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MCF5407CAI162 MCF5407CAI162 NXP USA Inc. MCF5407.pdf Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 162MHz
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
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P1014NSN5FFB P1014NSN5FFB NXP USA Inc. QP1010FS.pdf Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
1+3736.66 грн
10+2953.05 грн
84+2633.76 грн
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TEA19162CT/1J TEA19162CT/1J NXP USA Inc. TEA19162T.pdf Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
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TEA19162CT/1J TEA19162CT/1J NXP USA Inc. TEA19162T.pdf Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
на замовлення 2488 шт:
термін постачання 21-31 дні (днів)
5+76.74 грн
10+53.56 грн
25+48.42 грн
100+40.13 грн
250+37.60 грн
500+36.07 грн
1000+34.25 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
TEA19162T/3J TEA19162T/3J NXP USA Inc. TEA19162T.pdf Description: PFC CONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
на замовлення 2434 шт:
термін постачання 21-31 дні (днів)
4+93.36 грн
10+65.44 грн
25+59.30 грн
100+49.29 грн
250+46.26 грн
500+44.44 грн
1000+43.06 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
P3T2030AUKAZ P3T2030AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030AUKAZ P3T2030AUKAZ NXP USA Inc. P3T1035XUK_P3T2030XUK.pdf Description: P3T2030AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3495 шт:
термін постачання 21-31 дні (днів)
7+49.05 грн
8+41.14 грн
10+39.01 грн
25+34.23 грн
50+32.59 грн
100+31.09 грн
500+27.61 грн
1000+26.51 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
BZT52H-B22,115 BZT52H-B22,115 NXP USA Inc. PHGLS21818-1.pdf?t.download=true&u=5oefqw Description: NOW NEXPERIA BZT52H-B22 - ZENER
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-123F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TA)
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-123F
Grade: Automotive
Power - Max: 375 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
Qualification: AEC-Q101
на замовлення 324000 шт:
термін постачання 21-31 дні (днів)
13172+1.48 грн
Мінімальне замовлення: 13172
В кошику  од. на суму  грн.
MIMX8MM5DVTLZCA MIMX8MM5DVTLZCA NXP USA Inc. IMX8MMCEC.pdf Description: MIMX8MM5DVTLZCA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Speed: 1.8GHz, 400MHz
RAM Size: 288kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 486-LFBGA (14x14)
Architecture: MPU
на замовлення 152 шт:
термін постачання 21-31 дні (днів)
1+2627.45 грн
10+2058.78 грн
25+1941.07 грн
152+1671.91 грн
В кошику  од. на суму  грн.
UJA1131AHW/5F0/0Y NXP USA Inc. UJA113X_SER.pdf Description: UJA1131AHW/5F0/0Y
Packaging: Bulk
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MPC8377EVRAJFA MPC8377EVRAJFA NXP USA Inc. MPC8377E.pdf Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+6622.82 грн
10+5330.05 грн
27+5049.41 грн
В кошику  од. на суму  грн.
LPC4330FET180Y LPC4330FET180Y NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+520.14 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
LPC4330FET180Y LPC4330FET180Y NXP USA Inc. LPC4350_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Cut Tape (CT)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1+850.50 грн
10+642.48 грн
25+598.21 грн
100+515.73 грн
250+493.97 грн
500+480.85 грн
В кошику  од. на суму  грн.
MC33FS4500LAE MC33FS4500LAE NXP USA Inc. FS6500-FS4500SDS-ASILB.pdf Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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74LVU04PW,118 74LVU04PW,118 NXP USA Inc. 74LVU04.pdf Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2.4V
Input Logic Level - Low: 0.2V ~ 0.5V
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
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MC9RS08KB4CFK MC9RS08KB4CFK NXP USA Inc. MC9RS08KB12.pdf Description: IC MCU 8BIT 4KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC56F84585VLK MC56F84585VLK NXP USA Inc. MC56F844XX.pdf Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 10x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
DigiKey Programmable: Not Verified
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LX2082RN82029B NXP USA Inc. Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
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FS32K142HFT0VLFR FS32K142HFT0VLFR NXP USA Inc. S32K1xx.pdf Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
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FS32K142HFT0VLFT FS32K142HFT0VLFT NXP USA Inc. S32K1xx.pdf Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
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MSC8251SAG1000B MSC8251SAG1000B NXP USA Inc. MSC8251FS.pdf Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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MIMXRT1052DVL6BR MIMXRT1052DVL6BR NXP USA Inc. IMXRT1050CEC.pdf Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 380 шт:
термін постачання 21-31 дні (днів)
1+822.02 грн
10+620.99 грн
25+578.34 грн
100+498.82 грн
250+495.06 грн
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MIMXRT1052CVL5BR MIMXRT1052CVL5BR NXP USA Inc. IMXRT1050IEC.pdf Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 1814 шт:
термін постачання 21-31 дні (днів)
1+771.38 грн
10+581.30 грн
25+541.01 грн
100+466.16 грн
250+461.44 грн
В кошику  од. на суму  грн.
NCF3340EHN/00320Y NXP USA Inc. Description: NFC
Packaging: Tape & Reel (TR)
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MC33FS6520LAE MC33FS6520LAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+633.72 грн
10+474.64 грн
25+440.72 грн
100+378.55 грн
250+361.85 грн
В кошику  од. на суму  грн.
MIMXRT106LCVL5B NXP USA Inc. Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
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T2080NSE8MQB T2080NSE8MQB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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T2080NXE8PTB T2080NXE8PTB NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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T2080NSE8T1B NXP USA Inc. T2080FS.pdf Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MC33FS6500LAE MC33FS6500LAE NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 247 шт:
термін постачання 21-31 дні (днів)
1+567.26 грн
10+422.98 грн
25+392.14 грн
100+336.22 грн
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SPC5748GSK1MMJ6 SPC5748GSK1MMJ6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 221 шт:
термін постачання 21-31 дні (днів)
1+2825.24 грн
10+2231.49 грн
25+2109.35 грн
100+1915.87 грн
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MPC8313ECVRADDC MPC8313ECVRADDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDC MPC8313EVRAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313ECVRAGDC MPC8313ECVRAGDC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313EVRAFFB MPC8313EVRAFFB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFB MPC8313EZQAFFB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRADDB MPC8313ECVRADDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRADDB MPC8313EVRADDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDB MPC8313EVRAGDB NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAFFC MPC8313ECZQAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFC MPC8313EZQAFFC NXP USA Inc. MPC8313E_Hrdw_Spec.pdf Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MCIMX6L7DVN10AC MCIMX6L7DVN10AC NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
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MCIMX6X2CVN08AB MCIMX6X2CVN08AB NXP USA Inc. IMX6SRSFS.pdf Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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A3T21H455W23SR6 NXP USA Inc. A3T21H455W23S.pdf Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 87W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 400 mA
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MC9S08AC16MFDE MC9S08AC16MFDE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 934 шт:
термін постачання 21-31 дні (днів)
52+398.38 грн
Мінімальне замовлення: 52
В кошику  од. на суму  грн.
MC9S08AC16MFDE MC9S08AC16MFDE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MC9S12XB128MAA MC9S12XB128MAA NXP USA Inc. MC9S12XDP512RMV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
14+1476.14 грн
Мінімальне замовлення: 14
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SPC5200CBV400B SPC5200CBV400B NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.1 (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 272-PBGA (27x27)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 272-BBGA
Packaging: Tray
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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SPC5200CBV400BR2 SPC5200CBV400BR2 NXP USA Inc. MPC5200BDS.pdf Description: IC MPU MPC52XX 400MHZ 272BGA
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.1 (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 272-PBGA (27x27)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 272-BBGA
Packaging: Tape & Reel (TR)
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MRF8S9220HSR3 MRF8S9220HSR3 NXP USA Inc. Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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CLF1G0035-100PU CLF1G0035-100PU NXP USA Inc. PHGLS25880-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET GAN HEMT 50V LDMOST
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 150 V
Supplier Device Package: LDMOST
Technology: GaN HEMT
Gain: 14dB
Power - Output: 100W
Frequency: 3GHz
Mounting Type: Chassis Mount
Package / Case: SOT-1228A
Packaging: Bulk
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
1+20281.46 грн
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UJA1168ATK/XF/0Z UJA1168ATK/XF/0Z NXP USA Inc. UJA1168A.pdf Description: IC TRANSCEIVER 1/1 14HVSON
Qualification: AEC-Q100
Grade: Automotive
Receiver Hysteresis: 800 mV
Supplier Device Package: 14-HVSON (3x4.5)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 5995 шт:
термін постачання 21-31 дні (днів)
2+307.76 грн
10+224.44 грн
25+206.49 грн
100+175.24 грн
250+166.40 грн
500+161.06 грн
1000+154.11 грн
2500+149.55 грн
Мінімальне замовлення: 2
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T1014NXE7PQA T1014NXE7PQA NXP USA Inc. T1024FS.pdf Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA
Packaging: Tray
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MKL13Z32VLK4 MKL13Z32VLK4 NXP USA Inc. KL13P80M48SF3.pdf Description: IC MCU 32BIT 32KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, PWM, WDT
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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AFT26H250-24SR6 NXP USA Inc. FSCLS11504-1.pdf?t.download=true&u=5oefqw Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 700 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-1230-4LS2L
Technology: LDMOS (Dual)
Gain: 14.1dB
Power - Output: 53dBm
Configuration: 2 N-Channel
Frequency: 2.5GHz ~ 2.69GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Bulk
на замовлення 1121 шт:
термін постачання 21-31 дні (днів)
2+10435.83 грн
Мінімальне замовлення: 2
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MPC8271VRMIBA MPC8271VRMIBA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC82XX 266MHZ 516FPBGA
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-FPBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 280 шт:
термін постачання 21-31 дні (днів)
4+4913.12 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
MPC8271CVRMIBA MPC8271CVRMIBA NXP USA Inc. FSCLS05947-1.pdf?t.download=true&u=5oefqw Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
4+5402.65 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
LS1023ASN7QQB LS1023ASN7QQB NXP USA Inc. LS1043AFS.pdf Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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FS32K148HNT0VLUR FS32K148HNT0VLUR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 2MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 156
Supplier Device Package: 176-LQFP (24x24)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
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MC35FS6516CAER2 MC35FS6516CAER2 NXP USA Inc. FS6500-FS4500-ASILD.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MCF5407CAI162 MCF5407.pdf
MCF5407CAI162
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 208FQFP
Packaging: Tray
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Speed: 162MHz
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: DMA, WDT
Supplier Device Package: 208-FQFP (28x28)
Number of I/O: 16
DigiKey Programmable: Not Verified
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P1014NSN5FFB QP1010FS.pdf
P1014NSN5FFB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 800MHZ 425TEPBGA
Packaging: Tray
Package / Case: 425-FBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 425-TEPBGA I (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, SPI
на замовлення 84 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3736.66 грн
10+2953.05 грн
84+2633.76 грн
В кошику  од. на суму  грн.
TEA19162CT/1J TEA19162T.pdf
TEA19162CT/1J
Виробник: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
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TEA19162CT/1J TEA19162T.pdf
TEA19162CT/1J
Виробник: NXP USA Inc.
Description: IC PFC CTRLR DCM 134KHZ 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
на замовлення 2488 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+76.74 грн
10+53.56 грн
25+48.42 грн
100+40.13 грн
250+37.60 грн
500+36.07 грн
1000+34.25 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
TEA19162T/3J TEA19162T.pdf
TEA19162T/3J
Виробник: NXP USA Inc.
Description: PFC CONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 70 ~ 276 VAC
Frequency - Switching: 134kHz
Mode: Discontinuous Conduction (DCM)
Supplier Device Package: 8-SO
Current - Startup: 800 µA
на замовлення 2434 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+93.36 грн
10+65.44 грн
25+59.30 грн
100+49.29 грн
250+46.26 грн
500+44.44 грн
1000+43.06 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
P3T2030AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030AUKAZ
Виробник: NXP USA Inc.
Description: P3T2030AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Tape & Reel (TR)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
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P3T2030AUKAZ P3T1035XUK_P3T2030XUK.pdf
P3T2030AUKAZ
Виробник: NXP USA Inc.
Description: P3T2030AUKAZ
Features: Standby Mode, Shutdown Mode, One-Shot, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 4-UFBGA, WLCSP
Output Type: I2C, I3C
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.4V ~ 1.98V
Sensor Type: Digital
Resolution: 12 b
Supplier Device Package: 4-WLCSP (0.83x0.78)
Test Condition: 0°C ~ 85°C (-40°C ~ 125°C)
Accuracy - Highest (Lowest): ±2%
Sensing Temperature - Local: -40°C ~ 125°C
на замовлення 3495 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
7+49.05 грн
8+41.14 грн
10+39.01 грн
25+34.23 грн
50+32.59 грн
100+31.09 грн
500+27.61 грн
1000+26.51 грн
Мінімальне замовлення: 7
В кошику  од. на суму  грн.
BZT52H-B22,115 PHGLS21818-1.pdf?t.download=true&u=5oefqw
BZT52H-B22,115
Виробник: NXP USA Inc.
Description: NOW NEXPERIA BZT52H-B22 - ZENER
Tolerance: ±2%
Packaging: Bulk
Package / Case: SOD-123F
Mounting Type: Surface Mount
Operating Temperature: -65°C ~ 150°C (TA)
Voltage - Zener (Nom) (Vz): 22 V
Impedance (Max) (Zzt): 25 Ohms
Supplier Device Package: SOD-123F
Grade: Automotive
Power - Max: 375 mW
Voltage - Forward (Vf) (Max) @ If: 900 mV @ 10 mA
Current - Reverse Leakage @ Vr: 50 nA @ 15.4 V
Qualification: AEC-Q101
на замовлення 324000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
13172+1.48 грн
Мінімальне замовлення: 13172
В кошику  од. на суму  грн.
MIMX8MM5DVTLZCA IMX8MMCEC.pdf
MIMX8MM5DVTLZCA
Виробник: NXP USA Inc.
Description: MIMX8MM5DVTLZCA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Speed: 1.8GHz, 400MHz
RAM Size: 288kB
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Connectivity: AC'97, I2C, I2S, MMC/SD, PCIe, SAI, SDHC, SPDIF, SPI, TDM, UART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 486-LFBGA (14x14)
Architecture: MPU
на замовлення 152 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2627.45 грн
10+2058.78 грн
25+1941.07 грн
152+1671.91 грн
В кошику  од. на суму  грн.
UJA1131AHW/5F0/0Y UJA113X_SER.pdf
Виробник: NXP USA Inc.
Description: UJA1131AHW/5F0/0Y
Packaging: Bulk
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MPC8377EVRAJFA MPC8377E.pdf
MPC8377EVRAJFA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6622.82 грн
10+5330.05 грн
27+5049.41 грн
В кошику  од. на суму  грн.
LPC4330FET180Y LPC4350_30_20_10.pdf
LPC4330FET180Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+520.14 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
LPC4330FET180Y LPC4350_30_20_10.pdf
LPC4330FET180Y
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 180TFBGA
Packaging: Cut Tape (CT)
Package / Case: 180-TFBGA
Mounting Type: Surface Mount
Speed: 204MHz
RAM Size: 264K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x10b; D/A 1x10b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 180-TFBGA (12x12)
Number of I/O: 118
DigiKey Programmable: Not Verified
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+850.50 грн
10+642.48 грн
25+598.21 грн
100+515.73 грн
250+493.97 грн
500+480.85 грн
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MC33FS4500LAE FS6500-FS4500SDS-ASILB.pdf
MC33FS4500LAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP LINEAR 0.5A V
Supplier Device Package: 48-HLQFP (7x7)
Applications: System Basis Chip
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Packaging: Tray
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74LVU04PW,118 74LVU04.pdf
74LVU04PW,118
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5.5V
Current - Output High, Low: 12mA, 12mA
Number of Inputs: 1
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1V ~ 2.4V
Input Logic Level - Low: 0.2V ~ 0.5V
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 40 µA
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MC9RS08KB4CFK MC9RS08KB12.pdf
MC9RS08KB4CFK
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 126 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: RS08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 24-QFN-EP (4x4)
Number of I/O: 18
DigiKey Programmable: Not Verified
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MC56F84585VLK MC56F844XX.pdf
MC56F84585VLK
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 80FQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 56800EX
Data Converters: A/D 16x12b, 10x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-FQFP (12x12)
Number of I/O: 68
DigiKey Programmable: Not Verified
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LX2082RN82029B
Виробник: NXP USA Inc.
Description: IC MPU QORIQ LX 2GHZ 1150FBGA
Packaging: Tray
Package / Case: 1150-FBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 5°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1150-FBGA (23x23)
USB: USB 3.0 (1)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
SATA: SATA 6Gbps (4)
Additional Interfaces: CANbus, I2C, PCIe, SPI, UART
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FS32K142HFT0VLFR S32K1xx.pdf
FS32K142HFT0VLFR
Виробник: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
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FS32K142HFT0VLFT S32K1xx.pdf
FS32K142HFT0VLFT
Виробник: NXP USA Inc.
Description: S32K142, 256K FLASH, 32K RAM
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 89
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MSC8251SAG1000B MSC8251FS.pdf
MSC8251SAG1000B
Виробник: NXP USA Inc.
Description: IC DSP 1X 1GHZ SC3850 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Type: SC3850 Single Core
Operating Temperature: 0°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (96KB)
On-Chip RAM: 576kB
Voltage - I/O: 2.50V
Voltage - Core: 1.00V
Clock Rate: 1GHz
Supplier Device Package: 783-FCPBGA (29x29)
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MIMXRT1052DVL6BR IMXRT1050CEC.pdf
MIMXRT1052DVL6BR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 600MHz
RAM Size: 512K x 8
Operating Temperature: 0°C ~ 95°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 380 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+822.02 грн
10+620.99 грн
25+578.34 грн
100+498.82 грн
250+495.06 грн
В кошику  од. на суму  грн.
MIMXRT1052CVL5BR IMXRT1050IEC.pdf
MIMXRT1052CVL5BR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 196LFBGA
Packaging: Cut Tape (CT)
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: External Program Memory
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-LFBGA (10x10)
Number of I/O: 127
DigiKey Programmable: Not Verified
на замовлення 1814 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+771.38 грн
10+581.30 грн
25+541.01 грн
100+466.16 грн
250+461.44 грн
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NCF3340EHN/00320Y
Виробник: NXP USA Inc.
Description: NFC
Packaging: Tape & Reel (TR)
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MC33FS6520LAE FS6500-FS4500-ASILD.pdf
MC33FS6520LAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 2.2A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+633.72 грн
10+474.64 грн
25+440.72 грн
100+378.55 грн
250+361.85 грн
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MIMXRT106LCVL5B
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128MB ROM 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 1M x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 20x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 1.26V, 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 196-MAPBGA (10x10)
Number of I/O: 127
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T2080NSE8MQB T2080FS.pdf
T2080NSE8MQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.2GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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T2080NXE8PTB T2080FS.pdf
T2080NXE8PTB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.533GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.533GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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T2080NSE8T1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T2 1.8GHZ 896FCPBGA
Packaging: Tray
Package / Case: 896-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.8GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e6500
Supplier Device Package: 896-FCPBGA (25x25)
Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR3, DDR3L
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
SATA: SATA 3Gbps (2)
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MC33FS6500LAE FS6500-FS4500-ASILD.pdf
MC33FS6500LAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP DCDC 0.8A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
на замовлення 247 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+567.26 грн
10+422.98 грн
25+392.14 грн
100+336.22 грн
В кошику  од. на суму  грн.
SPC5748GSK1MMJ6 MPC5748G.pdf
SPC5748GSK1MMJ6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 6MB FLSH 256MAPPBGA
Packaging: Tray
Package / Case: 256-LBGA
Mounting Type: Surface Mount
Speed: 80MHz/160MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4, e200z4
Data Converters: A/D 80x10b, 64x12b
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 256-MAPPBGA (17x17)
Number of I/O: 178
DigiKey Programmable: Not Verified
на замовлення 221 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2825.24 грн
10+2231.49 грн
25+2109.35 грн
100+1915.87 грн
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MPC8313ECVRADDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRADDC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAGDC
Виробник: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313ECVRAGDC MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRAGDC
Виробник: NXP USA Inc.
Description: IC MPU POWERQUICC II PRO 516PBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 516-TEPBGA (27x27)
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MPC8313EVRAFFB MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAFFB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFB MPC8313E_Hrdw_Spec.pdf
MPC8313EZQAFFB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECVRADDB MPC8313E_Hrdw_Spec.pdf
MPC8313ECVRADDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRADDB MPC8313E_Hrdw_Spec.pdf
MPC8313EVRADDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 267MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 267MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EVRAGDB MPC8313E_Hrdw_Spec.pdf
MPC8313EVRAGDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313ECZQAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313ECZQAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MPC8313EZQAFFC MPC8313E_Hrdw_Spec.pdf
MPC8313EZQAFFC
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI
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MCIMX6L7DVN10AC IMX6SLCEC.pdf
MCIMX6L7DVN10AC
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Supplier Device Package: 432-MAPBGA (13x13)
Voltage - I/O: 1.2V, 1.8V, 3.0V
Core Processor: ARM® Cortex®-A9
Operating Temperature: 0°C ~ 95°C (TJ)
Speed: 1.0GHz
Mounting Type: Surface Mount
Package / Case: 432-TFBGA
Packaging: Tray
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (3)
Ethernet: 10/100Mbps (1)
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers: Keypad, LCD
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MCIMX6X2CVN08AB IMX6SRSFS.pdf
MCIMX6X2CVN08AB
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SX 800MHZ 400MAPBGA
Graphics Acceleration: Yes
RAM Controllers: LPDDR2, LVDDR3, DDR3
Additional Interfaces: AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Security Features: A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers: Keypad, LCD
Co-Processors/DSP: Multimedia; NEON™ MPE
Number of Cores/Bus Width: 2 Core, 32-Bit
USB: USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 400-MAPBGA (17x17)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.15V
Core Processor: ARM® Cortex®-A9, ARM® Cortex®-M4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz, 800MHz
Mounting Type: Surface Mount
Package / Case: 400-LFBGA
Packaging: Tray
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A3T21H455W23SR6 A3T21H455W23S.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 30V ACP1230S-4
Packaging: Tape & Reel (TR)
Package / Case: ACP-1230S-4L2S
Current Rating (Amps): 10µA
Mounting Type: Chassis Mount
Frequency: 2.11GHz ~ 2.2GHz
Configuration: Dual
Power - Output: 87W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: ACP-1230S-4L2S
Voltage - Rated: 65 V
Voltage - Test: 30 V
Current - Test: 400 mA
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MC9S08AC16MFDE MC9S08AC60AD.pdf
MC9S08AC16MFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Bulk
на замовлення 934 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
52+398.38 грн
Мінімальне замовлення: 52
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MC9S08AC16MFDE MC9S08AC60AD.pdf
MC9S08AC16MFDE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MC9S12XB128MAA MC9S12XDP512RMV2.pdf
MC9S12XB128MAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Bulk
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HCS12X
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
14+1476.14 грн
Мінімальне замовлення: 14
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SPC5200CBV400B MPC5200BDS.pdf
SPC5200CBV400B
Виробник: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.1 (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 272-PBGA (27x27)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 272-BBGA
Packaging: Tray
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
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SPC5200CBV400BR2 MPC5200BDS.pdf
SPC5200CBV400BR2
Виробник: NXP USA Inc.
Description: IC MPU MPC52XX 400MHZ 272BGA
Additional Interfaces: AC97, CAN, J1850, I2C, I2S, IrDA, PCI, PSC, SPI, UART
Graphics Acceleration: No
RAM Controllers: DDR, SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 1.1 (2)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 272-PBGA (27x27)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 85°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 272-BBGA
Packaging: Tape & Reel (TR)
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MRF8S9220HSR3
MRF8S9220HSR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Current - Test: 1.6 A
Voltage - Test: 28 V
Voltage - Rated: 70 V
Supplier Device Package: NI-780S
Technology: LDMOS
Gain: 19.4dB
Power - Output: 65W
Frequency: 960MHz
Mounting Type: Chassis Mount
Package / Case: NI-780S
Packaging: Tape & Reel (TR)
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CLF1G0035-100PU PHGLS25880-1.pdf?t.download=true&u=5oefqw
CLF1G0035-100PU
Виробник: NXP USA Inc.
Description: RF MOSFET GAN HEMT 50V LDMOST
Current - Test: 100 mA
Voltage - Test: 50 V
Voltage - Rated: 150 V
Supplier Device Package: LDMOST
Technology: GaN HEMT
Gain: 14dB
Power - Output: 100W
Frequency: 3GHz
Mounting Type: Chassis Mount
Package / Case: SOT-1228A
Packaging: Bulk
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+20281.46 грн
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UJA1168ATK/XF/0Z UJA1168A.pdf
UJA1168ATK/XF/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 14HVSON
Qualification: AEC-Q100
Grade: Automotive
Receiver Hysteresis: 800 mV
Supplier Device Package: 14-HVSON (3x4.5)
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 3V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 5995 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+307.76 грн
10+224.44 грн
25+206.49 грн
100+175.24 грн
250+166.40 грн
500+161.06 грн
1000+154.11 грн
2500+149.55 грн
Мінімальне замовлення: 2
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T1014NXE7PQA T1024FS.pdf
T1014NXE7PQA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ T1 1.4GHZ 780FBGA
Additional Interfaces: I2C, MMC/SD, PCIe, SPI, UART
SATA: SATA 3Gbps (2)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Graphics Acceleration: No
RAM Controllers: DDR3L, DDR4
Number of Cores/Bus Width: 1 Core, 64-Bit
USB: USB 2.0 + PHY (2)
Ethernet: GbE (8)
Supplier Device Package: 780-FBGA (23x23)
Core Processor: PowerPC e5500
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 1.4GHz
Mounting Type: Surface Mount
Package / Case: 780-FBGA
Packaging: Tray
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MKL13Z32VLK4 KL13P80M48SF3.pdf
MKL13Z32VLK4
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 80FQFP
DigiKey Programmable: Not Verified
Number of I/O: 70
Supplier Device Package: 80-FQFP (12x12)
Peripherals: DMA, PWM, WDT
Connectivity: FlexIO, I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 20x16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
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AFT26H250-24SR6 FSCLS11504-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI1230
Current - Test: 700 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-1230-4LS2L
Technology: LDMOS (Dual)
Gain: 14.1dB
Power - Output: 53dBm
Configuration: 2 N-Channel
Frequency: 2.5GHz ~ 2.69GHz
Mounting Type: Chassis Mount
Package / Case: NI-1230-4LS2L
Packaging: Bulk
на замовлення 1121 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+10435.83 грн
Мінімальне замовлення: 2
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MPC8271VRMIBA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8271VRMIBA
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 516FPBGA
Packaging: Bulk
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-FPBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
на замовлення 280 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+4913.12 грн
Мінімальне замовлення: 4
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MPC8271CVRMIBA FSCLS05947-1.pdf?t.download=true&u=5oefqw
MPC8271CVRMIBA
Виробник: NXP USA Inc.
Description: POWERQUICC 32 BIT POWER ARCHITEC
Packaging: Bulk
на замовлення 29 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+5402.65 грн
Мінімальне замовлення: 4
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LS1023ASN7QQB LS1043AFS.pdf
LS1023ASN7QQB
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.6GHZ 621FCPBGA
Packaging: Tray
Package / Case: 621-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.6GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 621-FCPBGA (21x21)
Ethernet: 1GbE (7) or 10GbE (1) & 1GbE (5)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 2 Core, 64-Bit
RAM Controllers: DDR3L, DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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FS32K148HNT0VLUR S32K1xx.pdf
FS32K148HNT0VLUR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 156
Supplier Device Package: 176-LQFP (24x24)
Peripherals: I2S, POR, PWM, WDT
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
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MC35FS6516CAER2 FS6500-FS4500-ASILD.pdf
MC35FS6516CAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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