Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2416) > Сторінка 36 з 41
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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SMD291NL-5M | Chip Quik Inc. |
 Description: NO-CLEAN TACK FLUX W/TIPSPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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SMD291NL75G | Chip Quik Inc. |
Description: FLUX - NO CLEAN LF CAN 2.64 OZ Packaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR Packaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL10 | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 10CC SYR Packaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL10T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN SAC305 T4 10CC Packaging: Syringe Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL10T5 | Chip Quik Inc. |
Description: SOLDER PASTE LF T5 10CC Packaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL15T4 | Chip Quik Inc. |
Description: SOLDER PASTE TWO PART MIX Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste, Two Part Mix Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 0.53 oz (15g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T3 Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL250T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN SAC305 T4 250G Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T5 Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL40T7 | Chip Quik Inc. |
Description: SOLDER PASTE IN JAR 40G (T7) SAC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.41 oz (40g) Mesh Type: 7 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL500T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 500G Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNL500T3C | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN SAC305 T3 Packaging: Cartridge Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNL500T4C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T4 500G Packaging: Cartridge Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNL500T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 500G T5 Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL500T5C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T5 500G Packaging: Cartridge Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNL50T3 | Chip Quik Inc. |
Description: SLDR PASTE NO-CLN SAC305 50G Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNL50T6 | Chip Quik Inc. |
Description: SOLDER PASTE IN JAR 50G (T6) SAC Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 6 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNL60T4 | Chip Quik Inc. |
Description: SN96.5/AG3.0/CU0.5 2-PRT MIX 60G Packaging: Jar Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste, Two Part Mix Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 2.12 oz (60g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD291SNLT4 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN LEAD-FREE Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD291SNLT5 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN LEAD-FREE Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD291SNLT6 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN LEAD-FREE Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 6 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товар відсутній |
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SMD291SNLT7 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN LEAD-FREE Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.35 oz (10g), 5cc Mesh Type: 7 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD291ST2CC6 | Chip Quik Inc. |
Description: TACK FLUX 6 PACK, 2CC TUBES Packaging: Bag Type: Flux - No Clean Form: Tube, 0.07 oz (2g), 2cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SMD291ST8CC | Chip Quik Inc. |
Description: TACK FLUX IN 8CC SQUEEZE TUBE Packaging: Tube Type: Flux - No Clean, Tacky Solder Form: Tube, 0.28 oz (8g), 8cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 60/40 TI Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 60/40 TI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.012 100G | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.012" (0.31mm) Wire Gauge: 28 AWG, 30 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 .3OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/ Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.3 oz (8.51g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 .4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/ Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.7 oz (19.85g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 .7OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/ Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.7 oz (19.85g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| SMD291NL-5M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 663.68 грн |
| SMD291NL75G |
|
Виробник: Chip Quik Inc.
Description: FLUX - NO CLEAN LF CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - NO CLEAN LF CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4455.11 грн |
| SMD291SNL |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1078.21 грн |
| SMD291SNL10 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 10CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN 10CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1689.9 грн |
| SMD291SNL10T4 |
|
Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN SAC305 T4 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST NO-CLEAN SAC305 T4 10CC
Packaging: Syringe
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1997.54 грн |
| SMD291SNL10T5 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2633.78 грн |
| SMD291SNL15T4 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE TWO PART MIX
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER PASTE TWO PART MIX
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1382.97 грн |
| SMD291SNL250T3 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T3
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3664.33 грн |
| SMD291SNL250T4 |
|
Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4459.45 грн |
| SMD291SNL250T5 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7028.95 грн |
| SMD291SNL40T7 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14439.94 грн |
| SMD291SNL500T3 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 500G
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNL500T3C |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNL500T4C |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNL500T5 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G T5
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 500G T5
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13267.12 грн |
| SMD291SNL500T5C |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Cartridge
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNL50T3 |
|
Виробник: Chip Quik Inc.
Description: SLDR PASTE NO-CLN SAC305 50G
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PASTE NO-CLN SAC305 50G
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNL50T6 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 50G (T6) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE IN JAR 50G (T6) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNL60T4 |
|
Виробник: Chip Quik Inc.
Description: SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 2.12 oz (60g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SN96.5/AG3.0/CU0.5 2-PRT MIX 60G
Packaging: Jar
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 2.12 oz (60g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3246.19 грн |
| SMD291SNLT4 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1253.7 грн |
| SMD291SNLT5 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1649.45 грн |
| SMD291SNLT6 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товар відсутній
| SMD291SNLT7 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5051.63 грн |
| SMD291ST2CC6 |
|
Виробник: Chip Quik Inc.
Description: TACK FLUX 6 PACK, 2CC TUBES
Packaging: Bag
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 6 PACK, 2CC TUBES
Packaging: Bag
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 15 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 990.11 грн |
| SMD291ST8CC |
|
Виробник: Chip Quik Inc.
Description: TACK FLUX IN 8CC SQUEEZE TUBE
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Tube, 0.28 oz (8g), 8cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX IN 8CC SQUEEZE TUBE
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Tube, 0.28 oz (8g), 8cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 863.72 грн |
| SMD2SW.015 100G |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1047.16 грн |
| SMD2SW.020 .4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 392.86 грн |
| SMD2SW.020 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2708.17 грн |
| SMD2SW.020 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 514.91 грн |
| SMD2SW.020 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 704.12 грн |
| SMD2SW.020 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1109.99 грн |
| SMD2SW.020 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 40 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1624.9 грн |
| SMD2SW.031 .7OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 299.7 грн |
| SMD2SW.031 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2621.5 грн |
| SMD2SW.031 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 498.3 грн |
| SMD2SW.031 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 681.74 грн |
| SMD2SW.031 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1075.32 грн |
| SMD2SW.031 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1572.9 грн |
| SMD2SWLF.012 100G |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2906.76 грн |
| SMD2SWLF.015 .3OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 799.45 грн |
| SMD2SWLF.015 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4416.11 грн |
| SMD2SWLF.015 1OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 839.17 грн |
| SMD2SWLF.015 2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1121.54 грн |
| SMD2SWLF.015 4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1933.99 грн |
| SMD2SWLF.015 8OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2613.56 грн |
| SMD2SWLF.020 .4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 699.79 грн |
| SMD2SWLF.020 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4329.45 грн |
| SMD2SWLF.020 1OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 822.56 грн |
| SMD2SWLF.020 2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1125.87 грн |
| SMD2SWLF.020 4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1775.11 грн |
| SMD2SWLF.020 8OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2597.67 грн |
| SMD2SWLF.031 .7OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 599.41 грн |
| SMD2SWLF.031 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4242.07 грн |
| SMD2SWLF.031 1OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 786.45 грн |
| SMD2SWLF.031 2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1102.76 грн |
| SMD2SWLF.031 4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1857.44 грн |
| SMD2SWLF.031 8OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2544.95 грн |
| SMD2SWLT.040 100G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8057.33 грн |
| SMD2SWLT.040 10G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1320.14 грн |
| SMD2SWLT.040 200G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 12906.03 грн |