Продукція > NXP USA INC. > Всі товари виробника NXP USA INC. (35865) > Сторінка 586 з 598
| Фото | Назва | Виробник | Інформація |
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| KIT-TJA1103-SDBS | NXP USA Inc. |
Description: SABRE DEV KIT ETHERNET PHY Packaging: Box Function: Ethernet PHY Type: Interface Contents: Board(s) Utilized IC / Part: TJA11xx Embedded: No |
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| KIT-TJA1103-SDBR | NXP USA Inc. |
Description: KIT-TJA1103-SDBR Packaging: Bulk |
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TEF6904AH/V5S,518 | NXP USA Inc. |
 Description: RF RECEIVER AM/FM 80QFPPackaging: Tape & Reel (TR) Package / Case: 80-BQFP Mounting Type: Surface Mount Modulation or Protocol: AM, FM Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 8V ~ 9V Applications: AM/FM Radio Receiver Current - Receiving: 102mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 80-QFP (14x14) |
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TEF6901AH/V5S,557 | NXP USA Inc. |
Description: RF RECEIVER AM/FM/WB 64QFP Packaging: Tray Package / Case: 64-BQFP Mounting Type: Surface Mount Modulation or Protocol: AM, FM, WB Data Interface: PCB, Surface Mount Operating Temperature: -40°C ~ 85°C Voltage - Supply: 8V ~ 9V Applications: AM/FM Radio Receiver Current - Receiving: 102mA Antenna Connector: PCB, Surface Mount Supplier Device Package: 64-QFP (14x14) |
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PESD3V3U1BCSFYL | NXP USA Inc. |
Description: TVS DIODE 3.3VWM 12VC DSN06032 Packaging: Bulk Package / Case: 0201 (0603 Metric) Mounting Type: Surface Mount Type: Zener Operating Temperature: -40°C ~ 125°C (TA) Applications: General Purpose Capacitance @ Frequency: 5.3pF @ 1MHz Current - Peak Pulse (10/1000µs): 5.4A (8/20µs) Voltage - Reverse Standoff (Typ): 3.3V (Max) Supplier Device Package: DSN0603-2 Bidirectional Channels: 1 Voltage - Breakdown (Min): 4.5V Voltage - Clamping (Max) @ Ipp: 12V Power Line Protection: No |
на замовлення 614872 шт: термін постачання 21-31 дні (днів) |
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MPC8272VRMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
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MCIMX6Q6AVT10AER | NXP USA Inc. |
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA Packaging: Tape & Reel (TR) Package / Case: 624-FBGA, FCBGA Mounting Type: Surface Mount Speed: 1.0GHz Operating Temperature: -40°C ~ 125°C (TJ) Core Processor: ARM® Cortex®-A9 Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Supplier Device Package: 624-FCBGA (21x21) Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 + PHY (4) Number of Cores/Bus Width: 4 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection SATA: SATA 3Gbps (1) Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART |
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UBA2071AT/N1,118 | NXP USA Inc. |
Description: IC CCFL/EEFL CNTRL 42KHZ 24SO Packaging: Tape & Reel (TR) Package / Case: 24-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Frequency: 38kHz ~ 42kHz Type: CCFL/EEFL Controller Operating Temperature: -25°C ~ 100°C Voltage - Supply: 14V Supplier Device Package: 24-SO Dimming: Yes Current - Supply: 1.5 mA |
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| LFVBBOK77CW1C | NXP USA Inc. |
Description: NXP MPC5777C 422 PIN 1.0 MM PITC Packaging: Bulk Accessory Type: Calibration Unit Utilized IC / Part: MPCxxxx |
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MCF51JE128VMB | NXP USA Inc. |
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA Packaging: Box Package / Case: 81-LBGA Mounting Type: Surface Mount Speed: 50MHz Program Memory Size: 128KB (128K x 8) RAM Size: 32K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: Coldfire V1 Data Converters: A/D 12x12b; D/A 1x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG Peripherals: LVD, PWM, WDT Supplier Device Package: 81-MAPBGA (10x10) Number of I/O: 48 DigiKey Programmable: Not Verified |
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MRF6VP3450HR5 | NXP USA Inc. |
Description: RF MOSFET LDMOS 50V NI1230 Packaging: Tape & Reel (TR) Package / Case: NI-1230 Mounting Type: Chassis Mount Frequency: 860MHz Configuration: Dual Power - Output: 90W Gain: 22.5dB Technology: LDMOS Supplier Device Package: NI-1230 Voltage - Rated: 110 V Voltage - Test: 50 V Current - Test: 1.4 A |
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NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSP Features: Slew Rate Controlled Packaging: Tape & Reel (TR) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
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NX5P1100UKZ | NXP USA Inc. |
Description: IC PWR SWITCH 1:1 12WLCSP Features: Slew Rate Controlled Packaging: Cut Tape (CT) Package / Case: 12-UFBGA, WLCSP Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: USB Switch Operating Temperature: -40°C ~ 85°C (TA) Output Configuration: High Side Rds On (Typ): 60mOhm Input Type: Non-Inverting Voltage - Load: 3V ~ 5.5V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 1A Ratio - Input:Output: 1:1 Supplier Device Package: 12-WLCSP (1.6x1.3) Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO |
на замовлення 1845 шт: термін постачання 21-31 дні (днів) |
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MC35FS4507NAE | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tray Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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MC35FS4507NAER2 | NXP USA Inc. |
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V Packaging: Tape & Reel (TR) Package / Case: 48-LQFP Exposed Pad Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TA) Voltage - Supply: 1V ~ 5V Applications: System Basis Chip Supplier Device Package: 48-HLQFP (7x7) Grade: Automotive Qualification: AEC-Q100 |
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LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
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LPC5528JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 974 шт: термін постачання 21-31 дні (днів) |
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LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tape & Reel (TR) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
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LPC5526JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 993 шт: термін постачання 21-31 дні (днів) |
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LPC55S28JBD100Y | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100HLQFP Packaging: Cut Tape (CT) Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 925 шт: термін постачання 21-31 дні (днів) |
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LPC5528JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 512KB (512K x 8) RAM Size: 256K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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LPC5526JBD100E | NXP USA Inc. |
Description: IC MCU 32BIT 256KB FLSH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 150MHz Program Memory Size: 256KB (256K x 8) RAM Size: 144K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M33 Data Converters: A/D 10x16b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Supplier Device Package: 100-HLQFP (14x14) Number of I/O: 64 |
на замовлення 90 шт: термін постачання 21-31 дні (днів) |
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| BC860C,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 100MA SOT23 Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BC860B,215 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 100MA SOT23 Packaging: Tape & Reel (TR) |
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В кошику од. на суму грн. | |||||||||||||||
| BC860B,235 | NXP USA Inc. |
Description: TRANSISTOR PNP 45V 100MA SOT23 Packaging: Tape & Reel (TR) |
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В кошику од. на суму грн. | |||||||||||||||
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MC912DG128ACPVE | NXP USA Inc. |
Description: IC MCU 16BIT 128KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 128KB (128K x 8) RAM Size: 8K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, I2C, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 69 DigiKey Programmable: Not Verified |
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В кошику од. на суму грн. | ||||||||||||||
| JN5121-000-AIV | NXP USA Inc. |
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN Packaging: Tape & Reel (TR) Package / Case: 56-QFN Interface: 2-Wire Serial, SPI Serial, UART RAM Size: 96K x 8 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V Controller Series: IEEE802.15.4 Program Memory Type: ROM (64kB) Applications: Wireless Number of I/O: 21 DigiKey Programmable: Not Verified |
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MPC885ZP66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
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MPXV2202GC6T1 | NXP USA Inc. |
Description: SENSOR 29.01PSIG 0.13" .04V Features: Temperature Compensated Packaging: Tape & Reel (TR) Package / Case: 8-SMD, Gull Wing, Top Port Output Type: Wheatstone Bridge Mounting Type: Surface Mount Output: 0 mV ~ 40 mV (10V) Operating Pressure: 29.01PSI (200kPa) Pressure Type: Vented Gauge Operating Temperature: -40°C ~ 125°C Termination Style: Gull Wing Voltage - Supply: 10V ~ 16V Port Size: Male - 0.13" (3.17mm) Tube Applications: Board Mount Port Style: Barbless Maximum Pressure: 58.02PSI (400kPa) |
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Z0107MN,135 | NXP USA Inc. |
 Description: TRIAC SENS GATE 600V 1A SC73Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
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MPC17550eVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP Packaging: Tape & Reel (TR) Package / Case: 36-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -10°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 2.5V ~ 5.5V Applications: Battery Powered Technology: Power MOSFET Voltage - Load: 1.6V ~ 5.5V Supplier Device Package: 36-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC |
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В кошику од. на суму грн. | ||||||||||||||
| BZV55-C10,115 | NXP USA Inc. |
Description: DIODE ZENER 10V 500MW LLDS Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BTA412Y-800C,127 | NXP USA Inc. |
Description: TRIAC 800V 12A TO220AB-3 Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| KITFS23LDOEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| KITFS23SKTEVM | NXP USA Inc. |
Description: EVAL BOARD FOR FS2320 Packaging: Bulk Function: System Basis Chip (SBC) Type: Interface Contents: Board(s) Utilized IC / Part: FS2320 Embedded: Yes, MCU, 32-Bit |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| KITFS27-SP48VEVM | NXP USA Inc. |
Description: KITFS27-SP48VEVM Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||||
| KITFS27EVM | NXP USA Inc. |
Description: KITFS27EVM Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||||
| KITFS27SKTEVM | NXP USA Inc. |
Description: KITFS27SKTEVM Packaging: Bulk |
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| KITFS27-24VEVM | NXP USA Inc. |
Description: KITFS27-24VEVM Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||||
| KITFS27-48VEVM | NXP USA Inc. |
Description: KITFS27-48VEVM Packaging: Bulk |
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В кошику од. на суму грн. | |||||||||||||||
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74HC597DB,118 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOP Packaging: Tape & Reel (TR) Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
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В кошику од. на суму грн. | ||||||||||||||
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74HC597DB,112 | NXP USA Inc. |
Description: IC SR PUSH-PULL 8BIT 16-SSOP Packaging: Tube Package / Case: 16-SSOP (0.209", 5.30mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SSOP Number of Bits per Element: 8 |
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74HC597D,652 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO Packaging: Tube Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
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74HC597D,653 | NXP USA Inc. |
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Push-Pull Mounting Type: Surface Mount Number of Elements: 1 Function: Parallel to Serial Logic Type: Shift Register Operating Temperature: -40°C ~ 125°C Voltage - Supply: 2V ~ 6V Supplier Device Package: 16-SO Number of Bits per Element: 8 |
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В кошику од. на суму грн. | ||||||||||||||
| BT139-800G,127 | NXP USA Inc. |
Description: TRIAC 800V 16A TO220AB Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139-800,127 | NXP USA Inc. |
Description: TRIAC 800V 16A TO220AB Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139-600,127 | NXP USA Inc. |
Description: TRIAC 600V 16A TO220AB Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139X-800,127 | NXP USA Inc. |
Description: TRIAC 800V 16A TO220-3 Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139B-800F,118 | NXP USA Inc. |
Description: TRIAC 800V 16A D2PAK Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139B-600E,118 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 16A D2PAK Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139-600E,127 | NXP USA Inc. |
Description: TRIAC SENS GATE 600V 16A TO220AB Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BT139X-600E,127 | NXP USA Inc. |
Description: TRIAC 600V 16A SOT186A Packaging: Bulk |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||||
| BUX87P,127 | NXP USA Inc. | Description: TRANS BJT NPN 450V SOT-82 |
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В кошику од. на суму грн. | |||||||||||||||
 |
SC16C2550BIBS,151 | NXP USA Inc. |
Description: SERIAL I/O CONTROLLER, 2 CHANNEL Packaging: Tray Package / Case: 32-VFQFN Exposed Pad Number of Channels: 2, DUART Mounting Type: Surface Mount Voltage - Supply: 2.5V, 3.3V, 5V FIFO's: 16 Byte Data Rate (Max): 5Mbps Supplier Device Package: 32-HVQFN (5x5) With Auto Flow Control: Yes With False Start Bit Detection: Yes With Modem Control: Yes |
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В кошику од. на суму грн. | ||||||||||||||
 |
HEF4047BT,652 | NXP USA Inc. |
Description: IC MONO/ASTBL MULTVIBRATR 14SOIC Packaging: Tube |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
|
|
HEF4047BT,653 | NXP USA Inc. |
Description: IC MONO/ASTBL MULTVIBRATR 14SOIC Packaging: Tape & Reel (TR) |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
N74F11N,602 | NXP USA Inc. |
Description: IC GATE AND 3CH 3-INP 14DIP Packaging: Tube Package / Case: 14-DIP (0.300", 7.62mm) Mounting Type: Through Hole Logic Type: AND Gate Operating Temperature: 0°C ~ 70°C Voltage - Supply: 4.5V ~ 5.5V Current - Output High, Low: 1mA, 20mA Number of Inputs: 3 Supplier Device Package: 14-DIP Input Logic Level - High: 2V Input Logic Level - Low: 0.8V Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF Number of Circuits: 3 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
TDA1560Q/N4,112 | NXP USA Inc. |
Description: IC RADIO PWR AMP 40W 17-DIL Packaging: Tube Features: Mute, Standby Package / Case: 17-SIP Formed Leads Output Type: 1-Channel (Mono) Mounting Type: Through Hole Type: Class B, Class H Voltage - Supply: 8V ~ 18V Max Output Power x Channels @ Load: 40W x1 @ 8Ohm Supplier Device Package: DBS17P |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
 |
TDA1519CTH/N3,512 | NXP USA Inc. |
Description: IC STEREO PWR AMP 22W BTL 20HSOP Features: Mute, Standby Packaging: Tube Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Output Type: 2-Channel (Stereo) Mounting Type: Surface Mount Type: Class B Voltage - Supply: 6V ~ 18V Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm Supplier Device Package: 20-HSOP |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||||
| BSC9132NXN7MNMB | NXP USA Inc. |
Description: IC MPU QORIQ 1.333GHZ 780FCBGA Packaging: Tray Package / Case: 780-BFBGA, FCBGA Mounting Type: Surface Mount Speed: 1.333GHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC e500 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 780-FCBGA (23x23) Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 2 Core, 32-Bit Co-Processors/DSP: Signal Processing; SC3850 - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM |
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В кошику од. на суму грн. |
| KIT-TJA1103-SDBS |
Виробник: NXP USA Inc.
Description: SABRE DEV KIT ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
Description: SABRE DEV KIT ETHERNET PHY
Packaging: Box
Function: Ethernet PHY
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA11xx
Embedded: No
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| TEF6904AH/V5S,518 |
|
Виробник: NXP USA Inc.
Description: RF RECEIVER AM/FM 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-BQFP
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 8V ~ 9V
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 80-QFP (14x14)
Description: RF RECEIVER AM/FM 80QFP
Packaging: Tape & Reel (TR)
Package / Case: 80-BQFP
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 8V ~ 9V
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 80-QFP (14x14)
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| TEF6901AH/V5S,557 |
|
Виробник: NXP USA Inc.
Description: RF RECEIVER AM/FM/WB 64QFP
Packaging: Tray
Package / Case: 64-BQFP
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, WB
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 8V ~ 9V
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-QFP (14x14)
Description: RF RECEIVER AM/FM/WB 64QFP
Packaging: Tray
Package / Case: 64-BQFP
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, WB
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 8V ~ 9V
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-QFP (14x14)
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В кошику
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| PESD3V3U1BCSFYL |
|
Виробник: NXP USA Inc.
Description: TVS DIODE 3.3VWM 12VC DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 5.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5.4A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 4.5V
Voltage - Clamping (Max) @ Ipp: 12V
Power Line Protection: No
Description: TVS DIODE 3.3VWM 12VC DSN06032
Packaging: Bulk
Package / Case: 0201 (0603 Metric)
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 125°C (TA)
Applications: General Purpose
Capacitance @ Frequency: 5.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 5.4A (8/20µs)
Voltage - Reverse Standoff (Typ): 3.3V (Max)
Supplier Device Package: DSN0603-2
Bidirectional Channels: 1
Voltage - Breakdown (Min): 4.5V
Voltage - Clamping (Max) @ Ipp: 12V
Power Line Protection: No
на замовлення 614872 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 2224+ | 9.30 грн |
| MPC8272VRMIBA |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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В кошику
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| MCIMX6Q6AVT10AER |
|
Виробник: NXP USA Inc.
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Description: IC MPU I.MX6Q 1.0GHZ 624FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 624-FBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: -40°C ~ 125°C (TJ)
Core Processor: ARM® Cortex®-A9
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Supplier Device Package: 624-FCBGA (21x21)
Ethernet: 10/100/1000Mbps (1)
USB: USB 2.0 + PHY (4)
Number of Cores/Bus Width: 4 Core, 32-Bit
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
SATA: SATA 3Gbps (1)
Additional Interfaces: CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
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| UBA2071AT/N1,118 |
|
Виробник: NXP USA Inc.
Description: IC CCFL/EEFL CNTRL 42KHZ 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
Description: IC CCFL/EEFL CNTRL 42KHZ 24SO
Packaging: Tape & Reel (TR)
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Frequency: 38kHz ~ 42kHz
Type: CCFL/EEFL Controller
Operating Temperature: -25°C ~ 100°C
Voltage - Supply: 14V
Supplier Device Package: 24-SO
Dimming: Yes
Current - Supply: 1.5 mA
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| LFVBBOK77CW1C |
Виробник: NXP USA Inc.
Description: NXP MPC5777C 422 PIN 1.0 MM PITC
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
Description: NXP MPC5777C 422 PIN 1.0 MM PITC
Packaging: Bulk
Accessory Type: Calibration Unit
Utilized IC / Part: MPCxxxx
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| MCF51JE128VMB |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 128KB FLSH 81MAPBGA
Packaging: Box
Package / Case: 81-LBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 12x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: EBI/EMI, I2C, SCI, SPI, USB OTG
Peripherals: LVD, PWM, WDT
Supplier Device Package: 81-MAPBGA (10x10)
Number of I/O: 48
DigiKey Programmable: Not Verified
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| MRF6VP3450HR5 |
|
Виробник: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 90W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 1.4 A
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 860MHz
Configuration: Dual
Power - Output: 90W
Gain: 22.5dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 1.4 A
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| NX5P1100UKZ |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
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| NX5P1100UKZ |
|
Виробник: NXP USA Inc.
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
Description: IC PWR SWITCH 1:1 12WLCSP
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 12-UFBGA, WLCSP
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: USB Switch
Operating Temperature: -40°C ~ 85°C (TA)
Output Configuration: High Side
Rds On (Typ): 60mOhm
Input Type: Non-Inverting
Voltage - Load: 3V ~ 5.5V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 1A
Ratio - Input:Output: 1:1
Supplier Device Package: 12-WLCSP (1.6x1.3)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Reverse Current, UVLO
на замовлення 1845 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 5+ | 78.66 грн |
| 10+ | 54.54 грн |
| 25+ | 49.31 грн |
| 100+ | 40.85 грн |
| 250+ | 38.26 грн |
| 500+ | 36.70 грн |
| 1000+ | 34.83 грн |
| MC35FS4507NAE |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| MC35FS4507NAER2 |
|
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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| LPC5528JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
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| LPC5528JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 974 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 476.13 грн |
| 10+ | 400.21 грн |
| 25+ | 370.91 грн |
| 100+ | 320.57 грн |
| 250+ | 306.49 грн |
| 500+ | 298.17 грн |
| LPC5526JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
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| LPC5526JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 993 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 489.38 грн |
| 10+ | 363.45 грн |
| 25+ | 336.15 грн |
| 100+ | 287.29 грн |
| 250+ | 274.50 грн |
| 500+ | 266.18 грн |
| LPC55S28JBD100Y |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 925 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 582.12 грн |
| 10+ | 434.49 грн |
| 25+ | 402.90 грн |
| 100+ | 345.56 грн |
| 250+ | 330.04 грн |
| 500+ | 320.68 грн |
| LPC5528JBD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 512KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 439.70 грн |
| 10+ | 394.78 грн |
| LPC5526JBD100E |
|
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
Description: IC MCU 32BIT 256KB FLSH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Number of I/O: 64
на замовлення 90 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 494.35 грн |
| 10+ | 366.48 грн |
| 90+ | 311.07 грн |
| MC912DG128ACPVE |
|
Виробник: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 69
DigiKey Programmable: Not Verified
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| JN5121-000-AIV |
|
Виробник: NXP USA Inc.
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
Description: IC MCU 802.15.4 32BIT 2.4G 56QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-QFN
Interface: 2-Wire Serial, SPI Serial, UART
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V, 2.7V, 3V, 3.3V
Controller Series: IEEE802.15.4
Program Memory Type: ROM (64kB)
Applications: Wireless
Number of I/O: 21
DigiKey Programmable: Not Verified
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| MPC885ZP66 |
|
Виробник: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
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| MPXV2202GC6T1 |
|
Виробник: NXP USA Inc.
Description: SENSOR 29.01PSIG 0.13" .04V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
Description: SENSOR 29.01PSIG 0.13" .04V
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD, Gull Wing, Top Port
Output Type: Wheatstone Bridge
Mounting Type: Surface Mount
Output: 0 mV ~ 40 mV (10V)
Operating Pressure: 29.01PSI (200kPa)
Pressure Type: Vented Gauge
Operating Temperature: -40°C ~ 125°C
Termination Style: Gull Wing
Voltage - Supply: 10V ~ 16V
Port Size: Male - 0.13" (3.17mm) Tube
Applications: Board Mount
Port Style: Barbless
Maximum Pressure: 58.02PSI (400kPa)
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| MPC17550eVEL |
|
Виробник: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tape & Reel (TR)
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tape & Reel (TR)
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
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| KITFS23LDOEVM |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 14996.03 грн |
| KITFS23SKTEVM |
|
Виробник: NXP USA Inc.
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
Description: EVAL BOARD FOR FS2320
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Contents: Board(s)
Utilized IC / Part: FS2320
Embedded: Yes, MCU, 32-Bit
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна |
|---|---|
| 1+ | 16710.92 грн |
| 74HC597DB,118 |
|
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| 74HC597DB,112 |
|
Виробник: NXP USA Inc.
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
Description: IC SR PUSH-PULL 8BIT 16-SSOP
Packaging: Tube
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SSOP
Number of Bits per Element: 8
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| 74HC597D,652 |
|
Виробник: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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| 74HC597D,653 |
|
Виробник: NXP USA Inc.
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
Description: IC SHFT REG PUSH-PULL 8BIT 16-SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 1
Function: Parallel to Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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| BUX87P,127 |
Виробник: NXP USA Inc.
Description: TRANS BJT NPN 450V SOT-82
Description: TRANS BJT NPN 450V SOT-82
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| SC16C2550BIBS,151 |
|
Виробник: NXP USA Inc.
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Description: SERIAL I/O CONTROLLER, 2 CHANNEL
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Number of Channels: 2, DUART
Mounting Type: Surface Mount
Voltage - Supply: 2.5V, 3.3V, 5V
FIFO's: 16 Byte
Data Rate (Max): 5Mbps
Supplier Device Package: 32-HVQFN (5x5)
With Auto Flow Control: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
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| N74F11N,602 |
|
Виробник: NXP USA Inc.
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 3
Description: IC GATE AND 3CH 3-INP 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Logic Type: AND Gate
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Current - Output High, Low: 1mA, 20mA
Number of Inputs: 3
Supplier Device Package: 14-DIP
Input Logic Level - High: 2V
Input Logic Level - Low: 0.8V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Number of Circuits: 3
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| TDA1560Q/N4,112 |
|
Виробник: NXP USA Inc.
Description: IC RADIO PWR AMP 40W 17-DIL
Packaging: Tube
Features: Mute, Standby
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
Description: IC RADIO PWR AMP 40W 17-DIL
Packaging: Tube
Features: Mute, Standby
Package / Case: 17-SIP Formed Leads
Output Type: 1-Channel (Mono)
Mounting Type: Through Hole
Type: Class B, Class H
Voltage - Supply: 8V ~ 18V
Max Output Power x Channels @ Load: 40W x1 @ 8Ohm
Supplier Device Package: DBS17P
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| TDA1519CTH/N3,512 |
|
Виробник: NXP USA Inc.
Description: IC STEREO PWR AMP 22W BTL 20HSOP
Features: Mute, Standby
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
Description: IC STEREO PWR AMP 22W BTL 20HSOP
Features: Mute, Standby
Packaging: Tube
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Output Type: 2-Channel (Stereo)
Mounting Type: Surface Mount
Type: Class B
Voltage - Supply: 6V ~ 18V
Max Output Power x Channels @ Load: 6W x 2 @ 4Ohm
Supplier Device Package: 20-HSOP
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| BSC9132NXN7MNMB |
|
Виробник: NXP USA Inc.
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
Description: IC MPU QORIQ 1.333GHZ 780FCBGA
Packaging: Tray
Package / Case: 780-BFBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 780-FCBGA (23x23)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 2 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Additional Interfaces: AIC, DUART, I2C, MMC/SD, SPI, USIM
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