Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (36145) > Сторінка 580 з 603

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MC33778ASA1AE MC33778ASA1AE NXP USA Inc. Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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MC33778ATA1AE MC33778ATA1AE NXP USA Inc. Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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RD-K358WBMU NXP USA Inc. Description: RD-K358WBMU
Packaging: Bulk
Contents: Board(s)
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NT4PLDJUK/20038YZ NT4PLDJUK/20038YZ NXP USA Inc. NTAGXDNADS.pdf Description: WLCSP16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
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NT4PLDJUK/20038YZ NT4PLDJUK/20038YZ NXP USA Inc. NTAGXDNADS.pdf Description: WLCSP16
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
на замовлення 8480 шт:
термін постачання 21-31 дні (днів)
3+133.79 грн
10+111.41 грн
25+105.12 грн
100+90.56 грн
250+85.70 грн
500+82.27 грн
1000+77.74 грн
5000+71.03 грн
Мінімальне замовлення: 3
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MC35FS6517NAER2 MC35FS6517NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6517NAE MC35FS6517NAE NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC9S08EL16CTLR MC9S08EL16CTLR NXP USA Inc. MC9S08EL32AD.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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SPF5020AMBACESR2 NXP USA Inc. Description: PMIC -3 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
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SC33PF8100CCESR2 NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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SC33PF8100JCESR2 NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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SC33PF8200KCESR2 NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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MVR5510AMBA4TSR2 NXP USA Inc. VR5510.pdf Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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74ABT125N,602 74ABT125N,602 NXP USA Inc. 74ABT125_DS_Rev6.pdf Description: IC BUFFER NON-INVERT 5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 14-DIP
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MIMX9321CVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9312XVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322CVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9321XVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322XVXXMBB NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322XVXXMAC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322XVXXMBC NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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TJA1120AHN/0J NXP USA Inc. AUTO-ETHERNETBR.pdf Description: ICETHERNET PHY TXRX 36-HVQFN
Packaging: Tape & Reel (TR)
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TJA1120AHN/0J NXP USA Inc. AUTO-ETHERNETBR.pdf Description: ICETHERNET PHY TXRX 36-HVQFN
Packaging: Cut Tape (CT)
на замовлення 1044 шт:
термін постачання 21-31 дні (днів)
2+260.72 грн
10+189.04 грн
25+173.50 грн
100+146.80 грн
250+139.16 грн
500+134.55 грн
1000+128.61 грн
Мінімальне замовлення: 2
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74HCT125N,652 74HCT125N,652 NXP USA Inc. 74HC_HCT125_Rev5.pdf Description: IC BUFFER NON-INVERT 5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
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MC68302AG33C MC68302AG33C NXP USA Inc. MC68302TIMING.pdf Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
на замовлення 170 шт:
термін постачання 21-31 дні (днів)
5+4704.71 грн
Мінімальне замовлення: 5
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MC68340CAG25E MC68340CAG25E NXP USA Inc. MC68340UM.pdf Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
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P3H2841HN-ARD NXP USA Inc. Description: P3H2841HN-ARD
Packaging: Bulk
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MCIMX31DVMN5D NXP USA Inc. FSCLS05432-1.pdf?t.download=true&u=5oefqw Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
3+7239.40 грн
Мінімальне замовлення: 3
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LFJ34INTPQA NXP USA Inc. Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
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MCIMX6D6AVT08AD MCIMX6D6AVT08AD NXP USA Inc. IMX6DQAEC.pdf Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
1+5046.40 грн
10+4044.10 грн
60+3794.05 грн
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QN9083DUKZ QN9083DUKZ NXP USA Inc. QN908x.pdf Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
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QN9083DUKZ QN9083DUKZ NXP USA Inc. QN908x.pdf Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 1990 шт:
термін постачання 21-31 дні (днів)
1+697.27 грн
10+582.83 грн
25+552.05 грн
100+478.40 грн
250+454.63 грн
500+437.85 грн
1000+415.14 грн
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MC34PF1550A2EP MC34PF1550A2EP NXP USA Inc. PF1550.pdf Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
1+399.66 грн
10+294.18 грн
25+271.52 грн
100+231.36 грн
490+213.64 грн
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MC908QT1AMDWE MC908QT1AMDWE NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QT1AMDWER MC908QT1AMDWER NXP USA Inc. MC68HC908QY4A.pdf Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCIMX6U1AVM08AC MCIMX6U1AVM08AC NXP USA Inc. IMX6SDLAEC.pdf Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 859 шт:
термін постачання 21-31 дні (днів)
1+2975.18 грн
10+2348.40 грн
60+2145.99 грн
В кошику  од. на суму  грн.
P2041NSN7MMC P2041NSN7MMC NXP USA Inc. P2040_Rev2.pdf Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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MCIMX6L8DVN10AA MCIMX6L8DVN10AA NXP USA Inc. IMX6SLCEC.pdf Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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FS32K148UJT0VMHR FS32K148UJT0VMHR NXP USA Inc. S32K1xx.pdf Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
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IP4284CZ10-TB,115 IP4284CZ10-TB,115 NXP USA Inc. IP4284CZ10-TB_TT_Rev02.pdf Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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MCF5483CVR166 MCF5483CVR166 NXP USA Inc. MCF5485EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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TJA1465B-EVB NXP USA Inc. Description: TJA1465B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1465B
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MCDXTM4CK344 NXP USA Inc. Description: MCDXTM4CK344
Packaging: Bulk
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SAF4000EL/101Q53BY NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tape & Reel (TR)
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FS32K148HET0VLLT FS32K148HET0VLLT NXP USA Inc. S32K1xx.pdf Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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PCAL9722HNHP PCAL9722HNHP NXP USA Inc. PCAL9722.pdf Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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PCAL9722HN/Q900HP PCAL9722HN/Q900HP NXP USA Inc. PCAL9722.pdf Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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A3T19H455W23SR6 NXP USA Inc. A3T19H455W23S.pdf Description: RF MOSFET
Packaging: Bulk
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
2+10749.32 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
LS1048ASN7PTA LS1048ASN7PTA NXP USA Inc. LS1088AFS.pdf Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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PCA9511ADP,118 PCA9511ADP,118 NXP USA Inc. PCA9511A.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
на замовлення 100000 шт:
термін постачання 21-31 дні (днів)
2500+81.89 грн
5000+77.20 грн
7500+76.38 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9511ADP,118 PCA9511ADP,118 NXP USA Inc. PCA9511A.pdf Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
на замовлення 103223 шт:
термін постачання 21-31 дні (днів)
3+159.52 грн
10+113.64 грн
25+103.63 грн
100+86.92 грн
250+82.00 грн
500+79.03 грн
1000+75.33 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC56F8122VFAE MC56F8122VFAE NXP USA Inc. MC56F8322.pdf Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
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T2081NSN8T1B NXP USA Inc. T2080FS.pdf Description: QORIQ T2080 AND T2081 MULTICORE
Packaging: Bulk
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
1+25483.27 грн
В кошику  од. на суму  грн.
MKV30F64VLF10 MKV30F64VLF10 NXP USA Inc. KV30P64M100SFA.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
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P3H2840HN-ARD NXP USA Inc. Description: P3H2840HN-ARD
Packaging: Bulk
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LFINTPL3QA NXP USA Inc. Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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MX95LP4XEVK-15CM NXP USA Inc. Description: MX95LP4XEVK-15CM
Packaging: Bulk
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MPXV10GC7U MPXV10GC7U NXP USA Inc. MPX10.pdf Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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MIMXRT1181CVP2C MIMXRT1181CVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 82
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MIMXRT1182CVP2C MIMXRT1182CVP2C NXP USA Inc. IMXRT1180EC.pdf Description: IC
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 82
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MC33778ASA1AE
MC33778ASA1AE
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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MC33778ATA1AE
MC33778ATA1AE
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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RD-K358WBMU
Виробник: NXP USA Inc.
Description: RD-K358WBMU
Packaging: Bulk
Contents: Board(s)
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NT4PLDJUK/20038YZ NTAGXDNADS.pdf
NT4PLDJUK/20038YZ
Виробник: NXP USA Inc.
Description: WLCSP16
Packaging: Tape & Reel (TR)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
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NT4PLDJUK/20038YZ NTAGXDNADS.pdf
NT4PLDJUK/20038YZ
Виробник: NXP USA Inc.
Description: WLCSP16
Packaging: Cut Tape (CT)
Package / Case: 16-UFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -40°C ~ 105°C (TA)
Standards: ISO 14443-4, ISO 7816-4, NFC
Supplier Device Package: 16-WLCSP (1.84x1.87)
на замовлення 8480 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+133.79 грн
10+111.41 грн
25+105.12 грн
100+90.56 грн
250+85.70 грн
500+82.27 грн
1000+77.74 грн
5000+71.03 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
MC35FS6517NAER2 35FS4500-35FS6500-ASILB.pdf
MC35FS6517NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS6517NAE 35FS4500-35FS6500-ASILB.pdf
MC35FS6517NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC9S08EL16CTLR MC9S08EL32AD.pdf
MC9S08EL16CTLR
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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SPF5020AMBACESR2
Виробник: NXP USA Inc.
Description: PMIC -3 HIGH PERFORMANCE BUCKS
Packaging: Tape & Reel (TR)
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SC33PF8100CCESR2
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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SC33PF8100JCESR2
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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SC33PF8200KCESR2
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tape & Reel (TR)
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MVR5510AMBA4TSR2 VR5510.pdf
Виробник: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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74ABT125N,602 74ABT125_DS_Rev6.pdf
74ABT125N,602
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 14-DIP
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MIMX9321CVXXMAC IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9312XVXXMAC IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322CVXXMAC IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9321XVXXMAC IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 1, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322XVXXMBB IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322XVXXMAC IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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MIMX9322XVXXMBC IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA9
Packaging: Tray
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE, NPU
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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TJA1120AHN/0J AUTO-ETHERNETBR.pdf
Виробник: NXP USA Inc.
Description: ICETHERNET PHY TXRX 36-HVQFN
Packaging: Tape & Reel (TR)
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TJA1120AHN/0J AUTO-ETHERNETBR.pdf
Виробник: NXP USA Inc.
Description: ICETHERNET PHY TXRX 36-HVQFN
Packaging: Cut Tape (CT)
на замовлення 1044 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+260.72 грн
10+189.04 грн
25+173.50 грн
100+146.80 грн
250+139.16 грн
500+134.55 грн
1000+128.61 грн
Мінімальне замовлення: 2
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74HCT125N,652 74HC_HCT125_Rev5.pdf
74HCT125N,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 14-DIP
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MC68302AG33C MC68302TIMING.pdf
MC68302AG33C
Виробник: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 144LQFP
Packaging: Bulk
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: M68000
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
на замовлення 170 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+4704.71 грн
Мінімальне замовлення: 5
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MC68340CAG25E MC68340UM.pdf
MC68340CAG25E
Виробник: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32
Voltage - I/O: 5.0V
Supplier Device Package: 144-LQFP (20x20)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: USART
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P3H2841HN-ARD
Виробник: NXP USA Inc.
Description: P3H2841HN-ARD
Packaging: Bulk
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MCIMX31DVMN5D FSCLS05432-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: I.MX31 32-BIT MPU, ARM1136JF-S C
Packaging: Bulk
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+7239.40 грн
Мінімальне замовлення: 3
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LFJ34INTPQA
Виробник: NXP USA Inc.
Description: QORIVVA MPC5634M ON A 208 BGA TO
Packaging: Bulk
Module/Board Type: Socket Adapter
Utilized IC / Part: MPC5634M
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MCIMX6D6AVT08AD IMX6DQAEC.pdf
MCIMX6D6AVT08AD
Виробник: NXP USA Inc.
Description: IC MPU I.MX6D 852MHZ 624FCBGA
Packaging: Tray
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 852MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 182 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+5046.40 грн
10+4044.10 грн
60+3794.05 грн
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QN9083DUKZ QN908x.pdf
QN9083DUKZ
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Tape & Reel (TR)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
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QN9083DUKZ QN908x.pdf
QN9083DUKZ
Виробник: NXP USA Inc.
Description: IC RF TXRX+MCU BLE 47WLSCP
Packaging: Cut Tape (CT)
Package / Case: 47-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 32MHz
Memory Size: 512kB Flash, 256kB ROM, 128kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 3.6V
Power - Output: 2dBm
Protocol: Bluetooth v5.0
Current - Receiving: 5mA
Data Rate (Max): 16Mbps
Current - Transmitting: 3.5mA
Supplier Device Package: 47-WLSCP (3.28x3.2)
Modulation: FSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART, USART, USB
DigiKey Programmable: Not Verified
на замовлення 1990 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+697.27 грн
10+582.83 грн
25+552.05 грн
100+478.40 грн
250+454.63 грн
500+437.85 грн
1000+415.14 грн
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MC34PF1550A2EP PF1550.pdf
MC34PF1550A2EP
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC: 3 BUCK REGS
Packaging: Tray
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3.8V ~ 7V
Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
Supplier Device Package: 40-HVQFN (5x5)
на замовлення 490 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+399.66 грн
10+294.18 грн
25+271.52 грн
100+231.36 грн
490+213.64 грн
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MC908QT1AMDWE MC68HC908QY4A.pdf
MC908QT1AMDWE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QT1AMDWER MC68HC908QY4A.pdf
MC908QT1AMDWER
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 8-SO
Number of I/O: 5
DigiKey Programmable: Not Verified
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MCIMX6U1AVM08AC IMX6SDLAEC.pdf
MCIMX6U1AVM08AC
Виробник: NXP USA Inc.
Description: IC MPU I.MX6DL 800MHZ 624MAPBGA
Packaging: Tray
Package / Case: 624-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-MAPBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
на замовлення 859 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+2975.18 грн
10+2348.40 грн
60+2145.99 грн
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P2041NSN7MMC P2040_Rev2.pdf
P2041NSN7MMC
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P2 1.2GHZ 780FCPBGA
Packaging: Tray
Package / Case: 780-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500mc
Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCPBGA (23x23)
Ethernet: 10/100/1000Mbps (5), 10Gbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 4 Core, 32-Bit
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, RapidIO, SPI
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MCIMX6L8DVN10AA IMX6SLCEC.pdf
MCIMX6L8DVN10AA
Виробник: NXP USA Inc.
Description: IC MPU I.MX6SL 1.0GHZ 432MAPBGA
Packaging: Tray
Package / Case: 432-TFBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.2V, 1.8V, 3.0V
Supplier Device Package: 432-MAPBGA (13x13)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Additional Interfaces: AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
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FS32K148UJT0VMHR S32K1xx.pdf
FS32K148UJT0VMHR
Виробник: NXP USA Inc.
Description: S32K148 ARM CORTEX-M4F, 112 MHZ,
Packaging: Tape & Reel (TR)
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 112MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 89
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IP4284CZ10-TB,115 IP4284CZ10-TB_TT_Rev02.pdf
IP4284CZ10-TB,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: General Purpose
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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MCF5483CVR166 MCF5485EC.pdf
MCF5483CVR166
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 166MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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TJA1465B-EVB
Виробник: NXP USA Inc.
Description: TJA1465B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1465B
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MCDXTM4CK344
Виробник: NXP USA Inc.
Description: MCDXTM4CK344
Packaging: Bulk
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SAF4000EL/101Q53BY
Виробник: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tape & Reel (TR)
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FS32K148HET0VLLT S32K1xx.pdf
FS32K148HET0VLLT
Виробник: NXP USA Inc.
Description: S32K148 32-BIT MCU, ARM CORTEX-M
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b SAR; D/A 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 156
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PCAL9722HNHP PCAL9722.pdf
PCAL9722HNHP
Виробник: NXP USA Inc.
Description: PCAL9722HN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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PCAL9722HN/Q900HP PCAL9722.pdf
PCAL9722HN/Q900HP
Виробник: NXP USA Inc.
Description: PCAL9722HN/Q900
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Supplier Device Package: 32-HVQFN (5x5)
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A3T19H455W23SR6 A3T19H455W23S.pdf
Виробник: NXP USA Inc.
Description: RF MOSFET
Packaging: Bulk
на замовлення 990 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+10749.32 грн
Мінімальне замовлення: 2
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LS1048ASN7PTA LS1088AFS.pdf
LS1048ASN7PTA
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.4GHZ 780FBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 105°C
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 780-FBGA (23x23)
Ethernet: 10GbE (2), 1GbE (8)
USB: USB 3.0 (2) + PHY
Number of Cores/Bus Width: 4 Core, 64-Bit
RAM Controllers: DDR4
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (1)
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PCA9511ADP,118 PCA9511A.pdf
PCA9511ADP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
на замовлення 100000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+81.89 грн
5000+77.20 грн
7500+76.38 грн
Мінімальне замовлення: 2500
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PCA9511ADP,118 PCA9511A.pdf
PCA9511ADP,118
Виробник: NXP USA Inc.
Description: IC ACCELERATR I2C HOTSWAP 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, Accelerator
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: I2C - Hotswap
Current - Supply: 6mA
Data Rate (Max): 400kHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 7 pF
на замовлення 103223 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+159.52 грн
10+113.64 грн
25+103.63 грн
100+86.92 грн
250+82.00 грн
500+79.03 грн
1000+75.33 грн
Мінімальне замовлення: 3
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MC56F8122VFAE MC56F8322.pdf
MC56F8122VFAE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (16K x 16)
RAM Size: 4K x 16
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 56800E
Data Converters: A/D 6x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.25V ~ 3.6V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 21
DigiKey Programmable: Verified
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T2081NSN8T1B T2080FS.pdf
Виробник: NXP USA Inc.
Description: QORIQ T2080 AND T2081 MULTICORE
Packaging: Bulk
на замовлення 98 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+25483.27 грн
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MKV30F64VLF10 KV30P64M100SFA.pdf
MKV30F64VLF10
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 2x16b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
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P3H2840HN-ARD
Виробник: NXP USA Inc.
Description: P3H2840HN-ARD
Packaging: Bulk
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LFINTPL3QA
Виробник: NXP USA Inc.
Description: 144 PIN 0.5MM EQFP TO 208 1.0MM
Packaging: Bulk
Module/Board Type: Socket Module - PGA
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MX95LP4XEVK-15CM
Виробник: NXP USA Inc.
Description: MX95LP4XEVK-15CM
Packaging: Bulk
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MPXV10GC7U MPX10.pdf
MPXV10GC7U
Виробник: NXP USA Inc.
Description: SENSOR 1.45PSIG 0.13" .035V 8DIP
Features: Temperature Compensated
Packaging: Tube
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Output Type: Wheatstone Bridge
Mounting Type: Through Hole
Output: 0 mV ~ 35 mV (3V)
Operating Pressure: 1.45PSI (10kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: PC Pin
Voltage - Supply: 3V ~ 6V
Port Size: Male - 0.13" (3.18mm) Tube
Applications: Board Mount
Supplier Device Package: 8-DIP
Port Style: Barbless
Maximum Pressure: 10.88PSI (75kPa)
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MIMXRT1181CVP2C IMXRT1180EC.pdf
MIMXRT1181CVP2C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 82
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MIMXRT1182CVP2C IMXRT1180EC.pdf
MIMXRT1182CVP2C
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 144-LFBGA
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TJ)
Oscillator Type: Internal
Program Memory Type: ROM
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 30x16b SAR; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 0.9V ~ 1.15V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART
Peripherals: Crypto - AES, DMA, PWM, RSA, SHA, TRNG, WDT
Supplier Device Package: 144-LFBGA (10x10)
Number of I/O: 82
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