Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2653) > Сторінка 44 з 45
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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SMDTCLF | Chip Quik Inc. |
Description: SOLDER TIP TIN (ACTIVATOR) 26.6GPackaging: Bulk For Use With/Related Products: Soldering Irons, Workstands Type: Tip Tinner (Activator) Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm) Specifications: Lead Free Part Status: Active |
на замовлення 762 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK1.5 | Chip Quik Inc. |
Description: 1.5MM SOLDER WICK NO CLEANPackaging: Bulk Color: Yellow Length: 5' (1.524m) Type: No Clean Width: 0.059" (1.50mm) Product Type: Braid/Wick Part Status: Active |
на замовлення 521 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK2.0 | Chip Quik Inc. |
Description: 2.0MM SOLDER WICK NO CLEANPackaging: Bulk Color: Green Length: 5' (1.524m) Type: No Clean Width: 0.080" (2.03mm) Product Type: Braid/Wick Part Status: Active |
на замовлення 1305 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK2.5 | Chip Quik Inc. |
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUEPackaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.098" (2.50mm) Product Type: Braid/Wick |
на замовлення 464 шт: термін постачання 21-31 дні (днів) |
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SOLDERWICK2.8 | Chip Quik Inc. |
Description: 2.8MM SOLDER WICK NO CLEANPackaging: Bulk Color: Blue Length: 5' (1.524m) Type: No Clean Width: 0.110" (2.79mm) Product Type: Braid/Wick Part Status: Active |
на замовлення 1252 шт: термін постачання 21-31 дні (днів) |
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SS-METAL-0.2-136X48 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQUPackaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SS-METAL-0.2-68X36 | Chip Quik Inc. |
Description: STAINLESS STEEL SOLDER PASTE SQUPackaging: Bulk For Use With/Related Products: Boards, Stencils Accessory Type: Stencil Squeegee |
на замовлення 133 шт: термін постачання 21-31 дні (днів) |
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ST0001 | Chip Quik Inc. |
Description: SOLDER PRACTICE KITPackaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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| ST0001-S | Chip Quik Inc. |
Description: SMD SOLDERING PRACTICE KIT STENC Packaging: Bulk Material: Stainless Steel Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||
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ST0002 | Chip Quik Inc. |
Description: PRACTICE KIT (WITH 135 SMD PARTSPackaging: Bulk Kit Type: Solder Main Purpose: SMD Practice |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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ST0002-S | Chip Quik Inc. |
Description: PRACTICE KIT STENCIL FOR ST0002Packaging: Bulk Material: Stainless Steel Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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STENCIL-WIPES | Chip Quik Inc. |
Description: STENCIL WIPES (IPA/WATER LINT-FRPackaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
на замовлення 239 шт: термін постачання 21-31 дні (днів) |
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STENCIL-WIPES-ANTISTATIC | Chip Quik Inc. |
Description: STENCIL WIPES ANTI-STATIC (IPA/WPackaging: Bulk Type: Wipes, Pre-Saturated Size: 9" x 6.1" Applications: Stencils Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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TC1-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSITPackaging: Bulk Color: White Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 483 шт: термін постачання 21-31 дні (днів) |
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TC1-200G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSITPackaging: Bulk Color: White Size / Dimension: 200 gram Jar Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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TC1-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - HIGH DENSITPackaging: Bulk Color: White Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 0.67W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months |
на замовлення 115 шт: термін постачання 21-31 дні (днів) |
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TC2-10G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRAPackaging: Bulk Color: Gray Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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TC2-20G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRAPackaging: Bulk Color: Gray Size / Dimension: 20 gram Syringe Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 77 шт: термін постачання 21-31 дні (днів) |
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TC2-50G | Chip Quik Inc. |
Description: HEAT SINK COMPOUND - GREY ULTRAPackaging: Bulk Color: Gray Size / Dimension: 50 gram Jar Type: Silicone Compound Thermal Conductivity: 4.30W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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TC3-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUNDPackaging: Bulk Color: Gray Size / Dimension: 5cc Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 171 шт: термін постачання 21-31 дні (днів) |
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TC3-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUNDPackaging: Bulk Color: Gray Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 24 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 933 шт: термін постачання 21-31 дні (днів) |
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TC3-3.5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUNDPackaging: Bulk Color: Gray Size / Dimension: 3.5 gram Syringe Type: Silicone Compound Thermal Conductivity: 8.50W/m-K Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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TC4-10G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 10 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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TC4-1G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 1 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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TC4-20G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 20 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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TC4-2G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 2 gram Syringe Type: Silicone Compound Thermal Conductivity: 79.00 W/m-K Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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TC4-5G | Chip Quik Inc. |
Description: HEAT SINK THERMAL COMPOUND - DEEPackaging: Bulk Color: Silver Size / Dimension: 5 gram Syringe Type: Thermal Compound, Liquid Metal Thermal Conductivity: 79.00 W/m-K Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life: 60 Months Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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TS391AX | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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TS391AX10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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TS391AX250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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TS391AX50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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TS391AX500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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TS391LT | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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TS391LT10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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TS391LT250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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TS391LT50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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TS391LT500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 281°F (138°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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TS391SNL | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 150 шт: термін постачання 21-31 дні (днів) |
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TS391SNL10 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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TS391SNL250 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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TS391SNL50 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.76 oz (50g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 113 шт: термін постачання 21-31 дні (днів) |
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TS391SNL500C | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NOPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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TS991AX35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NCPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TS991AX500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE NCPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||
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TS991SNL35T3 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NCPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 3 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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TS991SNL35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE NCPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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TS991SNL500T3 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE NCPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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TS991SNL500T4 | Chip Quik Inc. |
Description: SOLDER PASTE THERMALLY STABLE NCPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423°F (217°C) Form: Jar, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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TV-1000 | Chip Quik Inc. |
Description: DESOLDERING TWEEZERS 110VPackaging: Box For Use With/Related Products: SMD Components Tool Type: Vacuum System, Tweezer Kit |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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TV-100-PB | Chip Quik Inc. |
Description: DESOLDERING TWEEZERSPackaging: Box For Use With/Related Products: SMD Components Tool Type: Vacuum System, Tweezer Kit |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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UVA10CC-WP | Chip Quik Inc. |
Description: UVA BLOCKING 10CC SYRINGE 10PACKPackaging: Bulk Capacity: 10cc Color: Black Type: Syringe, Air Operated Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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UVA10CC-WP-QTY1 | Chip Quik Inc. |
Description: UVA BLOCKING 10CC SYRINGE (WITHPackaging: Bulk Capacity: 10cc Color: Black Type: Syringe, Air Operated Tip Type: Dispenser Needle, Tip Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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UVA5CC-WP | Chip Quik Inc. |
Description: UVA BLOCKING 5CC SYRINGE 10 PACKPackaging: Bulk Capacity: 5cc Color: Black Type: Syringe, Air Operated Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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UVA5CC-WP-QTY1 | Chip Quik Inc. |
Description: UVA BLOCKING 5CC SYRINGE (WITH APackaging: Bulk Capacity: 5cc Color: Black Type: Syringe, Air Operated Tip Type: Dispenser Needle, Tip Part Status: Active |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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V8910 | Chip Quik Inc. |
Description: TOOL VACUUM PICK & PLACE W/TIPSPackaging: Tube Accessory Type: Vacuum Tool with Tips |
на замовлення 282 шт: термін постачання 21-31 дні (днів) |
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V9000K8-B | Chip Quik Inc. |
Description: REPLACEMENT CUPS FOR V8910Packaging: Bag For Use With/Related Products: V8910 Accessory Type: Vacuum Tips |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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WS991 | Chip Quik Inc. |
Description: TACKY FLUX WATER-SOLUBLE 10CC SYPackaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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WS991-10M | Chip Quik Inc. |
Description: WATER-SOLUBLE FLUX W/TIPSPackaging: Bulk Type: Flux - Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 71 шт: термін постачання 21-31 дні (днів) |
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WS991-5M | Chip Quik Inc. |
Description: WATER-SOLUBLE TACK FLUX W/TIPSPackaging: Bulk Type: Flux - Water-Soluble Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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WS991AX35T4 | Chip Quik Inc. |
Description: THERMALLY STABLE SOLDER PASTE WSPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (34.869g) Mesh Type: 4 Flux Type: Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. |
| SMDTCLF |
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Виробник: Chip Quik Inc.
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
Description: SOLDER TIP TIN (ACTIVATOR) 26.6G
Packaging: Bulk
For Use With/Related Products: Soldering Irons, Workstands
Type: Tip Tinner (Activator)
Size: 1.57" Dia x 0.57" H (40.0mm x 14.5mm)
Specifications: Lead Free
Part Status: Active
на замовлення 762 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 608.11 грн |
| SOLDERWICK1.5 |
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Виробник: Chip Quik Inc.
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
Description: 1.5MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Yellow
Length: 5' (1.524m)
Type: No Clean
Width: 0.059" (1.50mm)
Product Type: Braid/Wick
Part Status: Active
на замовлення 521 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 145.31 грн |
| SOLDERWICK2.0 |
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Виробник: Chip Quik Inc.
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.0MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Green
Length: 5' (1.524m)
Type: No Clean
Width: 0.080" (2.03mm)
Product Type: Braid/Wick
Part Status: Active
на замовлення 1305 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 148.47 грн |
| SOLDERWICK2.5 |
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Виробник: Chip Quik Inc.
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
Description: 2.5MM SOLDER WICK (#4 LIGHT BLUE
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.098" (2.50mm)
Product Type: Braid/Wick
на замовлення 464 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 360.92 грн |
| 10+ | 326.94 грн |
| 100+ | 245.15 грн |
| SOLDERWICK2.8 |
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Виробник: Chip Quik Inc.
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
Description: 2.8MM SOLDER WICK NO CLEAN
Packaging: Bulk
Color: Blue
Length: 5' (1.524m)
Type: No Clean
Width: 0.110" (2.79mm)
Product Type: Braid/Wick
Part Status: Active
на замовлення 1252 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 3+ | 148.47 грн |
| SS-METAL-0.2-136X48 |
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Виробник: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
на замовлення 21 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1333.10 грн |
| SS-METAL-0.2-68X36 |
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Виробник: Chip Quik Inc.
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
Description: STAINLESS STEEL SOLDER PASTE SQU
Packaging: Bulk
For Use With/Related Products: Boards, Stencils
Accessory Type: Stencil Squeegee
на замовлення 133 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 666.55 грн |
| ST0001 |
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Виробник: Chip Quik Inc.
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: SOLDER PRACTICE KIT
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
на замовлення 109 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2129.17 грн |
| ST0001-S |
Виробник: Chip Quik Inc.
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
Description: SMD SOLDERING PRACTICE KIT STENC
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 2.000" L x 2.000" W (50.80mm x 50.80mm)
товару немає в наявності
В кошику
од. на суму грн.
| ST0002 |
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Виробник: Chip Quik Inc.
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
Description: PRACTICE KIT (WITH 135 SMD PARTS
Packaging: Bulk
Kit Type: Solder
Main Purpose: SMD Practice
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5330.02 грн |
| ST0002-S |
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Виробник: Chip Quik Inc.
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
Description: PRACTICE KIT STENCIL FOR ST0002
Packaging: Bulk
Material: Stainless Steel
Outer Dimension: 5.000" L x 4.000" W (127.00mm x 101.60mm)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3329.59 грн |
| STENCIL-WIPES |
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Виробник: Chip Quik Inc.
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES (IPA/WATER LINT-FR
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
на замовлення 239 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 807.91 грн |
| STENCIL-WIPES-ANTISTATIC |
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Виробник: Chip Quik Inc.
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
Description: STENCIL WIPES ANTI-STATIC (IPA/W
Packaging: Bulk
Type: Wipes, Pre-Saturated
Size: 9" x 6.1"
Applications: Stencils
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1001.40 грн |
| TC1-10G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 483 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 608.11 грн |
| TC1-200G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 200 gram Jar
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
на замовлення 13 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3784.48 грн |
| TC1-20G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Description: HEAT SINK COMPOUND - HIGH DENSIT
Packaging: Bulk
Color: White
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 0.67W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
на замовлення 115 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 895.58 грн |
| TC2-10G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1600.82 грн |
| TC2-20G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 20 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 77 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3530.97 грн |
| TC2-50G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK COMPOUND - GREY ULTRA
Packaging: Bulk
Color: Gray
Size / Dimension: 50 gram Jar
Type: Silicone Compound
Thermal Conductivity: 4.30W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 44 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8152.59 грн |
| TC3-10G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 5cc Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 5cc Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 171 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2579.32 грн |
| TC3-1G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 24 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 933 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 404.35 грн |
| TC3-3.5G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND
Packaging: Bulk
Color: Gray
Size / Dimension: 3.5 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 8.50W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 102 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1105.65 грн |
| TC4-10G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 10 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2405.58 грн |
| 10+ | 2180.35 грн |
| TC4-1G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 1 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 27 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 845.03 грн |
| 10+ | 769.09 грн |
| 25+ | 723.81 грн |
| TC4-20G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 20 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 123 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5779.39 грн |
| TC4-2G |
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Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 2 gram Syringe
Type: Silicone Compound
Thermal Conductivity: 79.00 W/m-K
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 9 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1322.04 грн |
| TC4-5G |
![]() |
Виробник: Chip Quik Inc.
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
Description: HEAT SINK THERMAL COMPOUND - DEE
Packaging: Bulk
Color: Silver
Size / Dimension: 5 gram Syringe
Type: Thermal Compound, Liquid Metal
Thermal Conductivity: 79.00 W/m-K
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life: 60 Months
Usable Temperature Range: -40°F ~ 302°F (-40°C ~ 150°C)
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1694.80 грн |
| 10+ | 1444.95 грн |
| TS391AX |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1192.52 грн |
| TS391AX10 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2018.60 грн |
| TS391AX250 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4116.18 грн |
| TS391AX50 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1042.47 грн |
| TS391AX500C |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| TS391LT |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 101 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1152.25 грн |
| TS391LT10 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1967.27 грн |
| TS391LT250 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 5773.86 грн |
| TS391LT50 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1491.84 грн |
| TS391LT500C |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 281°F (138°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| TS391SNL |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 150 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1152.25 грн |
| TS391SNL10 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2171.81 грн |
| TS391SNL250 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 4754.30 грн |
| TS391SNL50 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 113 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1220.16 грн |
| TS391SNL500C |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NO
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8152.59 грн |
| TS991AX35T4 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 2943.40 грн |
| TS991AX500T4 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| TS991SNL35T3 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 3
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 3
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3223.76 грн |
| TS991SNL35T4 |
![]() |
Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3223.76 грн |
| TS991SNL500T3 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7762.45 грн |
| TS991SNL500T4 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE THERMALLY STABLE NC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423°F (217°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 8120.21 грн |
| 5+ | 6737.88 грн |
| TV-1000 |
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Виробник: Chip Quik Inc.
Description: DESOLDERING TWEEZERS 110V
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
Description: DESOLDERING TWEEZERS 110V
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 25549.20 грн |
| TV-100-PB |
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Виробник: Chip Quik Inc.
Description: DESOLDERING TWEEZERS
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
Description: DESOLDERING TWEEZERS
Packaging: Box
For Use With/Related Products: SMD Components
Tool Type: Vacuum System, Tweezer Kit
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 13623.19 грн |
| UVA10CC-WP |
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Виробник: Chip Quik Inc.
Description: UVA BLOCKING 10CC SYRINGE 10PACK
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Part Status: Active
Description: UVA BLOCKING 10CC SYRINGE 10PACK
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1749.30 грн |
| UVA10CC-WP-QTY1 |
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Виробник: Chip Quik Inc.
Description: UVA BLOCKING 10CC SYRINGE (WITH
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Tip Type: Dispenser Needle, Tip
Part Status: Active
Description: UVA BLOCKING 10CC SYRINGE (WITH
Packaging: Bulk
Capacity: 10cc
Color: Black
Type: Syringe, Air Operated
Tip Type: Dispenser Needle, Tip
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 324.59 грн |
| 5+ | 297.96 грн |
| 10+ | 290.59 грн |
| 25+ | 258.70 грн |
| UVA5CC-WP |
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Виробник: Chip Quik Inc.
Description: UVA BLOCKING 5CC SYRINGE 10 PACK
Packaging: Bulk
Capacity: 5cc
Color: Black
Type: Syringe, Air Operated
Part Status: Active
Description: UVA BLOCKING 5CC SYRINGE 10 PACK
Packaging: Bulk
Capacity: 5cc
Color: Black
Type: Syringe, Air Operated
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1749.30 грн |
| 5+ | 1634.92 грн |
| 10+ | 1585.34 грн |
| UVA5CC-WP-QTY1 |
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Виробник: Chip Quik Inc.
Description: UVA BLOCKING 5CC SYRINGE (WITH A
Packaging: Bulk
Capacity: 5cc
Color: Black
Type: Syringe, Air Operated
Tip Type: Dispenser Needle, Tip
Part Status: Active
Description: UVA BLOCKING 5CC SYRINGE (WITH A
Packaging: Bulk
Capacity: 5cc
Color: Black
Type: Syringe, Air Operated
Tip Type: Dispenser Needle, Tip
Part Status: Active
на замовлення 55 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 324.59 грн |
| 5+ | 297.96 грн |
| 10+ | 290.59 грн |
| 25+ | 258.70 грн |
| 50+ | 237.73 грн |
| V8910 |
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Виробник: Chip Quik Inc.
Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Tube
Accessory Type: Vacuum Tool with Tips
Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Tube
Accessory Type: Vacuum Tool with Tips
на замовлення 282 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3564.14 грн |
| V9000K8-B |
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Виробник: Chip Quik Inc.
Description: REPLACEMENT CUPS FOR V8910
Packaging: Bag
For Use With/Related Products: V8910
Accessory Type: Vacuum Tips
Description: REPLACEMENT CUPS FOR V8910
Packaging: Bag
For Use With/Related Products: V8910
Accessory Type: Vacuum Tips
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 3076.08 грн |
| WS991 |
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Виробник: Chip Quik Inc.
Description: TACKY FLUX WATER-SOLUBLE 10CC SY
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACKY FLUX WATER-SOLUBLE 10CC SY
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 29 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 1351.26 грн |
| 5+ | 1121.59 грн |
| 10+ | 1052.00 грн |
| 25+ | 907.11 грн |
| WS991-10M |
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Виробник: Chip Quik Inc.
Description: WATER-SOLUBLE FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: WATER-SOLUBLE FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 71 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 800.02 грн |
| WS991-5M |
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Виробник: Chip Quik Inc.
Description: WATER-SOLUBLE TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: WATER-SOLUBLE TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 666.55 грн |
| WS991AX35T4 |
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Виробник: Chip Quik Inc.
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: THERMALLY STABLE SOLDER PASTE WS
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (34.869g)
Mesh Type: 4
Flux Type: Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.






















































