Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (37072) > Сторінка 583 з 618

Виробник: NXP USA Inc.
Description: TRANSISTOR NPN 60V 1A SOT89
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: 8ULP, DUAL CORTEX A35
Packaging: Tray
Package / Case: 512-VFBGA
Mounting Type: Surface Mount
Speed: 800MHz, 216MHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A35, ARM® Cortex®-M33F
Voltage - I/O: 1.8V
Supplier Device Package: 512-VFBGA (9.4x9.4)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: DSP, GPU, Multimedia; NEON™ SIMD
RAM Controllers: LPDDR3, LPDDR4, LPDDR4x
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-CSI, MIPI-DSI
Security Features: A-HAB, ARM TZ, CAAM, Cryptography, eFuse, Random Number Generator, Secure Memory, Secure RTC, System JTAG
Additional Interfaces: AC'97, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PDM, SAI, SDHC, SPDIF, SPI, UART

Виробник: NXP USA Inc.
Description: RF MOSFET DFN
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: MPC5668G EVAL BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply, Accessories
Core Processor: e200
Utilized IC / Part: MPC5668G

Виробник: NXP USA Inc.
Description: IC MEDIA PROC 143MHZ 292-HBGA
Packaging: Tray
Package / Case: 292-HBGA
Mounting Type: Surface Mount
Interface: I2C, 2-Wire Serial
RAM Size: 48K x 8
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 2.375V ~ 2.625V
Controller Series: Nexperia
Applications: Multimedia
Core Processor: TriMedia™
Supplier Device Package: 292-BGA
Number of I/O: 169
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC GATE NOR 2CH 4-INP 14-SO
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: DIODE ZENER DUAL 5V TO236AB
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: TVS DIODE 5VWM 33VC SOD323
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 833MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 833MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI

Виробник: NXP USA Inc.
Description: NMH1000 FREEDOM SHIELD EVAL BRD
Packaging: Box
Function: Magnetic
Type: Sensor
Contents: Board(s)
Utilized IC / Part: NMH1000

Виробник: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16-TSSOP
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16TSSOP
Packaging: Tube

Виробник: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16SSOP
Packaging: Tube

Виробник: NXP USA Inc.
Description: IC QUAD 2-IN MUX 16SOIC
Packaging: Tube

Виробник: NXP USA Inc.
Description: MFS2305BMMA0EPR2
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)

Виробник: NXP USA Inc.
Description: MFS2305BMMA0EP
Packaging: Bulk
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 120°C
Voltage - Supply: 3.3V, 5V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)

Виробник: NXP USA Inc.
Description: MFS2322BMBA0EPR2
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: MFS2323BMBA0EPR2
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)

Виробник: NXP USA Inc.
Description: MFS2322BMBA0EP
Packaging: Tray

Виробник: NXP USA Inc.
Description: NPM8 INDUSTRIAL PRESSURE MONITOR
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: MFS2323BMBA0EP
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 48-HVQFN (7x7)

Виробник: NXP USA Inc.
Description: IC MCU 32BIT EXT MEM 289MAPBGA
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: DIODE SWITCH 100V 0.25A SOD323
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: IC VIDEO LEVEL SHIFTER 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Shifter
Voltage - Supply: 3.0V ~ 3.6V
Applications: Consumer Video
Standards: DVI v1.0, HDMI v1.4b
Supplier Device Package: 32-HVQFN (5x5)
Control Interface: I2C

Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SO

Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP

Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP

Виробник: NXP USA Inc.
Description: TRANS 2NPN 40V 0.2A 6TSSOP
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32SOIC
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Interface: CAN, LIN
Voltage - Supply: 5.5V ~ 28V
Applications: System Basis Chip
Supplier Device Package: 32-SSOP-EP

Виробник: NXP USA Inc.
Description: IC FF D-TYPE 1-ELE 8-BIT 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8

Виробник: NXP USA Inc.
Description: IC INV 2-CIR 2-IN 6-X2SON
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.65V ~ 5.5V
Current - Output High, Low: 32mA, 32mA
Number of Inputs: 2
Supplier Device Package: 6-X2SON (1.0x0.8)
Input Logic Level - High: 1.7V ~ 2V
Input Logic Level - Low: 0.7V ~ 0.8V
Max Propagation Delay @ V, Max CL: 3.8ns @ 5V, 50pF
Number of Circuits: 2
Current - Quiescent (Max): 4 µA

Виробник: NXP USA Inc.
Description: IC DUAL INVERTER 6XSON
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: IC 20-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Supplier Device Package: 20-SSOP

Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34

Виробник: NXP USA Inc.
Description: S12Z CPU, 128K FLASH
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S12Z
Data Converters: A/D 10x10b, 10x12b; D/A 1x8b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Connectivity: CANbus, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34

Виробник: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14SOIC
Packaging: Tube

Виробник: NXP USA Inc.
Description: IC SWITCH QUAD 1X2 14TSSOP
Packaging: Tube
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 35Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-TSSOP
Voltage - Supply, Single (V+): 1V ~ 6V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Switch Time (Ton, Toff) (Max): 16ns, 28ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 2µA
Number of Circuits: 4

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 16KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: SCI, SPI
Peripherals: DMA, POR, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SC-101, SOT-883
Size / Dimension: 0.039" L x 0.024" W (1.00mm x 0.60mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 25dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 1

Виробник: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 100LFBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 68x10b, 31x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Grade: Automotive
Number of I/O: 65
Qualification: AEC-Q100

Виробник: NXP USA Inc.
Description: IC MCU 32B 1.5MB FLASH 100MAPBGA
Packaging: Tray
Package / Case: 100-LFBGA
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: e200z2, e200z4
Data Converters: A/D 36x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI
Peripherals: DMA, I2S, POR, WDT
Supplier Device Package: 100-MAPBGA (11x11)
Number of I/O: 65
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: 32-BIT MICROCONTROLLERS - MCU MC
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN-EP (9x9)
Number of I/O: 33
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: AUTO SBC
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Current - Supply: 30µA
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive

Виробник: NXP USA Inc.
Description: PMIC, DUAL CHANNEL VPRE REGULATO
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: PMIC,DUAL CHANNEL VPRE REGULATOR
Packaging: Tray

Виробник: NXP USA Inc.
Description: IC INV 6-CIR 1-IN 14-SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA

Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage

Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tray
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 900MHz, 250MHz
Operating Temperature: 0°C ~ 95°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART

Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tray

Виробник: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 8.5pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 2

Виробник: NXP USA Inc.
Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)

Виробник: NXP USA Inc.
Description: IC TRANSLATION TXRX 3.6V 24TSSOP
Packaging: Tube
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 1
Logic Type: Translation Transceiver
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 12mA, 12mA
Supplier Device Package: 24-TSSOP

Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12X
Data Converters: A/D 16x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 1 X 3:8 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Circuit: 1 x 3:8
Type: Decoder/Demultiplexer
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Independent Circuits: 1
Current - Output High, Low: 5.2mA, 5.2mA
Voltage Supply Source: Single Supply
Supplier Device Package: 16-SSOP

Виробник: NXP USA Inc.
Description: IC PLL W/VCO 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC PLL W/VCO 16SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 21MHz
Type: Phase Lock Loop (PLL)
Input: Clock
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Differential - Input:Output: No/No
Supplier Device Package: 16-SSOP
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: IC PHASE LOCK LOOP W/VCO 16SOIC
Packaging: Tube
DigiKey Programmable: Not Verified

Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 40V 500MA TO236AB
Packaging: Tape & Reel (TR)