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MGD3160AM335EKR2 MGD3160AM335EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
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MGD3160AM335EKR2 MGD3160AM335EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 995 шт:
термін постачання 21-31 дні (днів)
1+680.66 грн
10+510.64 грн
25+474.44 грн
100+407.91 грн
250+390.12 грн
500+379.39 грн
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MGD3160AM535EKR2 MGD3160AM535EKR2 NXP USA Inc. GD3160.pdf Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 697 шт:
термін постачання 21-31 дні (днів)
1+680.66 грн
10+510.64 грн
25+474.44 грн
100+407.91 грн
250+390.12 грн
500+379.39 грн
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MC33GD3100BEKR2 MC33GD3100BEKR2 NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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MC33GD3100A3EKR2 MC33GD3100A3EKR2 NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MC33GD3100EKR2 MC33GD3100EKR2 NXP USA Inc. MC33GD3100_SDS.pdf Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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S32M27XEVB-L064 S32M27XEVB-L064 NXP USA Inc. S32M27XEVB-L064.pdf Description: S32M27XEVB-L064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M27X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
1+14813.03 грн
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S32M27XEVB-C064 S32M27XEVB-C064 NXP USA Inc. S32M27XEVB-L064.pdf Description: S32M27XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M27X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+14813.03 грн
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FRDM-IMX8MPLUS FRDM-IMX8MPLUS NXP USA Inc. FRDMIMX8MPLUSQSG.pdf Description: FRDM-IMX8MPLUS
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Utilized IC / Part: i.MX 8M Plus
Platform: Freedom
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SAF7755HV/N207WY NXP USA Inc. Description: CAR DISP
Packaging: Bulk
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MPXY8020A6U MPXY8020A6U NXP USA Inc. MPXY8000.pdf description Description: SENSOR TIRE PRESS MONITOR 8-SSOP
Packaging: Tube
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74LV125D,112 74LV125D,112 NXP USA Inc. 74LV125.pdf Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 14-SO
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SC33FS8530E1KS NXP USA Inc. FS84_FS85C_DS.pdf Description: FS8510
Packaging: Tray
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SC34PF8100F8EPR2 NXP USA Inc. Description: PMIC, I.MX8, PRE-PROG ,7 BUCK, 4
Packaging: Tape & Reel (TR)
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SC34PF8100F8EP NXP USA Inc. Description: PMIC, I.MX8, PRE-PROG ,7 BUCK, 4
Packaging: Tray
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MC33FS8425G0ESR2 MC33FS8425G0ESR2 NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8425G0ES MC33FS8425G0ES NXP USA Inc. FS84_FS85C_DS.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MSC7116VM1000 MSC7116VM1000 NXP USA Inc. MSC7116.pdf Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I2C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
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FS32K142HFT0MLLR FS32K142HFT0MLLR NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K142HAT0MLLR FS32K142HAT0MLLR NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K142HFT0MLHT FS32K142HFT0MLHT NXP USA Inc. Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MRF6V2150NR1 MRF6V2150NR1 NXP USA Inc. MRF6V2150N%28B%29R1.pdf Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
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MFS5600AMEA0ESR2 MFS5600AMEA0ESR2 NXP USA Inc. FS5600.pdf Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023AVNA0ESR2 MPF5023AVNA0ESR2 NXP USA Inc. PF5023.pdf Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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S912ZVMC64AWKHR S912ZVMC64AWKHR NXP USA Inc. Description: S12Z CORE,64K FLASH,CAN,64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
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C912ZVMC64L0WKHR NXP USA Inc. Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
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TLVH431ACDBZR,215 TLVH431ACDBZR,215 NXP USA Inc. TLVH431_Family.pdf Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
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MC68SEC000FU16 MC68SEC000FU16 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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74LVTH32245EC,518 74LVTH32245EC,518 NXP USA Inc. DS_568_74LVTH32245.pdf Description: IC TXRX NON-INVERT 3.6V 96-LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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MIMX9332CVVXMACR NXP USA Inc. IMX93IEC.pdf Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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SC33771CTA1MAER2 SC33771CTA1MAER2 NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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SC33771CTA1MAE SC33771CTA1MAE NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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PBLS4004V,115 PBLS4004V,115 NXP USA Inc. PBLS4004Y_PBLS4004V.pdf Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
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PBLS4005V,115 PBLS4005V,115 NXP USA Inc. PBLS4005Y_PBLS4005V.pdf Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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MVR5510AVMAHTS NXP USA Inc. VR5510.pdf Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC68331CPV16 MC68331CPV16 NXP USA Inc. MC68331.pdf Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 18
DigiKey Programmable: Not Verified
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PCA9306DC1Z PCA9306DC1Z NXP USA Inc. PCA9306.pdf Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
на замовлення 2165 шт:
термін постачання 21-31 дні (днів)
6+65.42 грн
10+45.21 грн
25+40.76 грн
100+33.64 грн
250+31.45 грн
500+30.13 грн
1000+29.56 грн
Мінімальне замовлення: 6
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MCXA344VFM NXP USA Inc. MCXAFS.pdf Description: MCXA20-256, 32QFN
Packaging: Tray
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74ALVCH16825DGG112 74ALVCH16825DGG112 NXP USA Inc. 74ALVCH16825.pdf Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 9
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
на замовлення 875 шт:
термін постачання 21-31 дні (днів)
178+120.87 грн
Мінімальне замовлення: 178
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S32E288AACAAMJGT S32E288AACAAMJGT NXP USA Inc. S32Z27_DS.pdf Description: IC
Packaging: Tray
Mounting Type: Surface Mount
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
1+9159.09 грн
10+7437.28 грн
40+6946.63 грн
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MF3E23A1DUF/01Z NXP USA Inc. MF3E(H)x3_SDS.pdf Description: IC
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: PLLMC
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MIMX9596DVTXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 15X15 COMMERCIAL
Packaging: Tray
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MIMX9596CVTXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 15X15 INDUSTRIAL
Packaging: Tray
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MIMX9596XVTXNBC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
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MIMX9596XVTXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
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MIMX9596DVZXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 19X19 NO-LID COMMERCIAL
Packaging: Tray
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MIMX9596CVZXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 19X19 NO-LID INDUSTRIAL
Packaging: Tray
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MIMX9596XVZXNBC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
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MIMX9596XVZXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
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MIMX9596AVZXNAC NXP USA Inc. IMX91CEC.pdf Description: I.MX95 19X19 NO-LID AUTO
Packaging: Tray
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IMX95-OS08A20 NXP USA Inc. Description: OS08A20 CAMERA 8MP MIPI-CSI
Packaging: Bulk
Function: Camera
Type: Sensor
Contents: Board(s)
Utilized IC / Part: OS08A20
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MC68HC908AP64CB MC68HC908AP64CB NXP USA Inc. MC68HC908AP64.pdf Description: IC MCU 8BIT 64KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 30
DigiKey Programmable: Not Verified
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NCJ3321AHF/00100Y NCJ3321AHF/00100Y NXP USA Inc. NCF3321FS.pdf Description: NCJ3321AHF
Packaging: Tape & Reel (TR)
Package / Case: 40-WFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HWQFN (5x5)
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MC9S08AC32MPUE MC9S08AC32MPUE NXP USA Inc. PHGL-S-A0002263322-1.pdf?t.download=true&u=5oefqw Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 894 шт:
термін постачання 21-31 дні (днів)
43+492.67 грн
Мінімальне замовлення: 43
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MC9S08AC32MFUE MC9S08AC32MFUE NXP USA Inc. MC9S08AC60AD.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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74HC112N,652 74HC112N,652 NXP USA Inc. 74HC_HCT112_Rev_Oct2000.pdf Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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74HCT112N,652 74HCT112N,652 NXP USA Inc. 74HC_HCT112.pdf Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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MCIMX31LDVMN5DR2 MCIMX31LDVMN5DR2 NXP USA Inc. MCIMX31_5.pdf Description: IC MPU I.MX31 532MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
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MC33PF8100EPTS NXP USA Inc. PF8100_PF8200.pdf Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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MIMX8QP5AVUFEAB MIMX8QP5AVUFEAB NXP USA Inc. IMX8QP1P3AEC.pdf Description: MIMX8QP5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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MGD3160AM335EKR2 GD3160.pdf
MGD3160AM335EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
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MGD3160AM335EKR2 GD3160.pdf
MGD3160AM335EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 995 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+680.66 грн
10+510.64 грн
25+474.44 грн
100+407.91 грн
250+390.12 грн
500+379.39 грн
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MGD3160AM535EKR2 GD3160.pdf
MGD3160AM535EKR2
Виробник: NXP USA Inc.
Description: EV INVERTER CONTROL; IGBT & SIC
Packaging: Cut Tape (CT)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: PWM, SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 4.5V ~ 40V
Rds On (Typ): 500mOhm LS, 500mOhm HS
Applications: DC-DC Converters
Current - Output / Channel: 15A
Current - Peak Output: 15A
Technology: Power MOSFET, IGBT
Supplier Device Package: 32-SOIC
Fault Protection: Over Temperature, Short Circuit
Load Type: Inductive, Capacitive, Resistive
Grade: Automotive
Qualification: AEC-Q100
на замовлення 697 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+680.66 грн
10+510.64 грн
25+474.44 грн
100+407.91 грн
250+390.12 грн
500+379.39 грн
В кошику  од. на суму  грн.
MC33GD3100BEKR2 MC33GD3100_SDS.pdf
MC33GD3100BEKR2
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
Qualification: AEC-Q100
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MC33GD3100A3EKR2 MC33GD3100_SDS.pdf
MC33GD3100A3EKR2
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.3V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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MC33GD3100EKR2 MC33GD3100_SDS.pdf
MC33GD3100EKR2
Виробник: NXP USA Inc.
Description: IC GATE DRVR HALF-BRIDGE 32SOIC
Packaging: Tape & Reel (TR)
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V
Supplier Device Package: 32-SOIC
Channel Type: Single
Driven Configuration: Half-Bridge
Number of Drivers: 1
Gate Type: IGBT, MOSFET (N-Channel)
Current - Peak Output (Source, Sink): 15A, 15A
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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S32M27XEVB-L064 S32M27XEVB-L064.pdf
S32M27XEVB-L064
Виробник: NXP USA Inc.
Description: S32M27XEVB-L064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M27X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14813.03 грн
В кошику  од. на суму  грн.
S32M27XEVB-C064 S32M27XEVB-L064.pdf
S32M27XEVB-C064
Виробник: NXP USA Inc.
Description: S32M27XEVB-C064
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: S32M27X
Primary Attributes: Motors (BLDC, PMSM)
Embedded: Yes, MCU, 32-Bit
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+14813.03 грн
В кошику  од. на суму  грн.
FRDM-IMX8MPLUS FRDMIMX8MPLUSQSG.pdf
FRDM-IMX8MPLUS
Виробник: NXP USA Inc.
Description: FRDM-IMX8MPLUS
Packaging: Bulk
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: ARM® Cortex®-A53, Cortex®-M7
Utilized IC / Part: i.MX 8M Plus
Platform: Freedom
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SAF7755HV/N207WY
Виробник: NXP USA Inc.
Description: CAR DISP
Packaging: Bulk
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MPXY8020A6U description MPXY8000.pdf
MPXY8020A6U
Виробник: NXP USA Inc.
Description: SENSOR TIRE PRESS MONITOR 8-SSOP
Packaging: Tube
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74LV125D,112 74LV125.pdf
74LV125D,112
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 14-SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5.5V
Number of Bits per Element: 1
Current - Output High, Low: 16mA, 16mA
Supplier Device Package: 14-SO
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SC33FS8530E1KS FS84_FS85C_DS.pdf
Виробник: NXP USA Inc.
Description: FS8510
Packaging: Tray
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SC34PF8100F8EPR2
Виробник: NXP USA Inc.
Description: PMIC, I.MX8, PRE-PROG ,7 BUCK, 4
Packaging: Tape & Reel (TR)
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SC34PF8100F8EP
Виробник: NXP USA Inc.
Description: PMIC, I.MX8, PRE-PROG ,7 BUCK, 4
Packaging: Tray
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MC33FS8425G0ESR2 FS84_FS85C_DS.pdf
MC33FS8425G0ESR2
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC33FS8425G0ES FS84_FS85C_DS.pdf
MC33FS8425G0ES
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: System Basis Chip
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MSC7116VM1000 MSC7116.pdf
MSC7116VM1000
Виробник: NXP USA Inc.
Description: DSP 16BIT W/DDR CTRLR 400-MAPBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Interface: Host Interface, I2C, UART
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (8kB)
On-Chip RAM: 400kB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 266MHz
Supplier Device Package: 400-LFBGA (17x17)
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FS32K142HFT0MLLR
FS32K142HFT0MLLR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K142HAT0MLLR
FS32K142HAT0MLLR
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 89
DigiKey Programmable: Not Verified
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FS32K142HFT0MLHT
FS32K142HFT0MLHT
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b SAR; D/A1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 58
DigiKey Programmable: Not Verified
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MRF6V2150NR1 MRF6V2150N%28B%29R1.pdf
MRF6V2150NR1
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V TO270-4
Packaging: Tape & Reel (TR)
Package / Case: TO-270AB
Mounting Type: Surface Mount
Frequency: 220MHz
Power - Output: 150W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: TO-270 WB-4
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 450 mA
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MFS5600AMEA0ESR2 FS5600.pdf
MFS5600AMEA0ESR2
Виробник: NXP USA Inc.
Description: DUAL 36V AUTOMOTIVE DC-DC CONTRO
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 36V
Current - Supply: 140µA
Supplier Device Package: 32-HVQFN (5x5)
Grade: Automotive
Qualification: AEC-Q100
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MPF5023AVNA0ESR2 PF5023.pdf
MPF5023AVNA0ESR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC, PRE-PROG, 3
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 200µA
Supplier Device Package: 40-HVQFN (6x6)
Grade: Automotive
Qualification: AEC-Q100
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S912ZVMC64AWKHR
S912ZVMC64AWKHR
Виробник: NXP USA Inc.
Description: S12Z CORE,64K FLASH,CAN,64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S12Z
Data Converters: A/D 9x12b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Connectivity: CANbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 64-HLQFP (10x10)
Number of I/O: 31
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C912ZVMC64L0WKHR
Виробник: NXP USA Inc.
Description: 16-BIT MICROCONTROLLERS
Packaging: Tape & Reel (TR)
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TLVH431ACDBZR,215 TLVH431_Family.pdf
TLVH431ACDBZR,215
Виробник: NXP USA Inc.
Description: IC VREF SHUNT ADJ 1% TO236AB
Tolerance: ±1%
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Adjustable
Mounting Type: Surface Mount
Reference Type: Shunt
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: SOT-23 (TO-236AB)
Voltage - Output (Min/Fixed): 1.24V
Current - Cathode: 80 µA
Current - Output: 70 mA
Voltage - Output (Max): 18 V
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MC68SEC000FU16 MC68SEC000.pdf
MC68SEC000FU16
Виробник: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
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74LVTH32245EC,518 DS_568_74LVTH32245.pdf
74LVTH32245EC,518
Виробник: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 96-LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 96-LFBGA
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 4
Logic Type: Transceiver, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Number of Bits per Element: 8
Current - Output High, Low: 32mA, 64mA
Supplier Device Package: 96-LFBGA (13.5x5.5)
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MIMX9332CVVXMACR IMX93IEC.pdf
Виробник: NXP USA Inc.
Description: I.MX93 BGA11
Packaging: Tape & Reel (TR)
Package / Case: 306-LFBGA
Mounting Type: Surface Mount
Speed: 250MHz, 1.7GHz
Operating Temperature: -40°C ~ 105°C (TJ)
Core Processor: ARM® Cortex®-A55, ARM® Cortex®-M33
Voltage - I/O: 1.8V
Supplier Device Package: 306-LFBGA (11x11)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 OTG (2)
Number of Cores/Bus Width: 2, 1 Core, 64-Bit
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: LCD, LVDS, MIPI-CSI, MIPI-DSI
Security Features: Boot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Additional Interfaces: CANbus, DMA, GPIO, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, SPDIF, SPI, UART
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SC33771CTA1MAER2
SC33771CTA1MAER2
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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SC33771CTA1MAE
SC33771CTA1MAE
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 7 ~ 14
Mounting Type: Surface Mount
Function: Multi-Function Controller
Interface: SPI
Operating Temperature: -40°C ~ 105°C (TA)
Battery Chemistry: Lithium Ion
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Temperature, Over/Under Voltage
Grade: Automotive
Qualification: AEC-Q100
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PBLS4004V,115 PBLS4004Y_PBLS4004V.pdf
PBLS4004V,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 22kOhms
Resistor - Emitter Base (R2): 22kOhms
Supplier Device Package: SOT-666
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PBLS4005V,115 PBLS4005Y_PBLS4005V.pdf
PBLS4005V,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 40V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 80 @ 5mA, 5V / 150 @ 100mA, 2V
Frequency - Transition: 300MHz
Resistor - Base (R1): 47kOhms
Resistor - Emitter Base (R2): 47kOhms
Supplier Device Package: SOT-666
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MVR5510AVMAHTS VR5510.pdf
Виробник: NXP USA Inc.
Description: PMIC, 3BUCK , 3 LDOS,BOOST
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
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MC68331CPV16 MC68331.pdf
MC68331CPV16
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 18
DigiKey Programmable: Not Verified
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PCA9306DC1Z PCA9306.pdf
PCA9306DC1Z
Виробник: NXP USA Inc.
Description: IC XLTR VL BIDIR 8-VSSOP
Features: Auto-Direction Sensing
Packaging: Cut Tape (CT)
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 105°C (TA)
Supplier Device Package: 8-VSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Number of Circuits: 1
на замовлення 2165 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+65.42 грн
10+45.21 грн
25+40.76 грн
100+33.64 грн
250+31.45 грн
500+30.13 грн
1000+29.56 грн
Мінімальне замовлення: 6
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MCXA344VFM MCXAFS.pdf
Виробник: NXP USA Inc.
Description: MCXA20-256, 32QFN
Packaging: Tray
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74ALVCH16825DGG112 74ALVCH16825.pdf
74ALVCH16825DGG112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 56-TSSOP
Packaging: Bulk
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.2V ~ 3.6V
Number of Bits per Element: 9
Current - Output High, Low: 24mA, 24mA
Supplier Device Package: 56-TSSOP
на замовлення 875 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
178+120.87 грн
Мінімальне замовлення: 178
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S32E288AACAAMJGT S32Z27_DS.pdf
S32E288AACAAMJGT
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Mounting Type: Surface Mount
на замовлення 200 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+9159.09 грн
10+7437.28 грн
40+6946.63 грн
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MF3E23A1DUF/01Z MF3E(H)x3_SDS.pdf
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Transponder
Operating Temperature: -25°C ~ 85°C (TA)
Standards: ISO 14443A, ISO 7816-4, Mifare, NFC
Supplier Device Package: PLLMC
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MIMX9596DVTXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 15X15 COMMERCIAL
Packaging: Tray
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MIMX9596CVTXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 15X15 INDUSTRIAL
Packaging: Tray
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MIMX9596XVTXNBC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
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MIMX9596XVTXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 15X15 EXTENDED INDUSTRIAL
Packaging: Tray
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MIMX9596DVZXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID COMMERCIAL
Packaging: Tray
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MIMX9596CVZXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID INDUSTRIAL
Packaging: Tray
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MIMX9596XVZXNBC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
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MIMX9596XVZXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID EXTENDED IND
Packaging: Tray
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MIMX9596AVZXNAC IMX91CEC.pdf
Виробник: NXP USA Inc.
Description: I.MX95 19X19 NO-LID AUTO
Packaging: Tray
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IMX95-OS08A20
Виробник: NXP USA Inc.
Description: OS08A20 CAMERA 8MP MIPI-CSI
Packaging: Bulk
Function: Camera
Type: Sensor
Contents: Board(s)
Utilized IC / Part: OS08A20
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MC68HC908AP64CB MC68HC908AP64.pdf
MC68HC908AP64CB
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 42DIP
Packaging: Tube
Package / Case: 42-SDIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 8MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, IRSCI, SCI, SPI
Peripherals: LED, LVD, POR, PWM
Supplier Device Package: 42-PDIP
Number of I/O: 30
DigiKey Programmable: Not Verified
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NCJ3321AHF/00100Y NCF3321FS.pdf
NCJ3321AHF/00100Y
Виробник: NXP USA Inc.
Description: NCJ3321AHF
Packaging: Tape & Reel (TR)
Package / Case: 40-WFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Supplier Device Package: 40-HWQFN (5x5)
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MC9S08AC32MPUE PHGL-S-A0002263322-1.pdf?t.download=true&u=5oefqw
MC9S08AC32MPUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 894 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
43+492.67 грн
Мінімальне замовлення: 43
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MC9S08AC32MFUE MC9S08AC60AD.pdf
MC9S08AC32MFUE
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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74HC112N,652 74HC_HCT112_Rev_Oct2000.pdf
74HC112N,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Negative Edge
Clock Frequency: 71 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 1
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74HCT112N,652 74HC_HCT112.pdf
74HCT112N,652
Виробник: NXP USA Inc.
Description: IC FF JK TYPE DOUBLE 1BIT 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 2
Function: Set(Preset) and Reset
Type: JK Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Current - Quiescent (Iq): 4 µA
Current - Output High, Low: 4mA, 4mA
Trigger Type: Negative Edge
Clock Frequency: 64 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 35ns @ 4.5V, 50pF
Number of Bits per Element: 1
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MCIMX31LDVMN5DR2 MCIMX31_5.pdf
MCIMX31LDVMN5DR2
Виробник: NXP USA Inc.
Description: IC MPU I.MX31 532MHZ 473LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 473-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V
Supplier Device Package: 473-LFBGA (19x19)
USB: USB 2.0 (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, MPEG-4, VFP
RAM Controllers: DDR
Graphics Acceleration: Yes
Display & Interface Controllers: Keyboard, Keypad, LCD
Security Features: Random Number Generator, RTIC, Secure Fusebox, Secure JTAG, Secure Memory
Additional Interfaces: 1-Wire, AC97, ATA, FIR, I2C, I2S, MMC/SD/SDIO, MSHC, PCMCIA, SDHC, SIM, SPI, SSI, UART
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MC33PF8100EPTS PF8100_PF8200.pdf
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 10µA
Supplier Device Package: 56-HVQFN (8x8)
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MIMX8QP5AVUFEAB IMX8QP1P3AEC.pdf
MIMX8QP5AVUFEAB
Виробник: NXP USA Inc.
Description: MIMX8QP5AVUFEAB
Packaging: Bulk
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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