Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2420) > Сторінка 18 з 41

Обрати Сторінку:   [  << Попередня Сторінка ]  1 4 8 12 13 14 15 16 17 18 19 20 21 22 23 24 28 32 36 40 41  [ Наступна Сторінка >> ]
Фото Назва Виробник Інформація Доступність
Ціна
без ПДВ
IPC0138 IPC0138 Chip Quik Inc. IPC0138.pdf Description: TQFP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
IPC0138-S IPC0138-S Chip Quik Inc. IPC0138-S.pdf Description: TQFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
товар відсутній
IPC0139 Chip Quik Inc. IPC0139.pdf Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
IPC0139-S Chip Quik Inc. Description: TQFP-80 (0.8MM PITCH, 14X20MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
товар відсутній
IPC0140 IPC0140 Chip Quik Inc. IPC0140.pdf Description: SSOP-36 TO DIP-36 SMT ADAPTER
товар відсутній
IPC0140-S IPC0140-S Chip Quik Inc. IPC0140-S.pdf Description: SSOP-36 STENCIL
товар відсутній
IPC0141 IPC0141 Chip Quik Inc. IPC0141.pdf Description: POWERSSO-36 TO DIP-40 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
1+716.89 грн
IPC0141-S IPC0141-S Chip Quik Inc. IPC0141-S.pdf Description: POWERSSO-36 STENCIL
товар відсутній
IPC0142 IPC0142 Chip Quik Inc. IPC0142.pdf Description: SOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
2+235.07 грн
Мінімальне замовлення: 2
IPC0142C IPC0142C Chip Quik Inc. IPC0142C.pdf Description: SOP-8 TO DIP-8 SMT ADAPTER (2.54
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
1+437.29 грн
IPC0142-S IPC0142-S Chip Quik Inc. IPC0142-S.pdf Description: SOP-8 STENCIL
товар відсутній
IPC0143 IPC0143 Chip Quik Inc. IPC0143.pdf Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0143-S IPC0143-S Chip Quik Inc. IPC0143-S.pdf Description: QFN-16 STENCIL
товар відсутній
IPC0144 IPC0144 Chip Quik Inc. IPC0144.pdf Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0144-S IPC0144-S Chip Quik Inc. IPC0144-S.pdf Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm)
Number of Positions: 56
товар відсутній
IPC0145 IPC0145 Chip Quik Inc. IPC0145.pdf Description: QFN-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
1+707.4 грн
IPC0145-S IPC0145-S Chip Quik Inc. IPC0145-S.pdf Description: QFN-36 STENCIL
товар відсутній
IPC0146 IPC0146 Chip Quik Inc. IPC0146.pdf Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0146-S IPC0146-S Chip Quik Inc. IPC0146-S.pdf Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.197" W (11.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.330" L x 0.096" W (8.38mm x 2.45mm)
Number of Positions: 56
товар відсутній
IPC0147 IPC0147 Chip Quik Inc. IPC0147.pdf Description: HSOP-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
товар відсутній
IPC0147-S IPC0147-S Chip Quik Inc. IPC0147-S.pdf Description: HSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
IPC0148 IPC0148 Chip Quik Inc. IPC0148.pdf Description: PLCC-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
товар відсутній
IPC0148-S IPC0148-S Chip Quik Inc. IPC0148-S.pdf Description: PLCC-4 STENCIL
товар відсутній
IPC0149 IPC0149 Chip Quik Inc. IPC0149.pdf Description: SSOP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
IPC0149-S IPC0149-S Chip Quik Inc. IPC0149-S.pdf Description: SSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
IPC0150 IPC0150 Chip Quik Inc. IPC0150.pdf Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
1+386.18 грн
IPC0150-S IPC0150-S Chip Quik Inc. IPC0150-S.pdf Description: DFN-10 STENCIL
товар відсутній
IPC0151 IPC0151 Chip Quik Inc. IPC0151.pdf Description: MSOP-12 TO DIP-12 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
товар відсутній
IPC0151-S Chip Quik Inc. Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
товар відсутній
IPC0152 IPC0152 Chip Quik Inc. IPC0152.pdf Description: DFN-18 TO DIP-22 SMT ADAPTER
товар відсутній
IPC0152-S IPC0152-S Chip Quik Inc. IPC0152-S.pdf Description: DFN-18 STENCIL
товар відсутній
IPC0153 IPC0153 Chip Quik Inc. IPC0153.pdf Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
1+322.67 грн
IPC0153-S IPC0153-S Chip Quik Inc. IPC0153-S.pdf Description: DFN-6 STENCIL
товар відсутній
IPC0154 IPC0154 Chip Quik Inc. IPC0154.pdf Description: QFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0154-S IPC0154-S Chip Quik Inc. Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm)
Number of Positions: 12
товар відсутній
IPC0155 IPC0155 Chip Quik Inc. IPC0155.pdf Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0156 IPC0156 Chip Quik Inc. IPC0156.pdf Description: TSSOP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товар відсутній
IPC0156-S IPC0156-S Chip Quik Inc. Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Number of Positions: 44
товар відсутній
IPC0157 IPC0157 Chip Quik Inc. IPC0157.pdf Description: DFN-10 TO DIP-14 SMT ADAPTER (0.
товар відсутній
IPC0158 IPC0158 Chip Quik Inc. IPC0158.pdf Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0158-S IPC0158-S Chip Quik Inc. IPC0158-S.pdf Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
товар відсутній
IPC0160 Chip Quik Inc. IPC0160.pdf Description: MQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MQFP
Part Status: Active
товар відсутній
IPC0160-S IPC0160-S Chip Quik Inc. Description: MQFP-44 (0.8MM PITCH, 10X10MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
IPC0161 Chip Quik Inc. IPC0161.pdf Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
товар відсутній
IPC0162 Chip Quik Inc. IPC0162.pdf Description: SSOP-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
IPC0162-S IPC0162-S Chip Quik Inc. Description: SSOP-24 (1MM PITCH, 13X6MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: SSOP
Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
товар відсутній
IPC0163 Chip Quik Inc. IPC0163.pdf Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
IPC0163-S IPC0163-S Chip Quik Inc. Description: SOIC-32 (1.27MM PITCH, 20.4X11.3
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
IPC0164 Chip Quik Inc. IPC0164.pdf Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4
товар відсутній
IPC0164-S IPC0164-S Chip Quik Inc. IPC0164-S.pdf Description: DFN-8 (0.45MM PITCH, 2X3MM BODY)
товар відсутній
IPC0165 IPC0165 Chip Quik Inc. IPC0165.pdf Description: SON-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
товар відсутній
IPC0167-S IPC0167-S Chip Quik Inc. IPC0167-S.pdf Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM
товар відсутній
IPC0168 Chip Quik Inc. IPC0168.pdf Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
товар відсутній
IPC0168-S IPC0168-S Chip Quik Inc. Description: POWERPAD-16/POWERSOIC-16 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 16
товар відсутній
IPC0169 Chip Quik Inc. IPC0169.pdf Description: SOIC-44 TO DIP-44 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
IPC0169-S Chip Quik Inc. Description: SOIC-44 (1.27MM PITCH, 28.1X13.2
товар відсутній
IPC0170 Chip Quik Inc. IPC0170.pdf Description: BGA-24 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0170-S Chip Quik Inc. Description: BGA-24 (1MM PITCH, 8X6MM BODY) S
товар відсутній
IPC0171 Chip Quik Inc. IPC0171.pdf Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0171-S Chip Quik Inc. Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
товар відсутній
IPC0138 IPC0138.pdf
IPC0138
Виробник: Chip Quik Inc.
Description: TQFP-64 TO DIP-64 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
IPC0138-S IPC0138-S.pdf
IPC0138-S
Виробник: Chip Quik Inc.
Description: TQFP-64 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TQFP
Inner Dimension: 0.472" L x 0.472" W (12.00mm x 12.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
товар відсутній
IPC0139 IPC0139.pdf
Виробник: Chip Quik Inc.
Description: TQFP-80 TO DIP-80 SMT ADAPTER (0
Packaging: Bulk
Number of Positions: 80
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
товар відсутній
IPC0139-S
Виробник: Chip Quik Inc.
Description: TQFP-80 (0.8MM PITCH, 14X20MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.551" W (20.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 80
товар відсутній
IPC0140 IPC0140.pdf
IPC0140
Виробник: Chip Quik Inc.
Description: SSOP-36 TO DIP-36 SMT ADAPTER
товар відсутній
IPC0140-S IPC0140-S.pdf
IPC0140-S
Виробник: Chip Quik Inc.
Description: SSOP-36 STENCIL
товар відсутній
IPC0141 IPC0141.pdf
IPC0141
Виробник: Chip Quik Inc.
Description: POWERSSO-36 TO DIP-40 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PowerSSO
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+716.89 грн
IPC0141-S IPC0141-S.pdf
IPC0141-S
Виробник: Chip Quik Inc.
Description: POWERSSO-36 STENCIL
товар відсутній
IPC0142 IPC0142.pdf
IPC0142
Виробник: Chip Quik Inc.
Description: SOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.400" (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
2+235.07 грн
Мінімальне замовлення: 2
IPC0142C IPC0142C.pdf
IPC0142C
Виробник: Chip Quik Inc.
Description: SOP-8 TO DIP-8 SMT ADAPTER (2.54
Packaging: Bulk
Size / Dimension: 0.550" L x 0.400" W (13.97mm x 10.16mm)
Number of Positions: 8
Pitch: 0.100" (2.54mm)
Proto Board Type: SMD to DIP
Package Accepted: SOP
Part Status: Active
на замовлення 24 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+437.29 грн
IPC0142-S IPC0142-S.pdf
IPC0142-S
Виробник: Chip Quik Inc.
Description: SOP-8 STENCIL
товар відсутній
IPC0143 IPC0143.pdf
IPC0143
Виробник: Chip Quik Inc.
Description: QFN-16 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.000" (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0143-S IPC0143-S.pdf
IPC0143-S
Виробник: Chip Quik Inc.
Description: QFN-16 STENCIL
товар відсутній
IPC0144 IPC0144.pdf
IPC0144
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0144-S IPC0144-S.pdf
IPC0144-S
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.204" L x 0.204" W (5.18mm x 5.18mm)
Number of Positions: 56
товар відсутній
IPC0145 IPC0145.pdf
IPC0145
Виробник: Chip Quik Inc.
Description: QFN-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
на замовлення 6 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+707.4 грн
IPC0145-S IPC0145-S.pdf
IPC0145-S
Виробник: Chip Quik Inc.
Description: QFN-36 STENCIL
товар відсутній
IPC0146 IPC0146.pdf
IPC0146
Виробник: Chip Quik Inc.
Description: QFN-56 TO DIP-60 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.000" (25.40mm x 76.20mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QFN
Part Status: Active
товар відсутній
IPC0146-S IPC0146-S.pdf
IPC0146-S
Виробник: Chip Quik Inc.
Description: QFN-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: QFN/LFCSP
Inner Dimension: 0.433" L x 0.197" W (11.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.330" L x 0.096" W (8.38mm x 2.45mm)
Number of Positions: 56
товар відсутній
IPC0147 IPC0147.pdf
IPC0147
Виробник: Chip Quik Inc.
Description: HSOP-48 TO DIP-52 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: HSOP
Part Status: Active
товар відсутній
IPC0147-S IPC0147-S.pdf
IPC0147-S
Виробник: Chip Quik Inc.
Description: HSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: HSOP
Inner Dimension: 0.630" L x 0.346" W (16.00mm x 8.80mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
IPC0148 IPC0148.pdf
IPC0148
Виробник: Chip Quik Inc.
Description: PLCC-4 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.200" (25.40mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PLCC
товар відсутній
IPC0148-S IPC0148-S.pdf
IPC0148-S
Виробник: Chip Quik Inc.
Description: PLCC-4 STENCIL
товар відсутній
IPC0149 IPC0149.pdf
IPC0149
Виробник: Chip Quik Inc.
Description: SSOP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
IPC0149-S IPC0149-S.pdf
IPC0149-S
Виробник: Chip Quik Inc.
Description: SSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Inner Dimension: 0.406" L x 0.295" W (10.30mm x 7.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
IPC0150 IPC0150.pdf
IPC0150
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.700" (25.40mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+386.18 грн
IPC0150-S IPC0150-S.pdf
IPC0150-S
Виробник: Chip Quik Inc.
Description: DFN-10 STENCIL
товар відсутній
IPC0151 IPC0151.pdf
IPC0151
Виробник: Chip Quik Inc.
Description: MSOP-12 TO DIP-12 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.600" W (25.40mm x 15.24mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP
товар відсутній
IPC0151-S
Виробник: Chip Quik Inc.
Description: MSOP-12 (0.65MM PITCH, 4X3MM BOD
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: MSOP
Inner Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 12
товар відсутній
IPC0152 IPC0152.pdf
IPC0152
Виробник: Chip Quik Inc.
Description: DFN-18 TO DIP-22 SMT ADAPTER
товар відсутній
IPC0152-S IPC0152-S.pdf
IPC0152-S
Виробник: Chip Quik Inc.
Description: DFN-18 STENCIL
товар відсутній
IPC0153 IPC0153.pdf
IPC0153
Виробник: Chip Quik Inc.
Description: DFN-6 TO DIP-10 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 0.500" (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)
Кількість Ціна без ПДВ
1+322.67 грн
IPC0153-S IPC0153-S.pdf
IPC0153-S
Виробник: Chip Quik Inc.
Description: DFN-6 STENCIL
товар відсутній
IPC0154 IPC0154.pdf
IPC0154
Виробник: Chip Quik Inc.
Description: QFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0154-S
IPC0154-S
Виробник: Chip Quik Inc.
Description: QFN-12/LFCSP-12 (0.4MM PITCH, 2X
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: QFN/LFCSP
Inner Dimension: 0.079" L x 0.079" W (2.00mm x 2.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.036" L x 0.036" W (0.92mm x 0.92mm)
Number of Positions: 12
товар відсутній
IPC0155 IPC0155.pdf
IPC0155
Виробник: Chip Quik Inc.
Description: DFN-12 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.800" W (25.40mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 12
Pitch: 0.016" (0.40mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: DFN
товар відсутній
IPC0156 IPC0156.pdf
IPC0156
Виробник: Chip Quik Inc.
Description: TSSOP-44 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 2.400" W (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товар відсутній
IPC0156-S
IPC0156-S
Виробник: Chip Quik Inc.
Description: TSSOP-44 (0.64MM PITCH, 14X6.1MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: TSSOP
Inner Dimension: 0.551" L x 0.240" W (14.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.276" L x 0.157" W (7.00mm x 4.00mm)
Number of Positions: 44
товар відсутній
IPC0157 IPC0157.pdf
IPC0157
Виробник: Chip Quik Inc.
Description: DFN-10 TO DIP-14 SMT ADAPTER (0.
товар відсутній
IPC0158 IPC0158.pdf
IPC0158
Виробник: Chip Quik Inc.
Description: QFN-24 TO DIP-28 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.400" W (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QFN
товар відсутній
IPC0158-S IPC0158-S.pdf
IPC0158-S
Виробник: Chip Quik Inc.
Description: QFN-24/LFCSP-24 (0.5MM PITCH, 5X
товар відсутній
IPC0160 IPC0160.pdf
Виробник: Chip Quik Inc.
Description: MQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MQFP
Part Status: Active
товар відсутній
IPC0160-S
IPC0160-S
Виробник: Chip Quik Inc.
Description: MQFP-44 (0.8MM PITCH, 10X10MM BO
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: MQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
IPC0161 IPC0161.pdf
Виробник: Chip Quik Inc.
Description: LGA-10 TO DIP-10 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
товар відсутній
IPC0162 IPC0162.pdf
Виробник: Chip Quik Inc.
Description: SSOP-24 TO DIP-24 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
IPC0162-S
IPC0162-S
Виробник: Chip Quik Inc.
Description: SSOP-24 (1MM PITCH, 13X6MM BODY)
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: SSOP
Inner Dimension: 0.512" L x 0.236" W (13.00mm x 6.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
товар відсутній
IPC0163 IPC0163.pdf
Виробник: Chip Quik Inc.
Description: SOIC-32 TO DIP-32 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 1.600" W (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
IPC0163-S
IPC0163-S
Виробник: Chip Quik Inc.
Description: SOIC-32 (1.27MM PITCH, 20.4X11.3
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: SOIC
Inner Dimension: 0.803" L x 0.445" W (20.40mm x 11.30mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
IPC0164 IPC0164.pdf
Виробник: Chip Quik Inc.
Description: DFN-8 TO DIP-12 SMT ADAPTER (0.4
товар відсутній
IPC0164-S IPC0164-S.pdf
IPC0164-S
Виробник: Chip Quik Inc.
Description: DFN-8 (0.45MM PITCH, 2X3MM BODY)
товар відсутній
IPC0165 IPC0165.pdf
IPC0165
Виробник: Chip Quik Inc.
Description: SON-6 TO DIP-10 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 1.000" L x 0.500" W (25.40mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
товар відсутній
IPC0167-S IPC0167-S.pdf
IPC0167-S
Виробник: Chip Quik Inc.
Description: SOP-36 (0.65MM PITCH, 12.8X7.5MM
товар відсутній
IPC0168 IPC0168.pdf
Виробник: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 TO DIP-
Packaging: Bulk
Size / Dimension: 1.000" L x 1.000" W (25.40mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: PowerSOIC
Part Status: Active
товар відсутній
IPC0168-S
IPC0168-S
Виробник: Chip Quik Inc.
Description: POWERPAD-16/POWERSOIC-16 (1.27MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PowerSOIC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.154" L x 0.130" W (3.90mm x 3.30mm)
Number of Positions: 16
товар відсутній
IPC0169 IPC0169.pdf
Виробник: Chip Quik Inc.
Description: SOIC-44 TO DIP-44 SMT ADAPTER (1
Packaging: Bulk
Size / Dimension: 1.000" L x 2.200" W (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOIC
Part Status: Active
товар відсутній
IPC0169-S
Виробник: Chip Quik Inc.
Description: SOIC-44 (1.27MM PITCH, 28.1X13.2
товар відсутній
IPC0170 IPC0170.pdf
Виробник: Chip Quik Inc.
Description: BGA-24 TO DIP-24 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.200" W (25.40mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0170-S
Виробник: Chip Quik Inc.
Description: BGA-24 (1MM PITCH, 8X6MM BODY) S
товар відсутній
IPC0171 IPC0171.pdf
Виробник: Chip Quik Inc.
Description: BGA-25 TO DIP-25 SMT ADAPTER (1.
Packaging: Bulk
Size / Dimension: 1.000" L x 1.300" W (25.40mm x 33.02mm)
Material: FR4 Epoxy Glass
Number of Positions: 25
Pitch: 0.039" (1.00mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: BGA
товар відсутній
IPC0171-S
Виробник: Chip Quik Inc.
Description: BGA-25 (1MM PITCH, 8X6MM BODY) S
товар відсутній
Обрати Сторінку:   [  << Попередня Сторінка ]  1 4 8 12 13 14 15 16 17 18 19 20 21 22 23 24 28 32 36 40 41  [ Наступна Сторінка >> ]