Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2416) > Сторінка 20 з 41

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IPC0206 Chip Quik Inc. Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
товар відсутній
IPC0206-S Chip Quik Inc. Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
товар відсутній
IPC0207 Chip Quik Inc. Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0207-S Chip Quik Inc. Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
товар відсутній
IPC0208 Chip Quik Inc. Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товар відсутній
IPC0208-S Chip Quik Inc. Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
товар відсутній
IPC0209 Chip Quik Inc. Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товар відсутній
IPC0210 Chip Quik Inc. Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
товар відсутній
IPC0212 Chip Quik Inc. Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0213 Chip Quik Inc. Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0215 Chip Quik Inc. Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0215-S Chip Quik Inc. Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
IPC0216 Chip Quik Inc. Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
товар відсутній
IPC0217 Chip Quik Inc. Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
товар відсутній
IPC0218 Chip Quik Inc. Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0219 Chip Quik Inc. Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+329.31 грн
5+ 308.77 грн
IPC0220 Chip Quik Inc. Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0221 Chip Quik Inc. Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0222 Chip Quik Inc. Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0222-S Chip Quik Inc. Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товар відсутній
IPC0224 Chip Quik Inc. Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
товар відсутній
IPC0225 Chip Quik Inc. Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
товар відсутній
IPC0226 Chip Quik Inc. Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
товар відсутній
IPC0227 Chip Quik Inc. Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
товар відсутній
IPC0228 Chip Quik Inc. Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
товар відсутній
IPC0229 IPC0229 Chip Quik Inc. Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
товар відсутній
IPC0229-S Chip Quik Inc. Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
товар відсутній
IPC0230 Chip Quik Inc. Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
товар відсутній
IPC0231 Chip Quik Inc. Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
товар відсутній
IPC0232 Chip Quik Inc. Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0232-S Chip Quik Inc. Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
товар відсутній
IPC0233 Chip Quik Inc. Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0233-S Chip Quik Inc. Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
товар відсутній
IPC0234 Chip Quik Inc. Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0234-S Chip Quik Inc. Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
товар відсутній
IPC0235 Chip Quik Inc. Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0235-S Chip Quik Inc. Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
товар відсутній
IPC0236 Chip Quik Inc. Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0236-S Chip Quik Inc. Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
товар відсутній
IPC0237 Chip Quik Inc. Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0237-S Chip Quik Inc. Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
товар відсутній
IPC0238 Chip Quik Inc. Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0238-S Chip Quik Inc. Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
товар відсутній
IPC0242 IPC0242 Chip Quik Inc. IPC0242.pdf Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
1+799.45 грн
IPC0242-S IPC0242-S Chip Quik Inc. IPC0242-S.pdf Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
1+763.34 грн
IPC0243 IPC0243 Chip Quik Inc. IPC0243.pdf Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
1+319.2 грн
IPC0243-S IPC0243-S Chip Quik Inc. IPC0243-S.pdf Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
1+792.23 грн
IPC0244 IPC0244 Chip Quik Inc. IPC0244.pdf Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
2+243.37 грн
Мінімальне замовлення: 2
IPC0244-S IPC0244-S Chip Quik Inc. IPC0244-S.pdf Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+837 грн
IPC0245 IPC0245 Chip Quik Inc. IPC0245.pdf Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
2+266.48 грн
Мінімальне замовлення: 2
IPC0245-S IPC0245-S Chip Quik Inc. IPC0245-S.pdf Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+772.73 грн
IPC0246 IPC0246 Chip Quik Inc. IPC0246.pdf Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
2+279.48 грн
Мінімальне замовлення: 2
IPC0246-S IPC0246-S Chip Quik Inc. IPC0246-S.pdf Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+772.73 грн
IPC0247 IPC0247 Chip Quik Inc. IPC0247.pdf Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
1+299.7 грн
IPC0248 IPC0248 Chip Quik Inc. IPC0248.pdf Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
1+608.07 грн
IPC0248-S IPC0248-S Chip Quik Inc. IPC0248-S.pdf Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+837 грн
IPC0249 IPC0249 Chip Quik Inc. IPC0249.pdf Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
1+1092.65 грн
IPC0249-S IPC0249-S Chip Quik Inc. IPC0249-S.pdf Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+837 грн
IPC0250 IPC0250 Chip Quik Inc. IPC0250.pdf Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
1+349.53 грн
IPC0250-S IPC0250-S Chip Quik Inc. IPC0250-S.pdf Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
1+772.73 грн
IPC0206
Виробник: Chip Quik Inc.
Description: DFN-20 TO DIP-24 SMT ADAPTER (0.
товар відсутній
IPC0206-S
Виробник: Chip Quik Inc.
Description: DFN-20 (0.5 MM PITCH 5 X 4 MM BO
товар відсутній
IPC0207
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 1.000" W (35.56mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0207-S
Виробник: Chip Quik Inc.
Description: QFN-24 (0.4 MM PITCH 3 X 3 MM BO
товар відсутній
IPC0208
Виробник: Chip Quik Inc.
Description: POWERQSOP-16 TO DIP-20 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товар відсутній
IPC0208-S
Виробник: Chip Quik Inc.
Description: POWERQSOP-16 (0.635 MM PITCH 4.9
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: PowerQSOP
Inner Dimension: 0.193" L x 0.154" W (4.90mm x 3.90mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.123" L x 0.087" W (3.12mm x 2.20mm)
Number of Positions: 16
товар відсутній
IPC0209
Виробник: Chip Quik Inc.
Description: POWERQSOP-28 TO DIP-32 SMT ADAPT
Packaging: Bulk
Size / Dimension: 1.600" L x 1.000" W (40.64mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товар відсутній
IPC0210
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
товар відсутній
IPC0212
Виробник: Chip Quik Inc.
Description: QFN-54 TO DIP-58 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.900" L x 1.000" W (73.66mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0213
Виробник: Chip Quik Inc.
Description: QFN-10 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0215
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0215-S
Виробник: Chip Quik Inc.
Description: QFN-20 (0.5 MM PITCH 4.5 X 2.5 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN
Inner Dimension: 0.177" L x 0.098" W (4.50mm x 2.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 20
товар відсутній
IPC0216
Виробник: Chip Quik Inc.
Description: LED-6 TO DIP-10 SMT ADAPTER (1.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.063" (1.60mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED
товар відсутній
IPC0217
Виробник: Chip Quik Inc.
Description: QFN-18 TO DIP-22 SMT ADAPTER (0.
товар відсутній
IPC0218
Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 1.000" W (30.48mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0219
Виробник: Chip Quik Inc.
Description: DFN-6/SON-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+329.31 грн
5+ 308.77 грн
IPC0220
Виробник: Chip Quik Inc.
Description: BGA-6 TO DIP-6 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0221
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0222
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 21
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0222-S
Виробник: Chip Quik Inc.
Description: QFN-12 (1.0 MM PITCH 4 X 4 MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: QFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товар відсутній
IPC0224
Виробник: Chip Quik Inc.
Description: LED-2 TO DIP-4 SMT ADAPTER (0.57
товар відсутній
IPC0225
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
товар відсутній
IPC0226
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.8
товар відсутній
IPC0227
Виробник: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.85
товар відсутній
IPC0228
Виробник: Chip Quik Inc.
Description: LED-4 TO DIP-4 SMT ADAPTER (0.8
товар відсутній
IPC0229
IPC0229
Виробник: Chip Quik Inc.
Description: LED-6/PLCC-6 TO DIP-6 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.043" (1.10mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LED, PLCC
Part Status: Active
товар відсутній
IPC0229-S
Виробник: Chip Quik Inc.
Description: LED-6/PLCC-6 (1.1 MM PITCH 3.3 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.043" (1.10mm)
Type: LED/PLCC
Inner Dimension: 0.134" L x 0.130" W (3.40mm x 3.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
товар відсутній
IPC0230
Виробник: Chip Quik Inc.
Description: LED-6/DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN, LED
товар відсутній
IPC0231
Виробник: Chip Quik Inc.
Description: LED-3 TO DIP-4 SMT ADAPTER (1.1
товар відсутній
IPC0232
Виробник: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.400" L x 1.000" W (86.36mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0232-S
Виробник: Chip Quik Inc.
Description: HTQFP-64 (0.8 MM PITCH 14 X 14 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 64
товар відсутній
IPC0233
Виробник: Chip Quik Inc.
Description: HTQFP-100 TO DIP-104 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 5.200" L x 1.000" W (132.08mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0233-S
Виробник: Chip Quik Inc.
Description: HTQFP-100 (0.5 MM PITCH 14 X 14
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.433" W (11.00mm x 11.00mm)
Number of Positions: 100
товар відсутній
IPC0234
Виробник: Chip Quik Inc.
Description: HTQFP-80 TO DIP-84 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 4.200" L x 1.000" W (106.68mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0234-S
Виробник: Chip Quik Inc.
Description: HTQFP-80 (0.5 MM PITCH 12 X 12 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.354" L x 0.354" W (9.00mm x 9.00mm)
Number of Positions: 80
товар відсутній
IPC0235
Виробник: Chip Quik Inc.
Description: HTQFP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 1.000" W (60.96mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0235-S
Виробник: Chip Quik Inc.
Description: HTQFP-44 (0.8 MM PITCH 10 X 10 M
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 44
товар відсутній
IPC0236
Виробник: Chip Quik Inc.
Description: HTQFP-52 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 1.000" W (71.12mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0236-S
Виробник: Chip Quik Inc.
Description: HTQFP-52 (0.65 MM PITCH 10 X 10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HTQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Number of Positions: 52
товар відсутній
IPC0237
Виробник: Chip Quik Inc.
Description: HTQFP-48 TO DIP-52 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.600" L x 1.000" W (66.04mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
Part Status: Active
товар відсутній
IPC0237-S
Виробник: Chip Quik Inc.
Description: HTQFP-48 (0.5 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 48
товар відсутній
IPC0238
Виробник: Chip Quik Inc.
Description: HTQFP-64 TO DIP-68 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 3.200" L x 1.000" W (81.28mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: HTQFP
товар відсутній
IPC0238-S
Виробник: Chip Quik Inc.
Description: HTQFP-64 (0.4 MM PITCH 7 X 7 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: HTQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Number of Positions: 64
товар відсутній
IPC0242 IPC0242.pdf
IPC0242
Виробник: Chip Quik Inc.
Description: MODULE-29 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+799.45 грн
IPC0242-S IPC0242-S.pdf
IPC0242-S
Виробник: Chip Quik Inc.
Description: MODULE-29 (1.016 MM PITCH, 21.72
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: Module
Inner Dimension: 0.855" L x 0.580" W (21.72mm x 14.73mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 29
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+763.34 грн
IPC0243 IPC0243.pdf
IPC0243
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER (0.8
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+319.2 грн
IPC0243-S IPC0243-S.pdf
IPC0243-S
Виробник: Chip Quik Inc.
Description: DFN-6 (0.8 MM PITCH, 2.45 X 2.45
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.094" L x 0.079" W (2.40mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+792.23 грн
IPC0244 IPC0244.pdf
IPC0244
Виробник: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.35
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.014" (0.35mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+243.37 грн
Мінімальне замовлення: 2
IPC0244-S IPC0244-S.pdf
IPC0244-S
Виробник: Chip Quik Inc.
Description: BGA-4 (0.35 MM PITCH, 0.64 X 0.6
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.014" (0.35mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+837 грн
IPC0245 IPC0245.pdf
IPC0245
Виробник: Chip Quik Inc.
Description: BGA-4 TO DIP-4 SMT ADAPTER (0.4
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+266.48 грн
Мінімальне замовлення: 2
IPC0245-S IPC0245-S.pdf
IPC0245-S
Виробник: Chip Quik Inc.
Description: BGA-4 (0.4 MM PITCH, 0.88 X 0.88
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: BGA
Inner Dimension: 0.033" L x 0.033" W (0.85mm x 0.85mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+772.73 грн
IPC0246 IPC0246.pdf
IPC0246
Виробник: Chip Quik Inc.
Description: MODULE-5 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+279.48 грн
Мінімальне замовлення: 2
IPC0246-S IPC0246-S.pdf
IPC0246-S
Виробник: Chip Quik Inc.
Description: MODULE-5 (0.822 MM PITCH, 3.5 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: Module
Inner Dimension: 0.138" L x 0.138" W (3.50mm x 3.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+772.73 грн
IPC0247 IPC0247.pdf
IPC0247
Виробник: Chip Quik Inc.
Description: MODULE-6 TO DIP-6 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.300" W (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.038" (0.97mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+299.7 грн
IPC0248 IPC0248.pdf
IPC0248
Виробник: Chip Quik Inc.
Description: PLCC-12 TO DIP-12 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PLCC
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+608.07 грн
IPC0248-S IPC0248-S.pdf
IPC0248-S
Виробник: Chip Quik Inc.
Description: PLCC-12 (1.27 MM PITCH, 5 X 5 MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 12
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+837 грн
IPC0249 IPC0249.pdf
IPC0249
Виробник: Chip Quik Inc.
Description: RAD-PAK-70 TO DIP-70 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 3.500" L x 1.000" W (88.90mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 70
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+1092.65 грн
IPC0249-S IPC0249-S.pdf
IPC0249-S
Виробник: Chip Quik Inc.
Description: RAD-PAK-70 (0.635 MM PITCH, 20.8
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Inner Dimension: 1.000" L x 0.819" W (25.40mm x 20.80mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 70
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+837 грн
IPC0250 IPC0250.pdf
IPC0250
Виробник: Chip Quik Inc.
Description: SMD-0.5 TO DIP-8 SMT ADAPTER (3.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.156" (3.96mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+349.53 грн
IPC0250-S IPC0250-S.pdf
IPC0250-S
Виробник: Chip Quik Inc.
Description: SMD-0.5 (3.81 MM PITCH, 10.28 X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.150" (3.81mm)
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+772.73 грн
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