Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2429) > Сторінка 15 з 41
| Фото | Назва | Виробник | Інформація |
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IPC0051 | Chip Quik Inc. |
 Description: POWERSOIC-8/PSOP-8/HSOP-8 TO DIPPackaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PowerSOIC, PSOP, HSOP Part Status: Active |
на замовлення 99 шт: термін постачання 21-31 дні (днів) |
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IPC0051C | Chip Quik Inc. |
Description: POWERSOIC-8 TO DIP-12 SMT ADAPTE Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Number of Positions: 12 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: HSOP, PSOP, SOIC Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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IPC0051-S | Chip Quik Inc. |
Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCI Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PowerSOIC Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm) Number of Positions: 8 |
товар відсутній |
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IPC0052 | Chip Quik Inc. |
Description: DFN-4 TO DIP-4 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0052-S | Chip Quik Inc. |
Description: DFN-4 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.059" L x 0.051" W (1.50mm x 1.30mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 4 |
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IPC0053 | Chip Quik Inc. |
Description: DFN-5 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0053-S | Chip Quik Inc. |
Description: DFN-5 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm) Number of Positions: 5 |
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IPC0054 | Chip Quik Inc. |
Description: DFN-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0054-S | Chip Quik Inc. |
Description: DFN-6 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: DFN Inner Dimension: 0.047" L x 0.039" W (1.20mm x 1.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
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IPC0055 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0055-S | Chip Quik Inc. |
Description: DFN-6 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.039" L x 0.018" W (1.00mm x 0.45mm) Number of Positions: 6 |
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IPC0056 | Chip Quik Inc. |
Description: DFN-6 TO DIP-6 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0056-S | Chip Quik Inc. |
Description: DFN-6 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
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IPC0057 | Chip Quik Inc. |
Description: DFN-6 TO DIP-10 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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IPC0057-S | Chip Quik Inc. |
Description: DFN-6 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm) Number of Positions: 6 |
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IPC0058 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0058-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.059" L x 0.030" W (1.50mm x 0.75mm) Number of Positions: 8 |
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IPC0059 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0059-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm) Number of Positions: 8 |
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IPC0060 | Chip Quik Inc. |
Description: DFN-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 48 шт: термін постачання 21-31 дні (днів) |
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IPC0060C | Chip Quik Inc. |
Description: DFN-8 TO DIP-8 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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IPC0060-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
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IPC0061 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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IPC0061C | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.5 Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Number of Positions: 12 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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IPC0061-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm) Number of Positions: 8 |
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IPC0062 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 52 шт: термін постачання 21-31 дні (днів) |
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IPC0062-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.053" L x 0.057" W (1.35mm x 1.45mm) Number of Positions: 8 |
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IPC0063 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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IPC0063-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm) Number of Positions: 8 |
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IPC0064 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0064-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.069" L x 0.057" W (1.75mm x 1.45mm) Number of Positions: 8 |
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IPC0065 | Chip Quik Inc. |
Description: DFN-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0065-S | Chip Quik Inc. |
Description: DFN-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.087" W (3.00mm x 2.20mm) Number of Positions: 8 |
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IPC0066 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0066-S | Chip Quik Inc. |
Description: DFN-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.094" L x 0.033" W (2.40mm x 0.85mm) Number of Positions: 10 |
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IPC0067 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 37 шт: термін постачання 21-31 дні (днів) |
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IPC0067-S | Chip Quik Inc. |
Description: DFN-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.079" L x 0.059" W (2.00mm x 1.50mm) Number of Positions: 10 |
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IPC0068 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0068-S | Chip Quik Inc. |
Description: DFN-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm) Number of Positions: 10 |
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IPC0069 | Chip Quik Inc. |
Description: DFN-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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IPC0069-S | Chip Quik Inc. |
Description: DFN-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: DFN Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm) Number of Positions: 10 |
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IPC0070 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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IPC0070C | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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IPC0070-S | Chip Quik Inc. |
Description: DFN-12 STENCIL |
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IPC0071 | Chip Quik Inc. |
Description: DFN-12 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 12 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN |
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IPC0071-S | Chip Quik Inc. |
Description: DFN-12 STENCIL |
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IPC0072 | Chip Quik Inc. |
Description: DFN-14 TO DIP-18 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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IPC0072-S | Chip Quik Inc. |
Description: DFN-14 STENCIL |
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IPC0073 | Chip Quik Inc. |
Description: DFN-16 TO DIP-20 SMT ADAPTER |
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IPC0073-S | Chip Quik Inc. |
Description: DFN-16 STENCIL |
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IPC0074 | Chip Quik Inc. |
Description: DFN-16 TO DIP-20 SMT ADAPTER |
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IPC0074-S | Chip Quik Inc. |
Description: DFN-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: DFN Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm) Number of Positions: 16 |
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IPC0075 | Chip Quik Inc. |
Description: DFN-18 TO DIP-22 SMT ADAPTER |
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IPC0075-S | Chip Quik Inc. |
Description: DFN-18 STENCIL |
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IPC0076 | Chip Quik Inc. |
Description: MSOP-8 TO DIP-12 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 92 шт: термін постачання 21-31 дні (днів) |
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IPC0076C | Chip Quik Inc. |
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm) Number of Positions: 12 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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IPC0076-S | Chip Quik Inc. |
Description: MSOP-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: MSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm) Number of Positions: 8 |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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IPC0077 | Chip Quik Inc. |
Description: MSOP-10 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
|
||
 |
IPC0077C | Chip Quik Inc. |
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Number of Positions: 14 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: MSOP Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
|
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 |
IPC0077-S | Chip Quik Inc. |
Description: MSOP-10 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: MSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm) Number of Positions: 10 |
товар відсутній |
| IPC0051 |
|
Виробник: Chip Quik Inc.
Description: POWERSOIC-8/PSOP-8/HSOP-8 TO DIP
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
Description: POWERSOIC-8/PSOP-8/HSOP-8 TO DIP
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC, PSOP, HSOP
Part Status: Active
на замовлення 99 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 364.31 грн |
| IPC0051C |
|
Виробник: Chip Quik Inc.
Description: POWERSOIC-8 TO DIP-12 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
Description: POWERSOIC-8 TO DIP-12 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: HSOP, PSOP, SOIC
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 579.31 грн |
| IPC0051-S |
|
Виробник: Chip Quik Inc.
Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm)
Number of Positions: 8
Description: POWERSOIC-8/PSOP-8/HSOP-8 STENCI
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.089" W (3.00mm x 2.25mm)
Number of Positions: 8
товар відсутній
| IPC0052 |
|
Виробник: Chip Quik Inc.
Description: DFN-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0052-S |
|
Виробник: Chip Quik Inc.
Description: DFN-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.059" L x 0.051" W (1.50mm x 1.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
Description: DFN-4 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.059" L x 0.051" W (1.50mm x 1.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 4
товар відсутній
| IPC0053 |
|
Виробник: Chip Quik Inc.
Description: DFN-5 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-5 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0053-S |
|
Виробник: Chip Quik Inc.
Description: DFN-5 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 5
Description: DFN-5 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 5
товар відсутній
| IPC0054 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0054-S |
|
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.047" L x 0.039" W (1.20mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: DFN
Inner Dimension: 0.047" L x 0.039" W (1.20mm x 1.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
| IPC0055 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0055-S |
|
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.039" L x 0.018" W (1.00mm x 0.45mm)
Number of Positions: 6
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.039" L x 0.018" W (1.00mm x 0.45mm)
Number of Positions: 6
товар відсутній
| IPC0056 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.300" (25.40mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0056-S |
|
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.063" L x 0.063" W (1.60mm x 1.60mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товар відсутній
| IPC0057 |
|
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 329.97 грн |
| IPC0057-S |
|
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 6
Description: DFN-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.053" L x 0.026" W (1.35mm x 0.65mm)
Number of Positions: 6
товар відсутній
| IPC0058 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0058-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.059" L x 0.030" W (1.50mm x 0.75mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.083" L x 0.079" W (2.10mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.059" L x 0.030" W (1.50mm x 0.75mm)
Number of Positions: 8
товар відсутній
| IPC0059 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0059-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.098" L x 0.079" W (2.50mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.051" L x 0.039" W (1.30mm x 1.00mm)
Number of Positions: 8
товар відсутній
| IPC0060 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 48 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 357.59 грн |
| IPC0060C |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-8 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 581.55 грн |
| IPC0060-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
| IPC0061 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 369.53 грн |
| IPC0061C |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.5
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 579.31 грн |
| IPC0061-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.057" L x 0.031" W (1.45mm x 0.80mm)
Number of Positions: 8
товар відсутній
| IPC0062 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 52 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 369.53 грн |
| IPC0062-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.053" L x 0.057" W (1.35mm x 1.45mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.053" L x 0.057" W (1.35mm x 1.45mm)
Number of Positions: 8
товар відсутній
| IPC0063 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 369.53 грн |
| IPC0063-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.091" L x 0.055" W (2.30mm x 1.40mm)
Number of Positions: 8
товар відсутній
| IPC0064 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
| IPC0064-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.069" L x 0.057" W (1.75mm x 1.45mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.069" L x 0.057" W (1.75mm x 1.45mm)
Number of Positions: 8
товар відсутній
| IPC0065 |
|
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
| IPC0065-S |
|
Виробник: Chip Quik Inc.
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.087" W (3.00mm x 2.20mm)
Number of Positions: 8
Description: DFN-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.087" W (3.00mm x 2.20mm)
Number of Positions: 8
товар відсутній
| IPC0066 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
| IPC0066-S |
|
Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.094" L x 0.033" W (2.40mm x 0.85mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.094" L x 0.033" W (2.40mm x 0.85mm)
Number of Positions: 10
товар відсутній
| IPC0067 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 37 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 399.4 грн |
| IPC0067-S |
|
Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.079" L x 0.059" W (2.00mm x 1.50mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.079" L x 0.059" W (2.00mm x 1.50mm)
Number of Positions: 10
товар відсутній
| IPC0068 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
| IPC0068-S |
|
Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.083" L x 0.083" W (2.10mm x 2.10mm)
Number of Positions: 10
товар відсутній
| IPC0069 |
|
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
| IPC0069-S |
|
Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 10
Description: DFN-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: DFN
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.118" L x 0.102" W (3.00mm x 2.60mm)
Number of Positions: 10
товар відсутній
| IPC0070 |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 439.71 грн |
| IPC0070C |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 19 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 633.81 грн |
| IPC0071 |
|
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Description: DFN-12 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.800" (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
| IPC0072 |
|
Виробник: Chip Quik Inc.
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-14 TO DIP-18 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.900" (25.40mm x 22.86mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 481.52 грн |
| IPC0074-S |
|
Виробник: Chip Quik Inc.
Description: DFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm)
Number of Positions: 16
Description: DFN-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: DFN
Inner Dimension: 0.197" L x 0.157" W (5.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.171" L x 0.096" W (4.35mm x 2.45mm)
Number of Positions: 16
товар відсутній
| IPC0076 |
|
Виробник: Chip Quik Inc.
Description: MSOP-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-8 TO DIP-12 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.600" (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 92 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 369.53 грн |
| IPC0076C |
|
Виробник: Chip Quik Inc.
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-8 TO DIP-12 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.600" L x 0.400" W (15.24mm x 10.16mm)
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 579.31 грн |
| IPC0076-S |
|
Виробник: Chip Quik Inc.
Description: MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 8
Description: MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 8
на замовлення 10 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 798.79 грн |
| IPC0077 |
|
Виробник: Chip Quik Inc.
Description: MSOP-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 404.62 грн |
| IPC0077C |
|
Виробник: Chip Quik Inc.
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
Description: MSOP-10 TO DIP-14 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Number of Positions: 14
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 614.4 грн |
| IPC0077-S |
|
Виробник: Chip Quik Inc.
Description: MSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 10
Description: MSOP-10 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: MSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.110" L x 0.079" W (2.80mm x 2.00mm)
Number of Positions: 10
товар відсутній