D-3
Qualification: AEC-Q101
Power - Max: 280 mW
Voltage - Collector Emitter Breakdown (Max): 45 V
Current - Collector (Ic) (Max): 100 mA
Grade: Automotive
Supplier Device Package: DFN1010D-3
Frequency - Transition: 100MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Current - Collector Cutoff (Max): 15nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Surface Mount
Package / Case: 3-XDFN Exposed Pad
Packaging: Bulk
на замовлення 24340 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3877+ | 5.47 грн |
| PN7642EV/C101Y |
|
Виробник: NXP USA Inc.
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
Description: PN7642EV/C101Y
Packaging: Cut Tape (CT)
Package / Case: 64-VFBGA
Mounting Type: Surface Mount
Frequency: 13.56MHz
Interface: I2C, SPI, UART, USB
Type: RFID Reader/Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.4V ~ 5.5V
Standards: FeliCa, ISO 14443-3/4-A, ISO 14443-3/4-B, ISO 15693, ISO 18000-3, Mifare, NFC
Supplier Device Package: 64-VFBGA (4.5x4.5)
на замовлення 1270 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 867.11 грн |
| 10+ | 725.21 грн |
| 25+ | 687.14 грн |
| 100+ | 595.86 грн |
| 250+ | 566.53 грн |
| 500+ | 545.83 грн |
| 1000+ | 517.72 грн |
| PNX1501E/G,557 |
|
Виробник: NXP USA Inc.
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified
Description: IC MEDIA PROC 266MHZ 456-BGA
Packaging: Tray
Package / Case: 456-BGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.14V ~ 1.26V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TM3260
Supplier Device Package: 456-BGA (27x27)
Number of I/O: 61
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 200 шт
В кошику
од. на суму грн.