Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2567) > Сторінка 28 з 43
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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PA0055 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MLP, MLF |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0055-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MLP/MLF Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0056 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MLP, MLF Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0056-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0057 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0057-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0058 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0058-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.197" L x 0.039" W (5.00mm x 1.00mm) Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0059 | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0059-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0060 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN THIN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0060C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0060-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0061 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 62 шт: термін постачання 21-31 дні (днів) |
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PA0061C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0061-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0062 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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PA0062-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0063 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0063C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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PA0063-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0064 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN THIN Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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PA0064C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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PA0064-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0065 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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PA0065C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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PA0065-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0066 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0066-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0067 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0067C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm) Number of Positions: 32 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0067-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0068 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0068-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0069 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN THIN |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0069-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 36 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0070 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0070-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0071 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0071C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm) Number of Positions: 40 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0071-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0072 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0072-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 44 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0073 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0073C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0073-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0074 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0074-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 56 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0075 | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0075-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0076 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0076-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0077 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0077-S | Chip Quik Inc. |
![]() |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0078 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0078-S | Chip Quik Inc. |
![]() |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0079 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0079-S | Chip Quik Inc. |
![]() |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0080 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0080-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TVSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
товару немає в наявності |
В кошику од. на суму грн. |
PA0055 |
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Виробник: Chip Quik Inc.
Description: MLP/MLF-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MLP, MLF
Description: MLP/MLF-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MLP, MLF
товару немає в наявності
В кошику
од. на суму грн.
PA0055-S |
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Виробник: Chip Quik Inc.
Description: MLP/MLF-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MLP/MLF
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: MLP/MLF-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MLP/MLF
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товару немає в наявності
В кошику
од. на суму грн.
PA0056 |
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Виробник: Chip Quik Inc.
Description: MLP/MLF-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MLP, MLF
Part Status: Active
Description: MLP/MLF-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MLP, MLF
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0056-S |
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Виробник: Chip Quik Inc.
Description: MLP/MLF-40 STENCIL
Description: MLP/MLF-40 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0057 |
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Виробник: Chip Quik Inc.
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
PA0057-S |
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Виробник: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.
PA0058 |
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Виробник: Chip Quik Inc.
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
PA0058-S |
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Виробник: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.197" L x 0.039" W (5.00mm x 1.00mm)
Number of Positions: 8
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.197" L x 0.039" W (5.00mm x 1.00mm)
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.
PA0059 |
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Виробник: Chip Quik Inc.
Description: QFN-14 TO DIP-14 SMT ADAPTER
Description: QFN-14 TO DIP-14 SMT ADAPTER
товару немає в наявності
В кошику
од. на суму грн.
PA0059-S |
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Виробник: Chip Quik Inc.
Description: QFN-14 STENCIL
Description: QFN-14 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0060 |
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Виробник: Chip Quik Inc.
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0060C |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16-THIN TO DIP-16 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 557.07 грн |
PA0060-S |
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Виробник: Chip Quik Inc.
Description: QFN-16-THIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: QFN-16-THIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 884.94 грн |
PA0061 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 62 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 335.04 грн |
PA0061C |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 557.07 грн |
PA0061-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
PA0062 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 342.20 грн |
PA0062-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Description: QFN-16 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0063 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 370.05 грн |
PA0063C |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-20 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 580.15 грн |
PA0063-S |
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Виробник: Chip Quik Inc.
Description: STENCIL QFN-20 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: STENCIL QFN-20 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 884.94 грн |
PA0064 |
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Виробник: Chip Quik Inc.
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 405.07 грн |
PA0064C |
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Виробник: Chip Quik Inc.
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-24-THIN TO DIP-24 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 615.16 грн |
PA0064-S |
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Виробник: Chip Quik Inc.
Description: QFN-24-THIN STENCIL
Description: QFN-24-THIN STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0065 |
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Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 517.28 грн |
PA0065C |
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Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-28 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 726.57 грн |
PA0065-S |
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Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: QFN-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товару немає в наявності
В кошику
од. на суму грн.
PA0066 |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
PA0066-S |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-28 STENCIL
Description: QFN-28 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0067 |
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Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 587.31 грн |
PA0067C |
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Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-32 TO DIP-32 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.600" L x 0.400" W (40.64mm x 10.16mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 796.61 грн |
PA0067-S |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Description: QFN-32 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0068 |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0068-S |
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Виробник: Chip Quik Inc.
Description: QFN-32 STENCIL
Description: QFN-32 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0069 |
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Виробник: Chip Quik Inc.
Description: QFN-36-THIN TO DIP-36 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
Description: QFN-36-THIN TO DIP-36 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN THIN
товару немає в наявності
В кошику
од. на суму грн.
PA0069-S |
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Виробник: Chip Quik Inc.
Description: QFN-36-THIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 36
Description: QFN-36-THIN STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.236" L x 0.236" W (6.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 36
товару немає в наявності
В кошику
од. на суму грн.
PA0070 |
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Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0070-S |
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Виробник: Chip Quik Inc.
Description: QFN-40 STENCIL
Description: QFN-40 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0071 |
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Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-40 TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 770.34 грн |
PA0071C |
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Виробник: Chip Quik Inc.
Description: QFN-40 TO DIP-40 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-40 TO DIP-40 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.000" L x 0.700" W (50.80mm x 17.78mm)
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 989.99 грн |
PA0071-S |
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Виробник: Chip Quik Inc.
Description: QFN-40 STENCIL
Description: QFN-40 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0072 |
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Виробник: Chip Quik Inc.
Description: QFN-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-44 TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0072-S |
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Виробник: Chip Quik Inc.
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
Description: QFN-44 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 44
товару немає в наявності
В кошику
од. на суму грн.
PA0073 |
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Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0073C |
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Виробник: Chip Quik Inc.
Description: QFN-48 TO DIP-48 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-48 TO DIP-48 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1091.06 грн |
PA0073-S |
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Виробник: Chip Quik Inc.
Description: QFN-48 STENCIL
Description: QFN-48 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0074 |
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Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0074-S |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 56
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.315" L x 0.315" W (8.00mm x 8.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 56
товару немає в наявності
В кошику
од. на суму грн.
PA0075 |
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Виробник: Chip Quik Inc.
Description: TVSOP-14 TO DIP-14 SMT ADAPTER
Description: TVSOP-14 TO DIP-14 SMT ADAPTER
товару немає в наявності
В кошику
од. на суму грн.
PA0075-S |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-14 STENCIL
Description: TVSOP-14 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0076 |
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Виробник: Chip Quik Inc.
Description: TVSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0076-S |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-16 STENCIL
Description: TVSOP-16 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0077 |
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Виробник: Chip Quik Inc.
Description: TVSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Description: TVSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
товару немає в наявності
В кошику
од. на суму грн.
PA0077-S |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-20 STENCIL
Description: TVSOP-20 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0078 |
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Виробник: Chip Quik Inc.
Description: TVSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0078-S |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-24 STENCIL
Description: TVSOP-24 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0079 |
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Виробник: Chip Quik Inc.
Description: TVSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0079-S |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-38 STENCIL
Description: TVSOP-38 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0080 |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0080-S |
![]() |
Виробник: Chip Quik Inc.
Description: TVSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TVSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товару немає в наявності
В кошику
од. на суму грн.