Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36849) > Сторінка 569 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC35FS6517NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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MC35FS6517NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||
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MC9S08EL16CTLR | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 28TSSOPPackaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 512 x 8 Core Processor: S08 Data Converters: A/D 16x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 28-TSSOP Number of I/O: 22 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||
| SPF5020AMBACESR2 | NXP USA Inc. |
Description: PMIC -3 HIGH PERFORMANCE BUCKS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | |||||||||||||
| SC33PF8100CCESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||
| SC33PF8100JCESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||
| SC33PF8200KCESR2 | NXP USA Inc. |
Description: PMIC I.MX8, 7 BUCK REG,4 LDOSPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||
| MVR5510AMBA4TSR2 | NXP USA Inc. |
Description: PMIC, 3BUCK , 3 LDOS,BOOSTQualification: AEC-Q100 Grade: Automotive Supplier Device Package: 56-HVQFN (8x8) Current - Supply: 15mA Voltage - Supply: 2.7V ~ 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | |||||||||||||
|
74ABT125N,602 | NXP USA Inc. |
Description: IC BUFF 4.5V/5.5V 14-DIPPackaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Output Type: 3-State Mounting Type: Through Hole Number of Elements: 4 Logic Type: Buffer, Non-Inverting Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 4.5V ~ 5.5V Number of Bits per Element: 1 Current - Output High, Low: 32mA, 64mA Supplier Device Package: 14-DIP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| MIMX9321CVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
| MIMX9312XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
| MIMX9322CVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 105°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
| MIMX9321XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 1, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
| MIMX9322XVXXMBB | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
| MIMX9322XVXXMAC | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
| MIMX9322XVXXMBC | NXP USA Inc. |
Description: I.MX93 BGA9Packaging: Tray Package / Case: 208-VFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 208-FCBGA (15x15) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2) Number of Cores/Bus Width: 2, 1 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE, NPU RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | |||||||||||||
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TJA1120AHN/0J | NXP USA Inc. |
Description: ICETHERNET PHY TXRX 36-HVQFNPackaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 4000 шт В кошику од. на суму грн. | ||||||||||||
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TJA1120AHN/0J | NXP USA Inc. |
Description: ICETHERNET PHY TXRX 36-HVQFNPackaging: Cut Tape (CT) |
на замовлення 3186 шт: термін постачання 21-31 дні (днів) |
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MC68340CAG25E | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: CPU32 Voltage - I/O: 5.0V Supplier Device Package: 144-LQFP (20x20) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| P3H2841HN-ARD | NXP USA Inc. |
Description: P3H2841HN-ARD Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| MCIMX31DVMN5D | NXP USA Inc. |
Description: I.MX31 32-BIT MPU, ARM1136JF-S CPackaging: Bulk |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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| LFJ34INTPQA | NXP USA Inc. |
Description: QORIVVA MPC5634M ON A 208 BGA TO Packaging: Bulk Module/Board Type: Socket Adapter Utilized IC / Part: MPC5634M |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
|
QN9083DUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 47WLSCPPackaging: Tape & Reel (TR) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 32MHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Data Rate (Max): 16Mbps Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||
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QN9083DUKZ | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 47WLSCPPackaging: Cut Tape (CT) Package / Case: 47-XFBGA, WLCSP Sensitivity: -95dBm Mounting Type: Surface Mount Frequency: 32MHz Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM Type: TxRx + MCU Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.62V ~ 3.6V Power - Output: 2dBm Protocol: Bluetooth v5.0 Current - Receiving: 5mA Data Rate (Max): 16Mbps Current - Transmitting: 3.5mA Supplier Device Package: 47-WLSCP (3.28x3.2) Modulation: FSK, GFSK RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART, USART, USB DigiKey Programmable: Not Verified |
на замовлення 216 шт: термін постачання 21-31 дні (днів) |
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MC34PF1550A2EP | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSPackaging: Tray Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 105°C Voltage - Supply: 3.8V ~ 7V Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Supplier Device Package: 40-HVQFN (5x5) |
на замовлення 490 шт: термін постачання 21-31 дні (днів) |
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MC908QT1AMDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SOPackaging: Tube Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MC908QT1AMDWER | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SOPackaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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P2041NSN7MMC | NXP USA Inc. |
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGAPackaging: Tray Package / Case: 780-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.2GHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500mc Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCPBGA (23x23) Ethernet: 10/100/1000Mbps (5), 10Gbps (1) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 4 Core, 32-Bit RAM Controllers: DDR3, DDR3L Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MCIMX6L8DVN10AA | NXP USA Inc. |
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGAPackaging: Tray Package / Case: 432-TFBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.2V, 1.8V, 3.0V Supplier Device Package: 432-MAPBGA (13x13) Ethernet: 10/100Mbps (1) USB: USB 2.0 + PHY (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART |
товару немає в наявності |
Мінімальне замовлення: 800 шт В кошику од. на суму грн. | ||||||||||||
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FS32K148UJT0VMHR | NXP USA Inc. |
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,Number of I/O: 89 Supplier Device Package: 100-MAPBGA (11x11) Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 32x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 112MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | ||||||||||||
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MCF5483CVR166 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGAPackaging: Tray Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 166MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: Coldfire V4E Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB Peripherals: DMA, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 99 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 200 шт В кошику од. на суму грн. | ||||||||||||
| TJA1465B-EVB | NXP USA Inc. |
Description: TJA1465B-EVB Utilized IC / Part: TJA1465B Contents: Board(s) Type: Interface Function: CANbus Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| MCDXTM4CK344 | NXP USA Inc. |
Description: MCDXTM4CK344 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| SAF4000EL/101Q53BY | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5342 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||
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FS32K148HET0VLLT | NXP USA Inc. |
Description: S32K148 32-BIT MCU, ARM CORTEX-MPackaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: ARM® Cortex®-M4F Data Converters: A/D 32x12b SAR; D/A 1x8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Supplier Device Package: 100-LQFP (14x14) Number of I/O: 156 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCAL9722HNHP | NXP USA Inc. |
Description: PCAL9722HNPackaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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PCAL9722HN/Q900HP | NXP USA Inc. |
Description: PCAL9722HN/Q900Packaging: Tape & Reel (TR) Package / Case: 32-VFQFN Exposed Pad Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5x5) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| A3T19H455W23SR6 | NXP USA Inc. |
Description: RF MOSFETPackaging: Bulk |
на замовлення 1036 шт: термін постачання 21-31 дні (днів) |
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LS1048ASN7PTA | NXP USA Inc. |
Description: IC MPU QORIQ 1.4GHZ 780FBGAPackaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.4GHz Operating Temperature: 0°C ~ 105°C Core Processor: ARM® Cortex®-A53 Supplier Device Package: 780-FBGA (23x23) Ethernet: 10GbE (2), 1GbE (8) USB: USB 3.0 (2) + PHY Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR4 Security Features: Secure Boot, TrustZone® SATA: SATA 6Gbps (1) |
товару немає в наявності |
Мінімальне замовлення: 60 шт В кошику од. на суму грн. | ||||||||||||
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MC56F8122VFAE | NXP USA Inc. |
Description: IC MCU 16BIT 32KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (16K x 16) RAM Size: 4K x 16 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 56800E Data Converters: A/D 6x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 21 DigiKey Programmable: Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
| T2081NSN8T1B | NXP USA Inc. |
Description: QORIQ T2080 AND T2081 MULTICOREPackaging: Bulk |
на замовлення 98 шт: термін постачання 21-31 дні (днів) |
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MKV30F64VLF10 | NXP USA Inc. |
Description: IC MCU 32BIT 64KB FLASH 48LQFPData Converters: A/D 2x16b; D/A 1x12b Core Processor: ARM® Cortex®-M4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 64KB (64K x 8) Speed: 100MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 35 Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||
| P3H2840HN-ARD | NXP USA Inc. |
Description: P3H2840HN-ARD Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| LFINTPL3QA | NXP USA Inc. |
Description: 144 PIN 0.5MM EQFP TO 208 1.0MM Packaging: Bulk Module/Board Type: Socket Module - PGA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
| MX95LP4XEVK-15CM | NXP USA Inc. |
Description: MX95LP4XEVK-15CM Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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MPXV10GC7U | NXP USA Inc. |
Description: SENSOR 1.45PSIG 0.13" .035V 8DIPFeatures: Temperature Compensated Packaging: Tube Package / Case: 8-DIP (0.550", 13.97mm), Top Port Output Type: Wheatstone Bridge Mounting Type: Through Hole Output: 0 mV ~ 35 mV (3V) Operating Pressure: 1.45PSI (10kPa) Pressure Type: Vented Gauge Operating Temperature: -40°C ~ 125°C Termination Style: PC Pin Voltage - Supply: 3V ~ 6V Port Size: Male - 0.13" (3.18mm) Tube Applications: Board Mount Supplier Device Package: 8-DIP Port Style: Barbless Maximum Pressure: 10.88PSI (75kPa) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1181CVP2C | NXP USA Inc. |
Description: ICNumber of I/O: 82 Supplier Device Package: 144-LFBGA (10x10) Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Core Size: 32-Bit Data Converters: A/D 30x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M33F Program Memory Type: ROM Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 768K x 8 Program Memory Size: 160KB (160K x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 144-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1182CVP2C | NXP USA Inc. |
Description: ICNumber of I/O: 82 Supplier Device Package: 144-LFBGA (10x10) Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Core Size: 32-Bit Data Converters: A/D 30x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M33F Program Memory Type: ROM Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TJ) RAM Size: 768K x 8 Program Memory Size: 160KB (160K x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 144-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1181XVP2C | NXP USA Inc. |
Description: ICNumber of I/O: 82 Supplier Device Package: 144-LFBGA (10x10) Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Core Size: 32-Bit Data Converters: A/D 30x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M33F Program Memory Type: ROM Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 768K x 8 Program Memory Size: 160KB (160K x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 144-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1182XVP2C | NXP USA Inc. |
Description: ICNumber of I/O: 82 Supplier Device Package: 144-LFBGA (10x10) Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Core Size: 32-Bit Data Converters: A/D 30x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M33F Program Memory Type: ROM Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 768K x 8 Program Memory Size: 160KB (160K x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 144-LFBGA Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1186CVJ8C | NXP USA Inc. |
Description: RT1180,INDUS,196BGA,C0 Number of I/O: 1 Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: ROM Oscillator Type: External, Internal Operating Temperature: 0°C ~ 105°C RAM Size: 128K x 8 Program Memory Size: 64KB (64K x 8) Speed: 300MHz Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1186XVJ8C | NXP USA Inc. |
Description: RT1180,EXD INDUS,196BGA,C0 Packaging: Tray Number of I/O: 1 Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16x16b SAR; D/A 1x12b Core Processor: ARM® Cortex®-M7 Program Memory Type: ROM Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C RAM Size: 128K x 8 Program Memory Size: 64KB (64K x 8) Speed: 300MHz |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1187CVM8C | NXP USA Inc. |
Description: ICPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 800MHz Program Memory Size: 160KB (160K x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F Data Converters: A/D 30x16b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 289-LFBGA (14x14) Number of I/O: 173 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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MIMXRT1187XVM8C | NXP USA Inc. |
Description: ICPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 800MHz Program Memory Size: 160KB (160K x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F Data Converters: A/D 30x16b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 289-LFBGA (14x14) Number of I/O: 173 |
на замовлення 760 шт: термін постачання 21-31 дні (днів) |
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MIMXRT1189CVM8C | NXP USA Inc. |
Description: ICPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 800MHz Program Memory Size: 160KB (160K x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 105°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F Data Converters: A/D 30x16b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 289-LFBGA (14x14) Number of I/O: 173 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
| MIMXRT1186JVJ8C | NXP USA Inc. |
Description: RT1180,INDUS,196BGA,C0 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 189 шт В кошику од. на суму грн. | |||||||||||||
| MIMXRT1186KVJ8C | NXP USA Inc. |
Description: RT1180,EXD INDUS,196BGA,C0 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 189 шт В кошику од. на суму грн. | |||||||||||||
|
SC16IS762IPW,128 | NXP USA Inc. |
Description: IC DUAL UART 64BYTE 28TSSOPPackaging: Tape & Reel (TR) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: I2C, SPI, UART Operating Temperature: -40°C ~ 95°C Voltage - Supply: 2.5V, 3.3V Current - Supply: 2mA Protocol: RS232, RS485 Supplier Device Package: 28-TSSOP DigiKey Programmable: Not Verified |
на замовлення 7500 шт: термін постачання 21-31 дні (днів) |
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SC16IS762IPW,128 | NXP USA Inc. |
Description: IC DUAL UART 64BYTE 28TSSOPPackaging: Cut Tape (CT) Package / Case: 28-TSSOP (0.173", 4.40mm Width) Function: Controller Interface: I2C, SPI, UART Operating Temperature: -40°C ~ 95°C Voltage - Supply: 2.5V, 3.3V Current - Supply: 2mA Protocol: RS232, RS485 Supplier Device Package: 28-TSSOP DigiKey Programmable: Not Verified |
на замовлення 7565 шт: термін постачання 21-31 дні (днів) |
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SPC5748GK0AMMJ6 | NXP USA Inc. |
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGAOscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 768K x 8 Program Memory Size: 6MB (6M x 8) Speed: 80MHz/160MHz Mounting Type: Surface Mount Package / Case: 256-LBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 178 Supplier Device Package: 256-MAPPBGA (17x17) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 80x10b, 64x12b Core Processor: e200z2, e200z4, e200z4 Program Memory Type: FLASH |
товару немає в наявності |
Мінімальне замовлення: 450 шт В кошику од. на суму грн. |
| MC35FS6517NAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC35FS6517NAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| MC9S08EL16CTLR |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 5000 шт
В кошику
од. на суму грн.
| MVR5510AMBA4TSR2 |
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Виробник: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Qualification: AEC-Q100
Grade: Automotive
Supplier Device Package: 56-HVQFN (8x8)
Current - Supply: 15mA
Voltage - Supply: 2.7V ~ 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 4000 шт
В кошику
од. на суму грн.
| 74ABT125N,602 |
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Виробник: NXP USA Inc.
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 14-DIP
Description: IC BUFF 4.5V/5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 14-DIP
товару немає в наявності
В кошику
од. на суму грн.
| MIMX9321CVXXMAC |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9312XVXXMAC |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322CVXXMAC |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9321XVXXMAC |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322XVXXMBB |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322XVXXMAC |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| MIMX9322XVXXMBC |
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Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
В кошику
од. на суму грн.
| TJA1120AHN/0J |
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на замовлення 3186 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 272.95 грн |
| 10+ | 198.39 грн |
| 25+ | 182.27 грн |
| 100+ | 154.42 грн |
| 250+ | 146.49 грн |
| 500+ | 145.50 грн |
| MC68340CAG25E |
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Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
товару немає в наявності
В кошику
од. на суму грн.
| MCIMX31DVMN5D |
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на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 6724.09 грн |
| LFJ34INTPQA |
Виробник: NXP USA Inc.
Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
товару немає в наявності
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од. на суму грн.
| QN9083DUKZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| QN9083DUKZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 216 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 723.12 грн |
| 10+ | 604.31 грн |
| 25+ | 572.40 грн |
| 100+ | 496.02 грн |
| MC34PF1550A2EP |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 368.68 грн |
| 10+ | 271.37 грн |
| 25+ | 250.47 грн |
| 100+ | 213.43 грн |
| 490+ | 197.08 грн |
| MC908QT1AMDWE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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| MC908QT1AMDWER |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
товару немає в наявності
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од. на суму грн.
| P2041NSN7MMC |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
товару немає в наявності
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од. на суму грн.
| MCIMX6L8DVN10AA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
товару немає в наявності
Мінімальне замовлення: 800 шт
В кошику
од. на суму грн.
| FS32K148UJT0VMHR |
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Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Number of I/O: 89
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Number of I/O: 89
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 1500 шт
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| MCF5483CVR166 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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Мінімальне замовлення: 200 шт
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| TJA1465B-EVB |
Виробник: NXP USA Inc.
Description: TJA1465B-EVB
Utilized IC / Part: TJA1465B
Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Bulk
Description: TJA1465B-EVB
Utilized IC / Part: TJA1465B
Contents: Board(s)
Type: Interface
Function: CANbus
Packaging: Bulk
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| SAF4000EL/101Q53BY |
товару немає в наявності
Мінімальне замовлення: 1000 шт
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| FS32K148HET0VLLT |
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Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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| PCAL9722HNHP |
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Виробник: NXP USA Inc.
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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| PCAL9722HN/Q900HP |
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Виробник: NXP USA Inc.
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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| A3T19H455W23SR6 |
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на замовлення 1036 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 10598.81 грн |
| LS1048ASN7PTA |
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Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
товару немає в наявності
Мінімальне замовлення: 60 шт
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| MC56F8122VFAE |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
В кошику
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| T2081NSN8T1B |
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на замовлення 98 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 23507.82 грн |
| MKV30F64VLF10 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Data Converters: A/D 2x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 35
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
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Мінімальне замовлення: 1250 шт
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| LFINTPL3QA |
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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| MPXV10GC7U |
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Виробник: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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| MIMXRT1181CVP2C |
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Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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| MIMXRT1182CVP2C |
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Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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| MIMXRT1181XVP2C |
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Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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| MIMXRT1182XVP2C |
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Виробник: NXP USA Inc.
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
Description: IC
Number of I/O: 82
Supplier Device Package: 144-LFBGA (10x10)
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Core Size: 32-Bit
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M33F
Program Memory Type: ROM
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 768K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 144-LFBGA
Packaging: Tray
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| MIMXRT1186CVJ8C |
Виробник: NXP USA Inc.
Description: RT1180,INDUS,196BGA,C0
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 105°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Packaging: Tray
Description: RT1180,INDUS,196BGA,C0
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: 0°C ~ 105°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Packaging: Tray
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| MIMXRT1186XVJ8C |
Виробник: NXP USA Inc.
Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
Description: RT1180,EXD INDUS,196BGA,C0
Packaging: Tray
Number of I/O: 1
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Connectivity: CAN, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.15V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16x16b SAR; D/A 1x12b
Core Processor: ARM® Cortex®-M7
Program Memory Type: ROM
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C
RAM Size: 128K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 300MHz
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| MIMXRT1187CVM8C |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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| MIMXRT1187XVM8C |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
на замовлення 760 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1409.06 грн |
| 10+ | 1081.08 грн |
| 25+ | 1012.24 грн |
| 152+ | 862.40 грн |
| 304+ | 838.95 грн |
| 608+ | 819.64 грн |
| MIMXRT1189CVM8C |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
товару немає в наявності
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| SC16IS762IPW,128 |
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Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7500 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2500+ | 382.51 грн |
| SC16IS762IPW,128 |
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Виробник: NXP USA Inc.
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
Description: IC DUAL UART 64BYTE 28TSSOP
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Protocol: RS232, RS485
Supplier Device Package: 28-TSSOP
DigiKey Programmable: Not Verified
на замовлення 7565 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 641.63 грн |
| 10+ | 480.35 грн |
| 25+ | 446.08 грн |
| 100+ | 383.28 грн |
| 250+ | 376.32 грн |
| SPC5748GK0AMMJ6 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 768K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 80MHz/160MHz
Mounting Type: Surface Mount
Package / Case: 256-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 178
Supplier Device Package: 256-MAPPBGA (17x17)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 80x10b, 64x12b
Core Processor: e200z2, e200z4, e200z4
Program Memory Type: FLASH
товару немає в наявності
Мінімальне замовлення: 450 шт
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од. на суму грн.






















