Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2669) > Сторінка 36 з 45
| Фото | Назва | Виробник | Інформація | Доступність | Ціна |
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REM32 | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY 32Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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REM32-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LFPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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REM32-THIN | Chip Quik Inc. |
Description: CHIP REMOVAL ALLOY (32 FEET, 0.8Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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REM32-THIN-NL | Chip Quik Inc. |
Description: CHIP LEAD-FREE REMOVAL ALLOY (32Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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REM32-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP RPart Status: Active Packaging: Bulk Flux Type: No-Clean, Water Soluble Process: Lead Free Melting Point: 144°F (62°C) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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REM3-THICK | Chip Quik Inc. |
Description: CHIP REMOVAL ALLOY (3 FEET, 3.17Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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REM3-THICK-NL | Chip Quik Inc. |
Description: CHIP LEAD-FREE REMOVAL ALLOY (3Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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REM4.5 | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY 4.5Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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REM4.5-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LFPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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REM4.5-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP RPart Status: Active Packaging: Bulk Flux Type: No-Clean, Water Soluble Process: Lead Free Melting Point: 144°F (62°C) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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REM4-THICK | Chip Quik Inc. |
Description: CHIP REMOVAL ALLOY (4 FEET, 3.17Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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REM4-THICK-NL | Chip Quik Inc. |
Description: CHIP LEAD-FREE REMOVAL ALLOY (4Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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REM64-THIN | Chip Quik Inc. |
Description: CHIP REMOVAL ALLOY (64 FEET, 0.8Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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REM64-THIN-NL | Chip Quik Inc. |
Description: CHIP LEAD-FREE REMOVAL ALLOY (64Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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REM8 | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY 8 FPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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REM8-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LFPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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REM8-THIN | Chip Quik Inc. |
Description: CHIP REMOVAL ALLOY (8 FEET, 0.8MPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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REM8-THIN-NL | Chip Quik Inc. |
Description: CHIP LEAD-FREE REMOVAL ALLOY (8Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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REM8-ULTRA-NL | Chip Quik Inc. |
Description: ULTRA LOW TEMP FLUX CORED CHIP RPart Status: Active Packaging: Bulk Flux Type: No-Clean, Water Soluble Process: Lead Free Melting Point: 144°F (62°C) |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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REMKIT | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOYPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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REMKIT4.5 | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY WITPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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REMKIT4.5-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LFPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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REMKIT-NL | Chip Quik Inc. |
Description: SMD / SMT CHIP REMOVAL ALLOY LFPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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REMKIT-THIN | Chip Quik Inc. |
Description: CHIP REMOVAL ALLOY KIT (5 FEET,Packaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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REMKIT-THIN-NL | Chip Quik Inc. |
Description: CHIP LEAD-FREE REMOVAL ALLOY KITPackaging: Bulk For Use With/Related Products: SMD Components Accessory Type: Removal Alloy |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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RMA591 | Chip Quik Inc. |
Description: RMA TACK FLUX FOR LEADED 10CCPackaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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RMA591-10M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEADED) W/TIPSPackaging: Bulk Shipping Info: Ships with Cold Pack. Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 120 шт: термін постачання 21-31 дні (днів) |
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RMA591-5M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEAD) W/ TIPSShelf Life: 24 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Part Status: Active Form: Syringe, 0.169 oz (5g) Type: Flux - Rosin Mildly Activated (RMA) Packaging: Bulk |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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RMA591LT10 | Chip Quik Inc. |
Description: RMA SOLDER PASTE SN42/BI57.6/AG0Packaging: Bulk Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RMA591LT250 | Chip Quik Inc. |
Description: RMA SOLDER PASTE SN42/BI57.6/AG0Shelf Life: 6 Months Shelf Life Start: Date of Manufacture Flux Type: No-Clean Form: Jar, 8.8 oz (250g) Melting Point: 280°F (138°C) Type: Solder Paste Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RMA591NL | Chip Quik Inc. |
Description: RMA TACK FLUX FOR LEAD-FREE 10CCPackaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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RMA591NL-10M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEAD-FREE) W/TIPSPackaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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RMA591NL-5M | Chip Quik Inc. |
Description: TACK FLUX (FOR LEAD-FREE) W/ TIPShelf Life: 24 Months Shelf Life Start: Date of Manufacture Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Part Status: Active Form: Syringe, 0.18 oz (5g), 5cc Type: Flux - Rosin Mildly Activated (RMA) Packaging: Bulk |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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RMA791 | Chip Quik Inc. |
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FLPackaging: Bulk Type: Flux - Rosin Mildly Activated (RMA) Form: Jar, 2 oz (56.7g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 137 шт: термін постачання 21-31 дні (днів) |
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SBB0802P-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Size / Dimension: 1.00" L x 1.00" W (25.4mm x 25.4mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
на замовлення 187 шт: термін постачання 21-31 дні (днів) |
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SBB1002-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPackaging: Bulk Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
на замовлення 491 шт: термін постачання 21-31 дні (днів) |
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SBB1005-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPackaging: Bulk Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
на замовлення 416 шт: термін постачання 21-31 дні (днів) |
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SBB136 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 609 шт: термін постачання 21-31 дні (днів) |
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SBB1602-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPackaging: Bulk Size / Dimension: 2.00" L x 1.10" W (50.8mm x 27.9mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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SBB1605-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPackaging: Bulk Size / Dimension: 2.60" L x 2.40" W (66.0mm x 61.0mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SBB170 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 381 шт: термін постачання 21-31 дні (днів) |
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| SBB1802P-1 | Chip Quik Inc. | Description: SOLDER-IN BREADBOARD 1X2" (18 RO |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SBB206 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.062" (1.58mm) Proto Board Type: Breadboard, General Purpose Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 643 шт: термін постачання 21-31 дні (днів) |
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| SBB2802P-1 | Chip Quik Inc. |
Description: SOLDER-IN BREADBOARD 1X3" (28 RO Part Status: Active Plating: Plated Through Hole (PTH) Circuit Pattern: Pad Per Hole (Round) Hole Diameter: 0.039" (1.00mm) Proto Board Type: Breadboard, General Purpose Board Thickness: 0.063" (1.60mm) Pitch: 0.1" (2.54mm) Grid Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm) Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SBB2805-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPackaging: Bulk Size / Dimension: 3.20" L x 2.60" W (81.3mm x 66.0mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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SBB2808-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPart Status: Active Plating: Non-Plated Through Hole (NPTH) Circuit Pattern: 3 Hole Pad (Single Side) Hole Diameter: 0.039" (1.00mm) Proto Board Type: Breadboard, General Purpose Pitch: 0.100" (2.54mm) Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Packaging: Bulk |
на замовлення 119 шт: термін постачання 21-31 дні (днів) |
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SBB400 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 338 шт: термін постачання 21-31 дні (днів) |
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SBB8006-SS-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTHPart Status: Active Plating: Non-Plated Through Hole (NPTH) Circuit Pattern: 5 Hole Pad (Single Side) Board Thickness: 0.063" (1.60mm) Pitch: 0.100" (2.54mm) Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm) Packaging: Bulk Hole Diameter: 0.039" (1.00mm) Proto Board Type: Breadboard, General Purpose |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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SBB830 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 362 шт: термін постачання 21-31 дні (днів) |
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SBB830-QTY10 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SBB830-QTY25 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTHPackaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Single Side) Plating: Plated Through Hole (PTH) |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SBBSM127P | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMDPackaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.050" (1.27mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
на замовлення 322 шт: термін постачання 21-31 дні (днів) |
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SBBSM200P | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.079" (2.00mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
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SBBSM2106-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMDPackaging: Bulk Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pad (Square) Plating: Plated Surface Mount |
на замовлення 747 шт: термін постачання 21-31 дні (днів) |
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| SBBSM2108-1 | Chip Quik Inc. | Description: SMD BREADBOARD 168 SMT PADS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SBBSM2110-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMDPlating: Plated Surface Mount Circuit Pattern: Pads (Square) Proto Board Type: Breadboard, Surface Mount Board Thickness: 0.063" (1.60mm) Pitch: 0.1" (2.54mm) Grid Size / Dimension: 2.30" L x 1.10" W (58.4mm x 27.9mm) Packaging: Bulk |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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| SBBSM2112-1 | Chip Quik Inc. |
Description: SMD BREADBOARD 252 SMT PADS Packaging: Bulk Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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SBBSM2120-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMDPackaging: Bulk Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pad (Square) Plating: Plated Surface Mount |
на замовлення 389 шт: термін постачання 21-31 дні (днів) |
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| SBBSM3030-1 | Chip Quik Inc. | Description: LG SMD BREADBOARD 900 SMT PADS |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| SBBSM3040-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Pitch: 0.1" (2.54mm) Grid Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Packaging: Bulk Plating: Plated Surface Mount Circuit Pattern: Pads (Square) Proto Board Type: Breadboard, Surface Mount Board Thickness: 0.063" (1.60mm) |
товару немає в наявності |
В кошику од. на суму грн. |
| REM32 |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY 32
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY 32
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 8014.29 грн |
| REM32-NL |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 8014.29 грн |
| REM32-THIN |
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Виробник: Chip Quik Inc.
Description: CHIP REMOVAL ALLOY (32 FEET, 0.8
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP REMOVAL ALLOY (32 FEET, 0.8
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4608.88 грн |
| 5+ | 3824.54 грн |
| 10+ | 3586.71 грн |
| REM32-THIN-NL |
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Виробник: Chip Quik Inc.
Description: CHIP LEAD-FREE REMOVAL ALLOY (32
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP LEAD-FREE REMOVAL ALLOY (32
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 4776.99 грн |
| 5+ | 3964.48 грн |
| 10+ | 3717.88 грн |
| REM32-ULTRA-NL |
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Виробник: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Part Status: Active
Packaging: Bulk
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Melting Point: 144°F (62°C)
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Part Status: Active
Packaging: Bulk
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Melting Point: 144°F (62°C)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 16445.71 грн |
| REM3-THICK |
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Виробник: Chip Quik Inc.
Description: CHIP REMOVAL ALLOY (3 FEET, 3.17
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP REMOVAL ALLOY (3 FEET, 3.17
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2776.17 грн |
| 5+ | 2304.04 грн |
| 10+ | 2161.00 грн |
| 25+ | 1862.96 грн |
| REM3-THICK-NL |
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Виробник: Chip Quik Inc.
Description: CHIP LEAD-FREE REMOVAL ALLOY (3
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP LEAD-FREE REMOVAL ALLOY (3
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2867.30 грн |
| 5+ | 2379.08 грн |
| 10+ | 2231.35 грн |
| REM4.5 |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY 4.5
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY 4.5
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1652.82 грн |
| 5+ | 1371.77 грн |
| 10+ | 1286.75 грн |
| REM4.5-NL |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1652.82 грн |
| 5+ | 1371.77 грн |
| REM4.5-ULTRA-NL |
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Виробник: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Part Status: Active
Packaging: Bulk
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Melting Point: 144°F (62°C)
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Part Status: Active
Packaging: Bulk
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Melting Point: 144°F (62°C)
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 3320.56 грн |
| 5+ | 2753.69 грн |
| 10+ | 2581.59 грн |
| REM4-THICK |
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Виробник: Chip Quik Inc.
Description: CHIP REMOVAL ALLOY (4 FEET, 3.17
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP REMOVAL ALLOY (4 FEET, 3.17
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 3401.48 грн |
| 5+ | 2822.98 грн |
| 10+ | 2647.63 грн |
| REM4-THICK-NL |
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Виробник: Chip Quik Inc.
Description: CHIP LEAD-FREE REMOVAL ALLOY (4
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP LEAD-FREE REMOVAL ALLOY (4
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 3489.46 грн |
| 5+ | 2895.90 грн |
| 10+ | 2716.01 грн |
| REM64-THIN |
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Виробник: Chip Quik Inc.
Description: CHIP REMOVAL ALLOY (64 FEET, 0.8
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP REMOVAL ALLOY (64 FEET, 0.8
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 7700.06 грн |
| 5+ | 6388.81 грн |
| REM64-THIN-NL |
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Виробник: Chip Quik Inc.
Description: CHIP LEAD-FREE REMOVAL ALLOY (64
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP LEAD-FREE REMOVAL ALLOY (64
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 7857.17 грн |
| 5+ | 6519.37 грн |
| REM8 |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY 8 F
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY 8 F
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
товару немає в наявності
В кошику
од. на суму грн.
| REM8-NL |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 3046.40 грн |
| REM8-THIN |
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Виробник: Chip Quik Inc.
Description: CHIP REMOVAL ALLOY (8 FEET, 0.8M
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP REMOVAL ALLOY (8 FEET, 0.8M
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1555.41 грн |
| 5+ | 1290.83 грн |
| 10+ | 1210.72 грн |
| REM8-THIN-NL |
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Виробник: Chip Quik Inc.
Description: CHIP LEAD-FREE REMOVAL ALLOY (8
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP LEAD-FREE REMOVAL ALLOY (8
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1749.44 грн |
| 5+ | 1452.26 грн |
| 10+ | 1362.24 грн |
| REM8-ULTRA-NL |
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Виробник: Chip Quik Inc.
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Part Status: Active
Packaging: Bulk
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Melting Point: 144°F (62°C)
Description: ULTRA LOW TEMP FLUX CORED CHIP R
Part Status: Active
Packaging: Bulk
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Melting Point: 144°F (62°C)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 5074.72 грн |
| REMKIT |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 803.63 грн |
| REMKIT4.5 |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY WIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY WIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2502.01 грн |
| REMKIT4.5-NL |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 2502.01 грн |
| REMKIT-NL |
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Виробник: Chip Quik Inc.
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: SMD / SMT CHIP REMOVAL ALLOY LF
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 803.63 грн |
| REMKIT-THIN |
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Виробник: Chip Quik Inc.
Description: CHIP REMOVAL ALLOY KIT (5 FEET,
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP REMOVAL ALLOY KIT (5 FEET,
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 37 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1051.87 грн |
| 5+ | 873.26 грн |
| 10+ | 819.18 грн |
| 25+ | 706.36 грн |
| REMKIT-THIN-NL |
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Виробник: Chip Quik Inc.
Description: CHIP LEAD-FREE REMOVAL ALLOY KIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
Description: CHIP LEAD-FREE REMOVAL ALLOY KIT
Packaging: Bulk
For Use With/Related Products: SMD Components
Accessory Type: Removal Alloy
на замовлення 42 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1154.77 грн |
| 5+ | 958.74 грн |
| 10+ | 899.21 грн |
| 25+ | 775.40 грн |
| RMA591 |
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Виробник: Chip Quik Inc.
Description: RMA TACK FLUX FOR LEADED 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: RMA TACK FLUX FOR LEADED 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 1714.09 грн |
| 5+ | 1422.76 грн |
| 10+ | 1334.48 грн |
| RMA591-10M |
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Виробник: Chip Quik Inc.
Description: TACK FLUX (FOR LEADED) W/TIPS
Packaging: Bulk
Shipping Info: Ships with Cold Pack.
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEADED) W/TIPS
Packaging: Bulk
Shipping Info: Ships with Cold Pack.
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 120 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 795.77 грн |
| RMA591-5M |
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Виробник: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD) W/ TIPS
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Part Status: Active
Form: Syringe, 0.169 oz (5g)
Type: Flux - Rosin Mildly Activated (RMA)
Packaging: Bulk
Description: TACK FLUX (FOR LEAD) W/ TIPS
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Part Status: Active
Form: Syringe, 0.169 oz (5g)
Type: Flux - Rosin Mildly Activated (RMA)
Packaging: Bulk
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 670.87 грн |
| RMA591LT10 |
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Виробник: Chip Quik Inc.
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Packaging: Bulk
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| RMA591LT250 |
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Виробник: Chip Quik Inc.
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Flux Type: No-Clean
Form: Jar, 8.8 oz (250g)
Melting Point: 280°F (138°C)
Type: Solder Paste
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Packaging: Bulk
Description: RMA SOLDER PASTE SN42/BI57.6/AG0
Shelf Life: 6 Months
Shelf Life Start: Date of Manufacture
Flux Type: No-Clean
Form: Jar, 8.8 oz (250g)
Melting Point: 280°F (138°C)
Type: Solder Paste
Composition: Sn42Bi57.6Ag0.4 (42/57.6/0.4)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| RMA591NL |
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Виробник: Chip Quik Inc.
Description: RMA TACK FLUX FOR LEAD-FREE 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: RMA TACK FLUX FOR LEAD-FREE 10CC
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
| RMA591NL-10M |
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Виробник: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX (FOR LEAD-FREE) W/TIPS
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 795.77 грн |
| RMA591NL-5M |
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Виробник: Chip Quik Inc.
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Part Status: Active
Form: Syringe, 0.18 oz (5g), 5cc
Type: Flux - Rosin Mildly Activated (RMA)
Packaging: Bulk
Description: TACK FLUX (FOR LEAD-FREE) W/ TIP
Shelf Life: 24 Months
Shelf Life Start: Date of Manufacture
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Part Status: Active
Form: Syringe, 0.18 oz (5g), 5cc
Type: Flux - Rosin Mildly Activated (RMA)
Packaging: Bulk
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 670.87 грн |
| RMA791 |
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Виробник: Chip Quik Inc.
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Jar, 2 oz (56.7g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: ROSIN PASTE FLUX (RMA) IN 2OZ FL
Packaging: Bulk
Type: Flux - Rosin Mildly Activated (RMA)
Form: Jar, 2 oz (56.7g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 137 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 531.04 грн |
| SBB0802P-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.00" L x 1.00" W (25.4mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.00" L x 1.00" W (25.4mm x 25.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
на замовлення 187 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 217.60 грн |
| 5+ | 178.22 грн |
| 10+ | 167.10 грн |
| 25+ | 144.77 грн |
| 50+ | 136.76 грн |
| 100+ | 129.60 грн |
| SBB1002-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 1.40" L x 1.10" W (35.6mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
на замовлення 491 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 5+ | 73.06 грн |
| SBB1005-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 1.40" W (66.0mm x 35.6mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
на замовлення 416 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 106.05 грн |
| SBB136 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 609 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 159.47 грн |
| SBB1602-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.00" L x 1.10" W (50.8mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.00" L x 1.10" W (50.8mm x 27.9mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
на замовлення 101 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 153.18 грн |
| SBB1605-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 2.40" W (66.0mm x 61.0mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 2.60" L x 2.40" W (66.0mm x 61.0mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
на замовлення 13 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 182.25 грн |
| SBB170 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 381 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 159.47 грн |
| SBB1802P-1 |
Виробник: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X2" (18 RO
Description: SOLDER-IN BREADBOARD 1X2" (18 RO
товару немає в наявності
В кошику
од. на суму грн.
| SBB206 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.58mm)
Proto Board Type: Breadboard, General Purpose
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 643 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 199.53 грн |
| SBB2802P-1 |
Виробник: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Part Status: Active
Plating: Plated Through Hole (PTH)
Circuit Pattern: Pad Per Hole (Round)
Hole Diameter: 0.039" (1.00mm)
Proto Board Type: Breadboard, General Purpose
Board Thickness: 0.063" (1.60mm)
Pitch: 0.1" (2.54mm) Grid
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Packaging: Bulk
Description: SOLDER-IN BREADBOARD 1X3" (28 RO
Part Status: Active
Plating: Plated Through Hole (PTH)
Circuit Pattern: Pad Per Hole (Round)
Hole Diameter: 0.039" (1.00mm)
Proto Board Type: Breadboard, General Purpose
Board Thickness: 0.063" (1.60mm)
Pitch: 0.1" (2.54mm) Grid
Size / Dimension: 3.00" L x 1.00" W (76.2mm x 25.4mm)
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| SBB2805-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 3.20" L x 2.60" W (81.3mm x 66.0mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 3.20" L x 2.60" W (81.3mm x 66.0mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 233.31 грн |
| SBB2808-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Part Status: Active
Plating: Non-Plated Through Hole (NPTH)
Circuit Pattern: 3 Hole Pad (Single Side)
Hole Diameter: 0.039" (1.00mm)
Proto Board Type: Breadboard, General Purpose
Pitch: 0.100" (2.54mm)
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Packaging: Bulk
Description: BREADBOARD GENERAL PURPOSE NPTH
Part Status: Active
Plating: Non-Plated Through Hole (NPTH)
Circuit Pattern: 3 Hole Pad (Single Side)
Hole Diameter: 0.039" (1.00mm)
Proto Board Type: Breadboard, General Purpose
Pitch: 0.100" (2.54mm)
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Packaging: Bulk
на замовлення 119 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 249.02 грн |
| SBB400 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 338 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 319.72 грн |
| SBB8006-SS-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Part Status: Active
Plating: Non-Plated Through Hole (NPTH)
Circuit Pattern: 5 Hole Pad (Single Side)
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm)
Packaging: Bulk
Hole Diameter: 0.039" (1.00mm)
Proto Board Type: Breadboard, General Purpose
Description: BREADBOARD GENERAL PURPOSE NPTH
Part Status: Active
Plating: Non-Plated Through Hole (NPTH)
Circuit Pattern: 5 Hole Pad (Single Side)
Board Thickness: 0.063" (1.60mm)
Pitch: 0.100" (2.54mm)
Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm)
Packaging: Bulk
Hole Diameter: 0.039" (1.00mm)
Proto Board Type: Breadboard, General Purpose
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 916.75 грн |
| SBB830 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 362 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 580.53 грн |
| SBB830-QTY10 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 5273.47 грн |
| SBB830-QTY25 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 12084.27 грн |
| SBBSM127P |
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Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
на замовлення 322 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 406.13 грн |
| 5+ | 335.27 грн |
| 10+ | 315.45 грн |
| 25+ | 274.42 грн |
| 50+ | 260.08 грн |
| 100+ | 247.26 грн |
| 250+ | 228.52 грн |
| SBBSM200P |
Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.079" (2.00mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.079" (2.00mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 1+ | 383.35 грн |
| 5+ | 316.81 грн |
| 10+ | 297.97 грн |
| 25+ | 259.23 грн |
| 50+ | 245.69 грн |
| 100+ | 233.55 грн |
| SBBSM2106-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
на замовлення 747 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 3+ | 106.05 грн |
| SBBSM2108-1 |
Виробник: Chip Quik Inc.
Description: SMD BREADBOARD 168 SMT PADS
Description: SMD BREADBOARD 168 SMT PADS
товару немає в наявності
В кошику
од. на суму грн.
| SBBSM2110-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Plating: Plated Surface Mount
Circuit Pattern: Pads (Square)
Proto Board Type: Breadboard, Surface Mount
Board Thickness: 0.063" (1.60mm)
Pitch: 0.1" (2.54mm) Grid
Size / Dimension: 2.30" L x 1.10" W (58.4mm x 27.9mm)
Packaging: Bulk
Description: BREADBOARD SMD PLATED SMD
Plating: Plated Surface Mount
Circuit Pattern: Pads (Square)
Proto Board Type: Breadboard, Surface Mount
Board Thickness: 0.063" (1.60mm)
Pitch: 0.1" (2.54mm) Grid
Size / Dimension: 2.30" L x 1.10" W (58.4mm x 27.9mm)
Packaging: Bulk
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 182.25 грн |
| SBBSM2112-1 |
Виробник: Chip Quik Inc.
Description: SMD BREADBOARD 252 SMT PADS
Packaging: Bulk
Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Description: SMD BREADBOARD 252 SMT PADS
Packaging: Bulk
Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SBBSM2120-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
на замовлення 389 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна |
|---|---|
| 2+ | 279.66 грн |
| SBBSM3030-1 |
Виробник: Chip Quik Inc.
Description: LG SMD BREADBOARD 900 SMT PADS
Description: LG SMD BREADBOARD 900 SMT PADS
товару немає в наявності
В кошику
од. на суму грн.
| SBBSM3040-1 |
Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Pitch: 0.1" (2.54mm) Grid
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Packaging: Bulk
Plating: Plated Surface Mount
Circuit Pattern: Pads (Square)
Proto Board Type: Breadboard, Surface Mount
Board Thickness: 0.063" (1.60mm)
Description: BREADBOARD SMD PLATED SMD
Pitch: 0.1" (2.54mm) Grid
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Packaging: Bulk
Plating: Plated Surface Mount
Circuit Pattern: Pads (Square)
Proto Board Type: Breadboard, Surface Mount
Board Thickness: 0.063" (1.60mm)
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