Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2570) > Сторінка 14 з 43
Фото | Назва | Виробник | Інформація |
Доступність |
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HDR100MET40F-G-V-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 40 Style: Board to Board Operating Temperature: -40°C ~ 130°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.079" (2.00mm) Insulation Height: 0.079" (2.00mm) Number of Rows: 1 |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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HDR100MET40M-G-RA-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Through Hole, Right Angle Number of Positions: 40 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Contact Length - Post: 0.071" (1.80mm) Insulation Height: 0.050" (1.27mm) Shrouding: Unshrouded Contact Length - Mating: 0.071" (1.80mm) |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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HDR100MET40M-G-V-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Cuttable Mounting Type: Through Hole Number of Positions: 40 Number of Rows: 1 Style: Board to Board Operating Temperature: -40°C ~ 130°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Circular Contact Length - Post: 0.079" (2.00mm) Insulation Height: 0.039" (1.00mm) Shrouding: Unshrouded Overall Contact Length: 0.197" (5.00mm) Insulation Material: Polyamide (PA6T), Nylon 6T Contact Length - Mating: 0.079" (2.00mm) |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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HDR100MET80F-G-V-SM | Chip Quik Inc. |
Description: 1.00 MM 80 PIN VERTICAL FEMALE H Packaging: Bulk Connector Type: Header Mounting Type: Surface Mount Number of Positions: 80 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Insulation Height: 0.089" (2.26mm) Row Spacing - Mating: 0.039" (1.00mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
HDR100MET80M-G-V-SM | Chip Quik Inc. |
Description: CONN HEADER SMD 80POS 1MM Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Surface Mount Number of Positions: 80 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.039" (1.00mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Contact Shape: Square Insulation Height: 0.059" (1.50mm) Shrouding: Unshrouded Row Spacing - Mating: 0.039" (1.00mm) Contact Length - Mating: 0.075" (1.90mm) |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
HDR127MET10F-G-V-SM-DR | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Surface Mount Number of Positions: 10 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Insulation Height: 0.134" (3.40mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
HDR127MET20F-G-V-SM-DR | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR127MET40F-G-RA-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 40 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Part Status: Active Contact Length - Post: 0.094" (2.40mm) Insulation Height: 0.071" (1.80mm) Number of Rows: 1 |
на замовлення 88 шт: термін постачання 21-31 дні (днів) |
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HDR127MET40F-G-V-SM-DR | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
HDR127MET40F-G-V-TH | Chip Quik Inc. | Description: 1.27 MM 40 PIN VERTICAL FEMALE H |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR127MET40M-G-RA-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Through Hole, Right Angle Number of Positions: 40 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Contact Length - Post: 0.071" (1.80mm) Insulation Height: 0.083" (2.10mm) Shrouding: Unshrouded Contact Length - Mating: 0.118" (3.00mm) |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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HDR127MET40M-G-V-TH | Chip Quik Inc. | Description: 1.27 MM 40 PIN VERTICAL MALE HEA |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR127MET80F-G-V-SM | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Surface Mount Number of Positions: 80 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Part Status: Active Insulation Height: 0.134" (3.40mm) Row Spacing - Mating: 0.050" (1.27mm) Number of Rows: 2 |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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HDR127MET80F-G-V-TH | Chip Quik Inc. | Description: 1.27 MM 80 PIN VERTICAL FEMALE H |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR127MET80M-G-V-SM | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Surface Mount Number of Positions: 80 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.079" (2.00mm) Shrouding: Unshrouded Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.120" (3.05mm) |
на замовлення 82 шт: термін постачання 21-31 дні (днів) |
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HDR127MET80M-G-V-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Through Hole Number of Positions: 80 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Contact Length - Post: 0.071" (1.80mm) Insulation Height: 0.079" (2.00mm) Shrouding: Unshrouded Overall Contact Length: 0.268" (6.80mm) Row Spacing - Mating: 0.050" (1.27mm) Contact Length - Mating: 0.118" (3.00mm) |
на замовлення 55 шт: термін постачання 21-31 дні (днів) |
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HDR200MET10F-G-V-SM-DR | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
HDR200MET20F-G-V-SM-DR | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR200MET40F-G-RA-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 40 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Part Status: Active Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.108" (2.75mm) Number of Rows: 1 |
на замовлення 80 шт: термін постачання 21-31 дні (днів) |
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HDR200MET40F-G-V-SM-DR | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR200MET40F-G-V-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole Number of Positions: 40 Style: Board to Board Operating Temperature: -40°C ~ 130°C Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Gold Part Status: Active Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.169" (4.30mm) Number of Rows: 1 |
на замовлення 359 шт: термін постачання 21-31 дні (днів) |
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HDR200MET40M-G-RA-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Through Hole, Right Angle Number of Positions: 40 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Contact Length - Post: 0.110" (2.79mm) Insulation Height: 0.079" (2.00mm) Shrouding: Unshrouded Contact Length - Mating: 0.157" (4.00mm) |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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HDR200MET40M-G-V-TH | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Cuttable Mounting Type: Through Hole Number of Positions: 40 Number of Rows: 1 Style: Board to Board Operating Temperature: -40°C ~ 130°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Insulation Color: Black Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Gold Part Status: Active Contact Shape: Circular Contact Length - Post: 0.110" (2.80mm) Insulation Height: 0.079" (2.00mm) Shrouding: Unshrouded Overall Contact Length: 0.343" (8.70mm) Insulation Material: Polyamide (PA6T), Nylon 6T Contact Length - Mating: 0.154" (3.90mm) |
на замовлення 69 шт: термін постачання 21-31 дні (днів) |
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HDR200MET80F-G-V-SM | Chip Quik Inc. | Description: 2.00 MM 80 PIN VERTICAL FEMALE H |
товару немає в наявності |
В кошику од. на суму грн. | |||||||||||||
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HDR200MET80M-G-V-SM | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header, Breakaway Mounting Type: Surface Mount Number of Positions: 80 Number of Rows: 2 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Pitch - Mating: 0.079" (2.00mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.079" (2.00mm) Shrouding: Unshrouded Row Spacing - Mating: 0.079" (2.00mm) Contact Length - Mating: 0.157" (4.00mm) |
на замовлення 133 шт: термін постачання 21-31 дні (днів) |
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HDR-ETD | Chip Quik Inc. |
![]() Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 40, 40 Number of Rows: 1 Style: Board to Board Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Wire Wrap Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish - Post: Gold Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Contact Length - Mating: 0.118" (3.00mm) |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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HDR-SOICN-80 | Chip Quik Inc. |
![]() Packaging: Bulk Features: Closed Frame Mounting Type: Surface Mount Type: SOIC Operating Temperature: -40°C ~ 130°C Number of Positions or Pins (Grid): 80 (2 x 40) Termination: Solder Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 39.4µin (1.00µm) |
на замовлення 175 шт: термін постачання 21-31 дні (днів) |
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HDR-SOICW-80 | Chip Quik Inc. |
![]() Features: Closed Frame Packaging: Bulk Mounting Type: Surface Mount Type: SOIC Operating Temperature: -40°C ~ 130°C Number of Positions or Pins (Grid): 80 (2 x 40) Termination: Solder Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 39.4µin (1.00µm) Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Gold Contact Finish Thickness - Post: 39.4µin (1.00µm) |
на замовлення 192 шт: термін постачання 21-31 дні (днів) |
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HPS10C | Chip Quik Inc. |
![]() Packaging: Bulk Features: Clear, 10.2 Ounces For Use With/Related Products: Multi-Purpose Type: Silicone |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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HPS10C-20G | Chip Quik Inc. |
![]() Features: Clear, 20g Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Silicone Part Status: Active |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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HVPB6 | Chip Quik Inc. |
![]() Packaging: Bulk Accessory Type: Vacuum Tool with Tips |
на замовлення 114 шт: термін постачання 21-31 дні (днів) |
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ICB-MAX3232 | Chip Quik Inc. |
![]() Packaging: Bulk Function: Transceiver, RS-232 Type: Interface Utilized IC / Part: MAX3232E Supplied Contents: Board(s) Embedded: No Contents: Board(s) |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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IPC0001 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.049" (1.25mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0001-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: QFN/LFCSP Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0002 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0002-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm) Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0003 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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IPC0003-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 12 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0004 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0004-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm) Number of Positions: 12 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0005 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0005-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0006 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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IPC0006C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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IPC0006-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm) Number of Positions: 16 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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IPC0007 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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IPC0007-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 16 |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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IPC0008 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
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IPC0008-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm) Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0009 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0009-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: QFN/LFCSP Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm) Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0010 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0010-S | Chip Quik Inc. |
![]() |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0011 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0011-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: QFN/LFCSP Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 20 |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
|
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IPC0012 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
|
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IPC0012C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Number of Positions: 24 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: QFN Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
|
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IPC0012-S | Chip Quik Inc. |
![]() |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0013 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QFN |
товару немає в наявності |
В кошику од. на суму грн. | ||||||||||||
|
IPC0013-S | Chip Quik Inc. |
![]() |
товару немає в наявності |
В кошику од. на суму грн. |
HDR100MET40F-G-V-TH |
![]() |
Виробник: Chip Quik Inc.
Description: 1.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.079" (2.00mm)
Number of Rows: 1
Description: 1.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.079" (2.00mm)
Number of Rows: 1
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 172.24 грн |
HDR100MET40M-G-RA-TH |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.050" (1.27mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.071" (1.80mm)
Description: CONN HEADER R/A 40POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.050" (1.27mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.071" (1.80mm)
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 124.67 грн |
HDR100MET40M-G-V-TH |
![]() |
Виробник: Chip Quik Inc.
Description: 1.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.039" (1.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.197" (5.00mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.079" (2.00mm)
Description: 1.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.079" (2.00mm)
Insulation Height: 0.039" (1.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.197" (5.00mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.079" (2.00mm)
на замовлення 52 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 140.25 грн |
HDR100MET80F-G-V-SM |
Виробник: Chip Quik Inc.
Description: 1.00 MM 80 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Insulation Height: 0.089" (2.26mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
Description: 1.00 MM 80 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Insulation Height: 0.089" (2.26mm)
Row Spacing - Mating: 0.039" (1.00mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
HDR100MET80M-G-V-SM |
Виробник: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.039" (1.00mm)
Contact Length - Mating: 0.075" (1.90mm)
Description: CONN HEADER SMD 80POS 1MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.039" (1.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Contact Shape: Square
Insulation Height: 0.059" (1.50mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.039" (1.00mm)
Contact Length - Mating: 0.075" (1.90mm)
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET10F-G-V-SM-DR |
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Виробник: Chip Quik Inc.
Description: CONN HDR 10POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN HDR 10POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 10
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET20F-G-V-SM-DR |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HDR 20POS 0.05 GOLD SMD
Description: CONN HDR 20POS 0.05 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET40F-G-RA-TH |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HDR 40POS 0.05 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.094" (2.40mm)
Insulation Height: 0.071" (1.80mm)
Number of Rows: 1
Description: CONN HDR 40POS 0.05 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.094" (2.40mm)
Insulation Height: 0.071" (1.80mm)
Number of Rows: 1
на замовлення 88 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 121.39 грн |
HDR127MET40F-G-V-SM-DR |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HDR 40POS 0.05 GOLD SMD
Description: CONN HDR 40POS 0.05 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET40F-G-V-TH |
Виробник: Chip Quik Inc.
Description: 1.27 MM 40 PIN VERTICAL FEMALE H
Description: 1.27 MM 40 PIN VERTICAL FEMALE H
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET40M-G-RA-TH |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.083" (2.10mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
Description: CONN HEADER R/A 40POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.083" (2.10mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 113.19 грн |
HDR127MET40M-G-V-TH |
Виробник: Chip Quik Inc.
Description: 1.27 MM 40 PIN VERTICAL MALE HEA
Description: 1.27 MM 40 PIN VERTICAL MALE HEA
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET80F-G-V-SM |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HDR 80POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
Description: CONN HDR 80POS 0.05 GOLD SMD
Packaging: Bulk
Connector Type: Header
Mounting Type: Surface Mount
Number of Positions: 80
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Part Status: Active
Insulation Height: 0.134" (3.40mm)
Row Spacing - Mating: 0.050" (1.27mm)
Number of Rows: 2
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 174.70 грн |
HDR127MET80F-G-V-TH |
Виробник: Chip Quik Inc.
Description: 1.27 MM 80 PIN VERTICAL FEMALE H
Description: 1.27 MM 80 PIN VERTICAL FEMALE H
товару немає в наявності
В кошику
од. на суму грн.
HDR127MET80M-G-V-SM |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
Description: CONN HEADER SMD 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.120" (3.05mm)
на замовлення 82 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 159.12 грн |
HDR127MET80M-G-V-TH |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HEADER VERT 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.268" (6.80mm)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.118" (3.00mm)
Description: CONN HEADER VERT 80POS 1.27MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.071" (1.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.268" (6.80mm)
Row Spacing - Mating: 0.050" (1.27mm)
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 55 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 159.12 грн |
HDR200MET10F-G-V-SM-DR |
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Виробник: Chip Quik Inc.
Description: CONN HDR 10POS 0.079 GOLD SMD
Description: CONN HDR 10POS 0.079 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
HDR200MET20F-G-V-SM-DR |
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Виробник: Chip Quik Inc.
Description: CONN HDR 20POS 0.079 GOLD SMD
Description: CONN HDR 20POS 0.079 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
HDR200MET40F-G-RA-TH |
![]() |
Виробник: Chip Quik Inc.
Description: CONN HDR 40P 0.079 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.108" (2.75mm)
Number of Rows: 1
Description: CONN HDR 40P 0.079 GOLD PCB R/A
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Style: Board to Board
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.108" (2.75mm)
Number of Rows: 1
на замовлення 80 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 105.81 грн |
HDR200MET40F-G-V-SM-DR |
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Виробник: Chip Quik Inc.
Description: CONN HDR 40POS 0.079 GOLD SMD
Description: CONN HDR 40POS 0.079 GOLD SMD
товару немає в наявності
В кошику
од. на суму грн.
HDR200MET40F-G-V-TH |
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Виробник: Chip Quik Inc.
Description: 2.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.169" (4.30mm)
Number of Rows: 1
Description: 2.00 MM 40 PIN VERTICAL FEMALE H
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole
Number of Positions: 40
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Female Socket
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.169" (4.30mm)
Number of Rows: 1
на замовлення 359 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 142.72 грн |
HDR200MET40M-G-RA-TH |
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Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER R/A 40POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Through Hole, Right Angle
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Contact Length - Post: 0.110" (2.79mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 114.01 грн |
HDR200MET40M-G-V-TH |
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Виробник: Chip Quik Inc.
Description: 2.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.110" (2.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.343" (8.70mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.154" (3.90mm)
Description: 2.00 MM 40 PIN VERTICAL MALE HEA
Packaging: Bulk
Connector Type: Header, Cuttable
Mounting Type: Through Hole
Number of Positions: 40
Number of Rows: 1
Style: Board to Board
Operating Temperature: -40°C ~ 130°C
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Contact Material: Brass
Insulation Color: Black
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Circular
Contact Length - Post: 0.110" (2.80mm)
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Overall Contact Length: 0.343" (8.70mm)
Insulation Material: Polyamide (PA6T), Nylon 6T
Contact Length - Mating: 0.154" (3.90mm)
на замовлення 69 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
4+ | 93.50 грн |
HDR200MET80F-G-V-SM |
Виробник: Chip Quik Inc.
Description: 2.00 MM 80 PIN VERTICAL FEMALE H
Description: 2.00 MM 80 PIN VERTICAL FEMALE H
товару немає в наявності
В кошику
од. на суму грн.
HDR200MET80M-G-V-SM |
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Виробник: Chip Quik Inc.
Description: CONN HEADER SMD 80POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.157" (4.00mm)
Description: CONN HEADER SMD 80POS 2MM
Packaging: Bulk
Connector Type: Header, Breakaway
Mounting Type: Surface Mount
Number of Positions: 80
Number of Rows: 2
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Solder
Pitch - Mating: 0.079" (2.00mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.079" (2.00mm)
Shrouding: Unshrouded
Row Spacing - Mating: 0.079" (2.00mm)
Contact Length - Mating: 0.157" (4.00mm)
на замовлення 133 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 187.83 грн |
HDR-ETD |
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Виробник: Chip Quik Inc.
Description: CONN HEADER R/A 40POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40, 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
Description: CONN HEADER R/A 40POS 2.54MM
Packaging: Bulk
Connector Type: Header
Mounting Type: Through Hole, Right Angle
Number of Positions: 40, 40
Number of Rows: 1
Style: Board to Board
Contact Type: Male Pin
Fastening Type: Push-Pull
Number of Positions Loaded: All
Termination: Wire Wrap
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish - Post: Gold
Part Status: Active
Contact Shape: Square
Insulation Height: 0.100" (2.54mm)
Shrouding: Unshrouded
Contact Length - Mating: 0.118" (3.00mm)
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
3+ | 130.41 грн |
HDR-SOICN-80 |
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Виробник: Chip Quik Inc.
Description: SMT TO SOIC-NARROW HEADER (1.27M
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
Description: SMT TO SOIC-NARROW HEADER (1.27M
Packaging: Bulk
Features: Closed Frame
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
на замовлення 175 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 552.82 грн |
5+ | 455.10 грн |
10+ | 428.01 грн |
25+ | 372.24 грн |
50+ | 352.73 грн |
100+ | 335.31 грн |
HDR-SOICW-80 |
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Виробник: Chip Quik Inc.
Description: SMT TO SOIC-WIDE HEADER (1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
Description: SMT TO SOIC-WIDE HEADER (1.27MM
Features: Closed Frame
Packaging: Bulk
Mounting Type: Surface Mount
Type: SOIC
Operating Temperature: -40°C ~ 130°C
Number of Positions or Pins (Grid): 80 (2 x 40)
Termination: Solder
Housing Material: Polyamide (PA6T), Nylon 6T, Glass Filled
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 39.4µin (1.00µm)
на замовлення 192 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 651.24 грн |
5+ | 537.56 грн |
10+ | 505.88 грн |
25+ | 440.40 грн |
50+ | 417.66 грн |
100+ | 397.38 грн |
HPS10C |
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Виробник: Chip Quik Inc.
Description: HIGH PERFORMANCE SILICONE 100% R
Packaging: Bulk
Features: Clear, 10.2 Ounces
For Use With/Related Products: Multi-Purpose
Type: Silicone
Description: HIGH PERFORMANCE SILICONE 100% R
Packaging: Bulk
Features: Clear, 10.2 Ounces
For Use With/Related Products: Multi-Purpose
Type: Silicone
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1531.32 грн |
HPS10C-20G |
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Виробник: Chip Quik Inc.
Description: HIGH PERFORMANCE SILICONE 100% R
Features: Clear, 20g
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Silicone
Part Status: Active
Description: HIGH PERFORMANCE SILICONE 100% R
Features: Clear, 20g
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Silicone
Part Status: Active
на замовлення 31 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 353.51 грн |
HVPB6 |
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Виробник: Chip Quik Inc.
Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Bulk
Accessory Type: Vacuum Tool with Tips
Description: TOOL VACUUM PICK & PLACE W/TIPS
Packaging: Bulk
Accessory Type: Vacuum Tool with Tips
на замовлення 114 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1551.82 грн |
ICB-MAX3232 |
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Виробник: Chip Quik Inc.
Description: EVAL BOARD FOR MAX3232E
Packaging: Bulk
Function: Transceiver, RS-232
Type: Interface
Utilized IC / Part: MAX3232E
Supplied Contents: Board(s)
Embedded: No
Contents: Board(s)
Description: EVAL BOARD FOR MAX3232E
Packaging: Bulk
Function: Transceiver, RS-232
Type: Interface
Utilized IC / Part: MAX3232E
Supplied Contents: Board(s)
Embedded: No
Contents: Board(s)
на замовлення 61 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 593.83 грн |
5+ | 492.06 грн |
10+ | 463.79 грн |
25+ | 404.50 грн |
50+ | 384.07 грн |
IPC0001 |
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Виробник: Chip Quik Inc.
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.049" (1.25mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0001-S |
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Виробник: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.055" L x 0.047" W (1.40mm x 1.20mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.
IPC0002 |
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Виробник: Chip Quik Inc.
Description: QFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0002-S |
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Виробник: Chip Quik Inc.
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm)
Number of Positions: 8
Description: QFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.043" L x 0.043" W (1.10mm x 1.10mm)
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.
IPC0003 |
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Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 526.57 грн |
IPC0003-S |
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Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 12
товару немає в наявності
В кошику
од. на суму грн.
IPC0004 |
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Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0004-S |
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Виробник: Chip Quik Inc.
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm)
Number of Positions: 12
Description: QFN-12 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.110" L x 0.062" W (2.80mm x 1.58mm)
Number of Positions: 12
товару немає в наявності
В кошику
од. на суму грн.
IPC0005 |
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Виробник: Chip Quik Inc.
Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
IPC0005-S |
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Виробник: Chip Quik Inc.
Description: QFN-14 STENCIL
Description: QFN-14 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
IPC0006 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 569.22 грн |
IPC0006C |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-20 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 784.93 грн |
IPC0006-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions: 16
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.059" L x 0.059" W (1.50mm x 1.50mm)
Number of Positions: 16
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 835.79 грн |
IPC0007 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 569.22 грн |
IPC0007-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 16
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 16
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 853.83 грн |
IPC0008 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
IPC0008-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 16
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.094" L x 0.094" W (2.40mm x 2.40mm)
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
IPC0009 |
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Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0009-S |
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Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm)
Number of Positions: 16
Description: QFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: QFN/LFCSP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.106" L x 0.106" W (2.70mm x 2.70mm)
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
IPC0010 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0010-S |
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Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Description: QFN-20 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
IPC0011 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0011-S |
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Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 20
Description: QFN-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 20
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 835.79 грн |
IPC0012 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 634.84 грн |
IPC0012C |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
Description: QFN-20 TO DIP-24 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 821.02 грн |
IPC0012-S |
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Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Description: QFN-20 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
IPC0013 |
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Виробник: Chip Quik Inc.
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Description: QFN-20 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.200" (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товару немає в наявності
В кошику
од. на суму грн.
IPC0013-S |
![]() |
Виробник: Chip Quik Inc.
Description: QFN-20 STENCIL
Description: QFN-20 STENCIL
товару немає в наявності
В кошику
од. на суму грн.