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APT40GL120JU3 APT40GL120JU3 Microchip Technology 7009-apt40gl120ju3-datasheet Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APTGF150A60T3AG Microchip Technology APTGF150A60T3AG.pdf Description: IGBT MODULE 600V 230A 833W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 230 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 833 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
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APTGF50DH120T3G Microchip Technology APTGF50DH120T3G.pdf Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
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APTGF50DSK120T3G Microchip Technology APTGF50DSK120T3G.pdf Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
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APTGL120TDU120TPG Microchip Technology 7624-aptgl120tdu120tpg-datasheet Description: IGBT MODULE 1200V 140A 517W SP6P
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Triple, Dual - Common Source
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: SP6-P
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 517 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
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APTGL40H120T1G Microchip Technology Description: IGBT MODULE 1200V 65A 220W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APTGL40X120T3G Microchip Technology 7632-aptgl40x120t3g-datasheet Description: IGBT MODULE 1200V 65A 220W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APTGL90A120T1G Microchip Technology 7646-aptgl90a120t1g-datasheet Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Through Hole
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGL90DA120T1G Microchip Technology 7647-aptgl90da120t1g-datasheet Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APT90DR160HJ APT90DR160HJ Microchip Technology 7310-apt90dr160hj-datasheet Description: BRIDGE RECT 1PHASE 1.6KV SOT-227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 1.6 kV
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A
Current - Reverse Leakage @ Vr: 50 µA @ 1600 V
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APTGL90DDA120T3G Microchip Technology 7648-aptgl90dda120t3g-datasheet Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Boost Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGL90DSK120T3G Microchip Technology 7650-aptgl90dsk120t3g-datasheet Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGL90H120T3G Microchip Technology 7651-aptgl90h120t3g-datasheet Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGT200DA60T3AG APTGT200DA60T3AG Microchip Technology 7766-aptgt200da60t3ag-datasheet Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
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APTGT200SK60T3AG Microchip Technology 7779-aptgt200sk60t3ag-datasheet Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
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APTGT20TL601G Microchip Technology 7790-aptgt20tl601g-datasheet Description: IGBT MODULE 600V 32A 62W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A
NTC Thermistor: No
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 32 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 62 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V
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APT60DF20HJ APT60DF20HJ Microchip Technology 7186-apt60df20hj-datasheet Description: BRIDGE RECT 1P 200V 90A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 90 A
Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
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APT75DF170HJ APT75DF170HJ Microchip Technology 7237-apt75df170hj-datasheet Description: BRIDGE RECT 1P 1.7KV 75A SOT227
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APT75DL120HJ APT75DL120HJ Microchip Technology 7238-apt75dl120hj-datasheet Description: BRIDGE RECT 1P 1.2KV 75A SOT227
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APT40GL120JU2 APT40GL120JU2 Microchip Technology 7008-apt40gl120ju2-datasheet Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APT13F120S APT13F120S Microchip Technology 6621-apt13f120b-apt13f120s-datasheet Description: MOSFET N-CH 1200V 14A D3PAK
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APT14F100S APT14F100S Microchip Technology 6625-apt14f100bg-apt14f100sg-datasheet Description: MOSFET N-CH 1000V 14A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V
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APT17F80S APT17F80S Microchip Technology APT17F80B_S_C.pdf Description: MOSFET N-CH 800V 18A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V
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APT37F50S APT37F50S Microchip Technology 6980-apt37f50b-apt37f50s-datasheet Description: MOSFET N-CH 500V 37A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V
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APT33N90JCU2 APT33N90JCU2 Microchip Technology Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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APT33N90JCU3 APT33N90JCU3 Microchip Technology Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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APTC60DDAM45T1G Microchip Technology 7333-aptc60ddam45t1g-datasheet Description: MOSFET 2N-CH 600V 49A SP1
Packaging: Tray
Package / Case: SP1
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 49A
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Supplier Device Package: SP1
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APTC60DSKM24T3G APTC60DSKM24T3G Microchip Technology 7340-aptc60dskm24t3g-datasheet Description: MOSFET 2N-CH 600V 95A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 462W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 95A
Input Capacitance (Ciss) (Max) @ Vds: 14400pF @ 25V
Rds On (Max) @ Id, Vgs: 24mOhm @ 47.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 300nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 5mA
Supplier Device Package: SP3
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
1+6910.74 грн
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APTC60HM70BT3G Microchip Technology 123994-aptc60hm70bt3g-datasheet Description: MOSFET 4N-CH 600V 39A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 4 N-Channel (Full Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 39A
Input Capacitance (Ciss) (Max) @ Vds: 700pF @ 25V
Rds On (Max) @ Id, Vgs: 70mOhm @ 39A, 10V
Gate Charge (Qg) (Max) @ Vgs: 259nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 3.9V @ 2.7mA
Supplier Device Package: SP3
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APT30DQ60BHBG APT30DQ60BHBG Microchip Technology 6883-apt30dq60bhbg-datasheet Description: DIODE ARRAY GP 600V 30A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-247
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.4 V @ 30 A
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
1+404.63 грн
100+316.87 грн
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APT25GN120SG APT25GN120SG Microchip Technology 6785-apt25gn120bg-apt25gn120sg-datasheet Description: IGBT 1200V 67A 272W D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT200GT60JR APT200GT60JR Microchip Technology 6714-apt200gt60jr-datasheet Description: IGBT MOD 600V 195A 500W SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: NPT
Current - Collector (Ic) (Max): 195 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 500 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 8.65 nF @ 25 V
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APT17F100S APT17F100S Microchip Technology APT17F100B_S_D.pdf Description: MOSFET N-CH 1000V 17A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 780mOhm @ 9A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4845 pF @ 25 V
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APT42F50S APT42F50S Microchip Technology 7028-apt42f50b-apt42f50s-datasheet Description: MOSFET N-CH 500V 42A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 130mOhm @ 21A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6810 pF @ 25 V
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APT30F50S APT30F50S Microchip Technology 6891-apt30f50b-apt30f50s-datasheet Description: MOSFET N-CH 500V 30A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 30A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 14A, 10V
Power Dissipation (Max): 415W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 115 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4525 pF @ 25 V
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APTC60VDAM45T1G Microchip Technology 7362-aptc60vdam45t1g-datasheet Description: MOSFET 2N-CH 600V 49A SP1
Packaging: Tray
Package / Case: SP1
Mounting Type: Chassis Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 49A
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Supplier Device Package: SP1
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24LC128T-I/SN 24LC128T-I/SN Microchip Technology 24AA128-24LC128-24FC128-128K-I2C-Serial-EEPROM-DS.pdf Description: IC EEPROM 128KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 16K x 8
DigiKey Programmable: Verified
на замовлення 5992 шт:
термін постачання 21-31 дні (днів)
6+56.75 грн
Мінімальне замовлення: 6
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24LC32AT-I/SN 24LC32AT-I/SN Microchip Technology 24AA32A-24LC32A-32-Kbit-I2C-Serial-EEPROM-DS20001713.pdf Description: IC EEPROM 32KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 32Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 4K x 8
DigiKey Programmable: Verified
на замовлення 76239 шт:
термін постачання 21-31 дні (днів)
10+35.36 грн
Мінімальне замовлення: 10
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LAN8710A-EZC-TR LAN8710A-EZC-TR Microchip Technology 00002164B.pdf Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
на замовлення 24997 шт:
термін постачання 21-31 дні (днів)
5+78.13 грн
25+62.94 грн
100+60.70 грн
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LAN8710A-EZK-TR LAN8710A-EZK-TR Microchip Technology 00002164B.pdf Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
на замовлення 49543 шт:
термін постачання 21-31 дні (днів)
2+168.59 грн
10+120.38 грн
25+109.92 грн
100+92.38 грн
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LAN8720A-CP-TR LAN8720A-CP-TR Microchip Technology LAN8720A-LAN8720Ai-Data-Sheet-DS00002165.pdf Description: IC TRANSCEIVER FULL 2/2 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 24-QFN (4x4)
Duplex: Full
Part Status: Active
на замовлення 13388 шт:
термін постачання 21-31 дні (днів)
5+73.19 грн
25+58.83 грн
100+56.43 грн
Мінімальне замовлення: 5
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MCP23S17T-E/SS MCP23S17T-E/SS Microchip Technology MCP23017-Data-Sheet-DS20001952.pdf Description: IC XPNDR 10MHZ SPI 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Clock Frequency: 10 MHz
Interrupt Output: Yes
Supplier Device Package: 28-SSOP
Current - Output Source/Sink: 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 25189 шт:
термін постачання 21-31 дні (днів)
3+125.83 грн
25+101.21 грн
100+91.71 грн
Мінімальне замовлення: 3
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MCP2515T-I/SO MCP2515T-I/SO Microchip Technology MCP2515-Stand-Alone-CAN-Controller-with-SPI-20001801J.pdf Description: IC CAN CONTROLLER W/SPI 18SOIC
Packaging: Cut Tape (CT)
Package / Case: 18-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 10mA
Protocol: CANbus
Standards: CAN 2.0
Supplier Device Package: 18-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 21129 шт:
термін постачання 21-31 дні (днів)
2+173.53 грн
25+138.85 грн
100+126.54 грн
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MCP2515T-I/ST MCP2515T-I/ST Microchip Technology MCP2515-Stand-Alone-CAN-Controller-with-SPI-20001801J.pdf Description: IC CAN CONTROLLER W/SPI 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 10mA
Protocol: CANbus
Standards: CAN 2.0
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 13462 шт:
термін постачання 21-31 дні (днів)
2+189.98 грн
25+152.53 грн
100+138.85 грн
Мінімальне замовлення: 2
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MCP2551T-E/SN MCP2551T-E/SN Microchip Technology 20001667G.pdf Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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MCP6002T-I/SN MCP6002T-I/SN Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OPAMP GP 2 CIRCUIT 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x2 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
на замовлення 25432 шт:
термін постачання 21-31 дні (днів)
12+28.78 грн
25+23.25 грн
100+21.20 грн
Мінімальне замовлення: 12
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MCP6004T-I/ST MCP6004T-I/ST Microchip Technology MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf Description: IC OPAMP GP 4 CIRCUIT 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
на замовлення 49462 шт:
термін постачання 21-31 дні (днів)
9+38.65 грн
25+30.09 грн
100+28.04 грн
Мінімальне замовлення: 9
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USB3320C-EZK-TR USB3320C-EZK-TR Microchip Technology 00001792E.pdf Description: IC TRANSCEIVER HALF 1/1 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Number of Drivers/Receivers: 1/1
Protocol: USB 2.0
Supplier Device Package: 32-QFN (5x5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
на замовлення 14330 шт:
термін постачання 21-31 дні (днів)
3+152.97 грн
25+122.21 грн
100+112.02 грн
Мінімальне замовлення: 3
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DS3102GN Microchip Technology DS3102_data_sheet_2012-04.pdf Description: IC TIMING LINE CARD 81CSBGA
Packaging: Tray
Package / Case: 81-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CMOS, LVDS, LVPECL, TTL
Frequency - Max: 312.5MHz
Input: CMOS, LVDS, LVPECL, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 1.98V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 8:7
Differential - Input:Output: No/Yes
Supplier Device Package: 81-CSBGA (10x10)
PLL: Yes
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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DS31400GN Microchip Technology DS31400_short_form_2012-04.pdf Description: IC TIMING DUAL DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 8:14
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSPBGA (17x17)
PLL: Yes
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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DS31404GN2 Microchip Technology DS31404_short_form_2012-04.pdf Description: IC TIMING DUAL DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 4:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSBGA (17x17)
PLL: Yes
Part Status: Active
Number of Circuits: 2
DigiKey Programmable: Not Verified
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DS31408GN Microchip Technology DS31408_short_form_2012-04.pdf Description: IC TIMING DUAL DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 8:14
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSBGA (17x17)
PLL: Yes
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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LE57D122BTC Microchip Technology LE5712_RevG_V2.pdf Description: IC TELECOM INTERFACE 44TQFP
Packaging: Tray
Package / Case: 44-TQFP Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 2-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 44-TQFP-EP (10x10)
Number of Circuits: 2
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LE58083ABGC Microchip Technology LE58083_RevE_V2.pdf Description: IC TELECOM INTERFACE 121BGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 121-LFBGA (10x10)
Number of Circuits: 1
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DS31415GN2 Microchip Technology DS31415_short_form_2012-04.pdf Description: IC TIMING SINGLE DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 3:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSBGA (17x17)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
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LE58QL02FJCT Microchip Technology LE58QL02_021_031_Ver9.pdf Description: IC TELECOM INTERFACE 44PLCC
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LE78D110BVC LE78D110BVC Microchip Technology LE78D11_RevD_V2.pdf Description: IC TELECOM INTERFACE 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Function: Voice Over IP Processor
Interface: PCM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 44-TQFP (10x10)
Number of Circuits: 1
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LE79R70-1FQC LE79R70-1FQC Microchip Technology LE79R70_RevJ_V2.pdf Description: IC TELECOM INTERFACE 32QFN
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LE79R79-1FQC LE79R79-1FQC Microchip Technology LE79R79_RevO_V2.pdf Description: IC TELECOM INTERFACE 32QFN
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LE58QL031DJC Microchip Technology LE58QL02_021_031_Ver9.pdf Description: IC TELECOM INTERFACE 32PLCC
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APT40GL120JU3 7009-apt40gl120ju3-datasheet
APT40GL120JU3
Виробник: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APTGF150A60T3AG APTGF150A60T3AG.pdf
Виробник: Microchip Technology
Description: IGBT MODULE 600V 230A 833W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Part Status: Obsolete
Current - Collector (Ic) (Max): 230 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 833 W
Current - Collector Cutoff (Max): 350 µA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
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APTGF50DH120T3G APTGF50DH120T3G.pdf
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Asymmetrical Bridge
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
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APTGF50DSK120T3G APTGF50DSK120T3G.pdf
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 70A 312W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: NPT
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 312 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 3.45 nF @ 25 V
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APTGL120TDU120TPG 7624-aptgl120tdu120tpg-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 140A 517W SP6P
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Triple, Dual - Common Source
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: SP6-P
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 517 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 6.2 nF @ 25 V
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APTGL40H120T1G
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 65A 220W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APTGL40X120T3G 7632-aptgl40x120t3g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 65A 220W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APTGL90A120T1G 7646-aptgl90a120t1g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Through Hole
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGL90DA120T1G 7647-aptgl90da120t1g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APT90DR160HJ 7310-apt90dr160hj-datasheet
APT90DR160HJ
Виробник: Microchip Technology
Description: BRIDGE RECT 1PHASE 1.6KV SOT-227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 1.6 kV
Voltage - Forward (Vf) (Max) @ If: 1.3 V @ 90 A
Current - Reverse Leakage @ Vr: 50 µA @ 1600 V
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APTGL90DDA120T3G 7648-aptgl90dda120t3g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Boost Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGL90DSK120T3G 7650-aptgl90dsk120t3g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Buck Chopper
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGL90H120T3G 7651-aptgl90h120t3g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 1200V 110A 385W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 110 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 385 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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APTGT200DA60T3AG 7766-aptgt200da60t3ag-datasheet
APTGT200DA60T3AG
Виробник: Microchip Technology
Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
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APTGT200SK60T3AG 7779-aptgt200sk60t3ag-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 600V 290A 750W SP3
Packaging: Bulk
Package / Case: SP3
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: Yes
Supplier Device Package: SP3
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 290 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 750 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 12.3 nF @ 25 V
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APTGT20TL601G 7790-aptgt20tl601g-datasheet
Виробник: Microchip Technology
Description: IGBT MODULE 600V 32A 62W SP1
Packaging: Bulk
Package / Case: SP1
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 20A
NTC Thermistor: No
Supplier Device Package: SP1
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 32 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 62 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.1 pF @ 25 V
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APT60DF20HJ 7186-apt60df20hj-datasheet
APT60DF20HJ
Виробник: Microchip Technology
Description: BRIDGE RECT 1P 200V 90A SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: SOT-227
Voltage - Peak Reverse (Max): 200 V
Current - Average Rectified (Io): 90 A
Voltage - Forward (Vf) (Max) @ If: 1.15 V @ 60 A
Current - Reverse Leakage @ Vr: 250 µA @ 200 V
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APT75DF170HJ 7237-apt75df170hj-datasheet
APT75DF170HJ
Виробник: Microchip Technology
Description: BRIDGE RECT 1P 1.7KV 75A SOT227
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APT75DL120HJ 7238-apt75dl120hj-datasheet
APT75DL120HJ
Виробник: Microchip Technology
Description: BRIDGE RECT 1P 1.2KV 75A SOT227
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APT40GL120JU2 7008-apt40gl120ju2-datasheet
APT40GL120JU2
Виробник: Microchip Technology
Description: IGBT MOD 1200V 65A 220W SOT227
Packaging: Bulk
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis, Stud Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 35A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 220 W
Current - Collector Cutoff (Max): 250 µA
Input Capacitance (Cies) @ Vce: 1.95 nF @ 25 V
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APT13F120S 6621-apt13f120b-apt13f120s-datasheet
APT13F120S
Виробник: Microchip Technology
Description: MOSFET N-CH 1200V 14A D3PAK
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APT14F100S 6625-apt14f100bg-apt14f100sg-datasheet
APT14F100S
Виробник: Microchip Technology
Description: MOSFET N-CH 1000V 14A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 980mOhm @ 7A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 120 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3965 pF @ 25 V
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APT17F80S APT17F80B_S_C.pdf
APT17F80S
Виробник: Microchip Technology
Description: MOSFET N-CH 800V 18A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 9A, 10V
Power Dissipation (Max): 500W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 800 V
Gate Charge (Qg) (Max) @ Vgs: 122 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3757 pF @ 25 V
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APT37F50S 6980-apt37f50b-apt37f50s-datasheet
APT37F50S
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 37A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 37A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 18A, 10V
Power Dissipation (Max): 520W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5710 pF @ 25 V
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APT33N90JCU2
APT33N90JCU2
Виробник: Microchip Technology
Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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APT33N90JCU3
APT33N90JCU3
Виробник: Microchip Technology
Description: MOSFET N-CH 900V 33A SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 33A (Tc)
Rds On (Max) @ Id, Vgs: 120mOhm @ 26A, 10V
Power Dissipation (Max): 290W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 3mA
Supplier Device Package: SOT-227
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 270 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6800 pF @ 100 V
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APTC60DDAM45T1G 7333-aptc60ddam45t1g-datasheet
Виробник: Microchip Technology
Description: MOSFET 2N-CH 600V 49A SP1
Packaging: Tray
Package / Case: SP1
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 49A
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Supplier Device Package: SP1
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APTC60DSKM24T3G 7340-aptc60dskm24t3g-datasheet
APTC60DSKM24T3G
Виробник: Microchip Technology
Description: MOSFET 2N-CH 600V 95A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 2 N Channel (Dual Buck Chopper)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 462W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 95A
Input Capacitance (Ciss) (Max) @ Vds: 14400pF @ 25V
Rds On (Max) @ Id, Vgs: 24mOhm @ 47.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 300nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 5mA
Supplier Device Package: SP3
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+6910.74 грн
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APTC60HM70BT3G 123994-aptc60hm70bt3g-datasheet
Виробник: Microchip Technology
Description: MOSFET 4N-CH 600V 39A SP3
Packaging: Tray
Package / Case: SP3
Mounting Type: Chassis Mount
Configuration: 4 N-Channel (Full Bridge)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 39A
Input Capacitance (Ciss) (Max) @ Vds: 700pF @ 25V
Rds On (Max) @ Id, Vgs: 70mOhm @ 39A, 10V
Gate Charge (Qg) (Max) @ Vgs: 259nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 3.9V @ 2.7mA
Supplier Device Package: SP3
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APT30DQ60BHBG 6883-apt30dq60bhbg-datasheet
APT30DQ60BHBG
Виробник: Microchip Technology
Description: DIODE ARRAY GP 600V 30A TO247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 30A
Supplier Device Package: TO-247
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.4 V @ 30 A
на замовлення 150 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
1+404.63 грн
100+316.87 грн
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APT25GN120SG 6785-apt25gn120bg-apt25gn120sg-datasheet
APT25GN120SG
Виробник: Microchip Technology
Description: IGBT 1200V 67A 272W D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 25A
Supplier Device Package: D3Pak
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 22ns/280ns
Test Condition: 800V, 25A, 1Ohm, 15V
Gate Charge: 155 nC
Current - Collector (Ic) (Max): 67 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 272 W
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APT200GT60JR 6714-apt200gt60jr-datasheet
APT200GT60JR
Виробник: Microchip Technology
Description: IGBT MOD 600V 195A 500W SOT227
Packaging: Tray
Package / Case: SOT-227-4, miniBLOC
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: SOT-227
IGBT Type: NPT
Current - Collector (Ic) (Max): 195 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 500 W
Current - Collector Cutoff (Max): 25 µA
Input Capacitance (Cies) @ Vce: 8.65 nF @ 25 V
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APT17F100S APT17F100B_S_D.pdf
APT17F100S
Виробник: Microchip Technology
Description: MOSFET N-CH 1000V 17A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 780mOhm @ 9A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 1000 V
Gate Charge (Qg) (Max) @ Vgs: 150 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4845 pF @ 25 V
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APT42F50S 7028-apt42f50b-apt42f50s-datasheet
APT42F50S
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 42A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 130mOhm @ 21A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6810 pF @ 25 V
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APT30F50S 6891-apt30f50b-apt30f50s-datasheet
APT30F50S
Виробник: Microchip Technology
Description: MOSFET N-CH 500V 30A D3PAK
Packaging: Tube
Package / Case: TO-268-3, D3PAK (2 Leads + Tab), TO-268AA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 30A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 14A, 10V
Power Dissipation (Max): 415W (Tc)
Vgs(th) (Max) @ Id: 5V @ 1mA
Supplier Device Package: D3Pak
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±30V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 115 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4525 pF @ 25 V
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APTC60VDAM45T1G 7362-aptc60vdam45t1g-datasheet
Виробник: Microchip Technology
Description: MOSFET 2N-CH 600V 49A SP1
Packaging: Tray
Package / Case: SP1
Mounting Type: Chassis Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 250W
Drain to Source Voltage (Vdss): 600V
Current - Continuous Drain (Id) @ 25°C: 49A
Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
Vgs(th) (Max) @ Id: 3.9V @ 3mA
Supplier Device Package: SP1
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24LC128T-I/SN 24AA128-24LC128-24FC128-128K-I2C-Serial-EEPROM-DS.pdf
24LC128T-I/SN
Виробник: Microchip Technology
Description: IC EEPROM 128KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 128Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 16K x 8
DigiKey Programmable: Verified
на замовлення 5992 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
6+56.75 грн
Мінімальне замовлення: 6
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24LC32AT-I/SN 24AA32A-24LC32A-32-Kbit-I2C-Serial-EEPROM-DS20001713.pdf
24LC32AT-I/SN
Виробник: Microchip Technology
Description: IC EEPROM 32KBIT I2C 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 32Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.5V ~ 5.5V
Technology: EEPROM
Clock Frequency: 400 kHz
Memory Format: EEPROM
Supplier Device Package: 8-SOIC
Part Status: Active
Write Cycle Time - Word, Page: 5ms
Memory Interface: I2C
Access Time: 900 ns
Memory Organization: 4K x 8
DigiKey Programmable: Verified
на замовлення 76239 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
10+35.36 грн
Мінімальне замовлення: 10
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LAN8710A-EZC-TR 00002164B.pdf
LAN8710A-EZC-TR
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
на замовлення 24997 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+78.13 грн
25+62.94 грн
100+60.70 грн
Мінімальне замовлення: 5
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LAN8710A-EZK-TR 00002164B.pdf
LAN8710A-EZK-TR
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 4/4 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 4/4
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 32-QFN (5x5)
Duplex: Full
Part Status: Active
на замовлення 49543 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+168.59 грн
10+120.38 грн
25+109.92 грн
100+92.38 грн
Мінімальне замовлення: 2
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LAN8720A-CP-TR LAN8720A-LAN8720Ai-Data-Sheet-DS00002165.pdf
LAN8720A-CP-TR
Виробник: Microchip Technology
Description: IC TRANSCEIVER FULL 2/2 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: 0°C ~ 85°C
Voltage - Supply: 1.6V ~ 3.6V
Number of Drivers/Receivers: 2/2
Data Rate: 100Mbps
Protocol: MII, RMII
Supplier Device Package: 24-QFN (4x4)
Duplex: Full
Part Status: Active
на замовлення 13388 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
5+73.19 грн
25+58.83 грн
100+56.43 грн
Мінімальне замовлення: 5
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MCP23S17T-E/SS MCP23017-Data-Sheet-DS20001952.pdf
MCP23S17T-E/SS
Виробник: Microchip Technology
Description: IC XPNDR 10MHZ SPI 28SSOP
Packaging: Cut Tape (CT)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 16
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.8V ~ 5.5V
Clock Frequency: 10 MHz
Interrupt Output: Yes
Supplier Device Package: 28-SSOP
Current - Output Source/Sink: 25mA
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 25189 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+125.83 грн
25+101.21 грн
100+91.71 грн
Мінімальне замовлення: 3
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MCP2515T-I/SO MCP2515-Stand-Alone-CAN-Controller-with-SPI-20001801J.pdf
MCP2515T-I/SO
Виробник: Microchip Technology
Description: IC CAN CONTROLLER W/SPI 18SOIC
Packaging: Cut Tape (CT)
Package / Case: 18-SOIC (0.295", 7.50mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 10mA
Protocol: CANbus
Standards: CAN 2.0
Supplier Device Package: 18-SOIC
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 21129 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+173.53 грн
25+138.85 грн
100+126.54 грн
Мінімальне замовлення: 2
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MCP2515T-I/ST MCP2515-Stand-Alone-CAN-Controller-with-SPI-20001801J.pdf
MCP2515T-I/ST
Виробник: Microchip Technology
Description: IC CAN CONTROLLER W/SPI 20TSSOP
Packaging: Cut Tape (CT)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Current - Supply: 10mA
Protocol: CANbus
Standards: CAN 2.0
Supplier Device Package: 20-TSSOP
Part Status: Active
DigiKey Programmable: Not Verified
на замовлення 13462 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
2+189.98 грн
25+152.53 грн
100+138.85 грн
Мінімальне замовлення: 2
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MCP2551T-E/SN 20001667G.pdf
MCP2551T-E/SN
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SOIC
Receiver Hysteresis: 200 mV
Duplex: Half
Part Status: Active
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MCP6002T-I/SN MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6002T-I/SN
Виробник: Microchip Technology
Description: IC OPAMP GP 2 CIRCUIT 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x2 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 8-SOIC
Part Status: Active
Number of Circuits: 2
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
на замовлення 25432 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
12+28.78 грн
25+23.25 грн
100+21.20 грн
Мінімальне замовлення: 12
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MCP6004T-I/ST MCP6001-1R-1U-2-4-1-MHz-Low-Power-Op-Amp-DS20001733L.pdf
MCP6004T-I/ST
Виробник: Microchip Technology
Description: IC OPAMP GP 4 CIRCUIT 14TSSOP
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Output Type: Rail-to-Rail
Mounting Type: Surface Mount
Amplifier Type: Standard (General Purpose)
Operating Temperature: -40°C ~ 85°C (TA)
Current - Supply: 100µA (x4 Channels)
Slew Rate: 0.6V/µs
Gain Bandwidth Product: 1 MHz
Current - Input Bias: 1 pA
Voltage - Input Offset: 4.5 mV
Supplier Device Package: 14-TSSOP
Part Status: Active
Number of Circuits: 4
Current - Output / Channel: 23 mA
Voltage - Supply Span (Min): 1.8 V
Voltage - Supply Span (Max): 6 V
на замовлення 49462 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
9+38.65 грн
25+30.09 грн
100+28.04 грн
Мінімальне замовлення: 9
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USB3320C-EZK-TR 00001792E.pdf
USB3320C-EZK-TR
Виробник: Microchip Technology
Description: IC TRANSCEIVER HALF 1/1 32QFN
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.3V
Number of Drivers/Receivers: 1/1
Protocol: USB 2.0
Supplier Device Package: 32-QFN (5x5)
Receiver Hysteresis: 50 mV
Duplex: Half
Part Status: Active
на замовлення 14330 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна
3+152.97 грн
25+122.21 грн
100+112.02 грн
Мінімальне замовлення: 3
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DS3102GN DS3102_data_sheet_2012-04.pdf
Виробник: Microchip Technology
Description: IC TIMING LINE CARD 81CSBGA
Packaging: Tray
Package / Case: 81-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CMOS, LVDS, LVPECL, TTL
Frequency - Max: 312.5MHz
Input: CMOS, LVDS, LVPECL, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.62V ~ 1.98V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 8:7
Differential - Input:Output: No/Yes
Supplier Device Package: 81-CSBGA (10x10)
PLL: Yes
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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DS31400GN DS31400_short_form_2012-04.pdf
Виробник: Microchip Technology
Description: IC TIMING DUAL DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 8:14
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSPBGA (17x17)
PLL: Yes
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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DS31404GN2 DS31404_short_form_2012-04.pdf
Виробник: Microchip Technology
Description: IC TIMING DUAL DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 4:8
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSBGA (17x17)
PLL: Yes
Part Status: Active
Number of Circuits: 2
DigiKey Programmable: Not Verified
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DS31408GN DS31408_short_form_2012-04.pdf
Виробник: Microchip Technology
Description: IC TIMING DUAL DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 8:14
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSBGA (17x17)
PLL: Yes
Part Status: Obsolete
Number of Circuits: 1
DigiKey Programmable: Not Verified
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LE57D122BTC LE5712_RevG_V2.pdf
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 44TQFP
Packaging: Tray
Package / Case: 44-TQFP Exposed Pad
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: 2-Wire
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: 44-TQFP-EP (10x10)
Number of Circuits: 2
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LE58083ABGC LE58083_RevE_V2.pdf
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 121BGA
Packaging: Tray
Package / Case: 121-LFBGA
Mounting Type: Surface Mount
Function: Subscriber Line Interface Concept (SLIC)
Interface: PCI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 121-LFBGA (10x10)
Number of Circuits: 1
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DS31415GN2 DS31415_short_form_2012-04.pdf
Виробник: Microchip Technology
Description: IC TIMING SINGLE DPLL 256CSBGA
Packaging: Tray
Package / Case: 256-LBGA, CSBGA
Mounting Type: Surface Mount
Output: CML, CMOS, LVDS, LVPECL, TTL
Frequency - Max: 750MHz
Input: CMOS, TTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Main Purpose: Ethernet, SONET/SDH, Stratum, Telecom
Ratio - Input:Output: 3:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 256-CSBGA (17x17)
PLL: Yes
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
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LE58QL02FJCT LE58QL02_021_031_Ver9.pdf
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 44PLCC
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LE78D110BVC LE78D11_RevD_V2.pdf
LE78D110BVC
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Function: Voice Over IP Processor
Interface: PCM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Supplier Device Package: 44-TQFP (10x10)
Number of Circuits: 1
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LE79R70-1FQC LE79R70_RevJ_V2.pdf
LE79R70-1FQC
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 32QFN
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LE79R79-1FQC LE79R79_RevO_V2.pdf
LE79R79-1FQC
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 32QFN
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LE58QL031DJC LE58QL02_021_031_Ver9.pdf
Виробник: Microchip Technology
Description: IC TELECOM INTERFACE 32PLCC
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