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MIDRANGESBCV33BOARDTOBO1 MIDRANGESBCV33BOARDTOBO1 Infineon Technologies MIDRANGESBCV33BOARDTOBO1_Web.pdf Description: IC SBC 3 REG CAN 48VQFN
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: TLE9263
Supplied Contents: Board(s)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
1+10914.25 грн
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CY15E004J-SXE CY15E004J-SXE Infineon Technologies Infineon-CY15E004J_4_KBIT_(512_X_8)_SERIAL_(I2C)_AUTOMOTIVE-E_F-RAM-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee3a8be6a71&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FRAM 4KBIT I2C 3.4MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 3.4 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: I2C
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CY90F598GPFR-GSE1 CY90F598GPFR-GSE1 Infineon Technologies Infineon-CY90598G_F598G_V595G_F2MC-16LX_CY90595G_Series_CMOS_16-bit_Proprietary_Microcontroller_Datasheet-AdditionalTechnicalInformation-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edda37e6222&utm_source=cypress&utm_medium=refe Description: IC MCU 16BIT 128KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-QFP (14x20)
Number of I/O: 78
DigiKey Programmable: Not Verified
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CY7C1512AV18-250BZC CY7C1512AV18-250BZC Infineon Technologies CY7C15%2812%2C14%29AV18_8.pdf Description: IC SRAM 72MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Memory Interface: Parallel
Memory Organization: 4M x 18
DigiKey Programmable: Not Verified
на замовлення 249 шт:
термін постачання 21-31 дні (днів)
3+8706.91 грн
Мінімальне замовлення: 3
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S6E0003H0AGV2000A Infineon Technologies Description: MULTI-MARKET MCUS
Packaging: Tray
на замовлення 600 шт:
термін постачання 21-31 дні (днів)
1+957.67 грн
10+847.66 грн
60+812.53 грн
120+671.84 грн
240+638.87 грн
480+597.65 грн
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IRS2108PBF IRS2108PBF Infineon Technologies IRSDS08085-1.pdf?t.download=true&u=5oefqw Description: IC GATE DRVR HALF-BRIDGE 8DIP
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Inverting, Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 8-PDIP
Rise / Fall Time (Typ): 100ns, 35ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
DigiKey Programmable: Not Verified
на замовлення 11854 шт:
термін постачання 21-31 дні (днів)
160+129.75 грн
Мінімальне замовлення: 160
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S29GL01GT10DHSS20 S29GL01GT10DHSS20 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
на замовлення 162 шт:
термін постачання 21-31 дні (днів)
100+723.06 грн
Мінімальне замовлення: 100
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IM323M6G2XKMA1 Infineon Technologies IM323-M6G_IM323-M6G2 Ver2.0_12-1-22.pdf Description: CIPOS TINY
Packaging: Tube
Package / Case: 26-PowerDIP Module (1.043", 26.50mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Current: 10 A
Voltage: 600 V
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FS150R12KT4B11BOSA1 FS150R12KT4B11BOSA1 Infineon Technologies INFNS28532-1.pdf?t.download=true&u=5oefqw Description: IGBT MOD 1200V 150A 750W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 150A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 150 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 9.35 nF @ 25 V
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
3+8514.33 грн
Мінімальне замовлення: 3
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S28HS02GTFPBHB050 S28HS02GTFPBHB050 Infineon Technologies Infineon-S28HS02GT_S28HS04GT_S28HL02GT_S28HL04GT_2Gb_4Gb_SEMPER_Flash_Octal_interface_1.8V_3.0V-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7e7124d1017f0631e33714d9 Description: IC FLASH 2GBIT SPI/OCTAL 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (8x8)
Memory Interface: SPI - Octal I/O
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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IMW120R060M1HXKSA1 IMW120R060M1HXKSA1 Infineon Technologies Infineon-IMW120R060M1H-DS-v01_01-EN.pdf?fileId=5546d46269e1c019016a92fd535b6681 Description: SICFET N-CH 1.2KV 36A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 78mOhm @ 13A, 18V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 5.7V @ 5.6mA
Supplier Device Package: PG-TO247-3-41
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 800 V
на замовлення 867 шт:
термін постачання 21-31 дні (днів)
1+726.10 грн
30+411.18 грн
120+352.57 грн
510+314.68 грн
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CY7C1312KV18-300BZXC CY7C1312KV18-300BZXC Infineon Technologies download Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Bulk
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
на замовлення 78 шт:
термін постачання 21-31 дні (днів)
10+2241.96 грн
Мінімальне замовлення: 10
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CY7C1312CV18-250BZI CY7C1312CV18-250BZI Infineon Technologies CY7C1312%2C14CV18.pdf Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
9+2660.88 грн
Мінімальне замовлення: 9
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CY9AFA44MBPMC1-G-JNE2 CY9AFA44MBPMC1-G-JNE2 Infineon Technologies Infineon-CY9AA40NB_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee0465565d8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
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TLS810A1LDV33BOARDTOBO1 Infineon Technologies Description: TLS810A1LDV33 BOARD
Packaging: Bulk
Voltage - Output: 3.3V
Voltage - Input: 3V ~ 42V
Current - Output: 100mA
Regulator Type: Positive Fixed
Board Type: Fully Populated
Utilized IC / Part: TLS810A1LD
Supplied Contents: Board(s)
Channels per IC: 1 - Single
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
1+3926.43 грн
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IRSM515-044DA Infineon Technologies IRSM505-044_IRSM515-044_Series.pdf Description: IC HALF BRIDGE DRIVER 3A 23DIP
Features: Bootstrap Circuit
Packaging: Tube
Package / Case: 32-PowerDIP Module, 23 Leads
Mounting Type: Through Hole
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 13.5V ~ 16.5V
Rds On (Typ): 800mOhm
Applications: AC Motors
Current - Output / Channel: 3A
Current - Peak Output: 15A
Technology: UMOS
Voltage - Load: 200V (Max)
Supplier Device Package: 23-DIP
Fault Protection: UVLO
Load Type: Inductive
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S6BP401AL2SN1B200 Infineon Technologies Infineon-S6BP401A_Power_Management_IC_for_Automotive_ADAS_Platform-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed50c9b53cf Description: PMIC AUTO ANALOG
Packaging: Tape & Reel (TR)
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MB89P935BPFV-G-BI8E1 MB89P935BPFV-G-BI8E1 Infineon Technologies 5047 Description: IC MCU 8BIT 16KB OTP 30SSOP
Packaging: Bulk
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 30-SSOP
Number of I/O: 21
DigiKey Programmable: Not Verified
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PEF 3304 E V2.1-G Infineon Technologies PEB%2C%20PEF%2033xx.pdf Description: IC TELECOM INTERFACE 176-LBGA
Packaging: Tray
Package / Case: 176-LBGA
Mounting Type: Surface Mount
Function: Analog Voice Access
Interface: JTAG, PCM, SCI/SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: PG-LBGA-176
Number of Circuits: 4
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CY7C68000-56LFXC CY7C68000-56LFXC Infineon Technologies CY7C68000_8.pdf Description: IC TRANSCEIVER FULL 1/1 56QFN
Packaging: Tube
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Number of Drivers/Receivers: 1/1
Protocol: USB 2.0
Supplier Device Package: 56-QFN (8x8)
Duplex: Full
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S6BP401AL2SN1B000 S6BP401AL2SN1B000 Infineon Technologies download Description: ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.97V ~ 5.5V
Frequency - Switching: 2.1MHz
Topology: Step-Down (Buck) Synchronous (4), Linear (LDO) (2)
Supplier Device Package: 40-QFN (6x6)
Voltage/Current - Output 1: 1.25V, 2A
Voltage/Current - Output 2: 1.125V, 3A
Voltage/Current - Output 3: 2.55V, 2A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Grade: Automotive
Number of Outputs: 6
Qualification: AEC-Q100
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CYUSB3304-BVXI CYUSB3304-BVXI Infineon Technologies Infineon-CYUSB330x_CYUSB331x_CYUSB332x_HX3_USB_3.0_Hub-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecb53f644b8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC USB 3.0 HUB 4-PORT 100BGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
Controller Series: CYUSB
Program Memory Type: ROM (32kB)
Applications: USB 3.0 Hub Controller
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 100-VFBGA (6x6)
Number of I/O: 10
DigiKey Programmable: Not Verified
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CY9AF344MAPMC-G-MNE2 CY9AF344MAPMC-G-MNE2 Infineon Technologies Infineon-CY9A340NB_Series_32_bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v04_00-EN.pdf Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 1269 шт:
термін постачання 21-31 дні (днів)
1+789.68 грн
10+594.44 грн
25+552.89 грн
119+471.74 грн
238+456.57 грн
476+444.09 грн
952+426.70 грн
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IPB035N12NM6ATMA1 Infineon Technologies Infineon-IPB035N12NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018e55d4064f25cd Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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CY9BF367MPMC1-G-JNE2 CY9BF367MPMC1-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 800KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 800KB (800K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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CY62157H30-45BVXAT CY62157H30-45BVXAT Infineon Technologies Infineon-CY62157H30-45BVXA-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0fb2e298275f Description: IC SRAM 8MBIT PARALLEL 48VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 512K x 16
DigiKey Programmable: Not Verified
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CY95F632KPMC-G-UNE2 CY95F632KPMC-G-UNE2 Infineon Technologies Infineon-CY95630H_Series_New_8FX_8-bit_Microcontrollers-AdditionalTechnicalInformation-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edd859f61fe&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration- Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I2C, LINbus, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
на замовлення 2498 шт:
термін постачання 21-31 дні (днів)
2+189.18 грн
10+163.20 грн
25+154.29 грн
80+125.49 грн
230+119.06 грн
440+106.83 грн
945+88.62 грн
Мінімальне замовлення: 2
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CY95F632KNPMC-G-UNE2 CY95F632KNPMC-G-UNE2 Infineon Technologies Infineon-CY95F632KNPMC-G-UNE2-FITReport-v01_00-EN.pdf?fileId=8ac78c8c850f4bee018511b51eb32f46&da=t Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I2C, LINbus, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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DD175N34KXPSA1 Infineon Technologies Description: THYR / DIODE MODULE DK
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 223A
Supplier Device Package: Module
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 3400 V
Voltage - Forward (Vf) (Max) @ If: 2.06 V @ 600 A
Current - Reverse Leakage @ Vr: 20 mA @ 3.4 kV
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DD175N30KHPSA1 DD175N30KHPSA1 Infineon Technologies Infineon-DD175N-DS-v03_00-EN.pdf?fileId=db3a304412b407950112b43062595032 Description: DIODE MODULE GP 3000V 223A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 223A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3000 V
Voltage - Forward (Vf) (Max) @ If: 2.05 V @ 600 A
Current - Reverse Leakage @ Vr: 20 mA @ 3000 V
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DD175N32KHPSA1 DD175N32KHPSA1 Infineon Technologies Infineon-DD175N-DS-v03_00-EN.pdf?fileId=db3a304412b407950112b43062595032 Description: DIODE MODULE GP 3200V 223A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 223A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3200 V
Voltage - Forward (Vf) (Max) @ If: 2.05 V @ 600 A
Current - Reverse Leakage @ Vr: 20 mA @ 3200 V
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KITT2G-B-HEVK KITT2G-B-HEVK Infineon Technologies Infineon-KIT_T2G-B-H_EVK_TRAVEO_T2G_Body_High_evaluation_kit_guide-UserManual-v02_00-EN.pdf?fileId=8ac78c8c8823155701886921ead71a59 Description: TRAVEO CYT4BF BODY HIGH EVAL BRD
Packaging: Tray
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-M0+, Cortex®-M7
Utilized IC / Part: CYT4BF
Platform: TRAVEO CYT4BF Body High
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
1+41305.22 грн
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CY9AF114NBGL-GK9E1 CY9AF114NBGL-GK9E1 Infineon Technologies Description: IC MCU 32BIT 256KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
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SIDC23D120H8X1SA1 Infineon Technologies Infineon-SIDC23D120H8-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c821f38900182205169e320a3 Description: DIODE GP 1.2KV 35A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.97 V @ 35 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
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CY9BF524LPMC1-GNE2 CY9BF524LPMC1-GNE2 Infineon Technologies Infineon-CY9B520M_SERIES_32_BIT_ARM_CORTEX_M3_FM3_MICROCONTROLLER-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edb80555e92 Description: IC MCU 32BIT 288KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 23x12b SAR; D/A 2x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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CY62147GN30-45ZSXIT CY62147GN30-45ZSXIT Infineon Technologies download Description: IC SRAM 4MBIT PARALLEL 44TSOP II
Packaging: Tape & Reel (TR)
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 256K x 16
DigiKey Programmable: Not Verified
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TLS805B1SJVBOARDTOBO1 TLS805B1SJVBOARDTOBO1 Infineon Technologies Description: EVAL BOARD FOR TLS805B1SJV
Packaging: Bulk
Voltage - Input: 3V ~ 42V
Current - Output: 50mA
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: TLS805B1SJV
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Contents: Board(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+4203.52 грн
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T880N18TOFXPSA1 T880N18TOFXPSA1 Infineon Technologies Infineon-T880N-DS-v01_00-en_de.pdf?fileId=db3a304323b87bc20123ffb85bf75bf8 Description: SCR MODULE 1800V 1750A DO200AB
Packaging: Tray
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 120°C
Structure: Single
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17500A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 880 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 1750 A
Voltage - Off State: 1.8 kV
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FF150R12KE3GB2HOSA1 FF150R12KE3GB2HOSA1 Infineon Technologies FF150R12KE3G.pdf Description: IGBT MODULE VCES 1200V 150A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge Inverter
Operating Temperature: -40°C ~ 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 150A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 780 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 11 nF @ 25 V
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+7185.63 грн
10+5765.32 грн
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S29AS016J70BHI042 S29AS016J70BHI042 Infineon Technologies Infineon-S29AS016J_16_Mbit_(2_M_x_8-Bit_1_M_x_16-Bit)_1.8_V_Boot_Sector_Flash-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed720655837&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration Description: IC FLASH 16MBIT PARALLEL 48FBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-FBGA (8.15x6.15)
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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KITA2GTC3875VTRBTOBO1 KITA2GTC3875VTRBTOBO1 Infineon Technologies Infineon-TriBoardManual_TC3X71-UserManual-v02_01-EN.pdf?fileId=5546d462696dbf1201697775dd0b58be Description: AURIX TC387 5V TRB FIXED BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: TriCore™
Utilized IC / Part: TC387
Platform: AURIX TC387 5V TRB Fixed
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
1+64375.54 грн
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S6BP401A90SN1B000 Infineon Technologies Description: IC REG
Packaging: Tape & Reel (TR)
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CY9AFAA2NPMC-G-SNE2 CY9AFAA2NPMC-G-SNE2 Infineon Technologies Infineon-CY9AAA0N_SERIES_32_BIT_Arm_Cortex_M3_FM3_MICROCONTROLLER-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee0a9a66657&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CSIO, I2C, UART/USART
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 84
DigiKey Programmable: Not Verified
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
1+707.26 грн
10+614.77 грн
25+586.15 грн
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CY8C4247AZA-M483T CY8C4247AZA-M483T Infineon Technologies Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, Temp Sensor, WDT
Supplier Device Package: 48-TQFP (7x7)
Grade: Automotive
Number of I/O: 38
Qualification: AEC-Q100
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CY8C4247AZS-M483T CY8C4247AZS-M483T Infineon Technologies Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 38
Qualification: AEC-Q100
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BSZ105N04NSGATMA2 Infineon Technologies Infineon-BSZ105N04NSG-DS-v02_00-en.pdf?fileId=db3a30431689f4420116c485c67f084e Description: TRENCH <= 40V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 40A (Tc)
Rds On (Max) @ Id, Vgs: 10.5mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 35W (Tc)
Vgs(th) (Max) @ Id: 4V @ 14µA
Supplier Device Package: PG-TSDSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 20 V
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CY9BF002BGL-G-101-K7ERE1 Infineon Technologies Description: IC MCU
Packaging: Tape & Reel (TR)
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S29GL01GS10TFA020 S29GL01GS10TFA020 Infineon Technologies Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium=referral&utm_campai Description: IC FLASH 1GBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Grade: Automotive
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 64M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CY9AF155NBGL-GK9E1 CY9AF155NBGL-GK9E1 Infineon Technologies Description: IC MCU 32BIT 416KB FLASH 112FBGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 416KB (416K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
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TLE5555ICMEE6XTMA1 TLE5555ICMEE6XTMA1 Infineon Technologies Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
на замовлення 3506 шт:
термін постачання 21-31 дні (днів)
2+271.60 грн
5+234.03 грн
10+223.67 грн
25+198.49 грн
50+190.65 грн
100+183.47 грн
500+166.27 грн
1000+163.46 грн
Мінімальне замовлення: 2
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TLE5555ICBE0TOPXTMA1 TLE5555ICBE0TOPXTMA1 Infineon Technologies Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICBE0TOPXTMA1 TLE5555ICBE0TOPXTMA1 Infineon Technologies Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
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TLE5555ICBE1TOPXTMA1 TLE5555ICBE1TOPXTMA1 Infineon Technologies Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICBE1TOPXTMA1 TLE5555ICBE1TOPXTMA1 Infineon Technologies Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
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TLE5555ICBE4BTOPXTMA1 TLE5555ICBE4BTOPXTMA1 Infineon Technologies Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICBE4BTOPXTMA1 TLE5555ICBE4BTOPXTMA1 Infineon Technologies Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
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TLE5555ICMEFXXTMA1 TLE5555ICMEFXXTMA1 Infineon Technologies Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICMEE1XTMA1 TLE5555ICMEE1XTMA1 Infineon Technologies Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICMEE0XTMA1 TLE5555ICMEE0XTMA1 Infineon Technologies Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICMEE4BXTMA1 TLE5555ICMEE4BXTMA1 Infineon Technologies Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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MIDRANGESBCV33BOARDTOBO1 MIDRANGESBCV33BOARDTOBO1_Web.pdf
MIDRANGESBCV33BOARDTOBO1
Виробник: Infineon Technologies
Description: IC SBC 3 REG CAN 48VQFN
Packaging: Bulk
Function: System Basis Chip (SBC)
Type: Interface
Utilized IC / Part: TLE9263
Supplied Contents: Board(s)
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+10914.25 грн
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CY15E004J-SXE Infineon-CY15E004J_4_KBIT_(512_X_8)_SERIAL_(I2C)_AUTOMOTIVE-E_F-RAM-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee3a8be6a71&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY15E004J-SXE
Виробник: Infineon Technologies
Description: IC FRAM 4KBIT I2C 3.4MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 3.4 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: I2C
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CY90F598GPFR-GSE1 Infineon-CY90598G_F598G_V595G_F2MC-16LX_CY90595G_Series_CMOS_16-bit_Proprietary_Microcontroller_Datasheet-AdditionalTechnicalInformation-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edda37e6222&utm_source=cypress&utm_medium=refe
CY90F598GPFR-GSE1
Виробник: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 100-QFP (14x20)
Number of I/O: 78
DigiKey Programmable: Not Verified
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CY7C1512AV18-250BZC CY7C15%2812%2C14%29AV18_8.pdf
CY7C1512AV18-250BZC
Виробник: Infineon Technologies
Description: IC SRAM 72MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Memory Interface: Parallel
Memory Organization: 4M x 18
DigiKey Programmable: Not Verified
на замовлення 249 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+8706.91 грн
Мінімальне замовлення: 3
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S6E0003H0AGV2000A
Виробник: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
на замовлення 600 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+957.67 грн
10+847.66 грн
60+812.53 грн
120+671.84 грн
240+638.87 грн
480+597.65 грн
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IRS2108PBF IRSDS08085-1.pdf?t.download=true&u=5oefqw
IRS2108PBF
Виробник: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 8DIP
Packaging: Bulk
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Inverting, Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 8-PDIP
Rise / Fall Time (Typ): 100ns, 35ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
DigiKey Programmable: Not Verified
на замовлення 11854 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
160+129.75 грн
Мінімальне замовлення: 160
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S29GL01GT10DHSS20 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL01GT10DHSS20
Виробник: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
на замовлення 162 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
100+723.06 грн
Мінімальне замовлення: 100
В кошику  од. на суму  грн.
IM323M6G2XKMA1 IM323-M6G_IM323-M6G2 Ver2.0_12-1-22.pdf
Виробник: Infineon Technologies
Description: CIPOS TINY
Packaging: Tube
Package / Case: 26-PowerDIP Module (1.043", 26.50mm)
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Current: 10 A
Voltage: 600 V
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FS150R12KT4B11BOSA1 INFNS28532-1.pdf?t.download=true&u=5oefqw
FS150R12KT4B11BOSA1
Виробник: Infineon Technologies
Description: IGBT MOD 1200V 150A 750W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 150A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 150 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 9.35 nF @ 25 V
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+8514.33 грн
Мінімальне замовлення: 3
В кошику  од. на суму  грн.
S28HS02GTFPBHB050 Infineon-S28HS02GT_S28HS04GT_S28HL02GT_S28HL04GT_2Gb_4Gb_SEMPER_Flash_Octal_interface_1.8V_3.0V-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7e7124d1017f0631e33714d9
S28HS02GTFPBHB050
Виробник: Infineon Technologies
Description: IC FLASH 2GBIT SPI/OCTAL 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (8x8)
Memory Interface: SPI - Octal I/O
Memory Organization: 256M x 8
DigiKey Programmable: Not Verified
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IMW120R060M1HXKSA1 Infineon-IMW120R060M1H-DS-v01_01-EN.pdf?fileId=5546d46269e1c019016a92fd535b6681
IMW120R060M1HXKSA1
Виробник: Infineon Technologies
Description: SICFET N-CH 1.2KV 36A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 36A (Tc)
Rds On (Max) @ Id, Vgs: 78mOhm @ 13A, 18V
Power Dissipation (Max): 150W (Tc)
Vgs(th) (Max) @ Id: 5.7V @ 5.6mA
Supplier Device Package: PG-TO247-3-41
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 31 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1060 pF @ 800 V
на замовлення 867 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+726.10 грн
30+411.18 грн
120+352.57 грн
510+314.68 грн
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CY7C1312KV18-300BZXC download
CY7C1312KV18-300BZXC
Виробник: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Bulk
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
на замовлення 78 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+2241.96 грн
Мінімальне замовлення: 10
В кошику  од. на суму  грн.
CY7C1312CV18-250BZI CY7C1312%2C14CV18.pdf
CY7C1312CV18-250BZI
Виробник: Infineon Technologies
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
на замовлення 239 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+2660.88 грн
Мінімальне замовлення: 9
В кошику  од. на суму  грн.
CY9AFA44MBPMC1-G-JNE2 Infineon-CY9AA40NB_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee0465565d8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9AFA44MBPMC1-G-JNE2
Виробник: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 66
DigiKey Programmable: Not Verified
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TLS810A1LDV33BOARDTOBO1
Виробник: Infineon Technologies
Description: TLS810A1LDV33 BOARD
Packaging: Bulk
Voltage - Output: 3.3V
Voltage - Input: 3V ~ 42V
Current - Output: 100mA
Regulator Type: Positive Fixed
Board Type: Fully Populated
Utilized IC / Part: TLS810A1LD
Supplied Contents: Board(s)
Channels per IC: 1 - Single
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+3926.43 грн
В кошику  од. на суму  грн.
IRSM515-044DA IRSM505-044_IRSM515-044_Series.pdf
Виробник: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 3A 23DIP
Features: Bootstrap Circuit
Packaging: Tube
Package / Case: 32-PowerDIP Module, 23 Leads
Mounting Type: Through Hole
Interface: Logic
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 13.5V ~ 16.5V
Rds On (Typ): 800mOhm
Applications: AC Motors
Current - Output / Channel: 3A
Current - Peak Output: 15A
Technology: UMOS
Voltage - Load: 200V (Max)
Supplier Device Package: 23-DIP
Fault Protection: UVLO
Load Type: Inductive
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S6BP401AL2SN1B200 Infineon-S6BP401A_Power_Management_IC_for_Automotive_ADAS_Platform-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed50c9b53cf
Виробник: Infineon Technologies
Description: PMIC AUTO ANALOG
Packaging: Tape & Reel (TR)
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MB89P935BPFV-G-BI8E1 5047
MB89P935BPFV-G-BI8E1
Виробник: Infineon Technologies
Description: IC MCU 8BIT 16KB OTP 30SSOP
Packaging: Bulk
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 30-SSOP
Number of I/O: 21
DigiKey Programmable: Not Verified
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PEF 3304 E V2.1-G PEB%2C%20PEF%2033xx.pdf
Виробник: Infineon Technologies
Description: IC TELECOM INTERFACE 176-LBGA
Packaging: Tray
Package / Case: 176-LBGA
Mounting Type: Surface Mount
Function: Analog Voice Access
Interface: JTAG, PCM, SCI/SPI
Operating Temperature: -40°C ~ 85°C
Supplier Device Package: PG-LBGA-176
Number of Circuits: 4
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CY7C68000-56LFXC CY7C68000_8.pdf
CY7C68000-56LFXC
Виробник: Infineon Technologies
Description: IC TRANSCEIVER FULL 1/1 56QFN
Packaging: Tube
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Number of Drivers/Receivers: 1/1
Protocol: USB 2.0
Supplier Device Package: 56-QFN (8x8)
Duplex: Full
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S6BP401AL2SN1B000 download
S6BP401AL2SN1B000
Виробник: Infineon Technologies
Description: ANALOG
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.97V ~ 5.5V
Frequency - Switching: 2.1MHz
Topology: Step-Down (Buck) Synchronous (4), Linear (LDO) (2)
Supplier Device Package: 40-QFN (6x6)
Voltage/Current - Output 1: 1.25V, 2A
Voltage/Current - Output 2: 1.125V, 3A
Voltage/Current - Output 3: 2.55V, 2A
w/LED Driver: No
w/Supervisor: No
w/Sequencer: No
Grade: Automotive
Number of Outputs: 6
Qualification: AEC-Q100
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CYUSB3304-BVXI Infineon-CYUSB330x_CYUSB331x_CYUSB332x_HX3_USB_3.0_Hub-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecb53f644b8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CYUSB3304-BVXI
Виробник: Infineon Technologies
Description: IC USB 3.0 HUB 4-PORT 100BGA
Packaging: Tray
Package / Case: 100-VFBGA
Mounting Type: Surface Mount
Interface: I2C
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.14V ~ 1.26V, 2.5V ~ 2.7V, 3V ~ 3.6V
Controller Series: CYUSB
Program Memory Type: ROM (32kB)
Applications: USB 3.0 Hub Controller
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 100-VFBGA (6x6)
Number of I/O: 10
DigiKey Programmable: Not Verified
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CY9AF344MAPMC-G-MNE2 Infineon-CY9A340NB_Series_32_bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v04_00-EN.pdf
CY9AF344MAPMC-G-MNE2
Виробник: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Number of I/O: 66
DigiKey Programmable: Not Verified
на замовлення 1269 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+789.68 грн
10+594.44 грн
25+552.89 грн
119+471.74 грн
238+456.57 грн
476+444.09 грн
952+426.70 грн
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IPB035N12NM6ATMA1 Infineon-IPB035N12NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018e55d4064f25cd
Виробник: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
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CY9BF367MPMC1-G-JNE2 download
CY9BF367MPMC1-G-JNE2
Виробник: Infineon Technologies
Description: IC MCU 32BIT 800KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 800KB (800K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 63
DigiKey Programmable: Not Verified
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CY62157H30-45BVXAT Infineon-CY62157H30-45BVXA-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0fb2e298275f
CY62157H30-45BVXAT
Виробник: Infineon Technologies
Description: IC SRAM 8MBIT PARALLEL 48VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 8Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 512K x 16
DigiKey Programmable: Not Verified
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CY95F632KPMC-G-UNE2 Infineon-CY95630H_Series_New_8FX_8-bit_Microcontrollers-AdditionalTechnicalInformation-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edd859f61fe&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-
CY95F632KPMC-G-UNE2
Виробник: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I2C, LINbus, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
на замовлення 2498 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+189.18 грн
10+163.20 грн
25+154.29 грн
80+125.49 грн
230+119.06 грн
440+106.83 грн
945+88.62 грн
Мінімальне замовлення: 2
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CY95F632KNPMC-G-UNE2 Infineon-CY95F632KNPMC-G-UNE2-FITReport-v01_00-EN.pdf?fileId=8ac78c8c850f4bee018511b51eb32f46&da=t
CY95F632KNPMC-G-UNE2
Виробник: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I2C, LINbus, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 29
DigiKey Programmable: Not Verified
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DD175N34KXPSA1
Виробник: Infineon Technologies
Description: THYR / DIODE MODULE DK
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 223A
Supplier Device Package: Module
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 3400 V
Voltage - Forward (Vf) (Max) @ If: 2.06 V @ 600 A
Current - Reverse Leakage @ Vr: 20 mA @ 3.4 kV
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DD175N30KHPSA1 Infineon-DD175N-DS-v03_00-EN.pdf?fileId=db3a304412b407950112b43062595032
DD175N30KHPSA1
Виробник: Infineon Technologies
Description: DIODE MODULE GP 3000V 223A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 223A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3000 V
Voltage - Forward (Vf) (Max) @ If: 2.05 V @ 600 A
Current - Reverse Leakage @ Vr: 20 mA @ 3000 V
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DD175N32KHPSA1 Infineon-DD175N-DS-v03_00-EN.pdf?fileId=db3a304412b407950112b43062595032
DD175N32KHPSA1
Виробник: Infineon Technologies
Description: DIODE MODULE GP 3200V 223A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 223A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3200 V
Voltage - Forward (Vf) (Max) @ If: 2.05 V @ 600 A
Current - Reverse Leakage @ Vr: 20 mA @ 3200 V
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KITT2G-B-HEVK Infineon-KIT_T2G-B-H_EVK_TRAVEO_T2G_Body_High_evaluation_kit_guide-UserManual-v02_00-EN.pdf?fileId=8ac78c8c8823155701886921ead71a59
KITT2G-B-HEVK
Виробник: Infineon Technologies
Description: TRAVEO CYT4BF BODY HIGH EVAL BRD
Packaging: Tray
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM® Cortex®-M0+, Cortex®-M7
Utilized IC / Part: CYT4BF
Platform: TRAVEO CYT4BF Body High
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+41305.22 грн
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CY9AF114NBGL-GK9E1
CY9AF114NBGL-GK9E1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 112BGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
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SIDC23D120H8X1SA1 Infineon-SIDC23D120H8-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c821f38900182205169e320a3
Виробник: Infineon Technologies
Description: DIODE GP 1.2KV 35A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 35A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.97 V @ 35 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
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CY9BF524LPMC1-GNE2 Infineon-CY9B520M_SERIES_32_BIT_ARM_CORTEX_M3_FM3_MICROCONTROLLER-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edb80555e92
CY9BF524LPMC1-GNE2
Виробник: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 23x12b SAR; D/A 2x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 50
DigiKey Programmable: Not Verified
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CY62147GN30-45ZSXIT download
CY62147GN30-45ZSXIT
Виробник: Infineon Technologies
Description: IC SRAM 4MBIT PARALLEL 44TSOP II
Packaging: Tape & Reel (TR)
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 4Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 256K x 16
DigiKey Programmable: Not Verified
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TLS805B1SJVBOARDTOBO1
TLS805B1SJVBOARDTOBO1
Виробник: Infineon Technologies
Description: EVAL BOARD FOR TLS805B1SJV
Packaging: Bulk
Voltage - Input: 3V ~ 42V
Current - Output: 50mA
Regulator Type: Positive Adjustable
Board Type: Fully Populated
Utilized IC / Part: TLS805B1SJV
Supplied Contents: Board(s)
Channels per IC: 1 - Single
Contents: Board(s)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+4203.52 грн
В кошику  од. на суму  грн.
T880N18TOFXPSA1 Infineon-T880N-DS-v01_00-en_de.pdf?fileId=db3a304323b87bc20123ffb85bf75bf8
T880N18TOFXPSA1
Виробник: Infineon Technologies
Description: SCR MODULE 1800V 1750A DO200AB
Packaging: Tray
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 120°C
Structure: Single
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17500A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 880 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 1750 A
Voltage - Off State: 1.8 kV
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FF150R12KE3GB2HOSA1 FF150R12KE3G.pdf
FF150R12KE3GB2HOSA1
Виробник: Infineon Technologies
Description: IGBT MODULE VCES 1200V 150A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge Inverter
Operating Temperature: -40°C ~ 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 150A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 780 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 11 nF @ 25 V
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+7185.63 грн
10+5765.32 грн
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S29AS016J70BHI042 Infineon-S29AS016J_16_Mbit_(2_M_x_8-Bit_1_M_x_16-Bit)_1.8_V_Boot_Sector_Flash-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed720655837&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration
S29AS016J70BHI042
Виробник: Infineon Technologies
Description: IC FLASH 16MBIT PARALLEL 48FBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 48-FBGA (8.15x6.15)
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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KITA2GTC3875VTRBTOBO1 Infineon-TriBoardManual_TC3X71-UserManual-v02_01-EN.pdf?fileId=5546d462696dbf1201697775dd0b58be
KITA2GTC3875VTRBTOBO1
Виробник: Infineon Technologies
Description: AURIX TC387 5V TRB FIXED BRD
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: TriCore™
Utilized IC / Part: TC387
Platform: AURIX TC387 5V TRB Fixed
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+64375.54 грн
В кошику  од. на суму  грн.
S6BP401A90SN1B000
Виробник: Infineon Technologies
Description: IC REG
Packaging: Tape & Reel (TR)
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CY9AFAA2NPMC-G-SNE2 Infineon-CY9AAA0N_SERIES_32_BIT_Arm_Cortex_M3_FM3_MICROCONTROLLER-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee0a9a66657&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9AFAA2NPMC-G-SNE2
Виробник: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CSIO, I2C, UART/USART
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 84
DigiKey Programmable: Not Verified
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+707.26 грн
10+614.77 грн
25+586.15 грн
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CY8C4247AZA-M483T
CY8C4247AZA-M483T
Виробник: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, Temp Sensor, WDT
Supplier Device Package: 48-TQFP (7x7)
Grade: Automotive
Number of I/O: 38
Qualification: AEC-Q100
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CY8C4247AZS-M483T
CY8C4247AZS-M483T
Виробник: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 38
Qualification: AEC-Q100
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BSZ105N04NSGATMA2 Infineon-BSZ105N04NSG-DS-v02_00-en.pdf?fileId=db3a30431689f4420116c485c67f084e
Виробник: Infineon Technologies
Description: TRENCH <= 40V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 40A (Tc)
Rds On (Max) @ Id, Vgs: 10.5mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 35W (Tc)
Vgs(th) (Max) @ Id: 4V @ 14µA
Supplier Device Package: PG-TSDSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 20 V
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CY9BF002BGL-G-101-K7ERE1
Виробник: Infineon Technologies
Description: IC MCU
Packaging: Tape & Reel (TR)
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S29GL01GS10TFA020 Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium=referral&utm_campai
S29GL01GS10TFA020
Виробник: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Grade: Automotive
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 64M x 16
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CY9AF155NBGL-GK9E1
CY9AF155NBGL-GK9E1
Виробник: Infineon Technologies
Description: IC MCU 32BIT 416KB FLASH 112FBGA
Packaging: Tray
Package / Case: 112-LFBGA
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 416KB (416K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 112-PFBGA (10x10)
Number of I/O: 83
DigiKey Programmable: Not Verified
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TLE5555ICMEE6XTMA1
TLE5555ICMEE6XTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
на замовлення 3506 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+271.60 грн
5+234.03 грн
10+223.67 грн
25+198.49 грн
50+190.65 грн
100+183.47 грн
500+166.27 грн
1000+163.46 грн
Мінімальне замовлення: 2
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TLE5555ICBE0TOPXTMA1 Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b
TLE5555ICBE0TOPXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICBE0TOPXTMA1 Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b
TLE5555ICBE0TOPXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
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TLE5555ICBE1TOPXTMA1 Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b
TLE5555ICBE1TOPXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICBE1TOPXTMA1 Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b
TLE5555ICBE1TOPXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
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TLE5555ICBE4BTOPXTMA1 Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b
TLE5555ICBE4BTOPXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICBE4BTOPXTMA1 Infineon-TLE5555iCB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c01900305ae825b7b
TLE5555ICBE4BTOPXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Cut Tape (CT)
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TLE5555ICMEFXXTMA1
TLE5555ICMEFXXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICMEE1XTMA1
TLE5555ICMEE1XTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICMEE0XTMA1
TLE5555ICMEE0XTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
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TLE5555ICMEE4BXTMA1
TLE5555ICMEE4BXTMA1
Виробник: Infineon Technologies
Description: SPEED & CURRENT SENSORS
Packaging: Tape & Reel (TR)
товару немає в наявності
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