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SC33771CTA1MAE SC33771CTA1MAE NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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PBLS4004V,115 PBLS4004V,115 NXP USA Inc. PBLS4004Y_PBLS4004V.pdf Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
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PBLS4005V,115 PBLS4005V,115 NXP USA Inc. PBLS4005Y_PBLS4005V.pdf Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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MVR5510AVMAHTS NXP USA Inc. VR5510.pdf Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC68331CPV16 MC68331CPV16 NXP USA Inc. MC68331.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 18
DigiKey Programmable: Not Verified
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PCA9306DC1Z PCA9306DC1Z NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
на замовлення 826 шт:
термін постачання 21-31 дні (днів)
5+74.60 грн
10+51.85 грн
25+46.81 грн
100+38.75 грн
250+36.29 грн
500+34.80 грн
Мінімальне замовлення: 5
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MCXA344VFM NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 32QFN
Packaging: Tray
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74ALVCH16825DGG112 74ALVCH16825DGG112 NXP USA Inc. 74ALVCH16825.pdf Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 9
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
на замовлення 875 шт:
термін постачання 21-31 дні (днів)
178+111.37 грн
Мінімальне замовлення: 178
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S32E288AACAAMJGT S32E288AACAAMJGT NXP USA Inc. S32Z27_DS.pdf Description: IC
Packaging: Tray
Mounting Type: Surface Mount
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+8594.78 грн
10+6979.06 грн
40+6518.64 грн
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MF3E23A1DUF/01Z NXP USA Inc. MF3E(H)x3_SDS.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: PLLMC
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MIMX9596DVTXNAC MIMX9596DVTXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 15X15 COMMERCIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596CVTXNAC MIMX9596CVTXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 15X15 INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVTXNBC MIMX9596XVTXNBC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVTXNAC MIMX9596XVTXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596DVZXNAC MIMX9596DVZXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 19X19 NO-LID COMMERCIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596CVZXNAC MIMX9596CVZXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 19X19 NO-LID INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVZXNBC MIMX9596XVZXNBC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVZXNAC MIMX9596XVZXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596AVZXNAC MIMX9596AVZXNAC NXP USA Inc. MIMX9596DVZXNAC.PDF Description: I.MX95 19X19 NO-LID AUTO
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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IMX95-OS08A20 NXP USA Inc. Description: OS08A20 CAMERA 8MP MIPI-CSI
Packaging: Bulk
Function: Camera
Type: Sensor
Contents: Board(s)
Utilized IC / Part: OS08A20
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MC68HC908AP64CB MC68HC908AP64CB NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 64KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 30
DigiKey Programmable: Not Verified
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NCJ3321AHF/00100Y NCJ3321AHF/00100Y NXP USA Inc. NCF3321FS.pdf Description: NCJ3321AHF
Packaging: Tape & Reel (TR)
Package / Case: 40-WFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HWQFN (5x5)
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MC9S08AC32MPUE MC9S08AC32MPUE NXP USA Inc. PHGL-S-A0002263322-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 894 шт:
термін постачання 21-31 дні (днів)
43+462.32 грн
Мінімальне замовлення: 43
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MC9S08AC32MFUE MC9S08AC32MFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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74HCT112N,652 74HCT112N,652 NXP USA Inc. 74HC_HCT112.pdf Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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MC33PF8100EPTS NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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MIMX8QP5AVUFEAB MIMX8QP5AVUFEAB NXP USA Inc. IMX8QP1P3AEC.pdf Description: MIMX8QP5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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MIMX8QP6AVUFEAB MIMX8QP6AVUFEAB NXP USA Inc. IMX8QP1P3AEC.pdf Description: MIMX8QP6AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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MIMX8QM5AVUFEAB MIMX8QM5AVUFEAB NXP USA Inc. IMX8QM1P3AEC.pdf Description: MIMX8QM5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PMEG3002ESFYL PMEG3002ESFYL NXP USA Inc. NEXP-S-A0003101014-1.pdf?t.download=true&u=5oefqw Description: DIODE SCHOTTK 30V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.42 ns
Technology: Schottky
Capacitance @ Vr, F: 21pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 535 mV @ 200 mA
Current - Reverse Leakage @ Vr: 9 µA @ 30 V
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)
2264+8.72 грн
Мінімальне замовлення: 2264
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ASL9015SHNZ ASL9015SHNZ NXP USA Inc. Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
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ASL9015FHNZ ASL9015FHNZ NXP USA Inc. Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
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LPC55S36JHI48MP LPC55S36JHI48MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
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В кошику  од. на суму  грн.
LPC55S36JHI48MP LPC55S36JHI48MP NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
на замовлення 3933 шт:
термін постачання 21-31 дні (днів)
1+617.74 грн
10+462.80 грн
25+429.80 грн
100+369.30 грн
250+353.07 грн
500+343.28 грн
1000+329.74 грн
В кошику  од. на суму  грн.
LPC55S36JHI48K LPC55S36JHI48K NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
на замовлення 1270 шт:
термін постачання 21-31 дні (днів)
1+617.74 грн
10+462.80 грн
25+429.80 грн
100+369.30 грн
250+353.07 грн
500+343.28 грн
В кошику  од. на суму  грн.
LPC55S36JHI48E LPC55S36JHI48E NXP USA Inc. LPC553x.pdf Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+617.74 грн
10+462.80 грн
25+429.80 грн
100+369.30 грн
В кошику  од. на суму  грн.
SC16IS760IBS,128 SC16IS760IBS,128 NXP USA Inc. SC16IS740_750_760.pdf Description: IC UART I2C/SPI 24-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
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SC16IS760IBS,128 SC16IS760IBS,128 NXP USA Inc. SC16IS740_750_760.pdf Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
на замовлення 1475 шт:
термін постачання 21-31 дні (днів)
1+376.08 грн
10+277.23 грн
25+255.84 грн
100+218.10 грн
250+209.28 грн
В кошику  од. на суму  грн.
PCF85063AT/AY PCF85063AT/AY NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
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PCF85063AT/AY PCF85063AT/AY NXP USA Inc. PCF85063A.pdf Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
на замовлення 1602 шт:
термін постачання 21-31 дні (днів)
5+63.72 грн
10+43.77 грн
25+39.39 грн
100+32.53 грн
250+30.40 грн
500+29.12 грн
1000+27.60 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
S32K388HHT0MJBST S32K388HHT0MJBST NXP USA Inc. S32K3xx.pdf Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit 5-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 569 шт:
термін постачання 21-31 дні (днів)
1+3303.95 грн
10+2608.42 грн
25+2465.26 грн
152+2131.51 грн
В кошику  од. на суму  грн.
MC9S12XEQ512VAA MC9S12XEQ512VAA NXP USA Inc. MC9S12XEP100RMV1.pdf Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEQ512BMAGR S912XEQ512BMAGR NXP USA Inc. MC9S12XEPB.pdf Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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MIMX9331CVVXMACR NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
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MF1PH4200DA4/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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SC33PF8200DXESR2 NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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SC33PF8200DZESR2 NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
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SC33PF8200DXES NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
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SC33PF8200DZES NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Bulk
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N74F32N,602 N74F32N,602 NXP USA Inc. N74F32.pdf Description: IC GATE OR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 4
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BC807-25QAZ BC807-25QAZ NXP USA Inc. BC807-25QA_40QA.pdf Description: TRANS PNP 45V 0.5A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 500mA, 1V
Frequency - Transition: 80MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 900 mW
Qualification: AEC-Q101
на замовлення 15001 шт:
термін постачання 21-31 дні (днів)
3587+5.28 грн
Мінімальне замовлення: 3587
В кошику  од. на суму  грн.
74LVC2G3157DPJ 74LVC2G3157DPJ NXP USA Inc. 74LVC2G3157.pdf Description: IC SWITCH SPDT X 2 15OHM 10TSSOP
Packaging: Bulk
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 15Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 10-TSSOP
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Crosstalk: -54dB @ 10MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 5.7ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 2
на замовлення 1486 шт:
термін постачання 21-31 дні (днів)
462+43.62 грн
Мінімальне замовлення: 462
В кошику  од. на суму  грн.
LS1017ASE7PQA LS1017ASE7PQA NXP USA Inc. LS1027A%2C%20LS1017A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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TDF8597TH/N1,118 TDF8597TH/N1,118 NXP USA Inc. TDF8597TH-N1-118.pdf Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
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TDF8597TH/N1,118 TDF8597TH/N1,118 NXP USA Inc. TDF8597TH-N1-118.pdf Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
на замовлення 498 шт:
термін постачання 21-31 дні (днів)
1+2664.45 грн
10+2092.35 грн
25+1983.36 грн
В кошику  од. на суму  грн.
FRDM-IMX91QSB NXP USA Inc. Description: FRDM-IMX91QSB
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
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NT4PLDJHN2/2003LXJ NXP USA Inc. NTAGXDNADS.pdf Description: HVQFN20
Packaging: Tape & Reel (TR)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
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NT4PLDJHN2/2003LXJ NXP USA Inc. NTAGXDNADS.pdf Description: HVQFN20
Packaging: Cut Tape (CT)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
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IW610X-EVK NXP USA Inc. Description: IW610X-EVK
Packaging: Bulk
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FRDMGD3162RPEVM FRDMGD3162RPEVM NXP USA Inc. getting-started-with-the-frdmgd3162rpevm-evaluation-board:GS-FRDMGD3162RPEVM Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: GD3162
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
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SC33771CTA1MAE
SC33771CTA1MAE
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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PBLS4004V,115 PBLS4004Y_PBLS4004V.pdf
PBLS4004V,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
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PBLS4005V,115 PBLS4005Y_PBLS4005V.pdf
PBLS4005V,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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MVR5510AVMAHTS VR5510.pdf
Виробник: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC68331CPV16 MC68331.pdf
MC68331CPV16
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 18
DigiKey Programmable: Not Verified
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PCA9306DC1Z PCA9306.pdf
PCA9306DC1Z
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
на замовлення 826 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+74.60 грн
10+51.85 грн
25+46.81 грн
100+38.75 грн
250+36.29 грн
500+34.80 грн
Мінімальне замовлення: 5
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MCXA344VFM MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 32QFN
Packaging: Tray
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74ALVCH16825DGG112 74ALVCH16825.pdf
74ALVCH16825DGG112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 9
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
на замовлення 875 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
178+111.37 грн
Мінімальне замовлення: 178
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S32E288AACAAMJGT S32Z27_DS.pdf
S32E288AACAAMJGT
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Mounting Type: Surface Mount
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+8594.78 грн
10+6979.06 грн
40+6518.64 грн
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MF3E23A1DUF/01Z MF3E(H)x3_SDS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: PLLMC
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MIMX9596DVTXNAC MIMX9596DVZXNAC.PDF
MIMX9596DVTXNAC
Виробник: NXP USA Inc.
Description: I.MX95 15X15 COMMERCIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596CVTXNAC MIMX9596DVZXNAC.PDF
MIMX9596CVTXNAC
Виробник: NXP USA Inc.
Description: I.MX95 15X15 INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVTXNBC MIMX9596DVZXNAC.PDF
MIMX9596XVTXNBC
Виробник: NXP USA Inc.
Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVTXNAC MIMX9596DVZXNAC.PDF
MIMX9596XVTXNAC
Виробник: NXP USA Inc.
Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596DVZXNAC MIMX9596DVZXNAC.PDF
MIMX9596DVZXNAC
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID COMMERCIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596CVZXNAC MIMX9596DVZXNAC.PDF
MIMX9596CVZXNAC
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID INDUSTRIAL
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVZXNBC MIMX9596DVZXNAC.PDF
MIMX9596XVZXNBC
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596XVZXNAC MIMX9596DVZXNAC.PDF
MIMX9596XVZXNAC
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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MIMX9596AVZXNAC MIMX9596DVZXNAC.PDF
MIMX9596AVZXNAC
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID AUTO
Packaging: Tray
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M7, ARM® Cortex®-M33
Voltage - I/O: 1.8V, 3.3V
Ethernet: 1GbE (2), 10GbE (1)
USB: USB 2.0 (1), USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
Co-Processors/DSP: NPGPU, NPU, VPU
RAM Controllers: LPDDR
Graphics Acceleration: Yes
Display & Interface Controllers: LVDS, MIPI-DSI
Security Features: Secure Boot, TrustZone
Additional Interfaces: CAN, GPIO, I2C, I3C, PCIe, SD/eMMC, SPI, UART
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IMX95-OS08A20
Виробник: NXP USA Inc.
Description: OS08A20 CAMERA 8MP MIPI-CSI
Packaging: Bulk
Function: Camera
Type: Sensor
Contents: Board(s)
Utilized IC / Part: OS08A20
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MC68HC908AP64CB MC68HC908AP64.pdf
MC68HC908AP64CB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 30
DigiKey Programmable: Not Verified
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NCJ3321AHF/00100Y NCF3321FS.pdf
NCJ3321AHF/00100Y
Виробник: NXP USA Inc.
Description: NCJ3321AHF
Packaging: Tape & Reel (TR)
Package / Case: 40-WFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HWQFN (5x5)
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MC9S08AC32MPUE PHGL-S-A0002263322-1.pdf?t.download=true&u=5oefqw
MC9S08AC32MPUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 894 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
43+462.32 грн
Мінімальне замовлення: 43
В кошику  од. на суму  грн.
MC9S08AC32MFUE MC9S08AC60AD.pdf
MC9S08AC32MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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74HCT112N,652 74HC_HCT112.pdf
74HCT112N,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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MC33PF8100EPTS PF8100_PF8200.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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MIMX8QP5AVUFEAB IMX8QP1P3AEC.pdf
MIMX8QP5AVUFEAB
Виробник: NXP USA Inc.
Description: MIMX8QP5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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MIMX8QP6AVUFEAB IMX8QP1P3AEC.pdf
MIMX8QP6AVUFEAB
Виробник: NXP USA Inc.
Description: MIMX8QP6AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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MIMX8QM5AVUFEAB IMX8QM1P3AEC.pdf
MIMX8QM5AVUFEAB
Виробник: NXP USA Inc.
Description: MIMX8QM5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PMEG3002ESFYL NEXP-S-A0003101014-1.pdf?t.download=true&u=5oefqw
PMEG3002ESFYL
Виробник: NXP USA Inc.
Description: DIODE SCHOTTK 30V 200MA DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 1.42 ns
Technology: Schottky
Capacitance @ Vr, F: 21pF @ 1V, 1MHz
Current - Average Rectified (Io): 200mA
Supplier Device Package: DSN0603-2
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 30 V
Voltage - Forward (Vf) (Max) @ If: 535 mV @ 200 mA
Current - Reverse Leakage @ Vr: 9 µA @ 30 V
на замовлення 18000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2264+8.72 грн
Мінімальне замовлення: 2264
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ASL9015SHNZ
ASL9015SHNZ
Виробник: NXP USA Inc.
Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
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ASL9015FHNZ
ASL9015FHNZ
Виробник: NXP USA Inc.
Description: IC LED DRIVER 36HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 36-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 36-HVQFN (6x6)
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LPC55S36JHI48MP LPC553x.pdf
LPC55S36JHI48MP
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
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LPC55S36JHI48MP LPC553x.pdf
LPC55S36JHI48MP
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
на замовлення 3933 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+617.74 грн
10+462.80 грн
25+429.80 грн
100+369.30 грн
250+353.07 грн
500+343.28 грн
1000+329.74 грн
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LPC55S36JHI48K LPC553x.pdf
LPC55S36JHI48K
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
на замовлення 1270 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+617.74 грн
10+462.80 грн
25+429.80 грн
100+369.30 грн
250+353.07 грн
500+343.28 грн
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LPC55S36JHI48E LPC553x.pdf
LPC55S36JHI48E
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Number of I/O: 32
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+617.74 грн
10+462.80 грн
25+429.80 грн
100+369.30 грн
В кошику  од. на суму  грн.
SC16IS760IBS,128 SC16IS740_750_760.pdf
SC16IS760IBS,128
Виробник: NXP USA Inc.
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
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SC16IS760IBS,128 SC16IS740_750_760.pdf
SC16IS760IBS,128
Виробник: NXP USA Inc.
Description: IC UART I2C/SPI 24-HVQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: I2C, SPI, UART
Operating Temperature: -40°C ~ 95°C
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 6mA
Protocol: RS232, RS485
Supplier Device Package: 24-HVQFN (4x4)
DigiKey Programmable: Not Verified
на замовлення 1475 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+376.08 грн
10+277.23 грн
25+255.84 грн
100+218.10 грн
250+209.28 грн
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PCF85063AT/AY PCF85063A.pdf
PCF85063AT/AY
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
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PCF85063AT/AY PCF85063A.pdf
PCF85063AT/AY
Виробник: NXP USA Inc.
Description: IC RTC CLOCK/CALENDAR I2C 8SO
Features: Alarm, Leap Year, Square Wave Output
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
Type: Clock/Calendar
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.9V ~ 5.5V
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Supplier Device Package: 8-SO
Current - Timekeeping (Max): 0.6µA @ 3.3V
DigiKey Programmable: Not Verified
на замовлення 1602 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+63.72 грн
10+43.77 грн
25+39.39 грн
100+32.53 грн
250+30.40 грн
500+29.12 грн
1000+27.60 грн
Мінімальне замовлення: 5
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S32K388HHT0MJBST S32K3xx.pdf
S32K388HHT0MJBST
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 320MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 1.125M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7F
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit 5-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 289-LFBGA (14x14)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 569 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3303.95 грн
10+2608.42 грн
25+2465.26 грн
152+2131.51 грн
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MC9S12XEQ512VAA MC9S12XEP100RMV1.pdf
MC9S12XEQ512VAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 12x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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S912XEQ512BMAGR MC9S12XEPB.pdf
S912XEQ512BMAGR
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 24x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 119
DigiKey Programmable: Not Verified
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MIMX9331CVVXMACR IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
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MF1PH4200DA4/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA4, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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SC33PF8200DXESR2 PF8100_PF8200.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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SC33PF8200DZESR2 PF8100_PF8200.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
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SC33PF8200DXES PF8100_PF8200.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
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SC33PF8200DZES PF8100_PF8200.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Bulk
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N74F32N,602 N74F32.pdf
N74F32N,602
Виробник: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: OR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 4
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BC807-25QAZ BC807-25QA_40QA.pdf
BC807-25QAZ
Виробник: NXP USA Inc.
Description: TRANS PNP 45V 0.5A DFN1010D-3
Packaging: Bulk
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 700mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 40 @ 500mA, 1V
Frequency - Transition: 80MHz
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 900 mW
Qualification: AEC-Q101
на замовлення 15001 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3587+5.28 грн
Мінімальне замовлення: 3587
В кошику  од. на суму  грн.
74LVC2G3157DPJ 74LVC2G3157.pdf
74LVC2G3157DPJ
Виробник: NXP USA Inc.
Description: IC SWITCH SPDT X 2 15OHM 10TSSOP
Packaging: Bulk
Package / Case: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 15Ohm
-3db Bandwidth: 300MHz
Supplier Device Package: 10-TSSOP
Voltage - Supply, Single (V+): 1.65V ~ 5.5V
Charge Injection: 7.5pC
Crosstalk: -54dB @ 10MHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Switch Time (Ton, Toff) (Max): 5.7ns, 3.8ns
Channel Capacitance (CS(off), CD(off)): 6pF
Current - Leakage (IS(off)) (Max): 5µA
Number of Circuits: 2
на замовлення 1486 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
462+43.62 грн
Мінімальне замовлення: 462
В кошику  од. на суму  грн.
LS1017ASE7PQA LS1027A%2C%20LS1017A.pdf
LS1017ASE7PQA
Виробник: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 448-BFBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 448-FBGA (17x17)
Ethernet: 1Gbps (1), 2.5Gbps (5)
USB: USB 3.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Graphics Acceleration: Yes
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
Additional Interfaces: CANbus, I2C, SPI, UART
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TDF8597TH/N1,118 TDF8597TH-N1-118.pdf
TDF8597TH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
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TDF8597TH/N1,118 TDF8597TH-N1-118.pdf
TDF8597TH/N1,118
Виробник: NXP USA Inc.
Description: IC AMP D MONO/STEREO 150W 36HSOP
Features: Depop, Differential Inputs, I2C, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class D
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 6V ~ 24V
Max Output Power x Channels @ Load: 150W x 1 @ 1Ohm; 100W x 2 @ 2Ohm
Supplier Device Package: 36-HSOP
на замовлення 498 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2664.45 грн
10+2092.35 грн
25+1983.36 грн
В кошику  од. на суму  грн.
FRDM-IMX91QSB
Виробник: NXP USA Inc.
Description: FRDM-IMX91QSB
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A55
Utilized IC / Part: i.MX 91
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NT4PLDJHN2/2003LXJ NTAGXDNADS.pdf
Виробник: NXP USA Inc.
Description: HVQFN20
Packaging: Tape & Reel (TR)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
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NT4PLDJHN2/2003LXJ NTAGXDNADS.pdf
Виробник: NXP USA Inc.
Description: HVQFN20
Packaging: Cut Tape (CT)
Package / Case: 20-PowerVFQFN
Mounting Type: Surface Mount, Wettable Flank
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 20-HVQFN (4x4)
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IW610X-EVK
Виробник: NXP USA Inc.
Description: IW610X-EVK
Packaging: Bulk
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FRDMGD3162RPEVM getting-started-with-the-frdmgd3162rpevm-evaluation-board:GS-FRDMGD3162RPEVM
FRDMGD3162RPEVM
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR GD3162
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: GD3162
Primary Attributes: 1-Channel (Single)
Secondary Attributes: SPI Interface(s)
Embedded: Yes, MCU
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