Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2693) > Сторінка 40 з 45
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||
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SMD291SNLT6 | Chip Quik Inc. |
 Description: SOLDER PASTE NO CLEAN LEAD-FREEPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 6 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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SMD291SNLT7 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN LEAD-FREE Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.35 oz (10g), 5cc Mesh Type: 7 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SMD291ST2CC6 | Chip Quik Inc. |
Description: TACK FLUX 6 PACK, 2CC TUBES Packaging: Bag Type: Flux - No Clean Form: Tube, 0.07 oz (2g), 2cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 94 шт: термін постачання 21-31 дні (днів) |
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SMD291ST8CC | Chip Quik Inc. |
Description: TACK FLUX IN 8CC SQUEEZE TUBE Packaging: Tube Type: Flux - No Clean, Tacky Solder Form: Tube, 0.28 oz (8g), 8cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 62 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 66 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 60/40 TI Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 60/40 TI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life: 60 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 50 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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SMD2SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn60Pb40 (60/40) Type: Wire Solder Melting Point: 361 ~ 370°F (183 ~ 188°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.012 100G | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.012" (0.31mm) Wire Gauge: 28 AWG, 30 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 .3OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/ Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.3 oz (8.51g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD2SWLF.015 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 4 oz (113.40g) Melting Point: 441°F (227°C) Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.015" (0.38mm) Packaging: Bulk |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.015 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 .4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/ Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.7 oz (19.85g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD2SWLF.020 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Form: Spool, 2 oz (56.70g) Melting Point: 441°F (227°C) Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.020" (0.51mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.020 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 .7OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE POCKET PACK 99.3/ Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Tube, 0.7 oz (19.85g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 1LB | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 1OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 2OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 4OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Melting Point: 441°F (227°C) Type: Wire Solder Composition: Sn99.3Cu0.7 (99.3/0.7) Diameter: 0.031" (0.79mm) Packaging: Bulk Part Status: Active Flux Type: No-Clean, Water Soluble Process: Lead Free Form: Spool, 4 oz (113.40g) |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLF.031 8OZ | Chip Quik Inc. |
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn99.3Cu0.7 (99.3/0.7) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD2SWLT.040 10G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 200G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 20G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 50G | Chip Quik Inc. |
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0 Process: Lead Free Form: Spool, 1 oz (28.35g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0 Process: Lead Free Form: Spool, 2 oz (56.70g) Melting Point: 280°F (138°C) Type: Wire Solder Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Diameter: 0.047" (1.19mm) Packaging: Bulk |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0 Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD32 | Chip Quik Inc. |
Description: INDUSTRIAL PACK 32' SMD Packaging: Tube Accessory Type: Removal Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD32NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 32' SMD Packaging: Tube Accessory Type: Removal Alloy |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD3SW.015 100G | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
|
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 |
SMD3SW.020 .4OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2 Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.020 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.020 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.020 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.020 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life: 60 Months |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.020 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.031 .7OZ | Chip Quik Inc. |
Description: SOLDER WIRE POCKET PACK 62/36/2 Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.031 1LB | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.031 1OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
 |
SMD3SW.031 2OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
|
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 |
SMD3SW.031 4OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
|
||||||
 |
SMD3SW.031 8OZ | Chip Quik Inc. |
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
|
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 |
SMD3SWLT.040 100G | Chip Quik Inc. |
Description: SN42/BI58 2.2% FLUX CORE SOLDER Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
|
| SMD291SNLT6 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 422 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 6
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3180.47 грн |
| SMD291SNLT7 |
|
Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO CLEAN LEAD-FREE
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.35 oz (10g), 5cc
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4843.50 грн |
| SMD291ST2CC6 |
|
Виробник: Chip Quik Inc.
Description: TACK FLUX 6 PACK, 2CC TUBES
Packaging: Bag
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 6 PACK, 2CC TUBES
Packaging: Bag
Type: Flux - No Clean
Form: Tube, 0.07 oz (2g), 2cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 94 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1026.93 грн |
| SMD291ST8CC |
|
Виробник: Chip Quik Inc.
Description: TACK FLUX IN 8CC SQUEEZE TUBE
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Tube, 0.28 oz (8g), 8cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX IN 8CC SQUEEZE TUBE
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Tube, 0.28 oz (8g), 8cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 62 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 895.60 грн |
| SMD2SW.015 100G |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 66 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1049.08 грн |
| SMD2SW.020 .4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 398.75 грн |
| SMD2SW.020 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3387.76 грн |
| SMD2SW.020 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 16 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 515.05 грн |
| SMD2SW.020 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 704.93 грн |
| SMD2SW.020 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 34 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1112.37 грн |
| SMD2SW.020 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1755.59 грн |
| SMD2SW.031 .7OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
Description: SOLDER WIRE POCKET PACK 60/40 TI
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 311.72 грн |
| SMD2SW.031 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 50 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3315.76 грн |
| SMD2SW.031 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 499.22 грн |
| SMD2SW.031 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 682.77 грн |
| SMD2SW.031 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1077.56 грн |
| SMD2SW.031 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 60/40 TIN/LEAD NO-CL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn60Pb40 (60/40)
Type: Wire Solder
Melting Point: 361 ~ 370°F (183 ~ 188°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1713.66 грн |
| SMD2SWLF.012 100G |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Wire Gauge: 28 AWG, 30 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2973.98 грн |
| SMD2SWLF.015 .3OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.3 oz (8.51g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SWLF.015 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5347.47 грн |
| SMD2SWLF.015 1OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 860.79 грн |
| SMD2SWLF.015 2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1174.88 грн |
| SMD2SWLF.015 4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.015" (0.38mm)
Packaging: Bulk
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2118.73 грн |
| SMD2SWLF.015 8OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2815.75 грн |
| SMD2SWLF.020 .4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SWLF.020 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5273.89 грн |
| SMD2SWLF.020 1OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 841.80 грн |
| SMD2SWLF.020 2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Form: Spool, 2 oz (56.70g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Form: Spool, 2 oz (56.70g)
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.020" (0.51mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1154.31 грн |
| SMD2SWLF.020 4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1815.72 грн |
| SMD2SWLF.020 8OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2772.23 грн |
| SMD2SWLF.031 .7OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE POCKET PACK 99.3/
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Tube, 0.7 oz (19.85g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 623.44 грн |
| SMD2SWLF.031 1LB |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5186.86 грн |
| SMD2SWLF.031 1OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 826.77 грн |
| SMD2SWLF.031 2OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1131.36 грн |
| SMD2SWLF.031 4OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Melting Point: 441°F (227°C)
Type: Wire Solder
Composition: Sn99.3Cu0.7 (99.3/0.7)
Diameter: 0.031" (0.79mm)
Packaging: Bulk
Part Status: Active
Flux Type: No-Clean, Water Soluble
Process: Lead Free
Form: Spool, 4 oz (113.40g)
на замовлення 9 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1897.21 грн |
| SMD2SWLF.031 8OZ |
|
Виробник: Chip Quik Inc.
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: LF SOLDER WIRE 99.3/0.7 TIN/COPP
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn99.3Cu0.7 (99.3/0.7)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2728.72 грн |
| SMD2SWLT.040 100G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
товару немає в наявності
В кошику
од. на суму грн.
| SMD2SWLT.040 10G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1506.37 грн |
| SMD2SWLT.040 200G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 16352.54 грн |
| SMD2SWLT.040 20G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2586.31 грн |
| SMD2SWLT.040 50G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5547.63 грн |
| SMD2SWLT.047 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 1 oz (28.35g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1184.37 грн |
| 5+ | 983.26 грн |
| SMD2SWLT.047 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Process: Lead Free
Form: Spool, 2 oz (56.70g)
Melting Point: 280°F (138°C)
Type: Wire Solder
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Diameter: 0.047" (1.19mm)
Packaging: Bulk
на замовлення 19 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1977.12 грн |
| 5+ | 1640.74 грн |
| 10+ | 1538.96 грн |
| SMD2SWLT.047 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3220.82 грн |
| 5+ | 2672.91 грн |
| SMD32 |
|
Виробник: Chip Quik Inc.
Description: INDUSTRIAL PACK 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: INDUSTRIAL PACK 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
товару немає в наявності
В кошику
од. на суму грн.
| SMD32NL |
|
Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 32' SMD
Packaging: Tube
Accessory Type: Removal Alloy
товару немає в наявності
В кошику
од. на суму грн.
| SMD3SW.015 100G |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 49 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1760.34 грн |
| SMD3SW.020 .4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 676.44 грн |
| SMD3SW.020 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6991.51 грн |
| SMD3SW.020 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 993.70 грн |
| SMD3SW.020 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1360.01 грн |
| SMD3SW.020 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
на замовлення 11 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2144.05 грн |
| SMD3SW.020 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3701.85 грн |
| SMD3SW.031 .7OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 575.18 грн |
| SMD3SW.031 1LB |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6913.18 грн |
| SMD3SW.031 1OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
| SMD3SW.031 2OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1329.94 грн |
| SMD3SW.031 4OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2097.37 грн |
| SMD3SW.031 8OZ |
|
Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 57 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3641.72 грн |
| SMD3SWLT.040 100G |
|
Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8080.15 грн |