Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2568) > Сторінка 6 з 43
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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DIP300T600P28 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DIP600-SOIC-08N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-08W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-10N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-10W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Number of Positions: 10 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-12N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-12W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Number of Positions: 12 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-14N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-14W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Number of Positions: 14 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-16N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm) Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-16W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm) Number of Positions: 16 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-18N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm) Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-18W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm) Number of Positions: 18 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-20N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-20W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Number of Positions: 20 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-22N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm) Number of Positions: 22 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-22W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm) Number of Positions: 22 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-24N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm) Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-24W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm) Number of Positions: 24 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-26N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm) Number of Positions: 26 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-26W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm) Number of Positions: 26 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-28N | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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DIP600-SOIC-28W | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm) Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOIC |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P04 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P06 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 253 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P08 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P10 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P12 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P14 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P16 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P18 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 18 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DIP600T300P20 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P24 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P26 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 26 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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DIP600T300P28 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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DIP900T600P48 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: DIP to DIP Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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DR040D254P010 | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 10-PIN CONN Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.016" (0.40mm) Proto Board Type: Connector to DIP Package Accepted: 0.4mm Connector Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DR040D254P020 | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 20-PIN CONN Packaging: Bulk Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.016" (0.40mm) Proto Board Type: Connector to DIP Package Accepted: 0.4mm Connector |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
DR040D254P030 | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 30-PIN CONN Packaging: Bulk Size / Dimension: 1.500" L x 0.700" W (38.10mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.016" (0.40mm) Proto Board Type: Connector to DIP Package Accepted: 0.4mm Connector |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040D254P040 | Chip Quik Inc. | Description: DUAL ROW 0.4MM PITCH 40-PIN CONN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040D254P060 | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 60-PIN CONN Packaging: Bulk Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.016" (0.40mm) Proto Board Type: Connector to DIP Package Accepted: 0.4mm Connector Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040D254P080 | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 80-PIN CONN Packaging: Bulk Size / Dimension: 4.000" L x 1.200" W (101.60mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.016" (0.40mm) Proto Board Type: Connector to DIP Package Accepted: 0.4mm Connector |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040D254P100 | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 100-PIN CON Packaging: Bulk Size / Dimension: 5.000" L x 1.500" W (127.00mm x 38.10mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.016" (0.40mm) Proto Board Type: Connector to DIP Package Accepted: 0.4mm Connector Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P010-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 10-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Number of Positions: 10 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P030-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 30-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Number of Positions: 30 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P040-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 40-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 40 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P050-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 50-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Number of Positions: 50 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P060-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 60-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 60 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P070-S | Chip Quik Inc. | Description: DUAL ROW 0.4MM PITCH 70-PIN CONN |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P080-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 80-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Number of Positions: 80 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR040P100-S | Chip Quik Inc. |
Description: DUAL ROW 0.4MM PITCH 100-PIN CON Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Part Status: Active Number of Positions: 100 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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DR050D254P010 | Chip Quik Inc. |
Description: DUAL ROW 0.5MM PITCH 10-PIN CONN Packaging: Bulk Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Proto Board Type: Connector to DIP Package Accepted: 0.5mm Connector Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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DR050D254P020 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector Part Status: Active |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
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DR050D254P030 | Chip Quik Inc. |
Description: DUAL ROW 0.5MM PITCH 30-PIN CONN Packaging: Bulk Size / Dimension: 1.500" L x 0.700" W (38.10mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.020" (0.50mm) Proto Board Type: Connector to DIP Package Accepted: 0.5mm Connector |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
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DR050D254P040 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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DR050D254P060 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm) Material: FR4 Epoxy Glass Number of Positions: 60 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: 0.5mm Connector Part Status: Active |
на замовлення 73 шт: термін постачання 21-31 дні (днів) |
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DR050D254P080 | Chip Quik Inc. |
Description: DUAL ROW 0.5MM PITCH 80-PIN CONN Packaging: Bulk Size / Dimension: 4.000" L x 1.200" W (101.60mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 80 Pitch: 0.020" (0.50mm) Proto Board Type: Connector to DIP Package Accepted: 0.5mm Connector |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR050D254P100 | Chip Quik Inc. |
Description: DUAL ROW 0.5MM PITCH 100-PIN CON Packaging: Bulk Size / Dimension: 5.000" L x 1.500" W (127.00mm x 38.10mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.020" (0.50mm) Proto Board Type: Connector to DIP Package Accepted: 0.5mm Connector Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR050P010-S | Chip Quik Inc. |
Description: DUAL ROW 0.5MM PITCH 10-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Part Status: Active Number of Positions: 10 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||
DR050P030-S | Chip Quik Inc. |
Description: DUAL ROW 0.5MM PITCH 30-PIN CONN Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Number of Positions: 30 |
товару немає в наявності |
В кошику од. на суму грн. |
DIP300T600P28 |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-28 (0.3" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DIP600-SOIC-08N |
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Виробник: Chip Quik Inc.
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 769.55 грн |
DIP600-SOIC-08W |
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Виробник: Chip Quik Inc.
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-08 (DIP-8) (0.6" WIDTH, 0.1"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 629.49 грн |
5+ | 523.87 грн |
10+ | 494.52 грн |
DIP600-SOIC-10N |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 767.16 грн |
5+ | 638.66 грн |
10+ | 602.72 грн |
DIP600-SOIC-10W |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-10 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Number of Positions: 10
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 784.67 грн |
5+ | 652.76 грн |
10+ | 616.29 грн |
DIP600-SOIC-12N |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 801.38 грн |
5+ | 667.02 грн |
10+ | 629.77 грн |
DIP600-SOIC-12W |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-12 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 818.09 грн |
5+ | 681.12 грн |
10+ | 643.26 грн |
DIP600-SOIC-14N |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 834.80 грн |
5+ | 695.37 грн |
10+ | 656.75 грн |
DIP600-SOIC-14W |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-14 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Number of Positions: 14
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 851.52 грн |
5+ | 709.47 грн |
10+ | 670.16 грн |
DIP600-SOIC-16N |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 728.96 грн |
5+ | 607.40 грн |
10+ | 573.68 грн |
DIP600-SOIC-16W |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-16 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.800" W (17.78mm x 20.32mm)
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 708.27 грн |
5+ | 590.23 грн |
DIP600-SOIC-18N |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 721.00 грн |
5+ | 601.42 грн |
10+ | 568.16 грн |
DIP600-SOIC-18W |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-18 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 0.900" W (17.78mm x 22.86mm)
Number of Positions: 18
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 918.36 грн |
5+ | 765.72 грн |
10+ | 723.57 грн |
DIP600-SOIC-20N |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 748.06 грн |
5+ | 623.95 грн |
10+ | 589.54 грн |
DIP600-SOIC-20W |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-20 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Number of Positions: 20
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 951.79 грн |
5+ | 793.77 грн |
10+ | 750.24 грн |
DIP600-SOIC-22N |
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Виробник: Chip Quik Inc.
Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 774.32 грн |
5+ | 646.33 грн |
10+ | 610.77 грн |
DIP600-SOIC-22W |
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Виробник: Chip Quik Inc.
Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-22 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.100" W (17.78mm x 27.94mm)
Number of Positions: 22
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 984.42 грн |
5+ | 821.66 грн |
10+ | 776.68 грн |
DIP600-SOIC-24N |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1001.13 грн |
5+ | 835.77 грн |
10+ | 790.01 грн |
DIP600-SOIC-24W |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-24 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.200" W (17.78mm x 30.48mm)
Number of Positions: 24
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1017.84 грн |
5+ | 849.56 грн |
10+ | 803.20 грн |
DIP600-SOIC-26N |
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Виробник: Chip Quik Inc.
Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1033.76 грн |
5+ | 863.51 грн |
10+ | 816.38 грн |
DIP600-SOIC-26W |
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Виробник: Chip Quik Inc.
Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-26 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" x 1.300" (17.78mm x 33.02mm)
Number of Positions: 26
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1051.26 грн |
5+ | 877.30 грн |
10+ | 829.63 грн |
DIP600-SOIC-28N |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1067.18 грн |
5+ | 891.25 грн |
10+ | 842.82 грн |
DIP600-SOIC-28W |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Description: DIP-28 (0.6" WIDTH, 0.1" PITCH)
Packaging: Bulk
Size / Dimension: 0.700" L x 1.400" W (17.78mm x 35.56mm)
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 866.64 грн |
5+ | 724.19 грн |
10+ | 684.72 грн |
DIP600T300P04 |
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Виробник: Chip Quik Inc.
Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-4 (0.6" BODY) TO DIP-4 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.200" W (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
5+ | 69.24 грн |
DIP600T300P06 |
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Виробник: Chip Quik Inc.
Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-6 (0.6" BODY) TO DIP-6 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.300" W (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 253 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 93.91 грн |
DIP600T300P08 |
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Виробник: Chip Quik Inc.
Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-8 (0.6" BODY) TO DIP-8 (0.3"
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 128.13 грн |
DIP600T300P10 |
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Виробник: Chip Quik Inc.
Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-10 (0.6" BODY) TO DIP-10 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 149.61 грн |
DIP600T300P12 |
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Виробник: Chip Quik Inc.
Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-12 (0.6" BODY) TO DIP-12 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.600" W (17.78mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 174.28 грн |
DIP600T300P14 |
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Виробник: Chip Quik Inc.
Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-14 (0.6" BODY) TO DIP-14 (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.700" W (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 229.99 грн |
DIP600T300P16 |
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Виробник: Chip Quik Inc.
Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-16 (0.6" BODY) TO DIP-16 (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.700" W (20.32mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 244.31 грн |
DIP600T300P18 |
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Виробник: Chip Quik Inc.
Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-18 (0.6" BODY) TO DIP-18 (0.
Packaging: Bulk
Size / Dimension: 0.900" L x 0.700" W (22.86mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 18
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DIP600T300P20 |
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Виробник: Chip Quik Inc.
Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-20 (0.6" BODY) TO DIP-20 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 286.49 грн |
DIP600T300P24 |
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Виробник: Chip Quik Inc.
Description: DIP-24 (0.6" BODY) TO DIP-24 (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-24 (0.6" BODY) TO DIP-24 (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 369.26 грн |
DIP600T300P26 |
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Виробник: Chip Quik Inc.
Description: DIP-26 (0.6" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-26 (0.6" BODY) TO DIP-26 (0.
Packaging: Bulk
Size / Dimension: 1.300" L x 0.700" W (33.02mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 26
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 385.17 грн |
DIP600T300P28 |
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Виробник: Chip Quik Inc.
Description: DIP-28 (0.6" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-28 (0.6" BODY) TO DIP-28 (0.
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 405.07 грн |
DIP900T600P48 |
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Виробник: Chip Quik Inc.
Description: DIP-48 (0.9" BODY) TO DIP-48 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
Description: DIP-48 (0.9" BODY) TO DIP-48 (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: DIP to DIP
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 580.94 грн |
DR040D254P010 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 10-PIN CONN
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: DUAL ROW 0.4MM PITCH 10-PIN CONN
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DR040D254P020 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 20-PIN CONN
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Description: DUAL ROW 0.4MM PITCH 20-PIN CONN
Packaging: Bulk
Size / Dimension: 1.000" L x 0.700" W (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
товару немає в наявності
В кошику
од. на суму грн.
DR040D254P030 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 30-PIN CONN
Packaging: Bulk
Size / Dimension: 1.500" L x 0.700" W (38.10mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Description: DUAL ROW 0.4MM PITCH 30-PIN CONN
Packaging: Bulk
Size / Dimension: 1.500" L x 0.700" W (38.10mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
товару немає в наявності
В кошику
од. на суму грн.
DR040D254P040 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 40-PIN CONN
Description: DUAL ROW 0.4MM PITCH 40-PIN CONN
товару немає в наявності
В кошику
од. на суму грн.
DR040D254P060 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 60-PIN CONN
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: DUAL ROW 0.4MM PITCH 60-PIN CONN
Packaging: Bulk
Size / Dimension: 3.000" L x 1.000" W (76.20mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DR040D254P080 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 80-PIN CONN
Packaging: Bulk
Size / Dimension: 4.000" L x 1.200" W (101.60mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Description: DUAL ROW 0.4MM PITCH 80-PIN CONN
Packaging: Bulk
Size / Dimension: 4.000" L x 1.200" W (101.60mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
товару немає в наявності
В кошику
од. на суму грн.
DR040D254P100 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 100-PIN CON
Packaging: Bulk
Size / Dimension: 5.000" L x 1.500" W (127.00mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
Description: DUAL ROW 0.4MM PITCH 100-PIN CON
Packaging: Bulk
Size / Dimension: 5.000" L x 1.500" W (127.00mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.016" (0.40mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.4mm Connector
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DR040P010-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 10-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 10
Description: DUAL ROW 0.4MM PITCH 10-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 10
товару немає в наявності
В кошику
од. на суму грн.
DR040P030-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 30-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 30
Description: DUAL ROW 0.4MM PITCH 30-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 30
товару немає в наявності
В кошику
од. на суму грн.
DR040P040-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 40-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
Description: DUAL ROW 0.4MM PITCH 40-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 40
товару немає в наявності
В кошику
од. на суму грн.
DR040P050-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 50-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 50
Description: DUAL ROW 0.4MM PITCH 50-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 50
товару немає в наявності
В кошику
од. на суму грн.
DR040P060-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 60-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
Description: DUAL ROW 0.4MM PITCH 60-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 60
товару немає в наявності
В кошику
од. на суму грн.
DR040P070-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 70-PIN CONN
Description: DUAL ROW 0.4MM PITCH 70-PIN CONN
товару немає в наявності
В кошику
од. на суму грн.
DR040P080-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 80-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 80
Description: DUAL ROW 0.4MM PITCH 80-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Number of Positions: 80
товару немає в наявності
В кошику
од. на суму грн.
DR040P100-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.4MM PITCH 100-PIN CON
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 100
Description: DUAL ROW 0.4MM PITCH 100-PIN CON
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Part Status: Active
Number of Positions: 100
товару немає в наявності
В кошику
од. на суму грн.
DR050D254P010 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 10-PIN CONN
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
Description: DUAL ROW 0.5MM PITCH 10-PIN CONN
Packaging: Bulk
Size / Dimension: 0.700" L x 0.500" W (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DR050D254P020 |
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Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 20-PIN CONN
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
Description: DUAL ROW 0.5MM PITCH 20-PIN CONN
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
на замовлення 69 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 351.75 грн |
DR050D254P030 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 30-PIN CONN
Packaging: Bulk
Size / Dimension: 1.500" L x 0.700" W (38.10mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
Description: DUAL ROW 0.5MM PITCH 30-PIN CONN
Packaging: Bulk
Size / Dimension: 1.500" L x 0.700" W (38.10mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
товару немає в наявності
В кошику
од. на суму грн.
DR050D254P040 |
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Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 40-PIN CONN
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
Description: DUAL ROW 0.5MM PITCH 40-PIN CONN
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 506.13 грн |
DR050D254P060 |
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Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 60-PIN CONN
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
Description: DUAL ROW 0.5MM PITCH 60-PIN CONN
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 60
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
на замовлення 73 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 638.24 грн |
DR050D254P080 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 80-PIN CONN
Packaging: Bulk
Size / Dimension: 4.000" L x 1.200" W (101.60mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
Description: DUAL ROW 0.5MM PITCH 80-PIN CONN
Packaging: Bulk
Size / Dimension: 4.000" L x 1.200" W (101.60mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 80
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
товару немає в наявності
В кошику
од. на суму грн.
DR050D254P100 |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 100-PIN CON
Packaging: Bulk
Size / Dimension: 5.000" L x 1.500" W (127.00mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
Description: DUAL ROW 0.5MM PITCH 100-PIN CON
Packaging: Bulk
Size / Dimension: 5.000" L x 1.500" W (127.00mm x 38.10mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.020" (0.50mm)
Proto Board Type: Connector to DIP
Package Accepted: 0.5mm Connector
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
DR050P010-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 10-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Part Status: Active
Number of Positions: 10
Description: DUAL ROW 0.5MM PITCH 10-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Part Status: Active
Number of Positions: 10
товару немає в наявності
В кошику
од. на суму грн.
DR050P030-S |
Виробник: Chip Quik Inc.
Description: DUAL ROW 0.5MM PITCH 30-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 30
Description: DUAL ROW 0.5MM PITCH 30-PIN CONN
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Number of Positions: 30
товару немає в наявності
В кошику
од. на суму грн.