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LPC11U36FBD64/401, LPC11U36FBD64/401, NXP USA Inc. LPC11U3X.pdf Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
1+497.63 грн
10+368.61 грн
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FXLS8971CFR1 FXLS8971CFR1 NXP USA Inc. FXLS8971CF.pdf Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
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FXLS8971CFR1 FXLS8971CFR1 NXP USA Inc. FXLS8971CF.pdf Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
на замовлення 580 шт:
термін постачання 21-31 дні (днів)
2+178.79 грн
5+153.28 грн
10+146.22 грн
25+129.37 грн
50+124.00 грн
100+119.11 грн
500+107.45 грн
Мінімальне замовлення: 2
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KIT-STBI-A8971 KIT-STBI-A8971 NXP USA Inc. UM11910.pdf Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+6649.67 грн
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LPC55S66JEV59Y LPC55S66JEV59Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S66JEV59E LPC55S66JEV59E NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59Y LPC5528JEV59Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59E LPC5528JEV59E NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59Y LPC55S28JEV59Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59E LPC55S28JEV59E NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59Y LPC55S69JEV59Y NXP USA Inc. Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59E LPC55S69JEV59E NXP USA Inc. Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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P1023NXE5CFB NXP USA Inc. P1_Series_FS.pdf Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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MC33FS6518NAER2 MC33FS6518NAER2 NXP USA Inc. F6500%2C%20F4500%20Data%20Short.pdf Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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NCX8200UKZ NCX8200UKZ NXP USA Inc. NCX8200.pdf Description: IC AUDIO SWITCH 9WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)
974+23.56 грн
Мінімальне замовлення: 974
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MPC8541VTAJD MPC8541VTAJD NXP USA Inc. MPC8541EEC.pdf Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
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TJA1465ATK/0J TJA1465ATK/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
6000+64.78 грн
Мінімальне замовлення: 6000
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TJA1465ATK/0J TJA1465ATK/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
3+131.82 грн
10+93.62 грн
25+85.11 грн
100+71.11 грн
250+66.94 грн
500+64.42 грн
1000+61.33 грн
2500+59.18 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TJA1465AT/0Z TJA1465AT/0Z NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+66.57 грн
Мінімальне замовлення: 2500
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TJA1465AT/0Z TJA1465AT/0Z NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
3+131.82 грн
10+93.62 грн
25+85.11 грн
100+71.11 грн
250+66.94 грн
500+64.42 грн
1000+61.33 грн
Мінімальне замовлення: 3
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TJA1465BHG/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1465BHG/0J NXP USA Inc. TJA1465.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1466AHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466AHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466BHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466BHG/0J NXP USA Inc. TJA1466.pdf Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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MC9S08DV48ACLH MC9S08DV48ACLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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S9S12XS128J1VAA S9S12XS128J1VAA NXP USA Inc. MC9S12XS256RMV1.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MVR5510AMDALES MVR5510AMDALES NXP USA Inc. VR5510.pdf Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
1+973.02 грн
10+736.81 грн
25+686.82 грн
100+593.03 грн
В кошику  од. на суму  грн.
PCA9554CBSHP PCA9554CBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
товару немає в наявності
В кошику  од. на суму  грн.
PCA9554CBSHP PCA9554CBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 5980 шт:
термін постачання 21-31 дні (днів)
4+102.99 грн
10+72.12 грн
25+65.44 грн
100+54.46 грн
250+51.15 грн
500+49.15 грн
1000+46.73 грн
2500+45.03 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PCA9554CPWJ PCA9554CPWJ NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+53.47 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
PCA9554BBSHP PCA9554BBSHP NXP USA Inc. PCA9554B_PCA9554C.pdf Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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MF1PH4230DA8/00J NXP USA Inc. MF1P(H)x2.pdf Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
товару немає в наявності
В кошику  од. на суму  грн.
LD6836TD/20H,125 LD6836TD/20H,125 NXP USA Inc. LD6836.pdf Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
2184+10.64 грн
Мінімальне замовлення: 2184
В кошику  од. на суму  грн.
MCF5470VR200 MCF5470VR200 NXP USA Inc. MCF5475EC.pdf Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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RDBESS774A1EVB NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
товару немає в наявності
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RDBESS772BJBEVB NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
товару немає в наявності
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RD33772C14VEVM NXP USA Inc. getting-started-with-the-rd33772c14vevm-reference-design:GS-RD33772C14VEVM Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU
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RD-BESS1500BUN NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD-BESS1-PREM NXP USA Inc. BESS10FS.pdf Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
товару немає в наявності
В кошику  од. на суму  грн.
MPL115A2ST1 MPL115A2ST1 NXP USA Inc. MPL115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
1000+232.42 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
MPL115A2ST1 MPL115A2ST1 NXP USA Inc. MPL115A2.pdf Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
на замовлення 1346 шт:
термін постачання 21-31 дні (днів)
1+344.39 грн
5+297.52 грн
10+284.90 грн
25+253.15 грн
50+243.47 грн
100+234.58 грн
500+213.15 грн
В кошику  од. на суму  грн.
MFS2613AMBA0AD MFS2613AMBA0AD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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MFS8620BMDA8ES MFS8620BMDA8ES NXP USA Inc. FS8600_SDS.pdf Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
1+499.28 грн
10+370.51 грн
25+342.90 грн
100+293.33 грн
260+279.24 грн
В кошику  од. на суму  грн.
MFS2613AMDA0AD MFS2613AMDA0AD NXP USA Inc. FS26_PB.pdf Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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MFS2633AMDAJAD MFS2633AMDAJAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAJAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDAKAD MFS2633AMDAKAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAKAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDC3AD MFS2633AMDC3AD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDC3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDAMAD MFS2633AMDAMAD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2633AMDAMAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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В кошику  од. на суму  грн.
MFS2633AMDE4AD MFS2633AMDE4AD NXP USA Inc. MFS2633AMDE4AD.pdf Description: MFS2633AMDE4AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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K32W042S1M2CAVAR NXP USA Inc. Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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K32W042S1M2VPJAT NXP USA Inc. Description: MCU KINETIS THREAD 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
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MCIMX353DVM5B MCIMX353DVM5B NXP USA Inc. MCIMX35SR2CEC.pdf Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MWE6IC9080NBR1 MWE6IC9080NBR1 NXP USA Inc. MWE6IC9080N.pdf Description: IC AMP GSM 865MHZ-960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 865MHz ~ 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 28.8dB
P1dB: 90W
Supplier Device Package: TO-272 WB-14
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AFSC5G26E39-EVB NXP USA Inc. AFSC5G26E39.pdf Description: AFSC5G26E39 2496-2690 MHZ REFERE
Packaging: Bulk
Frequency: 2.49GHz ~ 2.69GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G26E39
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NBP9FD4ST1 NXP USA Inc. NBP9S-3446634.pdf Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
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NBP9FD4ST1 NXP USA Inc. NBP9S-3446634.pdf Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
на замовлення 1973 шт:
термін постачання 21-31 дні (днів)
1+494.34 грн
5+428.43 грн
10+410.89 грн
25+366.05 грн
50+352.67 грн
100+340.40 грн
500+310.53 грн
1000+301.47 грн
В кошику  од. на суму  грн.
LPC11U36FBD64/401, LPC11U3X.pdf
LPC11U36FBD64/401,
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 96KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
на замовлення 17 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+497.63 грн
10+368.61 грн
В кошику  од. на суму  грн.
FXLS8971CFR1 FXLS8971CF.pdf
FXLS8971CFR1
Виробник: NXP USA Inc.
Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Tape & Reel (TR)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
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FXLS8971CFR1 FXLS8971CF.pdf
FXLS8971CFR1
Виробник: NXP USA Inc.
Description: FXLS8971CFR1
Features: Adjustable Bandwidth, Selectable Scale
Packaging: Cut Tape (CT)
Package / Case: 12-LQFN Exposed Pad
Output Type: I2C, SPI
Mounting Type: Surface Mount, Wettable Flank
Type: Analog, Digital
Axis: X, Y, Z
Acceleration Range: ±2g, 4g, 8g, 16g
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 1.71V ~ 3.6V
Bandwidth: 1.6kHz
Supplier Device Package: 12-DLQFN (3x3)
Sensitivity (LSB/g): 1024 (±2g) ~ 128 (±16g)
на замовлення 580 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+178.79 грн
5+153.28 грн
10+146.22 грн
25+129.37 грн
50+124.00 грн
100+119.11 грн
500+107.45 грн
Мінімальне замовлення: 2
В кошику  од. на суму  грн.
KIT-STBI-A8971 UM11910.pdf
KIT-STBI-A8971
Виробник: NXP USA Inc.
Description: Dev Kit FXLS8971
Packaging: Box
Sensitivity: 1024LSB/g, 512LSB/g, 256LSB/g, 128LSB/g
Interface: I2C, Serial, SPI
Contents: Board(s), Cable(s)
Voltage - Supply: 1.71V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: FXLS8971CF
Embedded: No
Sensing Range: ±2g, 4g, 8g, 16g
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6649.67 грн
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LPC55S66JEV59Y
LPC55S66JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S66JEV59E
LPC55S66JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59Y
LPC5528JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC5528JEV59E
LPC5528JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59Y
LPC55S28JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S28JEV59E
LPC55S28JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59Y
LPC55S69JEV59Y
Виробник: NXP USA Inc.
Description: IC
Packaging: Tape & Reel (TR)
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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LPC55S69JEV59E
LPC55S69JEV59E
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 59-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 640KB (640K x 8)
RAM Size: 320K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33F
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, TRNG, WDT
Supplier Device Package: 59-VFBGA (4x4)
Number of I/O: 37
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P1023NXE5CFB P1_Series_FS.pdf
Виробник: NXP USA Inc.
Description: IC MPU QORIQ P1 500MHZ 457TEPBGA
Packaging: Tray
Package / Case: 457-FBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500v2
Supplier Device Package: 457-TEPBGA-1 (19x19)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Security; SEC 4.2
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, SPI
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MC33FS6518NAER2 F6500%2C%20F4500%20Data%20Short.pdf
MC33FS6518NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, DCDC 1.5A VCO
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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NCX8200UKZ NCX8200.pdf
NCX8200UKZ
Виробник: NXP USA Inc.
Description: IC AUDIO SWITCH 9WLCSP
Packaging: Bulk
Package / Case: 9-UFBGA, WLCSP
Mounting Type: Surface Mount
Function: Audio Switch
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.6V ~ 3.6V
Applications: Consumer Audio
Supplier Device Package: 9-WLCSP (1.22x1.22)
Number of Channels: 1
на замовлення 16000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
974+23.56 грн
Мінімальне замовлення: 974
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MPC8541VTAJD MPC8541EEC.pdf
MPC8541VTAJD
Виробник: NXP USA Inc.
Description: IC MPU MPC85XX 533MHZ 783FCPBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 2.5V, 3.3V
Supplier Device Package: 783-FCPBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, PCI
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TJA1465ATK/0J TJA1465.pdf
TJA1465ATK/0J
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6000+64.78 грн
Мінімальне замовлення: 6000
В кошику  од. на суму  грн.
TJA1465ATK/0J TJA1465.pdf
TJA1465ATK/0J
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 6000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+131.82 грн
10+93.62 грн
25+85.11 грн
100+71.11 грн
250+66.94 грн
500+64.42 грн
1000+61.33 грн
2500+59.18 грн
Мінімальне замовлення: 3
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TJA1465AT/0Z TJA1465.pdf
TJA1465AT/0Z
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+66.57 грн
Мінімальне замовлення: 2500
В кошику  од. на суму  грн.
TJA1465AT/0Z TJA1465.pdf
TJA1465AT/0Z
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 50 mV
Duplex: Half
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+131.82 грн
10+93.62 грн
25+85.11 грн
100+71.11 грн
250+66.94 грн
500+64.42 грн
1000+61.33 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
TJA1465BHG/0J TJA1465.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1465BHG/0J TJA1465.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 8Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
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TJA1466AHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466AHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466CHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466BHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Tape & Reel (TR)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TJA1466BHG/0J TJA1466.pdf
Виробник: NXP USA Inc.
Description: CAN SIC TRANSCEIVER WITH PARTIAL
Packaging: Cut Tape (CT)
Package / Case: 18-VQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: 18-DHVQFN (3x4.5)
Receiver Hysteresis: 50 mV
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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MC9S08DV48ACLH MC9S08DV60.pdf
MC9S08DV48ACLH
Виробник: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
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S9S12XS128J1VAA MC9S12XS256RMV1.pdf
S9S12XS128J1VAA
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: HCS12X
Data Converters: A/D 8x12b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 1.72V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MVR5510AMDALES VR5510.pdf
MVR5510AMDALES
Виробник: NXP USA Inc.
Description: SAFETY POWER MANAGEMENT IC, QFN5
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 60V
Current - Supply: 15mA
Supplier Device Package: 56-HVQFN (8x8)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+973.02 грн
10+736.81 грн
25+686.82 грн
100+593.03 грн
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PCA9554CBSHP PCA9554B_PCA9554C.pdf
PCA9554CBSHP
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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PCA9554CBSHP PCA9554B_PCA9554C.pdf
PCA9554CBSHP
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 5980 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
4+102.99 грн
10+72.12 грн
25+65.44 грн
100+54.46 грн
250+51.15 грн
500+49.15 грн
1000+46.73 грн
2500+45.03 грн
Мінімальне замовлення: 4
В кошику  од. на суму  грн.
PCA9554CPWJ PCA9554B_PCA9554C.pdf
PCA9554CPWJ
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16TSSOP
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+53.47 грн
Мінімальне замовлення: 2500
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PCA9554BBSHP PCA9554B_PCA9554C.pdf
PCA9554BBSHP
Виробник: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 16HVQFN
Features: POR
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-HVQFN (3x3)
Current - Output Source/Sink: 10mA, 25mA
DigiKey Programmable: Not Verified
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MF1PH4230DA8/00J MF1P(H)x2.pdf
Виробник: NXP USA Inc.
Description: MIFAREA PLUS EV2
Packaging: Tape & Reel (TR)
Package / Case: MOA8, Smart Card Module
Mounting Type: Surface Mount
Frequency: 13.56MHz
Type: RFID Reader
Operating Temperature: -25°C ~ 85°C (TA)
Standards: Mifare, NFC
Supplier Device Package: PLLMC
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LD6836TD/20H,125 LD6836.pdf
LD6836TD/20H,125
Виробник: NXP USA Inc.
Description: IC REG LINEAR 2V 300MA 5-TSOP
Packaging: Bulk
Package / Case: SC-74A, SOT-753
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 300mA
Operating Temperature: -40°C ~ 85°C
Output Configuration: Positive
Current - Quiescent (Iq): 100 µA
Voltage - Input (Max): 5.5V
Number of Regulators: 1
Supplier Device Package: 5-TSOP
Voltage - Output (Min/Fixed): 2V
Control Features: Enable
PSRR: 55dB (1kHz)
Voltage Dropout (Max): 0.2V @ 300mA
Protection Features: Over Current, Over Temperature
Current - Supply (Max): 250 µA
на замовлення 12000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2184+10.64 грн
Мінімальне замовлення: 2184
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MCF5470VR200 MCF5475EC.pdf
MCF5470VR200
Виробник: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tray
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 200MHz
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: Coldfire V4E
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.43V ~ 1.58V
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART, USB
Peripherals: DMA, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 99
DigiKey Programmable: Not Verified
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RDBESS774A1EVB BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RDBESS772BJBEVB BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD33772C14VEVM getting-started-with-the-rd33772c14vevm-reference-design:GS-RD33772C14VEVM
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS26
Packaging: Box
Function: Battery Charger
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: FS26, MC33772C, S32K344
Embedded: Yes, MCU
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RD-BESS1500BUN BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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RD-BESS1-PREM BESS10FS.pdf
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR MC33772, MC33774
Packaging: Bulk
Function: Battery Cell Controller
Type: Power Management
Contents: Board(s)
Utilized IC / Part: MC33772, MC33774
Embedded: Yes, MCU
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MPL115A2ST1 MPL115A2.pdf
MPL115A2ST1
Виробник: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
на замовлення 1000 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1000+232.42 грн
Мінімальне замовлення: 1000
В кошику  од. на суму  грн.
MPL115A2ST1 MPL115A2.pdf
MPL115A2ST1
Виробник: NXP USA Inc.
Description: IC BAROMETRIC SENSOR I2C 8-TSON
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: 8-TLGA
Output Type: I2C
Mounting Type: Surface Mount
Operating Pressure: 7.25PSI ~ 16.68PSI (50kPa ~ 115kPa)
Pressure Type: Absolute
Accuracy: ±0.145PSI (±1kPa)
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.375V ~ 5.5V
Applications: Board Mount
Supplier Device Package: 8-LGA (5x3)
Port Style: No Port
на замовлення 1346 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+344.39 грн
5+297.52 грн
10+284.90 грн
25+253.15 грн
50+243.47 грн
100+234.58 грн
500+213.15 грн
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MFS2613AMBA0AD FS26_PB.pdf
MFS2613AMBA0AD
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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MFS8620BMDA8ES FS8600_SDS.pdf
MFS8620BMDA8ES
Виробник: NXP USA Inc.
Description: IC
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-HVQFN (7x7)
Grade: Automotive
Qualification: AEC-Q100
на замовлення 260 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+499.28 грн
10+370.51 грн
25+342.90 грн
100+293.33 грн
260+279.24 грн
В кошику  од. на суму  грн.
MFS2613AMDA0AD FS26_PB.pdf
MFS2613AMDA0AD
Виробник: NXP USA Inc.
Description: SAFETY SYSTEM BASIS CHIP WITH LO
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 40V
Supplier Device Package: 48-LQFP-EP (7x7)
Grade: Automotive
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MFS2633AMDAJAD MFS2633AMDAJAD.pdf
MFS2633AMDAJAD
Виробник: NXP USA Inc.
Description: MFS2633AMDAJAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDAKAD MFS2633AMDAJAD.pdf
MFS2633AMDAKAD
Виробник: NXP USA Inc.
Description: MFS2633AMDAKAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDC3AD MFS2633AMDAJAD.pdf
MFS2633AMDC3AD
Виробник: NXP USA Inc.
Description: MFS2633AMDC3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDAMAD MFS2633AMDAJAD.pdf
MFS2633AMDAMAD
Виробник: NXP USA Inc.
Description: MFS2633AMDAMAD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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MFS2633AMDE4AD MFS2633AMDE4AD.pdf
MFS2633AMDE4AD
Виробник: NXP USA Inc.
Description: MFS2633AMDE4AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
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K32W042S1M2CAVAR
Виробник: NXP USA Inc.
Description: MCU KINETIS BT5/FSK/THREAD WLCSP
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 191-WLCSP (5.97x5.85)
Number of I/O: 104
DigiKey Programmable: Not Verified
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K32W042S1M2VPJAT
Виробник: NXP USA Inc.
Description: MCU KINETIS THREAD 176-VFBGA
Packaging: Tray
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 1.25MB (1.25M x 8)
RAM Size: 384K x 8
Operating Temperature: -40°C ~ 105°C
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D - 12bit; D/A - 12bit
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals: Bluetooth, DMA, PWM, WDT
Supplier Device Package: 176-VFBGA
Number of I/O: 104
DigiKey Programmable: Not Verified
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MCIMX353DVM5B MCIMX35SR2CEC.pdf
MCIMX353DVM5B
Виробник: NXP USA Inc.
Description: IC MPU I.MX35 532MHZ 400LFBGA
Packaging: Tray
Package / Case: 400-LFBGA
Mounting Type: Surface Mount
Speed: 532MHz
Operating Temperature: -20°C ~ 70°C (TA)
Core Processor: ARM1136JF-S
Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
Supplier Device Package: 400-LFBGA (17x17)
Ethernet: 10/100Mbps (1)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Multimedia; GPU, IPU, VFP
RAM Controllers: LPDDR, DDR2
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, KPP, LCD
Security Features: Secure Fusebox, Secure JTAG, Tamper Detection
Additional Interfaces: 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SPI, SSI, UART
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MWE6IC9080NBR1 MWE6IC9080N.pdf
MWE6IC9080NBR1
Виробник: NXP USA Inc.
Description: IC AMP GSM 865MHZ-960MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-14 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 865MHz ~ 960MHz
RF Type: GSM, EDGE
Voltage - Supply: 28V
Gain: 28.8dB
P1dB: 90W
Supplier Device Package: TO-272 WB-14
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AFSC5G26E39-EVB AFSC5G26E39.pdf
Виробник: NXP USA Inc.
Description: AFSC5G26E39 2496-2690 MHZ REFERE
Packaging: Bulk
Frequency: 2.49GHz ~ 2.69GHz
Type: Power Amplifier
Contents: Board(s)
Utilized IC / Part: AFSC5G26E39
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NBP9FD4ST1 NBP9S-3446634.pdf
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Tape & Reel (TR)
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NBP9FD4ST1 NBP9S-3446634.pdf
Виробник: NXP USA Inc.
Description: IC PRESSURE SENSOR 24HQFN
Packaging: Cut Tape (CT)
на замовлення 1973 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+494.34 грн
5+428.43 грн
10+410.89 грн
25+366.05 грн
50+352.67 грн
100+340.40 грн
500+310.53 грн
1000+301.47 грн
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