Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2568) > Сторінка 29 з 43
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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PA0081 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TVSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0081-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TVSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0082 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SOT-323 Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0082-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 3 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0083 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 3 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, TO-236 Part Status: Active |
на замовлення 79 шт: термін постачання 21-31 дні (днів) |
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PA0083C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm) Number of Positions: 4 Pitch: 0.037" (0.95mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23, TO-236 Part Status: Active |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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PA0083-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.037" (0.95mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 3 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0084 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm) Material: FR4 Epoxy Glass Number of Positions: 4 Pitch: 0.059" (1.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-89 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0084-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.059" (1.50mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.157" L x 0.079" W (4.00mm x 2.00mm) Number of Positions: 3 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0085 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, SC-59 Part Status: Active |
на замовлення 299 шт: термін постачання 21-31 дні (днів) |
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PA0085C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 79 шт: термін постачання 21-31 дні (днів) |
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PA0085-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.037" (0.95mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 6 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0086 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, SC-59, SC-74A Part Status: Active |
на замовлення 249 шт: термін постачання 21-31 дні (днів) |
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PA0086C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.037" (0.95mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 125 шт: термін постачання 21-31 дні (днів) |
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PA0086-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.037" (0.95mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0087 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SC-88, SOT-363 Part Status: Active |
на замовлення 610 шт: термін постачання 21-31 дні (днів) |
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PA0087C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SC70-6 Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0087-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 6 |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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PA0088 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SC-70, SOT-353 Part Status: Active |
на замовлення 141 шт: термін постачання 21-31 дні (днів) |
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PA0088C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 5 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SC70-5 Part Status: Active |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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PA0088-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 5 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0089 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SOT-23, TSOT Part Status: Active |
на замовлення 189 шт: термін постачання 21-31 дні (днів) |
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PA0089C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SOT-23 Part Status: Active |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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PA0089-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SOT/SC Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0090 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm) Material: FR4 Epoxy Glass Number of Positions: 6 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOC Part Status: Active |
на замовлення 38 шт: термін постачання 21-31 дні (днів) |
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PA0090-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0091 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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PA0091C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm) Number of Positions: 32 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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PA0091-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0092 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PA0092C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm) Number of Positions: 32 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TQFP Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PA0092-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0093 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, PQFP, TQFP, VQFP Part Status: Active |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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PA0093C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm) Number of Positions: 44 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, PQFP, TQFP, VQFP Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0093-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0094 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 59 шт: термін постачання 21-31 дні (днів) |
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PA0094C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP Part Status: Active |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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PA0094-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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PA0095 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: PQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0095-S | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0096 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP, VQFP Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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PA0096C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm) Number of Positions: 64 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LQFP, TQFP, VQFP Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0096-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 64 |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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PA0097 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0097-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0098 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0098-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0099 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0099-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0100 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.039" (1.00mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0100-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.039" (1.00mm) Type: LGA Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0101 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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PA0101C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.031" (0.80mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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PA0101-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: LGA Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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PA0102 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0102-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: LGA Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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PA0103 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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PA0103C | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Number of Positions: 16 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: LGA Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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PA0103-S | Chip Quik Inc. |
![]() Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LGA Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0104 | Chip Quik Inc. |
![]() Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LQFP, MQFP, TQFP Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. |
PA0081 |
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Виробник: Chip Quik Inc.
Description: TVSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
Description: TVSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TVSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0081-S |
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Виробник: Chip Quik Inc.
Description: TVSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TVSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TVSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товару немає в наявності
В кошику
од. на суму грн.
PA0082 |
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Виробник: Chip Quik Inc.
Description: SC70-3/SOT-323 TO DIP-4 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-323
Part Status: Active
Description: SC70-3/SOT-323 TO DIP-4 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-323
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 205.32 грн |
PA0082-S |
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Виробник: Chip Quik Inc.
Description: SC70-3/SOT-323 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
Description: SC70-3/SOT-323 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
товару немає в наявності
В кошику
од. на суму грн.
PA0083 |
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Виробник: Chip Quik Inc.
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
Description: SOT23/TO-236 TO DIP-4 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 3
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
на замовлення 79 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 203.73 грн |
PA0083C |
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Виробник: Chip Quik Inc.
Description: SOT23 TO DIP-4 SMT ADAPTER (0.95
Packaging: Bulk
Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)
Number of Positions: 4
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
Description: SOT23 TO DIP-4 SMT ADAPTER (0.95
Packaging: Bulk
Size / Dimension: 0.400" L x 0.200" W (10.16mm x 5.08mm)
Number of Positions: 4
Pitch: 0.037" (0.95mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TO-236
Part Status: Active
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 431.33 грн |
PA0083-S |
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Виробник: Chip Quik Inc.
Description: SOT23/TO-236 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
Description: SOT23/TO-236 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 3
товару немає в наявності
В кошику
од. на суму грн.
PA0084 |
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Виробник: Chip Quik Inc.
Description: SOT-89 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
Description: SOT-89 TO DIP-4 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.200" (17.78mm x 5.08mm)
Material: FR4 Epoxy Glass
Number of Positions: 4
Pitch: 0.059" (1.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-89
товару немає в наявності
В кошику
од. на суму грн.
PA0084-S |
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Виробник: Chip Quik Inc.
Description: SOT-89 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.079" W (4.00mm x 2.00mm)
Number of Positions: 3
Description: SOT-89 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.059" (1.50mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.157" L x 0.079" W (4.00mm x 2.00mm)
Number of Positions: 3
товару немає в наявності
В кошику
од. на суму грн.
PA0085 |
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Виробник: Chip Quik Inc.
Description: SOT23-6/SC59-6 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59
Part Status: Active
Description: SOT23-6/SC59-6 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59
Part Status: Active
на замовлення 299 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 188.61 грн |
PA0085C |
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Виробник: Chip Quik Inc.
Description: SOT23-6 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23-6 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 79 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 397.90 грн |
PA0085-S |
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Виробник: Chip Quik Inc.
Description: SOT23-6/SC59-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
Description: SOT23-6/SC59-6 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 6
товару немає в наявності
В кошику
од. на суму грн.
PA0086 |
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Виробник: Chip Quik Inc.
Description: SOT23-5/SC59-5/SC-74A TO DIP-6
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59, SC-74A
Part Status: Active
Description: SOT23-5/SC59-5/SC-74A TO DIP-6
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, SC-59, SC-74A
Part Status: Active
на замовлення 249 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 188.61 грн |
PA0086C |
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Виробник: Chip Quik Inc.
Description: SOT23-5 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23-5 TO DIP-6 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.037" (0.95mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 125 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 397.90 грн |
PA0086-S |
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Виробник: Chip Quik Inc.
Description: SOT23-5/SC59-5/SC-74A STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SOT23-5/SC59-5/SC-74A STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.037" (0.95mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
товару немає в наявності
В кошику
од. на суму грн.
PA0087 |
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Виробник: Chip Quik Inc.
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SC-88, SOT-363
Part Status: Active
Description: SC70-6/SOT-363 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SC-88, SOT-363
Part Status: Active
на замовлення 610 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 188.61 грн |
PA0087C |
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Виробник: Chip Quik Inc.
Description: SC70-6 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-6
Part Status: Active
Description: SC70-6 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-6
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0087-S |
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Виробник: Chip Quik Inc.
Description: SC70-6/SOT-363 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
Description: SC70-6/SOT-363 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 6
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 863.45 грн |
PA0088 |
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Виробник: Chip Quik Inc.
Description: SC70-5/SOT-353 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-353
Part Status: Active
Description: SC70-5/SOT-353 TO DIP-6 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SC-70, SOT-353
Part Status: Active
на замовлення 141 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 188.61 грн |
PA0088C |
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Виробник: Chip Quik Inc.
Description: SC70-5 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-5
Part Status: Active
Description: SC70-5 TO DIP-6 SMT ADAPTER (0.6
Packaging: Bulk
Size / Dimension: 0.400" L x 0.300" W (10.16mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 5
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SC70-5
Part Status: Active
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 397.90 грн |
PA0088-S |
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Виробник: Chip Quik Inc.
Description: SC70-5/SOT-353 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
Description: SC70-5/SOT-353 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 5
товару немає в наявності
В кошику
од. на суму грн.
PA0089 |
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Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TSOT
Part Status: Active
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SOT-23, TSOT
Part Status: Active
на замовлення 189 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 222.83 грн |
PA0089C |
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Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
Description: SOT23-8/TSOT-8 TO DIP-8 SMT ADAP
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SOT-23
Part Status: Active
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 469.53 грн |
PA0089-S |
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Виробник: Chip Quik Inc.
Description: SOT23-8/TSOT-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
Description: SOT23-8/TSOT-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SOT/SC
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.
PA0090 |
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Виробник: Chip Quik Inc.
Description: TSOC-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOC
Part Status: Active
Description: TSOC-6 TO DIP-6 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.300" (17.78mm x 7.62mm)
Material: FR4 Epoxy Glass
Number of Positions: 6
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOC
Part Status: Active
на замовлення 38 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
2+ | 188.61 грн |
PA0090-S |
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Виробник: Chip Quik Inc.
Description: TSOC-6 STENCIL
Description: TSOC-6 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0091 |
![]() |
Виробник: Chip Quik Inc.
Description: TQFP-32/LQFP-32 TO DIP-32 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-32/LQFP-32 TO DIP-32 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 39 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 517.28 грн |
PA0091C |
![]() |
Виробник: Chip Quik Inc.
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 726.57 грн |
PA0091-S |
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Виробник: Chip Quik Inc.
Description: STENCIL TQFP-32 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: STENCIL TQFP-32 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 810.93 грн |
PA0092 |
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Виробник: Chip Quik Inc.
Description: TQFP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-32 TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 587.31 грн |
PA0092C |
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Виробник: Chip Quik Inc.
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
Description: TQFP-32 TO DIP-32 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TQFP
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 796.61 грн |
PA0092-S |
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Виробник: Chip Quik Inc.
Description: TQFP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: TQFP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товару немає в наявності
В кошику
од. на суму грн.
PA0093 |
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Виробник: Chip Quik Inc.
Description: LQFP-44/QFP-44/VQFP-44/TQFP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
Description: LQFP-44/QFP-44/VQFP-44/TQFP-44
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 733.74 грн |
PA0093C |
![]() |
Виробник: Chip Quik Inc.
Description: TQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
Description: TQFP-44 TO DIP-44 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.200" L x 0.700" W (55.88mm x 17.78mm)
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, PQFP, TQFP, VQFP
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 943.83 грн |
PA0093-S |
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Виробник: Chip Quik Inc.
Description: STENCIL LQFP-44 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: STENCIL LQFP-44 .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товару немає в наявності
В кошику
од. на суму грн.
PA0094 |
![]() |
Виробник: Chip Quik Inc.
Description: LQFP-48/TQFP-48 TO DIP-48 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: LQFP-48/TQFP-48 TO DIP-48 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 59 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 958.15 грн |
PA0094C |
![]() |
Виробник: Chip Quik Inc.
Description: TQFP-48 TO DIP-48 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
Description: TQFP-48 TO DIP-48 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP
Part Status: Active
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1274.09 грн |
PA0094-S |
![]() |
Виробник: Chip Quik Inc.
Description: STENCIL LQFP-48 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: STENCIL LQFP-48 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.276" L x 0.276" W (7.00mm x 7.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 810.93 грн |
PA0095 |
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Виробник: Chip Quik Inc.
Description: QFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP
Part Status: Active
Description: QFP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: PQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0095-S |
![]() |
Виробник: Chip Quik Inc.
Description: PQFP-48 STENCIL
Description: PQFP-48 STENCIL
товару немає в наявності
В кошику
од. на суму грн.
PA0096 |
![]() |
Виробник: Chip Quik Inc.
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
Description: VQFP-64/LQFP-64/TQFP-64 TO DIP64
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1104.58 грн |
PA0096C |
![]() |
Виробник: Chip Quik Inc.
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
Description: VQFP-64 TO DIP-64 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 3.200" L x 0.700" W (81.28mm x 17.78mm)
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LQFP, TQFP, VQFP
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1314.68 грн |
PA0096-S |
![]() |
Виробник: Chip Quik Inc.
Description: STENCIL VQFP-64 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
Description: STENCIL VQFP-64 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.394" L x 0.394" W (10.00mm x 10.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 64
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 884.94 грн |
PA0097 |
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Виробник: Chip Quik Inc.
Description: TSOP-32 I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-32 I TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0097-S |
![]() |
Виробник: Chip Quik Inc.
Description: TSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: TSOP-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товару немає в наявності
В кошику
од. на суму грн.
PA0098 |
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Виробник: Chip Quik Inc.
Description: LGA-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0098-S |
![]() |
Виробник: Chip Quik Inc.
Description: LGA-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: LGA-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товару немає в наявності
В кошику
од. на суму грн.
PA0099 |
![]() |
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0099-S |
![]() |
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.197" W (5.00mm x 5.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
PA0100 |
![]() |
Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.039" (1.00mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0100-S |
![]() |
Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.039" (1.00mm)
Type: LGA
Inner Dimension: 0.295" L x 0.173" W (7.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
PA0101 |
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Виробник: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 351.75 грн |
PA0101C |
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Виробник: Chip Quik Inc.
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-14 TO DIP-14 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.031" (0.80mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 572.19 грн |
PA0101-S |
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Виробник: Chip Quik Inc.
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: STENCIL LGA-14 3X5MM .8MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: LGA
Inner Dimension: 0.197" L x 0.118" W (5.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 850.72 грн |
PA0102 |
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Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
PA0102-S |
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Виробник: Chip Quik Inc.
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: LGA-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: LGA
Inner Dimension: 0.157" L x 0.157" W (4.00mm x 4.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
товару немає в наявності
В кошику
од. на суму грн.
PA0103 |
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Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 461.57 грн |
PA0103C |
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Виробник: Chip Quik Inc.
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
Description: LGA-16 TO DIP-16 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: LGA
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 682.01 грн |
PA0103-S |
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Виробник: Chip Quik Inc.
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: STENCIL LGA-16 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LGA
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 850.72 грн |
PA0104 |
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Виробник: Chip Quik Inc.
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
Description: MQFP-52/TQFP-52/LQFP-52 TO DIP-5
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LQFP, MQFP, TQFP
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.