Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2644) > Сторінка 45 з 45
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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WW100Ge.020 1LB | Chip Quik Inc. |
 Description: GERMANIUM DOPED SOLDER WIRE SN/CPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool Flux Type: No-Clean Shelf Life: 60 Months |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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WW100Ge.031 1LB | Chip Quik Inc. |
Description: GERMANIUM DOPED SOLDER WIRE SN/C Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006) Type: Wire Solder Melting Point: 441°F (227°C) Form: Spool, 1 lb (454 g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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WWSWLT.040 100g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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WWSWLT.040 10g | Chip Quik Inc. |
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Sn42Bi57Ag1 (42/57/1) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Water Soluble Shelf Life Start: Date of Manufacture Shelf Life: 60 Months |
товару немає в наявності |
В кошику од. на суму грн. |
| WW100Ge.020 1LB |
|
Виробник: Chip Quik Inc.
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn99.244Cu0.7Ni0.05Ge0.006 (99.244/0.7/0.05/0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool
Flux Type: No-Clean
Shelf Life: 60 Months
на замовлення 34 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7382.08 грн |
| 5+ | 6125.03 грн |
| 10+ | 5743.57 грн |
| 25+ | 4949.75 грн |
| WW100Ge.031 1LB |
Виробник: Chip Quik Inc.
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: GERMANIUM DOPED SOLDER WIRE SN/C
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn99.244Cu0.7 (Ni0.05/Ge0.006)
Type: Wire Solder
Melting Point: 441°F (227°C)
Form: Spool, 1 lb (454 g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 7028.86 грн |
| 5+ | 5832.80 грн |
| 10+ | 5469.63 грн |
| WWSWLT.040 100g |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
на замовлення 20 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 13555.11 грн |
| 5+ | 11244.97 грн |
| 10+ | 10542.92 грн |
| WWSWLT.040 10g |
|
Виробник: Chip Quik Inc.
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
Description: SN42/BI57/AG1 2.5% NO-CLEAN WATE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Sn42Bi57Ag1 (42/57/1)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Shelf Life Start: Date of Manufacture
Shelf Life: 60 Months
товару немає в наявності
В кошику
од. на суму грн.