Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36389) > Сторінка 565 з 607
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MSC8157TAG1000A | NXP USA Inc. |
Description: IC DSP 6X 1GHZ SC3850 783FCBGAInterface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Packaging: Tray Supplier Device Package: 783-FCPBGA (29x29) Clock Rate: 1GHz Voltage - Core: 1.00V Voltage - I/O: 1.0V, 1.5V, 2.5V On-Chip RAM: 6.375MB Non-Volatile Memory: ROM (96KB) Operating Temperature: -40°C ~ 105°C (TJ) Type: SC3850 Six Core |
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CBT3306D,118 | NXP USA Inc. |
Description: IC BUS SWITCH 1 X 1:1 8SOSupplier Device Package: 8-SO Voltage Supply Source: Single Supply Independent Circuits: 2 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Type: Bus Switch Circuit: 1 x 1:1 Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Bulk |
на замовлення 14665 шт: термін постачання 21-31 дні (днів) |
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PEMH7,115 | NXP USA Inc. |
Description: TRANS 2NPN PREBIAS 0.3W SOT666Packaging: Bulk |
на замовлення 132000 шт: термін постачання 21-31 дні (днів) |
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| MRF6VP11KHR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230Voltage - Test: 50 V Voltage - Rated: 110 V Supplier Device Package: NI-1230 Technology: LDMOS (Dual) Gain: 26dB Power - Output: 1000W Configuration: 2 N-Channel Frequency: 1.8MHz ~ 150MHz Mounting Type: Chassis Mount Package / Case: NI-1230 Packaging: Bulk Current - Test: 6 A |
на замовлення 841 шт: термін постачання 21-31 дні (днів) |
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MC35FS4500NAE | NXP USA Inc. |
Description: FS4500Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
на замовлення 250 шт: термін постачання 21-31 дні (днів) |
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SPC5742PK1MLQ5R | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPDigiKey Programmable: Not Verified Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 64x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
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SPC5742PK1MLQ5 | NXP USA Inc. |
Description: IC MCU 32BIT 1.5MB FLASH 144LQFPDigiKey Programmable: Not Verified Supplier Device Package: 144-LQFP (20x20) Peripherals: DMA, LVD, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Dual-Core Data Converters: A/D 64x12b Core Processor: e200z4 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray |
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SPC5744BK1AMMH2 | NXP USA Inc. |
Description: IC MCU 32B 1.5MB FLASH 100MAPBGADigiKey Programmable: Not Verified Supplier Device Package: 100-MAPBGA (11x11) Peripherals: DMA, I2S, POR, WDT Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 36x10b, 16x12b Core Processor: e200z4 EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 192K x 8 Program Memory Size: 1.5MB (1.5M x 8) Speed: 120MHz Mounting Type: Surface Mount Package / Case: 100-LFBGA Packaging: Tray |
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MC33937APEK | NXP USA Inc. |
Description: IC MOTOR DRIVER 6V-58V 54SOICGrade: Automotive Motor Type - AC, DC: Brushless DC (BLDC) Supplier Device Package: 54-SOIC-EP Technology: NMOS Voltage - Supply: 6V ~ 58V Output Configuration: Pre-Driver - Half Bridge (3) Operating Temperature: -40°C ~ 135°C (TA) Interface: SPI Function: Controller - Commutation, Direction Management Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Packaging: Tube |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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PCA9958HNY | NXP USA Inc. |
Description: PCA9958HNYType: Linear Frequency: 31.25kHz Number of Outputs: 24 Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Packaging: Cut Tape (CT) Voltage - Supply (Max): 5.5V Voltage - Supply (Min): 2.7V Dimming: PWM, SPI Supplier Device Package: 40-HVQFN (6x6) Topology: Constant Current Internal Switch(s): No Current - Output / Channel: 63mA Applications: General Purpose Operating Temperature: -40°C ~ 85°C (TA) |
на замовлення 4000 шт: термін постачання 21-31 дні (днів) |
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| MCXC243VFT | NXP USA Inc. |
Description: 48MHz, Cortex-M0+, USBNumber of I/O: 36 Supplier Device Package: 48-QFN (7x7) Peripherals: DMA, PWM, WDT Connectivity: I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 16b; D/A 1x12b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 48-UFQFN Exposed Pad Packaging: Tray |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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MPC8315ECVRAGDA | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGAAdditional Interfaces: DUART, I2C, PCI, SPI, TDM SATA: SATA 3Gbps (2) Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC 3.3 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (1) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300c3 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
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| S9S12VRP64F0MLFR | NXP USA Inc. |
Description: MAGNIV 16-BIT MCU, S12 CORE, 64K Packaging: Tape & Reel (TR) |
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MC908AP8ACFBE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44QFPDigiKey Programmable: Not Verified Number of I/O: 32 Supplier Device Package: 44-QFP (10x10) Peripherals: LED, LVD, POR, PWM Connectivity: I2C, IRSCI, SCI, SPI Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: HC08 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 8KB (8K x 8) Speed: 8MHz Mounting Type: Surface Mount Package / Case: 44-QFP Packaging: Tray |
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MC908AP16ACFBE557 | NXP USA Inc. |
Description: MICROCONTROLLER, 8 BIT, HC08/S08Packaging: Bulk DigiKey Programmable: Not Verified |
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74AUP1T34GM,132 | NXP USA Inc. |
Description: IC TRANSLTR UNIDIRECTIONAL 6XSONSupplier Device Package: 6-XSON (1.45x1) Current - Output High, Low: 4mA, 4mA Number of Bits per Element: 1 Voltage - Supply: 1.1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 6-XFDFN Packaging: Bulk |
на замовлення 470000 шт: термін постачання 21-31 дні (днів) |
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74AUP1T34GN,132 | NXP USA Inc. |
Description: IC TRANSLTR UNIDIRECTIONAL 6XSONSupplier Device Package: 6-XSON (0.9x1) Current - Output High, Low: 4mA, 4mA Number of Bits per Element: 1 Voltage - Supply: 1.1V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 1 Mounting Type: Surface Mount Output Type: Push-Pull Package / Case: 6-XFDFN Packaging: Bulk |
на замовлення 57632 шт: термін постачання 21-31 дні (днів) |
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| TDA19988AET/C1,151 | NXP USA Inc. |
Description: IC VIDEO HDMI TRANS 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Function: Transmitter Applications: Consumer Video Standards: HDMI 1.4a, ITU656 Supplier Device Package: 64-TFBGA (4.5x4.5) Control Interface: I2S |
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| TDA19988BET/C1,151 | NXP USA Inc. |
Description: IC VIDEO HDMI TRANS 64TFBGAPackaging: Tray Package / Case: 64-TFBGA Mounting Type: Surface Mount Function: Transmitter Applications: Consumer Video Standards: HDMI 1.4a, ITU656 Supplier Device Package: 64-TFBGA (4.5x4.5) Control Interface: I2S |
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MC56F84550VLF | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFP Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 10x12b; D/A 1x12b Core Processor: 56800EX EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT |
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MC56F84550VLFR | NXP USA Inc. |
Description: IC MCU 32BIT 96KB FLASH 48LQFPCore Size: 32-Bit Single-Core Data Converters: A/D 10x12b; D/A 1x12b Core Processor: 56800EX EEPROM Size: 2K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Cut Tape (CT) DigiKey Programmable: Not Verified Number of I/O: 39 Supplier Device Package: 48-LQFP (7x7) Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V |
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HEF4894BTT,118 | NXP USA Inc. |
Description: NOW NEXPERIA HEF4894BTT - 12-STANumber of Bits per Element: 12 Supplier Device Package: 20-TSSOP Voltage - Supply: 3V ~ 15V Operating Temperature: -40°C ~ 125°C Logic Type: Shift Register Function: Serial to Parallel, Serial Number of Elements: 1 Mounting Type: Surface Mount Output Type: Open Drain Package / Case: 20-TSSOP (0.173", 4.40mm Width) Packaging: Bulk |
на замовлення 3020 шт: термін постачання 21-31 дні (днів) |
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UJA1079ATW/3/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 75µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
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UJA1079ATW/5/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 75µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
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UJA1079ATW/3W/2Z | NXP USA Inc. |
Description: IC INTFACE SPECIALIZED 32HTSSOP Packaging: Tape & Reel (TR) Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Mounting Type: Surface Mount Voltage - Supply: 4.5V ~ 28V Applications: System Basis Chip Current - Supply: 75µA Supplier Device Package: 32-HTSSOP Grade: Automotive Qualification: AEC-Q100 |
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A7101CHTK2/T0BC2VJ | NXP USA Inc. |
Description: SECURE AUTHENTICATIONOperating Temperature: -25°C ~ 90°C (TA) Interface: I2C Mounting Type: Surface Mount Package / Case: 8-VDFN Exposed Pad Packaging: Bulk DigiKey Programmable: Not Verified Supplier Device Package: 8-HVSON (4x4) Core Processor: MX51 Applications: Authentication Voltage - Supply: 2.5V ~ 3.6V |
на замовлення 1897 шт: термін постачання 21-31 дні (днів) |
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MKW31Z256VHT4 | NXP USA Inc. |
Description: IC RF TXRX+MCU BLE 64VFLGADigiKey Programmable: Not Verified Serial Interfaces: I2C, SPI, UART RF Family/Standard: Bluetooth Modulation: FSK, GFSK, MSK, O-QPSK Supplier Device Package: 64-VFLGA (7x7) Current - Transmitting: 6mA Data Rate (Max): 1Mbps Current - Receiving: 6.2mA Protocol: Bluetooth v4.2 Power - Output: 3.5dBm Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -95dBm Package / Case: 64-VFLGA Packaging: Tray Type: TxRx + MCU Memory Size: 256kB Flash, 64kB RAM Voltage - Supply: 1.71V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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MPC8347VRADDB | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGAAdditional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (2) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
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MRF8P20100HSR3 | NXP USA Inc. |
Description: RF MOSFET LDMOS 28V NI780 Technology: LDMOS Gain: 16dB Power - Output: 20W Configuration: Dual Frequency: 2.03GHz Mounting Type: Surface Mount Package / Case: NI-780S-4L Packaging: Tape & Reel (TR) Current - Test: 400 mA Voltage - Test: 28 V Voltage - Rated: 65 V Supplier Device Package: NI-780S-4L |
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SPC5605BF1MLU6R | NXP USA Inc. |
Description: IC MCU 32BIT 768KB FLASH 176LQFPDigiKey Programmable: Not Verified Number of I/O: 149 Supplier Device Package: 176-LQFP (24x24) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, I2C, LINbus, SCI, SPI Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 29x10b, 5x12b Core Processor: e200z0h EEPROM Size: 64K x 8 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 768KB (768K x 8) Speed: 64MHz Mounting Type: Surface Mount Package / Case: 176-LQFP Packaging: Tape & Reel (TR) |
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FRDM-MCXC444 | NXP USA Inc. |
Description: FREEDOM MCXC444 EVAL BRDPackaging: Bulk Mounting Type: Fixed Type: MCU 32-Bit Contents: Board(s) Core Processor: ARM® Cortex®-M0+ Utilized IC / Part: MCXC444 Platform: Freedom |
на замовлення 54 шт: термін постачання 21-31 дні (днів) |
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| K32W032S1M2CAVAR | NXP USA Inc. |
Description: MCU KINETIS BT5/FSK WLCSP Packaging: Cut Tape (CT) Mounting Type: Surface Mount Speed: 72MHz Program Memory Size: 1.25MB (1.25M x 8) RAM Size: 384K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4/M0 Data Converters: A/D - 12bit; D/A - 12bit Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB Peripherals: Bluetooth, DMA, PWM, WDT Supplier Device Package: 191-WLCSP (5.97x5.85) Number of I/O: 104 DigiKey Programmable: Not Verified |
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74AUP2G132GD,125 | NXP USA Inc. |
Description: IC GATE NAND 2CH 2-INP 8-XSONMax Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF Input Logic Level - Low: 0.1V ~ 0.88V Input Logic Level - High: 0.6V ~ 2.29V Supplier Device Package: 8-XSON (2x3) Number of Inputs: 2 Current - Output High, Low: 4mA, 4mA Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C Logic Type: NAND Gate Mounting Type: Surface Mount Package / Case: 8-XFDFN Features: Schmitt Trigger Packaging: Bulk Current - Quiescent (Max): 500 nA Number of Circuits: 2 |
на замовлення 447102 шт: термін постачання 21-31 дні (днів) |
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74AUP2G126GD,125 | NXP USA Inc. |
Description: IC BUFFER/LINEDVR DUAL XSON8USupplier Device Package: 8-XSON (2x3) Current - Output High, Low: 4mA, 4mA Number of Bits per Element: 1 Voltage - Supply: 0.8V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Logic Type: Buffer, Non-Inverting Number of Elements: 2 Mounting Type: Surface Mount Output Type: 3-State Package / Case: 8-XFDFN Packaging: Bulk |
на замовлення 84319 шт: термін постачання 21-31 дні (днів) |
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| SC900719BAFR2 | NXP USA Inc. |
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO Packaging: Tape & Reel (TR) |
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| SC900719BAF | NXP USA Inc. |
Description: SOLENOID DRIVER, 12 DRVR, 3A, MO Packaging: Tray |
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S912XET256BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 256KB FLASH 80QFPPackaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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S912XEG384BCAAR | NXP USA Inc. |
Description: IC MCU 16BIT 384KB FLASH 80QFPPackaging: Tape & Reel (TR) Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 384KB (384K x 8) RAM Size: 24K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 4K x 8 Core Processor: HCS12X Data Converters: A/D 8x12b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 59 DigiKey Programmable: Not Verified |
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MC33PF8200A0ESR2 | NXP USA Inc. |
Description: POWER MANAGEMENT IC I.MX8 NON-PRPackaging: Tape & Reel (TR) Package / Case: 56-VFQFN Exposed Pad Mounting Type: Surface Mount, Wettable Flank Operating Temperature: -40°C ~ 105°C (TA) Voltage - Supply: 2.5V ~ 5.5V Applications: High Performance i.MX 8, S32x Processor Based Supplier Device Package: 56-HVQFN (8x8) |
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| FXPS71407BPST1 | NXP USA Inc. |
Description: FXPS71407BPST1 Packaging: Tape & Reel (TR) |
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В кошику од. на суму грн. | |||||||||||||||||
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S32K322NHT0VPBSR | NXP USA Inc. |
Description: S32K322NHT0VPBSRPackaging: Bulk Package / Case: 172-QFP Mounting Type: Surface Mount Speed: 160MHz Program Memory Size: 2MB (2M x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH EEPROM Size: 128K x 8 Core Processor: ARM® Cortex®-M7 Data Converters: A/D 24x12b SAR Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART Peripherals: DMA, I2S, WDT Supplier Device Package: 172-QFP (16x16) Grade: Automotive Number of I/O: 142 Qualification: AEC-Q100 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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PSMN020-30MLCX | NXP USA Inc. |
Description: TRANSISTOR >30MHZPackaging: Bulk Package / Case: SOT-1210, 8-LFPAK33 (5-Lead) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc) Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V Power Dissipation (Max): 33W (Tc) Vgs(th) (Max) @ Id: 1.95V @ 1mA Supplier Device Package: LFPAK33 Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 30 V Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V |
на замовлення 6572 шт: термін постачання 21-31 дні (днів) |
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MPC8264AZUPIBB | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 480TBGAPackaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| FB32K116LIT0VFMT | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLASH 32QFN Packaging: Tray |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SL3S1205FUD2/HAPBZ | NXP USA Inc. |
Description: SL3S1205FUD2/HAPBZPackaging: Tape & Reel (TR) Package / Case: Die Mounting Type: Surface Mount Frequency: 840MHz ~ 960MHz Type: RFID Transponder Operating Temperature: -40°C ~ 85°C (TA) Standards: EPC Supplier Device Package: Wafer |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| SL3S1205FUD2/HAPA | NXP USA Inc. |
Description: SL3S1205FUD2/HAPAPackaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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PDTA123TU,115 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 200MW SOT323Packaging: Bulk |
на замовлення 24000 шт: термін постачання 21-31 дні (днів) |
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PDTA123EMB,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A 3DFNPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 2.2 kOhms Resistor - Emitter Base (R2): 2.2 kOhms Resistors Included: R1 and R2 |
на замовлення 139871 шт: термін постачання 21-31 дні (днів) |
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PDTA123TMB,315 | NXP USA Inc. |
Description: TRANS PREBIAS PNP 50V 0.1A 3DFNPackaging: Bulk Package / Case: SC-101, SOT-883 Mounting Type: Surface Mount Transistor Type: PNP - Pre-Biased Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V Supplier Device Package: DFN1006B-3 Current - Collector (Ic) (Max): 100 mA Voltage - Collector Emitter Breakdown (Max): 50 V Power - Max: 250 mW Frequency - Transition: 180 MHz Resistor - Base (R1): 2.2 kOhms Resistors Included: R1 Only |
на замовлення 110000 шт: термін постачання 21-31 дні (днів) |
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MC908EY16MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFPPackaging: Tray Package / Case: 32-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: LINbus, SCI, SPI Peripherals: POR, PWM Supplier Device Package: 32-LQFP (7x7) Number of I/O: 24 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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MC9S08AC8MFGE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 44LQFPPackaging: Tray Package / Case: 44-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 8KB (8K x 8) RAM Size: 768 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 44-LQFP (10x10) Number of I/O: 34 DigiKey Programmable: Not Verified |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
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NVT2008BQZ | NXP USA Inc. |
Description: IC TRANSLATOR BIDIR 20DHVQFNPackaging: Tape & Reel (TR) Package / Case: 20-VFQFN Exposed Pad Output Type: Open Drain, Push-Pull Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-DHVQFN (4.5x2.5) Channel Type: Bidirectional Translator Type: Voltage Level Channels per Circuit: 8 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Number of Circuits: 1 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||||
| SL2S3103FUDA | NXP USA Inc. |
Description: IC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
| MFS2613AMDH3ADR2 | NXP USA Inc. |
Description: MFS2613AMDH3ADR2 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||||
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MCXW716AMFTAT | NXP USA Inc. |
Description: IC MCUPackaging: Bulk Package / Case: 48-VFQFN Exposed Pad Sensitivity: -106dBm Mounting Type: Surface Mount, Wettable Flank Memory Size: 1MB Flash, 128kB RAM Type: TxRx + MCU Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.8V ~ 1.98V Power - Output: 10dBm Protocol: Bluetooth v5.3, Matter, Thread, Zigbee® Current - Receiving: 3.69mA ~ 10.01mA Data Rate (Max): 2Mbps Current - Transmitting: 3.75mA ~ 20.99mA Supplier Device Package: 48-HVQFN (7x7) GPIO: 29 Modulation: 2FSK, GFSK, GMSK, MSK RF Family/Standard: 802.15.4, Bluetooth Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART |
на замовлення 1300 шт: термін постачання 21-31 дні (днів) |
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S9S08SG16E1WTG | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 16TSSOPPackaging: Bulk Package / Case: 16-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: S08 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Supplier Device Package: 16-TSSOP Number of I/O: 12 DigiKey Programmable: Not Verified |
на замовлення 768 шт: термін постачання 21-31 дні (днів) |
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TJA1057BTK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 4516 шт: термін постачання 21-31 дні (днів) |
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TJA1057CTK/0J | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 8HVSONPackaging: Cut Tape (CT) Package / Case: 8-VDFN Exposed Pad Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 150°C (TJ) Voltage - Supply: 4.5V ~ 5.5V Number of Drivers/Receivers: 1/1 Data Rate: 5Mbps Protocol: CANbus Supplier Device Package: 8-HVSON (3x3) Receiver Hysteresis: 300 mV Duplex: Half Grade: Automotive Qualification: AEC-Q100 |
на замовлення 6000 шт: термін постачання 21-31 дні (днів) |
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PZU20B2,115 | NXP USA Inc. |
Description: DIODE ZENER 20V 310MW SOD323FPackaging: Bulk |
на замовлення 66120 шт: термін постачання 21-31 дні (днів) |
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PCA9530D,112 | NXP USA Inc. |
Description: IC LED DRVR LINEAR I2C 25MA 8SONumber of Outputs: 2 Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tube Voltage - Supply (Max): 5.5V Voltage - Supply (Min): 2.3V Dimming: I2C, SMBus Supplier Device Package: 8-SO Internal Switch(s): Yes Current - Output / Channel: 25mA Applications: Backlight Operating Temperature: -40°C ~ 85°C (TA) Type: Linear Frequency: 400kHz |
товару немає в наявності |
В кошику од. на суму грн. |
| MSC8157TAG1000A |
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Виробник: NXP USA Inc.
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
Description: IC DSP 6X 1GHZ SC3850 783FCBGA
Interface: Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Packaging: Tray
Supplier Device Package: 783-FCPBGA (29x29)
Clock Rate: 1GHz
Voltage - Core: 1.00V
Voltage - I/O: 1.0V, 1.5V, 2.5V
On-Chip RAM: 6.375MB
Non-Volatile Memory: ROM (96KB)
Operating Temperature: -40°C ~ 105°C (TJ)
Type: SC3850 Six Core
товару немає в наявності
В кошику
од. на суму грн.
| CBT3306D,118 |
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Виробник: NXP USA Inc.
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Description: IC BUS SWITCH 1 X 1:1 8SO
Supplier Device Package: 8-SO
Voltage Supply Source: Single Supply
Independent Circuits: 2
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Bus Switch
Circuit: 1 x 1:1
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
на замовлення 14665 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1268+ | 18.18 грн |
| PEMH7,115 |
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на замовлення 132000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 6772+ | 3.03 грн |
| MRF6VP11KHR5 |
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Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
Description: RF MOSFET LDMOS 50V NI1230
Voltage - Test: 50 V
Voltage - Rated: 110 V
Supplier Device Package: NI-1230
Technology: LDMOS (Dual)
Gain: 26dB
Power - Output: 1000W
Configuration: 2 N-Channel
Frequency: 1.8MHz ~ 150MHz
Mounting Type: Chassis Mount
Package / Case: NI-1230
Packaging: Bulk
Current - Test: 6 A
на замовлення 841 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 24498.36 грн |
| MC35FS4500NAE |
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Виробник: NXP USA Inc.
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: FS4500
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 250 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 603.66 грн |
| 10+ | 451.17 грн |
| 25+ | 418.57 грн |
| 100+ | 359.19 грн |
| 250+ | 343.15 грн |
| SPC5742PK1MLQ5R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
товару немає в наявності
В кошику
од. на суму грн.
| SPC5742PK1MLQ5 |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 64x12b
Core Processor: e200z4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| SPC5744BK1AMMH2 |
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Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 100-MAPBGA (11x11)
Peripherals: DMA, I2S, POR, WDT
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 36x10b, 16x12b
Core Processor: e200z4
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5MB (1.5M x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Packaging: Tray
товару немає в наявності
В кошику
од. на суму грн.
| MC33937APEK |
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Виробник: NXP USA Inc.
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
Description: IC MOTOR DRIVER 6V-58V 54SOIC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: 54-SOIC-EP
Technology: NMOS
Voltage - Supply: 6V ~ 58V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 135°C (TA)
Interface: SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Packaging: Tube
на замовлення 34 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 430.39 грн |
| 10+ | 318.53 грн |
| 26+ | 293.61 грн |
| PCA9958HNY |
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Виробник: NXP USA Inc.
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
Description: PCA9958HNY
Type: Linear
Frequency: 31.25kHz
Number of Outputs: 24
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.7V
Dimming: PWM, SPI
Supplier Device Package: 40-HVQFN (6x6)
Topology: Constant Current
Internal Switch(s): No
Current - Output / Channel: 63mA
Applications: General Purpose
Operating Temperature: -40°C ~ 85°C (TA)
на замовлення 4000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 208.08 грн |
| 10+ | 149.40 грн |
| 25+ | 136.65 грн |
| 100+ | 115.12 грн |
| 250+ | 108.86 грн |
| 500+ | 105.09 грн |
| 1000+ | 100.31 грн |
| MCXC243VFT |
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Виробник: NXP USA Inc.
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
Description: 48MHz, Cortex-M0+, USB
Number of I/O: 36
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 16b; D/A 1x12b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-UFQFN Exposed Pad
Packaging: Tray
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2+ | 193.04 грн |
| 10+ | 173.48 грн |
| 25+ | 160.20 грн |
| 80+ | 139.01 грн |
| MPC8315ECVRAGDA |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI, TDM
SATA: SATA 3Gbps (2)
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC 3.3
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (1)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300c3
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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| MC908AP8ACFBE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-QFP (10x10)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
Description: IC MCU 8BIT 8KB FLASH 44QFP
DigiKey Programmable: Not Verified
Number of I/O: 32
Supplier Device Package: 44-QFP (10x10)
Peripherals: LED, LVD, POR, PWM
Connectivity: I2C, IRSCI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 44-QFP
Packaging: Tray
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| MC908AP16ACFBE557 |
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Виробник: NXP USA Inc.
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: MICROCONTROLLER, 8 BIT, HC08/S08
Packaging: Bulk
DigiKey Programmable: Not Verified
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| 74AUP1T34GM,132 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (1.45x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 470000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2551+ | 9.09 грн |
| 74AUP1T34GN,132 |
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Виробник: NXP USA Inc.
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (0.9x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
Description: IC TRANSLTR UNIDIRECTIONAL 6XSON
Supplier Device Package: 6-XSON (0.9x1)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 1.1V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Push-Pull
Package / Case: 6-XFDFN
Packaging: Bulk
на замовлення 57632 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1800+ | 12.88 грн |
| TDA19988AET/C1,151 |
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Виробник: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
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| TDA19988BET/C1,151 |
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Виробник: NXP USA Inc.
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
Description: IC VIDEO HDMI TRANS 64TFBGA
Packaging: Tray
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Function: Transmitter
Applications: Consumer Video
Standards: HDMI 1.4a, ITU656
Supplier Device Package: 64-TFBGA (4.5x4.5)
Control Interface: I2S
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| MC56F84550VLF |
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
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| MC56F84550VLFR |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Description: IC MCU 32BIT 96KB FLASH 48LQFP
Core Size: 32-Bit Single-Core
Data Converters: A/D 10x12b; D/A 1x12b
Core Processor: 56800EX
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Number of I/O: 39
Supplier Device Package: 48-LQFP (7x7)
Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
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| HEF4894BTT,118 |
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Виробник: NXP USA Inc.
Description: NOW NEXPERIA HEF4894BTT - 12-STA
Number of Bits per Element: 12
Supplier Device Package: 20-TSSOP
Voltage - Supply: 3V ~ 15V
Operating Temperature: -40°C ~ 125°C
Logic Type: Shift Register
Function: Serial to Parallel, Serial
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
Description: NOW NEXPERIA HEF4894BTT - 12-STA
Number of Bits per Element: 12
Supplier Device Package: 20-TSSOP
Voltage - Supply: 3V ~ 15V
Operating Temperature: -40°C ~ 125°C
Logic Type: Shift Register
Function: Serial to Parallel, Serial
Number of Elements: 1
Mounting Type: Surface Mount
Output Type: Open Drain
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Bulk
на замовлення 3020 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 480+ | 47.72 грн |
| UJA1079ATW/3/2Z |
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| UJA1079ATW/5/2Z |
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| UJA1079ATW/3W/2Z |
Виробник: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
Description: IC INTFACE SPECIALIZED 32HTSSOP
Packaging: Tape & Reel (TR)
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Mounting Type: Surface Mount
Voltage - Supply: 4.5V ~ 28V
Applications: System Basis Chip
Current - Supply: 75µA
Supplier Device Package: 32-HTSSOP
Grade: Automotive
Qualification: AEC-Q100
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| A7101CHTK2/T0BC2VJ |
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Виробник: NXP USA Inc.
Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
Description: SECURE AUTHENTICATION
Operating Temperature: -25°C ~ 90°C (TA)
Interface: I2C
Mounting Type: Surface Mount
Package / Case: 8-VDFN Exposed Pad
Packaging: Bulk
DigiKey Programmable: Not Verified
Supplier Device Package: 8-HVSON (4x4)
Core Processor: MX51
Applications: Authentication
Voltage - Supply: 2.5V ~ 3.6V
на замовлення 1897 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 183+ | 124.21 грн |
| MKW31Z256VHT4 |
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Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Description: IC RF TXRX+MCU BLE 64VFLGA
DigiKey Programmable: Not Verified
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Modulation: FSK, GFSK, MSK, O-QPSK
Supplier Device Package: 64-VFLGA (7x7)
Current - Transmitting: 6mA
Data Rate (Max): 1Mbps
Current - Receiving: 6.2mA
Protocol: Bluetooth v4.2
Power - Output: 3.5dBm
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 64-VFLGA
Packaging: Tray
Type: TxRx + MCU
Memory Size: 256kB Flash, 64kB RAM
Voltage - Supply: 1.71V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 318.05 грн |
| 10+ | 271.15 грн |
| MPC8347VRADDB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (2)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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| MRF8P20100HSR3 |
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
Description: RF MOSFET LDMOS 28V NI780
Technology: LDMOS
Gain: 16dB
Power - Output: 20W
Configuration: Dual
Frequency: 2.03GHz
Mounting Type: Surface Mount
Package / Case: NI-780S-4L
Packaging: Tape & Reel (TR)
Current - Test: 400 mA
Voltage - Test: 28 V
Voltage - Rated: 65 V
Supplier Device Package: NI-780S-4L
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| SPC5605BF1MLU6R |
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Виробник: NXP USA Inc.
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 768KB FLASH 176LQFP
DigiKey Programmable: Not Verified
Number of I/O: 149
Supplier Device Package: 176-LQFP (24x24)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 29x10b, 5x12b
Core Processor: e200z0h
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 64MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tape & Reel (TR)
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| FRDM-MCXC444 |
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Виробник: NXP USA Inc.
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
Description: FREEDOM MCXC444 EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M0+
Utilized IC / Part: MCXC444
Platform: Freedom
на замовлення 54 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 761.10 грн |
| K32W032S1M2CAVAR |
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
Description: MCU KINETIS BT5/FSK WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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| 74AUP2G132GD,125 |
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Виробник: NXP USA Inc.
Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
Description: IC GATE NAND 2CH 2-INP 8-XSON
Max Propagation Delay @ V, Max CL: 7.8ns @ 3.3V, 30pF
Input Logic Level - Low: 0.1V ~ 0.88V
Input Logic Level - High: 0.6V ~ 2.29V
Supplier Device Package: 8-XSON (2x3)
Number of Inputs: 2
Current - Output High, Low: 4mA, 4mA
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C
Logic Type: NAND Gate
Mounting Type: Surface Mount
Package / Case: 8-XFDFN
Features: Schmitt Trigger
Packaging: Bulk
Current - Quiescent (Max): 500 nA
Number of Circuits: 2
на замовлення 447102 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2049+ | 11.36 грн |
| 74AUP2G126GD,125 |
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Виробник: NXP USA Inc.
Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
Description: IC BUFFER/LINEDVR DUAL XSON8U
Supplier Device Package: 8-XSON (2x3)
Current - Output High, Low: 4mA, 4mA
Number of Bits per Element: 1
Voltage - Supply: 0.8V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Mounting Type: Surface Mount
Output Type: 3-State
Package / Case: 8-XFDFN
Packaging: Bulk
на замовлення 84319 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2049+ | 10.95 грн |
| S912XET256BCAAR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| S912XEG384BCAAR |
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Виробник: NXP USA Inc.
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 384KB FLASH 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 24K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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| MC33PF8200A0ESR2 |
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Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
Description: POWER MANAGEMENT IC I.MX8 NON-PR
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Supplier Device Package: 56-HVQFN (8x8)
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| S32K322NHT0VPBSR |
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Виробник: NXP USA Inc.
Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
Description: S32K322NHT0VPBSR
Packaging: Bulk
Package / Case: 172-QFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M7
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, QSPI, SAI, SENT, SPI, UART/USART
Peripherals: DMA, I2S, WDT
Supplier Device Package: 172-QFP (16x16)
Grade: Automotive
Number of I/O: 142
Qualification: AEC-Q100
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| PSMN020-30MLCX |
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Виробник: NXP USA Inc.
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc)
Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V
Description: TRANSISTOR >30MHZ
Packaging: Bulk
Package / Case: SOT-1210, 8-LFPAK33 (5-Lead)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31.8A (Tc)
Rds On (Max) @ Id, Vgs: 18.1mOhm @ 5A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Supplier Device Package: LFPAK33
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 9.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 430 pF @ 15 V
на замовлення 6572 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 725+ | 27.57 грн |
| MPC8264AZUPIBB |
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Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 300MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| SL3S1205FUD2/HAPBZ |
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Виробник: NXP USA Inc.
Description: SL3S1205FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
Description: SL3S1205FUD2/HAPBZ
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Frequency: 840MHz ~ 960MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 85°C (TA)
Standards: EPC
Supplier Device Package: Wafer
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| PDTA123TU,115 |
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на замовлення 24000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 13172+ | 1.51 грн |
| PDTA123EMB,315 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistor - Emitter Base (R2): 2.2 kOhms
Resistors Included: R1 and R2
на замовлення 139871 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11225+ | 2.26 грн |
| PDTA123TMB,315 |
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Виробник: NXP USA Inc.
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistors Included: R1 Only
Description: TRANS PREBIAS PNP 50V 0.1A 3DFN
Packaging: Bulk
Package / Case: SC-101, SOT-883
Mounting Type: Surface Mount
Transistor Type: PNP - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 20mA, 5V
Supplier Device Package: DFN1006B-3
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 250 mW
Frequency - Transition: 180 MHz
Resistor - Base (R1): 2.2 kOhms
Resistors Included: R1 Only
на замовлення 110000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 11225+ | 2.26 грн |
| MC908EY16MFAE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SCI, SPI
Peripherals: POR, PWM
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 24
DigiKey Programmable: Not Verified
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| MC9S08AC8MFGE |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Number of I/O: 34
DigiKey Programmable: Not Verified
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| NVT2008BQZ |
![]() |
Виробник: NXP USA Inc.
Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
Description: IC TRANSLATOR BIDIR 20DHVQFN
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-DHVQFN (4.5x2.5)
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 8
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
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| MCXW716AMFTAT |
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Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.8V ~ 1.98V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Matter, Thread, Zigbee®
Current - Receiving: 3.69mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.75mA ~ 20.99mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 29
Modulation: 2FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART
Description: IC MCU
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -106dBm
Mounting Type: Surface Mount, Wettable Flank
Memory Size: 1MB Flash, 128kB RAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.8V ~ 1.98V
Power - Output: 10dBm
Protocol: Bluetooth v5.3, Matter, Thread, Zigbee®
Current - Receiving: 3.69mA ~ 10.01mA
Data Rate (Max): 2Mbps
Current - Transmitting: 3.75mA ~ 20.99mA
Supplier Device Package: 48-HVQFN (7x7)
GPIO: 29
Modulation: 2FSK, GFSK, GMSK, MSK
RF Family/Standard: 802.15.4, Bluetooth
Serial Interfaces: ADC, CANbus, GPIO, I2C, SPI, UART
на замовлення 1300 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 546.69 грн |
| 10+ | 409.35 грн |
| 25+ | 380.08 грн |
| 100+ | 336.92 грн |
| S9S08SG16E1WTG |
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Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 16-TSSOP
Number of I/O: 12
DigiKey Programmable: Not Verified
на замовлення 768 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 107+ | 213.58 грн |
| TJA1057BTK/0J |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 4516 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 7+ | 49.84 грн |
| 10+ | 34.13 грн |
| 25+ | 30.60 грн |
| 100+ | 25.14 грн |
| 250+ | 23.43 грн |
| 500+ | 22.39 грн |
| 1000+ | 21.19 грн |
| 2500+ | 21.08 грн |
| TJA1057CTK/0J |
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Виробник: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
Description: IC TRANSCEIVER HALF 1/1 8HVSON
Packaging: Cut Tape (CT)
Package / Case: 8-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-HVSON (3x3)
Receiver Hysteresis: 300 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 78.33 грн |
| 10+ | 56.61 грн |
| 25+ | 49.92 грн |
| 100+ | 37.23 грн |
| 250+ | 32.60 грн |
| 500+ | 29.40 грн |
| 1000+ | 25.69 грн |
| 2500+ | 22.19 грн |
| PZU20B2,115 |
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на замовлення 66120 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 10804+ | 2.27 грн |
| PCA9530D,112 |
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Виробник: NXP USA Inc.
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I2C, SMBus
Supplier Device Package: 8-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Frequency: 400kHz
Description: IC LED DRVR LINEAR I2C 25MA 8SO
Number of Outputs: 2
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Voltage - Supply (Max): 5.5V
Voltage - Supply (Min): 2.3V
Dimming: I2C, SMBus
Supplier Device Package: 8-SO
Internal Switch(s): Yes
Current - Output / Channel: 25mA
Applications: Backlight
Operating Temperature: -40°C ~ 85°C (TA)
Type: Linear
Frequency: 400kHz
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