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MBMI7014TA2AER2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZADR2 NXP USA Inc. Description: AUTO SBC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZAD NXP USA Inc. Description: AUTO SBC
Packaging: Tray
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MBMI7014TA2AE MBMI7014TA2AE NXP USA Inc. BMI7014-MIM-PSP-TEST.pdf Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
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MCXN235VDFR NXP USA Inc. MCXN23x.pdf Description: IC
Packaging: Tape & Reel (TR)
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SC33FS8520DVKSR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: FS8500
Packaging: Tape & Reel (TR)
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MIMX9101DVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121DVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB NXP USA Inc. IMX91FAMFS.pdf Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MFS2300BMBA0EPR2 MFS2300BMBA0EPR2 NXP USA Inc. FS23DS.pdf Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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MC9S12E256VPVE MC9S12E256VPVE NXP USA Inc. MC9S12E256V1.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MIMX8UD7DVP08SC MIMX8UD7DVP08SC NXP USA Inc. IMX8ULPIEC.pdf Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 563 шт:
термін постачання 21-31 дні (днів)
1+1434.25 грн
10+1102.25 грн
25+1032.47 грн
100+897.01 грн
250+862.72 грн
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MIMX8MN2DVTJZAA MIMX8MN2DVTJZAA NXP USA Inc. IMX8MNCEC.pdf Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
1+1949.11 грн
10+1512.40 грн
25+1421.24 грн
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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PCA9460AUKZ PCA9460AUKZ NXP USA Inc. PCA9460.pdf Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
на замовлення 3336 шт:
термін постачання 21-31 дні (днів)
2+290.03 грн
10+211.19 грн
25+194.16 грн
100+164.68 грн
250+156.30 грн
500+151.26 грн
1000+144.69 грн
2500+140.38 грн
Мінімальне замовлення: 2
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MC32PF4210A4ESR2 MC32PF4210A4ESR2 NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC32PF4210A4ES MC32PF4210A4ES NXP USA Inc. PF4210.pdf Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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PCAL9539AHF,128 PCAL9539AHF,128 NXP USA Inc. PCAL9539A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BTS6201UJ BTS6201UJ NXP USA Inc. BTS6201U.pdf Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
на замовлення 5823 шт:
термін постачання 21-31 дні (днів)
2+276.65 грн
10+229.95 грн
25+217.37 грн
100+187.77 грн
250+178.04 грн
500+171.17 грн
1000+161.99 грн
Мінімальне замовлення: 2
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CWA-VSPA--FL NXP USA Inc. Description: IC
Packaging: Bulk
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ZK-HC08AX-A NXP USA Inc. Description: MC68HC908AB/AS/AZ EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908AB/AS/AZ
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74HC10N,652 74HC10N,652 NXP USA Inc. 74HC_HCT10_Rev_Oct2000.pdf Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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MRFE6S9160HSR3 MRFE6S9160HSR3 NXP USA Inc. MRFE6S9160HR3H%28S%29R3.pdf Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
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SE050D2HQ1/Z01PAZ NXP USA Inc. Description: SE050D2HQ1/Z01PAZ
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC35FS4505NAER2 MC35FS4505NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE MC35FS4505NAE NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC50XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEKR2 MC22XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC50XS4200DEK MC50XS4200DEK NXP USA Inc. MC20XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEKR2 MC17XS6400DEKR2 NXP USA Inc. MC07XS6517.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC20XS4200DFK MC20XS4200DFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEK MC22XS4200DEK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEK MC17XS6400DEK NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC06XS4200DFKR2 MC06XS4200DFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 12mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 12A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
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MGD3162AM551EKT MGD3162AM551EKT NXP USA Inc. SDS_GD3162.pdf Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
на замовлення 836 шт:
термін постачання 21-31 дні (днів)
1+796.53 грн
10+600.58 грн
25+559.02 грн
176+468.49 грн
352+454.90 грн
528+448.09 грн
В кошику  од. на суму  грн.
NAFE11348B40BSK NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34DCH NXP USA Inc. 74AUP3G34.pdf Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
716+29.92 грн
Мінімальне замовлення: 716
В кошику  од. на суму  грн.
LS2084ASE7V17B NXP USA Inc. LS2084A%2C%20LS2044A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
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SPC5747GK0AVKU6 SPC5747GK0AVKU6 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB MPC8349VVAJDB NXP USA Inc. Description: IC MPU 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Supplier Device Package: 672-LBGA (35x35)
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PCA1626U/F2,026 NXP USA Inc. PCA16XX.pdf Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB MIMX8QM5CVUFFAB NXP USA Inc. Download?colCode=IMX8QMAEC&amp;location=null Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PEMI2STD/LM,115 PEMI2STD/LM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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PCA9509PGM,125 PCA9509PGM,125 NXP USA Inc. PCA9509P.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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PCA9509PGM,125 PCA9509PGM,125 NXP USA Inc. PCA9509P.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
на замовлення 3822 шт:
термін постачання 21-31 дні (днів)
6+61.01 грн
10+42.25 грн
25+38.02 грн
100+31.36 грн
250+29.29 грн
500+28.04 грн
1000+26.57 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MPC8378CVRAGDA NXP USA Inc. FSCLS11905-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 1937 шт:
термін постачання 21-31 дні (днів)
5+4910.38 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
88W8897PB1-NMJC/AZ NXP USA Inc. Description: 88W8897PB1-NMJC/AZ
Packaging: Bulk
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PCA9846PWJ PCA9846PWJ NXP USA Inc. PCA9846.pdf Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+91.55 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9846PWJ PCA9846PWJ NXP USA Inc. PCA9846.pdf Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 3516 шт:
термін постачання 21-31 дні (днів)
2+176.36 грн
10+126.04 грн
25+115.09 грн
100+96.79 грн
250+91.79 грн
Мінімальне замовлення: 2
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S32K328NHT1MJBSR NXP USA Inc. S32K3xx.pdf Description: IC MCU
Packaging: Tape & Reel (TR)
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MC56F81646VLFR MC56F81646VLFR NXP USA Inc. MC56F81XXXL.pdf Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SFS2633AMDGCADR2 NXP USA Inc. Description: FS2600
Packaging: Tape & Reel (TR)
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MBMI7014TA2AER2
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZADR2
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
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SFS2633AMDDZAD
Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tray
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MBMI7014TA2AE BMI7014-MIM-PSP-TEST.pdf
MBMI7014TA2AE
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: I2C, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
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MCXN235VDFR MCXN23x.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
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SC33FS8520DVKSR2 FS84_FS85C_DS.pdf
Виробник: NXP USA Inc.
Description: FS8500
Packaging: Tape & Reel (TR)
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MIMX9101DVXXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9101CVXXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121DVVXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9121CVVXCAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111DVXXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9111CVXXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 208-VFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 208-FCBGA (15x15)
Ethernet: GbE (1)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131DVVXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MIMX9131CVVXJAB IMX91FAMFS.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Bulk
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 1.4GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: GbE (2)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: RGB
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPDIF, SPI, UART
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MFS2300BMBA0EPR2 FS23DS.pdf
MFS2300BMBA0EPR2
Виробник: NXP USA Inc.
Description: MFS2300BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5.5V ~ 40V
Applications: System Basis Chip
Current - Supply: 40µA
Supplier Device Package: 48-HVQFN (7x7)
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MC9S12E256VPVE MC9S12E256V1.pdf
MC9S12E256VPVE
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 16x10b; D/A 2x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.75V
Connectivity: EBI/EMI, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified
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MIMX8UD7DVP08SC IMX8ULPIEC.pdf
MIMX8UD7DVP08SC
Виробник: NXP USA Inc.
Description: I.MX8ULP, DUAL 800MHZ
Packaging: Tray
Package / Case: 485-LFBGA
Mounting Type: Surface Mount
Supplier Device Package: 485-LFBGA (15x15)
на замовлення 563 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1434.25 грн
10+1102.25 грн
25+1032.47 грн
100+897.01 грн
250+862.72 грн
В кошику  од. на суму  грн.
MIMX8MN2DVTJZAA IMX8MNCEC.pdf
MIMX8MN2DVTJZAA
Виробник: NXP USA Inc.
Description: IC MPU I.MX8MN 1.5GHZ 486LFBGA
Packaging: Tray
Package / Case: 486-LFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.5GHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A53
Supplier Device Package: 486-LFBGA (14x14)
Ethernet: GbE
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 64-Bit
Co-Processors/DSP: ARM® Cortex®-M7
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: LCD, MIPI-CSI, MIPI-DSI
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Additional Interfaces: I2C, PCIe, SDHC, SPI, UART
на замовлення 122 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1949.11 грн
10+1512.40 грн
25+1421.24 грн
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Виробник: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Tape & Reel (TR)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
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PCA9460AUKZ PCA9460.pdf
PCA9460AUKZ
Виробник: NXP USA Inc.
Description: POWER MANAGE IC (PMIC) FOR I.MX
Packaging: Cut Tape (CT)
Package / Case: 42-UFBGA, WLCSP
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Microcontroller, MCU
Supplier Device Package: 42-WLCSP (2.86x2.46)
на замовлення 3336 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+290.03 грн
10+211.19 грн
25+194.16 грн
100+164.68 грн
250+156.30 грн
500+151.26 грн
1000+144.69 грн
2500+140.38 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
MC32PF4210A4ESR2 PF4210.pdf
MC32PF4210A4ESR2
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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MC32PF4210A4ES PF4210.pdf
MC32PF4210A4ES
Виробник: NXP USA Inc.
Description: PF4210
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 4.5V
Applications: Audio, Video
Supplier Device Package: 56-QFN-EP (8x8)
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PCAL9539AHF,128 PCAL9539A.pdf
PCAL9539AHF,128
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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BTS6201UJ BTS6201U.pdf
BTS6201UJ
Виробник: NXP USA Inc.
Description: BTS6201U
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 4.2GHz
RF Type: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Gain: 31.5dB
Current - Supply: 95mA
Noise Figure: 3.4dB
P1dB: 27dBm
Test Frequency: 3.5GHz
Supplier Device Package: 16-HVQFN (3x3)
на замовлення 5823 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+276.65 грн
10+229.95 грн
25+217.37 грн
100+187.77 грн
250+178.04 грн
500+171.17 грн
1000+161.99 грн
Мінімальне замовлення: 2
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CWA-VSPA--FL
Виробник: NXP USA Inc.
Description: IC
Packaging: Bulk
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ZK-HC08AX-A
Виробник: NXP USA Inc.
Description: MC68HC908AB/AS/AZ EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: HC08
Utilized IC / Part: MC68HC908AB/AS/AZ
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74HC10N,652 74HC_HCT10_Rev_Oct2000.pdf
74HC10N,652
Виробник: NXP USA Inc.
Description: IC GATE NAND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NAND Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 16ns @ 6V, 50pF
Number of Circuits: 3
Current - Quiescent (Max): 2 µA
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MRFE6S9160HSR3 MRFE6S9160HR3H%28S%29R3.pdf
MRFE6S9160HSR3
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 28V NI780
Packaging: Tape & Reel (TR)
Package / Case: NI-780S
Mounting Type: Chassis Mount
Frequency: 880MHz
Power - Output: 35W
Gain: 21dB
Technology: LDMOS
Supplier Device Package: NI-780S
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 1.2 A
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SE050D2HQ1/Z01PAZ
Виробник: NXP USA Inc.
Description: SE050D2HQ1/Z01PAZ
Packaging: Bulk
DigiKey Programmable: Not Verified
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MC35FS4505NAER2 35FS4500-35FS6500-ASILB.pdf
MC35FS4505NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE 35FS4500-35FS6500-ASILB.pdf
MC35FS4505NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC22XS4200.pdf
MC50XS4200DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEKR2 MC22XS4200.pdf
MC22XS4200DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC50XS4200DEK MC20XS4200.pdf
MC50XS4200DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEKR2 MC07XS6517.pdf
MC17XS6400DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFKR2 MC22XS4200.pdf
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC20XS4200DFK MC22XS4200.pdf
MC20XS4200DFK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEK MC22XS4200.pdf
MC22XS4200DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEK MC12XS6D3.pdf
MC17XS6400DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFK MC22XS4200.pdf
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC06XS4200DFKR2 MC22XS4200.pdf
MC06XS4200DFKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 12mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 12A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
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MGD3162AM551EKT SDS_GD3162.pdf
MGD3162AM551EKT
Виробник: NXP USA Inc.
Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
на замовлення 836 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+796.53 грн
10+600.58 грн
25+559.02 грн
176+468.49 грн
352+454.90 грн
528+448.09 грн
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NAFE11348B40BSK NAFE11388.pdf
Виробник: NXP USA Inc.
Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NAFE11388.pdf
Виробник: NXP USA Inc.
Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34.pdf
74AUP3G34DCH
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
716+29.92 грн
Мінімальне замовлення: 716
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LS2084ASE7V17B LS2084A%2C%20LS2044A.pdf
Виробник: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
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SPC5747GK0AVKU6 MPC5646C.pdf
SPC5747GK0AVKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB
MPC8349VVAJDB
Виробник: NXP USA Inc.
Description: IC MPU 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Supplier Device Package: 672-LBGA (35x35)
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PCA1626U/F2,026 PCA16XX.pdf
Виробник: NXP USA Inc.
Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB Download?colCode=IMX8QMAEC&amp;location=null
MIMX8QM5CVUFFAB
Виробник: NXP USA Inc.
Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PEMI2STD/LM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LM,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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PCA9509PGM,125 PCA9509P.pdf
PCA9509PGM,125
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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PCA9509PGM,125 PCA9509P.pdf
PCA9509PGM,125
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
на замовлення 3822 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+61.01 грн
10+42.25 грн
25+38.02 грн
100+31.36 грн
250+29.29 грн
500+28.04 грн
1000+26.57 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MPC8378CVRAGDA FSCLS11905-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 1937 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+4910.38 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
88W8897PB1-NMJC/AZ
Виробник: NXP USA Inc.
Description: 88W8897PB1-NMJC/AZ
Packaging: Bulk
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PCA9846PWJ PCA9846.pdf
PCA9846PWJ
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+91.55 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9846PWJ PCA9846.pdf
PCA9846PWJ
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 3516 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+176.36 грн
10+126.04 грн
25+115.09 грн
100+96.79 грн
250+91.79 грн
Мінімальне замовлення: 2
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S32K328NHT1MJBSR S32K3xx.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
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MC56F81646VLFR MC56F81XXXL.pdf
MC56F81646VLFR
Виробник: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SFS2633AMDGCADR2
Виробник: NXP USA Inc.
Description: FS2600
Packaging: Tape & Reel (TR)
товару немає в наявності
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