Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36849) > Сторінка 565 з 615
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||||||||||||||
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| AFSC5G37E38-EVB | NXP USA Inc. |
Description: AFSC5G37E38 3600-3800 MHZ REFEREContents: Board(s) Type: Power Amplifier Frequency: 3.6GHz ~ 3.8GHz Packaging: Bulk Utilized IC / Part: AFSC5G37E38 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| AFSC5G26E38-EVB | NXP USA Inc. |
Description: AFSC5G26E38 2496-2690 MHZ REFEREUtilized IC / Part: AFSC5G26E38 Contents: Board(s) Type: Power Amplifier Frequency: 2.49GHz ~ 2.69GHz Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| LFDAS32KHH1A | NXP USA Inc. |
Description: NXP S32K144 100 PIN LQFP TO 100- Packaging: Bulk Module/Board Type: Socket Adapter Utilized IC / Part: S32K |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| MX95MBDES10001 | NXP USA Inc. |
Description: OX03C10 SERIALIZER/DESERIALIZERPackaging: Bulk Function: Camera, Deserializer, Serializer Type: Multiple Contents: Board(s) Utilized IC / Part: OX03C10 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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S32G234MABK0VUCR | NXP USA Inc. |
Description: S32G234M ARM CORTEX-M7, HSE, LLCGrade: Automotive Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No Co-Processors/DSP: Multimedia; NEON Number of Cores/Bus Width: 3 Core, 32/64-Bit Ethernet: GbE (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tape & Reel (TR) Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||
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S32G234MABK0VUCT | NXP USA Inc. |
Description: S32G234M ARM CORTEX-M7, HSE, LLCQualification: AEC-Q100 Grade: Automotive Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Graphics Acceleration: No Co-Processors/DSP: Multimedia; NEON Number of Cores/Bus Width: 3 Core, 32/64-Bit Ethernet: GbE (4) Supplier Device Package: 525-FCPBGA (19x19) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Core Processor: ARM® Cortex®-M7 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 525-FBGA, FCBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | ||||||||||||||
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LPC2368FET100,518 | NXP USA Inc. |
Description: IC MCU 16/32BIT 512KB 100TFBGAPackaging: Tape & Reel (TR) Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 512KB (512K x 8) RAM Size: 58K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 6x10b; D/A 1x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 70 DigiKey Programmable: Not Verified |
на замовлення 935 шт: термін постачання 21-31 дні (днів) |
Мінімальне замовлення: 935 шт В кошику од. на суму грн. | ||||||||||||||
| SAF4000EL/102Z223K | NXP USA Inc. |
Description: SAF4000EL Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 630 шт В кошику од. на суму грн. | |||||||||||||||
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AFT05MP075GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 12.5V TO270-4Current - Test: 400 mA Voltage - Test: 12.5 V Voltage - Rated: 40 V Supplier Device Package: TO-270 WB-4 Gull Technology: LDMOS Gain: 18.5dB Power - Output: 70W Configuration: Dual Frequency: 520MHz Mounting Type: Surface Mount Package / Case: TO-270BB Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||
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AFT05MP075GNR1 | NXP USA Inc. |
Description: RF MOSFET LDMOS 12.5V TO270-4Power - Output: 70W Configuration: Dual Frequency: 520MHz Mounting Type: Surface Mount Package / Case: TO-270BB Packaging: Cut Tape (CT) Current - Test: 400 mA Voltage - Test: 12.5 V Voltage - Rated: 40 V Supplier Device Package: TO-270 WB-4 Gull Technology: LDMOS Gain: 18.5dB |
на замовлення 425 шт: термін постачання 21-31 дні (днів) |
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NXQ1TXH5/101J | NXP USA Inc. |
Description: NXQ1TXH5 - ONE-CHIP 5 V QI WIRELDigiKey Programmable: Not Verified Packaging: Bulk |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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MC34PF1550A3EPR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC: 3 BUCK REGSSupplier Device Package: 40-HVQFN (5x5) Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices Voltage - Supply: 3.8V ~ 7V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 40-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | ||||||||||||||
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PCA9958HN/Q900Y | NXP USA Inc. |
Description: PCA9958HN/Q900YQualification: AEC-Q100 Grade: Automotive Voltage - Supply (Max): 5.5V Voltage - Supply (Min): 2.7V Dimming: PWM, SPI Supplier Device Package: 40-HVQFN (6x6) Topology: Constant Current Internal Switch(s): No Current - Output / Channel: 63mA Applications: General Purpose Operating Temperature: -40°C ~ 125°C (TA) Type: Linear Frequency: 31.25kHz Number of Outputs: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Cut Tape (CT) |
на замовлення 3984 шт: термін постачання 21-31 дні (днів) |
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MCIMX6G3DVK05AA | NXP USA Inc. |
Description: IC MPU I.MX6UL 528MHZ 272MAPBGAPackaging: Tray Package / Case: 272-LFBGA Mounting Type: Surface Mount Speed: 528MHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A7 Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 272-MAPBGA (9x9) Ethernet: 10/100Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART |
товару немає в наявності |
Мінімальне замовлення: 260 шт В кошику од. на суму грн. | ||||||||||||||
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MC12311CHN | NXP USA Inc. |
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA DigiKey Programmable: Not Verified Serial Interfaces: SPI, UART RF Family/Standard: General ISM < 1GHz Modulation: FSK, GFSK, GMSK, MSK, OOK GPIO: 34 Supplier Device Package: 60-VFLGA (8x8) Current - Transmitting: 16mA ~ 95mA Data Rate (Max): 300kbps Current - Receiving: 16mA Power - Output: 17dBm Voltage - Supply: 1.8V ~ 3.6V Operating Temperature: -40°C ~ 85°C Type: TxRx + MCU Memory Size: 32kB Flash, 2kB RAM Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz Mounting Type: Surface Mount Sensitivity: -120dBm Package / Case: 60-VFLGA Exposed Pad Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 1300 шт В кошику од. на суму грн. | ||||||||||||||
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BAP1321-03,115 | NXP USA Inc. |
Description: RF DIODE PIN 60V 500MW SOD-323Power Dissipation (Max): 500 mW Current - Max: 100 mA Supplier Device Package: SOD-323 Voltage - Peak Reverse (Max): 60V Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz Operating Temperature: -65°C ~ 150°C (TJ) Diode Type: PIN - Single Package / Case: SC-76, SOD-323 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC908QT2ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.5KB FLASH 8SOPackaging: Tube Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 1.5KB (1.5K x 8) RAM Size: 128 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 6x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Peripherals: LVD, POR, PWM Supplier Device Package: 8-SO Number of I/O: 5 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MCZ33972EWR2 | NXP USA Inc. |
Description: IC INTERFACE SPECIALIZED 32SOICSupplier Device Package: 32-SOIC Applications: Switch Monitoring Voltage - Supply: 8V ~ 26V Interface: SPI Serial Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
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PTN3393BSY | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 40HVQFNPackaging: Bulk Package / Case: 40-VFQFN Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 3.3V Applications: DisplayPort Supplier Device Package: 40-HVQFN (6x6) |
на замовлення 118 шт: термін постачання 21-31 дні (днів) |
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| SAF4001EL/101Q305Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4001EL/101Q3050 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
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NX3DV3899GU,115 | NXP USA Inc. |
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFNPackaging: Cut Tape (CT) Package / Case: 16-XFQFN Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) On-State Resistance (Max): 3.3Ohm -3db Bandwidth: 200MHz Supplier Device Package: 16-XQFN (1.8x2.6) Voltage - Supply, Single (V+): 1.4V ~ 4.3V Charge Injection: 4pC Crosstalk: -90dB @ 1MHz Switch Circuit: DPDT Multiplexer/Demultiplexer Circuit: 2:2 Channel-to-Channel Matching (ΔRon): 700mOhm Switch Time (Ton, Toff) (Max): 40ns, 20ns Channel Capacitance (CS(off), CD(off)): 8pF Current - Leakage (IS(off)) (Max): 5nA Number of Circuits: 2 |
на замовлення 20000 шт: термін постачання 21-31 дні (днів) |
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MKL26Z256VMC4R | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGADigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 121-MAPBGA (8x8) Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D - 16bit; D/A - 12bit Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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MKL26Z256VMC4 | NXP USA Inc. |
Description: IC MCU 32B 256KB FLASH 121MAPBGAOscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 32K x 8 Program Memory Size: 256KB (256K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 121-LFBGA Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 80 Supplier Device Package: 121-MAPBGA (8x8) Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D - 16bit; D/A - 12bit Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH |
товару немає в наявності |
Мінімальне замовлення: 1740 шт В кошику од. на суму грн. | ||||||||||||||
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FS32K148UAT0VLLR | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 100LQFPPackaging: Tape & Reel (TR) Number of I/O: 156 Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 32x12b SAR; D/A 1x8b Core Processor: ARM® Cortex®-M4F EEPROM Size: 4K x 8 Program Memory Type: FLASH Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 112MHz Mounting Type: Surface Mount Package / Case: 100-LQFP |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
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N74F373D,602 | NXP USA Inc. |
Description: IC D-TYPE TRANSP 8:8 20-SOVoltage - Supply: 4.5V ~ 5.5V Operating Temperature: 0°C ~ 70°C Logic Type: D-Type Transparent Latch Circuit: 8:8 Mounting Type: Surface Mount Output Type: Tri-State Package / Case: 20-SOIC (0.295", 7.50mm Width) Packaging: Tube Supplier Device Package: 20-SO Delay Time - Propagation: 2ns Current - Output High, Low: 3mA, 24mA Independent Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC33SA0528ACR2 | NXP USA Inc. |
Description: IC TRANSCEIVER FULL 2/2 32LQFPPackaging: Tape & Reel (TR) Package / Case: 32-LQFP Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5V Number of Drivers/Receivers: 2/2 Data Rate: 125kbps Protocol: DSI Supplier Device Package: 32-LQFP (7x7) Receiver Hysteresis: 350 mV Duplex: Full |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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MC68360AI33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 240FQFPPackaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: SCC, SMC, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8536BVJANGA | NXP USA Inc. |
Description: IC MPU MPC85XX 800MHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 800MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC8536AVTATHA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
на замовлення 157 шт: термін постачання 21-31 дні (днів) |
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MPC8536AVTATHA | NXP USA Inc. |
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGAPackaging: Tray Package / Case: 783-BBGA, FCBGA Mounting Type: Surface Mount Speed: 1.25GHz Operating Temperature: 0°C ~ 90°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 783-FCPBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (3) Number of Cores/Bus Width: 1 Core, 32-Bit RAM Controllers: DDR2, DDR3 Graphics Acceleration: No SATA: SATA 3Gbps (2) Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MC35FS6517CAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOPackaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 2000 шт В кошику од. на суму грн. | ||||||||||||||
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MC35FS6517CAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCOPackaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | ||||||||||||||
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MIMXRT1189XVM8C | NXP USA Inc. |
Description: ICPackaging: Tray Package / Case: 289-LFBGA Mounting Type: Surface Mount Speed: 240MHz, 800MHz Program Memory Size: 160KB (160K x 8) RAM Size: 768K x 8 Operating Temperature: -40°C ~ 125°C (TJ) Oscillator Type: Internal Program Memory Type: ROM Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F Data Converters: A/D 30x16b SAR; D/A 1x12b Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT Supplier Device Package: 289-LFBGA (14x14) Number of I/O: 173 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| MFS2613AMDAAAD | NXP USA Inc. |
Description: IC Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 250 шт В кошику од. на суму грн. | |||||||||||||||
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MCIMX513DJM8C | NXP USA Inc. |
Description: IC MPU I.MX51 800MHZ 529BGAAdditional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Display & Interface Controllers: Keypad, LCD Graphics Acceleration: No RAM Controllers: LPDDR, DDR2 Co-Processors/DSP: Multimedia; NEON™ SIMD Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (3), USB 2.0 + PHY (1) Ethernet: 10/100Mbps (1) Supplier Device Package: 529-BGA (19x19) Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V Core Processor: ARM® Cortex®-A8 Operating Temperature: -20°C ~ 85°C (TC) Speed: 800MHz Mounting Type: Surface Mount Package / Case: 529-LFBGA Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 420 шт В кошику од. на суму грн. | ||||||||||||||
| RDW8801-SD-S0 | NXP USA Inc. |
Description: RDW8801-SD-S0 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
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88W8987-A2-NYEE/AZ | NXP USA Inc. |
Description: IC RF TXRX BLE 68HVQFNPackaging: Cut Tape (CT) Package / Case: 68-VFQFN Exposed Pad Sensitivity: -99dBm Mounting Type: Surface Mount, Wettable Flank Frequency: 2.4GHz, 5GHz Type: TxRx Only Operating Temperature: -30°C ~ 85°C Voltage - Supply: 1.1V, 1.8V, 2.2V Power - Output: 22dBm Protocol: 802.11a/b/g/-c, Bluetooth v5.2 Current - Receiving: 38mA ~ 82mA Data Rate (Max): 433Mbps Current - Transmitting: 79mA ~ 145mA Supplier Device Package: 68-HVQFN (8x8) GPIO: 21 Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK RF Family/Standard: Bluetooth, WiFi Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART |
на замовлення 458 шт: термін постачання 21-31 дні (днів) |
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LPC4078FBD144,551 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFPPackaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 4032 x 8 Core Processor: ARM® Cortex®-M4 Data Converters: A/D 8x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) DigiKey Programmable: Not Verified |
на замовлення 171 шт: термін постачання 21-31 дні (днів) |
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| SAF4000EL/101Q534Y | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5340 Packaging: Tape & Reel (TR) |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | |||||||||||||||
| SAF4000EL/101Q534K | NXP USA Inc. |
Description: AUDIO DSPS SAF4000EL/101Q5340 Packaging: Tray |
товару немає в наявності |
Мінімальне замовлення: 630 шт В кошику од. на суму грн. | |||||||||||||||
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LPC1759FBD80Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 80LQFPPackaging: Cut Tape (CT) Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 512KB (512K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M3 Data Converters: A/D 6x12b; D/A 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 80-LQFP (12x12) Number of I/O: 52 DigiKey Programmable: Not Verified |
на замовлення 40 шт: термін постачання 21-31 дні (днів) |
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SPC5604BF2CLQ6R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 144LQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 64MHz Program Memory Size: 512KB (512K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 64K x 8 Core Processor: e200z0h Data Converters: A/D 36x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Number of I/O: 123 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 500 шт В кошику од. на суму грн. | ||||||||||||||
|
MC33285D | NXP USA Inc. |
Description: IC GATE DRVR HIGH-SIDE 8SOICPackaging: Tube Package / Case: 8-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 7V ~ 40V Input Type: Non-Inverting Supplier Device Package: 8-SOIC Channel Type: Synchronous Driven Configuration: High-Side Number of Drivers: 2 Gate Type: MOSFET (N-Channel) Logic Voltage - VIL, VIH: 0.7V, 1.7V DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 98 шт В кошику од. на суму грн. | ||||||||||||||
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MPC8347ECZQADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGAPackaging: Tray Package / Case: 620-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 2.5V, 3.3V Supplier Device Package: 620-HBGA (29x29) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 + PHY (2) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, I2C, PCI, SPI |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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NAFE73388B40BSK | NXP USA Inc. |
Description: UNIVERSAL 25 V 8-INPUT LOW POWERNumber of Channels: 8 Supplier Device Package: 64-HVQFN (9x9) Voltage - Supply, Digital: 3V ~ 3.6V Voltage - Supply, Analog: 3V ~ 3.6V Number of Bits: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 64-VFQFN Exposed Pad Packaging: Tray Power (Watts): 160 mW |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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NAFE73388B40BSE | NXP USA Inc. |
Description: UNIVERSAL 25 V 8-INPUT LOW POWERPower (Watts): 160 mW Number of Channels: 8 Supplier Device Package: 64-HVQFN (9x9) Voltage - Supply, Digital: 3V ~ 3.6V Voltage - Supply, Analog: 3V ~ 3.6V Number of Bits: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 64-VFQFN Exposed Pad Packaging: Tray |
на замовлення 260 шт: термін постачання 21-31 дні (днів) |
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MPC862PVR66B | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGAPackaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
товару немає в наявності |
Мінімальне замовлення: 44 шт В кошику од. на суму грн. | ||||||||||||||
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MPC8358ECVRAGDDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 668BGAPackaging: Tray Package / Case: 668-BBGA Exposed Pad Mounting Type: Surface Mount Speed: 400MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e300 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 668-PBGA-PGE (29x29) Ethernet: 10/100/1000Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 36 шт В кошику од. на суму грн. | ||||||||||||||
|
MC9S08DV48ACLC | NXP USA Inc. |
Description: IC MCU 8BIT 48KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 48KB (48K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 10x12b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 32-LQFP (7x7) Number of I/O: 25 DigiKey Programmable: Not Verified |
товару немає в наявності |
Мінімальне замовлення: 1250 шт В кошику од. на суму грн. | ||||||||||||||
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LPC11U22FBD48/30QL | NXP USA Inc. |
Description: IC MCU 32BIT 16KB FLASH 48LQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 16KB (16K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: ARM® Cortex®-M0 Data Converters: A/D 8x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Supplier Device Package: 48-LQFP (7x7) Number of I/O: 40 DigiKey Programmable: Not Verified |
на замовлення 242 шт: термін постачання 21-31 дні (днів) |
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MC56F81768LVLH | NXP USA Inc. |
Description: MC56F81768LVLHPackaging: Bulk Package / Case: 64-LQFP Mounting Type: Surface Mount Interface: DMA, I2C, LINbus, SCI, QSPI Type: Digital Signal Controllers Operating Temperature: -40°C ~ 105°C (TA) Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 20kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 64-LQFP (10x10) |
товару немає в наявності |
Мінімальне замовлення: 160 шт В кошику од. на суму грн. | ||||||||||||||
| C9KEAZN8AMTGR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 2500 шт В кошику од. на суму грн. | |||||||||||||||
| C9KEAZN8AVTG | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | |||||||||||||||
| C9KEAZN8AMFKR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 5000 шт В кошику од. на суму грн. | |||||||||||||||
| C9KEAZN8AMFK | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 2450 шт В кошику од. на суму грн. | |||||||||||||||
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C9KEAZN8AMTG | NXP USA Inc. |
Description: C9KEAZN8AMTG Packaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 8KB (8K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 12x12b SAR Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PMC, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 22 |
товару немає в наявності |
Мінімальне замовлення: 96 шт В кошику од. на суму грн. | ||||||||||||||
| C9KEAZ128AVLHR | NXP USA Inc. |
Description: IC MCU Packaging: Bulk |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | |||||||||||||||
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MCZ33742EGR2 | NXP USA Inc. |
Description: IC SYSTEM BASIS CHIP CAN 28-SOICPackaging: Tape & Reel (TR) Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C Voltage - Supply: 5.5V ~ 18V Current - Supply: 42mA Supplier Device Package: 28-SOIC Grade: Automotive |
товару немає в наявності |
Мінімальне замовлення: 1000 шт В кошику од. на суму грн. | ||||||||||||||
| MIMX9351DVVXMABR | NXP USA Inc. |
Description: ICPackaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: 0°C ~ 95°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. | |||||||||||||||
| MIMX9331XVVXMABR | NXP USA Inc. |
Description: ICPackaging: Tape & Reel (TR) Package / Case: 306-LFBGA Mounting Type: Surface Mount Speed: 250MHz, 1.7GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33 Voltage - I/O: 1.8V Supplier Device Package: 306-LFBGA (11x11) Ethernet: GbE (2) USB: USB 2.0 (2) Number of Cores/Bus Width: 2 Core, 64-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART |
товару немає в наявності |
Мінімальне замовлення: 1500 шт В кошику од. на суму грн. |
| AFSC5G37E38-EVB |
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Виробник: NXP USA Inc.
Description: AFSC5G37E38 3600-3800 MHZ REFERE
Contents: Board(s)
Type: Power Amplifier
Frequency: 3.6GHz ~ 3.8GHz
Packaging: Bulk
Utilized IC / Part: AFSC5G37E38
Description: AFSC5G37E38 3600-3800 MHZ REFERE
Contents: Board(s)
Type: Power Amplifier
Frequency: 3.6GHz ~ 3.8GHz
Packaging: Bulk
Utilized IC / Part: AFSC5G37E38
товару немає в наявності
В кошику
од. на суму грн.
| AFSC5G26E38-EVB |
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Виробник: NXP USA Inc.
Description: AFSC5G26E38 2496-2690 MHZ REFERE
Utilized IC / Part: AFSC5G26E38
Contents: Board(s)
Type: Power Amplifier
Frequency: 2.49GHz ~ 2.69GHz
Packaging: Bulk
Description: AFSC5G26E38 2496-2690 MHZ REFERE
Utilized IC / Part: AFSC5G26E38
Contents: Board(s)
Type: Power Amplifier
Frequency: 2.49GHz ~ 2.69GHz
Packaging: Bulk
товару немає в наявності
В кошику
од. на суму грн.
| LFDAS32KHH1A |
Виробник: NXP USA Inc.
Description: NXP S32K144 100 PIN LQFP TO 100-
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: S32K
Description: NXP S32K144 100 PIN LQFP TO 100-
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: S32K
товару немає в наявності
В кошику
од. на суму грн.
| MX95MBDES10001 |
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Виробник: NXP USA Inc.
Description: OX03C10 SERIALIZER/DESERIALIZER
Packaging: Bulk
Function: Camera, Deserializer, Serializer
Type: Multiple
Contents: Board(s)
Utilized IC / Part: OX03C10
Description: OX03C10 SERIALIZER/DESERIALIZER
Packaging: Bulk
Function: Camera, Deserializer, Serializer
Type: Multiple
Contents: Board(s)
Utilized IC / Part: OX03C10
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 47565.50 грн |
| S32G234MABK0VUCR |
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Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE, LLC
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Description: S32G234M ARM CORTEX-M7, HSE, LLC
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| S32G234MABK0VUCT |
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Виробник: NXP USA Inc.
Description: S32G234M ARM CORTEX-M7, HSE, LLC
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
Description: S32G234M ARM CORTEX-M7, HSE, LLC
Qualification: AEC-Q100
Grade: Automotive
Additional Interfaces: DMA, FlexRay, GPIO, I2C, LINbus, MMC/SD, PCIe, SPI, UART
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Graphics Acceleration: No
Co-Processors/DSP: Multimedia; NEON
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Ethernet: GbE (4)
Supplier Device Package: 525-FCPBGA (19x19)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Core Processor: ARM® Cortex®-M7
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 525-FBGA, FCBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| LPC2368FET100,518 |
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Виробник: NXP USA Inc.
Description: IC MCU 16/32BIT 512KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
Description: IC MCU 16/32BIT 512KB 100TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 58K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 6x10b; D/A 1x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 70
DigiKey Programmable: Not Verified
на замовлення 935 шт:
термін постачання 21-31 дні (днів)
| AFT05MP075GNR1 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
Description: RF MOSFET LDMOS 12.5V TO270-4
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| AFT05MP075GNR1 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V TO270-4
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Cut Tape (CT)
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
Description: RF MOSFET LDMOS 12.5V TO270-4
Power - Output: 70W
Configuration: Dual
Frequency: 520MHz
Mounting Type: Surface Mount
Package / Case: TO-270BB
Packaging: Cut Tape (CT)
Current - Test: 400 mA
Voltage - Test: 12.5 V
Voltage - Rated: 40 V
Supplier Device Package: TO-270 WB-4 Gull
Technology: LDMOS
Gain: 18.5dB
на замовлення 425 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2443.11 грн |
| 10+ | 1906.17 грн |
| 25+ | 1794.52 грн |
| 100+ | 1568.94 грн |
| 250+ | 1523.13 грн |
| NXQ1TXH5/101J |
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Виробник: NXP USA Inc.
Description: NXQ1TXH5 - ONE-CHIP 5 V QI WIREL
DigiKey Programmable: Not Verified
Packaging: Bulk
Description: NXQ1TXH5 - ONE-CHIP 5 V QI WIREL
DigiKey Programmable: Not Verified
Packaging: Bulk
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 5083.42 грн |
| MC34PF1550A3EPR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Supplier Device Package: 40-HVQFN (5x5)
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Voltage - Supply: 3.8V ~ 7V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 40-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 5000 шт
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| PCA9958HN/Q900Y |
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Виробник: NXP USA Inc.
Description: PCA9958HN/Q900Y
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: PCA9958HN/Q900Y
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
на замовлення 3984 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 227.06 грн |
| 10+ | 164.56 грн |
| 25+ | 150.94 грн |
| 100+ | 127.59 грн |
| 250+ | 120.89 грн |
| 500+ | 116.85 грн |
| 1000+ | 111.66 грн |
| MCIMX6G3DVK05AA |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Description: IC MPU I.MX6UL 528MHZ 272MAPBGA
Packaging: Tray
Package / Case: 272-LFBGA
Mounting Type: Surface Mount
Speed: 528MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A7
Voltage - I/O: 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 272-MAPBGA (9x9)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS
Security Features: ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Additional Interfaces: CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
товару немає в наявності
Мінімальне замовлення: 260 шт
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| MC12311CHN |
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: SPI, UART
RF Family/Standard: General ISM < 1GHz
Modulation: FSK, GFSK, GMSK, MSK, OOK
GPIO: 34
Supplier Device Package: 60-VFLGA (8x8)
Current - Transmitting: 16mA ~ 95mA
Data Rate (Max): 300kbps
Current - Receiving: 16mA
Power - Output: 17dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 32kB Flash, 2kB RAM
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Mounting Type: Surface Mount
Sensitivity: -120dBm
Package / Case: 60-VFLGA Exposed Pad
Packaging: Tray
Description: IC RF TXRX+MCU ISM<1GHZ 60VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: SPI, UART
RF Family/Standard: General ISM < 1GHz
Modulation: FSK, GFSK, GMSK, MSK, OOK
GPIO: 34
Supplier Device Package: 60-VFLGA (8x8)
Current - Transmitting: 16mA ~ 95mA
Data Rate (Max): 300kbps
Current - Receiving: 16mA
Power - Output: 17dBm
Voltage - Supply: 1.8V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 32kB Flash, 2kB RAM
Frequency: 315MHz, 433MHz, 470MHz, 868MHz, 915MHz, 928MHz, 955MHz
Mounting Type: Surface Mount
Sensitivity: -120dBm
Package / Case: 60-VFLGA Exposed Pad
Packaging: Tray
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Мінімальне замовлення: 1300 шт
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| BAP1321-03,115 |
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Виробник: NXP USA Inc.
Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Tape & Reel (TR)
Description: RF DIODE PIN 60V 500MW SOD-323
Power Dissipation (Max): 500 mW
Current - Max: 100 mA
Supplier Device Package: SOD-323
Voltage - Peak Reverse (Max): 60V
Resistance @ If, F: 1.3Ohm @ 100mA, 100MHz
Capacitance @ Vr, F: 0.32pF @ 20V, 1MHz
Operating Temperature: -65°C ~ 150°C (TJ)
Diode Type: PIN - Single
Package / Case: SC-76, SOD-323
Packaging: Tape & Reel (TR)
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| MC908QT2ACDWE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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| MCZ33972EWR2 |
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Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 8V ~ 26V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Description: IC INTERFACE SPECIALIZED 32SOIC
Supplier Device Package: 32-SOIC
Applications: Switch Monitoring
Voltage - Supply: 8V ~ 26V
Interface: SPI Serial
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
товару немає в наявності
Мінімальне замовлення: 1000 шт
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| PTN3393BSY |
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Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
Description: IC INTFACE SPECIALIZED 40HVQFN
Packaging: Bulk
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 3.3V
Applications: DisplayPort
Supplier Device Package: 40-HVQFN (6x6)
на замовлення 118 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 118+ | 126.23 грн |
| SAF4001EL/101Q305Y |
товару немає в наявності
Мінімальне замовлення: 1000 шт
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| NX3DV3899GU,115 |
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Виробник: NXP USA Inc.
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Number of Circuits: 2
Description: IC SWITCH DPDT X 2 3.3OHM 16XQFN
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 3.3Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 16-XQFN (1.8x2.6)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 4pC
Crosstalk: -90dB @ 1MHz
Switch Circuit: DPDT
Multiplexer/Demultiplexer Circuit: 2:2
Channel-to-Channel Matching (ΔRon): 700mOhm
Switch Time (Ton, Toff) (Max): 40ns, 20ns
Channel Capacitance (CS(off), CD(off)): 8pF
Current - Leakage (IS(off)) (Max): 5nA
Number of Circuits: 2
на замовлення 20000 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 90.19 грн |
| 10+ | 63.08 грн |
| 25+ | 57.11 грн |
| 100+ | 47.42 грн |
| 250+ | 44.48 грн |
| 500+ | 42.71 грн |
| 1000+ | 40.58 грн |
| MKL26Z256VMC4R |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32B 256KB FLASH 121MAPBGA
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tape & Reel (TR)
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Мінімальне замовлення: 2000 шт
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| MKL26Z256VMC4 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Description: IC MCU 32B 256KB FLASH 121MAPBGA
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 121-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 80
Supplier Device Package: 121-MAPBGA (8x8)
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART, USB, USB OTG
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D - 16bit; D/A - 12bit
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
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Мінімальне замовлення: 1740 шт
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| FS32K148UAT0VLLR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 156
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Number of I/O: 156
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Processor: ARM® Cortex®-M4F
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 112MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
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Мінімальне замовлення: 1000 шт
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| N74F373D,602 |
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Виробник: NXP USA Inc.
Description: IC D-TYPE TRANSP 8:8 20-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Delay Time - Propagation: 2ns
Current - Output High, Low: 3mA, 24mA
Independent Circuits: 1
Description: IC D-TYPE TRANSP 8:8 20-SO
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: 0°C ~ 70°C
Logic Type: D-Type Transparent Latch
Circuit: 8:8
Mounting Type: Surface Mount
Output Type: Tri-State
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Supplier Device Package: 20-SO
Delay Time - Propagation: 2ns
Current - Output High, Low: 3mA, 24mA
Independent Circuits: 1
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| MC33SA0528ACR2 |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER FULL 2/2 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V
Number of Drivers/Receivers: 2/2
Data Rate: 125kbps
Protocol: DSI
Supplier Device Package: 32-LQFP (7x7)
Receiver Hysteresis: 350 mV
Duplex: Full
Description: IC TRANSCEIVER FULL 2/2 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5V
Number of Drivers/Receivers: 2/2
Data Rate: 125kbps
Protocol: DSI
Supplier Device Package: 32-LQFP (7x7)
Receiver Hysteresis: 350 mV
Duplex: Full
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Мінімальне замовлення: 2000 шт
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| MC68360AI33L |
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Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
Description: IC MPU M683XX 33MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: SCC, SMC, SPI
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| MPC8536BVJANGA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 800MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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| MPC8536AVTATHA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 157 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 11090.12 грн |
| MPC8536AVTATHA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Description: IC MPU MPC85XX 1.25GHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.25GHz
Operating Temperature: 0°C ~ 90°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
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| MC35FS6517CAER2 |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 2000 шт
В кошику
од. на суму грн.
| MC35FS6517CAE |
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Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
товару немає в наявності
Мінімальне замовлення: 250 шт
В кошику
од. на суму грн.
| MIMXRT1189XVM8C |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
Description: IC
Packaging: Tray
Package / Case: 289-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz, 800MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F, ARM® Cortex®-M7F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 289-LFBGA (14x14)
Number of I/O: 173
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| MCIMX513DJM8C |
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Виробник: NXP USA Inc.
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
Description: IC MPU I.MX51 800MHZ 529BGA
Additional Interfaces: 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers: Keypad, LCD
Graphics Acceleration: No
RAM Controllers: LPDDR, DDR2
Co-Processors/DSP: Multimedia; NEON™ SIMD
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (3), USB 2.0 + PHY (1)
Ethernet: 10/100Mbps (1)
Supplier Device Package: 529-BGA (19x19)
Voltage - I/O: 1.2V, 1.875V, 2.775V, 3.0V
Core Processor: ARM® Cortex®-A8
Operating Temperature: -20°C ~ 85°C (TC)
Speed: 800MHz
Mounting Type: Surface Mount
Package / Case: 529-LFBGA
Packaging: Tray
товару немає в наявності
Мінімальне замовлення: 420 шт
В кошику
од. на суму грн.
| 88W8987-A2-NYEE/AZ |
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Виробник: NXP USA Inc.
Description: IC RF TXRX BLE 68HVQFN
Packaging: Cut Tape (CT)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
Description: IC RF TXRX BLE 68HVQFN
Packaging: Cut Tape (CT)
Package / Case: 68-VFQFN Exposed Pad
Sensitivity: -99dBm
Mounting Type: Surface Mount, Wettable Flank
Frequency: 2.4GHz, 5GHz
Type: TxRx Only
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.1V, 1.8V, 2.2V
Power - Output: 22dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 38mA ~ 82mA
Data Rate (Max): 433Mbps
Current - Transmitting: 79mA ~ 145mA
Supplier Device Package: 68-HVQFN (8x8)
GPIO: 21
Modulation: 4-DQPSK, 16-QAM, 64-QAM, 265-QAM, BPSK, GFSK, OFDM, QPSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: GPIO, JTAG, PCM, SDIO, UART
на замовлення 458 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 847.34 грн |
| 10+ | 709.44 грн |
| 25+ | 672.33 грн |
| 100+ | 583.22 грн |
| 250+ | 554.64 грн |
| LPC4078FBD144,551 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4032 x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
DigiKey Programmable: Not Verified
на замовлення 171 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1187.54 грн |
| 10+ | 906.69 грн |
| 60+ | 803.61 грн |
| 120+ | 727.98 грн |
| SAF4000EL/101Q534Y |
товару немає в наявності
Мінімальне замовлення: 1000 шт
В кошику
од. на суму грн.
| LPC1759FBD80Y |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 80LQFP
Packaging: Cut Tape (CT)
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 6x12b; D/A 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: CANbus, I2C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 52
DigiKey Programmable: Not Verified
на замовлення 40 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 932.78 грн |
| 10+ | 707.92 грн |
| 25+ | 660.35 грн |
| SPC5604BF2CLQ6R |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 64MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z0h
Data Converters: A/D 36x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 123
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 500 шт
В кошику
од. на суму грн.
| MC33285D |
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Виробник: NXP USA Inc.
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Channel Type: Synchronous
Driven Configuration: High-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.7V, 1.7V
DigiKey Programmable: Not Verified
Description: IC GATE DRVR HIGH-SIDE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 7V ~ 40V
Input Type: Non-Inverting
Supplier Device Package: 8-SOIC
Channel Type: Synchronous
Driven Configuration: High-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.7V, 1.7V
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 98 шт
В кошику
од. на суму грн.
| MPC8347ECZQADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
Description: IC MPU MPC83XX 266MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
товару немає в наявності
В кошику
од. на суму грн.
| NAFE73388B40BSK |
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Виробник: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Power (Watts): 160 mW
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Power (Watts): 160 mW
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1341.81 грн |
| 10+ | 1037.12 грн |
| 25+ | 973.44 грн |
| 100+ | 909.59 грн |
| NAFE73388B40BSE |
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Виробник: NXP USA Inc.
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Power (Watts): 160 mW
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Description: UNIVERSAL 25 V 8-INPUT LOW POWER
Power (Watts): 160 mW
Number of Channels: 8
Supplier Device Package: 64-HVQFN (9x9)
Voltage - Supply, Digital: 3V ~ 3.6V
Voltage - Supply, Analog: 3V ~ 3.6V
Number of Bits: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1677.27 грн |
| 10+ | 1296.31 грн |
| 25+ | 1216.81 грн |
| 100+ | 1059.92 грн |
| 260+ | 1019.35 грн |
| MPC862PVR66B |
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Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
товару немає в наявності
Мінімальне замовлення: 44 шт
В кошику
од. на суму грн.
| MPC8358ECVRAGDDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
Description: IC MPU MPC83XX 400MHZ 668BGA
Packaging: Tray
Package / Case: 668-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 668-PBGA-PGE (29x29)
Ethernet: 10/100/1000Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, HDLC, I2C, PCI, SPI, UART
товару немає в наявності
Мінімальне замовлення: 36 шт
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од. на суму грн.
| MC9S08DV48ACLC |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
товару немає в наявності
Мінімальне замовлення: 1250 шт
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од. на суму грн.
| LPC11U22FBD48/30QL |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 40
DigiKey Programmable: Not Verified
на замовлення 242 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 300.64 грн |
| 10+ | 219.49 грн |
| 25+ | 202.05 грн |
| 100+ | 171.57 грн |
| MC56F81768LVLH |
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Виробник: NXP USA Inc.
Description: MC56F81768LVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
Description: MC56F81768LVLH
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: DMA, I2C, LINbus, SCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 20kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 64-LQFP (10x10)
товару немає в наявності
Мінімальне замовлення: 160 шт
В кошику
од. на суму грн.
| C9KEAZN8AMTG |
Виробник: NXP USA Inc.
Description: C9KEAZN8AMTG
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 22
Description: C9KEAZN8AMTG
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 12x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PMC, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 22
товару немає в наявності
Мінімальне замовлення: 96 шт
В кошику
од. на суму грн.
| MCZ33742EGR2 |
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Виробник: NXP USA Inc.
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
Description: IC SYSTEM BASIS CHIP CAN 28-SOIC
Packaging: Tape & Reel (TR)
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 5.5V ~ 18V
Current - Supply: 42mA
Supplier Device Package: 28-SOIC
Grade: Automotive
товару немає в наявності
Мінімальне замовлення: 1000 шт
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од. на суму грн.
| MIMX9351DVVXMABR |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 1500 шт
В кошику
од. на суму грн.
| MIMX9331XVVXMABR |
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Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
товару немає в наявності
Мінімальне замовлення: 1500 шт
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од. на суму грн.
































