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PCA9564D,112 PCA9564D,112 NXP USA Inc. PCA9564.pdf Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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PCA9564D,118 PCA9564D,118 NXP USA Inc. PCA9564.pdf Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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74HC241D,652 74HC241D,652 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241D,653 74HC241D,653 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241DB,112 74HC241DB,112 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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74HCT241PW,118 74HCT241PW,118 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFF NON-INVERT 5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
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74HCT241D,652 74HCT241D,652 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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74HCT241DB,112 74HCT241DB,112 NXP USA Inc. 74HC_HCT241.pdf Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
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PCA9501D,118 PCA9501D,118 NXP USA Inc. PCA9501.pdf Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Packaging: Tape & Reel (TR)
Features: EEPROM, POR
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PEMI6QFN/HT,132 PEMI6QFN/HT,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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MPC555LFAZP40 MPC555LFAZP40 NXP USA Inc. MPC555PB.pdf Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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SPC5747CFK0ACKU6 NXP USA Inc. MPC5748G.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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BCP53,115 NXP USA Inc. BCP53_SER.pdf Description: TRANSISTOR PNP 80V 1A SOT-223
Packaging: Tape & Reel (TR)
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MAC97A8,412 NXP USA Inc. MAC97A8.pdf description Description: TRIAC SENS GATE 600V 0.6A TO92-3
Packaging: Bulk
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SAF4000EL/101Q53BK NXP USA Inc. Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tray
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MC68HC16Z1MAG16 MC68HC16Z1MAG16 NXP USA Inc. MC68HC16ZUM.pdf Description: IC MCU 16BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 16
DigiKey Programmable: Not Verified
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BT152-600R,127 NXP USA Inc. BT152B-400R%26600R.pdf Description: THYRISTOR 20A 650V TO220AB
Packaging: Tube
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Z0107NA,412 NXP USA Inc. Z0107NA.pdf Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
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MC25XS6300BEKR2 MC25XS6300BEKR2 NXP USA Inc. MC12XS6D2.pdf Description: IC SWITCH HIGH SIDE 32SOIC
Packaging: Tape & Reel (TR)
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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N74F02N,602 N74F02N,602 NXP USA Inc. DS_568_74F02.pdf Description: IC GATE NOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Number of Circuits: 4
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BCM856BS,115 NXP USA Inc. Description: TRANS 2PNP 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BCM857BS,115 NXP USA Inc. BCM857BS.pdf Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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MFS8612BMDA0ESR2 MFS8612BMDA0ESR2 NXP USA Inc. FS8600_SDS.pdf Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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74HC377D,652 74HC377D,652 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,118 74HC377PW,118 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,112 74HC377PW,112 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74AHC377PW,118 74AHC377PW,118 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC OCT D FF POS-EDG TRIG 20TSSOP
Packaging: Tape & Reel (TR)
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74AHC377D,118 74AHC377D,118 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tape & Reel (TR)
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74AHC377PW,112 74AHC377PW,112 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC OCTAL D F-F POS-EDG 20-TSSOP
Packaging: Tube
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74AHC377D,112 74AHC377D,112 NXP USA Inc. 74AHC_AHCT377.pdf Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tube
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74HC377DB,118 74HC377DB,118 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377DB,112 74HC377DB,112 NXP USA Inc. 74HC_HCT377.pdf Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC4066PW,118 74LVC4066PW,118 NXP USA Inc. 74LVC4066.pdf Description: IC SWITCH QUAD SPST 14TSSOP
Packaging: Tape & Reel (TR)
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74LVC4066PW,112 74LVC4066PW,112 NXP USA Inc. 74LVC4066.pdf Description: IC SWITCH QUAD SPST 14TSSOP
Packaging: Tube
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OM11043,598 OM11043,598 NXP USA Inc. OM11043_Web.pdf Description: MBED LPC176X DEV EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1768
Platform: mbed
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LD6806CX4/18P,315 LD6806CX4/18P,315 NXP USA Inc. LD6806_Series.pdf Description: IC REG LINEAR 1.8V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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TJA1041T/N1,112 TJA1041T/N1,112 NXP USA Inc. TJA1041.pdf Description: IC CAN TRANSCEIVER HS 14-SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
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MC68332ACEH25 MC68332ACEH25 NXP USA Inc. MC68332UM_ZIP.zip Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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ADC0804S030TS/C1,1 ADC0804S030TS/C1,1 NXP USA Inc. ADC0804S030_040_050.pdf Description: IC ADC 8BIT PAR 30MHZ 28-SSOP
Packaging: Tape & Reel (TR)
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ADC0804S040TS/C1,1 ADC0804S040TS/C1,1 NXP USA Inc. ADC0804S030_040_050.pdf Description: IC ADC 8BIT PAR 40MHZ 28-SSOP
Packaging: Tape & Reel (TR)
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ADC0804S050TS/C1,1 ADC0804S050TS/C1,1 NXP USA Inc. ADC0804S030_040_050.pdf Description: IC ADC 8BIT PAR 50MHZ 28-SSOP
Packaging: Tape & Reel (TR)
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ADC0804S050/DB NXP USA Inc. Description: BOARD EVALUATION FOR ADC0804S050
Packaging: Box
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74LVC138ADB,118 74LVC138ADB,118 NXP USA Inc. 74LVC138A.pdf Description: IC 3-8 DECOD/DEMUX INV 16SSOP
Packaging: Tape & Reel (TR)
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74LVC138AD,112 74LVC138AD,112 NXP USA Inc. 74LVC138A.pdf Description: IC DECODER/DEMUX 3-8 INV 16SOIC
Packaging: Tube
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74LVC138ADB,112 74LVC138ADB,112 NXP USA Inc. 74LVC138A.pdf Description: IC 3-8 DECOD/DEMUX INV 16SSOP
Packaging: Tube
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BAS70-04,215 BAS70-04,215 NXP USA Inc. BAS70-05.pdf Description: DIODE SCHOTTKY 70V 70MA TO236AB
Packaging: Tape & Reel (TR)
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IP4283CZ10-TB,115 IP4283CZ10-TB,115 NXP USA Inc. IP4283CZ10.pdf Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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IP4283CZ10-TB,115 IP4283CZ10-TB,115 NXP USA Inc. IP4283CZ10.pdf Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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LPC1115JBD48/303QL LPC1115JBD48/303QL NXP USA Inc. LPC1102_1104.pdf Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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LPC1115JET48/303QL LPC1115JET48/303QL NXP USA Inc. LPC111X.pdf Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 42
DigiKey Programmable: Not Verified
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1N4733A,113 1N4733A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 5.1V 1W DO41
Packaging: Tape & Reel (TR)
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TJA1051AT/3/0Z TJA1051AT/3/0Z NXP USA Inc. Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
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SPC5777CK2MME3 SPC5777CK2MME3 NXP USA Inc. MPC5777C-Datasheet.pdf Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
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1N4729A,113 1N4729A,113 NXP USA Inc. 1N4728A_SER.pdf Description: DIODE ZENER 3.6V 1W DO41
Packaging: Tape & Reel (TR)
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BYV32E-100,127 BYV32E-100,127 NXP USA Inc. BYV32E-100.pdf Description: DIODE ARRAY 100V 20A TO220AB
Packaging: Tube
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BYV32EB-200,118 BYV32EB-200,118 NXP USA Inc. BYV32EB-200.pdf Description: DIODE ARRAY 200V 20A D2PAK
Packaging: Tape & Reel (TR)
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PCAL9538APWJ PCAL9538APWJ NXP USA Inc. PCAL9538A.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PCAL9538APWJ PCAL9538APWJ NXP USA Inc. PCAL9538A.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2255 шт:
термін постачання 21-31 дні (днів)
3+129.36 грн
10+91.50 грн
25+83.28 грн
100+69.69 грн
250+65.65 грн
500+63.22 грн
1000+60.98 грн
Мінімальне замовлення: 3
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TDA7052AT/N2,118 TDA7052AT/N2,118 NXP USA Inc. TDA7052A_AT.pdf Description: VOLUME CONTROL CIRCUIT, 1 CHANNE
Features: Depop, Mute, Short-Circuit and Thermal Protection, Volume Control
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 18V
Max Output Power x Channels @ Load: 550mW x 1 @ 16Ohm
Supplier Device Package: 8-SO
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PEMI6QFN/HR,132 PEMI6QFN/HR,132 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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PCA9564D,112 PCA9564.pdf
PCA9564D,112
Виробник: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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PCA9564D,118 PCA9564.pdf
PCA9564D,118
Виробник: NXP USA Inc.
Description: IC CONTROLLER PARALLEL INTERFACE
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: Parallel
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 3.6V
Current - Supply: 6mA
Protocol: I2C
Supplier Device Package: 20-SO
DigiKey Programmable: Not Verified
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74HC241D,652 74HC_HCT241.pdf
74HC241D,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241D,653 74HC_HCT241.pdf
74HC241D,653
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERTING 6V 20-SO
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SO
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74HC241DB,112 74HC_HCT241.pdf
74HC241DB,112
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 4
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 20-SSOP
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74HCT241PW,118 74HC_HCT241.pdf
74HCT241PW,118
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-TSSOP
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74HCT241D,652 74HC_HCT241.pdf
74HCT241D,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 5.5V 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SO
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74HCT241DB,112 74HC_HCT241.pdf
74HCT241DB,112
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 5.5V 20-SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Number of Bits per Element: 4
Current - Output High, Low: 6mA, 6mA
Supplier Device Package: 20-SSOP
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PCA9501D,118 PCA9501.pdf
PCA9501D,118
Виробник: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 20SO
Packaging: Tape & Reel (TR)
Features: EEPROM, POR
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.6V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 20-SO
Current - Output Source/Sink: 100µA, 25mA
DigiKey Programmable: Not Verified
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PEMI6QFN/HT,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/HT,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 23pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 20dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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MPC555LFAZP40 MPC555PB.pdf
MPC555LFAZP40
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
Packaging: Tray
Package / Case: 272-BBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 448KB (448K x 8)
RAM Size: 26K x 8
Operating Temperature: -55°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 272-PBGA (27x27)
Number of I/O: 101
DigiKey Programmable: Not Verified
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SPC5747CFK0ACKU6 MPC5748G.pdf
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 48x10b, 16x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, Ethernet, I2C, LINbus, SAI, SPI
Peripherals: DMA, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Number of I/O: 129
DigiKey Programmable: Not Verified
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BCP53,115 BCP53_SER.pdf
Виробник: NXP USA Inc.
Description: TRANSISTOR PNP 80V 1A SOT-223
Packaging: Tape & Reel (TR)
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MAC97A8,412 description MAC97A8.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 600V 0.6A TO92-3
Packaging: Bulk
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SAF4000EL/101Q53BK
Виробник: NXP USA Inc.
Description: AUDIO DSPS SAF4000EL/101Q5342
Packaging: Tray
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MC68HC16Z1MAG16 MC68HC16ZUM.pdf
MC68HC16Z1MAG16
Виробник: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 16
DigiKey Programmable: Not Verified
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BT152-600R,127 BT152B-400R%26600R.pdf
Виробник: NXP USA Inc.
Description: THYRISTOR 20A 650V TO220AB
Packaging: Tube
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Z0107NA,412 Z0107NA.pdf
Виробник: NXP USA Inc.
Description: TRIAC SENS GATE 800V 1A TO92-3
Packaging: Bulk
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MC25XS6300BEKR2 MC12XS6D2.pdf
MC25XS6300BEKR2
Виробник: NXP USA Inc.
Description: IC SWITCH HIGH SIDE 32SOIC
Packaging: Tape & Reel (TR)
Features: Status Flag
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Mounting Type: Surface Mount
Number of Outputs: 3
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 25mOhm
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 4.5A
Supplier Device Package: 32-SOIC-EP
Fault Protection: Open Load Detect, Over Temperature
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N74F02N,602 DS_568_74F02.pdf
N74F02N,602
Виробник: NXP USA Inc.
Description: IC GATE NOR 4CH 2-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: NOR Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 2
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.5ns @ 5V, 50pF
Number of Circuits: 4
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BCM856BS,115
Виробник: NXP USA Inc.
Description: TRANS 2PNP 65V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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BCM857BS,115 BCM857BS.pdf
Виробник: NXP USA Inc.
Description: TRANS 2PNP 45V 0.1A 6TSSOP
Packaging: Tape & Reel (TR)
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MFS8612BMDA0ESR2 FS8600_SDS.pdf
MFS8612BMDA0ESR2
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP FOR DOM
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Applications: Camera
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
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74HC377D,652 74HC_HCT377.pdf
74HC377D,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8-BIT 20-SO
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SO
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,118 74HC_HCT377.pdf
74HC377PW,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377PW,112 74HC_HCT377.pdf
74HC377PW,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SGL 8-BIT 20-TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-TSSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74AHC377PW,118 74AHC_AHCT377.pdf
74AHC377PW,118
Виробник: NXP USA Inc.
Description: IC OCT D FF POS-EDG TRIG 20TSSOP
Packaging: Tape & Reel (TR)
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74AHC377D,118 74AHC_AHCT377.pdf
74AHC377D,118
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tape & Reel (TR)
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74AHC377PW,112 74AHC_AHCT377.pdf
74AHC377PW,112
Виробник: NXP USA Inc.
Description: IC OCTAL D F-F POS-EDG 20-TSSOP
Packaging: Tube
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74AHC377D,112 74AHC_AHCT377.pdf
74AHC377D,112
Виробник: NXP USA Inc.
Description: IC D-TYPE POS TRG SNGL 20SOIC
Packaging: Tube
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74HC377DB,118 74HC_HCT377.pdf
74HC377DB,118
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74HC377DB,112 74HC_HCT377.pdf
74HC377DB,112
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 8BIT 20SSOP
Packaging: Tube
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Output Type: Non-Inverted
Mounting Type: Surface Mount
Number of Elements: 1
Function: Standard
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 83 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 20-SSOP
Max Propagation Delay @ V, Max CL: 27ns @ 6V, 50pF
Number of Bits per Element: 8
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74LVC4066PW,118 74LVC4066.pdf
74LVC4066PW,118
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD SPST 14TSSOP
Packaging: Tape & Reel (TR)
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74LVC4066PW,112 74LVC4066.pdf
74LVC4066PW,112
Виробник: NXP USA Inc.
Description: IC SWITCH QUAD SPST 14TSSOP
Packaging: Tube
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OM11043,598 OM11043_Web.pdf
OM11043,598
Виробник: NXP USA Inc.
Description: MBED LPC176X DEV EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s)
Core Processor: ARM® Cortex®-M3
Utilized IC / Part: LPC1768
Platform: mbed
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LD6806CX4/18P,315 LD6806_Series.pdf
LD6806CX4/18P,315
Виробник: NXP USA Inc.
Description: IC REG LINEAR 1.8V 200MA 4-WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 4-XFBGA, WLCSP
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 200mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 4-WLCSP (0.76x0.76)
Voltage - Output (Min/Fixed): 1.8V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.1V @ 200mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
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TJA1041T/N1,112 TJA1041.pdf
TJA1041T/N1,112
Виробник: NXP USA Inc.
Description: IC CAN TRANSCEIVER HS 14-SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
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MC68332ACEH25 MC68332UM_ZIP.zip
MC68332ACEH25
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
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ADC0804S030TS/C1,1 ADC0804S030_040_050.pdf
ADC0804S030TS/C1,1
Виробник: NXP USA Inc.
Description: IC ADC 8BIT PAR 30MHZ 28-SSOP
Packaging: Tape & Reel (TR)
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ADC0804S040TS/C1,1 ADC0804S030_040_050.pdf
ADC0804S040TS/C1,1
Виробник: NXP USA Inc.
Description: IC ADC 8BIT PAR 40MHZ 28-SSOP
Packaging: Tape & Reel (TR)
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ADC0804S050TS/C1,1 ADC0804S030_040_050.pdf
ADC0804S050TS/C1,1
Виробник: NXP USA Inc.
Description: IC ADC 8BIT PAR 50MHZ 28-SSOP
Packaging: Tape & Reel (TR)
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ADC0804S050/DB
Виробник: NXP USA Inc.
Description: BOARD EVALUATION FOR ADC0804S050
Packaging: Box
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74LVC138ADB,118 74LVC138A.pdf
74LVC138ADB,118
Виробник: NXP USA Inc.
Description: IC 3-8 DECOD/DEMUX INV 16SSOP
Packaging: Tape & Reel (TR)
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74LVC138AD,112 74LVC138A.pdf
74LVC138AD,112
Виробник: NXP USA Inc.
Description: IC DECODER/DEMUX 3-8 INV 16SOIC
Packaging: Tube
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74LVC138ADB,112 74LVC138A.pdf
74LVC138ADB,112
Виробник: NXP USA Inc.
Description: IC 3-8 DECOD/DEMUX INV 16SSOP
Packaging: Tube
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BAS70-04,215 BAS70-05.pdf
BAS70-04,215
Виробник: NXP USA Inc.
Description: DIODE SCHOTTKY 70V 70MA TO236AB
Packaging: Tape & Reel (TR)
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IP4283CZ10-TB,115 IP4283CZ10.pdf
IP4283CZ10-TB,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Tape & Reel (TR)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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IP4283CZ10-TB,115 IP4283CZ10.pdf
IP4283CZ10-TB,115
Виробник: NXP USA Inc.
Description: TVS DIODE 5.5VWM 9.5VC 10XSONU
Packaging: Cut Tape (CT)
Package / Case: 10-XFDFN
Mounting Type: Surface Mount
Type: Steering (Rail to Rail)
Operating Temperature: -40°C ~ 85°C (TA)
Applications: HDMI
Voltage - Reverse Standoff (Typ): 5.5V
Supplier Device Package: 10-XSONU (2.5x1)
Unidirectional Channels: 4
Voltage - Breakdown (Min): 6V
Voltage - Clamping (Max) @ Ipp: 9.5V (Typ)
Power Line Protection: Yes
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LPC1115JBD48/303QL LPC1102_1104.pdf
LPC1115JBD48/303QL
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 42
DigiKey Programmable: Not Verified
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LPC1115JET48/303QL LPC111X.pdf
LPC1115JET48/303QL
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 48TFBGA
Packaging: Tray
Package / Case: 48-TFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 48-TFBGA (4.5x4.5)
Number of I/O: 42
DigiKey Programmable: Not Verified
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1N4733A,113 1N4728A_SER.pdf
1N4733A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 5.1V 1W DO41
Packaging: Tape & Reel (TR)
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TJA1051AT/3/0Z
TJA1051AT/3/0Z
Виробник: NXP USA Inc.
Description: IC TRANSCEIVER 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 120 mV
Grade: Automotive
Qualification: AEC-Q100
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SPC5777CK2MME3 MPC5777C-Datasheet.pdf
SPC5777CK2MME3
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 8MB FLASH 416MAPBGA
Packaging: Tray
Package / Case: 416-BGA
Mounting Type: Surface Mount
Speed: 264MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z7
Data Converters: A/D 16b Sigma-Delta, eQADC
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Supplier Device Package: 416-MAPBGA (27x27)
DigiKey Programmable: Not Verified
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1N4729A,113 1N4728A_SER.pdf
1N4729A,113
Виробник: NXP USA Inc.
Description: DIODE ZENER 3.6V 1W DO41
Packaging: Tape & Reel (TR)
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BYV32E-100,127 BYV32E-100.pdf
BYV32E-100,127
Виробник: NXP USA Inc.
Description: DIODE ARRAY 100V 20A TO220AB
Packaging: Tube
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BYV32EB-200,118 BYV32EB-200.pdf
BYV32EB-200,118
Виробник: NXP USA Inc.
Description: DIODE ARRAY 200V 20A D2PAK
Packaging: Tape & Reel (TR)
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PCAL9538APWJ PCAL9538A.pdf
PCAL9538APWJ
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PCAL9538APWJ PCAL9538A.pdf
PCAL9538APWJ
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2255 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+129.36 грн
10+91.50 грн
25+83.28 грн
100+69.69 грн
250+65.65 грн
500+63.22 грн
1000+60.98 грн
Мінімальне замовлення: 3
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TDA7052AT/N2,118 TDA7052A_AT.pdf
TDA7052AT/N2,118
Виробник: NXP USA Inc.
Description: VOLUME CONTROL CIRCUIT, 1 CHANNE
Features: Depop, Mute, Short-Circuit and Thermal Protection, Volume Control
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: 1-Channel (Mono)
Mounting Type: Surface Mount
Type: Class AB
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 18V
Max Output Power x Channels @ Load: 550mW x 1 @ 16Ohm
Supplier Device Package: 8-SO
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PEMI6QFN/HR,132 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI6QFN/HR,132
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 45 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN
Size / Dimension: 0.098" L x 0.047" W (2.50mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 45Ohms, C = 21pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 18dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 45
ESD Protection: Yes
Number of Channels: 6
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