Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2671) > Сторінка 40 з 45
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||
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SMD2SW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 60/40 TIPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life: 60 Months |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SMD2SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CLPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SMD2SWLF.012 100G | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.012" (0.31mm) Wire Gauge: 28 AWG, 30 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 .3OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.3 oz (8.51g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPart Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 4 oz (113.40g) Melting Point: 441°F (227°C) Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.015" (0.38mm) Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 .4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.7 oz (19.85g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SMD2SWLF.020 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPForm: Spool, 2 oz (56.70g) Melting Point: 441°F (227°C) Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.020" (0.51mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 .7OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.7 oz (19.85g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPMelting Point: 441°F (227°C) Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.031" (0.79mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 4 oz (113.40g) |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPPPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX COREPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SMD2SWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX COREPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX COREPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX COREPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX COREPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0Process: Lead Free Form: Spool, 1 oz (28.35g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0Process: Lead Free Form: Spool, 2 oz (56.70g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD32 | Chip Quik Inc. |
Description: INDUSTRIAL PACK 32' SMDPackaging: Tube Accessory Type: Removal Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SMD32NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 32' SMDPackaging: Tube Accessory Type: Removal Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||
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SMD3SW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life: 60 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SILPackaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 60 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDERPackaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 1OZProcess: Lead Free Form: Spool, 1 oz (28.35g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi58Sn42 (58/42) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 2OZProcess: Lead Free Form: Spool, 2 oz (56.70g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi58Sn42 (58/42) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 4OZProcess: Lead Free Form: Spool, 4 oz (113.40g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi58Sn42 (58/42) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI58 .047" 8OZProcess: Lead Free Form: Spool, 8 oz (227g), 1/2 lb Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi58Sn42 (58/42) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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| SMD2SW.020 2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 701.99 грн |
| SMD2SW.020 4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1107.64 грн |
| SMD2SW.020 8OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1748.83 грн |
| SMD2SW.031 .7OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 294.04 грн |
| SMD2SW.031 1LB |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2556.27 грн |
| SMD2SW.031 1OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SW.031 2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 680.44 грн |
| SMD2SW.031 4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1073.00 грн |
| SMD2SW.031 8OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SWLF.012 100G |
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Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2848.00 грн |
| SMD2SWLF.015 .3OZ |
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Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 790.51 грн |
| SMD2SWLF.015 1LB |
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Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4304.33 грн |
| SMD2SWLF.015 1OZ |
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Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 818.22 грн |
| SMD2SWLF.015 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1124.58 грн |
| SMD2SWLF.015 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2061.34 грн |
| SMD2SWLF.015 8OZ |
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Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2596.30 грн |
| SMD2SWLF.020 .4OZ |
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Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 691.22 грн |
| SMD2SWLF.020 1LB |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4241.21 грн |
| SMD2SWLF.020 1OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SWLF.020 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Form: Spool, 2 oz (56.70g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Form: Spool, 2 oz (56.70g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1106.87 грн |
| SMD2SWLF.020 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1738.82 грн |
| SMD2SWLF.020 8OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2544.73 грн |
| SMD2SWLF.031 .7OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 592.69 грн |
| SMD2SWLF.031 1LB |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4155.77 грн |
| SMD2SWLF.031 1OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 785.89 грн |
| SMD2SWLF.031 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1075.31 грн |
| SMD2SWLF.031 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1845.81 грн |
| SMD2SWLF.031 8OZ |
![]() |
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 35 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2493.16 грн |
| SMD2SWLT.040 100G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SWLT.040 10G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1465.57 грн |
| SMD2SWLT.040 200G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 14028.33 грн |
| SMD2SWLT.040 20G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2516.25 грн |
| SMD2SWLT.040 50G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5397.35 грн |
| SMD2SWLT.047 1OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1152.29 грн |
| 5+ | 956.62 грн |
| SMD2SWLT.047 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1923.56 грн |
| 5+ | 1596.29 грн |
| 10+ | 1497.27 грн |
| SMD2SWLT.047 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3133.57 грн |
| 5+ | 2600.50 грн |
| SMD32 |
![]() |
Виробник: Chip Quik Inc.
Description: INDUSTRIAL PACK 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: INDUSTRIAL PACK 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
товару немає в наявності
В кошику
од. на суму грн.
| SMD32NL |
![]() |
Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
товару немає в наявності
В кошику
од. на суму грн.
| SMD3SW.015 100G |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1753.45 грн |
| SMD3SW.020 .4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 674.28 грн |
| SMD3SW.020 1LB |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6963.75 грн |
| SMD3SW.020 1OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 989.87 грн |
| SMD3SW.020 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1354.72 грн |
| SMD3SW.020 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2136.00 грн |
| SMD3SW.020 8OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3687.78 грн |
| SMD3SW.031 .7OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 572.68 грн |
| SMD3SW.031 1LB |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6886.01 грн |
| SMD3SW.031 1OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 968.32 грн |
| SMD3SW.031 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1324.71 грн |
| SMD3SW.031 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2089.82 грн |
| SMD3SW.031 8OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 60 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3627.74 грн |
| SMD3SWLT.040 100G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7861.25 грн |
| SMD3SWLT.040 10G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1273.13 грн |
| SMD3SWLT.040 200G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13591.13 грн |
| SMD3SWLT.040 20G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2197.58 грн |
| SMD3SWLT.040 50G |
![]() |
Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4716.91 грн |
| SMD3SWLT.047 1OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 937.53 грн |
| 5+ | 777.54 грн |
| 10+ | 729.36 грн |
| 25+ | 628.94 грн |
| SMD3SWLT.047 2OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1639.53 грн |
| 5+ | 1360.73 грн |
| SMD3SWLT.047 4OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2748.71 грн |
| SMD3SWLT.047 8OZ |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Process: Lead Free
Form: Spool, 8 oz (227g), 1/2 lb
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Process: Lead Free
Form: Spool, 8 oz (227g), 1/2 lb
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi58Sn42 (58/42)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4475.98 грн |













































