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MC35FS4505NAER2 MC35FS4505NAER2 NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE MC35FS4505NAE NXP USA Inc. 35FS4500-35FS6500-ASILB.pdf Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC50XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEKR2 MC22XS4200DEKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC50XS4200DEK MC50XS4200DEK NXP USA Inc. MC20XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEKR2 MC17XS6400DEKR2 NXP USA Inc. MC07XS6517.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC20XS4200DFK MC20XS4200DFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEK MC22XS4200DEK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEK MC17XS6400DEK NXP USA Inc. MC12XS6D3.pdf Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFK NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC06XS4200DFKR2 MC06XS4200DFKR2 NXP USA Inc. MC22XS4200.pdf Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 12mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 12A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
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MGD3162AM551EKT MGD3162AM551EKT NXP USA Inc. SDS_GD3162.pdf Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
на замовлення 836 шт:
термін постачання 21-31 дні (днів)
1+787.26 грн
10+593.60 грн
25+552.52 грн
176+463.05 грн
352+449.61 грн
528+442.88 грн
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NAFE11348B40BSK NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NXP USA Inc. NAFE11388.pdf Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34DCH NXP USA Inc. 74AUP3G34.pdf Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
716+29.57 грн
Мінімальне замовлення: 716
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LS2084ASE7V17B NXP USA Inc. LS2084A%2C%20LS2044A.pdf Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
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SPC5747GK0AVKU6 SPC5747GK0AVKU6 NXP USA Inc. MPC5646C.pdf Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB MPC8349VVAJDB NXP USA Inc. Description: IC MPU 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Supplier Device Package: 672-LBGA (35x35)
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PCA1626U/F2,026 NXP USA Inc. PCA16XX.pdf Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB MIMX8QM5CVUFFAB NXP USA Inc. Download?colCode=IMX8QMAEC&amp;location=null Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PEMI2STD/LM,115 PEMI2STD/LM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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TEF6901AH/V5S,557 TEF6901AH/V5S,557 NXP USA Inc. TEF6901A.pdf Description: RF RECEIVER AM/FM/WB 64QFP
Packaging: Tray
Package / Case: 64-BQFP
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, WB
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 8V ~ 9V
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-QFP (14x14)
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PCA9509PGM,125 PCA9509PGM,125 NXP USA Inc. PCA9509P.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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PCA9509PGM,125 PCA9509PGM,125 NXP USA Inc. PCA9509P.pdf Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
на замовлення 3822 шт:
термін постачання 21-31 дні (днів)
6+60.30 грн
10+41.76 грн
25+37.58 грн
100+31.00 грн
250+28.95 грн
500+27.72 грн
1000+26.26 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MPC8378CVRAGDA NXP USA Inc. FSCLS11905-1.pdf?t.download=true&u=5oefqw Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 1937 шт:
термін постачання 21-31 дні (днів)
5+4853.28 грн
Мінімальне замовлення: 5
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88W8897PB1-NMJC/AZ NXP USA Inc. Description: 88W8897PB1-NMJC/AZ
Packaging: Bulk
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HEC4069UBT,118 HEC4069UBT,118 NXP USA Inc. HEF4069UB.pdf Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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PCA9846PWJ PCA9846PWJ NXP USA Inc. PCA9846.pdf Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
2500+90.49 грн
Мінімальне замовлення: 2500
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PCA9846PWJ PCA9846PWJ NXP USA Inc. PCA9846.pdf Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 3516 шт:
термін постачання 21-31 дні (днів)
2+174.31 грн
10+124.57 грн
25+113.76 грн
100+95.66 грн
250+90.72 грн
Мінімальне замовлення: 2
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S32K328NHT1MJBSR NXP USA Inc. S32K3xx.pdf Description: IC MCU
Packaging: Tape & Reel (TR)
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MC56F81646VLFR MC56F81646VLFR NXP USA Inc. MC56F81XXXL.pdf Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SFS2633AMDGCADR2 NXP USA Inc. Description: FS2600
Packaging: Tape & Reel (TR)
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SFS2633AMDGCAD NXP USA Inc. Description: FS2600
Packaging: Tray
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MPC8349EZUAJDB MPC8349EZUAJDB NXP USA Inc. MPC8349EAEC.pdf Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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NPIC6C596D,118 NPIC6C596D,118 NXP USA Inc. PHGL-S-A0000765027-1.pdf?t.download=true&u=5oefqw Description: IC SR OPEN DRAIN 8BIT 16-SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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RD5746RBMSEVM NXP USA Inc. Description: RD5746RBMSEVM
Packaging: Bulk
Contents: Board(s)
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TJA1446B-EVB NXP USA Inc. Description: TJA1446B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
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TJA1465A-EVB NXP USA Inc. Description: TJA1465A-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
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MCF51JF32VFM MCF51JF32VFM NXP USA Inc. MCF51JG256.pdf Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 6x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
DigiKey Programmable: Not Verified
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MCF51JF32VFM MCF51JF32VFM NXP USA Inc. MCF51JF128.pdf Description: MCF51JX 32-BIT MCU, COLDFIRE V1
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 6x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 948 шт:
термін постачання 21-31 дні (днів)
82+259.10 грн
Мінімальне замовлення: 82
В кошику  од. на суму  грн.
74HC175N,652 74HC175N,652 NXP USA Inc. 74HC_HCT175.pdf Description: IC FF D-TYPE SINGLE 4BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC126N,652 74HC126N,652 NXP USA Inc. 74HC%28T%29126.pdf Description: IC BUFFER NON-INVERT 6V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-DIP
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BCP69-16/DG,115 BCP69-16/DG,115 NXP USA Inc. BCP69%2CBC869%2CBC69A.pdf Description: TRANS PNP SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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MC32PF3000A2EPR2 MC32PF3000A2EPR2 NXP USA Inc. PF3000.pdf Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
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TDA8029HL/C206,118 TDA8029HL/C206,118 NXP USA Inc. TDA8029.pdf Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
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UBX100AHN/00200Y UBX100AHN/00200Y NXP USA Inc. ext_download.jsp?code=UBX100AHN Description: SUB-GHZ RF TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -128dBm
Mounting Type: Surface Mount
Frequency: 1GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 14dBm
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
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SJA1110AEL/1Y SJA1110AEL/1Y NXP USA Inc. Description: SJA1110AEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SJA1110AEL/1Y SJA1110AEL/1Y NXP USA Inc. Description: SJA1110AEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 516 шт:
термін постачання 21-31 дні (днів)
1+1533.22 грн
10+1181.55 грн
25+1107.87 грн
100+963.72 грн
250+927.49 грн
500+905.67 грн
В кошику  од. на суму  грн.
SJA1110CEL/1Y SJA1110CEL/1Y NXP USA Inc. Description: SJA1110CEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SJA1110CEL/1Y SJA1110CEL/1Y NXP USA Inc. Description: SJA1110CEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 835 шт:
термін постачання 21-31 дні (днів)
1+1172.22 грн
10+895.57 грн
25+837.31 грн
100+725.68 грн
250+697.03 грн
500+679.77 грн
В кошику  од. на суму  грн.
SJA1110DEL/1Y SJA1110DEL/1Y NXP USA Inc. Description: SJA1110DEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SJA1110DEL/1Y SJA1110DEL/1Y NXP USA Inc. Description: SJA1110DEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 928 шт:
термін постачання 21-31 дні (днів)
1+1250.70 грн
10+957.14 грн
25+895.50 грн
100+776.82 грн
250+746.51 грн
500+728.24 грн
В кошику  од. на суму  грн.
CGY1032,112 CGY1032,112 NXP USA Inc. CGY1032.pdf Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 265 mA
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MPC8314CVRAFDA MPC8314CVRAFDA NXP USA Inc. MPC8314EEC.pdf Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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SC33PF8200KKES NXP USA Inc. Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
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MFS2613AMDH3AD MFS2613AMDH3AD NXP USA Inc. MFS2633AMDAJAD.pdf Description: MFS2613AMDH3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
1+619.57 грн
10+463.14 грн
25+429.85 грн
100+369.06 грн
250+352.69 грн
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PBLS1503V,115 PBLS1503V,115 NXP USA Inc. PBLS1503Y_PBLS1503V.pdf Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
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MC33776ATA1AER2 MC33776ATA1AER2 NXP USA Inc. Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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MC33778ASA1AER2 MC33778ASA1AER2 NXP USA Inc. Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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MC35FS4505NAER2 35FS4500-35FS6500-ASILB.pdf
MC35FS4505NAER2
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC35FS4505NAE 35FS4500-35FS6500-ASILB.pdf
MC35FS4505NAE
Виробник: NXP USA Inc.
Description: SYSTEM BASIS CHIP, LINEAR 0.5A V
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TA)
Voltage - Supply: 1V ~ 5V
Applications: System Basis Chip
Supplier Device Package: 48-HLQFP (7x7)
Grade: Automotive
Qualification: AEC-Q100
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MC50XS4200DEKR2 MC22XS4200.pdf
MC50XS4200DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEKR2 MC22XS4200.pdf
MC22XS4200DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC50XS4200DEK MC20XS4200.pdf
MC50XS4200DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 50MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 41mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 1.65A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEKR2 MC07XS6517.pdf
MC17XS6400DEKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tape & Reel (TR)
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFKR2 MC22XS4200.pdf
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC20XS4200DFK MC22XS4200.pdf
MC20XS4200DFK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC22XS4200DEK MC22XS4200.pdf
MC22XS4200DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 22MO
Features: Internal PWM, Slew Rate Controlled
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 18.7mOhm
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.2A
Ratio - Input:Output: 1:1
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC17XS6400DEK MC12XS6D3.pdf
MC17XS6400DEK
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 12V, QUAD 17MO
Features: PWM Input, Slew Rate Controlled, Status Flag
Packaging: Tube
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 6
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 15mOhm
Input Type: Non-Inverting
Voltage - Load: 7V ~ 18V
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Current - Output (Max): 11A
Ratio - Input:Output: 1:6
Supplier Device Package: 32-HSOP
Fault Protection: Current Limiting (Adjustable), Open Load Detect, Over Temperature, Over Voltage, Reverse Current, Short Circuit, UVLO
Grade: Automotive
Qualification: AEC-Q100
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MC20XS4200BDFK MC22XS4200.pdf
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 20MO
Features: Internal PWM, Slew Rate Controlled, Watchdog Timer
Packaging: Tray
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 20mOhm (Max)
Input Type: Non-Inverting
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 4.4A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, Short Circuit, UVLO
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MC06XS4200DFKR2 MC22XS4200.pdf
MC06XS4200DFKR2
Виробник: NXP USA Inc.
Description: HIGH-SIDE SWITCH, 24V, DUAL 6MOH
Features: Internal PWM, Slew Rate Controlled
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerQFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 2
Interface: SPI
Switch Type: General Purpose
Operating Temperature: -40°C ~ 125°C (TA)
Output Configuration: High Side
Rds On (Typ): 12mOhm (Max)
Input Type: CMOS
Voltage - Load: 8V ~ 36V
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Current - Output (Max): 12A
Ratio - Input:Output: 1:1
Supplier Device Package: 23-PQFN (12x12)
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
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MGD3162AM551EKT SDS_GD3162.pdf
MGD3162AM551EKT
Виробник: NXP USA Inc.
Description: MGD3162AM551EKT
Packaging: Tray
Package / Case: 32-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Technology: Magnetic Coupling
Approval Agency: VDE
Supplier Device Package: 32-SOIC
Common Mode Transient Immunity (Min): 100V/ns
Grade: Automotive
Number of Channels: 1
Voltage - Output Supply: 0.3V ~ 25V
Qualification: AEC-Q100
на замовлення 836 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+787.26 грн
10+593.60 грн
25+552.52 грн
176+463.05 грн
352+449.61 грн
528+442.88 грн
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NAFE11348B40BSK NAFE11388.pdf
Виробник: NXP USA Inc.
Description: NAFE11348B40BSK
Packaging: Tray
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NAFE11348B40BSE NAFE11388.pdf
Виробник: NXP USA Inc.
Description: NAFE11348B40BSE
Packaging: Tray
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74AUP3G34DCH 74AUP3G34.pdf
74AUP3G34DCH
Виробник: NXP USA Inc.
Description: IC BUFF NON-INVERT 3.6V 8-VSSOP
Packaging: Bulk
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 3
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 0.8V ~ 3.6V
Number of Bits per Element: 1
Current - Output High, Low: 4mA, 4mA
Supplier Device Package: 8-VSSOP
на замовлення 716 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
716+29.57 грн
Мінімальне замовлення: 716
В кошику  од. на суму  грн.
LS2084ASE7V17B LS2084A%2C%20LS2044A.pdf
Виробник: NXP USA Inc.
Description: LAYERSCAPE 64-BIT ARM CORTEX-A72
Packaging: Tray
Package / Case: 1292-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 2GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: ARM® Cortex®-A72
Supplier Device Package: 1292-FCPBGA (37.5x37.5)
Ethernet: 10GbE (8), 1GbE (16), 2.5GbE (16)
USB: USB 3.0 + PHY (2)
Number of Cores/Bus Width: 8 Core, 64-Bit
RAM Controllers: DDR4, SDRAM
Graphics Acceleration: No
Security Features: Secure Boot, TrustZone®
SATA: SATA 6Gbps (2)
Additional Interfaces: DUART, eMMC/SD/SDIO, I2C, PCIe, SPI
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SPC5747GK0AVKU6 MPC5646C.pdf
SPC5747GK0AVKU6
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz, 160MHz, 160MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 768K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: e200z2, e200z4
Data Converters: A/D 80x10b, 64x12b SAR
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V, 3.15V ~ 5.5V
Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, WDT
Supplier Device Package: 176-LQFP (24x24)
Grade: Automotive
Number of I/O: 129
Qualification: AEC-Q100
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MPC8349VVAJDB
MPC8349VVAJDB
Виробник: NXP USA Inc.
Description: IC MPU 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Supplier Device Package: 672-LBGA (35x35)
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PCA1626U/F2,026 PCA16XX.pdf
Виробник: NXP USA Inc.
Description: IC WATCH CIRCUIT 32KHZ DIE
Packaging: Tray
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MIMX8QM5CVUFFAB Download?colCode=IMX8QMAEC&amp;location=null
MIMX8QM5CVUFFAB
Виробник: NXP USA Inc.
Description: MPU I.MX8 QUAD MAX
Packaging: Tray
Package / Case: 1313-BFBGA
Mounting Type: Surface Mount
Supplier Device Package: 1313-BGA (29x29)
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PEMI2STD/LM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/LM,115
Виробник: NXP USA Inc.
Description: FILTER RC(PI) 65 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 65Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 65
ESD Protection: Yes
Number of Channels: 2
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TEF6901AH/V5S,557 TEF6901A.pdf
TEF6901AH/V5S,557
Виробник: NXP USA Inc.
Description: RF RECEIVER AM/FM/WB 64QFP
Packaging: Tray
Package / Case: 64-BQFP
Mounting Type: Surface Mount
Modulation or Protocol: AM, FM, WB
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 8V ~ 9V
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 64-QFP (14x14)
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PCA9509PGM,125 PCA9509P.pdf
PCA9509PGM,125
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
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PCA9509PGM,125 PCA9509P.pdf
PCA9509PGM,125
Виробник: NXP USA Inc.
Description: IC REDRIVER I2C 2CH 400KHZ 8XQFN
Packaging: Cut Tape (CT)
Package / Case: 8-XFQFN Exposed Pad
Number of Channels: 2
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Applications: I2C
Current - Supply: 5µA
Data Rate (Max): 400kHz
Supplier Device Package: 8-XQFN (1.6x1.6)
Capacitance - Input: 10 pF
на замовлення 3822 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+60.30 грн
10+41.76 грн
25+37.58 грн
100+31.00 грн
250+28.95 грн
500+27.72 грн
1000+26.26 грн
Мінімальне замовлення: 6
В кошику  од. на суму  грн.
MPC8378CVRAGDA FSCLS11905-1.pdf?t.download=true&u=5oefqw
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ PBGA689
Packaging: Bulk
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 400MHz
Operating Temperature: -40°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
на замовлення 1937 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+4853.28 грн
Мінімальне замовлення: 5
В кошику  од. на суму  грн.
88W8897PB1-NMJC/AZ
Виробник: NXP USA Inc.
Description: 88W8897PB1-NMJC/AZ
Packaging: Bulk
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HEC4069UBT,118 HEF4069UB.pdf
HEC4069UBT,118
Виробник: NXP USA Inc.
Description: IC INVERTER 6CH 1-INP 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Logic Type: Inverter
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Current - Output High, Low: 3.4mA, 3.4mA
Number of Inputs: 1
Supplier Device Package: 14-SO
Input Logic Level - High: 4V ~ 12.5V
Input Logic Level - Low: 1V ~ 2.5V
Max Propagation Delay @ V, Max CL: 25ns @ 15V, 50pF
Number of Circuits: 6
Current - Quiescent (Max): 1 µA
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PCA9846PWJ PCA9846.pdf
PCA9846PWJ
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 2500 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2500+90.49 грн
Мінімальне замовлення: 2500
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PCA9846PWJ PCA9846.pdf
PCA9846PWJ
Виробник: NXP USA Inc.
Description: IC BUS SWITCH 2 X 4:1 16-TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Circuit: 2 x 4:1
Type: Bus Switch
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 0.8V ~ 3.6V, 1.65V ~ 3.6V
Independent Circuits: 1
Voltage Supply Source: Dual Supply
Supplier Device Package: 16-TSSOP
на замовлення 3516 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+174.31 грн
10+124.57 грн
25+113.76 грн
100+95.66 грн
250+90.72 грн
Мінімальне замовлення: 2
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S32K328NHT1MJBSR S32K3xx.pdf
Виробник: NXP USA Inc.
Description: IC MCU
Packaging: Tape & Reel (TR)
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MC56F81646VLFR MC56F81XXXL.pdf
MC56F81646VLFR
Виробник: NXP USA Inc.
Description: 32-BIT DSC, 56800EX CORE, 64KB F
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Interface: I2C, LINbus, QSCI, QSPI
Type: Digital Signal Controllers
Operating Temperature: -40°C ~ 105°C (TA)
Non-Volatile Memory: FLASH (64kB)
On-Chip RAM: 12kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 48-LQFP (7x7)
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SFS2633AMDGCADR2
Виробник: NXP USA Inc.
Description: FS2600
Packaging: Tape & Reel (TR)
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SFS2633AMDGCAD
Виробник: NXP USA Inc.
Description: FS2600
Packaging: Tray
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MPC8349EZUAJDB MPC8349EAEC.pdf
MPC8349EZUAJDB
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ 672LBGA
Packaging: Tray
Package / Case: 672-LBGA
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e300
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 672-LBGA (35x35)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (2)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, PCI, SPI
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NPIC6C596D,118 PHGL-S-A0000765027-1.pdf?t.download=true&u=5oefqw
NPIC6C596D,118
Виробник: NXP USA Inc.
Description: IC SR OPEN DRAIN 8BIT 16-SO
Packaging: Bulk
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Number of Bits per Element: 8
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RD5746RBMSEVM
Виробник: NXP USA Inc.
Description: RD5746RBMSEVM
Packaging: Bulk
Contents: Board(s)
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TJA1446B-EVB
Виробник: NXP USA Inc.
Description: TJA1446B-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
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TJA1465A-EVB
Виробник: NXP USA Inc.
Description: TJA1465A-EVB
Packaging: Bulk
Function: CANbus
Type: Interface
Contents: Board(s)
Utilized IC / Part: TJA1121
Platform: Arduino
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MCF51JF32VFM MCF51JG256.pdf
MCF51JF32VFM
Виробник: NXP USA Inc.
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 6x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
DigiKey Programmable: Not Verified
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MCF51JF32VFM MCF51JF128.pdf
MCF51JF32VFM
Виробник: NXP USA Inc.
Description: MCF51JX 32-BIT MCU, COLDFIRE V1
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 50MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: Coldfire V1
Data Converters: A/D 6x12b; D/A 1x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI, UART/USART, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 32-HVQFN (5x5)
Number of I/O: 22
DigiKey Programmable: Not Verified
на замовлення 948 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
82+259.10 грн
Мінімальне замовлення: 82
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74HC175N,652 74HC_HCT175.pdf
74HC175N,652
Виробник: NXP USA Inc.
Description: IC FF D-TYPE SINGLE 4BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Complementary
Mounting Type: Through Hole
Number of Elements: 1
Function: Master Reset
Type: D-Type
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Current - Quiescent (Iq): 8 µA
Current - Output High, Low: 5.2mA, 5.2mA
Trigger Type: Positive Edge
Clock Frequency: 89 MHz
Input Capacitance: 3.5 pF
Supplier Device Package: 16-DIP
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Number of Bits per Element: 4
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74HC126N,652 74HC%28T%29126.pdf
74HC126N,652
Виробник: NXP USA Inc.
Description: IC BUFFER NON-INVERT 6V 14-DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Output Type: 3-State
Mounting Type: Through Hole
Number of Elements: 4
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2V ~ 6V
Number of Bits per Element: 1
Current - Output High, Low: 7.8mA, 7.8mA
Supplier Device Package: 14-DIP
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BCP69-16/DG,115 BCP69%2CBC869%2CBC69A.pdf
BCP69-16/DG,115
Виробник: NXP USA Inc.
Description: TRANS PNP SC73
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Supplier Device Package: SC-73
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MC32PF3000A2EPR2 PF3000.pdf
MC32PF3000A2EPR2
Виробник: NXP USA Inc.
Description: POWER MANAGEMENT IC I.MX7 PRE-
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.8V ~ 5.5V
Applications: i.MX Processors
Supplier Device Package: 48-HVQFN (7x7)
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TDA8029HL/C206,118 TDA8029.pdf
TDA8029HL/C206,118
Виробник: NXP USA Inc.
Description: IC INTERFACE SPECIALIZED 32LQFP
Packaging: Tape & Reel (TR)
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 2.7V ~ 6V
Applications: Smart Card
Supplier Device Package: 32-LQFP (7x7)
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UBX100AHN/00200Y ext_download.jsp?code=UBX100AHN
UBX100AHN/00200Y
Виробник: NXP USA Inc.
Description: SUB-GHZ RF TRANSCEIVER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Sensitivity: -128dBm
Mounting Type: Surface Mount
Frequency: 1GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Power - Output: 14dBm
Data Rate (Max): 2Mbps
Supplier Device Package: 48-HVQFN (7x7)
RF Family/Standard: General ISM < 1GHz
Serial Interfaces: SPI
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SJA1110AEL/1Y
SJA1110AEL/1Y
Виробник: NXP USA Inc.
Description: SJA1110AEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SJA1110AEL/1Y
SJA1110AEL/1Y
Виробник: NXP USA Inc.
Description: SJA1110AEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 516 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1533.22 грн
10+1181.55 грн
25+1107.87 грн
100+963.72 грн
250+927.49 грн
500+905.67 грн
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SJA1110CEL/1Y
SJA1110CEL/1Y
Виробник: NXP USA Inc.
Description: SJA1110CEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SJA1110CEL/1Y
SJA1110CEL/1Y
Виробник: NXP USA Inc.
Description: SJA1110CEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 835 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1172.22 грн
10+895.57 грн
25+837.31 грн
100+725.68 грн
250+697.03 грн
500+679.77 грн
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SJA1110DEL/1Y
SJA1110DEL/1Y
Виробник: NXP USA Inc.
Description: SJA1110DEL/1Y
Packaging: Tape & Reel (TR)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
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SJA1110DEL/1Y
SJA1110DEL/1Y
Виробник: NXP USA Inc.
Description: SJA1110DEL/1Y
Packaging: Cut Tape (CT)
Package / Case: 256-LFBGA
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Protocol: Ethernet
Standards: 10/100 Base-T/TX PHY
Supplier Device Package: 256-LFBGA (14x14)
DigiKey Programmable: Not Verified
на замовлення 928 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+1250.70 грн
10+957.14 грн
25+895.50 грн
100+776.82 грн
250+746.51 грн
500+728.24 грн
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CGY1032,112 CGY1032.pdf
CGY1032,112
Виробник: NXP USA Inc.
Description: IC AMP CATV SOT115J
Packaging: Bulk
Package / Case: SOT-115J
Mounting Type: Chassis Mount
Applications: CATV
Supplier Device Package: SOT115J
Number of Circuits: 1
Current - Supply: 265 mA
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MPC8314CVRAFDA MPC8314EEC.pdf
MPC8314CVRAFDA
Виробник: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 620HBGA
Packaging: Tray
Package / Case: 620-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 620-HBGA (29x29)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI, TDM
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SC33PF8200KKES
Виробник: NXP USA Inc.
Description: PMIC I.MX8, 7 BUCK REG,4 LDOS
Packaging: Tray
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MFS2613AMDH3AD MFS2633AMDAJAD.pdf
MFS2613AMDH3AD
Виробник: NXP USA Inc.
Description: MFS2613AMDH3AD
Packaging: Tray
Package / Case: 48-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.2V ~ 36V
Applications: System Basis Chip
Supplier Device Package: 48-LQFP-EP (7x7)
на замовлення 250 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+619.57 грн
10+463.14 грн
25+429.85 грн
100+369.06 грн
250+352.69 грн
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PBLS1503V,115 PBLS1503Y_PBLS1503V.pdf
PBLS1503V,115
Виробник: NXP USA Inc.
Description: TRANS PREBIAS 1NPN 1PNP SOT-666
Packaging: Tape & Reel (TR)
Package / Case: SOT-563, SOT-666
Mounting Type: Surface Mount
Transistor Type: 1 NPN Pre-Biased, 1 PNP
Power - Max: 300mW
Current - Collector (Ic) (Max): 100mA, 500mA
Voltage - Collector Emitter Breakdown (Max): 50V, 15V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA / 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 1µA, 100nA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V / 150 @ 100mA. 2V
Frequency - Transition: 280MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: SOT-666
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MC33776ATA1AER2
MC33776ATA1AER2
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: TPL
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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MC33778ASA1AER2
MC33778ASA1AER2
Виробник: NXP USA Inc.
Description: BATTERY JUNCTION BOX CONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Function: Battery Monitor
Interface: SPI
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: 64-LQFP (10x10)
Fault Protection: Over Current, Over/Under Voltage
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В кошику  од. на суму  грн.
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